JPH11338990A - Non-contact ic card, its production, and laminated sheet for non-contact ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a sink from being generated to obtain an excellent surface smoothness and productivity by burying a loop coil for antenna and an IC chip in a polymer which has a softening point lower than that of a plastic sheet. SOLUTION: A plastic film 5 where IC chips 3 and loop coils 4 for antenna are arranged is interposed between plastic sheets 2 provided with polymer layers 1, and they are stuck to each other by thermal welding. The polymer, where the IC chip 3, the loop coil 4 for antenna, etc., are buried, is not especially limited if it has a softening point lower than that of the plastic sheets 2 and is superior in adhesion strength to an adhesion object due to thermal fusion. The polymer is interposed between two plastic sheets 2 and is heated from outside and then is fused and made fluid to bury the IC chip 3, etc., and therefore, it is necessary that the softening point of the polymer is lower than that of the plastic sheets 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact type IC card, a method for manufacturing the same, and a laminated sheet for the non-contact type IC card.

[0002]

2. Description of the Related Art Recently, an IC card incorporating an IC chip has appeared in place of a conventional magnetic stripe type card.
Commercialization has begun as a gasoline payment card, telephone card, and the like. An IC card with a built-in IC chip has a larger amount of information than a conventional magnetic stripe card.
The processing speed and the reliability in terms of security are remarkably excellent, and it is expected that the card will become the mainstream in the future.

[0003] IC cards are broadly classified into a "contact type IC card" in which a contact with a reader / writer for reading and writing information of the IC chip is exposed on the card surface, and an antenna coil and an IC chip are built in the card. Have been
There are two types of "contactless IC cards" that can read information on an IC chip with an induced current generated in a coil when the card passes through a magnetic field and can further rewrite the information.

[0004] A contact IC card can use a high-performance IC chip, but it has to be inserted into a reader / writer, which is troublesome, and the contact between the reader / writer and the card physically causes friction. The durability of the card due to wear and the maintenance of the reader / writer become problems.

On the other hand, since a non-contact type IC card does not need to be inserted into a reader / writer, there is no physical contact with the reader / writer. For example, when a non-contact type IC card is used as a telephone card, the card is not connected to the card. There is an advantage that telephone maintenance can be facilitated because the telephone can be prevented from being stained due to contact with the telephone. Also, since there is no need to insert the card into the reader / writer, information can be exchanged non-stop when passing through automatic ticket gates or tollgates on expressways, for example, which is effective in eliminating commuting rushes and traffic congestion. There is. Therefore, the non-contact type IC card is expected to have a large market as a prepaid card such as a regular period of a public institution or a telephone card.

In a non-contact type IC card, an IC chip and an antenna loop coil are fixed in a card-shaped mold,
Thereafter, it was mainly manufactured by an injection molding method in which a resin was injected and integrated. However, in this way IC
When a card is manufactured, the IC chip is damaged by the pressure or temperature at the time of resin injection, or the cost increases due to the necessity of printing each IC card after molding. In order to solve this problem, IC chips and the like (CO
A method of cutting out a large number of cards from this large-size sheet by embedding B) has been adopted. A hard PVC sheet is usually used for the large-sized sheet from the viewpoint of physical properties such as mechanical properties and workability, and from the viewpoint of cost and the like. The manufacturing method will be specifically described. First, a concave portion for mounting an IC chip on a central sheet (hereinafter, referred to as a “core sheet”) of a card is cut (hereinafter, referred to as “counterboring”), and then the IC chip is loaded into the concave portion, or After punching out a window having a size, an IC chip is loaded into the punching window, and a sheet for hiding the IC chip (hereinafter referred to as “over sheet”) is placed on one or both sides of the core sheet, and hot pressing is performed. To form a large-size sheet in which IC chips or the like (COB) are embedded. After that, it is punched and finished into a card shape. In this case, the oversheet may be printed in advance, or may be printed on the oversheet after hot pressing and before punching.

