JP2008012740A - Injection mold assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an injection mold assembly constituted so as to easily attach and detach a pressure sensor to efficiently perform these works. <P>SOLUTION: An inclined surface 31c is formed downward to the left-hand surface 31b of a contact part 31 and, when the pressure sensor 30 is inserted from the direction shown by an arrow A, the leading end part 30e of the pressure sensor 30 is brought into contact with the inclined surface 31c to be pressed thereto while the contact part 31 is retracted in the direction shown by an arrow B against the elastic force of an elastic member 33 and finally retracted (non-contact position) until the contact of the surface of the contact part 31 with the base 24c of an ejector pin 24 is released. As a result, the pressing force to the leading end part 24a of the ejector pin 24 due to resin pressure at the time of molding is properly detected by the contact of the base 24c of the ejector pin 24 with the detection part 30b of the pressure sensor 30. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an injection mold apparatus, and more particularly to an injection mold apparatus including a pressure sensor that detects a resin pressure in a mold.

Conventionally, in an injection mold apparatus, when setting molding conditions, the pressure of the resin supplied to the cavity is detected, and in order to detect this resin pressure, the resin is molded in the cavity. A pressure sensor provided opposite to the base end is brought into contact with the base end of the ejector pin for protruding the molded product, and the pressure of the resin supplied into the cavity causes the tip of the ejector pin to It has been practiced to detect the resin pressure during molding by detecting the acting downward force with a pressure sensor (see, for example, Patent Document 1).
Patent 3045078

However, in the one described in Patent Document 1, the structure for mounting the pressure sensor is complicated and the work is troublesome, and when it is not necessary to detect the resin pressure after setting the molding conditions, the pressure sensor is used. It was necessary to replace the ejector plate that had been removed, which required complicated work.
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an injection mold apparatus in which pressure sensors can be easily attached and detached, and the efficiency of these operations can be improved.

  In order to solve the above problems, the invention of claim 1 includes a fixed side mold and a movable side mold, and the movable side mold is provided with an ejector plate driven by an ejector rod when the mold is opened. Yes, with the movement of the ejector plate, the molded product formed in the cavity formed by the fixed-side mold and the movable-side mold through the movable-side mold when the mold is opened protrudes at the tip portion In an injection mold apparatus in which an ejector pin is disposed on the ejector plate, a contact portion that is movably disposed in the ejector plate and contacts a base end portion of the ejector pin, and a base of the ejector pin A pressure sensor for detecting the resin pressure in the cavity by contacting the end portion, and the contact portion is brought into contact with the proximal end portion of the ejector pin by inserting the pressure sensor; And a moving means for returning the non-contact position to the non-contact position by pulling out the ejector pin when the pressure sensor is inserted and positioned at a predetermined position. The base end part of this is in contact with a pressure sensor to detect the resin pressure.

According to a second aspect of the present invention, in the injection mold apparatus according to the first aspect, the moving means includes an elastic member that presses one end side of the abutting portion, and the pressure sensor is inserted. If not, the contact portion is biased to the contact position by the elastic member, and the contact portion is moved to the non-contact position against the elastic force of the elastic member by inserting the pressure sensor. It is characterized by being configured.
According to a third aspect of the present invention, in the injection mold apparatus according to the first or second aspect, the pressure sensor is housed and held in a holding member.
According to a fourth aspect of the present invention, in the injection mold apparatus according to the third aspect, the moving means is formed with an inclined surface at the tip of the holding member, and the inclined surface of the holding member of the contact portion. An inclined surface is formed on the surface that comes into contact with the contact member, and when the holding member is inserted, the inclined surface of the holding member and the inclined surface of the contact portion come into contact to move the contact portion to the non-contact position. It is configured as described above.

Further, the invention of claim 5 is the injection mold apparatus according to any one of claims 1 to 4, wherein the abutting portion and the moving means are separate units from the ejector plate, It is characterized by being detachably mounted in the ejector plate.
Injection mold equipment.
According to a sixth aspect of the present invention, in the injection mold apparatus according to the fifth aspect, the side surface of the unit protrudes from the side surface of the ejector plate.

