JP2008093957A - Mold device, insert molded article and insert molding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mold device capable of preventing pin traces from remaining on a molded article with a simple structure. <P>SOLUTION: The mold device 100 is equipped with a cavity C formed by a pair of molds 10, 20, a gate 24 for injecting and filling a molten resin in the cavity C, a plurality of holding pins 30 capable of being projected into and retracted from the cavity C and holding an insert A in the cavity C, a pressure sensor 60 for detecting a flow state of the molten resin injected and filled in the cavity C, and a control means 50 for controlling so as to sequentially pull out the holding pins 30 from the gate 24 side based on the detection result of the pressure sensor 60. An insert molded article having the remaining pin traces can be molded without using exclusive parts for supplementing the resin for the portion causing the pin traces thereby. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a mold apparatus, an insert molded product, and an insert molding method.

  Conventionally, an insert molded product in which an insert is embedded in a resin molded product is known. This insert-molded product is formed by providing a holding pin in a cavity in a mold so as to be able to protrude and retract, holding the insert in the cavity by the holding pin, and injecting and filling molten resin into the cavity (Patent Document 1, Patent). Reference 2).

  In this conventional insert molding method, after the molten resin is injected and filled into the cavity, the holding pin is moved backward out of the cavity, and the holding pin is extracted from the resin before the resin is solidified. In order to prevent pin marks of the holding pins extracted from the resin from remaining on the surface of the molded product as holes, the molten resin is secondarily injected and filled from the gate after the holding pins are extracted. However, since the molten resin is secondarily supplied from the gate in a state where the insert is not held, the insert is displaced in the cavity.

  In order to solve this problem, in the insert molding method of Patent Document 3, in addition to the holding pin that holds the insert in the mold apparatus, a pressing pin that compensates the resin is provided in the portion that becomes the pin mark, and the cavity is formed by the holding pin. After holding the inner insert, the molten resin is injected and filled into the cavity and simultaneously injected into the pin hole of the pressing pin. Then, the retraction movement of the holding pin and the forward movement of the pressing pin are simultaneously relatively moved so that the molten resin stored in the pin hole of the pressing pin is pushed into the cavity and the molten resin is inserted in the state where the insert is positioned. It is designed to be compensated for a portion that becomes a pin mark by extracting the holding pin.

JP-A-10-290726 Japanese Patent Laid-Open No. 11-207749 JP 2003-170467 A

  However, in the insert molding method of Patent Document 3, it is necessary to provide a dedicated pressing pin for supplementing the molten resin in a portion that becomes a pin mark. In addition, it is necessary to adjust the cavity internal pressure and the injection pressure in order to prevent the molten resin from flowing in from the gate, which is generated by the relative movement of the holding pin and the pressing pin at the same time.

  Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide a mold apparatus, an insert molded product, and an insert molding method that can keep a pin mark on a molded product with a simple configuration. .

  In order to solve the above-described problems, the present invention provides a cavity formed by a pair of molds, a gate for supplying a molten resin into the cavity, and a cavity that can be moved into and out of the cavity. A mold apparatus including a plurality of holding pins for holding, wherein the cavity is moved from the holding pins arranged on the gate side among the plurality of holding pins according to a flow state of a molten resin supplied into the cavity. Control means for controlling to sequentially pull out is provided. Accordingly, the resin can be supplied while the insert is held in the cavity by sequentially pulling out the holding pins according to the flow state of the molten resin. Therefore, an insert-molded product that does not leave a pin mark can be formed with a simple configuration without using a dedicated part that fills the pin mark with a resin.

  The mold apparatus according to the present invention further includes detection means for detecting a flow state of the molten resin supplied into the cavity, and the control means pulls out the holding pin based on a detection result of the detection means. Control as follows. Thereby, the holding pin can be pulled out based on the detection result of the detection means.

  The mold apparatus of the present invention further includes a biasing unit that biases the holding pin in a direction in which the holding pin is pulled out from the cavity. Thereby, the holding pin can be pulled out reliably.