[0007]

However, in this method, I
It takes time and effort to produce a C card, and it is necessary to form a recess slightly larger than the size of the IC chip in the core sheet or to punch out a window in order to load the IC chip. Sinking occurs and the smoothness of the card deteriorates. For this reason, when printing on the over layer after pressing, the printability deteriorates. Recently developed multi-function cards not only have a non-contact type IC chip built-in, but also have a contact type IC chip and magnetic stripe on one card, and may be inserted into a contact type reader / writer. is there. Further, there is a case where a heat-sensitive rewritable recording medium capable of repeating printing or erasing by heat is coated on the card surface, and therefore, the surface smoothness is particularly required. Thus, the smoothness of the card surface is expected to become an increasingly important problem in the future.

Further, as a method of manufacturing a non-contact type IC card, there is also known a method of arranging a loop coil for an antenna or the like between two foamed plastic films, heating and pressing with a press, and embedding in a foamed plastic film. Have been. However, in this method, since the non-contact type IC card is individually pressed and manufactured, there is a problem that a long time is required for processing and productivity is deteriorated.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a non-contact type IC card which does not cause sink marks, has excellent surface smoothness and productivity, and a method of manufacturing the same. An object of the present invention is to provide a laminated sheet for a non-contact type IC card.

[0010]

The IC card according to the present invention comprises:
A non-contact type IC card in which an antenna loop coil and an IC chip are incorporated between two plastic sheets, wherein the antenna loop coil and the IC chip are embedded in a polymer having a softening point lower than the softening point of the plastic sheet. It is characterized by having.

Here, the polymer can be a polymer layer or a polymer sheet, and if it is a polymer layer, it may be provided on a plastic sheet.

Also, an antenna loop coil and an IC
The chip is disposed on a plastic film, which can be embedded in the polymer.

[0013] Here, an easy-adhesion coating agent may be applied to at least one surface of the plastic film.

Further, the plastic sheet may be coated with an easy-adhesion coating agent on the side in contact with the polymer sheet.

The method of manufacturing a non-contact type IC card according to the present invention is a method of manufacturing a non-contact type IC card in which an antenna loop coil and an IC chip are incorporated between two plastic sheets. Two polymer layers or polymer sheets having a softening point lower than the softening point of the plastic sheet are provided between the sheets, an antenna loop coil and an IC chip are arranged between the polymer layers or the polymer sheets, and then heated and pressed. The antenna coil coil and the IC chip are embedded.

A method of manufacturing an IC card according to another aspect of the present invention is a non-contact type IC in which an antenna loop coil and an IC chip are incorporated between two plastic sheets.
A method for manufacturing a card, wherein two plastic sheets are plastic sheets each having a polymer layer having a softening point lower than the softening point of the plastic sheet on one surface. A plastic film on which the coil and the IC chip are arranged is sandwiched, and the loop coil for the antenna and the IC chip are embedded by heating and pressing.

A method for manufacturing a non-contact type IC card according to still another aspect of the present invention is a method for manufacturing a non-contact type IC card in which an antenna loop coil and an IC chip are incorporated between two plastic sheets. Two polymer sheets having a softening point lower than the softening point of the plastic sheet are disposed between the two plastic sheets, and a plastic film having an antenna loop coil and an IC chip disposed between the polymer sheets is heated. And pressurizing to bury the antenna loop coil and the IC chip.

Here, the heating and pressurizing can be continuously performed by using two opposing rolls.

The laminated sheet for a non-contact type IC card of the present invention is a laminated sheet for a non-contact type IC card having a polymer layer on one surface of a stretched and oriented plastic sheet, wherein the polymer layer is A resin having an adhesive performance to an adherend by heat melting, and having a softening point lower than the softening point of the plastic sheet, wherein a dye or pigment is dispersed in at least one of the plastic sheet and the polymer layer. It is characterized by being.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION The non-contact type IC card of the present invention
A polymer having a softening point lower than the softening point of a plastic sheet in which a loop coil for an antenna and an IC chip (COB) are embedded is incorporated between two plastic sheets.

Here, the polymer may be provided on a plastic sheet as a polymer layer, or may be a single sheet-shaped polymer sheet. In the present invention, an IC chip or the like is sandwiched between two polymer layers or polymer sheets, and the polymer is fluidized and heat-fused to form an IC.
Buried chips etc. However, in the case of a polymer sheet, a plastic sheet is superposed on the outside of two polymer sheets, and then the polymer is fluidized to perform heat fusion.

