JP2008016776A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component including a wireless communication module that has a simple and compact structure, while eliminating erroneous operation effect, noise effect and the like on other modules. <P>SOLUTION: The electronic component 100 includes a substrate 101 having a multi-layer structure, a wireless communication module M1 mounted on a first surface of the substrate 101, and another module M2 mounted on a second surface opposite to the first surface of the substrate 101. The module M2 is used by being connected with the wireless communication module M1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component including a wireless communication module.

  Wireless communication modules including a high frequency (RF) communication unit, an MCU (microcomputer) unit, a crystal resonator, and the like have been used for various electronic components. In addition, these wireless communication modules are often used in combination with modules having various other functions. For this reason, when configuring electronic components using a wireless communication module and a module other than the wireless communication module, A reduction in size and weight was required.

Further, since the wireless communication module includes a high-frequency communication unit, there is a concern that other modules may be affected by malfunction or noise. For this reason, a device for mounting the wireless communication module has been proposed such that the wireless communication module is electromagnetically shielded (see, for example, Patent Document 1).
JP 2002-33419 A

  However, if a shield-like structure for shielding the wireless communication module is provided, it is inevitable that the structure of the electronic component becomes complicated and large, and the electronic component including the wireless communication module is reduced in size and weight. Had a difficult problem. Conventionally, no specific configuration has been proposed in which a wireless communication module and a module other than the wireless communication module are reduced in size and packaged with a simple structure.

  Therefore, the present invention has a general object to provide a new and useful electronic component that solves the above problems.

  A specific object of the present invention is to provide an electronic component having a wireless communication module that is miniaturized with a simple structure.

  The present invention mounts the above-described problem on a substrate having a multilayer structure, a wireless communication module mounted on the first surface of the substrate, and a second surface opposite to the first surface of the substrate. This is solved by an electronic component comprising another module used in connection with the wireless communication module.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the electronic component which has the radio | wireless communication module reduced in size with the simple structure.

  Further, when the conductive layer for separating the wireless communication module and the another module is formed on the substrate, it is possible to reduce the influence of the wireless communication module on the another module, which is preferable. It is.

  The conductive layer includes two ground layers having a ground potential. When a power layer having a power supply potential is formed between the two ground layers, the power layer is electromagnetically shielded. It is possible and preferable.

  Further, when the area of the ground layer is larger than the area of the power supply layer, the effect of shielding the power supply layer is further improved.

  The two ground layers are connected to the wireless communication module and the other module, respectively, and the power supply layer is connected to the first power supply layer connected to the wireless communication module and the another module. If the second power supply layer is included, a structure for separating the wireless communication module and the another module can be formed in a space-saving manner.

  In the first power supply layer, when the power supply layer corresponding to the analog circuit of the wireless communication module and the power supply layer corresponding to the digital circuit of the wireless communication module are separated, the digital circuit and the analog circuit The power line is separated and is preferred.

  The another module may include a detection unit.

  The another module may include a display unit.

  Further, when the wireless communication module and the another module are connected by a via plug that penetrates the substrate, a structure that substantially separates the wireless communication module and the another module by the substrate is easily configured. be able to.

  If the connection terminal for connecting with the connection object of the said board | substrate is formed in the peripheral part of the said board | substrate, the connection with the connection object of the said electronic component will become easy.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the electronic component which has the radio | wireless communication module reduced in size with the simple structure.

  An electronic component according to the present invention is mounted on a substrate having a multilayer structure, a wireless communication module mounted on a first surface of the substrate, and a second surface opposite to the first surface of the substrate. And another module used in connection with the wireless communication module.

  In the electronic component described above, the wireless communication module and the other module are mounted on both surfaces of the substrate having a multilayer structure, so that the wireless communication module has an influence on the other module (for example, noise, malfunction, etc.) Can be suppressed.

  For example, conventionally, a structure for electromagnetically shielding (separating) a wireless communication module such as a shield structure for shielding the wireless communication module has been proposed. However, in the present invention, these external structures are used. In addition, it is possible to configure an electronic component that can be reduced in size and weight.

  That is, the substrate having a multilayer structure is a substrate for mounting the wireless communication module and the another module, and has a function of separating the wireless communication module and the another module.

  In addition, it is preferable that a conductive layer for separating the wireless communication module and the another module is formed on the substrate, since the effect of shielding the wireless communication module is further improved. Further, if the conductive layer is constituted by a ground layer that is connected to the wireless communication module or the other module and has a ground potential, it is suitable for downsizing of electronic components. Further, when the power supply layer connected to the wireless communication module or the other module is configured to be sandwiched between the two ground layers, the influence of the power supply layer on the module can be suppressed. This is possible and more preferable.

