JPH02190398A - Production of ic card - Google Patents
Production of ic cardInfo
- Publication number
- JPH02190398A JPH02190398A JP1010728A JP1072889A JPH02190398A JP H02190398 A JPH02190398 A JP H02190398A JP 1010728 A JP1010728 A JP 1010728A JP 1072889 A JP1072889 A JP 1072889A JP H02190398 A JPH02190398 A JP H02190398A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- plastic frame
- resin
- card
- outer part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000004033 plastic Substances 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 abstract description 10
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 4
- 229910052744 lithium Inorganic materials 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は非接触式のＩＣカードの製造方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a contactless IC card.
非接触式のＩＣカードはコネクタ接触による耐久性の問
題や電気的接合の不安定さが少い事により悪環境下での
使用に適している。特に防水構造を持つカードは環境の
よくないＦＡ’ＰＯＡの分野で有用である。従来、この
防水性カードの製造方法は第４図の断面図のように、゛
電子部品を実装した回路基板６１に外ケース３２を接合
し一体とした後に、外ケース６２の側壁に設けた小穴６
６からエポキシ樹＠６４を充てん、加熱硬化する。この
結果、内部をエポキシ樹脂３４で満たした防水カードが
出来あがる。Non-contact IC cards are suitable for use in adverse environments because they have fewer durability problems due to connector contact and less instability in electrical connections. In particular, a card with a waterproof structure is useful in the field of FA'POA where the environment is not good. Conventionally, the manufacturing method for this waterproof card is as shown in the cross-sectional view of FIG. 6
Fill with epoxy resin @64 from step 6 and heat cure. As a result, a waterproof card whose interior is filled with epoxy resin 34 is completed.
従来の製造方法においては外ケース６２と回路基板３゛
１を接合した後に、外ケース６２の側面の小穴６６から
樹脂を充てんするために、充てんスピードを速（するこ
とが困難である。さらに、充てんする樹脂量の管理にも
問題を生じ、カード製造の作業性が悪化し、コストアッ
プとなる。また、外ケース６２と、回路基板６１の接合
部分の不完全さから、その接合部分から湿気が浸入する
事があり、耐湿性等の信頼性の面にも問題を残している
。In the conventional manufacturing method, after the outer case 62 and the circuit board 3'1 are bonded, resin is filled through the small hole 66 on the side surface of the outer case 62, so it is difficult to increase the filling speed. This also causes problems in controlling the amount of resin to be filled, which worsens the workability of card manufacturing and increases costs.Moreover, due to the imperfection of the joint between the outer case 62 and the circuit board 61, moisture leaks from the joint. may seep in, leaving problems with reliability such as moisture resistance.
本発明は上記の問題点を解決し、ＩＣカードを構成する
回路基板を容易に樹脂封止できるＩＣカードの製造方法
を提供することを目的としている。SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and to provide a method for manufacturing an IC card in which a circuit board constituting the IC card can be easily sealed with resin.
この目的を達成するため本発明は、電子部品を搭載した
回路基板にプラスチック枠を組込み、外部をプラスチッ
クで一体成形した事を特徴とする。In order to achieve this object, the present invention is characterized in that a plastic frame is incorporated into a circuit board on which electronic components are mounted, and the outside is integrally molded with plastic.
本発明によれば、電子部品に成形時の熱の影響をあまり
伝えることな（回路基板とともに外部から成形樹脂によ
って密封する事ができる。また、プラスチック枠は、一
体成形時の熱から電池を保護し、形状的には、電子部品
の高さ、大きさの不揃いから生ずる一体成形時のヒケ等
の成形不良を軽減する作用を有する。According to the present invention, the influence of heat during molding is not transmitted to the electronic components (it can be sealed from the outside with molding resin along with the circuit board. Also, the plastic frame protects the battery from the heat during integral molding). However, in terms of shape, it has the effect of reducing molding defects such as sink marks during integral molding caused by uneven heights and sizes of electronic components.
以下図面に基づいて本発明の詳細な説明する。 The present invention will be described in detail below based on the drawings.
第１図は本発明実施例のプラスチック枠と回路基板の斜
視図。第２図はプラスチック枠を回路基板に組込んだ状
態の断面図。第３図はプラスチック枠と回路基板の外部
をプラスチックで一体成形した本発明実施例のＩＣカー
ドの断面図である。FIG. 1 is a perspective view of a plastic frame and a circuit board according to an embodiment of the present invention. FIG. 2 is a sectional view of the plastic frame assembled into the circuit board. FIG. 3 is a sectional view of an IC card according to an embodiment of the present invention in which the plastic frame and the outside of the circuit board are integrally molded from plastic.
回路基板１は耐熱性のガラスエポキシ基板である。メモ
リーＩＣ等の電子部品２やリチウム電池６はあらかじめ
回路基板１にハング実装する。プラスチック枠４はＡＢ
Ｓｔ！を詣で射出成形で製作する。The circuit board 1 is a heat-resistant glass epoxy board. Electronic components 2 such as a memory IC and a lithium battery 6 are mounted on the circuit board 1 by hanging in advance. Plastic frame 4 is AB
St! Manufactured using injection molding.
