JP2008000755A - Electrooptical device, method for producing electrooptical device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrooptical device which is hard to be damaged by laser light upon scribing, to provide a method for producing the electrooptical device, and to provide an electronic equipment. <P>SOLUTION: A substrate 52 is parted, so as to form a counter strip substrate 55 having edge faces 55d. Next, the counter strip substrate 55 and an element mother substrate 62 are joined. After the joining, a V counter cutting face 68, a V element cutting face 67 and an H element cutting face are scribed. In the scribing, laser light 56 is condensed and emitted on each inside of the substrate 52 and the substrate 63 using a condensing lens 8, so as to form a reforming part 57. Crack parts 58 are formed at the center of the reforming part 57, and the crack parts 58 are disposingly formed, so as to perform the scribing. At this time, in the element mother substrate 62, regarding the place confronted with the V counter cutting face 68 in the counter strip substrate 55, the place free from elements, wiring and terminals is set. Thereafter, the disposingly formed crack parts 58 are pressed, and are subjected to tension, so as to be parted. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electro-optical device, a method for manufacturing the electro-optical device, and an electronic apparatus.

Patent Document 1 discloses a laser scribing method for irradiating a substrate with laser light to form a modified region (hereinafter referred to as a modified portion) inside the substrate in order to cut a light-transmitting substrate with high quality. Has been. According to this, a laser beam having a pulse width of 1 μs or less is emitted and condensed inside the substrate by a condenser lens, and the peak power density at the focal point is set to 1 × 10 ⁸ (W / cm ² ) or more. Thereby, the modified part by multiphoton absorption is formed inside the workpiece.

In this laser scribing method, the size of the modified portion formed inside the object to be processed or the modified portion formed from this depends on the characteristics of the condenser lens and the peak power density of the laser beam. Dependent. For example, in an embodiment in which the glass (thickness: 700 μm) disclosed in Patent Document 1 is cut using a YAG laser, the peak power density is approximately 1 × when the condensing lens has a numerical aperture of 0.55. At 10 ¹¹ (W / cm ² ), the size of the modified portion is approximately 100 μm. Further, when the peak power density is about 5 × 10 ¹¹ (W / cm ² ), it is about 250 μm. By forming the reforming portions in the substrate and pressing the reforming portions, the substrate can be divided along the reforming portions with good quality.

  A display device such as a liquid crystal display device is often formed by using a pair of substrates having a rectangular outer shape and disposing a liquid crystal or a light emitting element between the pair of substrates.

JP 2002-192371 A

  When a pair of substrates are joined and then scribed by irradiating the substrate with laser light, there is laser light that passes through the modified portion formed by the laser light. Laser light that passes through the modified portion formed on the substrate located near the condenser lens irradiates the substrate located away from the condenser lens. When wirings, terminals, electrical elements, and the like are arranged on a substrate located at a location away from the condenser lens, the laser light that passes through the modified portion irradiates them. Wiring, terminals, and electrical elements irradiated with the laser light may be damaged by the laser light. Damaged wiring, terminals, and electrical elements may not function properly.

  The present invention has been made paying attention to such conventional problems, and an object of the present invention is to provide an electro-optical device that is not easily damaged by laser light when scribing, a method for manufacturing the electro-optical device, and an electronic apparatus. Is to provide.

  In order to solve the above problems, an electro-optical device manufacturing method according to the present invention is a method for manufacturing an electro-optical device formed by bonding a first substrate and a second substrate, and the first substrate has a plurality of rows. In addition, the first mother substrate formed in a plurality of rows is divided to form a first strip substrate in which the first substrate is formed in a row. A first substrate first forming step, and a plurality of first strip substrates and second substrates are formed. A joining step of joining the second mother substrates formed in rows and columns, a first substrate second forming step of dividing the first strip substrate to form the first substrate, and a second mother substrate being divided A second substrate forming step of forming a second substrate, and in the first substrate second forming step, the first strip substrate is irradiated with laser light to form a modified portion and to be divided. And

  According to the method of manufacturing the electro-optical device, the first substrate is formed with a plurality of rows and a plurality of columns on the first mother substrate. In the first substrate first forming step, the first mother substrate is divided to form a first strip substrate. Since the first mother substrate is formed with a plurality of rows of the first substrate and is divided for each row, the first strip substrate is in a state where the first substrate for one row is formed.

  The second mother substrate is also formed with a plurality of rows and columns in the second substrate, and the first strip substrate and the second mother substrate are bonded in the bonding step. Subsequently, in the first substrate second forming step, the first strip substrate is irradiated with laser light to form a modified portion and divided to form the first substrate. In the second substrate forming step, the second mother substrate is divided to form a second substrate.

  On the other hand, when the first mother substrate and the second mother substrate are bonded and the first mother substrate is irradiated with laser light to form the sides of the electro-optical device, the laser light passing through the first mother substrate is Irradiate the second mother substrate. The second mother substrate and members such as elements and wirings formed on the second mother substrate may be damaged by being irradiated with laser light.

  In the present invention, after the first strip substrate is formed from the first mother substrate, the first strip substrate and the second mother substrate are joined. Therefore, after joining the first strip substrate and the second mother substrate, the first strip substrate is formed by dividing the first mother substrate, and the first strip substrate is irradiated with laser light on the side of the modified portion. There is no need to form.

  That is, in the first substrate second forming step, it is not necessary to irradiate the second mother substrate facing the side of the first strip substrate with the laser beam. Therefore, the second mother substrate and the second mother substrate When a member such as an element or wiring is formed on the substrate, the formed member such as an element or wiring is irradiated with a laser beam and is not damaged.

Further, the second mother substrate may be made of a material that transmits laser light, and a member such as a third substrate, an element, and a wiring may be formed on the second mother substrate on the side opposite to the first substrate.
Also at this time, there is no need to irradiate the first strip substrate with the laser beam to form the modified portion. Therefore, the laser beam is transmitted through the second mother substrate, and the second mother substrate is opposite to the first substrate. There is no possibility of irradiating a member such as a third substrate, an element, or a wiring disposed on the side to cause damage. As a result, the electro-optical device can be a high-quality device.

  The method of manufacturing the electro-optical device according to the present invention is such that, in the first strip substrate, the second mother substrate facing the part of the side formed by dividing the first mother substrate is irradiated with laser light. A member to be damaged is arranged.