  Next, an example of a specific configuration of the electronic component will be described below with reference to the drawings.

  FIG. 1 is a cross-sectional view schematically showing an electronic component 100 according to Embodiment 1 of the present invention. Referring to FIG. 1, in an electronic component 100 according to the present embodiment, a wireless communication module M1 is provided on a first surface of a substrate 101 having a multilayer structure, and a wireless communication is provided on a second surface opposite to the first surface. A module M2 used in connection with the module M1 is mounted.

  In addition, on the substrate 101, the wiring layer L1, the ground layer G1, the wiring layer L2, and the (analog) power supply layer V1, which are formed of a conductive material in order from the top (from the side of the wireless communication module M1), ( The conductive layers of the digital) power supply layer V2, the wiring layer L3, the ground layer G2, and the wiring layer L4 are formed.

  Furthermore, an insulating layer D1 is provided between the wiring layer L1 and the ground layer G1, an insulating layer D2 is provided between the ground layer G1 and the wiring layer L2, an insulating layer D3 is provided between the wiring layer L2 and the power supply layer V1, and the power supply layer V1 and the power supply layer. An insulating layer D4 is provided between V2, an insulating layer D5 is provided between the power supply layer V2 and the wiring layer L3, an insulating layer D6 is provided between the wiring layer L3 and the ground layer G2, and an insulating layer D7 is provided between the ground layer G2 and the wiring layer L4. , Each is formed.

  Further, the wireless communication module M1 and the module M2 are connected by a via plug P1 that penetrates the substrate 101. The wireless communication module M1 and the wiring layer L2 are connected by a via plug P2, and the module M2 and the wiring layer L3 are connected by a via plug P3.

  In the above case, the conductive layer not connected to the via plug is electrically insulated from the via plug, but this structure is not shown. For example, the via plug P1 and the ground layers G1 and G2, the wiring layers L2 and L3, the power supply layers V1 and V2 are insulated, and the via plug P2 and the ground layer G1, and the via plug P3 and the ground layer G2 are also insulated. These insulating structures are not shown.

  Further, pattern wirings (not shown) connected to the wireless communication module M1 are formed in the wiring layers L1 and L2. Similarly, pattern wirings (not shown) connected to the module M2 are formed in the wiring layers L3 and L4.

  In addition, a ground layer G1 serving as a ground potential, an analog power layer V1 serving as a power source potential, and a digital power layer V2 serving as a power source potential are combined with the wireless communication module M1, a ground layer G2 serving as a ground potential, and a digital power layer V2 serving as a power source potential. Are connected to the module M2, respectively. Details of the structure of these connections will be described later.

  In the electronic component 100, the wireless communication module M1 and the module M2 are mounted on both surfaces of the substrate 101 having a multilayer structure, and the wireless communication module M1 and the module M2 are connected by via plugs P1 penetrating the substrate 101. It is a feature.

  In the above structure, the substrate 101 is a substrate for mounting the wireless communication module M1 and the module M2, and has a function of substantially separating the wireless communication module M1 and the module M2.

  For this reason, in the electronic component 100 according to the present embodiment, for example, the influence of the wireless communication module M1 on the module M2 without using an external structure on the substrate 101 such as a shield structure as in the conventional electronic component ( For example, noise, malfunction, etc.) can be suppressed.

  For this reason, the structure of the electronic component 100 having the wireless communication module M1 is simplified, and the electronic component 100 can be reduced in size and weight.

  In the substrate 101, since the ground layers G1 and G2 function as a conductive layer (shielding layer) for electromagnetically separating the wireless communication module M1 and the module M2, the wireless communication module M1 with respect to the module M2 is provided. It is possible to reduce the influence of high frequency noise and malfunction, which is preferable.

  Next, details of the structure of the substrate 101 will be described with reference to FIG. FIG. 2 is a perspective view schematically showing the substrate 101. However, the parts described above are denoted by the same reference numerals, and description thereof is omitted. In addition, in this figure, the insulating layers D1 to D7 are not shown.

  Referring to FIG. 2, in the substrate 101, the areas of the ground layers G1, G2 are formed so as to be larger than the areas of the power supply layers V1, V2, and the power supply by the ground layers G1, G2 when viewed in plan. The layers V1 and V2 are formed so as to be covered (hidden). For this reason, it is possible to suppress the noise generated by the power supply layers V1 and V2 from affecting the wireless communication module M1 and the module M2, and to configure a highly reliable electronic component.