The IC chip or the like may be directly arranged on the polymer, or may be arranged on a plastic film in advance and sandwiched between the polymers. FIGS. 1 and 2 show a specific configuration at the time of bonding when an IC chip or the like is arranged on a plastic film in advance.

FIGS. 1A to 1C show an example in which a plastic sheet having a polymer layer, that is, a laminated sheet for a non-contact type IC card is used.
(C) shows an example in which a polymer sheet is used. As shown in FIGS. 1A to 1C, a plastic film 5 on which an IC chip 3 and an antenna loop coil 4 are arranged is sandwiched between plastic sheets 2 provided with a polymer layer 1 and heat-sealed. And stick them together.

As shown in FIGS. 2A to 2C, a polymer sheet 10 is disposed between the plastic sheets 2, and an IC chip 3 and an antenna loop coil 4 are disposed between the polymer sheets 10. The plastic film 5 is sandwiched, bonded by heat fusion.

In the present invention, since the polymer is fluidized, the polymer flows around the IC chip or the like and fills the irregularities, so that a flat card can be manufactured.

The plastic sheet used in the present invention is not particularly limited as long as it has sufficient mechanical properties and workability when actually used as an IC card. For example, polyester-based sheets such as polyethylene terephthalate and polyethylene naphthalate; polyamide-based sheets such as nylon 6 and nylon 6, 6; polycarbonate sheets; polystyrene sheets; and cellulose derivative sheets such as triacetyl cellulose. Sheets made of vinyl resin, ABS resin, acrylic resin, etc., and sheets made of polyetherimide (PEI), polyethersulfone (PES), polyphenylene sulfide (PPS), polyetheretherketone (PEEK), etc. Sheet. Further, these sheets may be appropriately stretched, heat-treated or the like in order to improve mechanical strength and heat resistance. The use of engineering plastic improves the heat resistance of the non-contact IC card.

In the present invention, the thickness of the plastic film is not particularly limited.
It is preferably 0 μm.

The polymer in which the IC chip, the antenna loop coil, etc. are embedded has a softening point lower than the softening point of the plastic sheet, and is adhered to the adherend (plastic sheet, plastic film, etc.) by heat melting. There is no particular limitation as long as it has excellent properties. In the present invention, the polymer is melted and fluidized by embedding an IC chip or the like by sandwiching the polymer between two plastic sheets and heating from the outside, so that the softening point of the polymer is lower than the softening point of the plastic sheet. is necessary. If the softening point of the polymer is higher than the softening point of the plastic sheet, the plastic sheet is deformed when heated from outside the plastic sheet, and the smoothness of the card is impaired. In particular, when the plastic sheet is a stretched and oriented plastic sheet, the orientation is released and the plastic sheet expands and contracts, and the card is deformed such as curl. Considering the thermal deformation of the stretched and oriented plastic film, the heating temperature for melting the adhesive layer should not be too high. If the softening point (or melting temperature) of the polymer layer is low, it is not necessary to increase the heating temperature, so that the softening point (or melting temperature) of the polymer layer is 1
The temperature is preferably at most 00 ° C, more preferably at most 80 ° C. When the plastic film is a biaxially stretched PET or PEN film, the polymer layer is preferably a polyolefin resin or a polyester resin having a softening point of 100 ° C. or less, particularly preferably 80% or less.
It is preferred that the resin has a softening point of not higher than ℃. here,
The softening point is a value measured according to JIS K-7206.

Further, the polymer needs to have an appropriate fluidity at the bonding temperature so that the polymer can be fluidized and flow around the IC chip or the like. Therefore, it is preferable to select from hot melt adhesives. For example, polyethylene (PE), ethylene-vinyl acetate copolymer (EV
A), ethylene-ethyl acrylate copolymer (EE
A), a polyolefin resin or a polyester resin such as an acrylic acid copolymer resin (EAA) or an ethylene-methacrylic acid copolymer resin (EMAA), and a crystalline polyolefin resin or polyester resin is particularly preferable. However, when the plastic sheet is a polyester sheet, for example, a copolymerized polyester resin, a polyurethane resin, a modified polyethylene resin, or the like is preferable, and the plastic sheet is made of P, such as PVC or chlorinated PVC.
In the case of a VC sheet, it is preferable to use a vinyl acetate resin or the like.