  According to the method of manufacturing the electro-optical device, the first strip substrate is exposed to the laser beam irradiation at the position of the second mother substrate facing a part of the side formed in the first substrate first forming step. Damaged members are placed. It is not necessary to irradiate the laser beam to the location of the second substrate facing the side of the first strip substrate. Therefore, even when the second mother substrate is irradiated with the laser beam and a member that is damaged by the laser beam irradiation is disposed, the second mother substrate is not damaged by the laser beam irradiation. As a result, the electro-optical device can be a high-quality device.

  The electro-optical device manufacturing method of the present invention is characterized in that the damaged member is an electrode or a wiring.

  According to the method of manufacturing the electro-optical device, the first strip substrate is irradiated with a laser beam at a position of the second mother substrate facing a part of the side formed in the first substrate first forming step. There is no need. Therefore, an electrode or a wiring can be arranged at a location of the second mother substrate facing the side of the first strip substrate. Therefore, it is possible to provide an electro-optical device manufacturing method in which the arrangement of electrodes and wirings can be easily designed.

  The electro-optical device manufacturing method according to the present invention is characterized in that, in the first substrate first forming step, the first mother substrate is irradiated with laser light to form a modified portion and to be divided.

  According to this method of manufacturing an electro-optical device, in the first substrate first forming step, the first mother substrate is irradiated with laser light, and the modified portion is formed and divided. Therefore, in the first substrate first forming step, it can be divided by a dry method. Further, since the fragments of the substrate are rarely separated when dividing, cleaning is unnecessary. That is, a part of the outer shape can be formed without wetting the first mother substrate. Even when the first mother substrate is formed with a film whose performance may be deteriorated by cleaning, a part of the outer shape can be formed without cleaning. As a result, the electro-optical device can be a high-quality device.

  The electro-optical device manufacturing method according to the present invention is characterized in that, in the second substrate forming step, the second mother substrate is irradiated with laser light to form a modified portion and divided.

  According to this method of manufacturing an electro-optical device, in the second substrate forming step, the second mother substrate is irradiated with laser light, and a modified portion is formed and divided. Therefore, the fragments of the substrate are rarely separated when dividing. It is possible to reduce the occurrence of defects due to the fragments of the substrate adhering to the electrodes and the manufacturing apparatus. As a result, the electro-optical device can be a high-quality device.

  In the electro-optical device manufacturing method of the present invention, marks are formed on the first strip substrate and the second mother substrate, and are formed on the first mother substrate and the mark formed on the first strip substrate in the bonding step. The first strip substrate and the second mother substrate are joined to each other using the marks that are aligned.

  According to this method of manufacturing an electro-optical device, marks are formed on the first strip substrate and the second mother substrate. In the joining step, the first strip substrate and the second mother substrate are joined with their relative positions aligned using the mark formed on the first strip substrate and the mark formed on the second mother substrate. The Therefore, the first strip substrate and the second mother substrate are bonded to a predetermined position with high positional accuracy. As a result, the electro-optical device can be a high-quality device.

  The electro-optical device of the present invention is manufactured using the above-described method for manufacturing an electro-optical device.

  According to this electro-optical device, the electro-optical device is manufactured without being damaged by the laser beam when elements and wirings are formed on the second substrate. Therefore, an electro-optical device manufactured with high quality can be obtained.

  According to another aspect of the invention, there is provided an electronic apparatus including the above-described electro-optical device in a display unit.

  According to this electronic apparatus, the electronic apparatus includes the electro-optical device described above in the display unit. In this electro-optical device, the second substrate is manufactured with little damage by the laser beam, and is manufactured with high quality. Therefore, the electronic apparatus can be an electronic apparatus including an electro-optical device in which the second substrate is manufactured on the display unit without being damaged by the laser light and manufactured with high quality.

Embodiments of the present invention will be described below with reference to the drawings.
In addition, each member in each drawing is illustrated with a different scale for each member in order to make the size recognizable on each drawing.

(First embodiment)
A laser scribing method according to a first embodiment of the present invention will be described with reference to FIGS.

First, the laser irradiation apparatus will be described. FIG. 1 is a schematic diagram showing a configuration of a laser irradiation apparatus.
As shown in FIG. 1, the laser irradiation apparatus 1 includes a laser light source 2 that emits laser light, an optical path unit 3 that irradiates the work with the emitted laser light, and a work relative to the optical path unit 3. The table unit 4 is moved mainly and the control device 5 for controlling the operation is mainly configured.

The laser light source 2 may be any light source that can collect the emitted laser light inside the object to be processed and form a modified portion by multiphoton absorption. For example, in the present embodiment, the laser light source 2 is composed of a laser medium of LD excitation Nd: YAG (Nd: Y ₃ Al ₅ O ₁₂ ), and is a third harmonic (wavelength: 355 nm) Q-switch pulse oscillation laser light. The light emission conditions for emitting light are employed. The light emission conditions for emitting a laser beam with a pulse width of about 14 ns (nanoseconds), a pulse period of 10 kHz, and an output of about 60 μJ / pulse are employed.

  The optical path unit 3 includes a dichroic mirror 6. The dichroic mirror 6 is disposed on the optical axis 7 of the laser light emitted from the laser light source 2. The dichroic mirror 6 reflects the laser light emitted from the laser light source 2 and changes the traveling direction of the optical axis 7. A condenser lens 8 is disposed on the optical axis 7 through which the laser light reflected by the dichroic mirror 6 passes. A work 9 is arranged on the table 4, and the work 9 is irradiated with laser light that has passed through the condenser lens 8.

The condenser lens 8 is supported by the lens moving mechanism 11 by the lens support portion 10. The lens moving mechanism 11 has a linear motion mechanism (not shown), and moves the condenser lens 8 in the direction of the optical axis 7 so that the position where the laser light that has passed through the condenser lens 8 is condensed can be moved.
The linear motion mechanism is, for example, a screw type linear motion mechanism provided with a screw shaft (drive shaft) extending in the Z direction and a ball nut screwed to the screw shaft, and the drive shaft receives a predetermined pulse signal. It is connected to a Z-axis motor (not shown) that rotates forward and backward in predetermined step units. When a drive signal corresponding to a predetermined number of steps is input to the Z-axis motor, the Z-axis motor rotates normally or reversely, and the lens moving mechanism 11 corresponds to the number of steps corresponding to the optical axis 7 direction. It moves forward or backward along.