  The digital power supply layer V2 includes a digital power supply layer V2a connected to the wireless communication module M1 and a digital power supply layer V2b connected to the module M2 formed in the same plane. That is, in the digital power supply layer V2, the power supply layer V2a connected to the wireless communication module M1 and the power supply layer V2b connected to the module M2 are separated.

  The analog power supply layer V1 is connected to the wireless communication module M1. In this case, since the wireless communication module M1 has an analog circuit and a digital circuit, an analog power supply layer V1 corresponding to the analog circuit and a digital power supply layer V2a corresponding to the digital circuit are connected to the wireless communication module M1. Will be. That is, the power supply layer VM1 connected to the wireless communication module M1 includes an analog power supply layer V1 and a digital power supply layer V2a that are configured separately (insulated and stacked).

  As described above, the power supply layer connected to the wireless communication module M1 and the power supply layer connected to the module M2 are separated, and the power supply layer connected to the wireless communication module M1 further includes a power supply corresponding to the digital circuit. Since the power supply layer corresponding to the layer and the analog circuit is separated, it is possible to effectively suppress the occurrence of malfunction due to noise in the power supply layer.

  Next, FIG. 3 shows an example of connection between the wireless communication module M1 and the module M2 and the power supply layer and the ground layer. FIG. 3 is a diagram schematically illustrating the connection state between the wireless communication module M1 and the power supply layer and the ground layer described above, and the connection state between the module M2 and the power supply layer and the ground layer. However, the parts described above are denoted by the same reference numerals, and description thereof is omitted. Further, the illustration of the via plugs P1 to P3 and the insulating layers D1 to D7 described above with reference to FIG. 1 is omitted. Further, in this figure, for convenience of illustration, the areas of the power supply layer and the ground layer are substantially the same.

  Referring to FIG. 3, the wireless communication module M1 is connected to the ground layer G1 by a via plug P4. The wireless communication module M1 is connected to the power supply layer VM1 by via plugs P5 and P6. Specifically, the via plug P5 connects the analog circuit of the wireless communication module M1 to the analog power supply layer V1, and the via plug P6 connects the digital circuit of the wireless communication module M1 to the digital power supply layer V2a. That is, on the wireless communication module M1 side, the power supply line connected to the digital circuit and the power supply line connected to the analog circuit are separated.

  The module M2 is connected to the ground layer G2 by a via plug P8. The module M2 is connected to the digital power supply layer V2b by the via plug P7. That is, the power supply line connected to the wireless communication module M1 and the power supply line connected to the module M2 are separated.

  By configuring as described above, it is possible to minimize the mutual influence of the modules on the front and back of the substrate 101, and it is possible to configure a highly reliable electronic component.

  The wireless communication module M1 includes, for example, a high frequency (RF) communication unit, an MCU (microcomputer) unit, a crystal resonator, and the like. As an example, a module compatible with ZigBee (registered trademark) is known. Yes.

  Further, as the module M2 used in connection with the wireless communication module M1, for example, there is a module having a detecting means (for example, a sensor). Examples of the detection means include a temperature sensor, a humidity sensor, an optical sensor, an acceleration (vibration) sensor, a smoke sensor, and a flow rate sensor. It is possible to construct a wireless network using sensors by using an electronic component that combines a module using these sensors and a wireless communication module. For example, such a sensor network can be applied to a home security system, a control system for indoor facilities from a remote location, and the like.

  In this case, it is preferable that the electronic component including the wireless communication module is small and light so as not to select an installation location. Moreover, it is preferable that the sensor part is not covered with a shielding structure (such as a shield) and that the sensor part can be easily directed to a detection target (a generation source of light, temperature, vibration, or the like).

  That is, the electronic component according to the present embodiment, which has a simple structure, can be thinned, and can easily expose the sensor portion toward the detection target, is suitable for the above-described application.

  The module M2 is not limited to the module having the detection unit, and may include a display unit (a monitor, for example, electronic paper). In this case, information obtained by the wireless communication module can be displayed on the display means as an image or a character. In the electronic component according to the present embodiment, the display means can be easily exposed.

  In addition, the electronic component 100 according to the present embodiment can be manufactured by a known multilayer substrate manufacturing method. For example, the insulating layers D2, D4, and D6 shown in FIG. 1 may be formed of a core substrate, and the insulating layers D1, D3, D5, and D7 may be formed of a prepreg (adhesive) material.

  Also, the electronic component 100 can be manufactured by a build-up method. Moreover, you may manufacture combining a core board | substrate and a buildup layer.

  Next, a mounting method of the electronic component 100 and a structure for mounting will be described below. However, in the following drawings, the same reference numerals are given to the parts described above, and the description may be omitted.

