JP2008027774A - Ic socket and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC socket of which the contact can contact by metal to a land on the IC package side, and which can cope with multiple pins, fine pitch, large current, and high speed with high productivity. <P>SOLUTION: One end part side of a contact piece 10 is formed integrally at a contact fixing part 22 of a socket base body 20 and the portion other than one end part faces a through hole 21. The through hole part 30 is made of a plating layer 32 which is formed at the surrounding of the aperture part 11 of the contact piece 10 and the surrounding of the rear face side of the through hole 31 with the aperture part 11 of the contact piece 10 and the through hole 31 in a coincided state, through the inner wall of the through hole 31 penetrating the contact fixing part 22 in front and rear direction. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an IC socket used when mounting an IC package such as a CPU or LSI on, for example, a printed circuit board, and more specifically, for example, an IC socket in which a three-dimensional circuit is formed using a three-dimensional circuit forming technique and its manufacture It is about the method.

  Conventionally, techniques for mounting an IC package such as a CPU or LSI on a printed circuit board via an IC socket have been studied. Many motherboards of personal computers and servers are mounted with sockets for mounting CPUs of LGA (Land Grid array) packages and BGA (Ball Grid Array) packages.

  The number of pins and the speed of CPUs are increasing year by year in order to improve the functions and performance of CPUs, and measures are being taken by increasing the size of packages and making fine pitches. Along with this, it is necessary to cope with the increase in the number of pins of the IC socket, and it is also necessary to cope with an increase in the amount of bending accompanying an increase in the size of the package and a variation in the contact land of the package and the height variation of the ball. .

  Therefore, the IC socket is required to have a structure that can ensure a stroke in the bending direction in contact with the electrode portion of the IC package.

  Further, as a countermeasure to the fine pitch, it should be realized with a simple structure as much as possible, and a structure in which the connection from the package to the printed board is performed at a short distance is desirable.

  Furthermore, in order to cope with the high speed, it is important that the contact between the IC socket and the package has a low inductance, and the allowable current is required to be high in response to the increase in current consumption due to the high speed.

  The current mainstream of LGA package sockets is 400-800 pins with a pitch of about 1 mm. An IC socket having a structure in which a metal plate is bent in a complicated manner to form a predetermined contact piece and a contact is inserted into the socket housing. Is known (see, for example, Patent Documents 1 and 2). However, since these IC sockets are assembled by inserting contacts into the socket housing one pin at a time, as the number of pins increases, the contact insertion time required for manufacturing increases and productivity deteriorates.

As a countermeasure against such a problem, a structure using a column made of a conductive elastomer as a contact is known (for example, see Patent Document 3). However, when an elastomer is used as a contact in this way, the contact resistance is higher than that of metal contact, and there is a risk of heat generation and increase in voltage drop when the current is increased. Also, in the IC socket using elastomer, when the IC package is mounted, the contact part made of elastomer does not wipe the metal surface of the land (electrode part) on the IC package side, so that the oxide film on the land is removed. There is a problem that cannot be expected. Furthermore, since this IC socket comes into contact with the land made of metal on the IC package side by pressure contact with the elastomer, there is a problem that the contact resistance changes with time.
JP 2004-158430 A JP-A-2005-19284 US Pat. No. 6,669,490

  SUMMARY OF THE INVENTION An object of the present invention is to provide an IC socket that can make metal contact with a land on the IC package side, has high productivity, and can cope with high pin count, fine pitch, large current, and high speed, and a manufacturing method thereof. Is to provide.

  A first feature of the present invention is an IC socket, in which a plurality of contact storage holes formed from the front surface side to the back surface side on which an IC package is mounted are arranged, and contacts are fixed to the peripheral portion of the contact storage hole. A plate-shaped socket base, a contact piece having one end side fixed to the surface side of the contact fixing part in a state facing the contact housing hole, the one end part of the contact piece, and the contact fixing part And a through-hole portion that allows the contact piece to conduct to the back side of the socket base.

  A second feature of the present invention is an IC socket composite, wherein the pair of IC sockets according to any one of claims 1 to 9 are brought into contact with each other in a state where the back surfaces are aligned, The gist is that the through-hole portions on the back surface side are soldered to each other.