  An imaging device 12 is provided on the extension line of the optical axis 7 passing through the condenser lens 8 and the dichroic mirror 6 and on the opposite side of the condenser lens 8 with respect to the dichroic mirror 6. The imaging device 12 includes, for example, a coaxial incident light source and a CCD (Charge Coupled Device) (not shown). The visible light emitted from the coaxial incident light source passes through the condenser lens 8 and irradiates the work 9. The imaging device 12 can image the workpiece 9 through the condenser lens 8 and the dichroic mirror 6.

  The table unit 4 includes a base 15. On the side of the optical path portion 3 of the base 15, a rail 16 is provided so as to protrude, and an X-axis slide 17 is provided on the rail 16. The X-axis slide 17 includes a linear motion mechanism (not shown) and can move in the X direction on the rail 16. The linear motion mechanism is a mechanism similar to the linear motion mechanism included in the lens moving mechanism 11, and the X-axis slide 17 corresponds to the number of steps corresponding to the drive signal corresponding to the predetermined number of steps in the X direction. It moves forward or backward along.

  A rail 18 is provided so as to protrude from the X-axis slide 17 on the optical path section 3 side, and a Y-axis slide 19 is provided on the rail 18. The Y-axis slide 19 includes a linear motion mechanism similar to that of the X-axis slide 17 and can move on the rail 18 in the Y direction.

  A stage 20 is disposed on the optical path section 3 side of the Y-axis slide 19, and a suction chuck mechanism (not shown) is provided on the upper surface of the stage 20. When the workpiece 9 is placed, the workpiece 9 is positioned and fixed at a predetermined position on the upper surface of the stage 20 by the chuck mechanism.

The control device 5 includes a main computer 24. The main computer 24 includes a CPU (Central Processing Unit) and a memory (not shown). The CPU controls the operation of the laser irradiation apparatus 1 in accordance with program software stored in the memory.
The main computer 24 includes an input / output interface (not shown), and is connected to an input device 25, a display device 26, a laser control device 27, a lens control device 28, an image processing device 29, and a stage control device 30.

  The input device 25 is a device for inputting data of various processing conditions used in laser processing, and the display device 26 is a device for displaying various information at the time of laser processing. The CPU performs laser processing according to various processing conditions and program software that are input, and displays the processing status on the display device 26. The operator looks at various information displayed on the display device 26 and confirms the laser processing status for operation.

The laser control device 27 is a device that controls the pulse width of the pulse signal that drives the laser light source 2, the pulse cycle, the start and stop of output, and the like, and is controlled by the control signal of the main computer 24.
The lens control device 28 is a device that controls the movement and stop of the lens moving mechanism 11. The lens moving mechanism 11 has a built-in position sensor (not shown) that can detect the moving distance, and the lens control device 28 detects the output of the position sensor to detect the position of the condenser lens 8 in the direction of the optical axis 7. Recognize position. The lens control device 28 can transmit a pulse signal to the lens moving mechanism 11 to move the lens moving mechanism 11 to a desired position.

  The image processing device 29 has a function of calculating image data output from the imaging device 12. When the work 9 is placed on the stage 20 and an image taken by the imaging device 12 is observed, the lens moving mechanism 11 is operated to change the distance between the condenser lens 8 and the work 9 to make the image clearer. There are times when it is blurred. When the condenser lens 8 is moved to focus on the surface of the work 9 on the stage 20 side and when the work 9 is focused on the surface of the work 9 on the optical path unit 3 side, the image to be captured becomes clear. On the other hand, when the image is out of focus, the captured image is a blurred image.

  The thickness of the work 9 is determined by moving the condenser lens 8 in the direction of the optical axis 7 and detecting the position of the condenser lens 8 when the image picked up by the imaging device 12 becomes clear by the built-in position sensor. Can be measured.

  The in-focus position is obtained by measuring the distance between the in-focus position that is in focus when imaged by the imaging device 12 and the condensing position that is condensed by the condensing lens 8 when the laser beam is irradiated. And the offset distance, which is the difference between the condensing positions. For example, an object obtained by stacking two transparent substrates is set on the stage 20 as a workpiece 9 and the condenser lens 8 is moved so that the imaging device 12 is focused on a contact portion between the two substrates. Next, the modified portion is formed by irradiating laser light. The offset distance can be set by measuring the distance between the contact portion and the reforming portion of the two substrates.

  The condenser lens 8 is moved in the direction of the optical axis 7 so that the imaging device 12 is focused on the surface of the work 9 on the optical path portion 3 side. The moving distance of the condensing lens 8 is calculated from the position where the laser beam is to be irradiated and the offset distance, and the condensing lens 8 is moved by the distance corresponding to the calculated moving distance. With this method, the laser beam can be condensed to a predetermined depth in the workpiece 9.

  The stage control device 30 performs acquisition of position information and movement control of the X-axis slide 17 and the Y-axis slide 19. The X-axis slide 17 and the Y-axis slide 19 have built-in position sensors (not shown), and the stage control device 30 detects the positions of the X-axis slide 17 and the Y-axis slide 19 by detecting the output of the position sensor. To detect. The stage control device 30 acquires the position information of the X-axis slide 17 and the Y-axis slide 19, compares the position information instructed from the main computer 24, and corresponds to the distance corresponding to the difference to the X-axis slide. 17 and the Y-axis slide 19 are driven to move. The stage control device 30 can drive the X-axis slide 17 and the Y-axis slide 19 to move the workpiece 9 to a desired position.

  The laser control device 27 controls the laser light source 2 to emit laser light. The image processing device 29 detects the position in the optical axis direction with respect to the surface of the workpiece 9. The lens controller 28 controls the position in the optical axis direction where the laser light is condensed. The stage control device 30 moves the workpiece 9 in the XY directions, and controls the position where the workpiece 9 is irradiated with laser light. It is possible to collect and irradiate laser light at a desired position by performing the above-described control.

  Here, formation of the modified portion by multiphoton absorption will be described. The laser beam condensed by the condenser lens 8 enters the workpiece 9. Even if the workpiece 9 is a material that transmits laser light, the workpiece 9 absorbs photon energy when the energy of the photon is much larger than the absorption band gap of the material. This is called multi-photon absorption, and if the energy is increased by making the pulse width of the laser light extremely short, causing multi-photon absorption to occur inside the workpiece 9, the energy of multi-photon absorption will not be converted into thermal energy. A region in which a permanent structural change is induced is formed.