  Further, the mold apparatus of the present invention further comprises drive means for moving the holding pin in and out of the cavity and moving in a direction perpendicular to the moving direction of the holding pin, and the driving means is an end portion of the holding pin. An inclined surface is formed at a portion that contacts with. Thereby, the holding pin can be pulled out in the moving direction by setting the slide in a direction orthogonal to the moving direction of the holding pin.

  The driving means is disposed outside the mold. Thereby, an effective space can be secured in the internal space of the pair of molds. The detection means is disposed between the holding pins. Thereby, the flow state of the molten resin that has passed through the holding pin can be detected.

  Further, the mold apparatus according to the present invention is provided according to a groove portion provided in the cavity and forming a part of a molded product, an insertion pin inserted into the groove portion, and a flow state of a molten resin supplied into the cavity. And control means for controlling to insert the insertion pin into the groove. Thereby, a boss | hub can be shape | molded integrally, for example. The control means inserts the insertion pin into the groove based on the detection result of the detection means. Thereby, an insertion pin can be pushed in based on the detection result of a detection means.

  The insert-molded product of the present invention supplies resin into the cavity from a predetermined gate in a state where the insert is held by a plurality of holding pins provided in a cavity formed by a pair of molds. An insert molded product that seals the molded product in a molded product, wherein the outer surface of the plurality of holding pins is arranged outside the cavity from the holding pins arranged on the gate side in accordance with the flow state of the molten resin supplied into the cavity. The insert is hermetically sealed in the molded product while being sequentially pulled out. Accordingly, the resin can be supplied while the insert is held in the cavity by sequentially pulling out the holding pins according to the flow state of the molten resin. Therefore, an insert-molded product that does not leave a pin mark can be formed with a simple configuration without using a dedicated part that fills the pin mark with a resin.

  The present invention includes a cavity formed by a pair of molds, a gate that supplies molten resin into the cavity, and a plurality of holding pins that are provided in the cavity so as to be able to protrude and retract and hold the insert in the cavity. An insert molding method for molding an insert molded product using a mold apparatus, wherein the holding pins are arranged on the gate side among the plurality of holding pins in accordance with the flow state of the molten resin supplied into the cavity. And sequentially pulling the holding pins out of the cavities from the pins. Accordingly, the resin can be supplied while the insert is held in the cavity by sequentially pulling out the holding pins according to the flow state of the molten resin. Therefore, an insert-molded product that does not leave a pin mark can be formed with a simple configuration without using a dedicated part that fills the pin mark with a resin.

  The insert molding method of the present invention further includes a step of inserting an insertion pin into a groove that is provided in the cavity and forms a part of a molded product in accordance with the flow state of the molten resin supplied into the cavity. . Thereby, for example, the boss can be formed integrally with the molded product.

  The insert molding method of the present invention further includes a detection step of detecting a flow state of the molten resin supplied into the cavity by a predetermined detection means. Thereby, the holding pin can be pulled out based on the detection result of the detection means.

  According to the present invention, it is possible to provide a mold apparatus, an insert molded product, and an insert molding method that can keep a pin mark on a molded product with a simple configuration.

  Hereinafter, the best mode for carrying out the present invention will be described.

(First embodiment)
FIG. 1 is a plan view of a mold apparatus according to an embodiment of the present invention as viewed from above, and FIG. 2 is an overall configuration diagram showing an XX cross section of the mold apparatus shown in FIG. 3 shows a YY cross section of the mold apparatus shown in FIG. 1, and is a view for explaining a mechanism of a holding pin for holding the insert. FIG. 4 shows a YY cross section of the mold apparatus shown in FIG. FIG. 5 is an enlarged cross-sectional view of the holding pin and the cylinder portion shown in FIG. 3, illustrating a mechanism for pulling out the holding pin from the inside.

