JP4533093B2 - MODULE CIRCUIT UNIT AND ELECTRONIC DEVICE MOUNTING IT - Google Patents

Description

  The present invention relates to a module circuit unit composed of a plurality of module circuits mounted on a base substrate, and in particular, a module circuit on a base substrate mounted in a device that is required to be miniaturized, such as a portable terminal. Concerning the arrangement structure.

  A small electronic device such as a portable terminal (such as a mobile phone) incorporates electronic components mounted on a base substrate with high density. As the number of electronic components required increases with the increase in the number of functions of mobile terminals, there is a demand for further downsizing of mobile terminals at the same time. Implementation is required.

The following Patent Document 1 electrically and mechanically connects a plurality of printed circuit boards and makes the connection part three-dimensional, thereby reducing the space occupied by the connection area and enabling high-density mounting of printed circuit boards. This technology is disclosed.
Japanese Patent Laid-Open No. 7-50482

  However, the high-density arrangement of electronic components tends to cause characteristic deterioration due to radio wave interference, and therefore measures such as shielding each electronic component are taken. However, if an unexpected malfunction occurs, the minute and complicated Because of the simple circuit configuration, enormous and difficult investigation and inspection work is required.

  In addition, even when modularizing electronic components and connecting the module circuits to each other via wiring on the base board, due to restrictions on the wiring length and the placement position of the module circuit based on the wiring, etc. There is a possibility that the implementation will be hindered.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a module circuit unit that allows module circuits on a base substrate to be connected in a space-saving manner and enables higher-density mounting, and an electronic device equipped with the module circuit unit.

A first configuration of the module circuit unit according to the present invention includes a base substrate, a plurality of module circuits arranged adjacent to each other on the base substrate, and having recesses formed on the side surfaces, and connected to the ground and adjacent to each other. A conductive partition member arranged so as to partition the module circuits; and at least one of the recesses provided on the partition member and provided on the side surface of the module circuit adjacent to each other with the partition member interposed therebetween. And a connection terminal for grounding the module circuit.

According to a second configuration of the module circuit unit of the present invention, a base substrate, a plurality of module circuits arranged adjacent to each other on the base substrate and having a recess formed on a side surface, and the adjacent module circuit are partitioned. A partition member, a part of which is formed of a conductive member and connected to the ground, and the rest is formed of a non-conductive member, and the partition member is provided adjacent to the non-conductive member. A first connection terminal that is in contact with each concave portion provided on the side surface of the module circuit and wire-connects between adjacent module circuits; and provided on a side surface of the module circuit adjacent to each other with the conductive member interposed therebetween. And a second connection terminal that contacts at least one of the respective recesses and grounds the module circuit.

  In addition, the module circuit unit having each configuration described above includes a conductive member that is connected to the ground and is disposed so as to surround the plurality of module circuits on the base substrate, a side surface of the conductive member, and the conductive member There may be provided another connection terminal for grounding the side surface of the module circuit and the side surface of the module circuit facing each other.

  Moreover, the electronic device of the present invention that achieves the above object is an electronic device in which the module circuit unit having the above-described configuration is mounted.

  According to the module circuit unit of the present invention, it is possible to arrange the module circuits adjacent to each other while securing the wiring connection between the module circuits, and the electronic device can be further downsized. In addition, it is possible to easily and flexibly cope with function updates and defect corrections.

  Embodiments of the present invention will be described below with reference to the drawings. However, this embodiment does not limit the technical scope of the present invention.

  FIG. 1 is a diagram for explaining an external structure of a module circuit constituting a module circuit unit according to an embodiment of the present invention. Electronic components mounted on a base substrate inside the electronic device are modularized and configured as a plurality of module circuits 1. As shown in FIG. 1A, a recess 3 is provided on the side surface of the module circuit 1. The recess 3 is an external terminal. Preferably, a plurality of recesses 3 are provided on one side surface.

  Then, as shown in FIG. 1B, a partition wall 2 in which metal terminal pins 2A (connection terminals) are embedded is provided on a base substrate (not shown) so that the module circuit 1 can be fitted. Specifically, the metal terminal pin 2 </ b> A forms a recess with respect to the partition wall 2, and is combined with the recess 3 of the module circuit 1, so that the module circuit 1 is fitted into the partition wall 2.

  Then, another module circuit 1 is similarly fitted to the opposite surface of the partition wall 2 to realize wiring connection between the module circuits 1 through the metal terminal pins 2A.

  In addition, as shown in FIG. 1 (c), the connection between the module circuits is not a bar-shaped metal terminal pin 2A, but a connection terminal of another shape such as a leaf spring is provided on the partition wall 2 so that the wiring connection between the module circuits is possible. It may be done.