  In the present embodiment, this structure change region is called a modified portion. Of the modified portion, a region where a crack is formed as a result of a large structural change is referred to as a crack portion. Depending on the type of material, for example in the case of quartz glass, a hollow crack may be formed in the crack portion.

  As for the irradiation condition of the laser beam for forming such a modified portion, it is necessary to set the output of the laser beam, the pulse width, the pulse period, the laser scan speed, etc. for each workpiece. In particular, it is necessary to consider that the output of the laser light emitted from the laser light source 2 is attenuated by absorption by a transmissive substance disposed on the optical axis 7 such as the dichroic mirror 6 and the condenser lens 8. Therefore, it is desirable to carry out a preliminary test using an actual workpiece to derive optimum irradiation conditions.

(Liquid crystal display device)
Next, a liquid crystal display device will be described. FIG. 2 is a schematic plan view of the liquid crystal display device, and FIG. 3 is a schematic cross-sectional view taken along the line AA ′ of the liquid crystal display device of FIG.

  2 and 3, the liquid crystal display device 33 as an electro-optical device according to this embodiment includes a TFT array substrate 34 as a pair of second substrates and a counter substrate 35 as a first substrate. A liquid crystal layer made of liquid crystal 37 is sandwiched between regions bonded by a seal 36 which is a stopper and sealed in a region defined by the seal 36. The seal 36 is formed in a frame shape closed in a region within the substrate surface.

  A peripheral parting 38 for concealing the wiring with a light shielding material is formed on the surface of the counter substrate 35 on the liquid crystal 37 side inside the place where the seal 36 is formed. A data line drive circuit 39 and a mounting terminal 40 as an electrode are formed along a side 34a (lower side in FIG. 2) of the TFT array substrate 34 at a location outside the seal 36, and adjacent to the side 34a. A scanning line driving circuit 41 is formed along the side 34b and the side 34c (left and right sides in FIG. 2). The data line driving circuit 39, the mounting terminal 40, and the scanning line driving circuit 41 are electrically connected by a wiring 42a made of aluminum. On the remaining side 34d (upper side in FIG. 2) of the TFT array substrate 34, a wiring 42b for connecting the two scanning line driving circuits 41 is provided. In addition, inter-substrate conductive members 43 for providing electrical continuity between the TFT array substrate 34 and the counter substrate 35 are disposed at the four corners of the counter substrate 35.

  The liquid crystal display device 33 is configured for color display. On the counter substrate 35, red (R), green (G), and blue (B) color filters 44R, 44G, and 44B are formed together with a protective film (not shown). Has been. A light shielding film 45 is formed between the filter elements of the color filters 44R, 44G, and 44B, and the light shielding film 45 blocks light that does not pass through the color filters 44R, 44G, and 44B. Further, a counter electrode 46 and an alignment film 47 are disposed on the TFT array substrate 34 side of the color filters 44R, 44G, and 44B.

  The liquid crystal has the property that the tilt angle of the liquid crystal molecules changes when a voltage is applied to the electrodes sandwiching the liquid crystal, and the tilt angle of the liquid crystal is controlled by controlling the voltage applied to the liquid crystal by the switching operation of the TFT. Then, an operation of transmitting or blocking light is performed for each pixel. Thereby, the transmitted light passes through a color filter having three color filters of red (R), green (G), and blue (B) that are installed relative to each pixel. The color of each corresponding color filter is transmitted as colored light. In addition, since light does not naturally enter the color filter corresponding to the pixel where the light is blocked by the liquid crystal, the color filter is black. In this way, by operating the liquid crystal as a shutter by the switching operation of the TFT, the transmission of light is controlled for each pixel, and the color image can be displayed by blinking the pixel.

  In the region for displaying an image of the liquid crystal display device 33 having such a structure, a plurality of pixels are configured in a matrix of m rows and n columns, and a pixel signal is switched to each of these pixels. A TFT (switching element) is formed. A data line (source wiring) for supplying a pixel signal is electrically connected to the source electrode of the TFT, a scanning line (gate wiring) for supplying a scanning signal is electrically connected to the gate electrode of the TFT, and a drain electrode of the TFT The pixel electrode 48 is electrically connected to. The pixel electrode 48 is formed at a location facing each filter element of the color filters 44R, 44G, and 44B. A scanning signal of a pulse signal is supplied from the scanning line to the gate electrode of the TFT to which the scanning line is connected at a predetermined timing.

  The pixel electrode 48 is electrically connected to the drain of the TFT, and the pixel signal supplied from the data line is applied to the pixel electrode 48 of each pixel by turning on the TFT as a switching element for a certain period. It is supplied at the timing. The voltage level of the pixel signal of a predetermined level supplied to the pixel electrode 48 in this way is held between the counter electrode 46 of the counter substrate 35 shown in FIG. 3, and the liquid crystal 37 is changed according to the voltage level of the pixel signal. The amount of transmitted light changes. The liquid crystal display device 33 includes a color filter, and the liquid crystal display device 33 is controlled by controlling the light transmitted through the color filters 44R, 44G, and 44B with an image signal applied to an electrode that sandwiches a liquid crystal layer made of the liquid crystal 37. A color image can be displayed.

  An alignment film 49 is disposed on the counter electrode 35 side of the pixel electrode 48. The alignment film 47 and the alignment film 49 have groove-like irregularities formed on their surfaces, and the liquid crystal 37 filled between the alignment film 47 and the alignment film 49 is aligned along the groove-like irregularities. Formed.

  In the TFT array substrate 34 and the counter substrate 35, a polarizing sheet (not shown) is disposed on the surface opposite to the liquid crystal 37, and the amount of light transmitted through the liquid crystal display device 33 is changed by the action of the polarizing sheet and the liquid crystal 37. It is like that.

(Substrate dividing method)
Next, a method for dividing the substrate in the liquid crystal display device 33 described above will be described with reference to FIGS. FIG. 4 is a flowchart of the substrate dividing method, and FIGS. 5 to 10 are diagrams for explaining the substrate dividing method.

  In the flowchart of FIG. 4, step S <b> 1 corresponds to a first scribing process of the counter mother substrate, and is a process of scribing the counter substrate 35. Next, the process proceeds to step S2. Step S <b> 2 corresponds to a first dividing step of the counter mother substrate, and is a step of dividing the counter substrate 35. Step S1 and step S2 are combined to form step S11. Step S <b> 11 corresponds to the first substrate first forming step, and is a step of forming a part of the outer shape of the counter substrate 35. Next, the process proceeds to step S3.