The mold apparatus 100 includes a movable mold 10 that can be moved by a predetermined stroke by a movable cylinder (not shown) and a fixed mold that is paired with the movable mold 10 in order to mold an insert molded product using an insert molding method. The mold 20 and an injection machine (not shown) connected to the fixed mold 20 are generally configured. The mold apparatus 100 includes a plurality of holding pins 30 ₁ to 30 ₁₂ , an urging unit 40, a driving unit 50 ₁ to 50 ₆ , a plurality of pressure sensors 60 _{1 to} 60 ₁₀ , and a control unit (control unit) 65. .

The movable mold 10 and the fixed mold 20 are formed with a plurality of pin holes P for accommodating the plurality of holding pins 30 ₁ to 30 ₁₂ . The plurality of pin holes P have a portion with a small diameter. Further, the movable mold 10 and the fixed mold 20 are assisted outside by auxiliary plates 11 and 21. The stationary mold 20 is provided with a resin passage manifold 22 and a gate 24 for supplying molten resin from an injection machine. The gate 24 is for injecting and filling the molten resin supplied from the injection machine via the manifold 22 into the cavity C, and is disposed on the side of the cavity C. The cavity C is formed by clamping the movable side mold 10 and the fixed side mold 20 and has a rectangular planar shape corresponding to the product shape of the insert molded product. The insert (core) A is embedded in the insert molded product, and is put into the cavity C in the mold open state before molding.

The urging means 40 has a first spring part 42 and a second spring part 44. The driving means 50 is omitted in FIG. 2 and FIGS. 6 to 9 in order to clearly describe the plurality of holding pins 30, but actually, the driving means 50 is provided corresponding to the plurality of holding pins 30 ₁ to 30 _12. (See FIG. 1).

The holding pins 30 ₁ to 30 ₁₂ hold the insert A in the center in the cavity C by sandwiching the insert A put in the cavity C up and down. The holding pins 30 ₁ to 30 ₁₂ are respectively accommodated in the plurality of pin holes P of the movable side mold 10 and the fixed side mold 20 at predetermined positions for each pair at opposing positions on both surfaces of the cavity C. .

  As shown in FIG. 3, the holding pin 30 has a large-diameter portion 32 and a small-diameter portion 34 having a smaller diameter than the large-diameter portion 32 corresponding to the pin hole P. A first spring portion 42 is provided on the outer periphery of the large diameter portion 32, and a second spring portion 44 having a diameter smaller than that of the first spring portion 42 is provided on the outer periphery of the small diameter portion 34. The first spring portion 42 and the second spring portion 44 are elastic members and bias the holding pin 30 in the vertical direction X. The first spring portion 42 and the second spring portion 44 are in a contracted state when the holding pin 30 holds the insert A in the cavity C (see FIG. 3), and the holding pin 30 is the surface of the cavity C. When it moves up to, it will be in the restored state (see FIG. 4).

  A smooth surface 30 </ b> A is formed at one end of the holding pin 30 so that the insert A can be held in the cavity C. The smooth surface 30 </ b> A retracts the holding pin 30 to the surface of the cavity C. As shown in FIG. 5, the other end of the holding pin 30 is formed with a tip surface 30B and a chamfered portion 30C. The chamfered portion 30C is formed by chamfering at a predetermined angle θ.

  As shown in FIGS. 3 and 4, the holding pin 30 is in contact with the driving means 50 so as to be able to appear and disappear in the cavity C. The drive means 50 includes a piston part 52 and a cylinder part 54. The piston part 52 and the cylinder part 54 are arranged orthogonal to the vertical direction X of the holding pin 30 because they reciprocate in the horizontal direction Y orthogonal to the vertical direction X in which the holding pin 30 moves. Further, the piston part 52 and the cylinder part 54 are disposed on the outer surface F of the movable mold 10 and the fixed mold 20 so as not to occupy the internal space of the movable mold 10 and the fixed mold 20. (See FIG. 1). Thereby, the mold apparatus 100 can be made compact.

The piston 52 reciprocates in the horizontal direction X with the internal piston. The cylinder portion 54 reciprocates in the horizontal direction X with respect to the holding pin in accordance with the movement of the piston.
The piston portion 52 is configured to reciprocate by, for example, hydraulic pressure, air, or an electromagnetic contactor.