In the present invention, a laminated sheet in which a polymer layer is previously laminated on a plastic sheet can be used. Such a laminated sheet may be manufactured by appropriately selecting from known manufacturing methods according to the characteristics of the material used. For example, if the polymer can be diluted with a solvent, the polymer layer can be formed by solution coating on a plastic sheet.If the polymer cannot be diluted with a solvent, the polymer is hot-melted and extruded onto a plastic sheet. A laminated sheet can be obtained by forming a polymer layer or by coextrusion. Alternatively, the polymer layer and the plastic sheet may be separately formed into a sheet, and then heat-melted and bonded to form a polymer sheet. In the present invention, in order to improve the adhesion between the plastic sheet and the polymer layer,
The plastic sheet may be subjected to a treatment such as corona treatment or anchor application.

In the present invention, the thickness of the polymer may be such that the IC chip or the like is sufficiently buried by thermal fusion and has no irregularities on the surface. That is, the total thickness of two polymer layers in an IC card composed of two composite films, and the thickness of one polymer layer in an IC card composed of one polymer sheet is at least IC
It must be 1.1 times the thickness of the chip or the like. If the amount is less than this, the flow of the polymer is not sufficient and the
It is not preferable because voids are formed around the chip or the like or the surface smoothness is impaired. However, when an IC chip or the like to be described later is disposed on a plastic film, the portion protruding from the plastic film may be embedded, so the thickness of the polymer is greater than the thickness when the IC chip or the like is directly disposed. It may be thin.

In the present invention, in order to prevent tampering of the non-contact type IC card and to conceal the embedded antenna loop coil and IC chip, the plastic film and the adhesive layer serving as the base material are dyed. it can. Dyeing may be performed on only one of the plastic film and the adhesive layer, but it is preferable that both are dyed in order to ensure concealment. For such dyeing, a dye or a pigment can be formed by dispersing a dye or a pigment in a plastic film or a resin constituting the adhesive layer, and processing the dye or pigment.

The dyes used in the present invention include azo dyes, anthraquinone dyes, xanthene dyes and triphenylmethane dyes, and pigments include titanium oxide, zinc oxide and magnesium sulfate.

In the present invention, a loop coil for an antenna, an IC chip and the like may be previously arranged on a plastic film. Examples of the material of the plastic film include the same materials as those of the plastic sheet described above.

In the present invention, a plastic film may be coated with an easily adhesive coating agent. In such a case, when applied to both surfaces of the plastic film, the adhesiveness is further improved. Examples of the easy-adhesion coating agent preferably used in the present invention include acrylic resins and urethane resins. However, the present invention is not limited to these, and the type of the easily adhesive coating agent can be selected according to the material of the adherend (plastic sheet, plastic film, etc.).

In the present invention, a plastic film may be coated with an easy-adhesion coating agent. As such an easy-adhesion coating agent, the same as the easy-adhesion coating agent applied to the plastic film can be used.

In the non-contact type IC card of the various aspects of the present invention, even when the heating and pressurizing operation is a batch-type pressurizing method such as a hot press, the non-contact type IC card is passed between two opposed heated press rolls. Can be manufactured by a method of continuously heating and pressurizing, but from the viewpoint of mass productivity and manufacturing cost, it is preferable to manufacture by a method of passing between two pressure rolls. The pressure roll is preferably made of a material having high hardness in terms of the surface smoothness of the IC card after bonding, and examples thereof include a metal roll and a high hardness rubber roll having a Shore D70 or more.

According to the present invention, since two non-contact type IC card substrates can be bonded by pressing at a temperature lower than the glass transition temperature of the substrate, curling of the card does not occur. A flat IC card can be manufactured. Further, since the resin of the adhesive layer is melted and fluidized to fill the periphery of the IC chip or the like and fill the unevenness, a flat card can be manufactured. Even when the base material is a stretched and oriented polyethylene terephthalate or a polyethylene naphthalate, a card having a smooth surface can be produced without deformation such as curling due to heat.

[0039]

EXAMPLES Example 1 Laminated sheets 1 to 4 were produced by the following procedure.