  A third feature of the present invention is that a plurality of contact pieces having through-hole openings at one end are formed by processing a metal plate, and the contact pieces are set in an injection mold to form a plate shape. A plurality of contact storage holes recessed from the front surface side to the back surface side where the IC package is mounted are disposed by injection molding, and the contact piece is formed on the contact fixing portion at the peripheral edge of the contact storage hole. A step of forming a plate-shaped socket base having a through hole communicating with the through hole opening, and setting the mold to expose a part of the through hole and the contact piece. And a plating step of forming a plating layer on the exposed portions of the through holes and the contact pieces.

  According to the present invention, it is possible to provide an IC socket capable of making metal contact with a land on the IC package side, having high productivity, and capable of dealing with high pin count, fine pitch, high current, and high speed. .

  Hereinafter, an IC socket, an IC socket composite, and a method of manufacturing an IC socket according to the present invention will be described based on embodiments shown in the drawings.

[First Embodiment]
1 and 2 show an IC socket according to the first embodiment. 1 is a main part plan view of the IC socket according to the first embodiment, and FIG. 2 is a cross-sectional view taken along the line AA of FIG.

  The IC socket 1 of the present embodiment is generally constituted by a plurality of contact pieces 10, a socket base 20 on which these contact pieces 10 are arranged in a predetermined arrangement, and a through hole portion 30.

  The contact piece 10 is formed by externally processing a metal plate having conductivity and resilience (spring property), such as a copper alloy such as beryllium copper or phosphor bronze or a stainless alloy. The contact piece 10 has a rectangular shape, and an opening 11 for communicating with a through hole 31 described later is formed on one end side.

  As shown in FIG. 2, a contact protrusion 12 bulging toward the IC package (not shown) to be mounted is formed on the other end portion side of the contact piece 10. The contact protrusion 12 includes a resin protrusion 13 formed in a hemispherical shape on the upper surface of the contact piece 10 and a plating layer 14 formed so as to seal the resin protrusion 13.

  The socket base 20 is formed with through holes 21 as contact housing holes in a predetermined arrangement. In the present embodiment, the planar shape of the through hole 21 is a rectangle. Further, a columnar contact fixing portion 22 that protrudes toward the IC package (not shown) is formed in the vicinity of the peripheral edge portion on one side of the through hole 21 in the socket base 20. As shown in FIGS. 1 and 2, the contact fixing portion 22 is formed in a columnar shape between the through holes 21 along the longitudinal direction of the through holes 21. The contact fixing portion 22 is formed with a through hole 31 penetrating in the front and back direction of the socket base 20. Then, one end of the contact piece 10 is fixed to the upper part of the contact fixing portion 22 so that the through hole 31 of the contact fixing portion 22 and the opening 11 of the contact piece 10 communicate with each other. .

  As described above, one end of the contact piece 10 is fixed to the contact fixing portion 22, and a portion other than the one end faces the through hole 21.

  The through-hole portion 30 is formed on the opening 11 of the contact piece 10 in a state where the opening 11 of the contact piece 10 and the through-hole 31 are aligned via the inner wall of the through-hole 31 that penetrates the contact fixing portion 22 in the front and back direction. It consists of a plating layer 32 formed over the periphery and the periphery on the back side of the through hole 31. A catalyst layer may be formed as a base for the plating layers 14 and 32.

  In the IC socket 1 according to the present embodiment, since the contact piece 10 can make metal contact with the land on the IC package side, the contact resistance can be set small.

(Installation of IC package)
Next, the case where the IC package 40 is mounted on the IC socket 1 according to the present embodiment will be described with reference to FIGS.

  FIG. 3 shows a state immediately before the IC package 40 is aligned with the IC socket 1. The IC package 40 is an LGA package, and a plurality of land portions 41 are arranged on the lower surface. The contact protrusion 12 protruding from the other end of the contact piece 10 on the IC socket 1 side is provided in the same manner as the arrangement of the land portions 41 of the IC package 40. As shown in FIG. 3, the land portion 41 that comes into contact with the contact protrusion 12 is a position indicated by a one-dot chain line L <b> 1 in the drawing.

