JP2008004380A - Connector for circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector for a circuit board wherein soldering failure is not easily caused. <P>SOLUTION: An upper terminal 20A and a lower terminal 20B are soldered with the end faces 24 of rising parts 23A, 23B disposed on the upper side (outside) of solder H connected each other by a connecting part 25, the connecting part 25 is cut off from the end faces 24 after soldering, and short-circuited state of respective terminals 20A, 20B is thereby canceled. Thereby, even if a housing 10 is deformed by heat when soldering, the positions of connection parts 22A, 22B are not easily shifted from each other because the end faces 24 of the rising parts 23A, 23B are connected each other, and soldering failure is not easily caused. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a board connector.

  The thing of patent document 1 is known as an example of the board | substrate connector mounted in the surface of a circuit board. The board connector includes a housing and a plurality of terminals extending from the housing. The plurality of terminals are arranged in parallel in the width direction of the housing, and each terminal is drawn out from the back surface of the housing in the horizontal direction and hangs down to the circuit board side, and the tip thereof is on the surface of the circuit board. It becomes the connection part arranged along and soldered.

The plurality of terminals are collectively press-fitted into the housing in a state where the distal ends thereof are connected by a connecting member extending in the parallel direction of the terminals, and then the connecting member is cut off. Then, the board connector is positioned on the surface of the circuit board, and the connection portion is soldered by reflow soldering and mounted on the circuit board.
JP-A-11-121114 (see FIGS. 26 and 27)

However, in the structure as described above, when the housing is deformed by heat at the time of soldering the connection portion, for example, when the central portion in the width direction of the housing is bent so as to be lifted from the circuit board, the parallel connection portions Among them, the connection portion arranged in the center portion may be lifted from the surface of the circuit board, which may cause a soldering failure.
The present invention has been completed based on the above circumstances, and an object of the present invention is to provide a board connector that hardly causes poor soldering.

  As a means for achieving the above object, the invention of claim 1 is characterized in that a housing and a front end of the housing extending along the surface of the circuit board are arranged along the surface of the circuit board. A board connector comprising a plurality of terminals soldered to a conductive path of the circuit board, wherein the end portion of the terminal has an end face attached to the solder. The end face is bent in a direction away from the surface of the circuit board so as to be arranged on the outside, the end faces are connected in advance by a connecting portion, and the connecting portion is separated from the terminal after the soldering. It is characterized by where it comes to be.

The invention of claim 2 is characterized in that, in the invention of claim 1, the connecting portion also serves as a carrier for press-molding the terminal.
A third aspect of the invention is characterized in that, in the first or second aspect of the present invention, a cut is made in advance at the disconnection position of the connecting portion at the tip of the terminal.

  According to a fourth aspect of the present invention, there is provided the method according to any one of the first to third aspects, wherein the plurality of terminals are arranged in parallel in the width direction of the housing and arranged in a plurality of stages. The terminals arranged at positions overlapping each other are offset from each other in the width direction of the housing by the portions extending from the housing, and the end surfaces of the terminals of the terminals arranged in each step are connected by the connecting portion. It is characterized by being connected.

<Invention of Claim 1>
The plurality of terminals are soldered in a state where the end faces of the tip portions arranged on the outside of the solder are connected by the connecting portion, and the short-circuit state between the terminals is eliminated by separating the connecting portion from the end surface after the soldering. . Even if the housing is deformed due to heat or the like during soldering, the end faces of the terminals are connected to each other, so that their positions are difficult to shift and soldering defects are unlikely to occur.

<Invention of Claim 2>
Since the connection part which connects the end surfaces of a terminal serves as the carrier at the time of press-molding a terminal, compared with the case where it provides separately from a carrier, a yield is good.
<Invention of Claim 3>
Since the cutting position of the connecting portion at the tip of the terminal is cut in advance, the operation of cutting the connecting portion is easy.

<Invention of Claim 4>
Since the end faces of the tips of the terminals arranged in each stage are connected by a connecting part, the terminals in soldering are compared with the case where terminals arranged in multiple stages are connected only for each stage. They are less likely to be displaced from each other, and poor soldering is less likely to occur.