  Step S <b> 3 corresponds to a bonding process, and is a process of bonding the TFT array substrate 34 and the counter substrate 35. Next, the process proceeds to step S4. Step S4 corresponds to the second scribing process of the counter strip substrate, and is a process of scribing a place where the outer shape of the counter substrate 35 is not formed. Next, the process proceeds to step S5. Step S5 corresponds to a first scribe process of the element mother substrate, and is a process of scribing a part of the TFT array substrate 34. Next, the process proceeds to step S6. Step S6 corresponds to a second scribe process of the element mother substrate, and is a process of scribing the remaining part of the TFT array substrate 34 other than the part scribed in step S5. Next, the process proceeds to step S7.

  Step S7 corresponds to the first parting step of the element mother substrate, and is a step of cutting the place scribed in step S6. Next, the process proceeds to step S8. Step S8 corresponds to the second dividing step of the counter strip substrate, and is a step of dividing the place scribed in step S4. Next, the process proceeds to step S9. Step S9 corresponds to a second dividing step of the element mother substrate, and is a step of dividing the place scribed in step S5. Step S4 and step S8 are combined to form step S12. Step S12 corresponds to the first substrate second forming step, and is a step of scribing and dividing the counter strip substrate. Further, Step S5 to Step S7 and Step S9 are combined to form Step S13. Step S13 corresponds to a second substrate forming step, and is a step of scribing and dividing the element mother substrate. Through the above steps, the liquid crystal display device 33 is formed.

  Next, the manufacturing method will be described in detail with reference to FIGS. 5 to 10 in association with the steps shown in FIG. FIG. 5A is a schematic diagram showing a counter mother substrate that is a mother substrate in which the counter substrate is partitioned. FIG. 5B is a schematic cross-sectional view taken along the line B-B ′ of FIG.

  As shown in FIG. 5A and FIG. 5B, the counter mother substrate 51 as the first mother substrate is a substrate 52 formed in the shape of a disk, and a peripheral parting 38, a color filter 44, and a light shielding film 45 are provided. Is formed. Further, on the surfaces of the peripheral parting 38, the color filter 44, and the light shielding film 45, a counter electrode 46 having optical transparency and electrical conductivity is formed. An alignment film 47 is formed on the surface of the counter electrode 46, and an alignment process for forming irregularities on the surface is performed. The substrate 52 only needs to be a light-transmitting material. For example, quartz glass is used in the present embodiment.

  In the peripheral parting 38 formed by being arranged on the counter mother substrate 51, positioning marks 53 as a pair of marks are formed outside the peripheral parting part 38 at both ends, and used in step S3.

  In the present embodiment, an opposing strip substrate 55 as a first strip substrate is formed from the opposing mother substrate 51. A surface to be divided to cut out the counter strip substrate 55 from the counter mother substrate 51 is referred to as an H counter cut surface 54. The H-opposing cut surface 54 is a cut surface of the substrate 52 indicated by a one-dot chain line, and is a cut surface extending in the X-axis direction of FIG. Reference numerals 54 a, 54 b, 54 c, 54 d, and 54 e are H opposing cut surfaces 54, and 55 a, 55 b, and 55 c are opposing strip substrates 55.

  In step S11, the counter mother substrate 51 is divided along the H counter cut surface 54 to form a counter strip substrate 55 as a first substrate. The H-opposite cut surface 54 a of the counter-strip substrate 55 corresponds to the side 35 d of the counter substrate 35 shown in FIG. 3, and the H-opposite cut surface 54 b corresponds to the side 35 a of the counter substrate 35. The counter substrate 35 of the liquid crystal display device 33 shown in FIG. 3 corresponds to the counter substrate piece 35b of FIG. 5, and the counter strip substrate 55 is formed so that the counter substrate pieces 35b are arranged in a line. A cutting plane 54 is set.

  FIG. 6A and FIG. 6B are diagrams corresponding to step S1. As shown in FIG. 6A, the condensing lens 8 is used to condense and irradiate the laser beam 56 inside the counter mother substrate 51. A reforming portion 57 is formed at a location where the laser beam 56 is condensed, and a crack portion 58 is formed at the center of the reforming portion 57.

  While the condenser lens 8 and the opposing mother substrate 51 are moved relatively, the laser beam 56 is irradiated and the modified portions 57 are arranged and formed. At this time, the condenser lens 8 and the counter mother substrate 51 are relatively moved along the H counter cut surface 54 shown in FIG. 5 in the plane direction of the counter mother substrate 51. Subsequently, the place where the laser beam 56 is condensed is moved in the thickness direction of the substrate 52. After the movement, the laser beam 56 is irradiated while the condenser lens 8 and the opposing mother substrate 51 are moved relatively, and the modified portions 57 are arranged and formed. This is repeated, and the reforming portions 57 are arranged and formed on all the H opposing cut surfaces 54 of the opposing mother substrate 51.

  As a result, as shown in FIG. 6B, the modified portion 57 is formed on all the H-opposing cut surfaces 54 of the opposed mother substrate 51, and the crack portion 58 is formed in the central portion of the modified portion 57. The As a result, a crack surface 59 formed by arranging the crack portions 58 on the H-opposed cut surface 54 is formed.

  FIG. 6C and FIG. 6D are diagrams corresponding to step S2. Next, as shown in FIG. 6C, the opposing mother substrate 51 is placed on the base 60 made of an elastic material, and the place facing the crack surface 59 is pressed using the pressing member 61. The opposing mother substrate 51 sinks into the base 60 and tension acts on the crack portion 58. The opposing mother substrate 51 breaks up and breaks starting from a crack portion 58 close to the surface in contact with the table 60.

  As shown in FIG. 6D, as a result, the counter mother substrate 51 is divided into several counter strip substrates 55. The counter strip substrate 55 is divided to form an end face 55d as a side.

  FIG. 7A and FIG. 7B are diagrams corresponding to step S3. FIG. 7A is a schematic diagram showing a mother substrate on which a liquid crystal display panel is partitioned. FIG. 7A is a plan view seen from the counter substrate side, and FIG. 7B is a schematic cross-sectional view taken along the line C-C ′ of FIG.

