JP4816480B2 - Harness manufacturing method - Google Patents

Description

  The present invention relates to a harness and a method for manufacturing the harness, for example, a harness and a method for manufacturing the harness in which a plurality of coaxial wires having different shield diameters are shielded.

  In recent years, in the field of electronic devices, for example, notebook computers and mobile phones have been widely used, so that these information communication devices have been required to be reduced in size and weight. Therefore, harnesses are used for connection between the device main body and the liquid crystal display unit, wiring in the device, and the like. As shown in FIG. 6, the harness 200 is disposed on the outer periphery side of the core wire 211, the insulator 212 disposed on the outer periphery side of the core wire 211, the shield 213 disposed on the outer periphery side of the insulator 212, and the shield 213. A plurality of coaxial lines 210 having an outer sheath 214 to be provided. FIG. 6 is a schematic perspective view showing a conventional harness.

  The harness 200 is wired in a narrow space, and matching of characteristic impedance with high accuracy is required. In order to meet such a requirement, the shield 213 must be securely grounded (grounded) with respect to each coaxial line 210, and the shield process for connecting the shield 213 and the ground bars 220 and 230 is performed. Yes. The shield process is performed, for example, by connecting the exposed shield 213 of the coaxial line 210 and the ground bars 220 and 230 with the adhesive member 240.

As a shield process, for example, in Japanese Patent Application Laid-Open No. 11-297133 (Patent Document 1), the shield of the coaxial line is exposed, and the shield is sandwiched by a ground bar from above and below, and soldering is performed. A technique for connecting a bar is disclosed.
JP 11-297133 A

  However, it has been found that the shield process disclosed in Patent Document 1 may include a coaxial line in which the connection between the exposed shield and the ground bar is not sufficient. If there is a coaxial line in which the connection between the shield and the ground bar is not sufficient, a shielding effect for grounding the shield of the coaxial line cannot be obtained sufficiently.

  Therefore, the objective of this invention is providing the manufacturing method of the harness which can improve the shielding effect of the shield which the several coaxial line exposed.

  The inventor of the present application has found that the problem that a coaxial line in which the connection between the exposed shield and the ground bar is not sufficient may be included due to variations in the diameter of the exposed shield. However, since the ground bar is a metal plate that is not easily deformed and has a uniform thickness, if the shield diameter varies, a shield that is in contact with the ground bar and a shield that is not in contact with the ground bar are generated. As a result, the connection performance between the shield and the ground bar is not stable.

  Therefore, the harness of the present invention includes a plurality of coaxial lines, a thin plate, a thin film, and an adhesive member. The coaxial line has a core wire, an insulator disposed on the outer peripheral side of the core wire, a shield disposed on the outer peripheral side of the insulator, and a jacket disposed on the outer peripheral side of the shield. Moreover, the core wire and the shield are exposed at one end of the coaxial wire. The thin plate is conductive on at least one surface. The thin film is more flexible than the thin plate, and at least one surface is conductive. The adhesive member electrically connects the shield and the surface of the thin plate and the surface of the thin film. Of the plurality of coaxial lines, at least two of the exposed shields have different diameters. The exposed shield is arranged in parallel on the surface of the thin plate, and the surface of the thin film is arranged on the shield according to the height of the shield.

  According to the harness of the present invention, a thin film having higher flexibility than a thin plate is used as a ground bar. Therefore, the thin film can be disposed on the shield disposed on the thin plate according to the variation in height caused by the difference in the diameter of the shield. Therefore, the connection between the thin shield and the thin plate and thin film can be stabilized. That is, the shielding effect can be improved for the exposed shield of a plurality of coaxial lines.

  The “flexibility” is based on the amount of deformation when the same force is applied under the same conditions, and a material having a large amount of deformation is considered to have high flexibility.

  In the harness described above, the thin film is preferably a flexible printed circuit (FPC).

  Since the flexible printed wiring board can easily follow shields having different diameters, the shielding effect of grounding the shield of the coaxial line can be further improved.

  In the harness, the adhesive member is preferably a thermosetting resin. Thereby, a shield, a thin plate, and a thin film can be connected more firmly.

  In the harness, preferably, the adhesive member is composed of a thermosetting resin and conductive particles blended in the thermosetting resin. Thereby, a shield, a thin plate, and a thin film can be connected more firmly.