  4A to 4C are diagrams illustrating an example in which connection terminals for mounting are provided on the electronic component 100 described above. 4A is a plan view of the electronic component 100 viewed from the surface of the wireless communication module M1 (hereinafter referred to as the front surface in the text), and FIG. 4B is a plan view of the electronic component 100 viewed from the surface of the module M2 (hereinafter referred to as the back surface in the text). 4C shows a perspective view (image diagram).

  Referring to FIGS. 4A to 4C, connection terminals B (BGA using solder balls; ball grid array) are formed on the peripheral edge of the back surface of the electronic component 100 (substrate 101). Using the connection terminal B, the electronic component 100 can be connected to a connection target.

  5A to 5C are examples in which another connection terminal for mounting is provided on the electronic component 100 described above. 5A is a plan view as viewed from the front surface of the electronic component 100, FIG. 5B is a plan view as viewed from the back surface, and FIG. 5C is a perspective view (image diagram).

  Referring to FIGS. 5A to 5C, a connection terminal E (electrode) is formed on the peripheral edge (side wall) of the electronic component 100. In addition, the electrode E is formed with a recess so as to facilitate connection. The electronic component 100 may be connected to the connection target using the connection terminal E.

  Further, the connection terminals are not limited to the above-described BGA and electrodes. For example, as shown in FIG. 6, connection terminals LG (LGA; land grid array) are provided on the peripheral edge of the back surface of the electronic component 100 (substrate 101). It may be formed.

  7A and 7B show the substrates S1 and S2 for mounting the electronic component 100, respectively. The substrate S1 shown in FIG. 7A is configured to have a notch, and the substrate S2 shown in FIG. 7B is configured to have a through hole in the center. These notches and through holes are for exposing the module M2 (or the wireless communication module M1). Further, the connection terminals formed on the peripheral edge of the electronic component 100 are connected to a wiring pattern (not shown) formed on the peripheral edge of the through portion of the substrate S1.

  8A is a perspective view of the electronic component 100 mounted on the substrate S1 shown in FIG. 7A as viewed from the front surface of the electronic component, and FIG. 8B shows the electronic component 100 mounted on the substrate S1 on the back surface of the electronic component. It is the perspective view seen from.

  8A and 8B, the electronic component 100 is mounted on the substrate S1 such that the module M2 is exposed from the cutout portion of the substrate S1. Further, the electronic component 100 may be formed with an antenna portion AT. Further, the connection terminals formed on the peripheral edge portion of the electronic component 100 are connected to a wiring pattern (not shown) formed on the peripheral edge portion of the cutout portion of the substrate S2.

  9A is a perspective view of the electronic component 100 mounted on the substrate S2 shown in FIG. 7B as viewed from the surface of the electronic component, and FIG. 9B shows the electronic component 100 mounted on the substrate S2. It is the perspective view seen from the back surface.

  9A and 9B, the electronic component 100 is mounted on the substrate S2 such that the module M2 is exposed from the through hole of the substrate S2. Further, an antenna unit AT connected to the wireless communication module M1 may be formed on the substrate S2.

  The electronic component 100 is connected to a connection target such as a mother board via a board for mounting such as the board S1 or the board S2.

  In addition, the thickness of the substrates S1 and S2 may be greater than the thickness of the module M2 (or the thickness of the wireless communication module M1) so that the module and the motherboard do not interfere when mounted on the motherboard. preferable.

  In mounting, as shown in FIG. 10A, the side of the electronic component mounted on the substrate S2 on which the wireless communication module M1 is formed may be sealed with a resin material F. Further, as shown in FIG. 10B, a connection terminal B1 such as a BGA may be provided on the back surface of the substrate S2 (the back surface of the electronic component 100).

  FIG. 11 is a diagram schematically showing another mounting method for the electronic component 100. Referring to FIG. 11, in the case shown in FIG. 11, pin-like connection terminals PI are formed on the peripheral edge of the back surface of the electronic component 100.

  In this case, by mounting the socket SK1 into which the connection terminal PI can be inserted on the board (motherboard) S3 to be connected, electronic components can be mounted.

  FIG. 12 is a diagram schematically showing still another mounting method for the electronic component 100. Referring to FIG. 12, in the case shown in FIG. 12, a header H1 is installed on the peripheral edge of the back surface of the electronic component, and a socket SK2 corresponding to the header H1 is installed on the substrate S3.

  FIG. 13 is a perspective view of the socket SK2 and the header H1. As shown in the figure, the connection terminal may have a structure in which concave portions (convex portions) made of a conductive material to be connected are formed with high density.