A polymer layer in which an IC chip or the like is embedded was prepared by a usual extrusion method using the materials shown in Table 1 and Aronmelt PES-111EE (manufactured by Toagosei Co., Ltd.).
However, the polymer layer was formed into a sheet having a thickness of 300 μm by an extruder. Then, the polymer layer and a 100 μm-thick corona-treated biaxially stretched polyester film, trade name “Diafoil W400” (manufactured by Diafoil Hoechst) are thermocompression bonded to form a laminated sheet 1 for bonding. Produced. Next, laminated sheets 2 to 4 were produced in the same manner as the production of laminated sheet 1 except that the material of the polymer layer was changed as shown in Table 1.

[0041]

[Table 1]

Each of the obtained laminated sheets 1 to 4 has a width of 3
A loop coil for a four-turn antenna in which a copper wire with a wire diameter of 0.15 mm is slit four times, and a 5 mm × 5
An IC chip having a size of mm and a thickness of 0.35 mm was disposed on the polymer layer and temporarily fixed with a cyanoacrylate-based instant adhesive. However, loop coil for antenna, I
C chips and the like were made into one set, and a large number of IC chips and the like were arranged on the polymer layer at equal intervals in consideration of a desired card size and the like, and temporarily fixed with an adhesive. Another laminated sheet was placed on an IC chip or the like so that the polymer layer was on the inside, and the two laminated sheets were laminated under the following laminating conditions. Here, the other laminated sheet is wound on a roll, and may be unwound from the roll. The total thickness of the obtained laminated sheet was 800 μm.
This sheet was punched out for each set of IC chips and the like, and finished in a card shape to produce a non-contact type IC card. In order to obtain a desired resistance value, a loop coil made of a copper wire having an appropriate length such as 200 turns may be used in place of the 4-turn loop coil to obtain a desired resistance value.

For the obtained non-contact type IC card, I
The surface smoothness of the embedded portion of the C chip was visually determined by observing the surface of the IC card with the naked eye. As a result, it was found that each of the non-contact IC cards of the present invention exhibited good smoothness. The plastic sheet may be printed in advance.

Lamination conditions: Roll material: Metal roll or rubber roll (hardness of rubber roll, Shore D75) Roll diameter: Diameter 100 mm Setting temperature: Laminated sheet 1, 2 140 ° C. Laminated sheet 3, 4 180 ° C. Laminating pressure: Gauge pressure 12 kg / cm Bonding speed: 0.5 m / min Example 2 The material of the polymer layer for embedding the IC chip was Soaprene DH (Nippon Gosei Co., Ltd., ethylene / VA copolymer, VA = 70 mol%). A composite film was obtained in the same manner as in Example 1, except that the material of the plastic sheet was changed to chlorinated PVC. Next, a non-contact IC card was produced in the same manner as in Example 1. Non-contact type I obtained
When the surface smoothness of the C card was evaluated in the same manner as in Example 1, good results were obtained. However, the lamination of the two laminated sheets was performed under the following conditions.

Bonding condition: Roll material: Metal roll or rubber roll (hardness of rubber roll, Shore D75) Roll diameter: diameter 100 mm Setting temperature: 120 ° C. Bonding pressure: gauge pressure 12 kg / cm Bonding speed: 0.5 m / min Example 3 In Example 1, the laminated sheet was replaced with a reactive ethylene copolymer as a polymer for embedding an IC chip, trade name "Bond First 2B" (manufactured by Sumitomo Chemical Co., Ltd.),
A polycarbonate sheet was used as a substrate and a plastic sheet, "NOVAREX 7020" (manufactured by Mitsubishi Engineering-Plastics Co., Ltd.), was produced by a co-extrusion method using two extruders instead of a normal extrusion method. A non-contact type IC card was produced in the same manner as in Example 1 except that the laminated sheet was used. However, the thickness of the polymer layer of the obtained laminated sheet was 300 μm, and the thickness of the substrate was 100 μm.

When the obtained non-contact type IC card was evaluated for surface smoothness in the same manner as in Example 1, good results were obtained. However, the bonding conditions of the two laminated sheets are the same as those of the laminated sheets 3 and 4 in Example 1.

Further, a laminated sheet was produced by using polyethylene terephthalate (PET) as the material of the base plastic sheet instead of polycarbonate, and a non-contact type IC card was produced using the laminated sheet in the same manner as described above. Good surface smoothness was obtained.