The method for manufacturing a harness according to the present invention includes a first coaxial line preparation step, a second coaxial line preparation step, a thin plate preparation step, a thin film preparation step, and a connection step. The first coaxial line preparation step has a core wire, an insulator disposed on the outer peripheral side of the core wire, a shield disposed on the outer peripheral side of the insulator, and a jacket disposed on the outer peripheral side of the shield, A coaxial line is prepared with the core wire and shield exposed at one end. In the second coaxial line preparation step, a plurality of coaxial lines having different diameters are prepared for at least two of the exposed shields. In the thin plate preparation step, a thin plate having at least one surface conductive is prepared. In the thin film preparation step, a thin film having higher flexibility than that of a thin plate and having a conductive surface on at least one surface is prepared. In the connecting process, the exposed shield is arranged in parallel on the surface of the thin plate, and the surface of the thin film is arranged on the shield according to the height of the shield, and the exposed shield, the surface of the thin plate, and the surface of the thin film Are electrically connected by an adhesive member. In the connecting step, the adhesive member is disposed on the surface of the thin plate and the surface of the thin film before the exposed shield is disposed between the thin plate and the thin film. After the exposed shield is disposed between the thin plate and the thin film, a pressure member having a buffer member having higher flexibility than the thin plate is used on one surface, and the buffer member and the thin film are brought into contact with each other to perform pressurization.

  According to the harness manufacturing method of the present invention, the thin plate and the thin film having higher flexibility than the thin plate are connected to the exposed shield. For this reason, the thin film can be disposed in accordance with the fluctuation of the height caused by the difference in the diameters of the shields disposed on the thin plate. Therefore, the connection between the thin shield and the thin plate and thin film can be stabilized. That is, it is possible to manufacture a harness that can improve the shield effect of grounding the exposed shields of a plurality of coaxial lines.

  With a highly flexible cushioning member, the thin film can be deformed according to the height of the shield disposed on the thin plate. Therefore, the shield with a thin diameter can be connected to the thin plate and the thin film more stably.

  According to the harness and the method of manufacturing the harness of the present invention, since the thin plate and the thin film having higher flexibility than the thin plate are used to connect to the plurality of shields having different diameters, the shield of the exposed shield of the plurality of coaxial lines The effect can be improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the same or corresponding parts are denoted by the same reference numerals, and description thereof will not be repeated.

  FIG. 1 is a perspective view showing a harness according to an embodiment of the present invention. 2 is a cross-sectional view taken along line II-II in FIG. With reference to FIG. 1 and FIG. 2, the harness in embodiment of this invention is demonstrated. As shown in FIGS. 1 and 2, the harness 100 according to the embodiment includes a plurality of coaxial wires 110, a thin plate 120, a thin film 130, and an adhesive member 140. The coaxial line 110 includes a core wire 111, an insulator 112 disposed on the outer peripheral side of the core wire 111, a shield 113 disposed on the outer peripheral side of the insulator 112, and a jacket 114 disposed on the outer peripheral side of the shield 113. have. The coaxial wire 110 has a core wire 111 and a shield 113 exposed at one end. At least one surface of the thin plate 120 is conductive. The thin film 130 is more flexible than the thin plate 120, and at least one surface thereof is conductive. The adhesive member 140 connects the shield 113 to the surfaces of the thin plate 120 and the thin film 130. Among the plurality of coaxial wires 110, at least two diameters of the exposed shield 113 are different. The shield 113 exposed on the thin plate 120 is arranged in parallel, and the surface of the thin film 130 is arranged on the shield 113 according to the height of the shield 113.

  In the embodiment, a plurality of exposed shields 113 are arranged in parallel on the thin plate 120. A thin film 130 is disposed on the exposed shield 113. The thin film 130 is curved so as to follow the curvature of the exposed shield 113. That is, the thin film 130 is curved following the variation in the height of the exposed shield. An adhesive member 140 is disposed between the thin plate 120 and the thin film 130 so as to embed the exposed shield 113. That is, the exposed shield 113 is covered and fixed by the thin plate 120, the thin film 130, and the adhesive member 140. Therefore, the exposed shields 113 of all the coaxial wires 110 are connected to the thin plate 120 and the thin film 130.

  Specifically, the coaxial line 110 includes a core wire 111, an insulator 112, a shield 113, and a jacket 114. The core wire 111 is a conductive member that is electrically connected to a member such as a connector. The insulator 112 is an insulating member disposed on the outer peripheral side of the core wire 111. The shield 113 is an insulating member disposed on the outer peripheral side of the insulator 112. The outer jacket 114 is an insulating member disposed on the outer peripheral side of the shield 113.