  As shown in FIG. 7A and FIG. 7B, the element mother substrate 62 as the second mother substrate has a pixel electrode 48 formed on a disc-shaped substrate 63, and the surface of the pixel electrode 48. An alignment film 49 is disposed on the substrate. The alignment film 49 is subjected to an alignment process. Transistor elements (not shown) are formed on the substrate 63, and are electrically connected to the pixel electrodes 48, the data line driving circuit 39, and the scanning line driving circuit 41 shown in FIG. Mounting terminals 40 are formed on the substrate 63 and are electrically connected to the data line driving circuit 39 and the scanning line driving circuit 41 shown in FIG.

  A sealing material 36a, which is a material of the seal 36, is applied on the substrate 63 in a frame shape. The method of applying the sealing material 36a only needs to apply the seal 36 in a desired shape. For example, in this embodiment, a screen printing method is adopted. The sealing material 36a may be any material that can obtain an adhesive force after solidification and does not deteriorate due to contact with the liquid crystal 37. For example, in the present embodiment, a thermosetting epoxy resin is used.

After the sealing material 36a is applied in a frame shape, the liquid crystal 37 is applied inside the sealing material 36a using a dispenser. The substrate 63 is placed in a vacuum chamber (not shown), and the inside of the vacuum chamber is evacuated to make a vacuum. In a vacuum, the opposing strip substrate 55 and the element mother substrate 62 are pressed in alignment with each other.
At this time, a positioning mark 64 as a mark is formed on the substrate 63 at a location corresponding to the positioning mark 53 shown in FIG. The positioning marks 53 formed on the opposing strip substrate 55 and the positioning marks 64 formed on the element mother substrate 62 are matched to match the relative positions of the opposing strip substrate 55 and the element mother substrate 62.

  A sealing material 36 a is applied to one element mother substrate 62 in a shape corresponding to the plurality of opposed strip substrates 55, and the plurality of opposed strip substrates 55 are arranged on one element mother substrate 62. After the opposing strip substrate 55 is pressed against the element mother substrate 62, air flows into the vacuum chamber. The opposing strip substrate 55 and the element mother substrate 62 are pressurized by the atmospheric pressure.

  The counter strip substrate 55 and the element mother substrate 62 are heated while maintaining the relative positions, and the seal material 36 a is solidified to form the seal 36. The mother substrate 65 in which the opposing strip substrate 55 and the element mother substrate 62 are joined through the seal 36 is completed, and step S3 is completed.

  The surfaces to be divided for cutting out the liquid crystal display device 33 from the mother substrate 65 are referred to as an H element cutting surface 66, a V element cutting surface 67, and a V opposing cutting surface 68, respectively. The H element cut surface 66 is a cut surface of the element mother substrate 62 indicated by a one-dot chain line, and is a cut surface extending in the X-axis direction of FIG. The V element cut surface 67 is a cut surface of the element mother substrate 62 indicated by a one-dot chain line, and is a cut surface extending in the Y-axis direction of FIG. The V opposing cut surface 68 is a cut surface of the opposing strip substrate 55 indicated by a one-dot chain line, and is a cut surface extending in the Y-axis direction of FIG. In FIG. 7A, 66a, 66b, and 66c are H element cut surfaces 66, 67a, 67b, and 67c are V element cut surfaces 67, and 68a, 68b, and 68c are V elements cut surfaces, respectively. This is an opposing cut surface 68.

  FIG. 8A and FIG. 8B are diagrams corresponding to step S4. As shown in FIG. 8A, the condensing lens 8 is used to condense and irradiate the laser beam 56 inside the opposing strip substrate 55. A reforming portion 57 is formed at a location where the laser beam 56 is condensed, and a crack portion 58 is formed at the center of the reforming portion 57.

  While the condenser lens 8 and the opposing strip substrate 55 are relatively moved, the laser beam 56 is irradiated and the modified portions 57 are arranged and formed. At this time, the condenser lens 8 and the counter strip substrate 55 are relatively moved along the V counter cut surface 68 shown in FIG. 7 in the plane direction of the counter strip substrate 55. Subsequently, the place where the laser beam 56 is condensed is moved in the thickness direction of the substrate 52. After the movement, the laser beam 56 is irradiated while the condenser lens 8 and the opposing strip substrate 55 are moved relatively, and the modified portions 57 are arranged and formed. This process is repeated to form a crack surface 70 formed by arranging the modified portions 57 on all the V opposing cut surfaces 68 of the opposing strip substrate 55.

  As a result, as shown in FIG. 8B, crack surfaces 70 are formed in which the modified portions 57 are arranged on all the V opposing cut surfaces 68 of the opposing strip substrate 55.

  FIG. 8C and FIG. 8D are diagrams corresponding to step S5. As shown in FIG. 8C, the condensing lens 8 is used to condense and irradiate the laser beam 56 inside the element mother substrate 62. A reforming portion 57 is formed at a location where the laser beam 56 is condensed, and a crack portion 58 is formed at the center of the reforming portion 57.

  While the condenser lens 8 and the element mother substrate 62 are moved relative to each other, the laser beam 56 is irradiated and the modified portions 57 are arranged and formed. At this time, the condenser lens 8 and the element mother substrate 62 are relatively moved along the V element cut surface 67 shown in FIG. 7 in the plane direction of the element mother substrate 62. Subsequently, the place where the laser beam 56 is condensed is moved in the thickness direction of the substrate 63. After the movement, the condensing lens 8 and the element mother substrate 62 are relatively moved while being irradiated with the laser beam 56 and the reforming portions 57 are arranged and formed. This process is repeated to form crack surfaces 71 formed by arranging modified portions 57 on all V element cut surfaces 67 of the element mother substrate 62.

  As a result, as shown in FIG. 8D, crack surfaces 71 are formed in which the modified portions 57 are arranged on all the V element cut surfaces 67 of the element mother substrate 62.

  FIG. 9A and FIG. 9B are diagrams corresponding to step S6. As shown in FIG. 9A, the condensing lens 8 is used to condense and irradiate the laser beam 56 inside the element mother substrate 62. A reforming portion 57 is formed at a location where the laser beam 56 is condensed, and a crack portion 58 is formed at the center of the reforming portion 57.