  That is, since the module circuits 1 are arranged on the base substrate with almost no gap through the thin partition wall 2, a space for connection wiring becomes unnecessary, and the module circuits 1 are densely arranged on the base substrate. Wiring connection between the module circuits in the state of being arranged in the circuit becomes possible.

  FIG. 2 is a diagram showing a first configuration example of the module circuit unit 10 in the present embodiment having the arrangement structure of FIG. FIG. 2 is a top view, and four rectangular parallelepiped module circuits 1 (1A, 1B, 1C, 1D) have metal terminal pins 2A embedded in a conductive frame 4 arranged on a base substrate 5. The module circuits 1 are arranged adjacent to each other via the partition wall 2. Each module circuit 1 is shielded to prevent characteristic deterioration such as radio wave interference. As a result, spatial coupling due to circuit connection and interference at the same potential can be prevented, and performance degradation can be largely avoided by removing only unnecessary waves that affect the wiring path.

  Each module circuit 1 is adjacent to two module circuits via the partition wall 2 and is also in contact with the conductive frame 4. For example, the module circuit 1 </ b> A is adjacent to the module circuits 1 </ b> B and 1 </ b> C on the two inner side surfaces and is in contact with the conductive frame 4 on the two outer side surfaces. The module circuit 1 can be connected to the ground potential (GND) by wiring connection with the conductive frame 4. The conductive frame 4 can be formed of a metal or a metal-deposited resin.

  Each module circuit 1 is preferably provided with the recess 3 on all four side surfaces. On the two side surfaces adjacent to another module circuit 1, the recess 3 is in contact with the metal terminal 2 </ b> A of the partition wall 2. In addition, the conductive frame 4 is also provided with a recess 3 on a side surface in contact with the module circuit 1, and the recess is formed by combining the recess 3 provided on the side surface adjacent to the module circuit 1 with the conductive frame 4. The metal terminal pin 2A is inserted into the hole. As a result, the module circuit 1 is grounded to the conductive frame 4.

  FIG. 3 is an assembly diagram when the module circuit unit of FIG. 2 is applied to a mobile phone terminal. FIG. 3 shows a foldable mobile phone terminal, and the module circuit unit 10 shown in FIG. 2 is mounted on each of a case having a liquid crystal (LED) panel 31 and a case 32 having an operation button (key) panel 30. The The module circuit unit 10 includes a base substrate 5, for example, four module circuits 1 and a conductive frame 4. The module circuit unit 10 includes a partition wall 2 in which metal module pins 2 A are embedded on the base substrate 5. The module circuit connection is realized by mounting them adjacent to each other. In addition, the outside of the module circuit 1 is surrounded by a conductive frame 4, and a metal terminal pin 2 </ b> A is inserted into a hole formed by a recess 3 provided on a side surface in contact with the conductive frame 4, Connection is realized. A portion of the base substrate 5 that comes into contact with the conductive frame 4 is provided with a wiring pattern and connected to the ground.

  When the module circuit unit 10 is mounted in a case, a leaf spring 33 is disposed on the inner side surface of each case 32, and the module circuit unit 10 is attached to the case by pressing the module circuit unit 10 into the case. Can be fixed to.

  As described above, in an electronic device such as a mobile phone terminal that is required to be miniaturized, a space for wiring connection on the base substrate is not required, and module circuits can be mounted with high density.

  Further, by blocking the circuit on the base substrate with the module circuit, the following advantages are obtained. Specifically, by configuring a module circuit for each function such as communication (wireless), power supply, control, etc., selecting a module circuit having a required function, and configuring the module circuit unit 10, Module circuits used for a plurality of types of electronic devices having different functions can be shared, and development costs can be reduced. In addition, when updating the function of the electronic device, it is possible to cope with the problem by replacing only the module circuit having the new function without replacing the entire base substrate, which leads to cost reduction. Also, if any trouble occurs, it is sufficient to replace only the defective module circuit without replacing the entire base substrate.

  FIG. 4 is a schematic diagram illustrating a second configuration example of the module circuit unit 10 according to the present embodiment. The second configuration example of FIG. 4 is a configuration in which the metal terminal pin 2A of the partition wall 2 is connected to the ground in comparison with the first configuration example of FIG. In the case of the second configuration, the metal terminal pin 2A of the partition wall 2 does not require wiring connection between the module circuits arranged on both sides of the partition wall 2, so that the metal terminal pin 2A as shown in FIG. May be provided separately on each surface of the partition wall 2.

