JP2008004341A - Manufacturing method of cabling material, manufacturing method of connection structure of cabling material, and connection structure of cabling material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of cabling material, a manufacturing method of a connection structure of the cabling material and the connection structure of the cabling material, which are all capable of improving a connection reliability between a conductor of the cabling material and a connection terminal formed on a member to be connected of a circuit board or the like when connecting the conductor to the connection terminal. <P>SOLUTION: The extra-fine coaxial cable 2 has the center conductor 3 which is electrically connected to the connection terminal 22 of the circuit board 9 via adhesive 11 containing conductive material. Before connecting the center conductor 3 to the connection terminal 22, the center conductor 3 is previously deformed in a bent shape that is the same as the shape after the center conductor 3 is connected to the connection terminal 22. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a wiring material having a conductor connected to a connection terminal of a connected member such as a circuit board, a method for manufacturing a wiring material connection structure in which the conductor is connected to a connection terminal, and connection of the wiring material Concerning structure.

  In recent years, in the field of electronic devices, for example, notebook computers, mobile phones, and the like have been widely used, and electronic devices have been required to be smaller and lighter. Therefore, for example, an extremely thin coaxial cable is used for connection between the device main body and the liquid crystal display unit, wiring in the device, and the like, and wiring is performed in the form of a multi-core cable in which these ultrafine coaxial cables are integrated together. It is like that.

For example, when connecting a micro coaxial cable to a connected member such as a circuit board, it is necessary to connect the central conductor of the micro coaxial cable to a connection terminal formed on the connected member. Here, a technique for connecting conductors with a conductive adhesive has been disclosed. More specifically, for example, a fine conductor having a center conductor, an insulator covering the outer periphery of the center conductor, an outer conductor covering the outer periphery of the insulator, and a jacket layer covering the outer periphery of the outer conductor. In a multi-core cable having a plurality of coaxial cables, first, the exposed central conductor is flattened flat, formed into a flat shape in cross-section, and subjected to heat and pressure treatment, through a conductive adhesive. A conductor connection structure for connecting the central conductor to a signal electrode which is a connection terminal having a predetermined pitch formed on a circuit board is disclosed (for example, see Patent Document 1).
JP 2005-63878 A

  Here, in Patent Document 1, the lower surface of the pressure-bonding member used when performing the heating and pressurizing process includes a first contact surface that contacts the ground bar, and a second contact surface that contacts the central conductor. have. And using the said crimping | compression-bonding member, when pressing a center conductor toward the connection terminal and connecting a center conductor and a connection terminal via a conductive adhesive, a center conductor is the above-mentioned 1st contact. The surface is deformed by a step between the surface and the second contact surface. However, when the center conductor is connected to the connection terminal, the method of simultaneously performing deformation (that is, bending) of the center conductor by heat and pressure treatment causes elastic strain to accumulate in the center conductor, and the center conductor-connection terminal. After the connection, a residual stress corresponding to the elastic strain described above is generated at the boundary between the central conductor and the conductive adhesive. Therefore, due to the residual stress, a force acts in the direction in which the conductive adhesive is peeled off, so that the adhesive strength between the central conductor and the adhesive is reduced. As a result, the connection between the central conductor and the connection terminal is reduced. There was a problem that reliability decreased.

  Therefore, the present invention has been made in view of the above problems, and when connecting a conductor of a wiring material to a connection terminal formed on a connected member such as a circuit board, the connection between the conductor and the connection terminal is made. It is an object of the present invention to provide a wiring material manufacturing method, a wiring material connection structure manufacturing method, and a wiring material connection structure capable of improving reliability.

  In order to achieve the above object, the invention according to claim 1 is a method of manufacturing a wiring material having a conductor connected to a connection terminal of a connected member, before connecting the conductor and the connection terminal, the conductor, It is characterized by being deformed into a bent shape when the conductor and the connection terminal are connected.

  According to this configuration, for example, when connecting a conductor to a connection terminal via a conductive adhesive, it is possible to effectively reduce the elastic strain accumulated in the conductor, between the conductor and the connection terminal. After the connection, the residual stress of the conductor at the boundary between the conductor and the adhesive can be effectively reduced. Therefore, since the force acting in the direction of peeling of the adhesive due to the residual stress is reduced, the adhesive strength between the conductor and the adhesive is improved, and the peeling of the adhesive at the boundary between the conductor and the adhesive is effective. Can be prevented. As a result, the connection reliability between the conductor and the connection terminal can be improved. Further, it is possible to effectively prevent the conductor from being damaged due to the elastic strain.