Embodiments of the present invention will be described below with reference to FIGS.
The board connector C of the present embodiment is configured as a male connector that can be fitted with a mating female connector (not shown), and is placed and fixed on the upper surface of the circuit board K as shown in FIG. And a plurality of terminals 20A and 20B which are held by the housing 10 and soldered to conductive paths (not shown) of the circuit board K. Hereinafter, in each component member, the fitting surface side (the right side in FIG. 1) with the mating connector will be referred to as the front, and the upper side will be referred to as the upper side and the lower side as the lower side.

  The housing 10 is made of a high heat-resistant resin, and includes a terminal holding portion 11 having a vertical wall shape that is long in the width direction, and a rectangular tube-shaped hood portion 12 protruding forward from the peripheral edge of the terminal holding portion 11. It has a horizontally long block shape as a whole.

  As shown in FIG. 2, the terminal holding part 11 is provided with a plurality of terminal insertion holes 13 into which the terminals 20A and 20B can be press-fitted from the rear. The plurality of terminal insertion holes 13 are juxtaposed in the width direction of the housing 10 and arranged in two stages in the height direction (vertical direction), and the upper terminal insertion holes 13 and the lower terminal insertion holes 13 overlap in the vertical direction. Arranged in position. The upper terminal insertion hole 13 is in parallel with a portion excluding a formation region of a lock protrusion 14 described later.

  A mating connector can be fitted into the hood portion 12, and a lock that can lock the mating connector lock arm as shown in FIG. The protrusion 14 protrudes downward (inward of the hood part 12). When the lock arm is engaged with the lock protrusion 14, the mating connector is held in a properly fitted state with respect to the board connector C. Further, guide ribs 15 are formed in the hood portion 12 along the front-rear direction so as to guide the mating connector fitting operation.

  On both side surfaces in the width direction of the housing 10, as shown in FIG. 3, mounting grooves 16 in which a fixing bracket 30 to be described later can be mounted are provided. Each mounting groove 16 is provided in a substantially central portion of the housing 10 in the front-rear direction, and is recessed inward from the outer surface.

  The fixing bracket 30 mounted in each mounting groove 16 is provided for soldering and mounting the housing 10 on the circuit board K. Each fixing bracket 30 is formed by punching a metal plate into a predetermined shape, and is mounted on the circuit board K after being bent at a right angle from the main body portion 31 disposed along both side surfaces of the hood portion 12 and its lower end. It is composed of a joint portion 32 that can be placed, and has a substantially L shape as a whole. The pair of fixing brackets 30 are positioned so that their respective lower surfaces (the lower surfaces of the joint portions 32) are arranged slightly below the lower surface of the housing 10, and are mounted in the mounting grooves 16, and both the joint portions 32 are connected to the circuit board K. Soldered to the upper surface of

  Each joint portion 32 is provided with three slits 33 and four solder entry holes 34 penetrating the joint portion 32 in the vertical direction (plate thickness direction). The slit 33 and the solder entry hole 34. The solder H is also attached to the inner peripheral surface of the solder, and the surface to which the solder H is attached is increased correspondingly, and the holding power to the circuit board K is improved. The solder H adhering to the joint portion 32 is not shown in the drawing.

  The terminal 20 held by the housing 10 is a male terminal formed by press-molding a metal plate as will be described later, and is inserted into each terminal insertion hole 13 as shown in FIG. The upper terminal 20A inserted in the upper terminal insertion hole 13 and the lower terminal 20B inserted in the lower terminal insertion hole 13 are arranged in parallel in the width direction of the housing 10 and divided into two upper and lower stages. It is arranged at the position that overlaps.

  As shown in FIG. 1, each terminal 20 </ b> A, 20 </ b> B has a configuration in which one end side projects forward from the terminal holding portion 11 and is arranged in the housing 10, and the other end side extends rearward from the terminal holding portion 11. ing. The end on the side protruding forward has a tab shape, and a female terminal (not shown) of the mating connector can be connected.

  On the other hand, the portions extending rearward from the terminal holding portion 11 are extended horizontally from the terminal holding portion 11 so as to extend rearward and then bent downward, and this portion 21A, 21B. The connecting portions 22A and 22B extending rearward from the lower ends of the extending portions 21A and 21B along the upper surface of the circuit board K, and the upper ends of the connecting portions 22A and 22B rise upward (in a direction away from the circuit board K). Rising parts 23A and 23B are provided. The connecting portions 22A and 22B and the rising portions 23A and 23B correspond to the tip portions of the terminals 20A and 20B in the present invention.