  The shape of the coaxial wire 110 is not particularly limited as long as the core wire 111 and the shield 113 are exposed at one end of the coaxial wire 110. However, in the first embodiment, the core wire 111, the insulator 112, and the shield 113 are used. Are exposed in order toward one end. The one end portion is a region having a predetermined length from one end to the other end of the coaxial line 110 (from one end toward the direction in which the coaxial line 110 extends), and the exposed core wire 111. And a region including the exposed insulator 112 and the exposed shield 113.

  Any coaxial line 110 can be used as long as at least two diameters of the exposed shield 113 are different among the plurality of coaxial lines 110. For example, the plurality of coaxial wires 110 are manufactured as the same size industrially, but when the diameters are actually different, they are manufactured as the same size industrially and are actually the same in diameter. This includes all cases in which only the diameter of the shield 113 where is exposed differs, and in the case of producing coaxial wires of industrially different diameters.

  Moreover, there is no restriction | limiting in particular in the outer diameter dimension of the coaxial line 110 to be used. For example, a coaxial wire 110 having a core wire 111 with a diameter of 100 μm or less and a shield 113 with a diameter of 200 μm to 300 μm can be used. Further, for example, an ultrafine coaxial line having an outer diameter of 1 mm or less can be used for at least one of the coaxial lines 110.

  The thin plate 120 is connected to a plurality of exposed shields 113, and the shield 113 is grounded. The method for grounding is not particularly limited, and examples thereof include a method of fixing the shield 113 and the ground by connecting to a ground electrode (not shown) via the thin plate 120 and the thin film 130.

  The thin plate 120 is not particularly limited as long as the surface connected to the shield 113 is conductive, but a plate-like metal plate made of a metal such as copper can be used, for example.

  Further, the thin plate 120 is not particularly limited as long as it is less flexible than the thin film 130. However, from the viewpoint of easy handling, the deformation amount when a pressure of 0.3 MPa is applied with the shield 113 placed is 10 μm. It is preferable that it is less than.

  The thin film 130 is connected to the opposite side of the exposed shield 113 to the side connected to the thin plate 120. As with the thin plate 120, the thin film 130 has the shield 113 grounded.

  Further, the thin film 130 has a deformation amount when a pressure of 0.3 MPa is applied in a state of being superimposed on the shield 113 from the viewpoint of easily following the height of the shield 113 arranged in parallel on the thin plate 120. It is preferable that it is 10 micrometers or more.

  As such a thin film 130, a flexible printed wiring board is preferably used. The flexible printed wiring board is not particularly limited as long as it includes a metal film 131 such as a pattern and an insulating film 132, and any of a single-sided board, a double-sided board, and a multilayer board may be used. In addition, a single-sided board means what has a pattern (circuit) only on one side of a wiring board. A double-sided board means what has a pattern (circuit) on both surfaces of a wiring board. A multilayer board means what laminated | stacked the insulator and the pattern (circuit) on the wafer form. In the embodiment, a single-sided flexible printed wiring board in which a metal film 131 having a pattern such as copper foil is formed on an insulating film 132 such as polyimide is used. When a flexible printed wiring board is used as the thin film 130, the conductive surface on the side where the pattern is formed is disposed on the shield 113.

  The thin film 130 may be one or more films made of a conductive material. Examples of such a film include a foil made of copper, aluminum, gold, or an alloy thereof.

  The thin film 130 has a thickness of, for example, 300 μm or less, and preferably 5 μm or more and 50 μm or less. By setting the thickness to 10 μm or more and 50 μm or less, the thickness of the shield 113 can be changed to follow.

  Further, the thin film 130 may have the same composition as that of the thin plate 120. In this case, for example, by reducing the thickness, the flexibility of the thin film 130 is made higher than that of the thin plate 120.

  In addition, the thin plate 120 and the thin film 130 should just be electroconductive at least one part of the surface connected with the exposed shield 113. FIG. The thin plate 120 and the thin film 130 are preferably all conductive surfaces connected to the exposed shield 113.