  Invention of Claim 2 is a manufacturing method of the connection structure of the wiring material with which the conductor connected to the connection terminal of the to-be-connected member of the wiring material which has a conductor, Comprising: A conductor is previously connected with a conductor and a connection terminal. It is deformed while aligning the deformed conductor and the connection terminal, the step of deforming into a bent shape at the time of connection, the step of placing a conductive adhesive containing a conductive material on the connection terminal, and the deformed conductor and the connection terminal. A step of interposing a conductive adhesive between the conductive conductor and the connection terminal, and a step of electrically connecting the deformed conductor and the connection terminal via the conductive adhesive by performing a heat and pressure treatment It is characterized by including.

  According to this configuration, it is possible to effectively reduce the elastic strain accumulated in the conductor when the conductor is connected to the connection terminal via the conductive adhesive, and the connection between the conductor and the connection terminal can be reduced. Later, the residual stress of the conductor at the boundary between the conductor and the adhesive can be effectively reduced. Therefore, since the force acting in the direction of peeling of the adhesive due to the residual stress is reduced, the adhesive strength between the conductor and the adhesive is improved, and the peeling of the adhesive at the boundary between the conductor and the adhesive is effective. Can be prevented. As a result, the connection reliability between the conductor and the connection terminal can be improved. Further, it is possible to effectively prevent the conductor from being damaged due to the elastic strain.

  Invention of Claim 3 is a manufacturing method of the connection structure of the wiring material of Claim 2, Comprising: When deform | transforming a conductor, in the state which arranged the several wiring material in parallel, several wiring material The height of the portion connected to the connection terminal of each conductor is substantially the same.

  According to the configuration, the heat and pressure treatment can further effectively reduce the elastic strain accumulated in the conductor when the conductor is connected to the connection terminal via the conductive adhesive, After the connection between the conductor and the connection terminal, the residual stress of the conductor at the boundary between the conductor and the adhesive can be further effectively reduced. Therefore, the connection reliability between the conductor and the connection terminal can be further improved.

  Invention of Claim 4 is a manufacturing method of the connection structure of the wiring material of Claim 2 or Claim 3, Comprising: The process of making the part connected to a connection terminal of a conductor into a planar shape further It is characterized by including.

  According to this configuration, when the conductor is connected to the connection terminal via the conductive adhesive containing conductive fine particles, the contact area between the conductor and the surface of the adhesive can be increased. The adhesive strength between adhesives can be further improved. In addition, when connecting the conductor and the connection terminal, it becomes possible to easily bite the conductive substance contained in the conductive adhesive between the conductor and the connection terminal. Can be further improved.

  Invention of Claim 5 is a manufacturing method of the connection structure of the wiring material of Claim 4, Comprising: When changing a conductor into the bending shape at the time of connection of a conductor and a connection terminal, connection of a conductor A portion connected to the terminal is planar. According to this configuration, the conductor can be deformed and planarized at the same time, so that the manufacturing process of the wiring material connection structure is simplified.

  The invention described in claim 6 is a wiring member connection structure manufactured by the manufacturing method according to any one of claims 2 to 5. According to this configuration, it is possible to obtain a wiring material connection structure having the same effect as that of the wiring material connection structure manufacturing method according to any one of claims 2 to 5.

  ADVANTAGE OF THE INVENTION According to this invention, when connecting the conductor of a wiring material to the connection terminal of a to-be-connected member, it becomes possible to improve the connection reliability of a conductor and a connection terminal.

(First embodiment)
Hereinafter, a preferred embodiment of the present invention will be described. FIG. 1 is a top view for explaining a connection structure of wiring members manufactured by the method of manufacturing a wiring member according to the first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA in FIG. It is. Moreover, FIG. 3 is sectional drawing for demonstrating the micro coaxial cable in the 1st Embodiment of this invention. In the present embodiment, as the connection structure of the wiring material, the connection structure of the wiring material when the central conductor of the micro coaxial cable that is the wiring material is connected to the connection terminal formed on the circuit board is taken as an example. explain.