  As shown in FIGS. 3 to 5, the cylinder portion 54 is formed with an inclined surface 54A, and a first support surface 54B and a second support surface 54C are formed in the middle of the inclined surface. Yes. The inclined surface 54A is set to substantially the same angle θ ′ as the angle θ of the chamfered portion 30C so that the chamfered portion 30C of the holding pin 30 slides (see FIG. 5).

  The first support surface 54 </ b> B and the second support surface 54 </ b> C are horizontal surfaces that contact the holding pin 30 tip surface 30 </ b> B and support the holding pin 30. When the holding pin 30 is on the first support surface 54B, the holding pin 30 can hold the insert A in the cavity C. When the holding pin 30 is on the second support surface 54C, the other end of the holding pin comes to the surface of the cavity C.

  The difference between the height of the first support surface 54B and the height of the second support surface 54C moves from the position of the holding pin 30 holding the insert A in the cavity (position in FIG. 3) to the surface of the cavity C. It is set in consideration of the moving distance of the holding pin 30 to the position of the holding pin 30 (the position in FIG. 4). The moving distance of the holding pin 30 can be easily adjusted by changing the difference between the height of the first support surface 54B and the height of the second support surface 54C.

  When the cylinder portion 54 moves in the horizontal direction Y (right direction), the holding pin 30 moves in the vertical direction X (downward) while sliding on the inclined surface 54A of the cylinder portion 54, and the tip of the holding pin 30 is the surface of the cavity C. To the position (position shown in FIG. 4).

  When the cylinder portion 54 moves in the horizontal direction Y (left direction), the holding pin 30 moves in the vertical direction X (upward) while sliding on the inclined surface 54A of the cylinder portion 54, and the tip of the holding pin 30 holds the insert A. Move to the position (position in FIG. 3).

The control unit 65 is, for example, a CPU (Central
Processing unit (RAM), random access memory (RAM), read only memory (ROM), and the like, and gate 24 of holding pins 30 ₁ to 30 ₁₂ according to the flow state of the molten resin supplied into cavity C The driving means 50 is controlled so as to be sequentially pulled out from the holding pin on the side.

The pressure sensor 60 detects the flow state of the molten resin supplied from the gate 24 into the cavity C. The pressure sensors 60 _{1 to} 60 ₅ are disposed between the holding pins 30 ₁ to 30 ₅ . Further, a part of the pressure sensor 60 is arranged so as to be exposed on the surface of the cavity C. The pressure sensor 60 detects the resin pressure of the molten resin in the cavity C and detects the molten resin flowing immediately after the holding pins 30. When the pressure sensor 60 detects the resin pressure of the molten resin flowing immediately after the holding pin 30, the pressure sensor 60 outputs a detection signal to the control unit 65, and the piston unit 52 is driven by the control of the control unit 65.

  Next, each step of the method for manufacturing an insert molded product will be described with reference to FIGS. 6 to 9 using the mold apparatus 100 described above. 6 to 9 are views showing a process of injecting and filling molten resin into the cavity of the mold apparatus according to the first embodiment of the present invention.

As shown in FIG. 6, first, the insert A is set in a product cavity C formed between the movable mold 10 and the fixed mold 20 when the mold is opened. Next, the movable mold 10 is moved by a predetermined stroke toward the fixed mold 20 by driving the elevating cylinder, and the movable mold 10 and the fixed mold 20 are clamped. Subsequently, the control unit 65 controls the driving unit 50 and the cylinder unit 54 moves horizontally, whereby the plurality of holding pins 30 ₁ to 30 ₁₂ move forward into the cavity C, and the insert A is moved to the center in the cavity C. Hold. Next, the molten resin M is injected and filled into the cavity C through the manifold 22 and the gate 24 from the injection machine. The molten resin M flows from the right side to the left side of the cavity C shown in the figure.