  As shown in FIG. 1, the width W of the thin plate 120 and the thin film 130 is preferably 80% to 100% of the length of the exposed shield 113 in the extending direction of the coaxial line 110. Thereby, the shield process which connects the shield 113, the thin plate 120, and the thin film 130 can be performed more reliably. As shown in FIG. 2, the length L123 of the thin plate 120 and the length L130 of the thin film 130 are preferably long enough to straddle all the shields 113 when the coaxial lines 110 are arranged in parallel.

  It is preferable that the adhesive member 140 is a thermosetting resin or is composed of a thermosetting resin and conductive particles blended in the thermosetting resin. For example, an epoxy resin can be used as the thermosetting resin. Moreover, as a thermosetting resin, resin with high heat resistance is preferable, and it is more preferable that heat resistance is 100 degreeC or more. For example, an anisotropic conductive film can be used as the adhesive member 140 made of the thermosetting resin and the conductive particles blended in the thermosetting resin. The “anisotropic conductive film (ACF)” is a property in which fine conductive particles are dispersed in a film-like insulating resin material, and the conductivity in a specific (between plane) direction is high. It means a film having (anisotropic conductivity). As the conductive particles, for example, powder of conductive particles such as nickel, copper, silver, gold, or graphite can be used.

  Next, with reference to FIGS. 1-5, the manufacturing method of the harness in embodiment of this invention is demonstrated. In addition, FIG. 3 is a flowchart which shows the manufacturing method of the harness in embodiment of this invention. 4A and 4B show the coaxial line prepared in the coaxial line preparation step in the embodiment of the present invention, where FIG. 4A is a perspective view and FIG. 4B is a cross-sectional view. FIG. 5 is a schematic cross-sectional view showing a connection process in the embodiment of the present invention.

  As shown in FIGS. 3, 4A and 4B, the core wire 111, the insulator 112 disposed on the outer peripheral side of the core wire 111, the shield 113 disposed on the outer peripheral side of the insulator 112, and the shield A first coaxial line preparation step (S10) for preparing the coaxial line 110 having the outer jacket 114 arranged on the outer peripheral side of the 113 and having the core wire 111 and the shield 113 exposed at one end is performed. In the first coaxial line preparation step (S10), the coaxial line 110 may be prepared by obtaining a commercially available coaxial line, or the coaxial line 110 may be prepared by performing an exposure step described later.

  When performing an exposure process by the 1st coaxial line preparation process (S10), it carries out as follows, for example. First, a coaxial including a core wire 111, an insulator 112 disposed on the outer peripheral side of the core wire 111, a shield 113 disposed on the outer peripheral side of the insulator 112, and a jacket 114 disposed on the outer peripheral side of the shield 113. Line 110 is prepared. And the exposure process which exposes the core wire 111 and the shield 113 in one end part is implemented. In the exposing step, it is preferable that the core wire 111, the insulator 112, and the shield 113 are sequentially exposed toward one end.

  In the case of performing the exposure process, the method of exposing the core wire 111 and the shield 113 can employ any method such as a method using a laser or a mechanical peeling method. In the embodiment, the jacket 114 at one end of the coaxial line 110 is removed by, for example, a laser. Then, a part of the shield 113 in the vicinity of the outer jacket 114 is left, and the remaining shield 113 is removed by laser. Then, a part of the insulator 112 in the vicinity of the shield 113 is left, and the remaining insulator 112 is removed by laser. Thereby, the coaxial wire 110 as shown in FIG. 4A in which the core wire 111, the insulator 112, and the shield 113 are sequentially exposed toward one end can be formed.

  Next, a second coaxial wire preparation step (S20) is performed in which a plurality of coaxial wires 110 having different diameters at least two of the exposed shields 113 are prepared. Specifically, in the second coaxial line preparation step (S20), a plurality of coaxial wires 110 are prepared in the first coaxial line preparation step (S10). At least two of the plurality of coaxial wires 110 have different diameters.

  In the second coaxial line preparation step (S20), as described above, the same size is manufactured industrially, but when the diameter of the shield 113 is actually different, the same size is manufactured industrially. Actually, when the diameter of the shield 113 that is completely the same, but exposed by the exposure process or the like is different, or when the coaxial wires 110 having industrially different diameters are manufactured, the plurality of coaxial wires 110 are formed. prepare.

  Next, a thin plate preparation step (S30) in which at least one surface prepares a conductive thin plate 120 is performed. Specifically, in the thin plate preparation step (S30), the above-described thin plate 120 is prepared. In the thin plate preparation step (S30), from the viewpoint of easy handling, it is possible to prepare a thin plate 120 having a deformation amount of less than 10 μm when a pressure of 0.3 MPa is applied with the shield 113 placed. preferable.