  As shown in FIG. 1, the multi-core cable 1 includes a plurality of micro coaxial cables 2 (four in the present embodiment), and the micro coaxial cables 2 are arranged at a predetermined pitch (for example, 0.3 mm). (Narrow pitch) and arranged in parallel and bundled. Further, as shown in FIGS. 1 to 3, the micro coaxial cable 2 includes a center conductor 3 having an outer diameter of 0.060 mm, and an insulator 4 having an outer diameter of 0.16 mm that covers the outer periphery of the center conductor 3. The outer conductor (or horizontal winding shield) 5 covering the outer periphery of the insulator 4 and the jacket layer 6 having an outer diameter of 0.26 mm covering the outer periphery of the outer conductor 5. It is configured. Further, as shown in FIG. 3, the center conductor 3 is formed by a stranded wire obtained by twisting a plurality of thin wires 40 (seven in the present embodiment). The central conductor 3 may be formed by a single wire (that is, one conducting wire). Moreover, the outer diameter of the center conductor 3 is preferably 0.01 mm to 2 mm.

  In addition, as shown in FIG. 2, a part of the outer conductor 5 is removed by removing a jacket layer 6 having a predetermined length at each end of a plurality of micro coaxial cables 2 constituting the multi-core cable 1. Is exposed. Further, the outer conductor 5 exposed at each end of the plurality of micro coaxial cables 2 is brought into contact with, for example, a rotating brush to loosen and loosen the winding of the outer conductor 5, and the loosened outer conductor 5 is removed. By pulling and removing a part thereof, the insulator 4 is exposed. Further, a part of the central conductor 3 is exposed by removing a part of the exposed insulator 4.

  As shown in FIGS. 1 and 2, the external conductor 5 exposed at the end 20 of each micro coaxial cable 2 is connected to a ground bar 7 for grounding the external conductor 5. More specifically, as shown in FIG. 2, the outer conductor 5 and the ground bar 7 are connected by sandwiching the outer conductor 5 with the ground bar 7 from above and below via the adhesive 8. ing.

  The ground bar 7 is formed by processing a metal plate (for example, a metal foil). The ground bar 7 mechanically fixes each of the fine coaxial cables 2 and obtains conduction with the external conductor 5. Further, as shown in FIG. 1, the ground bar 7 is integrally formed along the arrangement direction of the plurality of micro coaxial cables 2 (direction of the arrow X in the figure), and a plurality of ground bars 7 are provided on the ground bar 7. By connecting the two extra fine coaxial cables 2, the outer conductors 5 of the extra fine coaxial cable 2 are collectively grounded.

  In addition, it is preferable to use a conductive adhesive for the adhesive 8 that connects the outer conductor 5 and the ground bar 7. As the conductive adhesive, for example, an insulating thermosetting resin such as an epoxy resin as a main component and a conductive substance dispersed in the resin can be used. For example, an epoxy resin in which a powder of a conductive substance such as copper, silver, or graphite is dispersed can be used. By using such a conductive adhesive, the outer conductor 5 and the ground bar 7 of each micro coaxial cable 2 can be conductively connected at a time. Therefore, the connection structure between each micro coaxial cable 2 and the ground bar 7 is simplified and the connection work is facilitated.

  Further, as shown in FIG. 1, a conductor pattern portion having a connection terminal 22 which is a connection portion with the exposed central conductor 3 is provided on a circuit board 9 which is a connected member to which the micro coaxial cable 2 is connected. (Or a circuit pattern portion) 10 is formed. The connection terminals 22 are made of, for example, a conductive metal such as copper, and are provided at intervals of, for example, 0.3 mm, corresponding to the narrow pitch of the micro coaxial cable 2 described above.

  As shown in FIG. 2, the central conductor 3 and the connection terminal 22 are electrically connected via the adhesive 11. As the adhesive 11 that connects the central conductor 3 and the connection terminal 22, for example, an insulating thermosetting resin is a main component, and powder of a conductive material such as copper, silver, or graphite is dispersed in the resin. A conductive adhesive can be used. By using such a conductive adhesive, it becomes possible to connect between the center conductor 3 and the connection terminal 22 with a low conductive resistance, so that the conductivity between the center conductor 3 and the connection terminal 22 is improved. Can do.

