JP2003143728A - Terminal connector for ultrathin multiscore cable, and terminal connection method therefor - Google Patents

Terminal connector for ultrathin multiscore cable, and terminal connection method therefor

Info

Publication number
JP2003143728A
JP2003143728A JP2001332508A JP2001332508A JP2003143728A JP 2003143728 A JP2003143728 A JP 2003143728A JP 2001332508 A JP2001332508 A JP 2001332508A JP 2001332508 A JP2001332508 A JP 2001332508A JP 2003143728 A JP2003143728 A JP 2003143728A
Authority
JP
Japan
Prior art keywords
conductor
circuit pattern
terminal
ultrafine
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001332508A
Other languages
Japanese (ja)
Other versions
JP3846264B2 (en
Inventor
Satoru Mano
哲 間野
Takao Ichikawa
貴朗 市川
Masashi Kunii
正史 国井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP2001332508A priority Critical patent/JP3846264B2/en
Publication of JP2003143728A publication Critical patent/JP2003143728A/en
Application granted granted Critical
Publication of JP3846264B2 publication Critical patent/JP3846264B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Processing Of Terminals (AREA)
  • Cable Accessories (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a terminal connector for an ultrathin multicore cable which can connect even ultarthin line cores simply at narrow pitches and can simplify labor in manufacturing, and its terminal connection method. SOLUTION: In this terminal connector for an ultrathin multicore cable, where a plurality of pieces of ultrathin line cores 3 with their conductor lines 4 covered with insulators and bundled; as its terminal connection method, a plurality of lines of arrangement grooves 2 are formed in a base block 1; ultrathin line cores 3 are arranged and united in the several arrangement grooves 2 so that the plurality of pieces of ultrathin line cores 3 taken out of the terminal of the ultrathin multicore cable are positioned on the same plane; they are polished inclusive of the base block 1 so that the conductor lines 4 of the plurality of pieces of ultrathin line cores 3 are exposed in the longitudinal direction on the same plane, and a circuit pattern member 11, where a conductor circuit pattern 13 is formed on the surface, is fixed via an anisotropic conductive film 10 to the conductor exposed face of the base block 1 in such a way that the face of the conductor circuit pattern 13 faces the conductor exposed face; and the conductor line 4 of the ultrathin line core 3 and the conductor circuit pattern 13 are electrically connected with each other.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、電気・電子機器等
に用いられる極細多心ケーブルの端末部と、表面に導体
回路パターンを有するプリント基板等の回路パターン部
材の接続部とを接続する極細多心ケーブルの端末接続部
及びその端末接続方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrafine multi-core cable for use in electric / electronic equipment and the like, and an ultrafine cable for connecting a terminal portion of a cable and a circuit pattern member such as a printed circuit board having a conductor circuit pattern on its surface. The present invention relates to a terminal connecting portion of a multi-core cable and a method of connecting the terminal.

【0002】[0002]

【従来の技術】従来は、極細多心ケーブルの端末部から
取り出された複数本の極細線心を、導体回路パターンが
形成された基板に接続するには、極細線心の端末部をそ
れぞれ段剥ぎして導体線を露出させ、その導体線の端末
部を、導体回路パターン上にそれぞれ半田付けしてい
た。
2. Description of the Related Art Conventionally, in order to connect a plurality of ultrafine wire cores taken out from an end portion of an ultrafine multi-core cable to a substrate on which a conductor circuit pattern is formed, each end portion of the ultrafine wire core is stepped. The conductor wire was exposed by peeling it off, and the end portions of the conductor wire were soldered on the conductor circuit patterns.

【0003】例えば、極細同軸線心を複数本束ねた極細
多心ケーブルの端末部を基板に接続する場合は、図7に
示すように、極細多心ケーブル(図示せず)の端末部か
ら複数本の極細同軸線心61を取り出し、それぞれの端
末部分を段剥ぎして、ジャケット層65から中心導体6
2と絶縁層63と外部導体層64を露出させ、その中心
導体62を基板70の信号導体回路パターン部71に、
外部導体層64を基板70のグランド導体回路パターン
部72にそれぞれ半田接続していた。
For example, when connecting the ends of an ultrafine multi-core cable in which a plurality of ultrafine coaxial cores are bundled to a substrate, as shown in FIG. 7, a plurality of ultrafine multicore cables (not shown) are connected to the ends. Take out the extra fine coaxial wire cores 61, peel off the respective end portions, and remove the center conductor 6 from the jacket layer 65.
2, the insulating layer 63 and the outer conductor layer 64 are exposed, and the central conductor 62 thereof is formed on the signal conductor circuit pattern portion 71 of the substrate 70.
The outer conductor layers 64 were soldered to the ground conductor circuit pattern portions 72 of the substrate 70, respectively.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、近年の
電気・電子機器の小型化、高性能化に伴い、それに用い
られる極細多心ケーブルもさらなる細経化、多心化が望
まれており、極細同軸線心にあっては、現在では外径が
0.2mm以下というものまで出現しつつある。
However, with the recent miniaturization and higher performance of electric and electronic devices, it has been desired that the ultra-fine multi-core cables used therefor be further thinned and multi-core. In the coaxial core, the outer diameter of 0.2 mm or less is emerging at present.