  Further, the electronic component may be mounted as shown in FIGS. 14A to 14B. Referring to FIG. 14A, in the case shown in FIG. 14A, the electronic component is placed such that the end (peripheral portion) of the electronic component 100 becomes a plug-type connection terminal PL corresponding to the socket SK3 on the substrate S3. It is configured.

  As shown in FIG. 14B, the electronic component 100 is mounted so as to be substantially perpendicular to the substrate S3 by inserting the connection terminal PL into the socket SK3. Further, in the case of the above structure, there is an advantage that the electronic component 100 can be easily attached to or detached from the substrate S3.

  As described above, the structure and method for connecting the electronic component to the connection target can be variously modified and changed in accordance with the usage form of the electronic component.

  In addition, the number of modules to be mounted, positions, and the like can be changed in various ways. For example, a plurality of wireless communication modules are mounted on the substrate 101, or modules used by being connected to the wireless communication modules are used. A plurality of them may be mounted.

  Although the present invention has been described with reference to the preferred embodiments, the present invention is not limited to the specific embodiments described above, and various modifications and changes can be made within the scope described in the claims.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the electronic component which has the radio | wireless communication module reduced in size with the simple structure.

1 is a cross-sectional view of an electronic component according to Example 1. FIG. It is a figure which shows the structure of the board | substrate of the electronic component of FIG. It is a figure which shows the connection of the electronic component of FIG. It is FIG. (1) which shows the mounting method of an electronic component. It is FIG. (2) which shows the mounting method of an electronic component. It is FIG. (3) which shows the mounting method of an electronic component. FIG. 14 is a diagram (No. 4) illustrating a mounting method of an electronic component. It is FIG. (5) which shows the mounting method of an electronic component. It is FIG. (6) which shows the mounting method of an electronic component. FIG. 11 is a diagram (No. 7) illustrating a method for mounting an electronic component. It is FIG. (1) which shows the board | substrate for mounting an electronic component. It is FIG. (2) which shows the board | substrate for mounting an electronic component. It is FIG. (8) which shows the mounting method of an electronic component. It is FIG. (9) which shows the mounting method of an electronic component. It is FIG. (10) which shows the mounting method of an electronic component. It is FIG. (11) which shows the mounting method of an electronic component. It is FIG. (12) which shows the mounting method of an electronic component. It is FIG. (13) which shows the mounting method of an electronic component. It is FIG. (14) which shows the mounting method of an electronic component. It is FIG. (15) which shows the mounting method of an electronic component. It is a figure which shows the header and socket which are used for mounting. It is FIG. (16) which shows the mounting method of an electronic component. It is FIG. (17) which shows the mounting method of an electronic component.

Explanation of symbols

100 Electronic component 101 Substrate M1 Wireless communication module M2 module D1, D2, D3, D4, D5, D6, D7 Insulating layer L1, L2, L3, L4 Wiring layer G1, G2 Ground layer V1, V2, V2a, V2b, VM1 Power supply Layer P1, P2, P3, P4, P5, P6, P7, P8 Via plug B, B1, E, LG, PI, PL Connection terminal SK1, SK2, SK3 Socket H1 Header S1, S2, S3 Board

Claims (10)

A substrate having a multilayer structure;
A wireless communication module mounted on the first surface of the substrate;
An electronic component comprising: another module mounted on the second surface opposite to the first surface of the substrate and used in connection with the wireless communication module.   The electronic component according to claim 1, wherein a conductive layer for separating the wireless communication module and the another module is formed on the substrate. The conductive layer includes two ground layers having a ground potential,
The electronic component according to claim 2, wherein a power supply layer having a power supply potential is formed between the two ground layers.   The electronic component according to claim 3, wherein an area of the ground layer is larger than an area of the power supply layer. The two ground layers are respectively connected to the wireless communication module and the another module;
5. The electronic component according to claim 3, wherein the power supply layer includes a first power supply layer connected to the wireless communication module and a second power supply layer connected to the another module. .   The power supply layer corresponding to the analog circuit of the wireless communication module and the power supply layer corresponding to the digital circuit of the wireless communication module are separated from each other in the first power supply layer. Item 5. An electronic component according to Item 5.   The electronic component according to claim 1, wherein the another module includes a detection unit.   The electronic component according to claim 1, wherein the another module includes display means.   9. The electronic component according to claim 1, wherein the wireless communication module and the another module are connected by a via plug that penetrates the substrate.   10. The electronic component according to claim 1, wherein a connection terminal for connecting to a connection target of the substrate is formed at a peripheral portion of the substrate. 11.

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