  FIG. 4 shows a state in which the land portion 41 of the IC package 40 is pressed against the contact protrusion 12 of the IC socket 1 and then pressed. At this time, as shown in FIG. 4, the contact protrusion 12 and the land portion 41 abut at a position indicated by a one-dot chain line L2 in the drawing. Therefore, the plating layer 14 and the land portion 41 of the contact protrusion 12 are rubbed while being displaced from each other at the position of the alternate long and short dash line L1 to L2.

  FIG. 5 shows a state in which the land portion 41 of the IC package 40 is further pressed against the contact protrusion 12 of the IC socket 1. At this time, as shown in FIG. 5, the contact protrusion 12 and the land portion 41 abut at a position indicated by a one-dot chain line L3 in the drawing. Accordingly, the plating layer 14 of the contact protrusion 12 and the land portion 41 are rubbed and moved while being displaced from each other by a distance d from the state of first contact. Eventually, a retention lock mechanism (not shown) may be held so that the IC package 40 does not come off.

  As described above, the contact is displaced while being rubbed, thereby having a wiping action for removing the oxide film on the contact. Therefore, the plating layer 14 and the land portion 41 can ensure a connection with a small contact resistance.

(IC socket mounting)
As a method for mounting the IC socket 1 according to the present embodiment, solder balls can be used. Hereinafter, a method for forming solder balls will be described with reference to FIGS.

  This mounting method can be used, for example, when the IC socket 1 is mounted on a motherboard (main printed circuit board) of a personal computer. As shown in FIGS. 6A and 6B, the solder paste 50 is screen-printed on the land 32 </ b> A on the back surface side of the through hole portion 30 of the IC socket 1.

  Next, as shown in FIG. 6C, the printed solder paste 50 may be changed to solder balls 51 by heating by a method such as reflow.

  In order to mount the manufactured IC socket 1 on the mother board, the IC socket 1 is positioned and placed on the mother board, and soldering by reflow is performed at the same time when other components are mounted. .

(IC socket complex)
For a server socket that requires maintenance of an IC socket, it is convenient to use an IC socket complex 1A as shown in FIG.

  As shown in FIG. 7A, the IC socket composite 1A is manufactured by preparing a pair of IC sockets 1 provided so that the lands 32A of the through-hole portion 33 are vertically symmetrical. A solder paste 50 is printed on one land 32A of the IC socket 1 as shown in FIG. Then, as shown in FIG. 7A, the pair of IC sockets 1 are aligned and joined so that the lands 32A correspond to each other. At this time, as shown in FIG. 7A, the solder paste 50 is interposed between the lands 32A corresponding to each other.

  Next, while maintaining this state, heating such as reflow is performed to solder the lands 32A of the pair of upper and lower IC sockets 1 to complete the IC socket complex 1A.

  Since this IC socket complex 1A has contacts on the front and back surfaces, a socket structure that can be exchanged on the front and back surfaces can be realized.

(IC socket manufacturing method)
Next, a method for manufacturing the IC socket 1 according to the present embodiment will be described by applying MID (Molded Interconection Device) technology. In addition, this manufacturing method is performed along a flowchart as shown in FIG.

  First, as shown in FIG. 8A, a metal plate 10A is prepared, and outer shape processing is performed, for example, by etching or pressing to form a contact piece 10 as shown in FIG. 8B. The contact piece 10 has a rectangular shape as shown in FIG. 1, and an opening 11 is formed on one end side.

  The contact piece 10 prepares the number of contacts required for the IC socket 1 to be manufactured. These contact pieces 10 are arranged in the arrangement of the contact pieces 10 of the final IC socket 1 so that the subsequent steps can be easily performed. To be integrated. If necessary, this integrated processed contact piece 10 may be divided into a plurality of parts. However, for ease of handling in the process, all contact pieces 10 are processed as an integrated block. It is desirable. FIG. 10 is a plan view of a semi-finished product of the IC socket 1 and shows a state in which the contact pieces 10 are integrated and connected by a runner 16. Thus, if the contact piece 10 is electrically connected by the runner 16, electrolytic plating can be used in the plating process.