【0005】さらに、極細多心ケーブルの端末部と、表
面に導体回路パターンを有する回路パターン部材との接
続部である極細多心ケーブルの端末接続部についても小
型化が進んでいる。
Further, the miniaturization of the terminal connection portion of the ultra-fine multi-core cable, which is the connection portion between the terminal portion of the ultra-fine multi-core cable and the circuit pattern member having the conductor circuit pattern on the surface, is also progressing.

【0006】このように、接続する極細線心の外径が細
くなり、かつ各極細線心間のピッチを狭ピッチで接続し
なければならない状況の中、従来の接続方法は、極細線
心を1本ずつ接続するため、端末接続部の製造作業に非
常に手間が掛かり、作業工数が増え、大幅なコストアッ
プにつながっていた。
[0006] In such a situation that the outer diameter of the ultrafine wire cores to be connected is reduced and the pitch between the ultrafine wire cores must be connected at a narrow pitch, the conventional connecting method Since the terminals are connected one by one, it takes a lot of time and labor to manufacture the terminal connecting portion, the number of man-hours is increased, and the cost is greatly increased.

【0007】そこで、本発明の目的は、上記課題を解決
し、極細の線心でも簡単に狭ピッチで接続でき、製造の
手間を簡略化することが可能な極細多心ケーブルの端末
接続部及びその端末接続方法を提供することにある。
[0007] Therefore, an object of the present invention is to solve the above-mentioned problems, to connect even a fine wire core easily at a narrow pitch, and to simplify the manufacturing work. It is to provide the terminal connection method.

【0008】[0008]

【課題を解決するための手段】上記課題を解決するため
に本発明は、導体線に絶縁被覆が施された極細線心を複
数本束ねた極細多心ケーブルの端末接続部であって、複
数本の配列溝が形成された基台を有し、それぞれの配列
溝内に、極細多心ケーブルの端末部から取り出された複
数本の極細線心がそれぞれ配列されると共に、固定一体
化され、上記配列溝内の複数本の極細線心は、同一平面
上に配置され、上記配列溝内の複数本の極細線心の導体
線が長手方向に沿って同一平面上に露出してなる導体露
出面が上記基台に形成され、当該導体露出面に異方性導
電膜を介して、回路パターン部材が固定され、回路パタ
ーン部材の表面に形成された導体回路パターンと、上記
配列溝内の複数本の極細線心の導体線が上記異方性導電
膜を用いて電気的に接続されたものである。
In order to solve the above-mentioned problems, the present invention relates to a terminal connecting portion of an ultrafine multi-core cable in which a plurality of ultrafine wire cores in which a conductor wire is provided with an insulating coating are bundled. It has a base on which an array groove of a book is formed, and in each array groove, a plurality of ultrafine wire cores taken out from the terminal portion of the ultrafine multi-core cable are arranged, respectively, and fixedly integrated, A plurality of ultrafine wire cores in the array groove are arranged on the same plane, and conductor conductors of the plurality of ultrafine wire cores in the array groove are exposed on the same plane along the longitudinal direction. A surface is formed on the base, a circuit pattern member is fixed to the conductor exposed surface via an anisotropic conductive film, and a conductor circuit pattern formed on the surface of the circuit pattern member, The conductor wire of the ultrafine wire core of the book is electrically connected by using the anisotropic conductive film. It is those that are connected.

【0009】また、上記極細線心は、中心導体と、該中
心導体の外周に施された絶縁体層と、該絶縁体層の外周
に施された外部導体層と、該外部導体層の外周に施され
たジャケット層とを有する外径が0.5mm以下の極細
同軸線心であり、上記配列溝内に複数本の極細同軸線心
がピッチ0.3〜0.7mmで配列されていても良い。
The ultrafine wire core includes a center conductor, an insulator layer provided on the outer periphery of the center conductor, an outer conductor layer provided on the outer periphery of the insulator layer, and an outer periphery of the outer conductor layer. An outer diameter of 0.5 mm or less having an outer diameter of a jacket layer, and a plurality of fine coaxial wires are arranged in the arrangement groove at a pitch of 0.3 to 0.7 mm. Is also good.