  The width of the portion extending backward from the terminal holding portion 11 is reduced to almost half that of the portion disposed in the housing 10. As shown in FIG. 2, the upper stage terminal 20A has a configuration in which an extension part 21A extends from a substantially right half part in the width direction of a part arranged in the housing 10 when viewed from the back, while the lower stage terminal 20B The extending portion 21 </ b> B extends from the substantially left half of the portion disposed in the housing 10 in the width direction. Thus, the extending portion 21A of the upper terminal 20A and the extending portion 21B of the lower terminal 20B are arranged so as to be offset from each other in the width direction without overlapping, and the connecting portion 22A of the upper terminal 20A and the connecting portion 22B of the lower terminal 20B Are aligned on the same plane and arranged in parallel in the width direction.

  As shown in FIG. 1, each connection portion 22 </ b> A, 22 </ b> B is slightly inclined downward from the front side to the rear side, and the lower surface position of the rear end portion is substantially the same position as the lower surface position of the joint portion 32 of the fixture 30. And located slightly below the lower surface of the housing 10. Each of the extending portions 21A and 21B has a shape that is further narrowed in the middle of the portion that hangs downward, and a sufficient interval is secured so that the connection portions 22A and 22B are not short-circuited (see FIG. 2).

  As shown in FIG. 1, each of the rising portions 23A and 23B is raised so as to be substantially perpendicular to the plate surface direction of the circuit board K, and is higher than the solder H attached around the connection portions 22A and 22B. The end surface 24 has a height dimension arranged on the upper side (outside). As shown in FIG. 2, all the rising portions 23 </ b> A and 23 </ b> B have substantially equal height dimensions, and when the board connector C is placed on the circuit board K, the end faces 24 are the upper surfaces of the circuit board K. Are arranged in a line at substantially the same height position separated by a predetermined dimension.

  The connection portions 22A and 22B are placed on and soldered to the solder H applied in advance on the upper surface of the circuit board K, and the terminals 20A and 20B are conductive paths (not shown) printed on the circuit board K. ). At this time, the solder H adheres from the lower surfaces of the connection portions 22A and 22B to the front, rear, left and right peripheral surfaces, and the leading ends of the rising portions 23A and 23B protrude upward from the solder H. In addition, since the lower surface and peripheral surface of each connection part 22A and 22B to which the solder H adheres are the surfaces where the plating process is performed, the adhesiveness with the solder H is high.

  Now, the upper terminal 20A and the lower terminal 20B are connected terminals R in which the end faces 24 of the rising parts 23A and 23B are connected by a connecting part 25 as shown in FIG. 4 until the soldering operation is completed. Yes. The connecting terminal R is formed by punching a metal plate and then bending it, and the surface is plated to improve the adhesion to the solder H.

  As shown in FIG. 4, the connecting portion 25 has a height dimension (dimension in the short direction) substantially the same as the rising dimension of each of the rising portions 23A and 23B, and has a long strip shape in the parallel direction of the terminals 20A and 20B. . All the upper terminal 20A and the lower terminal 20B in parallel are connected by one connecting part 25, and each rising part 23A, 23B is connected to the lower edge of the connecting part 25.

  The upper stage terminal 20 </ b> A and the lower stage terminal 20 </ b> B are arranged in a substantially parallel direction with a pitch that matches the arrangement of the terminal insertion holes 13, and can be inserted into the terminal insertion holes 13 in a lump. Further, since the upper terminal 20A and the lower terminal 20B are connected by the connecting portion 25, the positions of the terminals 20A and 20B are not easily displaced even by an impact caused by a collision or the like during a packing operation or a transportation operation.

  Furthermore, feed holes (not shown) for feeding out the connecting terminals R are formed in the connecting portion 25 at a constant pitch, and the connecting portion 25 also serves as a carrier during press working.

  And the cut | notch 26 is made | formed beforehand in the position used as the end surface 24 of each terminal 20A, 20B. This notch 26 is formed on the surface (front side surface) facing the housing 10 and is cut from the housing 10 side (front side) to the opposite side (rear side) to a thickness approximately half the plate thickness. The cross-sectional shape is a mountain shape (see FIG. 6).

Next, a mounting method of the above-described board connector C will be described.
In this mounting method, a soldering process of soldering the terminals 20A and 20B in a state where the end faces 24 of the rising parts 23A and 23B are connected by the connecting part 25, and the connecting part 25 is separated from the end face 24 after the soldering process. And a cutting process.

