JP2008016776A5 - - Google Patents

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Publication number
JP2008016776A5
JP2008016776A5 JP2006189298A JP2006189298A JP2008016776A5 JP 2008016776 A5 JP2008016776 A5 JP 2008016776A5 JP 2006189298 A JP2006189298 A JP 2006189298A JP 2006189298 A JP2006189298 A JP 2006189298A JP 2008016776 A5 JP2008016776 A5 JP 2008016776A5
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JP
Japan
Prior art keywords
power supply
wireless communication
electronic component
communication module
supply layer
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Application number
JP2006189298A
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Japanese (ja)
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JP5032803B2 (en
JP2008016776A (en
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Priority to JP2006189298A priority Critical patent/JP5032803B2/en
Priority claimed from JP2006189298A external-priority patent/JP5032803B2/en
Publication of JP2008016776A publication Critical patent/JP2008016776A/en
Publication of JP2008016776A5 publication Critical patent/JP2008016776A5/ja
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Publication of JP5032803B2 publication Critical patent/JP5032803B2/en
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Claims (8)

多層構造を有する基板と、
前記基板の第１の面に実装された無線通信モジュールと、
前記基板の前記第１の面の反対側の第２の面に実装された、前記無線通信モジュールと接続して用いられる別のモジュールと、を有し、
前記基板には、前記無線通信モジュールと前記別のモジュールを分離するための導電層が形成されており、
前記導電層は、接地電位となる２つの接地層を含み、
前記２つの接地層の間には、電源電位となる電源層が形成されていることを特徴とする電子部品。 A substrate having a multilayer structure;
A wireless communication module mounted on the first surface of the substrate;
Mounted on the second surface opposite the first surface of the substrate, have a, and another module used in connection with the wireless communication module,
On the substrate, a conductive layer for separating the wireless communication module and the another module is formed,
The conductive layer includes two ground layers having a ground potential,
An electronic component, wherein a power supply layer having a power supply potential is formed between the two ground layers . 前記接地層の面積が前記電源層の面積よりも大きいことを特徴とする請求項１記載の電子部品。 Electronic component according to claim 1, wherein the area of said ground layer being greater than the area of the power supply layer. 前記２つの接地層は、前記無線通信モジュールと前記別のモジュールにそれぞれ接続され、
前記電源層は、前記無線通信モジュールに接続される第１の電源層と、前記別のモジュールに接続される第２の電源層とを含むことを特徴とする請求項１または２記載の電子部品。 The two ground layers are connected to the wireless communication module and the other module, respectively.
The power supply layer, a first power supply layer, the electronic component according to claim 1 or 2 wherein, characterized in that it comprises a second power supply layer connected to said another module connected to the wireless communication module . 前記第１の電源層では、前記無線通信モジュールのアナログ回路に対応する電源層と、前記無線通信モジュールのデジタル回路に対応する電源層とが分離された構造となっていることを特徴とする請求項３記載の電子部品。 The power supply layer corresponding to an analog circuit of the wireless communication module and a power supply layer corresponding to a digital circuit of the wireless communication module are separated from each other in the first power supply layer. Item 4. The electronic component according to Item 3 . 前記別のモジュールは、検知手段を含むことを特徴とする請求項１乃至４のいずれか１項記載の電子部品。 Said another module, an electronic component according to any one of claims 1 to 4, characterized in that it comprises a detection means. 前記別のモジュールは、表示手段を含むことを特徴とする請求項１乃至４のいずれか１項記載の電子部品。 Said another module, an electronic component according to any one of claims 1 to 4, characterized in that it comprises a display means. 前記無線通信モジュールと前記別のモジュールは、前記基板を貫通するビアプラグにより接続されていることを特徴とする請求項１乃至６のいずれか１項記載の電子部品。 The wireless communication module and said another module, an electronic component according to any one of claims 1 to 6, characterized in that it is connected by a via plug penetrating the substrate. 前記基板の周縁部には、当該基板の接続対象と接続するための接続端子が形成されていることを特徴とする請求項１乃至７のいずれか１項記載の電子部品。 A peripheral portion of the substrate, the electronic component of any one of claims 1 to 7, characterized in that the connection terminals for connecting the connection object of the substrates is formed.
JP2006189298A 2006-07-10 2006-07-10 Electronic components Active JP5032803B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006189298A JP5032803B2 (en) 2006-07-10 2006-07-10 Electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006189298A JP5032803B2 (en) 2006-07-10 2006-07-10 Electronic components

Publications (3)

Publication Number Publication Date
JP2008016776A JP2008016776A (en) 2008-01-24
JP2008016776A5 true JP2008016776A5 (en) 2009-07-30
JP5032803B2 JP5032803B2 (en) 2012-09-26

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ID=39073483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006189298A Active JP5032803B2 (en) 2006-07-10 2006-07-10 Electronic components

Country Status (1)

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JP (1) JP5032803B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7760219B2 (en) 2008-01-28 2010-07-20 Fujifilm Corporation Method of forming image by thermal transfer
JP5027751B2 (en) * 2008-07-25 2012-09-19 株式会社クボタ Module for work equipment
CN103889149B (en) 2012-12-21 2017-07-14 华为终端有限公司 Electronic installation and grid array module
JP6357759B2 (en) * 2013-11-25 2018-07-18 セイコーエプソン株式会社 Package, physical quantity sensor, electronic device and mobile
CN109429421B (en) * 2017-08-24 2023-01-20 中兴通讯股份有限公司 PCB and electronic equipment
JP7267054B2 (en) * 2019-03-25 2023-05-01 三菱重工業株式会社 pulsar receiver

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6353540B1 (en) * 1995-01-10 2002-03-05 Hitachi, Ltd. Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board.

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