When the pressure sensor 60 ₁ detects the resin pressure of the molten resin M having passed through the retaining pin 30 ₁ provided in the vicinity of the gate 24, the control unit 65, by the cylinder portion 54 of the driving means 50 ₁ is horizontally moved, retaining pin 30 ₁ leaves the inserts a, and retracted to the surface of the cavity C (see FIG. 6). At this time, the movement of the holding pin ₁ is instantaneously performed because it is biased in the direction indicated by the arrow by the restoring action of the first spring portion 42 and the second spring portion 44. Next, when the pressure sensor 60 ₂ detects the resin pressure of the molten resin M that has passed through the holding pin 30 ₂ , the control unit 65 horizontally moves the cylinder portion 54 of the driving means 50 ₂ , thereby causing the holding pin 30 ₂ to move. Retreat to the surface of the cavity C (see FIG. 7).

Similarly, with respect to the subsequent holding pins 30 ₃ , holding pins 30 ₄ , holding pins 30 ₅ , holding pins 30 ₆ , when the pressure sensors 60 ₃ , 60 ₄ , 60 ₅ detect the resin pressure of the molten resin M flowing immediately after, By horizontally moving the cylinder portion 54 of the driving means 50 ₃ , 50 ₄ , 50 ₅ , 50 ₆ , the drive means 50 ₃ , 50 ₄ , 50 ₅ , 50 ₆ is retracted to the surface of the cavity C (see FIGS. 8 and 9). As shown in FIG. 9, all the holding pins 30 ₁ to 30 ₁₂ move to the surface of the cavity C, whereby the cavity C is filled with the molten resin M.

As described above, when the plurality of holding pins 30 ₁ to 30 ₁₂ that have held the surface of the insert A detect the molten resin M through which the pressure sensors 60 _{1 to} 60 ₁₀ disposed immediately after the detection, the control unit 65 Based on the detection results of the pressure sensors 60 _{1 to} 60 ₁₀ , the driving means 50 is controlled so as to be sequentially pulled out from the holding pins 30 on the gate 24 side. As described above, the resin is supplied into the cavity from a predetermined gate in a state where the insert is held by the plurality of holding pins provided in the cavity formed by the pair of molds so as to be protruded and retractable, and then supplied into the cavity. Depending on the flow state of the molten resin, the part that becomes the trace of the extracted holding pin by sealing the insert in the molded product while sequentially pulling it out of the cavity from the holding pin arranged on the gate side among the plurality of holding pins Since the molten resin M is compensated for, pin hole holes do not remain on the surface of the insert-molded product after molding.

  Further, since the plurality of holding pins 30 are sequentially pulled out from the gate 24 side, the insert A in the cavity is held by the other holding pins 30 even if one holding pin 30 is pulled out. Therefore, even when the molten resin M flows into the cavity C, the insert A is appropriately held. As described above, the mold apparatus 100 can be simply inserted without adjusting the timing of pulling out the existing holding pin 30 without adopting a dedicated part for supplementing the resin to the pin mark portion. A molded product can be formed.

(Second Embodiment)
Next, a mold apparatus 200 according to a second embodiment of the present invention will be described with reference to FIGS. 10 to 13. FIG. 10 is a cross-sectional view of a mold apparatus according to the second embodiment of the present invention, a schematic view corresponding to FIG. 2, and FIG. 11 is a diagram for explaining a mechanism of a holding pin of the mold apparatus shown in FIG. 12 is a view for explaining the mechanism of the insertion pin of the mold apparatus shown in FIG. FIG. 13 is a view showing an insert molded product molded by the mold apparatus shown in FIG. 10. FIG. 13A is a sectional view of the insert molded product 300, and FIG. 13B is a side view of the insert molded product 300. It is a front view of 310 A of recessed parts. The same constituent elements as those of the mold apparatus 100 of the first embodiment are denoted by the same reference numerals in the drawings, and the description thereof is omitted.

  The mold apparatus 200 according to the present embodiment integrally molds the boss portion 310 such as a fastener simultaneously with the molding of the insert molded product 300.