Hereinafter, this process will be described in order.
(1) Soldering process In each part where soldering is planned on the upper surface of the circuit board K (a part where the connecting parts 22A and 22B of the terminals 20A and 20B and the joint part 32 of the fixing bracket 30 are arranged) is previously provided. Solder H is applied. Then, while aligning the board connector C so that the connecting portions 22A and 22B of the upper terminal 20A and the lower terminal 20B and the joint portions 32 of the fixing brackets 30 are respectively placed on the solder H, the upper surface of the circuit board K is aligned. Put it on.

  Next, the circuit board K on which the board connector C is mounted is caused to run in a reflow furnace (not shown). Then, the solder H applied to the circuit board K is melted by the heat inside the reflow furnace, and the melted solder H is applied to the connection portions 22A and 22B of the terminals 20A and 20B and the joint portions 32 of the fixing brackets 30. Adhere to. Specifically, the melted solder H enters inside the solder entry hole 34 of each joint portion 32, and the solder H adheres to the lower surface and peripheral surface of the joint portion 32 and the inner surface of the solder entry hole 34. Further, as shown in FIG. 6, the melted solder H is bent from the lower surface of each connecting portion 22A, 22B to both side surfaces thereof, the bent surface (front surface) to the rising portions 23A, 23B and the extended portions 21A, 21B. It spreads along the surface (rear surface) and adheres to the peripheral surface of each connecting portion 22A, 22B. At this time, the solder H that spreads and adheres to the front surfaces of the connecting portions 22A and 22B does not reach the position of the notch 26 (the position that becomes the end surface 24 of the rising portions 23A and 23B), that is, the notch 26 is buried in the solder H. It will be in an exposed state.

  When the solder H is cooled and solidified, the connection portions 22A and 22B of the terminals 20A and 20B and the joint portions 32 of the fixing brackets 30 are fixed at predetermined positions on the circuit board K, respectively. Thus, the board connector C is placed and fixed on the circuit board K in a state where the terminals 20A and 20B are connected to the conductive path of the circuit board K in a conductive manner.

(2) Cutting process Next, the connection part 25 is cut off from the end surfaces 24 of the terminals 20A and 20B using a jig (not shown) provided with a cutting blade. Then, the short circuit state of each terminal 20 is eliminated, the end surfaces 24 of the rising portions 23A and 23B remain in a state of protruding from the solder H, and the board connector C is mounted on the circuit board K.

Next, the operation and effect of the present embodiment configured as described above will be described.
When the circuit board K on which the board connector C is placed passes through the reflow furnace, the housing 10 may thermally expand due to heat inside the reflow furnace. Then, due to the difference in thermal expansion between the housing 10 and the circuit board K, the housing 10 tends to warp and deform in a direction in which the vicinity of the central portion in the width direction of the housing 10 is away from the upper surface of the circuit board K. At this time, of the upper terminal 20A and the lower terminal 20B that are arranged in parallel in the width direction, a force that is lifted upward from the upper surface of the circuit board K acts particularly on the lower terminal 20B that is arranged near the center. When the lower terminal 20B arranged in the vicinity of the central portion tries to float upward, the end surface 24 of the rising portion 23B does not float more than the positions of the end surfaces 24 of the rising portions 23A and 23B arranged at both ends. It is restrained by the connecting portion 25 and is held without shifting its height position. This prevents the connection portions 22B of the lower terminal 20B disposed in the center portion in the width direction of the housing 10 from being lifted from the upper surface of the circuit board K during reflow soldering. Hard to occur.

  In particular, since the upper terminal 20A and the lower terminal 20B that are arranged in two stages are connected to each other by one connecting portion 25, compared to the case where they are connected separately in one stage, the soldering is more difficult. Misalignment between the terminals 20A and 20B is more reliably prevented.

In addition, since the cuts 26 are made in advance at the positions to be the end surfaces 24 of the rising portions 23A and 23B, the operation of separating the connecting portion 25 can be performed relatively easily.
In addition, since the connection part 25 which connects the end surfaces 24 of each rising part 23A, 23B serves also as the carrier at the time of a process, a yield is good.