  Although there is no restriction | limiting in particular in the thermosetting resin used for this adhesive agent 11, The adhesive agent 11 excellent in heat resistance and adhesive force can be produced by using an epoxy resin as a thermosetting resin. It becomes possible. As this epoxy resin, for example, bisphenol A type, F type, S type, or AD type epoxy resin, naphthalene type epoxy resin, novolak type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, etc. are used. can do. A phenoxy resin that is a high molecular weight epoxy resin can also be used.

  Further, an anisotropic conductive adhesive containing a conductive substance can be used for the adhesive 11. More specifically, as the anisotropic conductive adhesive, for example, an insulating thermosetting resin such as the above-described epoxy resin is a main component, and fine particles (for example, spherical metal fine particles) are contained in the resin. Or metal particles made of spherical resin particles plated with metal), in which a conductive substance having a so-called large aspect ratio, such as a linearly connected shape or a needle shape, is used. can do. Note that the aspect ratio here refers to the ratio of the short diameter of the conductive material (the length of the cross section of the conductive material) to the long diameter (the length of the conductive material).

  Further, the metal fine particles used in the present invention preferably include a ferromagnetic material in part, such as a single metal having ferromagnetism, two or more kinds of alloys having ferromagnetism, a metal having ferromagnetism, and the like. It is preferably any one of an alloy with the above metal and a composite containing a metal having ferromagnetism. This is because the use of a ferromagnetic metal makes it possible to orient the conductive material using a magnetic field due to the magnetism of the metal itself. For example, nickel, iron, cobalt, and two or more kinds of alloys thereof can be used.

  Further, it is preferable that the conductive material has an aspect ratio of 10 or more. By using such a conductive substance, when an anisotropic conductive adhesive is used as the adhesive 11, the contact probability between the conductive substances is increased. Accordingly, the central conductor 3 and the connection terminal 22 can be connected without increasing the blending amount of the conductive substance.

  The aspect ratio of the conductive material is directly measured by a method such as observation with a CCD microscope. In the case of a conductive material whose cross section is not a circle, the aspect ratio is obtained by setting the maximum length of the cross section as the minor axis. Further, the conductive material does not necessarily have a straight shape, and can be used without any problem even if there is some bending or branching. In this case, the aspect ratio is obtained with the maximum length of the conductive material as the major axis.

  Moreover, it is desirable that the minor axis of the conductive substance is 1 μm or less. By using such a conductive material, when an anisotropic conductive adhesive is used as the adhesive 11, the contact probability between the conductive materials is further increased. Thus, the center conductor 3 and the connection terminal 22 can be connected.

  As shown in FIG. 2, the circuit board 9 is provided with a grounding portion 12, and the ground bar 7 to which each micro coaxial cable 2 is connected is in contact with the grounding portion 12. . More specifically, the external conductor 5 of each micro coaxial cable 2 is connected to the ground by connecting the ground bar 7 connected to the external conductor 5 to the grounding portion 12 provided on the circuit board 9 by soldering. It is configured to be electrically connected to the grounding portion 12 of the circuit board 9 through the bar 7 and to connect the external conductor 5 to the ground.

  As described above, the ground bar 7 to which the outer conductor 5 of the micro coaxial cable 2 constituting the multi-core cable 1 is connected is connected to the ground portion 12 of the circuit board 9, and the central conductor 3 is connected to the conductor pattern portion of the circuit board 9. By connecting to 10 connection terminals 22, the connection structure 50 of the micro coaxial cable shown in FIGS. 1 and 2 is formed.