  According to the present invention, it is possible to provide an injection mold apparatus that can easily attach and remove the pressure sensor and can improve the efficiency of these operations by adopting the above-described configuration.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a cross-sectional view showing a schematic configuration of an injection mold apparatus according to an embodiment of the present invention.
This injection molding die apparatus has a fixed side mounting plate 10 attached to a fixed side holder of a molding machine (not shown) and a movable side mounting plate 11 attached to a movable side holder of the molding machine. A fixed-side mold 12 having a female cavity 12a is attached to the fixed-side attachment plate 10, and a movable-side mold 13 having a male core 13a is received on the movable-side attachment plate 11. The plate 14 and the spacer block 15 are attached.

This injection mold apparatus can be divided between a fixed mold 12 and a movable mold 13, and the movable mold 13 moves in a direction perpendicular to the plate surface in accordance with the movement of the holder of the molding machine. The fixed side mold 12 and the movable side mold 13 are opened and closed. The stationary mold 12 is provided with a guide bush 19, the movable mold 13 is provided with a guide post 18, and the guide post 18 is slidably inserted into the guide bush 19. Since the opening and closing of the fixed mold 12 and the movable mold 13 are guided by the guide posts 18 and the guide bushes 19, the cavity 12a and the core 13a are closed when the fixed mold 12 and the movable mold 13 are closed. Are combined in the correct position.
The fixed side mounting plate 10 has a sprue 16 serving as a path for injecting molten resin from a cylinder nozzle of the molding machine, and a locating means for positioning the mold device to the cylinder nozzle of the molding machine. A ring 17 is attached.

  An ejector plate 21 is provided on the movable side mounting plate 11 side. The ejector plate 21 can be moved in the vertical direction by an ejector rod 26, and the movable side plate is moved along with the vertical movement of the ejector plate 21. The mold 13 is also moved up and down to open and close the mold. The ejector plate 21 is provided with ejector pins 24 that protrude from the core 13a and project the molded product C out of the mold at the tip 24a when the mold is opened. The ejector plate 21 is provided with a return pin 22 for retracting the ejector pin 24 by returning the ejector plate 21 to a predetermined position when the mold is closed. In the figure, reference numeral 23 denotes an ejection pin for releasing the resin solidified in the sprue 16 from the movable side mold 13 when the mold is opened.

The base end portion 24 b of the ejector pin 24 is larger in diameter than the tip end portion 24 a, and is held together with the protrusion pin 23 and the return pin 22 by the holding plate 25 connected to the ejector plate 21. It is configured to move up and down according to the up and down movement. As shown in FIG. 2, a pressure sensor 30, a plate-like contact portion 31, and a moving means for moving the contact portion 31, which will be described later, are disposed at positions facing the bottom surface 24 c of the base end portion 24 b of the ejector pin 24. A unit 32 provided with is attached to the ejector plate 21 so as to be removable.
In the present invention, the pressure sensor 30, the contact portion 31, and the moving means are characterized. Various embodiments of this characteristic portion will be described below.

FIG. 3 shows a planar shape of a unit 32 according to an embodiment of the present invention, in which 30 is a pressure sensor composed of a piezoelectric transducer, etc., 30a is a pressure sensor detector, and 30b is a detection signal from the pressure sensor. An electric wire 31 to be output is a trapezoidal plate-like contact portion.
The unit 32 is a quadrangular plate-like body, and an inverted L-shaped recess 34 is formed at the center thereof, and the contact portion 31 is located above and below the recess 34a in the horizontal recess 34a. It is guided in the left-right direction by the peripheral walls 34c, 34d and is movably accommodated. The vertical recess 34b communicating with the recess 34a is formed such that the side walls 30c and 30d of the pressure sensor 30 are guided by the left and right side walls 34e and 34f of the recess 34b so that the pressure sensor 30 can be inserted in the vertical direction. .