  As shown in FIGS. 10 to 12, the mold apparatus 200 includes a movable mold 10A, a fixed mold 20A, a plurality of holding pins 30, a first spring portion 42, and a second spring portion 44. In addition to the biasing means 40, the plurality of driving means 50 including the piston portion 52 and the cylinder portion 54, the plurality of pressure sensors 60, and the control portion 65, the plurality of insertion pins 70, the biasing means 80, the piston portion 92 and the cylinder portion 94. The driving means 90 is further provided.

  A groove portion 95 that forms a boss portion is provided in the cavity C at a portion corresponding to the insertion pin 70. The groove 95 penetrates the pin hole P that accommodates the insertion pin 70. The urging means 80 has a first spring portion 82 and a second spring portion 84. The driving means 90 is composed of a piston part 92 and a cylinder part 94. The driving unit 90 is controlled by the control unit 65 based on the detection result of the pressure sensor 60.

  The plurality of insertion pins 70 are inserted into and removed from the groove portion 95 to form a boss portion 310 (see FIG. 13) including the concave portion 310A. The plurality of insertion pins 70 are set to be shorter than the holding pins 30.

  The first spring portion 82 and the second spring portion 84 are provided on the outer periphery of the plurality of insertion pins 70. The first spring portion 82 and the second spring portion 84 are in an extended state when the insertion pin 70 is not inserted into the groove portion 95 of the cavity C (see FIG. 11), and the insertion pin 70 is the groove portion of the cavity C. When inserted in 95, it is in a contracted state (see FIG. 12).

As shown in FIGS. 11 and 12, the piston portion 92 and the cylinder portion 94 are controlled by the control portion 65 so as to sequentially insert the insertion pins 70 into the groove portion 95 from the gate 24 side in accordance with the flow state of the molten resin. The Further, the piston portion 92 and the cylinder portion 94 are arranged so as to be orthogonal to the insertion pin 70 so that the insertion pin 70 can be inserted into or removed from the groove portion 95 of the cavity C. The pressure sensor 60A~60D is also disposed immediately after the plurality of insertion pins 70 _{1-70 4.} The detection results of the pressure sensors 60 </ b> A to 60 </ b> D are output to the control unit 65.

  When the cylinder portion 94 moves in the horizontal direction Y (left direction), the insertion pin 70 moves in the vertical direction X (upward) while sliding on the inclined surface 94A of the cylinder portion 94, and the tip of the insertion pin 70 enters the groove portion 95. enter in. When the cylinder portion 94 moves in the horizontal direction Y (right direction), the insertion pin 70 moves in the vertical direction (downward) while sliding on the inclined surface 94A of the cylinder portion 94, and the tip of the insertion pin 70 moves backward out of the groove portion 95. To do.

Next, an outline of the operation of the mold apparatus 200 will be described with reference to FIG. The insert A set in the cavity C is held by the holding pin 30. At this time, the insertion pin 70 stands by at the standby position. When the molten resin M is injected and filled through the gate 24 from the injection machine, the inserting pin ₇₀ 1, 70 ₃ arranged immediately after the pressure sensor 60A, the resin pressure of the molten resin M to 60C passes the insert pin 70 _1, 70 ₃ It detects and outputs a detection result to the control part 65.

When the control unit 65 for horizontally moving the drive means 90, the inserting pin 70 ₁ enters into the groove 95 from the standby position. Next, when the pressure sensors 60 ₁ , 60 ₂ , 60 ₆ and 60 ₇ detect the molten resin pressure, the control unit 65 moves the driving means 50 horizontally to hold the holding pins 30 ₁ , 30 ₂ , 30 ₇ and 30. ₈ is retracted from the cavity C. Next, the control unit 65 inserts the insertion pins 70 ₂ and 70 ₄ into the groove portion 95 by horizontally driving the driving unit 90 based on the detection results output from the pressure sensors 60B and 60D.

  As described above, in the standby state in which the insertion pin 70 is retracted out of the groove portion 95, the molten resin is firmly filled into the groove portion 95, and after the molten resin is filled into the groove portion 95, the insertion pin 70 is inserted into the groove portion 95. By inserting, the boss part can be formed integrally with the insert molded product. Further, since the piston pin 92 and the cylinder portion 94 are used for driving the insertion pin 70 similarly to the driving of the holding pin 30, an increase in the number of different types of parts due to the use of common parts can be prevented. Further, since the insertion pin 70 is inserted into the groove portion 95 filled with the molten resin M, the boss portion 310 that does not generate poorly shaped welds can be formed.