  Here, in this embodiment, before connecting the center conductor 3 of the micro coaxial cable 2 to the conductor pattern portion 10 of the circuit board 9, the center conductor 3 is connected to the connection terminal 22. Is characterized in that it is deformed in advance. With such a configuration, when the center conductor 3 is connected to the connection terminal 22 of the conductor pattern portion 10, unlike the conventional technique in which the center conductor is bent at the same time by heat and pressure treatment, the center conductor 3 is connected to the circuit. When connecting to the connection terminal 22 of the substrate 9, there is no need to bend the central conductor. Accordingly, the elastic strain accumulated in the center conductor 3 can be effectively reduced when the center conductor 3 is connected to the connection terminal 22 by the heat and pressure treatment. Then, after the connection between the central conductor 3 and the connection terminal 22, the residual stress of the central conductor 3 acting in the direction in which the adhesive 11 peels at the boundary between the central conductor 3 and the adhesive 11 (that is, the reaction based on the elastic strain). Force) can be effectively reduced.

  In addition, the processing method of the center conductor 3 having the above-described bent shape is not particularly limited, and any method can be used as long as the center conductor 3 can be deformed into a bent shape in a state where the center conductor 3 is connected to the connection terminal 22. But it ’s okay. For example, as shown in FIG. 4, a roller 30, a transport table 31 for transporting the roller 30, a mounting table 38 for mounting the micro coaxial cable 2, and a roller provided on the mounting table 38 32 and 33 are prepared. First, the micro coaxial cable 2 having the central conductor 3 is placed on the placement surface 34 of the placement table 38, and the transport table 31 is placed on the placement table 38 shown in FIG. Next, in FIG. 4, the roller 30 at the position indicated by the broken line is conveyed in the direction of arrow Y in the drawing on the conveyance surface 35 of the conveyance table 31. Then, the roller 30 comes into contact with the center conductor 3, the center conductor 3 is pressed by the roller 30, and the center conductor 3 is sandwiched between the roller 30 and the roller 32 and between the roller 30 and the roller 33, As shown in FIG. 4, the center conductor 3 can be deformed into a bent shape in a state where the center conductor 3 is connected to the connection terminal 22.

  At this time, as shown in FIG. 5, the processing method described in FIG. 4 is used in a state where a plurality of micro coaxial cables 2 are placed in parallel on the placement surface 34 of the placement table 38. By doing so, the height of the part 3a connected to the connection terminal 22 of the central conductor 3 of each of the plurality of micro coaxial cables 2 can be made substantially the same.

  Next, the manufacturing method of the connection structure of the wiring material in this embodiment is demonstrated. First, each of the plurality of micro coaxial cables 2 constituting the multi-core cable 1 is cut in a lump to have a predetermined length. Next, the jacket layer 6 having a predetermined length is cut at each end 20 of the plurality of micro coaxial cables 2. Next, the outer conductor 5 having a predetermined length is cut, and the cut jacket layer 6 and the outer conductor 5 are removed. Next, the adhesive 8 is temporarily bonded to the ground bar 7, and the exposed external conductor 5 is sandwiched from above and below by the ground bar 7 to which the adhesive 8 is temporarily bonded, and the adhesive 8 is attached to the exposed surface of the external conductor 5. Paste. Then, the external conductor 5 and the ground bar 7 are connected via the adhesive 8 by performing heat and pressure treatment.

  Next, at each end portion 20 of the plurality of micro coaxial cables 2, the outer conductor 5 on the tip side (that is, the arrow W side in FIGS. 1 and 2) from the portion where the ground bar 7 is connected, for example, A rotating brush or the like is brought into contact to loosen and loosen the winding of the outer conductor 5, and the loosened outer conductor 5 is pulled to remove a part thereof, thereby exposing the insulator 4. Next, the central conductor 3 is exposed at the end portion 20 by removing a part of the insulator 4. Next, the center conductor 3 is processed by the above-described method, and the center conductor 3 is deformed in advance into a bent shape in a state where the center conductor 3 is connected to the conductor pattern portion 10 as shown in FIG.

  Next, the ground bar 7 to which the external conductor 5 is connected is connected to a grounding portion 12 provided on the circuit board 9 by soldering or conductive adhesive, thereby forming each micro coaxial cable constituting the multi-core cable 1. With respect to the cable 2, the external conductor 5 is grounded to the ground portion 12. In addition, when connecting with a conductive adhesive, the ground bar 7 and the grounding part 12 are connected through a conductive adhesive by performing a heating and pressurizing process.

