JP2008015624A - Method of producing card with built-in electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of producing a card with built-in electronic components that reduces percent defective by simplifying manufacturing processes. <P>SOLUTION: The method of producing a card with built-in electronic components comprises a procedure including a surface forming step for forming a surface forming plate by means of information on the layout of electronic components mounted on the surface of a circuit board; a back forming step for forming a back forming plate by means of information on the layout of electronic components mounted on the back of the circuit board; an adhesive application step for applying an adhesive to the surface forming plate and the back forming plate; and a card forming step for forming the card with the built-in electronic components by sandwiching the circuit board between the surface forming plate and the back forming plate, setting predetermined adhesive-hardening requirements, and bonding the surface forming plate and the back forming plate together. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a method for manufacturing a card incorporating an electronic component.

Traditionally,
An IC circuit including an antenna for non-contact communication and a card (for example, an IC card) containing a circuit board on which electronic components such as an information display element are arranged are formed.

For example, in Patent Document 1, in the manufacture of an IC card, one or more layers of spacers punched into a fixture shape are stacked on a circuit board on which electronic components are mounted, and the height is adjusted. A technique is disclosed in which the spacers and the films are pasted and bonded to each other by heating and pressurizing them using a heat-sensitive adhesive. (Prior art 1)
Japanese Patent Application Laid-Open No. 2004-228561 discloses a technique for card molding by placing a circuit board on which electronic components are mounted in an injection mold and injecting a resin into the mold when manufacturing an IC card. (Prior art 2)
JP-A-8-216575 (2-3 pages, FIGS. 1 and 2) JP-A-4-363300 (2-3 pages, FIG. 1)

By the way, in the prior art 1, there is a drawback that much labor is required for registering the punching shapes of the spacers over a plurality of sheets. Furthermore, the prior art 1 has a problem that irregularities in the shape of stamped spacers occur on the surface of the molded card. Moreover, in the prior art 1 and the prior art 2, there existed a malfunction that components were damaged frequently by the heating temperature and pressure at the time of card | curd molding.

The present invention has been made in view of such conventional techniques, and an object of the present invention is to provide a method of manufacturing an electronic component built-in card that simplifies the manufacturing process and reduces the defective rate. .

The present invention solves the above problems by the following means. That is, the invention of claim 1 uses a surface molding step of molding the surface molding plate using the arrangement information of the electronic components mounted on the surface of the circuit board, and the electronic components mounted on the back surface of the circuit board. Using the arrangement information, a back surface molding step for molding the back surface molding plate, an adhesive application step for applying an adhesive to the front surface molding plate and the back surface molding plate, and between the front surface molding plate and the back surface molding plate, A card molding step of setting a predetermined adhesive curing condition across the circuit board, bonding the front surface molding plate and the back surface molding plate, and molding the electronic component built-in card. An electronic component built-in card manufacturing method characterized by the above.

Here, it is possible to prevent damage to the electronic component due to heat by using an adhesive that does not require heating for bonding the front surface molding plate and the back surface molding plate.

Moreover, since the unevenness | corrugation of the electronic component of a circuit board has the unevenness | corrugation shape | molded corresponding to the surface molding board or the back surface molding board, since a molding board is not deformed, an unevenness | corrugation does not arise in the molding board surface.

Furthermore, since only the front surface molding plate, the circuit board, and the back surface molding plate are used, it is not necessary to prepare and stack a plurality of spacer sheets, and the manufacturing process can be simplified.

According to the present invention, an electronic component built-in card can be manufactured by a simple manufacturing process. It is also possible to manufacture an electronic component built-in card having excellent appearance quality. Furthermore, an electronic component built-in card can be manufactured without damaging the electronic component.

(Example)
Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings.
FIG. 1 is a cross-sectional view of the electronic component built-in card 100.