Example 4 100 μm of a crystalline olefin resin having a melting point of 70 ° C.
Two rolls were prepared by winding a 100-μm-thick PET film having a thick polymer layer on one side into a roll. Also,
A roll of a 100 μm-thick PET film in which a plurality of sets of antenna loop coils and IC chips were arranged was prepared. The space between the two bonding rolls was set so that two PET films having a polymer layer and a PET film on which an IC chip and the like were arranged passed. However, as shown in FIG. 3, two PET films 22 were set between two rolls 20 with the polymer layer facing inward so as to sandwich the PET film 21 on which an antenna loop coil and the like were installed. Where 21 'and 2
2 'means a roll in which the film is wound on a roll. Using the same roll as in Example 1, three sheets were bonded at a bonding roll temperature of 80 ° C., a pressure of 2 kg / cm, and a bonding speed of 1 m / min. Next, the bonded film was cut and punched to obtain a non-contact IC card in which an antenna loop coil and an IC chip were embedded.

In the same manner as in Example 1, the surface smoothness of the embedded portion of the IC chip was visually determined for the obtained IC card. As a result, it was found that all the non-contact type IC cards of the present invention exhibited good surface smoothness.

Example 5 100 μm of crystalline olefin resin having a melting point of 100 ° C.
100 μm-thick PET having m-thick polymer layer on one side
Two rolls of film were prepared. Further, a thickness 100 in which a plurality of sets of the antenna loop coil and the IC chip are arranged.
An acrylic resin was applied to both surfaces of a μm PET film as an easy-adhesion coating agent, dried, and a roll was prepared. A PET film having an antenna loop coil and the like disposed between two bonding rolls and two PET films were set in the same manner as in Example 4. Using the same roll as in Example 1, the temperature of the bonding roll 1
Three sheets were bonded together at 10 ° C., a pressure of 4 kg / cm, and a bonding speed of 1 m / min. Next, the bonded film was cut and punched to obtain a non-contact IC card in which an antenna loop coil and an IC chip were embedded.

In the same manner as in Example 1, the surface smoothness of the embedded portion of the IC chip was visually determined for the obtained IC card. As a result, it was found that all the non-contact type IC cards of the present invention exhibited good surface smoothness.

The non-contact type IC card was subjected to a sliding and bending test 10,000 times, and no peeling was observed. That is, it was found that by applying the easy-adhesion coating agent to the plastic film, the interlayer adhesion was extremely improved and the durability was also improved.

Example 6 Two rolls of a 100 μm-thick PET film were coated with an acrylic resin as an easy-adhesion coating agent on one side.
And 100 μm of olefin resin having a melting point of 70 ° C.
Two rolls of a m-thick polymer sheet were prepared. In addition, a roll was prepared by winding a 100-μm-thick PET film in which a plurality of sets of antenna loop coils and IC chips were arranged. Between the two bonding rolls, a PET film on which an antenna loop coil and the like were installed, two PET films, and two polymer sheets were set so as to pass therethrough. However, as shown in FIG. 4, a crystalline olefin resin film 32 as a polymer sheet is sandwiched by a PET film 31 on which an antenna loop coil and the like are arranged, and two such that an easy-adhesion coating agent is on the outside thereof. A PET film 33 was set. Here, 31 ', 32', and 33 'each mean a roll obtained by winding a film on a roll. Using the same roll as in Example 1, five sheets were bonded at a bonding roll temperature of 75 ° C., a pressure of 2 kg / cm, and a bonding speed of 1 m / min. Then, the laminated film was cut and punched, and the loop coil for the antenna and the I
A non-contact type IC card in which a C chip was embedded was obtained.

In the same manner as in Example 1, the surface smoothness of the embedded portion of the IC chip was visually determined for the obtained IC card. As a result, it was found that all the non-contact type IC cards of the present invention exhibited good surface smoothness.

Example 7 In Example 6, instead of a PET film having a thickness of 100 μm on which an antenna loop coil and the like are arranged, an antenna loop coil and the like having an acrylic resin applied as an easy-adhesion coating agent on both sides are arranged. A non-contact type IC card was produced in the same manner except that a roll of a PET film having a thickness of 100 μm was set. When the same evaluation was performed on the obtained non-contact type IC card, it showed good surface smoothness. Further, when the obtained contactless IC card was subjected to a sliding and bending test 10,000 times, no peeling was observed, extremely good interlayer adhesion was exhibited, and durability was improved.