  Then, the adhesive 11 (for example, a conductive adhesive in which the above-described conductive substance powder is dispersed) is placed on the connection terminal 22 of the conductor pattern portion 10, and the processed center conductor 3 and connection terminal 22 are processed. The adhesive 11 is interposed between the connection terminal 22 and the portion 3 a of the center conductor 3 connected to the connection terminal 22. Next, a heated crimping member (not shown) is placed above the center conductor 3. Then, the crimping member is brought into contact with the center conductor 3 and the crimping member is moved to perform a heat and pressure treatment. Then, as shown in FIG. 6, the portion 3 a of the center conductor 3 connected to the connection terminal 22 comes into contact with the surface 11 a of the adhesive 11, and the center conductor 3 and the connection terminal 22 through the adhesive 11. Are electrically connected to each other to ensure conduction between the central conductor 3 and the connection terminal 22. In this case, since the adhesive 11 is mainly composed of a thermosetting resin, the adhesive 11 softens once when heated at the curing temperature of the thermosetting resin, but the heating is continued. By doing so, it will be cured. And when the preset hardening time passes, the heating state by a crimping | compression-bonding member will be cancelled | released, the maintenance state of the hardening temperature of a thermosetting resin will be open | released, and it will be the structure which starts cooling.

According to the present embodiment described above, the following effects can be obtained.
(1) In this embodiment, before connecting the center conductor 3 of the micro coaxial cable 2 to the connection terminal 22 of the circuit board 9, the center conductor 3 is bent when the center conductor 3 and the connection terminal 22 are connected. In addition, it is configured to be deformed in advance. Accordingly, when the center conductor 3 is connected to the connection terminal 22, it is possible to effectively reduce the elastic strain accumulated in the center conductor 3, and after the connection between the center conductor 3 and the connection terminal 22, The residual stress of the center conductor 3 at the boundary between the conductor 3 and the adhesive 11 can be effectively reduced. Accordingly, since the force acting in the direction in which the adhesive 11 peels due to the residual stress is reduced, the adhesive strength between the central conductor 3 and the adhesive 11 is improved, and the boundary between the central conductor 3 and the adhesive 11 is improved. Since peeling of the adhesive 11 can be effectively prevented, the connection reliability between the center conductor 3 and the connection terminal 22 can be improved. Moreover, damage to the central conductor 3 due to elastic strain can be effectively prevented.

  (2) In the present embodiment, the height of the portion 3a connected to the connection terminal 22 of the central conductor 3 of each of the plurality of micro coaxial cables 2 is set in a state where the plurality of micro coaxial cables 2 are arranged in parallel. The configuration is substantially the same. Therefore, when the center conductor 3 is connected to the connection terminal 22 by the heat and pressure treatment, the elastic strain accumulated in the center conductor 3 can be further effectively reduced, and the center conductor 3-connection terminal 22 is also reduced. After the connection between them, the residual stress of the center conductor 3 at the boundary between the center conductor 3 and the adhesive 11 can be more effectively reduced. Therefore, the connection reliability between the center conductor 3 and the connection terminal 22 can be further improved.

(Second Embodiment)
Next, a second embodiment of the present invention will be described. FIG. 7 is a cross-sectional view for explaining a connection structure of wiring members manufactured by the wiring material manufacturing method according to the second embodiment of the present invention. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted. Also in the present embodiment, the connection structure of the wiring material when connecting the central conductor of the micro coaxial cable, which is the wiring material, to the connection terminal of the conductor pattern portion formed on the circuit board as the connection structure of the wiring material. An example will be described. The overall configuration of the multi-core cable is the same as that of the first embodiment described above, and therefore detailed description thereof is omitted here.

  In the present embodiment, as shown in FIG. 7, each of the conductors 3 has a substantially square cross section, and is connected to the connection terminal 22 of the conductor pattern portion 10 of each of the plurality of center conductors 3. The portion 3a is configured to have a planar shape. By using the center conductor 3 having such a planar shape, the connection structure between the center conductor 3 and the connection terminal 22 is compared with the case where the center conductor 3 having a substantially circular cross section shown in FIG. 6 is used. And it becomes possible to increase the contact area of the part 3a of each center conductor 3 connected to the connection terminal 22, and the surface 11a of the adhesive agent 11.