  While the condenser lens 8 and the element mother substrate 62 are moved relative to each other, the laser beam 56 is irradiated and the modified portions 57 are arranged and formed. At this time, the condenser lens 8 and the element mother substrate 62 move relative to each other along the H element cut surface 66 shown in FIG. 7 in the plane direction of the element mother substrate 62. Subsequently, the place where the laser beam 56 is condensed is moved in the thickness direction of the substrate 63. After the movement, the condensing lens 8 and the element mother substrate 62 are relatively moved while being irradiated with the laser beam 56 and the reforming portions 57 are arranged and formed. This process is repeated to form crack surfaces 72 formed by arranging the modified portions 57 on all the H element cut surfaces 66 of the element mother substrate 62.

  As a result, as shown in FIG. 9B, crack surfaces 72 are formed in which the modified portions 57 are arranged on all the H element cut surfaces 66 of the element mother substrate 62.

  FIG. 9C and FIG. 9D are diagrams corresponding to step S7. As shown in FIG. 9C, the element mother substrate 62 is disposed on the base 60 made of an elastic material, and a place facing the crack surface 72 is pressed using the pressing member 61. The element mother substrate 62 sinks into the base 60 and tension acts on the crack portion 58. The element mother substrate 62 breaks and breaks starting from a crack portion 58 close to the surface in contact with the base 60.

  As shown in FIG. 9D, as a result, the element mother substrate 62 is divided into several strip substrates 73.

FIG. 10A and FIG. 10B are diagrams corresponding to step S8. Next, as shown in FIG. 10A, the opposing strip substrate 55 is disposed on the base 60 made of an elastic material, and the place facing the crack surface 70 is pressed using the pressing member 61. The counter strip substrate 55 sinks into the table 60, and tension acts on the crack portion 58. The opposing strip substrate 55 breaks up and breaks starting from a crack portion 58 close to the surface in contact with the table 60.
As shown in FIG. 10B, as a result, the crack surfaces 70 of all the V opposing cut surfaces 68 formed on the opposing strip substrate 55 are divided.

  FIG.10 (c) and FIG.10 (d) are figures corresponding to step S9. Next, as shown in FIG. 10C, the element mother substrate 62 is placed on the base 60 made of an elastic material, and the place facing the crack surface 71 is pressed using the pressing member 61. The element mother substrate 62 sinks into the base 60 and tension acts on the crack portion 58. The element mother substrate 62 breaks and breaks starting from a crack portion 58 close to the surface in contact with the base 60.

  As a result, as shown in FIG. 10D, the crack surface 71 of the V element cut surface 67 formed on the element mother substrate 62 is divided, and several liquid crystal display devices 33 are formed from the strip substrate 73. .

  A liquid crystal display device 33 is completed by attaching a polarizing sheet (not shown) to the TFT array substrate 34 and the counter substrate 35 shown in FIG.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, in the first substrate forming step of step S11, a part of the outer shape including the end face 55d is formed in the counter mother substrate 51, and the counter strip substrate 55 is formed. Subsequently, the opposing strip substrate 55 and the element mother substrate 62 are joined. After the opposing strip substrate 55 and the element mother substrate 62 are joined, in order to scribe the opposing strip substrate 55, laser light is irradiated to the end surface 55d shown in FIG. 7B formed by scribing and dividing in step S11. And never scribe.

  In the element mother substrate 62, wirings 42a are formed at positions facing the end face 55d. Since the wiring 42a is not irradiated with laser light to form the end face 55d, the wiring 42a is not damaged.

  (2) According to this embodiment, the data line driving circuit 39, the mounting terminal 40, and the scanning line driving circuit 41 are electrically connected by the wiring 42a made of aluminum, and are damaged when irradiated with laser light. There is a possibility of disconnection. As described in the effect (1) of this embodiment, this wiring is not irradiated with laser light to form the end face 55d, and thus is not damaged. Accordingly, the wiring 42a is not disconnected in order to form the end face 55d.

  (3) According to this embodiment, the positioning mark 53 is formed on the opposing strip substrate 55, and the positioning mark 64 is formed on the element mother substrate 62. In step S3, since the relative positions of the opposing strip substrate 55 and the element mother substrate 62 are aligned using the positioning mark 53 and the positioning mark 64, alignment can be performed with high positional accuracy.

  (4) According to the present embodiment, the counter strip substrate 55 is formed in step S11, and bonded to the element mother substrate 62 in step S3. On the counter strip substrate 55, a color filter 44, a light shielding film 45, a counter electrode 46, and the like corresponding to the plurality of liquid crystal display devices 33 are formed. Compared to the case where the counter substrate 35 is divided individually and then bonded to the element mother substrate 62, a plurality of the counter substrates 35 can be bonded by one bonding step, so that the number of times of bonding the counter substrate 35 can be reduced. Therefore, it can be manufactured with high productivity.

  (5) According to the present embodiment, in the first substrate second forming process of step S12, the laser beam is not disposed on the optical axis to be irradiated with the laser beam, with no wiring, elements, mounting terminals 40, seals 36, etc. Is being irradiated. Therefore, the liquid crystal display device 33 can be an electro-optical device in which wiring, elements, mounting terminals 40, seals 36, and the like are manufactured without being damaged by the laser light and are manufactured with high quality.

(6) According to the present embodiment, the laser beam is used to arrange and form the crack portions 58 inside the substrate and scribe. Therefore, it is possible to scribe with less generation of glass powder.
(Second Embodiment)

Next, an electronic apparatus provided with the liquid crystal display device 33 of the first embodiment will be described.
FIG. 11 is a schematic perspective view showing an example in which a liquid crystal display device is mounted on a personal computer. As shown in FIG. 11, the main body of a personal computer 80 as an electronic apparatus includes a display device 81 that displays information. The display device 81 is provided with the liquid crystal display device 33 manufactured according to the first embodiment. The display device 81 arranged in the personal computer 80 is manufactured according to the above-described embodiment, and the substrate in the display device 81 is divided by being scribed without being damaged by the laser beam and the elements arranged on the substrate. Yes. Therefore, the personal computer 90 is an electronic device provided with a liquid crystal display device 33 in which a device or the like arranged on a substrate is scribed and divided without being damaged by a laser beam.

In addition, this invention is not limited to embodiment mentioned above, A various change and improvement can also be added. A modification will be described below.
(Modification 1)
In the first embodiment, the counter mother substrate 51 is scribed using laser light to form the counter strip substrate 55, but the present invention is not limited to this. The counter mother substrate 51 may be divided using a glass cutter (glass scriber). Here, the glass cutter is moved while applying pressure on the substrate using a diamond piece or a carbide piece and a ring formed with a hard material such as diamond or cemented carbide on the surface, The blade tool which damages a board | substrate and forms a crack is shown.