The contact portion 31 is pressed leftward by an elastic member 33 made of a spring member such as a coil spring disposed between the side wall 34g of the recess 34a and the right side surface 31a of the contact portion 31. The left side surface 31b of 31 and the side wall 34e of the recess 34 are positioned in contact with each other, and the bottom surface 24c of the base end portion 24b of the ejector pin 24 indicated by the dotted line is in contact with the surface to prevent the ejector pin 24 from descending. (Contact position).
In addition, an inclined surface 31c is formed below the left side surface 31b of the contact portion 31, and when the pressure sensor 30 is inserted from the direction of arrow A, the distal end portion 30e of the pressure sensor 30 contacts the inclined surface 31c. By pressing, the contact portion 31 moves out in the direction of arrow B against the elastic force of the elastic member 33 (in this case, the elastic portion seat 33 contracts by the pressing force of the pressure sensor 30), and finally Then, the contact portion 31 retreats until the contact between the surface of the contact portion 31 and the bottom surface 24c of the ejector pin 24 is released (non-contact position). As a result, the bottom surface 24c of the ejector pin 24 moves on the surface of the contact portion 31 and contacts the detection portion 30a of the pressure sensor 30, and the tip of the pressure sensor 30 contacts the recess 34c so that the pressure sensor 30 is positioned. Is done. As described above, when the bottom surface 24c of the ejector pin 24 is brought into contact with the detection portion 30a of the pressure sensor 30, it is possible to appropriately detect the pressing force applied to the tip portion 24a of the ejector pin 24 due to the resin pressure during molding. Become.

On the other hand, when it is no longer necessary to measure the resin pressure at the time of molding, when the pressure sensor 30 is pulled out in the direction opposite to the insertion direction A, the contact portion 31 is moved to the left by the elastic force of the elastic member 33, and the contact The left side surface 31b of the portion 31 contacts and is positioned with the side wall 34e of the recess 34, and returns to the initial contact position. During this time, the bottom surface 24c of the ejector pin 24 abuts on the surface of the abutment portion 31 at the initial abutment position to prevent the ejector pin 24 from descending. As a result, the tip end portion 24a of the ejector pin is appropriately positioned on the surface of the core 13a of the movable mold 13 to prevent damage to the shape of the molded product molded in the cavity 12a and to produce a good molded product. Can be molded.
In this case, the surface of the detection 30a and the surface of the contact portion 31 are substantially the same so that the bottom surface 24c of the ejector pin 24 can be easily moved from the surface of the contact portion 31 to the detection portion 30a of the pressure sensor 30. Preferably, the contact portion 31 is substantially the same thickness as the pressure sensor 30 and the bottom surfaces of the recesses 34a and 34b are preferably the same plane.

As described above, by inserting / removing the pressure sensor 30, it is possible to easily and reliably perform measurement and non-measurement of the resin pressure, and it is possible to efficiently perform change work between measurement and non-measurement.
In this embodiment, the unit 32 in which the contact portion 31 and the moving means of the contact portion 31 are integrated is detachably attached to the ejector plate 21, but the contact portion is directly attached to the ejector plate without using the unit. You may form the moving means of 31 and the contact part 31. FIG. However, in the case of a unit structure, not only can the storage structure of the abutment portion 31 and the like to the ejector plate 21 be simplified, but other molds in which the unit 32 is previously provided with a unit installation space as it is. It has the advantage that it can be easily and reliably attached to the ejector plate of the apparatus.
As described above, when the unit structure is adopted, as shown in FIG. 2, when the side surface 32a of the unit 32 is projected from the side surface of the ejector plate 21 in the insertion direction, the projected side surface is used as a gripping and extracting portion. This is preferable because the unit 32 can be easily removed.