  Next, a plurality of integrated contact pieces 10 are set in a mold and primary injection molding is performed. As a result, as shown in FIG. 8C, one end portion side of the contact piece 10 is inserted (joined in the present embodiment) into the socket base 20, and the resin protrusion 13 is formed on the surface of the other end portion of the contact piece 10. A semi-finished product can be produced.

  Thereafter, surface treatment is performed by etching in the state of FIG.

  Next, secondary injection molding is performed leaving a portion to be plated. This mold for secondary injection molding is merely a mask for performing circuit formation. In FIG. 9A, a secondary injection mold is omitted. Then, as shown in FIG. 9A, the catalyst layer 15 is attached to the portion exposed from the secondary injection mold (not shown).

  Subsequently, as shown in FIG. 9B, the catalyst layer 15 is etched so that the peripheral portion of the opening 11 of the contact piece 10 and the catalyst layer 15 on the resin protrusion 13 remain.

  Then, after removing a mold for secondary injection molding (not shown) and performing electroplating, three-dimensional circuit formation as shown in FIG. 9C can be performed. In this plating step, the plating layer 14 on the surface of the contact protrusion 12 and the plating layer 32 on the surface of the catalyst layer 15 in the through hole 31 are simultaneously formed. Note that although electroplating is used in the present embodiment, electroless plating may be performed.

  Thereafter, the runner 16 is appropriately cut to complete the manufacture of the IC socket 1 according to the present embodiment. Further, as shown in FIGS. 6A to 6C, the solder balls 51 may be formed on the lands 32A of the plated layer 32 of the through-hole portion 30, or a retention lock mechanism component may be provided thereafter. .

  Here, an example of a specific specification of the IC socket 1 will be described.

Circuit width 0.2mm ~
Circuit interval 0.2mm ~
Contact piece thickness 0.3mm ~
Through hole diameter φ0.2mm
Plating base Cu: 4 to 10 μm
Plating intermediate layer Ni: 6 to 20 μm
Plating finish layer Au: 0.1 to 0.3 μm
Applicable resin LCP, SPS, PA, PPA, PPS, PC-ABS, PEI
In the above specification example, examples of the base (Cu), intermediate (Ni), and finish (Au) are shown as plating. However, depending on the usage environment, the intermediate is eliminated and Au is plated directly on Cu. May be.

  The applied resin may be selected depending on the required characteristics. However, when electric characteristics are important, a liquid crystal polymer (LCP) having a low dielectric constant is an effective material. In the case of using LCP, there is an advantage that heat resistance is easily increased, a reflow resistance is sufficient, and that strength is high. On the other hand, the mechanical strength is anisotropic and the weld strength is low. However, in recent years, engineering plastics technology has made great strides, and materials called super engineering plastics, which have been compatible with each other, have been developed one after another. Since any material that can be used for injection molding can be applied, it is considered that the possibility of selecting a resin that meets the purpose will be increased.

  In the IC socket 1 according to the present embodiment, by using the MID technology, productivity is remarkably higher than that of the conventional IC socket, and it is possible to cope with an increase in the number of pins, a fine pitch, a large current, and a high speed. .

[Second Embodiment]
12 to 14 show an IC socket 2 according to a second embodiment of the present invention. 12 is a plan view of the main part of the IC socket 2, FIG. 13A is a sectional view taken along line BB in FIG. 12, FIG. 13B is a sectional view taken along line CC in FIG. 12, and FIG. DD sectional view of FIG. 14, FIG. 14B is a DD sectional view of FIG. It should be noted that parts of the IC socket 2 of the second embodiment are denoted by the same or similar reference numerals to the same parts as those of the first embodiment, and detailed description thereof is omitted.

  In the IC socket 2 according to the present embodiment, the height of the contact fixing portion 22 is set to the same thickness as the surrounding resin portion. That is, in the socket base 20, the contact fixing portion 22 does not protrude to the surface side, and the through holes 21A as the rectangular contact storage holes are formed in a predetermined arrangement in the resin serving as the base of the contact piece 10, This is a simple structure in which a through hole 31 is formed in the contact fixing portion 22 at the peripheral edge of the through hole 21A. For this reason, the metal mold | die arrange | positioned at the back side used for primary injection molding is the shape of only a simple convex part, and the metal mold | die arrange | positioned at the surface side is a shape only of the recessed part for forming the resin protrusion 13A. realizable.