  Further, as the processing method of the central conductor 3 in the present embodiment, for example, the same method as that described in FIG. 4 in the first embodiment described above can be used. As shown in FIG. 8, instead of the roller 33 described above, by using a molding member 36 having a flat contact surface 41 with the center conductor 3, a portion of the center conductor 3 connected to the connection terminal 22. 3a can be a planar shape. Moreover, the deformation | transformation process (namely, bending process) and planarization of the center conductor 3 can be performed simultaneously by such a method.

  In the method described above with reference to FIG. 4, as shown in FIG. 9, a roller 33 having a groove 37 for molding is used, the central conductor 3 is pressed by the roller 30, and the central conductor 3 is The portion 3a of the central conductor 3 connected to the connection terminal 22 of the conductor pattern portion 10 may be formed into a planar shape by the groove portion 37 when being sandwiched between the roller 30 and the roller 33 to be deformed. FIG. 9 is a view when the center conductor 3 is pressed by the roller 30 and the center conductor 3 is sandwiched between the roller 30 and the roller 33 in which the groove portion 37 is formed and deformed. It is the figure seen from the direction of the arrow Z to show.

  Also in this case, as in the case described with reference to FIG. 5 described above, a plurality of micro coaxial cables 2 are placed in parallel on the mounting surface 34 of the mounting table 38, and a plurality of micro coaxial cables are placed. The height of the portion 3a connected to the connection terminal 22 of each central conductor 3 of the cable 2 can be made substantially the same.

  Next, the manufacturing method of the connection structure of the wiring material in this embodiment is demonstrated. First, as in the first embodiment described above, the external conductor 5 and the ground bar 7 are connected. Next, the central conductor 3 is exposed at the end portion 20 by removing a part of the insulator 4. Next, the center conductor 3 is processed by the above-described method, and the center conductor 3 is deformed in advance into a shape in a state where the center conductor 3 is connected to the connection terminal 22, and at the connection terminal 22 of the center conductor 3. The connected portion 3a is formed into a planar shape. Next, as in the first embodiment described above, the ground bar 7 to which the external conductor 5 is connected is connected to the ground portion 12 provided on the circuit board 9.

  Then, the adhesive 11 (for example, a conductive adhesive in which the above-described conductive substance powder is dispersed) is placed on the connection terminal 22 of the conductor pattern portion 10, and the processed center conductor 3 and connection terminal 22 are processed. The adhesive 11 is interposed between the connection terminal 22 and the portion 3 a of the center conductor 3 connected to the connection terminal 22. Next, the heated crimp member is placed above the center conductor 3. And while making a crimping | compression-bonding member contact the center conductor 3, the said crimping | compression-bonding member is moved and a heat press process is performed. Then, as shown in FIG. 7, the portion 3 a of the central conductor 3 connected to the connection terminal 22 comes into contact with the surface 11 a of the adhesive 11, and the central conductor 3 and the connection terminal 22 through the adhesive 11. Are electrically connected to each other to ensure conduction between the central conductor 3 and the connection terminal 22.

According to the present embodiment described above, the following effects can be obtained in addition to the effects (1) to (2) described in the first embodiment.
(3) In this embodiment, when manufacturing the micro coaxial cable 2, the part 3a of the center conductor 3 connected to the connection terminal 22 is made into a planar shape. Therefore, since the contact area between the center conductor 3 and the surface 11a of the adhesive 11 can be increased, the adhesive strength between the center conductor 3 and the adhesive 11 can be further improved. Further, when connecting the central conductor 3 and the connection terminal 22, it is easy to bite a conductive substance contained in the conductive adhesive used as the adhesive 11 between the central conductor 3 and the connection terminal 22. Therefore, the connection reliability between the center conductor 3 and the connection terminal 22 can be further improved.

  (4) In this embodiment, when the center conductor 3 is deformed into a bent shape when the center conductor 3 and the connection terminal 22 are connected, the portion 3a of the center conductor 3 connected to the connection terminal 22 is planar. The configuration is a shape. Therefore, the deformation process and planarization of the center conductor 3 can be performed at the same time, so that the manufacturing process of the micro coaxial cable 2 and the connection structure 50 of the micro coaxial cable 2 is simplified.