【0010】また、上記回路パターン部材の上記基台と
接続されていない側の端部における導体回路パターンの
導体間ピッチが、上記配列溝内の複数本の極細線心間の
ピッチよりも狭くなるように形成されているのが好まし
い。
The pitch between conductors of the conductor circuit pattern at the end of the circuit pattern member that is not connected to the base is narrower than the pitch between a plurality of ultrafine wire cores in the array groove. It is preferably formed as follows.

【0011】[0011]

【発明の実施の形態】次に、本発明の好適一実施の形態
を添付図面に基づいて詳述する。
BEST MODE FOR CARRYING OUT THE INVENTION Next, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

【0012】本実施の形態では、極細線心として極細同
軸線心3を用いた場合について述べる。
In the present embodiment, the case where the ultra-fine coaxial wire core 3 is used as the ultra-fine wire core will be described.

【0013】図4に示すように、極細同軸線心3は、単
線からなる中心導体4と、この中心導体4の外周に被覆
された絶縁体層5と、この絶縁体層5の外周に巻き付け
られた多数の導体からなる外部導体層6と、この外部導
体層6の外周に被覆されたジャケット層7とからなり、
外径は0.2mmである。
As shown in FIG. 4, the ultra-fine coaxial wire core 3 includes a central conductor 4 made of a single wire, an insulator layer 5 covering the outer periphery of the central conductor 4, and an outer periphery of the insulator layer 5. An outer conductor layer 6 composed of a large number of conductors, and a jacket layer 7 covering the outer periphery of the outer conductor layer 6,
The outer diameter is 0.2 mm.

【0014】図1に本発明にかかる極細多心ケーブルの
端末接続部の斜視図を示す。
FIG. 1 is a perspective view of a terminal connecting portion of an ultrafine multi-core cable according to the present invention.

【0015】図1に示すように、本発明にかかる端末接
続部は、図4に示した極細同軸線心3を収容すると共に
その中心導体4の端末部を所定のピッチで同一平面上に
配列する配列溝2が形成された基台1と、各中心導体4
の端末部と接続される導体回路パターンが形成された回
路パターン部材11とで主に構成されており、基台1と
回路パターン部材11は、厚さ方向にのみ導電性を有す
る異方性導電膜(AFC:Anisotropic Conductive Fil
m )10により接合されている。
As shown in FIG. 1, the terminal connecting portion according to the present invention accommodates the micro coaxial wire core 3 shown in FIG. 4 and arranges the terminal portions of the central conductor 4 on the same plane at a predetermined pitch. Base 1 on which the array groove 2 is formed, and each central conductor 4
And a circuit pattern member 11 on which a conductor circuit pattern is formed to be connected to the end portion of the base pattern 1 and the circuit pattern member 11 are anisotropic conductive materials having conductivity only in the thickness direction. Membrane (AFC: Anisotropic Conductive Fil)
m) 10 joined together.

【0016】図3に示すように、回路パターン部材11
は、絶縁性の基板12の表面に、銅等の導電性金属から
なる回路パターンが形成されており、この回路パターン
は中心導体と接続される線状の信号導体回路パターン部
13と、外部導体層と接続され、この信号導体回路パタ
ーン部13の両側に適宜間隔を隔てて形成されたグラン
ド導体回路パターン部14とを有している。
As shown in FIG. 3, the circuit pattern member 11
Has a circuit pattern made of a conductive metal such as copper formed on the surface of an insulating substrate 12. The circuit pattern has a linear signal conductor circuit pattern portion 13 connected to the central conductor and an outer conductor. It has a ground conductor circuit pattern portion 14 connected to the layer and formed on both sides of the signal conductor circuit pattern portion 13 at appropriate intervals.

【0017】信号導体回路パターン部13は、配列溝内
に収容された極細同軸線心の中心導体間のピッチに合わ
せて一端部が0.5mmのピッチで形成されていると共
に、他端部が中心導体間のピッチである0.5mmより
も狭くなるように、0.3mmのピッチで形成されてい
る。
In the signal conductor circuit pattern portion 13, one end portion is formed with a pitch of 0.5 mm in accordance with the pitch between the center conductors of the ultra-fine coaxial wires housed in the array groove, and the other end portion is formed. It is formed with a pitch of 0.3 mm so as to be narrower than the pitch between the central conductors of 0.5 mm.