  As described above, since the height of the contact fixing portion 22 for fixing the contact piece 10 can be controlled by resin, there is a degree of freedom in the stroke design of the contact piece 10, the required contact pitch and pin number specifications, and the warpage of the IC package. Depending on the allowable value, there may be a case where the length of the contact piece 10 may be short.

  Further, in the IC socket 2 according to the present embodiment, the width of the through hole 21 </ b> A where the contact piece 10 faces is set wider with a margin than the width of the contact piece 10.

  Furthermore, in the IC socket 2 according to the present embodiment, the shape of the resin protrusion 13A provided at the other end of the contact piece 10 is not a hemispherical shape but is set to a substantially semi-cylindrical shape.

  Also in the IC socket 2 according to the present embodiment, the same operations and effects as those of the first embodiment described above can be achieved. The manufacturing method of the IC socket 2 according to the present embodiment is the same as the manufacturing method of the IC socket 1 according to the first embodiment described above.

[Third Embodiment]
15 to 17 show an IC socket 3 according to a third embodiment of the present invention. 15 is a plan view of the main part of the IC socket 3, FIG. 16A is a cross-sectional view taken along the line FF in FIG. 15, FIG. 16B is a cross-sectional view taken along the line GG in FIG. 17A is a sectional view taken along the line II of FIG. 15, FIG. 17B is a sectional view taken along the line JJ of FIG. 15, and FIG. 17C is a sectional view taken along the line KK of FIG. FIG. In addition, each part of the IC socket 3 of the third embodiment has the same or similar reference numerals for the same parts as the IC socket 1 or the IC socket 2 according to the first and second embodiments. Detailed description will be omitted.

  In the IC socket 3 according to the present embodiment, the height of the contact fixing portion 22 is set to the same thickness as the surrounding resin portion, similarly to the IC socket 2 according to the second embodiment described above. Is. That is, in the socket base 20, the contact fixing portion 22 does not protrude to the surface side, and the through holes 21B as simply rectangular contact storage holes are formed in a predetermined arrangement in the resin that becomes the base of the contact piece 10A. This is a simple structure in which a through hole 31 is formed in the contact fixing portion 22 at the peripheral edge of the through hole 21B. For this reason, the metal mold | die arrange | positioned at the back side used for primary injection molding is the shape of only a simple convex part, and the metal mold | die arrange | positioned at the surface side is a shape only of the recessed part for forming the resin protrusion 13A. realizable.

  Thus, as shown in FIG. 15, the contact piece 10A has a shape bent in a crank shape, and has a long stroke. In the design of the contact piece 10A, with the increase in the number of pins and the fine pitch, the relationship between the allowable value of the package warp and the contact pressure is important, and it is expected that the technical difficulty level will increase in the future. Therefore, a structure that can increase the leaf spring length of the contact piece 10A or reduce the load in the stroke as such a shape is effective as a method of expanding the degree of freedom in spring design. The IC socket 3 according to the present embodiment can simplify the mold shape required for molding, and can effectively increase the leaf spring length despite the short contact pitch.

  For this reason, in the IC socket 3 according to the present embodiment, the through hole 21B facing the contact piece 10A is bent so as to increase the leaf spring length so that the contact piece 10A can be disposed obliquely.

  Also in the IC socket 3 according to the present embodiment, the shape of the resin protrusion 13A provided at the other end of the contact piece 10A is not a hemispherical shape, but is set to a substantially semi-cylindrical shape.

  Also in the IC socket 3 according to the present embodiment, the same operations and effects as the first and second embodiments described above can be achieved. The manufacturing method of the IC socket 3 according to the present embodiment is the same as the manufacturing method of the IC socket 1 according to the first embodiment described above.

[Fourth Embodiment]
18 and 19 show an IC socket 4 according to a fourth embodiment of the present invention.