The electronic component built-in card 100 includes a front surface molding plate 110, a back surface molding plate 120, and a circuit board 130. The circuit board 130 has at least one of the electronic component 140 on the front surface and the electronic component 150 on the back surface.

FIG. 2 is a diagram for explaining the structure of the electronic component built-in card 100.
FIG. 2 shows a circuit board 130 on which an electronic component 140 on the front surface and an electronic component 150 on the back surface are mounted.

The surface molding plate 110 has a dent corresponding to the circuit board 130 and a dent corresponding to the arrangement shape of the electronic component 140 on the surface. The back surface molding plate 120 has a dent corresponding to the circuit board 130 and a dent corresponding to the arrangement shape of the electronic component 150 on the back surface.

This indentation is deep enough to prevent the electronic components of the circuit board 130 from coming into contact with each other.

FIG. 3 is a perspective view of the back surface molding plate 130. The back surface molded board 130 demonstrated in FIG. 2 is shown in figure.
The back surface molding plate 130 is a recess corresponding to the circuit board 130,
And a recess corresponding to the arrangement shape of the electronic component 150 on the back surface of the circuit board 130.

In addition, as a method for creating a molded plate, for example, an NC cutting method or an optical modeling method using electronic component arrangement shape information, or an injection using a mold created using electronic component arrangement shape information There are molding methods.

As the material of the molded plate, general-purpose resins such as PVC, ABS, polycarbonate, epoxy, and urethane can be selected.

FIG. 4 is a diagram for explaining the flow of the manufacturing process of the electronic component built-in card. The surface molding plate 110 is molded using the arrangement information of the electronic component 140 mounted on the surface of the circuit board 130 (FIG. 4 (1)). Using the arrangement information of the electronic component 150 mounted on the back surface of the circuit board 130, the back surface molding plate 120 is molded ((2)).

An adhesive (for example, a room temperature curing type such as a two-component curing type or a moisture curing type is used) is applied to the front surface molding plate 110 and the rear surface molding plate 120 ((11)). The circuit board 130 is sandwiched between the front surface molding plate 110 and the back surface molding plate 120, and predetermined adhesive curing conditions are set (for example, the time required for curing the two-component curable adhesive). The front surface molding plate 110 and the back surface molding plate 120 are bonded together to mold the electronic component built-in card 100 ((12)).

An electronic component built-in card 100 (= IC card) was manufactured using an ABS resin plate and a two-component curable epoxy adhesive. Manufacturing the IC card 100 by cutting the ABS resin plate to produce the front surface molding plate 110 and the back surface molding plate 120, applying a two-component curable epoxy adhesive, and curing it at room temperature. did. As a result, there was no unevenness on the surface of the IC card 100 and it operated normally.

As described above in detail, according to the present invention, an electronic component built-in card can be manufactured by a simple manufacturing process. Also, an electronic component built-in card having excellent appearance quality could be manufactured. Furthermore, it becomes possible to manufacture an electronic component built-in card without damaging the electronic component.

Sectional view of the electronic component built-in card 100 The figure explaining the structure of the electronic component built-in card 100 Perspective view of backside molded plate Electronic component built-in card manufacturing procedure

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Electronic component built-in card 110 Front surface molding plate 120 Back surface molding plate 130 Circuit board 140 Front surface electronic component 150 Back surface electronic component

Claims (1)

An upper surface molding step of molding an upper surface molding plate using arrangement information of electronic components mounted on the upper surface of the circuit board;
A back surface molding step for molding a back surface molding plate using arrangement information of electronic components mounted on the back surface of the circuit board,
An adhesive application step for applying an adhesive to the upper surface molding plate and the rear surface molding plate;
The circuit board is sandwiched between the upper surface molding plate and the rear surface molding plate, predetermined adhesive curing conditions are set, the upper surface molding plate and the rear surface molding plate are bonded, and the electronic component built-in card is molded. Card molding step,
An electronic component built-in card manufacturing method characterized by comprising a procedure including

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