【0018】グランド導体回路パターン部14は、一方
の端部が3本の信号導体回路パターン部13間に噛み合
わされると共に、他方の端部同士が接続された櫛形に形
成されており、さらに、グランド導体回路パターン14
と極細同軸線心3の中心導体4が電気的に接続しないよ
うに、信号導体回路パターン部13の延長線上にあるグ
ランド導体回路パターン部14の一部(点線で示した部
分)は、絶縁フィルム15で覆われている。
The ground conductor circuit pattern portion 14 is formed in a comb shape in which one end portion is meshed with the three signal conductor circuit pattern portions 13 and the other end portions are connected to each other. Ground conductor circuit pattern 14
And a part of the ground conductor circuit pattern portion 14 on the extension line of the signal conductor circuit pattern portion 13 (a portion indicated by a dotted line) is an insulating film so that the central conductor 4 of the ultra-fine coaxial wire core 3 is not electrically connected. It is covered with 15.

【0019】また、図2に示すように、基台1は、加工
のしやすさから、材質がプラスチックあるいは金属等か
らなり、例えばエポキシ樹脂などの硬質プラスチック、
ジルコア、ステンレスが用いられている。
Further, as shown in FIG. 2, the base 1 is made of a material such as plastic or metal for easy processing, and is made of hard plastic such as epoxy resin.
Zircoa and stainless steel are used.

【0020】配列溝2は、断面が凹型形状(矩形状)で
形成されており、極細同軸線心の端末部は配列溝2に収
容された状態で半割に研磨され、平坦な導体露出面9が
形成されている。
The array groove 2 is formed in a concave shape (rectangular shape) in cross section, and the end portion of the ultrafine coaxial wire core is halved while being housed in the array groove 2 to provide a flat conductor exposed surface. 9 is formed.

【0021】異方性導電膜10は、実装する部材同士を
接着するための樹脂絶縁膜(バインダ)17中に、縦方
向(厚さ方向)の電気的接続を得るための導電粒子16
が混入されている。導電粒子16の材料としては、銀、
金、銅、アルミニウム、ニッケルや半田などの導通性の
良好な金属粒子やメッキなどの方法で金属層を表面に設
けた樹脂粒子が挙げられる。
The anisotropic conductive film 10 has conductive particles 16 for obtaining electrical connection in the vertical direction (thickness direction) in a resin insulating film (binder) 17 for bonding members to be mounted together.
Is mixed in. The material of the conductive particles 16 is silver,
Examples thereof include metal particles having good conductivity such as gold, copper, aluminum, nickel and solder, and resin particles having a metal layer provided on the surface by a method such as plating.

【0022】また、異方性導電膜10の樹脂絶縁膜(バ
インダ)17は、基台1と基板12に密着の良好な樹脂
成分からなる。この樹脂成分としては熱硬化性のエポキ
シやウレタンやシリコーンなどの樹脂類が挙げられる。
この中で望ましいのはアミン類や酸無水物を硬化剤とす
る熱硬化性のエポキシ樹脂類である。
The resin insulating film (binder) 17 of the anisotropic conductive film 10 is made of a resin component having a good adhesion to the base 1 and the substrate 12. Examples of this resin component include resins such as thermosetting epoxy, urethane, and silicone.
Of these, thermosetting epoxy resins having amines or acid anhydrides as curing agents are preferable.

【0023】この異方性導電膜10は加熱硬化前に基台
1に貼り付けられるため、適当な粘着性を有することが
望ましい。
Since this anisotropic conductive film 10 is attached to the base 1 before being heat-cured, it is desirable that the anisotropic conductive film 10 has appropriate tackiness.

【0024】そして、この異方性導電膜10により、中
心導体4及び外部導体層6は、それぞれ異方性導電膜1
0が含有する導電粒子16を介して、上述した回路パタ
ーン部材11の信号導体回路パターン13及びグランド
導体回路パターン14に電気的に接続されている。
With this anisotropic conductive film 10, the central conductor 4 and the outer conductive layer 6 are respectively formed.
It is electrically connected to the signal conductor circuit pattern 13 and the ground conductor circuit pattern 14 of the circuit pattern member 11 described above through the conductive particles 16 contained in 0.

【0025】次に、本発明にかかる極細多心ケーブルの
端末接続部の製造方法を作用と共に説明する。
Next, a method of manufacturing the terminal connecting portion of the ultra-fine multi-core cable according to the present invention will be described together with its operation.