  Next, it is preferable to perform a thin film preparation step (S40) in which a thin film 130 having higher flexibility than that of the thin plate 120 and having at least one surface of the conductive film 130 is prepared. Specifically, in the thin film preparation step (S40), the above-described thin film 130 is prepared. In the thin film preparation step (S40), it is preferable to prepare a thin film 130 having a deformation amount of 10 μm or more when a pressure of 0.3 MPa is applied in a state of being superimposed on the shield 113. Thereby, it becomes easy to follow the height of the shield 113 arranged in parallel on the thin plate 120 in the connection step (S50) described later. In the thin film preparation step (S40), it is more preferable to prepare a flexible printed wiring board as the thin film 130. Accordingly, it is possible to easily follow the height of the shield 113 arranged in parallel on the thin plate 120 in a connection step (S50) described later.

  Next, the exposed shield 113 and the thin plate 120 are arranged in a state where the exposed shield 113 is arranged in parallel on the surface of the thin plate 120 and the surface of the thin film 130 is arranged on the shield 113 according to the height of the shield 113. A connection step (S50) for electrically connecting the surface and the surface of the thin film 130 with the adhesive member 140 is performed. In the connecting step (S50), it is preferable to use a thermosetting resin as the adhesive member 140, and it is more preferable to use an anisotropic conductive film.

  In the connecting step (S50), for example, the adhesive member 140 is disposed on the conductive surface of the thin plate 120. In addition, the adhesive member 140 is disposed on the conductive surface of the thin film 130. And the shield 113 exposed on the said surface of the thin plate 120 is arrange | positioned in parallel. Then, the conductive surface of the thin film 130 is disposed on the shield 113. And each position alignment is performed. Then, as shown in FIG. 5, the exposed shield 113 and the surface of the thin plate 120 and the surface of the thin film 130 are connected by the adhesive member 140 by the adhesive member 140 using the pressure member 20. Thereby, the thin film 130 is arrange | positioned according to the height of the shield 113 arrange | positioned on a thin plate.

  In the connecting step (S50), it is preferable to use the pressure member 20 having the buffer member 10 having higher flexibility than the thin plate 120 on one surface, and press the buffer member 10 and the thin film 130 in contact with each other. Since the buffer member 10 is highly flexible, the thin film 130 can be deformed according to the height of the shield 113 on the thin plate 120 when being pressurized. The buffer member 10 serves as a cushioning material that absorbs deformation of the thin film 130 when the thin film 130 is deformed according to the curved diameter of the shield 113 when the surface of the pressure member 20 is flat and hardly deformed. Fulfill.

  The buffer member 10 is preferably a rubber sheet such as a silicon rubber sheet from the viewpoint of high heat resistance and good flexibility. The buffer member 10 may have two or more layers, and in the case of two layers, the surface layer in contact with the thin film 130 is preferably a rubber sheet.

  Further, the thickness of the buffer member 10 is preferably 50 μm or more and 500 μm or less, and more preferably 200 μm or more and 300 μm or less. By making it within this range, the deformation of the thin film 130 is more easily absorbed.

  In addition, the buffer member 10 has a structure in which the thin film 130 is stacked on the shield 113 and the buffer member 10 is further stacked on the shield 113 from the viewpoint of easily absorbing the deformation of the thin film 130. The deformation amount is preferably 10 μm or more.

  In the connecting step (S50), the thin film 130 is deformed, and the thin plate 120 is heated and pressurized under the conditions that do not deform. As such a condition, for example, heating and pressurization may be performed in a pressure range of 0.1 MPa to 5.0 MPa, a temperature range of 150 ° C. to 300 ° C., and a time range of 3 seconds to 60 seconds. preferable. Thereby, only the highly flexible thin film 130 can be deformed by following the shield 113. Moreover, since the thin plate 120 with low flexibility does not deform, it can serve as a reinforcing material.

  The adhesive member 140 is not particularly limited, but is preferably a thermosetting resin. In this case, the exposed shield 113 is connected to the surface of the thin plate 120 and the surface of the thin film 130 by heating and curing the thermosetting resin to a temperature higher than the melting point.