4 and 5 (a) and 5 (b) are diagrams showing a unit structure according to another embodiment of the present invention. The same reference numerals are given to the same components as those in the first embodiment, and the description thereof will be omitted.
In this embodiment, the configuration is basically the same as that in the first embodiment except that the pressure sensor 30 is housed and used in a trapezoidal holding member (holding block) 35. .
A concave portion 35a for accommodating and holding the pressure sensor 30 is formed in the central portion of the holding block 35. When the pressure sensor 30 is accommodated and held in the concave portion 35a, the concave portion 35a is held with the surface 30f of the pressure sensor 30. The surface 35b of the block 35 is configured to be substantially flush with the surface. An inclined surface 35d is formed at the distal end portion 35c, and when the holding block 35 storing and holding the pressure sensor 30 is inserted into the concave portion 34b of the unit 32, the left and right side surfaces 35e and 35f of the holding block 35 are formed. It is guided by the side walls 34e and 34f of the recess 34b of the unit 32 and inserted in the direction of arrow A. As a result, the inclined surface 31c of the contact portion 31 and the inclined surface 35d of the holding block 35 come into contact with each other. Retreat in the direction of arrow B against the elastic force of member 33. As the abutting portion 31 is retracted, the abutment of the base end portion 24b of the ejector pin moves from the abutting portion 31 to the detecting portion 30a of the pressure sensor 30 via the surface 35b of the holding block 35 (FIG. 5). (Refer to (a) and (b)).

As described above, when the pressure sensor 30 is housed and held in the concave portion 35a in the holding block 35, the side surfaces 35e and 35f of the holding block 35 are more accurate than the side surfaces 30c and 30d of the pressure sensor 30. Since it can be formed, there is an advantage that the pressure sensor 30 can be accurately positioned.
Moreover, since the contact portion 31 is retracted by sliding the surfaces of the inclined surface 31c of the contact portion 31 and the inclined surface 35d of the holding block 35, the retracting operation of the contact portion 31 can be performed smoothly. There are also advantages. In this case, the inclined surface 35 d is formed only on the holding block 35, the inclined surface is not formed on the abutting portion 31, and a rectangular shape is formed, and the corner portion of the abutting portion 31 contacts the inclined surface 35 d of the holding block 35. You may make it contact.

FIGS. 6A and 6B show a unit structure of another embodiment according to the present invention. The same reference numerals are given to the same components as those in the second embodiment, and the description thereof will be omitted.
In this embodiment, the moving means of the contact portion 31 is different from the above-described second embodiment. In the second embodiment, the pressing force of the elastic member 33 is used to move the contact portion 31 in the horizontal direction. However, in this embodiment, the elastic member 33 is not used and the contact portion 31 is formed on the contact portion 31. The abutting portion 31 is automatically moved in the left-right direction using the angular groove 36.

  The contact portion 31 is formed in a quadrangular shape, and an angular groove 36 that is cut obliquely is formed at the center thereof. On the other hand, the unit 32 is formed with a recess 34 having one end open, and the contact portion 31 is accommodated in the recess so as to be slidable in the left-right direction. An angular block 37 is accommodated in the open end 34h of the recess 34 so that it can be inserted and removed. The angular block 37 includes a protruding portion 37b that protrudes obliquely from the main body. A pressure sensor 30 is detachably mounted in a guide groove 37a formed from the main body of the angular block 37 to the protruding portion, and the tip end portion 37c of the protruding portion 37b is housed by being shifted to the right end in the concave portion 34. It can be inserted into the open end 36a of the angular groove 36 of the contact portion 31.

  As described above, when the angular block 37 is pushed in the direction of the arrow C in a state where the distal end portion 37c of the protruding portion 37b is inserted into the open end 36a of the angular groove 36 of the contact portion 31 (see FIG. 5A), the protruding portion 37b is inserted in the direction of the arrow D. As the protrusion 37b enters, the contact part 31 is guided to the angular groove 36 of the contact part 31 fitted to the protrusion 37b, and the contact part 31 moves to the left (arrow E direction). As a result, the contact of the base end portion 24 of the ejector pin 24 is moved from the surface of the contact portion 31 to the surface of the detection portion 30a of the pressure sensor 30 as shown in FIG. On the contrary, when the angular block 37 is pulled out in the direction opposite to the arrow C direction, the projecting portion 37b is retracted in the direction opposite to the arrow D direction, and the contact portion 31 is moved in the right direction accordingly, and the proximal end of the ejector pin 24 The contact of the portion 24 b changes from the pressure sensor 30 to the surface of the contact portion 31.