【0026】まず、接続しようとする複数本の極細線心
を整列させるため、図5(a)、図6(a)に示すよう
に、直方体状の基台1を準備し、図5(b)、図6
(b)に示すように、その基台1に3本の配列溝2を形
成する。
First, in order to align a plurality of ultrafine wire cores to be connected, as shown in FIGS. 5A and 6A, a rectangular parallelepiped base 1 is prepared, and FIG. ), FIG. 6
As shown in (b), three array grooves 2 are formed in the base 1.

【0027】この配列溝2の形成方法としては、エッチ
ングで形成する方法、サンドブラストを用いて形成する
方法等がある。また、基台1がプラスチックの場合は、
基台1の型と配列溝2の型が共に形成されてなる金型内
にプラスチック樹脂を注入し、硬化させて基台1と同時
に形成する方法がある。
As a method of forming the array grooves 2, there are a method of forming by etching, a method of forming by using sandblast and the like. If the base 1 is plastic,
There is a method of injecting a plastic resin into a mold in which the mold of the base 1 and the mold of the array groove 2 are both formed, and curing the resin to form the base 1 at the same time.

【0028】そして、極細多心ケーブル(図示せず)の
端末部から3本の極細同軸線心3を取り出し、図5
(c)、図6(c)に示すように、それら3本の極細同
軸線心3が同一平面上に位置するように、それぞれの配
列溝2内に極細同軸線心3を配列し、接着剤8により固
定一体化させる。
Then, the three ultra-fine coaxial wire cores 3 are taken out from the end portion of the ultra-fine multi-core cable (not shown), and as shown in FIG.
As shown in (c) and FIG. 6 (c), the ultrafine coaxial wire cores 3 are arranged in the respective alignment grooves 2 so that the three ultrafine coaxial wire cores 3 are located on the same plane, and are bonded. Fixed and integrated with the agent 8.

【0029】配列溝2内に極細同軸線心3を固定一体化
する方法としては、例えば、ホットメルト系接着剤、紫
外線硬化樹脂等の接着剤8を用いた固定が考えられる。
As a method for fixing and integrating the ultra-fine coaxial fiber cores 3 in the array groove 2, for example, fixing using an adhesive 8 such as a hot melt adhesive or an ultraviolet curable resin can be considered.

【0030】そして、図5(d)、図6(d)に示すよ
うに、3本の極細同軸線心3の中心導体4及び外部導体
層6が長手方向に沿って同一平面上に露出するように、
極細同軸線心3を基台1ごと研磨し、基台1に導体露出
面9を形成する。
Then, as shown in FIGS. 5 (d) and 6 (d), the central conductors 4 and the outer conductor layers 6 of the three micro coaxial cores 3 are exposed on the same plane along the longitudinal direction. like,
The micro coaxial core 3 is ground together with the base 1 to form a conductor exposed surface 9 on the base 1.

【0031】このとき、配列溝2が形成された基台1の
表面を全て研磨するのではなく、回路パターン部材を固
定する部分だけを部分的に研磨し、極細同軸線心3の把
持部用として、極細同軸線心3が引き出されている側の
端部部分を研磨せずに残しておくのが好ましい。
At this time, the surface of the base 1 on which the array grooves 2 are formed is not entirely ground, but only the portion for fixing the circuit pattern member is partially ground, and the portion for holding the ultrafine coaxial fiber core 3 is used. As a result, it is preferable to leave the end portion on the side where the micro coaxial wire core 3 is pulled out without polishing.

【0032】最後に、図5(e)、図6(e)に示すよ
うに、基台1の導体露出面9に、異方性導電膜10を挟
んで、回路パターン部材11を固定する。
Finally, as shown in FIGS. 5E and 6E, the circuit pattern member 11 is fixed to the exposed conductor surface 9 of the base 1 with the anisotropic conductive film 10 sandwiched therebetween.

【0033】具体的には、基台1の導体露出面9に、異
方性導電膜10を貼り付け、回路パターン部材11を熱
圧着して固定する。
Specifically, the anisotropic conductive film 10 is attached to the exposed conductor surface 9 of the base 1, and the circuit pattern member 11 is fixed by thermocompression bonding.

【0034】このとき、回路パターン部材11の表面に
形成された導体回路パターン13,14面が、導体露出
面9と向かい合うように固定する。
At this time, the conductor circuit patterns 13 and 14 formed on the surface of the circuit pattern member 11 are fixed so as to face the conductor exposed surface 9.

【0035】これによって、極細同軸線心3の中心導体
4及び外部導体層6と導体回路パターン13,14が異
方性導電膜10により、圧接接合され、電気的に接続さ
れる。
As a result, the central conductor 4 and the outer conductor layer 6 of the micro coaxial wire core 3 and the conductor circuit patterns 13 and 14 are pressure-welded and electrically connected by the anisotropic conductive film 10.