  Also in the IC socket 4 according to the present embodiment, the height of the contact fixing portion 22 is set to the same thickness as the surrounding resin portion. That is, in the socket base 20, the contact fixing portion 22 does not protrude to the surface side, and the through holes 21 that are simply rectangular contact housing holes are formed in a predetermined arrangement in the resin that becomes the base of the contact piece 10, This is a simple structure in which a through hole is formed in the contact fixing portion 22 at the peripheral edge of the through hole 21. For this reason, the metal mold | die arrange | positioned at the back surface used for primary injection molding is the shape of only a simple convex part, and the metal mold | die arrange | positioned at the surface side is a shape only of the recessed part for forming the resin protrusion 13. realizable.

  As described above, since the height of the contact fixing portion 22 for fixing the contact piece 10 can be controlled by resin, there is a degree of freedom in the stroke design of the contact piece 10, the required contact pitch and pin number specifications, and the warpage of the IC package. Depending on the allowable value, there may be a case where the length of the contact piece 10 may be short.

  Further, in the through hole 21 according to the present embodiment, an elastic elastomer 60 is disposed in order to adjust the contact pressure of the contact piece 10 and to suppress a decrease in the contact pressure due to deformation of the contact piece 10. .

  Also in the IC socket 4 according to the present embodiment, the same operations and effects as those in the first embodiment described above can be achieved. Further, the manufacturing method of the IC socket 4 according to the present embodiment is the same as the manufacturing method of the IC socket 1 according to the first embodiment described above. However, as shown in FIG. ) After forming 20, a process of forming the elastomer 60 in the through hole 21 is incorporated.

[Fifth Embodiment]
20 and 21 show an IC socket 5 according to a fifth embodiment of the present invention. 20 is a cross-sectional view of the main part of the IC socket 5, and FIG. 21 is a cross-sectional view taken along line MM in FIG.

  In the IC socket 5 according to the present embodiment, as shown in FIG. 21, when the contact piece 10 is insert-molded in the contact fixing portion 22, a resin layer 22A is also formed on the contact piece 10, and the contact piece 10 is sandwiched between resins. For this reason, the contact piece 10 is reliably held by the contact fixing portion 22, and durability when a load is applied to the contact piece 10 is improved.

  Other configurations in the present embodiment are similar to those in the above-described embodiments, and thus the same reference numerals are given to the drawings and description thereof is omitted.

[Other embodiments]
It should not be understood that the descriptions and drawings which form part of the disclosure of the above-described embodiments limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  For example, each of the above embodiments is an example in which the catalyst layer is formed under the plating layer, but it is needless to say that the plating layer may be formed without forming the catalyst layer.

  Further, in each of the embodiments described above, the through holes 21, 21A, and 21B as the contact housing holes are formed, but a bottomed concave groove may be used.

  Further, in each of the embodiments described above, the resin protrusions 13 and 13A are formed on the other end of the contact piece 10 and the surface of the resin protrusions 13 and 13A is plated. However, the contact piece 10 made of a metal plate is used. Of course, a protrusion bulging to the surface side by press working may be formed at the other end of the plate.

It is a principal part top view of the IC socket which concerns on the 1st Embodiment of this invention. It is AA sectional drawing of FIG. It is principal part sectional drawing which shows the state before mounting | wearing with an IC package to the IC socket which concerns on 1st Embodiment. It is principal part sectional drawing which shows the state in the middle of mounting | wearing with the IC package to the IC socket which concerns on 1st Embodiment. It is principal part sectional drawing which shows the state which mounted | wore the IC package to the IC socket which concerns on 1st Embodiment. (A)-(c) is principal part sectional drawing which shows the process of forming a solder ball in the land of the back surface of an IC socket. (A) It is principal part sectional drawing which shows the state which made the pair of IC socket which concerns on 1st Embodiment mutually contact the lands of the back surface side via a solder paste, (b) performs reflow It is principal part sectional drawing of the manufactured IC socket composite. (A)-(c) shows the manufacturing process of the IC socket which concerns on 1st Embodiment, The cross section which shows the contact piece produced by carrying out the external shape process of the metal plate used as a contact piece, and a metal plate, and a primary molded article FIG. (A)-(c) is sectional drawing which shows the manufacturing process of the IC socket which concerns on 1st Embodiment, and shows the state which formed the catalyst layer, the state which etched the catalyst layer, and the state which formed the plating layer. is there. It is a principal part top view which shows the state before cut | disconnecting the runner of the IC socket which concerns on 1st Embodiment. It is a flowchart which shows the manufacturing method of IC socket which concerns on 1st Embodiment. It is a principal part top view of the IC socket which concerns on the 2nd Embodiment of this invention. (A) is BB sectional drawing of FIG. 12, (b) is CC sectional drawing of FIG. (A) is DD sectional drawing of FIG. 12, (b) is EE sectional drawing. It is a principal part top view of the IC socket which concerns on the 3rd Embodiment of this invention. (A) is FF sectional drawing of FIG. 15, (b) is GG sectional drawing of FIG. 14, (c) is HH sectional drawing of FIG. (A) is II sectional drawing of FIG. 15, (b) is JJ sectional drawing of FIG. 15, (c) is KK sectional drawing of FIG. It is a principal part top view of the IC socket which concerns on the 4th Embodiment of this invention. It is LL sectional drawing of FIG. It is a principal part top view of the IC socket which concerns on the 5th Embodiment of this invention. It is MM sectional drawing of FIG.