  The method of scribing using a glass cutter only forms cracks on the surface of the substrate, and it can be manufactured in a shorter time than the method of scribing by forming the modified portions by using a laser beam. it can. As a result, it can be scribed and divided with good productivity.

(Modification 2)
In the first embodiment, the counter mother substrate 51 is scribed using laser light to form the counter strip substrate 55, but the present invention is not limited to this. You may cut | disconnect using a dicer-type cutting machine. The end face to be cut can be formed with high positional accuracy.

(Modification 3)
In the first embodiment, the element mother substrate 62 and the counter strip substrate 55 are bonded in the bonding step of step S3. In the element mother substrate 62, the wiring is arranged at a location facing the end surface 55d of the opposing strip substrate 55, but this is not restrictive. Since any element such as the data line driving circuit 39, the mounting terminal 40, and the scanning line driving circuit 41 is not irradiated with laser light, it can be scribed and divided without being damaged.

(Modification 4)
In the first embodiment, the counter strip substrate 55 is formed from the counter mother substrate 51 and bonded to the element mother substrate 62. However, the present invention is not limited to this. A counter substrate 35 corresponding to each liquid crystal display device 33 may be formed from the counter mother substrate 51 and bonded to the element mother substrate 62.

(Modification 5)
In the first embodiment, the scribing is performed in steps S4 to S6 and the processing is divided in steps S7 to S9. However, the present invention is not limited to this. Step S8 is performed after step S4, and the opposing strip board | substrate 55 is parted. Next, step S5 to step S7 may be performed, and step S9 may be performed to divide the element mother substrate 62. That is, the step of scribing and the step of dividing may be performed alternately. Since the reforming part 57 can be divided before aging, it can be divided with high quality.

(Modification 6)
In the first embodiment, quartz glass is used for the TFT array substrate 34 and the counter substrate 35. However, the present invention is not limited to this. Any brittle material that has optical transparency and can constitute the liquid crystal display device 33 may be used. Non-alkali glass such as Neoceram (registered trademark), optical glass, crystal and the like.

(Modification 7)
In the first embodiment, the method for dividing a substrate of the present invention is used for the liquid crystal display device 33, but it can also be used for electro-optical devices other than the liquid crystal display device 33. As an electro-optical device provided with a substrate, for example, it can be suitably used as a means for dividing a substrate in a plasma display, an organic EL (ELECTROLUMINESCENCE) display, a vacuum fluorescent display, a field emission display, or the like. In any case, it is possible to provide an electro-optical device including a substrate that is chamfered in the step of dividing the substrate.

  (Modification 8) In the second embodiment, the liquid crystal display device 33 is used as the display unit 81 of the personal computer 80. However, the present invention is not limited to this. For example, electronic book, mobile phone, digital still camera, LCD TV, viewfinder type or monitor direct view type video tape recorder, car navigation device, pager, electronic notebook, calculator, word processor, workstation, video phone, POS terminal, touch panel It can be suitably used as an image display means of electronic equipment such as. In any case, it is possible to provide an electronic device including the liquid crystal display device 33 that is divided by scribing the display portion with low laser light intensity.

Schematic which shows the structure of the laser irradiation apparatus which concerns on 1st Embodiment. FIG. 3 is a schematic plan view of a liquid crystal display device. 1 is a schematic cross-sectional view of a liquid crystal display device. The flowchart of the dividing method of a board | substrate. The schematic diagram of an opposing mother board | substrate. The figure explaining the division | segmentation method of a board | substrate. The schematic diagram of a mother board. The figure explaining the division | segmentation method of a board | substrate. The figure explaining the division | segmentation method of a board | substrate. The figure explaining the division | segmentation method of a board | substrate. The schematic perspective view which shows the personal computer which concerns on 2nd Embodiment.

Explanation of symbols

33 ... Liquid crystal display device as electro-optical device, 34 ... TFT array substrate as second substrate, 35 ... Counter substrate as first substrate, 40 ... Mounting terminal as electrode, 42a ... Wiring, 51 ... First Opposing mother substrate as a mother substrate, 53, 64 ... Positioning mark as a mark, 55 ... Opposing strip substrate as a first strip substrate, 55d ... End face as a side, 56 ... Laser light, 57 ... Modification part, 62 ... An element mother substrate as a second mother substrate.

Claims (8)

A method of manufacturing an electro-optical device, which is formed by bonding a first substrate and a second substrate,
A first substrate first forming step of dividing a first mother substrate in which the first substrate is formed in a plurality of rows and a plurality of columns to form a first strip substrate in which the first substrate is formed in a row; A bonding step of bonding a strip substrate and a second mother substrate in which the second substrate is formed in a plurality of rows and columns;
A first substrate second forming step of dividing the first strip substrate to form the first substrate;
A second substrate forming step of dividing the second mother substrate to form the second substrate;
In the first substrate second forming step, the modified portion is formed by irradiating the first strip substrate with laser light, and the divided portion is divided. A method of manufacturing the electro-optical device according to claim 1,
In the first strip substrate, a member that is damaged by laser light irradiation is disposed at a location of the second mother substrate facing a part of a side formed by dividing the first mother substrate. A method for manufacturing an electro-optical device. A method of manufacturing the electro-optical device according to claim 2,
The electro-optical device manufacturing method, wherein the damaged member is an electrode or a wiring. A method for manufacturing an electro-optical device according to claim 1,
In the first substrate first forming step, the modified portion is formed by irradiating the first mother substrate with laser light, and the method is divided. A method for manufacturing an electro-optical device according to any one of claims 1 to 4,
In the second substrate forming step, the modified portion is formed by irradiating the second mother substrate with laser light, and the method is divided. A method for manufacturing an electro-optical device according to any one of claims 1 to 5,
A mark is formed on the first strip substrate and the second mother substrate,
In the joining step, a relative position between the first strip substrate and the second mother substrate is determined using a mark formed on the first strip substrate and a mark formed on the second mother substrate. A method of manufacturing an electro-optical device, characterized by joining together.   An electro-optical device manufactured using the method for manufacturing an electro-optical device according to claim 1. An electronic apparatus comprising the electro-optical device according to claim 7 in a display unit.

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