【0036】以上説明したように、本発明によれば、極
細同軸線心3を複数本まとめて接続するため、狭ピッチ
でも容易に接続が可能になる。これにより、端末接続部
の製造作業を低コスト化できる。
As described above, according to the present invention, since a plurality of ultrafine coaxial wire cores 3 are connected together, connection can be easily performed even at a narrow pitch. As a result, the cost of manufacturing the terminal connecting portion can be reduced.

【0037】さらに、中心導体4と信号導体回路パター
ン部13との接続部が基台1と基板12に挟まれて保護
されているため、安定に接続することができる。
Further, since the connecting portion between the central conductor 4 and the signal conductor circuit pattern portion 13 is protected by being sandwiched between the base 1 and the substrate 12, a stable connection can be achieved.

【0038】尚、本実施の形態では、3本の極細同軸線
心3が接続される端末接続部について述べたが、これに
限らず、さらに本数を増やしても良いことは言うまでも
ない。
In the present embodiment, the terminal connecting portion to which the three ultra-fine coaxial wire cores 3 are connected has been described, but it goes without saying that the number may be further increased.

【0039】また、回路パターン部材11は、電子部品
が搭載されたプリント回路基板であっても良い。
The circuit pattern member 11 may be a printed circuit board on which electronic parts are mounted.

【0040】また、配列溝2の断面形状をV字形状やU
字形状に形成しても良い。
The cross-sectional shape of the array groove 2 is V-shaped or U-shaped.
You may form in a character shape.

【0041】[0041]

【発明の効果】以上要するに本発明によれば、極細の線
心でも簡単に狭ピッチで接続でき、製造の手間を簡略化
することが可能になる。
In summary, according to the present invention, even a very fine wire core can be easily connected at a narrow pitch, and the labor of manufacturing can be simplified.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明にかかる極細多心ケーブルの端末接続部
を示す斜視図である。
FIG. 1 is a perspective view showing a terminal connecting portion of an ultrafine multi-core cable according to the present invention.

【図2】図1の端末接続部の部分拡大断面図である。FIG. 2 is a partially enlarged cross-sectional view of a terminal connecting portion of FIG.

【図3】本発明を構成する回路パターン部材の平面図で
ある。
FIG. 3 is a plan view of a circuit pattern member that constitutes the present invention.

【図4】本発明により接続された極細同軸線心の断面図
である。
FIG. 4 is a sectional view of a micro coaxial wire core connected according to the present invention.

【図5】(a)から(e)は図1の端末接続部の中間体
を示す斜視図である。
5 (a) to 5 (e) are perspective views showing an intermediate body of the terminal connecting portion of FIG.

【図6】(a)は図5(a)の端末接続部中間体のA−
A線矢示断面図、(b)は図5(b)の端末接続部中間
体のB−B線矢示断面図、(c)は図5(c)の端末接
続部中間体のC−C線矢示断面図、(d)は図5(d)
の端末接続部中間体のD−D線矢示断面図、(e)は図
5(e)の端末接続部中間体のE−E線矢示断面図であ
る。
FIG. 6 (a) is A- of the intermediate body of the terminal connecting portion of FIG. 5 (a).
Sectional drawing of the A line arrow, (b) is a BB sectional sectional view of the terminal connection part intermediate body of FIG.5 (b), (c) is C- of the terminal connection part intermediate body of FIG.5 (c). Sectional view taken along the line C, FIG. 5D is FIG.
5 is a sectional view taken along the line D-D of the terminal connection portion intermediate body of FIG. 5E, and FIG. 5E is a sectional view taken along the line EE line of the terminal connection portion intermediate body of FIG.

【図7】従来の極細多心ケーブルの端末部と基板との接
続方法を説明するための図である。
FIG. 7 is a diagram for explaining a method of connecting a terminal portion of a conventional ultra-fine multi-core cable and a substrate.

【符号の説明】[Explanation of symbols]

1 基台 2 配列溝 3 極細同軸線心 4 中心導体(導体線) 5 絶縁体層 6 外部導体層 7 ジャケット層 10 異方性導電膜 11 回路パターン部材 13 信号導体回路パターン部(導体回路パターン) 1 base 2 array groove 3 Micro coaxial core 4 Center conductor (conductor wire) 5 Insulator layer 6 outer conductor layer 7 jacket layers 10 Anisotropic conductive film 11 Circuit pattern member 13 Signal conductor circuit pattern part (conductor circuit pattern)

