JP2002298103A - Contactless ic card and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low-cost IC card capable of corresponding with various modules and cards and a method for efficiently manufacturing the card thereof. SOLUTION: In this contactless IC card, an IC module 2, polyester hot-melt resin 6 and an over sheet 5 are sequentially loaded on at least a base material. The IC card is formed by laminating a multi-layer sheet previously laminating a polyester hot-melt resin layer with a melt viscosity of 50,000-150,000 CPS at 190 deg.C and a thickness of 10-150 μm and an over-sheet layer by a co-extrusion technique and the base material on which the IC module is mounted. In manufacturing thereof, a surface of recording medium is smoothed by heat-pressing after laying the IC module and the co-extruded laminated sheet on the base material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact IC card and a method for manufacturing the same.

[0002]

2. Description of the Related Art In a credit card, a prepaid card, a cash card, and the like, an IC module is mounted as a card base material having a large information recording amount and an excellent anti-counterfeiting effect as an alternative to a conventional magnetic card. IC cards have been developed.

[0003] IC cards are classified into two types, a contact type and a non-contact type, according to a method of reading a recording medium. In the contact type, a card and a reader come into contact when communicating with a terminal. However, there is a disadvantage that the contact is easily dirty or broken. Also, the maintenance of the leader requires man-hours. On the other hand, in the non-contact type system, since the recording medium and the reader do not have a contact point, these disadvantages including the maintenance work of the reader are improved. However, the systematization of security is not perfect, and it has not yet been widely deployed. However, an IC card using both an IC module and a magnetic stripe has begun to be put into practical use as a commuter pass or a prepaid card.

[0004] As a method of manufacturing this kind of IC card, a burying space is secured by embedding a hole in an IC module or a spacer is interposed therebetween, and an oversheet is laminated / hot-pressed on this space. Buried methods have been taken. However, the counterbore processing on the base sheet has a problem that the number of manufacturing steps and the cost are increased. In addition, there is a disadvantage that it is extremely troublesome to cope with IC modules having different shapes, since it is necessary to cut each shape. Even in the method of providing the buried space by the spacer, the positioning of the spacer and the processing of its shape are complicated, and similarly, it is extremely troublesome.

In a so-called resin filling method in which an IC chip is buried in a burial hole and a resin is sealed thereon, a thermosetting resin is usually used, but the time required for curing and the number of working steps are complicated. However, the cost of the product has been increased.

[0006] Japanese Patent Application Laid-Open No. Hei 3-24000 proposes to make a card using an injection molding machine. In this case, a base for fixing an IC module is molded by an injection molding method, and the IC module is mounted and fixed on the base. After that, injection molding is performed again to make a card.
This is not preferable in terms of production efficiency because it requires two injection molding steps. Further, since the module may be broken or the completed card may be warped due to heat or pressure at the time of injection molding, it cannot be said that it is an appropriate method for manufacturing a non-contact IC card.

In Japanese Patent Application Laid-Open No. Hei 10-147087, I
There is a disclosure of an IC card in which a base layer on which a C module is mounted, a hot melt resin, and an oversheet are sequentially laminated. However, the viscosity of the hot melt resin is specified, the coating is performed, the oversheet is laminated, and hot pressing is performed. In IC
The method of embedding a module is a method for embedding an IC module. Generally, the card surface is not flat unless it is formed thicker than the thickness of an IC chip. In general, the thickness is required to be tens to several hundreds of microns, so that the coating method requires repetitive processing, which is not a simple method as described in the specification.

[0008] JP-A-11-338990 discloses that
There is disclosed a method for embedding an IC module by providing a polymer layer having a softening point lower than these softening points between two plastic sheets. In the description of the invention,
There is a detailed description of the softening point of the polymer used for embedding the module. For example, if a hot-melt resin with a low melting point but a high viscosity is used, IC
If the module becomes thicker, the amount of hot-melt resin for embedding the module must be increased so that the resin does not spread well.
C module may not be fully embedded,
There is a drawback that sufficient efficiency cannot be obtained.

Further, in the patent specification filed earlier,
Although there is a disclosure of a method of manufacturing a non-contact IC card using a moisture-curable polyurethane resin, when a moisture-curable polyurethane reactive hot melt resin is used, a reactive gas is generated as the curing reaction of the resin proceeds after the card is processed. However, there is a problem that the flatness of the card surface is adversely affected, and in some cases, the card surface may be significantly uneven.

As a method for solving this problem, Japanese Unexamined Patent Application Publication No. 11-34548 discloses a method in which a gas adsorbent is added to a moisture-reactive polyurethane resin. However, under the current situation where adoption is progressing from the viewpoint of practicality, the gas adsorbent may be expensive, so that there is no advantage in cost.

[0011]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and is applicable to various modules and cards, has high production efficiency, is inexpensive and has high quality. An object of the present invention is to provide a contact IC card and a method for manufacturing the same.

[0012]

According to the present invention, there is provided, as a first invention, a multilayer in which a base material on which an IC module is mounted, a polyester hot melt resin layer and an oversheet layer are previously laminated by a coextrusion method. The present invention relates to a non-contact IC card comprising a sheet.

[0013] In a second aspect of the present invention, in the sheet according to the first aspect, the polyester hot melt resin layer and the oversheet layer are laminated in advance by a co-extrusion method. The present invention relates to a non-contact IC card obtained by having a melt viscosity at 190 ° C. of 50,000 to 150,000 CPS and a thickness in a range of 10 to 150 μm.