はじめにプラスチック枠４を回路基板１に設けた複数個
の位置決め穴５にビン６を嵌合して組立てる。第２図に
示すように、プラスチック枠４は回路基板上の電子部品
２を逃げて内側に多数の凹部７や穴８を設けである。こ
の凹部７や穴８は、内包する空気を極力少（するために
、電子部品に密接して設けである。また、プラスチック
枠４は、外部を一体成形する際に生ずる成形時の熱の影
響を遮断する効果を有する。特に内包するリチウム電池
３は耐熱度は８０’Ｃ程度であり、通常射出成形時の温
度には耐えられない。しかしリチウム電池６をプラスチ
ック枠４の凹部９に格納する事により一体成形時の熱か
ら保護する事が出来る。First, the plastic frame 4 is assembled by fitting the bins 6 into a plurality of positioning holes 5 provided in the circuit board 1. As shown in FIG. 2, the plastic frame 4 is provided with a large number of recesses 7 and holes 8 inside thereof, so as to escape the electronic components 2 on the circuit board. These recesses 7 and holes 8 are provided in close contact with the electronic components in order to minimize the amount of air they enclose.In addition, the plastic frame 4 is not affected by the heat generated during molding when the outside is integrally molded. In particular, the heat resistance of the lithium battery 3 contained therein is about 80'C, and cannot withstand the temperature normally used during injection molding.However, the lithium battery 6 is stored in the recess 9 of the plastic frame 4. This allows protection from the heat during integral molding.
次に、プラスチック枠４を回路基板１に組込んだ第２図
の状態の外部をＡＢＳのような熱可塑性の樹脂で一体成
形する。この射出成形により第３図に示すごとく外ケー
ス１０が形成されｉｃカードとして所定の寸法、外形、
外観が得られる。必要に応じてこの外ケース１０に化粧
シール（図示せず）を貼って完成とする。この時プラス
チック枠４のビン６は回路基板１との位置合せと同時に
射出成形の型の中で成形型と回路基板との間に一定の空
間を確保し、プラスチック枠４と回路基板１の外部を全
体的にプラスチックで覆う事を可能トシテイる。また、
プラスチック枠４は電子部品の高さの不揃いを軽減し、
成形時に凸凹の少〜・表面を提供している。このためＩ
Ｃカードの表面のヒケ等の外観形状も良好な物が得られ
る。Next, the outside of the state shown in FIG. 2 in which the plastic frame 4 is assembled into the circuit board 1 is integrally molded with a thermoplastic resin such as ABS. By this injection molding, the outer case 10 is formed as shown in FIG.
Appearance is obtained. If necessary, a decorative sticker (not shown) is pasted on the outer case 10 to complete the process. At this time, the bin 6 of the plastic frame 4 is aligned with the circuit board 1, and at the same time, a certain space is secured between the mold and the circuit board in the injection mold, and the outside of the plastic frame 4 and the circuit board 1 are secured. It is possible to cover the entire area with plastic. Also,
The plastic frame 4 reduces irregularities in the height of electronic components,
Provides a surface with minimal unevenness during molding. For this reason I
It is possible to obtain a C card with a good appearance including sink marks on the surface thereof.
以上の説明で明らかな様に、本発明によれば、樹脂光て
んを廃止し、作業性を向上させ、高価なエポキシ樹脂を
廃止するコスト面の改善も達成する事が出来る。また、
電子部品全体をプラスチックで完全に覆う事が出来るた
め、耐湿性等の信頼性の向上も計れ、防水性カードの製
造に多大な効果を発揮する事が出来る。As is clear from the above description, according to the present invention, it is possible to eliminate the use of resin glazing, improve workability, and achieve cost improvements by eliminating the use of expensive epoxy resin. Also,
Since the entire electronic component can be completely covered with plastic, reliability such as moisture resistance can be improved, and it can be highly effective in manufacturing waterproof cards.
第１図は本発明実施例のプラスチック枠と回路基板の斜
視図、第２図はプラスチック枠を回路基板に組込んだ状
態の断面図、第３図は本発明実施例の非接触式ＩＣカー
ドの断面図、第４図は従来の非接触式ＩＣカードの断面
図である。
１．６１・・・・・・回路基板、
４・・・・・・プラスチック枠、
１０．３２・・・・・・外ケース、
６・・・・・・リチウム電池。
第
図
第
は１
凶
第
図Fig. 1 is a perspective view of a plastic frame and circuit board according to an embodiment of the present invention, Fig. 2 is a sectional view of the plastic frame assembled into a circuit board, and Fig. 3 is a non-contact type IC card according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of a conventional non-contact type IC card. 1.61...Circuit board, 4...Plastic frame, 10.32...Outer case, 6...Lithium battery. Diagram number 1
Claims (1)
み、外部をプラスチックで一体成形した事を特徴とする
ＩＣカードの製造方法。A method for manufacturing an IC card, characterized in that a plastic frame is assembled into a circuit board on which electronic components are mounted, and the outside is integrally molded with plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1010728A JPH02190398A (en) | 1989-01-19 | 1989-01-19 | Production of ic card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1010728A JPH02190398A (en) | 1989-01-19 | 1989-01-19 | Production of ic card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02190398A true JPH02190398A (en) | 1990-07-26 |
Family
ID=11758354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1010728A Pending JPH02190398A (en) | 1989-01-19 | 1989-01-19 | Production of ic card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02190398A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04161393A (en) * | 1990-10-25 | 1992-06-04 | Ryoden Kasei Co Ltd | Ic card |
| JP2008015624A (en) * | 2006-07-03 | 2008-01-24 | Dainippon Printing Co Ltd | Method of producing card with built-in electronic component |
-
1989
- 1989-01-19 JP JP1010728A patent/JPH02190398A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04161393A (en) * | 1990-10-25 | 1992-06-04 | Ryoden Kasei Co Ltd | Ic card |
| JP2008015624A (en) * | 2006-07-03 | 2008-01-24 | Dainippon Printing Co Ltd | Method of producing card with built-in electronic component |
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