  The adhesive member 140 is more preferably an anisotropic conductive film. In this case, the exposed shield 113 is connected to the surface of the thin plate 120 and the surface of the thin film 130 by performing heating and pressurization under conditions according to the anisotropic conductive film to be used. When the adhesive member 140 is an anisotropic conductive film, electrical connection is made in the thickness direction of the anisotropic conductive film, so that the exposed shield 113 and the surface of the thin plate 120 and the surface of the thin film 130 are electrically connected. Connected to.

  By performing the above steps (S10 to S50), the harness 100 shown in FIGS. 1 and 2 can be manufactured. In addition, said process (S10-S50) may be implemented in arbitrary orders, and may implement two or more processes simultaneously.

  As described above, according to the harness in the embodiment of the present invention, the core wire 111, the insulator 112 disposed on the outer peripheral side of the core wire 111, the shield 113 disposed on the outer peripheral side of the insulator 112, A plurality of coaxial wires 110 having an outer sheath 114 disposed on the outer peripheral side of the shield 113, the core wire 111 and the shield 113 being exposed at one end, and a conductive thin plate 120 having at least one surface A thin film 130 having a higher flexibility than the thin plate 120 and having at least one surface conductive, a shield 113, and an adhesive member 140 connecting the surface of the thin plate 120 and the surface of the thin film 130, and a plurality of coaxial wires 110, at least two diameters of the exposed shield 113 are different, and the exposed shields 113 are arranged in parallel on the surface of the thin plate 120, The surface of the thin film 130 on Rudo 113 is characterized in that it is arranged according to the height of the shield 113.

  As a result of earnest research, the inventor of the present application has a variation in the diameter of the exposed shield 213 in the conventional harness 200 as shown in FIG. A problem has been found that the coaxial line 210 may be included. Specifically, as shown in FIG. 7, since the ground bars 220 and 230 are metal plates that are difficult to deform and have a uniform thickness, if the diameter of the shield 213 varies, the ground bars 220 and 230 come into contact with the ground bars 220 and 230. The shield 213 which is not in contact with the ground bars 220 and 230 is generated. As a result, the connection performance between the shield 213 and the ground bars 220 and 230 is not stable. FIG. 7 is a schematic cross-sectional view showing a conventional harness.

  Therefore, according to the harness 100 of the embodiment, the thin film 130 having higher flexibility than the thin plate 120 is used as the ground bar. Therefore, the thin film 130 can be disposed on the shield 113 disposed on the thin plate 120 in accordance with the variation in height caused by the difference in the diameter of the shield 113. Therefore, the shields 113 of all the coaxial wires 110 are connected to the thin plate 120 and the thin film 130. Therefore, the connection between the thin shield 113 and the thin plate 120 and the thin film 130 can be stabilized. Further, since the thin film 130 can be arranged following the diameter of the shield 113, the contact area between the shield 113 and the thin film 130 can be increased. Therefore, according to the harness 100 in the embodiment, the above-described problems can be solved, and the shielding effect can be improved with respect to the shield 113 where the plurality of coaxial wires 110 are exposed.

  In the harness 100, the thin film 130 is preferably a flexible printed wiring board. Since the flexible printed wiring board easily follows the shield 113 having a different diameter, the shield effect for grounding the shield 113 can be further improved.

  In the harness 100, the adhesive member 140 is preferably a thermosetting resin. Thereby, the shield 113, the thin plate 120, and the thin film 130 can be connected more firmly.

  In the harness 100, preferably, the adhesive member 140 is composed of a thermosetting resin and conductive particles blended in the thermosetting resin. Thereby, the shield 113, the thin plate 120, and the thin film 130 can be connected more firmly.

  The manufacturing method of the harness 100 according to the embodiment of the present invention includes a core wire 111, an insulator 112 disposed on the outer peripheral side of the core wire 111, a shield 113 disposed on the outer peripheral side of the insulator 112, and an outer periphery of the shield 113. A first coaxial line preparation step (S10) for preparing the coaxial line 110, wherein the core line 111 and the shield 113 are exposed at one end, and the exposed shield 113 From the thin plate 120, a second coaxial wire preparation step (S20) for preparing a plurality of coaxial wires 110 having at least two different diameters, a thin plate preparation step (S30) for preparing a conductive thin plate 120 having at least one surface. A thin film preparation step (S40) for preparing a thin film 130 having a high flexibility and at least one surface of which is conductive, and a seal exposed on the surface of the thin plate 120 113 are arranged in parallel, and the surface of the thin film 130 is arranged on the shield 113 according to the height of the shield 113, and the exposed shield 113, the surface of the thin plate 120, and the surface of the thin film 130 are bonded by the adhesive member 140. A connection step (S50) for electrical connection.