  In the above embodiment, the number of holding pins 30 and insertion pins 70 may be variously changed. Moreover, although this embodiment demonstrated the example which provided the holding pins 30 and 70 in both the movable side metal mold | die 10 and the fixed side metal mold | die 20, the movable side metal mold 10 and the fixed side metal mold | die were used according to the use. The pins 30 and 70 may be provided on only one of the 20 pins. When the holding pin 30 and the insertion pin 70 are provided in one mold, the biasing means 40, the driving means 50, the pressure sensor 60, and the like are configured to be provided in one mold provided with the pins 30 and 70.

  Moreover, in the said embodiment, although the pressure sensor 60 detects the resin pressure of molten resin, you may detect the cavity C internal pressure. The detection means is not limited to the pressure sensor, and may be a temperature sensor, an optical sensor or the like as long as it can detect the flow state of the molten resin. Further, the example in which the number of pressure sensors 60 is provided corresponding to the holding pins 30 and the insertion pins 70 has been described, but the number of pressure sensors 60 may be variously changed without corresponding to the holding pins 30 and the insertion pins 70. good. In addition, the example in which the pressure sensor 60 is arranged immediately after each of the holding pins 30 has been described. However, when the holding pin 30 is pulled out before the molten resin passes, the pressure sensor 60 may be arranged immediately before the holding pin 30. good.

  Further, since the driving means 50 and 90 are disposed outside the movable side mold 10 and the fixed side mold 20, the internal space of the movable side mold 10 and the fixed side mold 20 is occupied by the driving means. Therefore, a space for arranging a plurality of pins can be secured. As a result, a large number of pins 30 can be arranged, and the burden on one pin is reduced. For this reason, the driving means 50 and 90 can be reduced in size because the force for driving one pin may be small.

  The driving means 50 and 90 are driven based on the detection result of the pressure sensor 60. However, when the driving means 50 and 90 are operated by time control by controlling the flow rate of the molten resin constant, the pressure sensor 60 is used. May not be used. Thereby, the internal space of the movable mold 10 and the fixed mold 20 can be further secured by reducing the number of parts.

  Further, the gate is not limited to one provided on one side of the cavity, and the gate may be provided on both sides. In this case, the plurality of holding pins 30 and insertion pins 70 are configured to be sequentially pulled out from both gate sides. Further, when the gate 24 is provided, for example, at the lower center of the cavity, the pins may be sequentially pulled out from the center where the gate is provided. Examples of the insert molded product include a washlet shower nozzle, a headrest core, or a golf ball.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiments, and various modifications may be made within the scope of the gist of the present invention described in the claims. It can be changed.

It is the top view which looked at the metallic mold device by a 1st embodiment of the present invention from the upper part. It is a whole block diagram which shows the XX cross section of the metal mold | die apparatus shown in FIG. It is a figure which shows the YY cross section of the metal mold | die apparatus shown in FIG. 1, and demonstrates the mechanism of the holding pin holding an insert. It is a figure which shows the YY cross section of the metal mold | die apparatus shown in FIG. 1, and demonstrates the mechanism which pulls out a holding pin from the inside of a cavity. It is an expanded sectional view of a holding pin and a cylinder shown in FIG. It is a figure which shows one process of injecting and filling molten resin in the cavity of the metal mold | die apparatus by the 1st Embodiment of this invention. It is a figure which shows one process of injecting and filling molten resin in the cavity of the metal mold | die apparatus by the 1st Embodiment of this invention. It is a figure which shows one process of injecting and filling molten resin in the cavity of the metal mold | die apparatus by the 1st Embodiment of this invention. It is a figure which shows one process of injecting and filling molten resin in the cavity of the metal mold | die apparatus by the 1st Embodiment of this invention. It is the schematic corresponding to FIG. 2 which shows the cross section of the metal mold | die apparatus by the 2nd Embodiment of this invention. It is a figure explaining the mechanism of the insertion pin of the metal mold | die apparatus shown in FIG. It is a figure explaining the mechanism of the insertion pin of the metal mold | die apparatus shown in FIG. It is a figure which shows the insert molded product shape | molded by the metal mold | die apparatus shown in FIG.