In addition, you may change the said embodiment as follows.
In the second embodiment described above, the central conductor 3 having a substantially rectangular cross section has been described as an example. However, the cross sectional shape of the central conductor 3 is not limited to this, and is connected to the connection terminal 22. As long as the portion 3a has a planar shape, it may have any cross-sectional shape. For example, the central conductor 3 can be processed into a substantially triangular cross section.

  -Moreover, it is good also as a structure in which the adhesive agent 11 contains a latent hardener. As this latent curing agent, for example, a curing agent that is excellent in storage stability at a low temperature and hardly undergoes a curing reaction at room temperature, but that rapidly performs a curing reaction by heat or light can be used. More specifically, for example, imidazole series, hydrazide series, boron trifluoride-amine complex, amine imide, polyamine series, tertiary amine, alkyl urea series and other amine series, dicyandiamide series, and modified products thereof These may be used alone or as a mixture of two or more.

  Examples of utilization of the present invention include a method for manufacturing a wiring material having a conductor connected to a connection terminal of a connected member such as a circuit board, a method for manufacturing a connection structure of a wiring material in which a conductor is connected to a connection terminal, and wiring Examples include a connection structure of materials.

It is a top view for demonstrating the connection structure of the wiring material manufactured by the manufacturing method of the wiring material which concerns on the 1st Embodiment of this invention. It is AA sectional drawing of FIG. It is sectional drawing for demonstrating the micro coaxial cable which is a wiring material in the 1st Embodiment of this invention. It is a fragmentary sectional view for demonstrating the manufacturing method of the wiring material which concerns on the 1st Embodiment of this invention. It is a top view for demonstrating the manufacturing method of the wiring material which concerns on the 1st Embodiment of this invention. It is BB sectional drawing of FIG. It is sectional drawing for demonstrating the connection structure of the wiring material manufactured by the manufacturing method of the wiring material which concerns on the 2nd Embodiment of this invention. It is a fragmentary sectional view for demonstrating the manufacturing method of the wiring material which concerns on the 2nd Embodiment of this invention. It is a figure for demonstrating the modification of the planar processing of the center conductor in the manufacturing method of the wiring material which concerns on the 2nd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Multi-core cable, 2 ... Micro coaxial cable, 3 ... Center conductor, 3a ... Port part of center conductor connected to connection terminal, 4 ... Insulator, 5 ... External conductor, 6 ... Jacket layer, 9 ... Circuit board DESCRIPTION OF SYMBOLS 10 ... Conductive pattern part, 11 ... Adhesive (conductive adhesive), 11a ... The surface of the adhesive on which a conductor is mounted, 22 ... Connection terminal, 30 ... Roller, 31 ... Conveyance stand, 32 ... Roller, 33 ... Roller, 36 ... Molding member, 37 ... Groove, 50 ... Connection structure of extra fine coaxial cable

Claims (6)

In the method of manufacturing a wiring material having a conductor connected to the connection terminal of the connected member,
Before connecting the said conductor and the said connection terminal, the said conductor is deform | transformed into the bending shape at the time of the connection of the said conductor and the said connection terminal, The manufacturing method of the wiring material characterized by the above-mentioned. A wiring material having a conductor, wherein the conductor is connected to a connection terminal of a member to be connected.
Transforming the conductor in advance into a bent shape when the conductor and the connection terminal are connected;
Placing a conductive adhesive containing a conductive substance on the connection terminal;
Interposing the conductive adhesive between the deformed conductor and the connection terminal while aligning the deformed conductor and the connection terminal;
A method of manufacturing a connection structure for a wiring material, comprising a step of electrically connecting the deformed conductor and the connection terminal via the conductive adhesive by performing a heat and pressure treatment .   When deforming the conductor, with the plurality of wiring members arranged in parallel, the height of the portion of each of the plurality of wiring members connected to the connection terminal is made substantially the same. The manufacturing method of the connection structure of the wiring material according to claim 2.   4. The method for manufacturing a wiring material connection structure according to claim 2, further comprising a step of making a portion of the conductor connected to the connection terminal into a planar shape.   5. The portion of the conductor connected to the connection terminal is formed into the planar shape when the conductor is deformed into a bent shape when the conductor and the connection terminal are connected. Method for connecting a wiring material of the present invention.   A wiring material connection structure manufactured by the manufacturing method according to claim 2.

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