Explanation of symbols

1, 2, 3, 4, 5 IC socket 1A IC socket composite 10 Contact piece 10A Contact piece 11 Opening 12 Contact protrusion 13, 13A Resin protrusion 14, 32 Plating layer 15 Catalyst layer 16 Runner 20 Socket base 21, 21A, 21B Through hole 22 Contact fixing portion 22A Resin layer 30 Through hole portion 31 Through hole 32A Land 40 IC package 41 Land portion 50 Solder paste 51 Solder ball 60 Elastomer

Claims (13)

A plurality of contact storage holes formed from the front surface side to the back surface side to which the IC package is mounted, and a plate-shaped socket base having a contact fixing portion at the peripheral edge of the contact storage hole;
A contact piece whose one end is fixed to the surface side of the contact fixing portion in a state of facing the contact storing hole;
A through-hole portion that allows the contact piece to pass through the one end portion of the contact piece and the contact fixing portion to the back side of the socket base;
An IC socket comprising:   2. The IC socket according to claim 1, wherein the socket base is formed of a synthetic resin having electrical insulation.   The IC socket according to claim 1, wherein the contact housing hole is formed so as to penetrate in a front and back direction of the socket base.   4. The IC socket according to claim 1, wherein a contact protrusion that bulges toward the IC package to be mounted is formed at the other end of the contact piece. 5. .   5. The IC socket according to claim 4, wherein the contact protrusion has a metal layer covering a surface of a resin protrusion provided on the other end of the contact piece.   The IC socket according to claim 1, wherein a member having resilience is accommodated in the contact accommodation hole.   The other end portion of the contact piece is provided so as not to overlap a contact fixing portion adjacent to the contact fixing portion to which the contact piece is fixed. IC socket described in one item.   8. The IC socket according to claim 7, wherein the contact piece has a planar shape bent on a crank.   The IC socket according to any one of claims 1 to 8, wherein a solder ball is provided in a through-hole portion exposed on a back surface side of the socket base.   The pair of IC sockets according to any one of claims 1 to 9, wherein the pair of IC sockets are in contact with each other in a state where the back surfaces are aligned, and the through-hole portions on the back surface side are soldered together. IC socket composite characterized. A step of forming a plurality of contact pieces having through-hole openings at one end by processing a metal plate;
The contact piece is set in an injection mold, a plate-shaped socket base is injection-molded, and a plurality of contact housing holes recessed from the front surface side to the back surface side on which the IC package is mounted are arranged, and A step of forming a plate-shaped socket base having one end of the contact piece fixed to a contact fixing portion at a peripheral edge of a contact housing hole and having a through hole communicating with the through hole opening;
Setting the mold so as to expose a part of the through hole and the contact piece;
A plating step of forming a plating layer on the exposed portion of the through hole and the contact piece;
A method for manufacturing an IC socket, comprising:   12. The method of manufacturing an IC socket according to claim 11, wherein the contact housing hole is formed so as to penetrate in a front-back direction of the socket base.   In the injection molding, a raised resin protrusion is formed on the surface of the other end of the contact piece, and in the plating step, a plating layer for sealing the resin protrusion is formed on the other end of the contact piece. The method of manufacturing an IC socket according to claim 11 or 12, wherein

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