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H02G 15/08 H01R 9/09 Z (72)発明者 国井 正史 茨城県日立市川尻町4丁目10番1号 日立 電線ファインテック株式会社内 Fターム(参考) 5E051 GA06 GA08 GB04 5E077 BB08 BB09 BB24 BB31 DD04 GG22 GG26 JJ11 JJ20 5E085 BB04 BB08 CC01 CC09 DD05 GG07 GG21 GG26 JJ31 JJ38 5G355 AA03 BA01 BA11 CA04 5G375 AA10 CA02 CA12 DA05 DA09 EA17 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) H02G 15/08 H01R 9/09 Z (72) Inventor Masafumi Kunii 4-10-1 Kawajiri-cho, Hitachi-shi, Ibaraki F-term in Hitachi Cable Finetech Co., Ltd.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 導体線に絶縁被覆が施された極細線心を
複数本束ねた極細多心ケーブルの上記導体線の端末部
と、導体回路パターンの複数本の信号導体回路パターン
部とがそれぞれ接続された極細多心ケーブルの端末接続
部において、上記導体線の端末部を所定の間隔で同一平
面上に配列する配列溝が形成された基台と、上記信号導
体回路パターン部の一端部が上記間隔で同一平面上に配
列されて形成されている回路パターン部材とを有し、上
記導体線の端末部と上記信号導体回路パターン部の一端
部とが厚さ方向にのみ導電性を有する異方性導電膜によ
り接合されていることを特徴とする極細多心ケーブルの
端末接続部。
1. A terminal portion of the conductor wire of an ultrafine multicore cable in which a plurality of ultrafine wire cores having an insulating coating applied to the conductor wire are bundled, and a plurality of signal conductor circuit pattern portions of a conductor circuit pattern, respectively. In the terminal connection portion of the connected ultra-fine multi-core cable, a base having an array groove for arranging the terminal portions of the conductor wires on the same plane at a predetermined interval, and one end portion of the signal conductor circuit pattern portion are A circuit pattern member that is arranged on the same plane at the above intervals, and a terminal portion of the conductor wire and one end portion of the signal conductor circuit pattern portion have conductivity only in the thickness direction. A terminal connecting portion of an ultra-fine multi-core cable, which is joined by an anisotropic conductive film.
【請求項2】 上記極細線心は、中心導体と、該中心導
体の外周に被覆された絶縁体層と、該絶縁体層の外周に
巻き付けられた多数の導体線からなる外部導体層と、該
外部導体層の外周に被覆されたジャケット層とを有する
極細同軸線心であり、かつ上記回路パターン部材は、上
記外部導体層と接続され上記信号導体回路パターン部の
両側に適宜間隔を隔ててグランド導体回路パターン部が
形成されている請求項1記載の極細多心ケーブルの端末
接続部。
2. The ultrafine wire core includes a center conductor, an insulator layer coated on the outer circumference of the center conductor, and an outer conductor layer formed of a large number of conductor wires wound around the outer circumference of the insulator layer. A fine coaxial core having a jacket layer coated on the outer periphery of the outer conductor layer, wherein the circuit pattern member is connected to the outer conductor layer and is appropriately spaced on both sides of the signal conductor circuit pattern portion. The terminal connecting portion of the ultrafine multicore cable according to claim 1, wherein a ground conductor circuit pattern portion is formed.
【請求項3】 上記極細線心は外径が0.5mm以下で
あり、かつ上記配列溝は0.3〜0.7mmの間隔で形
成されている請求項1又は2記載の極細多心ケーブルの
端末接続部。
3. The ultrafine multicore cable according to claim 1, wherein the ultrafine wire core has an outer diameter of 0.5 mm or less, and the array grooves are formed at intervals of 0.3 to 0.7 mm. Terminal connection part.
【請求項4】 上記回路パターン部材は、上記信号導体
回路パターン部の他端部の間隔が、上記配列溝内に配列
された導体線の間隔よりも狭く形成されている請求項1
から3のいずれかに記載の極細多心ケーブルの端末接続
部。
4. The circuit pattern member is formed such that a distance between the other ends of the signal conductor circuit pattern portions is smaller than a distance between conductor lines arranged in the arrangement groove.
4. The terminal connecting portion of the ultrafine multi-core cable described in any one of 1 to 3.
【請求項5】 導体線に絶縁被覆が施された極細線心を
複数本束ねた極細多心ケーブルの上記導体線の端末部
と、導体回路パターンの複数本の信号導体回路パターン
部とをそれぞれ接続する極細多心ケーブルの端末接続方
法において、上記導体線の端末部を所定の間隔で同一平
面上に配列する配列溝が形成された基台の上記配列溝に
収容して固定し、上記導体線の端末部を上記基台と共に
研磨して露出させた後、上記信号導体回路パターン部の
一端部が上記間隔で同一平面上に配列されて形成されて
いる回路パターン部材を、上記導体線の端末部と上記信
号導体回路パターン部の一端部とが重ね合わさるよう
に、厚さ方向にのみ導電性を有する異方性導電膜を挟ん
で上記基台に接合させることを特徴とする極細多心ケー
ブルの端末接続方法。
5. An end portion of the conductor wire of an ultrafine multicore cable in which a plurality of ultrafine wire cores having an insulating coating applied to the conductor wire are bundled, and a plurality of signal conductor circuit pattern portions of a conductor circuit pattern, respectively. In the terminal connecting method of the ultrafine multi-core cable to be connected, the terminal portions of the conductor wires are accommodated and fixed in the array groove of the base in which the array grooves are arranged on the same plane at predetermined intervals, and the conductor is After exposing the end portion of the wire by polishing together with the base, one end portion of the signal conductor circuit pattern portion is formed by arranging on the same plane on the same plane, and An ultrafine multi-core, characterized in that an anisotropic conductive film having conductivity only in the thickness direction is sandwiched and bonded to the base so that the terminal part and one end of the signal conductor circuit pattern part are overlapped with each other. How to connect the cable end.
JP2001332508A 2001-10-30 2001-10-30 Terminal connection part of ultrafine multi-core cable and terminal connection method thereof Expired - Fee Related JP3846264B2 (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007194186A (en) * 2005-12-21 2007-08-02 Sumitomo Electric Ind Ltd Connection structure of multicore cable, multicore cable and method of manufacturing multicore cable connection structure
JP2008192458A (en) * 2007-02-05 2008-08-21 Sumitomo Electric Ind Ltd Harness and harness manufacturing method
JP2010279227A (en) * 2009-06-01 2010-12-09 Hitachi Cable Ltd Terminal shape of extrafine coaxial cable, and processing method
JP2010288402A (en) * 2009-06-12 2010-12-24 Hitachi Cable Ltd Small diameter coaxial cable array and method of manufacturing the same
JP2011045173A (en) * 2009-08-20 2011-03-03 Olympus Corp Cable assembly, electronic circuit module, and image pickup device
JP2016177897A (en) * 2015-03-18 2016-10-06 日本航空電子工業株式会社 Holding structure
JP2019525411A (en) * 2016-07-28 2019-09-05 スリーエム イノベイティブ プロパティズ カンパニー Electric cable