Example 8 A 300 μm thick polyolefin resin having a melting temperature of 70 ° C. was laminated as an adhesive layer on one surface of a biaxially stretched polyethylene terephthalate film having a thickness of 100 μm to prepare a laminated sheet for IC card. .

However, the polyolefin resin was manufactured to have a thickness of 300 μm by an extrusion method.

The two laminated sheets for IC cards obtained were placed with the adhesive layer facing each other, and a wire diameter of between the two sheets was 0.1 mm.
A four-turn antenna loop coil made of four turns of a 15 mm copper wire or a plastic sheet on which an IC chip with a size of 5 mm × 5 mm and a thickness of 0.35 mm is wired, a press temperature of 80 ° C. and a press Pressure is 5kg / cm
^{2. Two} laminated sheets for IC cards were bonded together in a press time of 5 minutes. However, loop coil for antenna,
IC chips and the like are made into one set, and many sets of IC chips and the like are arranged on a plastic sheet at equal intervals in consideration of a desired card size and the like. Next, the bonded film was cut and punched to obtain a non-contact IC card in which an antenna loop coil and an IC chip were embedded.

In the same manner as in Example 1, the surface smoothness of the embedded portion of the IC chip was visually determined for the obtained IC card. As a result, it was found that none of the obtained non-contact type IC cards was curled and showed good surface smoothness.

Example 9 In Example 8, the biaxially stretched PET film colored with titanium oxide was used instead of the biaxially stretched PET film.
A film was used, and instead of the polyolefin resin, a polyolefin resin in which 5 parts by weight of titanium oxide was dispersed with respect to 100 parts by weight of the polyolefin resin was used. A laminated sheet for an IC card laminated with an olefin resin was obtained. About the obtained IC card, I
The surface smoothness of the embedded portion of the C chip was visually determined. As a result, it was found that none of the obtained non-contact type IC cards was curled and showed good surface smoothness.

Since the obtained non-contact type IC card conceals the loop coil for the antenna and the IC chip, it is possible to prevent the IC card from being tampered with.

Example 10 A non-contact IC card was produced in the same manner as in Example 9 except that the resin of the adhesive layer was changed from a polyolefin resin to a polyester resin. In the same manner as in Example 1, the surface smoothness of the embedded portion of the IC chip was visually determined for the obtained IC card. As a result, it was found that none of the obtained non-contact type IC cards was curled and showed good surface smoothness.

Since the obtained card conceals the loop coil for the antenna and the IC chip, it is possible to prevent tampering of the non-contact type IC card.

COMPARATIVE EXAMPLE 1 In Example 8, a polyolefin resin having a melting temperature (softening point) of 120 ° C. was used instead of a polyolefin resin having a melting temperature (softening point) of 70 ° C. instead of a polyolefin resin having a melting point of 70 ° C. A non-contact IC card was produced in the same manner as in Example 8, except that the temperature was changed from 80 ° C to 130 ° C. For the obtained IC card, the surface smoothness of the embedded portion of the IC chip was visually determined in the same manner as in Example 1. As a result, the long side curled 5 mm with respect to the plane, and a non-contact type IC card having a smooth surface could not be obtained.

[0065]

As described in detail above, when an IC card is manufactured using the laminated sheet for a non-contact type IC card of the present invention, a loop coil for an antenna and an IC chip are embedded, and a smooth and curl-free A contact type IC card was produced. In addition, a non-contact type IC is manufactured using the laminated sheet for an IC card of the present invention which is colored with a dye or a pigment.
When the card is manufactured, the loop coil for the antenna and the I
A non-contact type IC card in which the C-chip concealed card is difficult to falsify was obtained.

The non-contact IC card of the present invention does not require counterboring or drilling, so that no sink marks are generated.
Excellent surface smoothness. Further, according to the manufacturing method of the present invention, since the IC card can be continuously produced, the processing steps are shortened, the mass productivity is excellent, and the processing cost can be reduced.

[Brief description of the drawings]

1 (a) to 1 (c) are schematic diagrams showing a configuration at the time of bonding a non-contact type IC card of the present invention.