As described above, in the unit according to the present embodiment, the movement of the contact portion 31 from the contact position with the ejector pin 24 to the non-contact position is performed without using an elastic member. This can be automatically performed by inserting and extracting the block 37 into and from the unit 32.
In this embodiment, the pressure sensor is directly accommodated in the angular block 37 provided with the protruding portion 36b. However, the holding block 35 accommodating the pressure sensor is provided in the guide groove of the rectangular block without the protruding portion. You may make it the structure attached so that it may protrude diagonally.

Sectional drawing which shows schematic structure of the injection molding die apparatus of one Embodiment by this invention. The expanded sectional view which notched a part at the time of seeing from the back surface side of the ejector plate part of FIG. The top view which shows schematic structure of the unit of one Embodiment by this invention. The top view which shows schematic structure of the unit of other embodiment by this invention. 5A and 5B are perspective views for explaining the operation of the unit shown in FIG. 4, in which FIG. 5A is a diagram showing a state before the holding block is inserted, and FIG. 5B is a diagram showing a state after the holding block is loaded. It is a perspective view which shows schematic structure of the unit of other embodiment by this invention, (a) is a figure which shows the state before insertion of a protrusion part, (b) is a figure which shows the state after loading of a protrusion part.

Explanation of symbols

  12 Fixed side mold, 12a Cavity, 13 Movable side mold, 13a Core, 21 Ejector plate, 24 Ejector pin, 24a Tip, 24b Base end, 24c Bottom, 26 Ejector rod, 30 Pressure sensor, 30a Detector, 31 Contact part, 32 unit, 33 Elastic member, 34 Recessed part, 35 Holding block, 36 Angular groove, 37 Angular block, 37b Protruding part, 37c Tip part

Claims (6)

The movable side mold is provided with an ejector plate that is driven by an ejector rod when the mold is opened, and the movable side is moved when the mold is opened along with the movement of the ejector plate. An injection mold apparatus in which an ejector pin is provided on the ejector plate to project a molded product formed in a cavity formed by the fixed side mold and the movable side mold through the mold. In
An abutting portion that is movably disposed in the ejector plate and abuts against a base end portion of the ejector pin;
A pressure sensor that detects a resin pressure in the cavity by contacting with a base end portion of the ejector pin, and inserting the pressure sensor removes the contact portion from a contact position with the base end portion of the ejector pin; Moving means for moving to a contact position and returning from the non-contact position to the contact position by pulling out the pressure sensor;
An injection mold apparatus, wherein when the pressure sensor is inserted and positioned at a predetermined position, a base end portion of an ejector pin comes into contact with the pressure sensor to detect the resin pressure. The injection mold apparatus according to claim 1, wherein
The moving means is
Provided at one end of the contact portion, when the pressure sensor is not inserted, the contact portion is pressed and biased to the contact position, and when the pressure sensor is inserted, the pressure sensor presses An injection mold apparatus comprising an elastic member that contracts to move the contact portion to the non-contact position.   3. The injection mold apparatus according to claim 1, wherein the pressure sensor is housed and held in a holding member. The injection mold apparatus according to claim 3,
The moving means is
When the holding member is inserted, an inclined surface that contacts the inclined surface of the holding member of the contact portion and moves the contact portion to a non-contact position is formed at the tip of the holding member. Characteristic injection mold equipment. The injection mold apparatus according to any one of claims 1 to 4,
An injection mold apparatus characterized in that the abutment portion and the moving means are separate units from the ejector plate, and the unit is detachably mounted in the ejector plate. The injection mold apparatus according to claim 5, wherein
An injection mold apparatus characterized in that the side surface of the unit protrudes from the side surface of the ejector plate.

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