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JPH04259200A (en) * 1991-02-14 1992-09-14 Toshiba Corp Ultrasonic wave probe
JPH11287926A (en) * 1997-03-13 1999-10-19 Nippon Telegr & Teleph Corp <Ntt> Optical element mounting substrate, optical module using the same and production thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04179074A (en) * 1990-11-13 1992-06-25 Toshiba Corp Method for connecting multi-core cable
JPH04259200A (en) * 1991-02-14 1992-09-14 Toshiba Corp Ultrasonic wave probe
JPH11287926A (en) * 1997-03-13 1999-10-19 Nippon Telegr & Teleph Corp <Ntt> Optical element mounting substrate, optical module using the same and production thereof

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007194186A (en) * 2005-12-21 2007-08-02 Sumitomo Electric Ind Ltd Connection structure of multicore cable, multicore cable and method of manufacturing multicore cable connection structure
JP2008192458A (en) * 2007-02-05 2008-08-21 Sumitomo Electric Ind Ltd Harness and harness manufacturing method
JP2010279227A (en) * 2009-06-01 2010-12-09 Hitachi Cable Ltd Terminal shape of extrafine coaxial cable, and processing method
JP2010288402A (en) * 2009-06-12 2010-12-24 Hitachi Cable Ltd Small diameter coaxial cable array and method of manufacturing the same
JP2011045173A (en) * 2009-08-20 2011-03-03 Olympus Corp Cable assembly, electronic circuit module, and image pickup device
US9124026B2 (en) 2009-08-20 2015-09-01 Olympus Corporation Cable assembly, electronic circuit module, and imaging apparatus
JP2016177897A (en) * 2015-03-18 2016-10-06 日本航空電子工業株式会社 Holding structure
JP2019525411A (en) * 2016-07-28 2019-09-05 スリーエム イノベイティブ プロパティズ カンパニー Electric cable
US11217918B2 (en) 2016-07-28 2022-01-04 3M Innovative Properties Company Electrical cable
US20220085528A1 (en) * 2016-07-28 2022-03-17 3M Innovative Properties Company Electrical cable

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