  As described above, according to the present embodiment, the upper stage terminal 20A and the lower stage terminal 20B are in a state in which the end faces 24 of the rising parts 23A and 23B arranged on the upper side (outside) of the solder H are connected by the connecting part 25. By soldering and disconnecting the connecting portion 25 from the end face 24 after soldering, the short circuit state between the terminals 20A and 20B is eliminated. As a result, even if the housing 10 is deformed by heat or the like during soldering, the end faces 24 of the rising portions 23A and 23B are connected to each other, so that the positions of the connecting portions 22A and 22B are difficult to shift, and poor soldering occurs. Hard to occur.

  Further, the end face 24 that can be separated from the connecting portion 25 is a fractured surface that is not subjected to plating, and therefore has low adhesion to the solder. However, since this end surface 24 is arranged on the upper side (outside) of the solder H, the solder H adheres to the lower surface and the peripheral surface of each connection portion 22A, 22B subjected to the plating process. Adhesion with the connecting portions 22A and 22B is high, and soldering defects are less likely to occur.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.

  (1) In the above-described embodiment, the board connector C is placed on the upper surface of the circuit board K to which the solder H has been applied in advance and travels in the reflow furnace so that the board connector C is soldered. However, the method of soldering work can be arbitrarily changed in addition to the above-described embodiment. For example, the board connector is placed on the upper surface of the circuit board in advance without soldering, and soldering is performed. May be.

  (2) In the above-described embodiment, the portion extending backward from the terminal holding portion 11 has a shape that is bent downward from the terminal holding portion 11 after extending substantially rearward from the terminal holding portion 11. However, the shape of the terminal is not limited to this, and the shape of the terminal may be any shape as long as a portion that is disposed along the upper surface of the circuit board and is soldered is provided.

  (3) In the above embodiment, each of the rising portions 23A and 23B is raised so as to be substantially perpendicular to the plate surface direction of the circuit board K. However, the rising portion is not limited to this. As long as the tip is raised so as to reach a position where it is not buried in solder, it may be raised in any direction, for example, it is raised obliquely with respect to the board surface direction of the circuit board. Also good.

  (4) In the above embodiment, the cuts 26 are made in advance at the positions that become the end surfaces 24 of the rising portions 23A and 23B. However, such cuts 26 are not necessarily made, for example, The cut may not be provided, and a mark for determining the cutting position may be written instead of the cut.

  (5) In the said embodiment, although the connection part 25 serves as a carrier, you may make it provide a carrier separately from a connection part.

  (6) In the above embodiment, the upper terminal 20A and the lower terminal 20B are connected to each other by the one connecting portion 25. However, the present invention is not limited to this. For example, the upper terminal and the lower terminal are connected separately. It may be. Further, as in the above-described embodiment, it is not necessary to connect all of the terminals 20A and 20B arranged in parallel with one connecting portion 25. For example, the terminals 20A and 20B may be connected separately on the left side and the right side.

Side sectional view which shows the state in which the board | substrate connector in this embodiment is mounted in the circuit board Rear view of board connector Bottom view of board connector Rear view of board connector before disconnecting the connecting part Top view of the board connector before disconnecting the connecting part Side sectional view showing a state in which the board connector before being cut off from the connecting portion is placed and fixed on the circuit board

Explanation of symbols

C: Board connector K ... Circuit board 10 ... Housing 20 ... Terminal 20A ... Upper terminal 20B ... Lower terminal 22A, 22B ... Connection (tip)
23A, 23B ... Rise (tip)
24 ... End face 25 ... Connecting part 26 ... Incision

Claims (4)

A housing and a portion extending from the housing so that a tip portion thereof is arranged along the surface of the circuit board, and a portion arranged along the surface of the circuit board is soldered to a conductive path of the circuit board. A board connector comprising a plurality of terminals,
The front end portion of the terminal has a shape bent in a direction away from the surface of the circuit board so that the end surface is arranged outside the attached solder, and the end surfaces are connected by a connecting portion. A board connector which is connected in advance and is separated from the terminal after the soldering. The board connector according to claim 1, wherein the connecting portion also serves as a carrier for press-molding the terminal. The board connector according to claim 1, wherein a cut is made in advance at a disconnection position of the connecting portion at a tip portion of the terminal. The plurality of terminals are arranged in parallel in the width direction of the housing and divided into a plurality of stages,
The terminals arranged at positions overlapping in the vertical direction are offset from each other in the width direction of the housing, and the end surfaces of the tip portions of the terminals arranged in each stage are connected to each other. The board connector according to claim 1, wherein the board connector is connected by a portion.

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