  According to the method of manufacturing harness 100 in the embodiment of the present invention, thin plate 120 and thin film 130 having higher flexibility than thin plate 120 and exposed shield 113 are connected by the connecting step (S50). Therefore, for the shield 113 disposed on the thin plate 120, the thin film 130 can be disposed in accordance with the height variation caused by the difference in the diameter of the shield 113. Therefore, the shield 113 of all the coaxial wires 110 can be connected to the thin plate 120 and the thin film 130. Therefore, the connection between the thin shield 113 and the thin plate 120 and the thin film 130 can be stabilized. Further, since the thin film 130 can be arranged following the diameter of the shield 113, the contact area between the shield 113 and the thin film 130 can be increased. Therefore, according to the method of manufacturing the harness 100 in the embodiment, the above-described problems can be solved, and the harness 100 that can improve the shielding effect with respect to the shields 113 where the plurality of coaxial wires 110 are exposed can be manufactured.

  In recent years, it has been desired to perform shield processing by gathering coaxial wires 110 having different industrial diameters. Therefore, according to the method of manufacturing harness 100 in the embodiment, the shield effect can be improved and the shielding process can be performed for harness 100 including a plurality of coaxial wires 110 having different diameters of exposed shield 113. .

  Preferably, in the method of manufacturing the harness 100, the connecting step (S50) uses the pressure member 20 having the buffer member 10 having higher flexibility than the thin plate 120 on one surface, and contacts the buffer member 10 and the thin film 130. It is characterized by pressurizing. Thereby, the thin film 130 can be deformed according to the height of the shield 113 disposed on the thin plate 120 by the buffer member 10. Therefore, the connection between the thin shield 113 and the thin plate 120 and the thin film 130 can be further stabilized.

  The embodiment disclosed above should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above embodiments but by the scope of claims, and is intended to include all modifications and variations within the scope and meaning equivalent to the scope of claims.

It is a perspective view which shows the harness in embodiment of this invention. It is sectional drawing in line segment II-II in FIG. It is a flowchart which shows the manufacturing method of the harness in embodiment of this invention. The coaxial line prepared by the coaxial line preparation process in embodiment of this invention is shown, (A) is a perspective view, (B) is sectional drawing. It is a schematic sectional drawing which shows the connection process in embodiment of this invention. It is a schematic perspective view which shows the conventional harness. It is a schematic sectional drawing which shows the conventional harness.

Explanation of symbols

  10 cushioning member, 20 pressure member, 100, 200 harness, 110, 210 coaxial wire, 111, 211 core wire, 112, 212 insulator, 113, 213 shield, 114, 214 jacket, 120 thin plate, 130 thin film, 131 metal Film, 132 Insulating film, 140, 240 Adhesive member, 220, 230 Ground bar, W width, L120, L130 length.

Claims (1)

A core wire, an insulator disposed on the outer peripheral side of the core wire, a shield disposed on the outer peripheral side of the insulator, and a jacket disposed on the outer peripheral side of the shield; A first coaxial line preparation step of preparing a coaxial line, wherein a core line and the shield are exposed;
A second coaxial line preparation step of preparing a plurality of the coaxial lines;
A thin plate preparation process in which at least one surface prepares a conductive thin plate;
A thin film preparation step of preparing a thin film having higher flexibility than the thin plate and at least one surface of which is conductive,
The exposed shield and the thin plate are arranged in parallel with the exposed shield on the surface of the thin plate, and the surface of the thin film is arranged on the shield according to the height of the shield. A connection step of electrically connecting the surface and the surface of the thin film with an adhesive member,
In the second coaxial line preparation step, at least two of the plurality of coaxial lines have different exposed shield diameters,
In the connecting step,
Before placing the exposed shield between the thin plate and the thin film, place the adhesive member on the surface of the thin plate and the surface of the thin film,
After placing the exposed shield between the thin plate and the thin film, a pressure member having a buffer member having higher flexibility than the thin plate is used on one surface, and the buffer member and the thin film are brought into contact with each other. A method for manufacturing a harness, characterized in that pressurizing is performed.

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