As described above, according to the present invention, the melt viscosity of the polyester hot melt resin at a specific temperature and
By defining the thickness of this layer, the IC module can be buried smoothly. By limiting the melt viscosity and the thickness, it is possible to reduce the leaching of the hot melt adhesive at the time of hot pressing during card production, and it is possible to prevent a decrease in work efficiency such that the adhesive adheres to the press board. For example, the thickness of the polyester hot melt resin layer is 10 μm.
If the thickness is smaller than m, there is a risk of peeling without obtaining sufficient adhesive strength with the base material. Conversely, if the thickness is larger than 150 μm, the flow of the polyester-based adhesive resin layer becomes large when pressed with a hot plate. In addition, seepage from the edge of the card base sheet causes stains on the hot platen and the like, and the workability is remarkably deteriorated.

[0015] The resin used for the oversheet layer used in the present invention may be the same material as the base material,
Different materials may be used. For example, strong paper or synthetic paper, PET (polyethylene terephthalate), PBT
(Polybutylene terephthalate), polyvinyl chloride, polyester, polycarbonate, polymethyl methacrylate, polystyrene, polylactic acid, polycaprolactone, poly (3-hydroxybutylate-3 hydroxyvalerate), polyvinyl alcohol, 4-methylpentene 1 resin, Synthetic resins such as cyclic polyolefins, natural resins,
Metals, ceramics, and the like can be used alone or in combination as a composite.

In order to improve the adhesiveness to the hot melt resin, the surface of the oversheet is preferably subjected to an easy adhesion treatment on the surface to be bonded to the resin. Furthermore,
An ordinary functional layer may be provided on the entire surface or a part of the surface of the base material on the surface opposite to the base material side in accordance with required characteristics. For example, a printed layer or a protective layer that has been printed in advance, a magnetic recording layer,
A visible recording layer, a picture layer and the like may be provided. For the protective layer, for example, a pigment such as titanium oxide may be formulated in order to enhance the concealment of the IC module or the circuit inside the card. In addition, the material of the functional layer mentioned here is not particularly limited and can be installed according to the purpose, but in order to improve the adhesiveness with the oversheet layer, a known adhesive or the like is used as appropriate. No problem.

The substrate sheet used in the present invention is not particularly limited, but those made of biaxially stretched polyester or polyimide can be suitably used.

[0018]

EXAMPLES Hereinafter, the present invention will be described with reference to specific examples. (Embodiment 1) FIG. 1 is a sectional configuration view of a non-contact IC card according to a first embodiment of the present invention. The base material is 15 × 15c
A biaxially stretched polyester sheet having a thickness of 120 μm and a thickness of 120 μm is used as a base material. One surface of the biaxially stretched polyester sheet is subjected to a plasma bonding treatment in advance, and an IC module having a thickness of 30 μm and including a transmission / reception coil and a data storage memory is arranged. From a hot-melt resin having a thickness of 30 μm, a melt viscosity at 190 ° C. of 70,000 CPS, and a 330 μm-thick laminated sheet made of a polyester resin having a layer thickness of 300 μm. Pressing and laminating with a board.

By the above operation, the I-thickness of 450 μm
A sheet in which the C module was embedded was obtained, and the sheet was cut into a card size to obtain a non-contact IC card sample of Example 1. The card sample thus obtained has good surface properties and good appearance. In addition, when we tested the reading with a dedicated card reader, we could use it without any problems.

(Embodiment 2) A non-contact IC card according to a second embodiment of the present invention has a cross-sectional structure similar to that of FIG. The substrate is 15 × 15cm in size and 100μm in thickness
Was used as a base material, and one surface thereof was subjected to an easy adhesion treatment by corona discharge to obtain a sample base material. Next, an IC module having a maximum thickness of 130 μm, a transmission / reception coil, a data storage memory, and a CPU is arranged on the above-described base material. Is 100,000
Thickness 30 made of polyester hot melt resin which is CPS and polyester resin whose layer thickness is 150 μm
190 ° C / 50kg /
Lamination was performed by pressing at a pressure of 30 seconds.

By the above operation, the thickness of 400 μm I
A sheet in which the C module was embedded was obtained, and the sheet was cut into a card size to obtain a non-contact IC card sample of Example 2. The card sample thus obtained has good surface properties and good appearance. In addition, when we tested the reading with a dedicated card reader, we could use it without any problems.

[0022]

As described above, according to the present invention, an IC module disposed on a substrate is embedded using a multilayer sheet having a polyester-based hot-melt resin layer and an oversheet layer which are laminated in advance. As a result, a non-contact card can be easily and efficiently manufactured at low cost. Further, by defining the melt viscosity and the layer thickness of the polyester-based hot melt resin, it is possible to obtain a non-contact IC card with good burying property of the resin that can be easily embedded in the IC module.

[Brief description of the drawings]

FIG. 1 is a configuration sectional view of a non-contact IC card showing a first embodiment according to the present invention.

FIG. 2 is a configuration sectional view of a non-contact IC card showing a second embodiment according to the present invention.

FIG. 3 is a cross-sectional view of a non-contact IC card manufactured by a conventional configuration and subjected to counterboring.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Transmission coil 2 ... IC module 3 ... Substrate 4 ... Coating adhesive 5 ... Oversheet 6 ... Polyester hot melt resin 7 ... Functional layer

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Claims (3)

[Claims] A substrate on which various IC modules are mounted;
A non-contact IC card comprising a multilayer sheet having a polyester-based hot-melt resin layer and an over-sheet layer previously laminated by a co-extrusion method. 2. Polyester hot melt resin 19
Melt viscosity at 0 ° C is 50,000 to 150,000C
2. The non-contact IC card according to claim 1, wherein the non-contact IC card is a PS having a thickness in a range of 10 to 150 [mu] m. 3. A method for manufacturing a non-contact IC card, comprising the steps of:
A method for producing a non-contact IC card, wherein the surface of the non-contact IC card is smoothed by stacking a base material on which the module is mounted and a co-extruded laminated sheet and then hot pressing.