  The partition wall 2 has conductivity and is electrically connected to the conductive frame 4 of the outer frame. As a result, the module circuit 1 is connected to the conductive frame 4 on all side surfaces around the module circuit 1 and can be grounded. This configuration is applied when there is a case where it is necessary to ground the side of the module circuit facing each other due to the circuit configuration inside the module circuit.

  Further, the wiring connection between the module circuits is performed by a wiring pattern provided on the base substrate.

  FIG. 5 is an assembly diagram when the module circuit unit of FIG. 4 is applied to a mobile phone terminal. 5, a foldable mobile phone terminal is shown as in FIG. 3, and the module circuit unit 10 shown in FIG. 4 is provided in each of a part having a liquid crystal (LED) panel and a part having an operation button (key) panel. Is implemented. The module circuit unit 10 includes a base substrate 5, four module circuits 1, and a conductive frame 4. Four module circuits 1 are surrounded by a conductive frame 4 on a base substrate 5, and each module circuit 1 is mounted in a state of being partitioned by a partition wall 2. Then, by making contact with the conductive frame 4 and the metal pin 2A of the partition wall 2, ground connection is realized on all side surfaces of the module circuit.

  Further, in FIG. 5, in comparison with FIG. 3, a wiring pattern is formed on a portion of the base substrate 5 where the partition walls 2 for partitioning the module circuits are mounted, and the ground connection with the conductive frame 4 is achieved. .

  FIG. 6 is a schematic diagram illustrating a third configuration example of the module circuit unit 10 according to the present embodiment. In the third configuration example of FIG. 6, a part of the partition wall 2 is used for ground connection and the rest is used for wiring connection between module circuits in comparison with the first configuration example of FIG. That is, a part of the partition wall 2 has conductivity so as to be electrically connected to the conductive frame 4, and the remaining part is non-conductive. The conductive portion is used for ground connection, and the nonconductive portion is used for wiring connection between module circuits.

  Specifically, in the third configuration example, the conductive frame 4 is formed of, for example, a plastic resin, and only the conductive portion is metal-deposited. And the part which is not metal-vapor-deposited becomes a nonelectroconductive part. The recessed part 3 provided in the side surface of the module circuit 1 forms a hole part through the partition part between module circuits, and the metal terminal 2A is inserted there. The metal terminal pin 2A inserted into the conductive portion connects the module circuit to the ground, and the metal terminal pin 2A inserted into the non-conductive portion connects the module circuits with wiring.

  Thus, in the third configuration example, the ground connection and the inter-module wiring connection can be properly used according to the application.

  FIG. 7 is an assembly diagram when the module circuit unit of FIG. 6 is applied to a mobile phone terminal. FIG. 7 shows a foldable mobile phone terminal as well as FIG. 3 and FIG. 5 and shows a part having a liquid crystal (LED) panel 31 and a case 32 having an operation button (key) panel 30 in FIG. The module circuit unit 10 is mounted. In comparison with FIG. 5, in FIG. 7, a wiring pattern is formed on the portion of the base substrate 5 where the conductive portions of the conductive frame 4 partitioning the module circuits are mounted, and the ground connection with the conductive frame 4 is illustrated. It has been. A wiring pattern is not formed in the non-conductive portion.

  FIG. 8 is a schematic diagram illustrating a fourth configuration example of the module circuit unit 10 according to the present embodiment. The fourth configuration example in FIG. 8 is a hole formed by eliminating the partition wall 2, bringing the module circuits 1 into direct contact with each other, and matching the recesses 3 with each other in comparison with the first configuration example in FIG. 2. In this configuration, the metal terminal pin 2A is directly embedded in the part. In this configuration example, the metal terminal pins 2A arranged between the module circuits perform wiring connection between the module circuits. With this configuration, the partition wall 2 is not necessary, and the module circuit 1 can be mounted with higher density.

  FIG. 9 is an assembly diagram when the module circuit unit of FIG. 8 is applied to a mobile phone terminal. In comparison with FIG. 3, the partition wall 2 is not provided.

  The module circuit according to the present embodiment may be a BGA (ball grid array) type that is connected to the wiring pattern of the base substrate by using spherical solder arranged on the bottom surface. And the inter-module wiring connection according to the present embodiment may be used. Similarly, both may be used for the ground connection.

  The module circuit unit in this embodiment can be applied not only to a mobile phone terminal but also to other electronic devices.