Explanation of symbols

100, 200 Mold apparatus 10, 10A Movable side mold 11, 21 Auxiliary plate 20, 20A Fixed side mold 22 Manifold 24 Gate 30 Holding pin 30A Smooth surface 30B Tip surface 30C Chamfered portion 32 Large diameter portion 34 Small diameter portion 40 With Force means 42 First spring portion 44 Second spring portion 50 Drive means 52 Piston portion 54 Cylinder portion 54A Inclined surface 54B First support surface 54C Second support surface 60 Pressure sensor 70 Insertion pin 80 Another bias means 82 First spring portion 84 Second spring portion 90 Driving means 92 Piston portion 94 Cylinder portion 95 Groove portion A Insert C Cavity P Pin hole

Claims (12)

A mold apparatus including a cavity formed by a pair of molds, a gate for supplying a molten resin into the cavity, and a plurality of holding pins that are provided in the cavity so as to be freely retractable and hold the insert in the cavity. There,
According to a flow state of the molten resin supplied into the cavity, control means is provided for controlling to sequentially withdraw from the cavity from the holding pins arranged on the gate side among the plurality of holding pins. And mold equipment. Further comprising detection means for detecting a flow state of the molten resin supplied into the cavity,
The mold apparatus according to claim 1, wherein the control unit performs control so that the holding pin is pulled out based on a detection result of the detection unit. The mold apparatus according to claim 1, further comprising a biasing unit that biases the holding pin in a direction in which the holding pin is pulled out from the cavity. The driving device further includes driving means for moving the holding pin in and out of the cavity and moving the holding pin in a direction perpendicular to the moving direction of the holding pin, and the driving means has an inclined surface at a portion contacting the end of the holding pin. The mold apparatus according to claim 1, wherein the mold apparatus is provided. The mold apparatus according to any one of claims 1 to 4, wherein the driving means is disposed outside the mold. 6. The mold apparatus according to claim 2, wherein the detection unit is disposed between the holding pins. A groove provided in the cavity and forming a part of a molded product;
An insertion pin to be inserted into the groove,
7. The control device according to claim 1, further comprising a control unit configured to control the insertion of the insertion pin into the groove according to a flow state of the molten resin supplied into the cavity. The mold apparatus as described in. The mold apparatus according to claim 7, wherein the control unit inserts the insertion pin into the groove portion based on a detection result of the detection unit. An insert for supplying resin into the cavity from a predetermined gate in a state where the insert is held by a plurality of holding pins provided in a cavity formed by a pair of molds so as to be able to protrude and retract, and sealing the insert in a molded product A molded article,
The insert is sealed in the molded product while being sequentially pulled out of the cavity from the holding pins arranged on the gate side among the plurality of holding pins according to the flow state of the molten resin supplied into the cavity. Insert molded product characterized by A mold apparatus including a cavity formed by a pair of molds, a gate for supplying a molten resin into the cavity, and a plurality of holding pins that are provided in the cavity so as to be able to protrude and retract and hold the insert in the cavity. An insert molding method for molding an insert molded product using,
A step of sequentially pulling out the holding pins out of the cavity from the holding pins arranged on the gate side among the plurality of holding pins according to the flow state of the molten resin supplied into the cavity. Insert molding method. The method according to claim 1, further comprising a step of inserting an insertion pin into a groove that is provided in the cavity and forms a part of a molded product according to a flow state of the molten resin supplied into the cavity. The insert molding method according to 10. The insert molding method according to claim 10 or 11, further comprising a detection step of detecting a flow state of the molten resin supplied into the cavity by a predetermined detection means.

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