FIGS. 2A to 2C are schematic diagrams illustrating a configuration of a non-contact type IC card according to the present invention at the time of bonding.

FIG. 3 is a cross-sectional view of the present invention using a laminating roll.
It is the schematic which shows the state which manufactures a C card.

FIG. 4 is a cross-sectional view of an embodiment of the present invention using a bonding roll.
It is the schematic which shows the state which manufactures a C card.

[Explanation of symbols]

Reference Signs List 1 polymer layer 2 plastic sheet 3 IC chip 4 loop coil for antenna 5 plastic film 10 polymer sheet 20 bonding roll 21 PET film 21 on which loop coil for antenna and the like are arranged 21 'roll of PET film on which loop coil for antenna and the like are arranged 22 PET film having a polymer layer 22 'Roll of PET film having a polymer layer 30 Laminating roll 31 PET film on which a loop coil for antenna is arranged 31' Roll of PET film on which a loop coil for antenna is arranged 32 Polymer sheet 32 ' Roll of polymer sheet 33 PET film 33 'Roll of PET film

Continued on the front page (72) Inventor Kazuhiko Kitayama 5-8, Mitsuya-cho, Nagahama-shi, Shiga Mitsubishi Plastics Nagahama Plant

Claims (10)

[Claims] 1. A non-contact type IC card in which an antenna loop coil and an IC chip are incorporated between two plastic sheets, wherein the polymer has a softening point lower than the softening point of the plastic sheet. And a non-contact type IC card having an IC chip embedded therein. 2. A non-contact type IC card in which an antenna loop coil and an IC chip are incorporated between two plastic sheets, wherein a softening point lower than the softening point of the plastic sheet is provided inside the plastic sheet. A polymer layer having a softening point lower than the softening point of the plastic sheet, and a loop coil for an antenna and an IC chip are embedded in the polymer layer or the polymer sheet. Characteristic non-contact IC card. 3. An antenna loop coil and IC
3. The non-contact type IC card according to claim 1, wherein the chip is disposed on a plastic film, and the plastic film is embedded in the polymer. 4. The non-contact IC card according to claim 3, wherein an easy-adhesion coating agent is applied to at least one surface of the plastic film. 5. The non-contact type IC card according to claim 2, wherein an easy-adhesion coating agent is applied to a surface of the plastic sheet in contact with the polymer sheet. 6. A method of manufacturing a non-contact type IC card in which an antenna loop coil and an IC chip are incorporated between two plastic sheets, wherein the softening point of the plastic sheet is between the two plastic sheets. Adding a polymer layer or sheet having a lower softening point to 2
A non-contact type IC card, wherein the antenna loop coil and the IC chip are disposed between the polymer layers or the polymer sheets, and then the antenna loop coil and the IC chip are embedded by heating and pressing. Manufacturing method. 7. A method for manufacturing a non-contact type IC card in which an antenna loop coil and an IC chip are incorporated between two plastic sheets, wherein the two plastic sheets are provided on one surface of the plastic sheet. A plastic sheet including a polymer layer having a softening point lower than the softening point of the sheet, wherein a plastic film on which an antenna loop coil and an IC chip are arranged is sandwiched between the polymer layers of the plastic sheet, and heated and pressed to form an antenna loop. A method for manufacturing a non-contact type IC card, wherein a coil and an IC chip are embedded. 8. A method of manufacturing a non-contact type IC card in which an antenna loop coil and an IC chip are incorporated between two plastic sheets, wherein the plastic sheet is softened between the two plastic sheets. Two polymer sheets having a softening point lower than the point, and an antenna loop coil and I
A method for manufacturing a non-contact type IC card, comprising sandwiching a plastic film on which a C chip is arranged, heating and applying pressure to embed an antenna loop coil and an IC chip. 9. The non-contact apparatus according to claim 6, wherein the heating and the pressing are continuously performed by using two opposing rolls. Method for manufacturing a type IC card. 10. A non-contact type IC card laminated sheet having a polymer layer on one side of a stretched and oriented plastic sheet, wherein the polymer layer has an adhesive performance to an adherend by thermal melting. And a resin having a softening point lower than the softening point of the plastic sheet, wherein a dye or pigment is dispersed in at least one of the plastic sheet and the polymer layer. For laminated sheet.