(Appendix 1)
A base substrate;
A plurality of module circuits arranged on the base substrate so that the side surfaces thereof are in contact with each other, and concave portions are formed on the side surfaces;
An adjacent module in contact with a recess provided on a first side of the module circuit and a recess provided on a second side facing the first side of another module circuit adjacent to the module circuit A module circuit unit comprising a connection terminal for wiring connection between circuits.

(Appendix 2)
A base substrate;
A plurality of module circuits disposed adjacent to each other on the base substrate and having a recess formed on a side surface;
A partition member arranged to partition adjacent module circuits;
It is provided with a connection terminal provided on the partition member and contacting each recess provided on a side surface of the adjacent module circuit with the partition member interposed therebetween, and for wiring connection between the adjacent module circuits. Module circuit unit.

(Appendix 3)
A base substrate;
A plurality of module circuits disposed adjacent to each other on the base substrate and having a recess formed on a side surface;
A conductive partition member connected to ground and arranged to partition adjacent module circuits;
A contact terminal provided on the partition member and in contact with at least one of the recesses provided on a side surface of the module circuit adjacent to the partition member with the partition member interposed therebetween, and connecting the module circuit to ground. Module circuit unit to do.

(Appendix 4)
A base substrate;
A plurality of module circuits arranged adjacent to each other on the base substrate and having recesses formed on side surfaces;
A partition member arranged to partition adjacent module circuits, a part of which is formed of a conductive member and connected to the ground, and the rest is formed of a non-conductive member;
A first connection terminal that is provided on the partition member and is in contact with each concave portion provided on a side surface of the adjacent module circuit with the non-conductive member interposed therebetween; and a wiring connection between adjacent module circuits; and A module circuit unit comprising: a second connection terminal that contacts at least one of the respective concave portions provided on the side surfaces of the module circuit adjacent to each other with a conductive member interposed therebetween, and connects the module circuit to ground. .

(Appendix 5)
In any one of supplementary notes 1 to 4,
A conductive member connected to ground and disposed on the base substrate so as to surround the plurality of module circuits;
A module circuit unit comprising: a side surface of the conductive member; and another connection terminal for grounding a side surface of the module circuit facing the side surface of the conductive member.

(Appendix 6)
An electronic device including the module circuit unit according to any one of appendices 1 to 5.

It is a figure explaining the external structure of the module circuit which comprises the module circuit unit in embodiment of this invention. It is a schematic diagram which shows the 1st structural example of the module circuit unit 10 in this Embodiment. FIG. 3 is an assembly diagram when the module circuit unit of FIG. 2 is applied to a mobile phone terminal. It is a schematic diagram which shows the 2nd structural example of the module circuit unit 10 in this Embodiment. FIG. 5 is an assembly diagram when the module circuit unit of FIG. 4 is applied to a mobile phone terminal. It is a schematic diagram which shows the 3rd structural example of the module circuit unit 10 in this Embodiment. FIG. 7 is an assembly diagram when the module circuit unit of FIG. 6 is applied to a mobile phone terminal. It is a schematic diagram which shows the 4th structural example of the module circuit unit 10 in this Embodiment. FIG. 9 is an assembly diagram when the module circuit unit of FIG. 8 is applied to a mobile phone terminal.

Explanation of symbols

  1: module circuit, 2: partition wall, 2A: connection terminal, 3: recess, 4: conductive frame, 5: base substrate, 10: module circuit unit

Claims (3)

A base substrate;
A plurality of module circuits arranged adjacent to each other on the base substrate and having recesses formed on side surfaces;
A conductive partition member connected to ground and arranged to partition adjacent module circuits;
A contact terminal provided on the partition member and in contact with at least one of the recesses provided on a side surface of the module circuit adjacent to the partition member with the partition member interposed therebetween, and connecting the module circuit to ground. Module circuit unit to do. A base substrate;
A plurality of module circuits arranged adjacent to each other on the base substrate and having recesses formed on side surfaces;
A partition member arranged to partition adjacent module circuits , a part of which is formed of a conductive member and connected to the ground, and the rest is formed of a non-conductive member;
Wherein provided in the partition member, wherein contact with the respective recess provided in the side surface of the module adjacent circuitry across the non-conductive member, a first connection terminal for wiring connection between adjacent modules circuit, wherein A module circuit unit comprising: a second connection terminal that contacts at least one of the respective concave portions provided on the side surfaces of the module circuit adjacent to each other with a conductive member interposed therebetween, and connects the module circuit to ground. . In claim 1 or 2,
A conductive member connected to ground and disposed on the base substrate so as to surround the plurality of module circuits;
A module circuit unit comprising: a side surface of the conductive member; and another connection terminal for grounding a side surface of the module circuit facing the side surface of the conductive member.

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