JP2007535126A - System for processing workpieces - Google Patents

Abstract

  A workpiece processing system including a processing head assembly and a base assembly, the processing head assembly having a processing head and an upper rotor, and the base assembly having a base and a lower rotor. The base and the lower rotor are provided with magnets, and the magnetic force generated by the magnets allows the upper rotor to engage with the lower rotor, and the upper and lower rotors engaged are processing chambers in which semiconductor wafers are placed for processing. Form. A processing fluid for processing the workpiece is optionally introduced into the processing chamber while the processing head rotates the workpiece. In addition, particles applied on the workpiece are reduced by the air flow around the processing chamber and through the processing chamber.

Description

Detailed Description of the Invention

The present invention is formed from, for example, a semiconductor wafer, a flat panel display, a rigid disk or optical medium, a thin film head, or a substrate on which a microelectronic circuit, data storage element or layer, or micromechanical element is formed. It relates to the surface treatment, cleaning, rinsing and drying of workpieces, such as other workpieces. These and similar articles are collectively referred to herein as “wafers” or “workpieces”. In particular, the present invention relates to a workpiece processing apparatus and system for processing semiconductor workpieces.
(Background technology)

  The semiconductor manufacturing industry continually seeks to improve the processes and equipment used to manufacture microelectronic circuits and components, such as the manufacture of integrated circuits from wafers. Many of these improved processes and equipment include the following objectives: reducing the time it takes to process a wafer to form the desired integrated circuit; for example, reducing contamination of the wafer during processing. Increase the yield of usable integrated circuits per wafer; reduce the number of steps required to create the desired integrated circuit; improve the uniformity and efficiency of the process used to create the desired integrated circuit And reducing manufacturing costs.

  As the semiconductor industry increases the specification of particle “adders”, the number and size of allowable particle contamination in the manufacture of semiconductor wafers continues to decrease. Existing equipment will not be sufficient for future particle specifications.

Furthermore, wafer processing often requires the application of a fluid in the form of a liquid, vapor or gas to one or more sides of the wafer. These fluids are used, for example, for wafer surface etching, wafer surface cleaning, wafer surface drying, wafer surface passivation, thin film deposition on the wafer surface, thin film or masking material removal from the wafer surface, etc. Is done. Controlling how processing fluid is applied to the wafer surface, reducing the possibility of cross-contamination of processing fluid, and effective cleaning or rinsing of processing fluid from the processing chamber surface are often critical to the success of processing operations It is.
(Disclosure of the Invention)

  In the manufacture of microelectronic devices and similar devices, a new wafer processing system has been invented that represents a significant improvement in motors. This new system reduces particle contamination. As a result, the final product defects are reduced. This reduces the total amount of raw materials, processing fluids, time, effort and effort required to manufacture the microelectronic device. Thus, the new wafer processing system of the present invention significantly increases manufacturing yield.

  A unique workpiece processor design has been invented that significantly reduces cross contamination of processing fluids. This unique design also greatly enhances the ability to drain steam and fume and drain the processing fluid during processing of semiconductor wafers from the processing chamber. Furthermore, the processing apparatus of the present invention utilizes a relatively simple magnetic rotor engaging mechanism, which is a variation in the effects of vibration due to variations in production technology from one processing apparatus to another. Decrease. As a result of these design improvements, the effects of wafer processing are more consistent from one workpiece processing apparatus to the next, and higher manufacturing quality standards and efficiency improvements are achieved.

  In one embodiment, the wafer processing system of the present invention comprises plating, etching, cleaning, passivation, deposition of a thin film or masking material on the surface of the workpiece, and / or thin film or masking from the surface of the workpiece. Multiple workpiece stations are provided for material removal. The system includes a robot that is movable between workpiece stations and moves the workpiece from one station to another. At least one of the workpiece stations includes a workpiece processing apparatus having an upper rotor and a lower rotor that are engageable to form a workpiece processing chamber. The magnetic force between the repelling magnets is utilized to maintain contact between the rotors during operation of the processing apparatus. This unique processing chamber design reduces the vibrations that are a major cause of particle contamination, and further reduces the flow of processing fluid to the processed wafer surface that can cause defects or failures in the final product of the microelectronic device. The possibility of leakage is also reduced. In one embodiment, the upper rotor is magnetically driven to contact the lower rotor. In other embodiments, the lower rotor is magnetically driven to contact the upper rotor. In either embodiment, a face seal is preferably provided between the upper and lower rotors.

  The wafer processing system of the present invention is also designed to increase the airflow through the workpiece processing apparatus during processing. Better airflow management reduces particle contamination and increases overall processing efficiency. As a result, the time, material and energy consumed are reduced. In particular, the processing apparatus according to the present invention has an airflow path that draws outside air from a small environment (mini-environment) surrounding the processing apparatus into the processing head and discharges it through a lower portion of the processing apparatus. Have in. In addition, a base and an annular channel formed in the upper edge of the base relieve pressure generated in the processing chamber. The opening at the upper edge of the base receives “blow-by” fluid during operation. The annular channel allows the “spray” fluid to flow out to the discharge port and release the generated pressure. Furthermore, an air suction device (aspirator) is connected to a ring positioned below the motor in the processing head. The aspirator aspirates any gaseous fluid coming from an airflow passage in the processing head or an annular channel in the base. In addition, a processing fluid nozzle in the base, which extends upward through the central opening of the processing head and upper rotor, and further through the opening in the lower rotor, is connected to the snorkel during operation. The air can be drawn directly into the workpiece processing apparatus. As a result of these design improvements, the air flow to the processing chamber is greatly enhanced, achieving more consistent processing and increased efficiency.

  In another embodiment, the new processing system of the present invention includes a first rotor having a plurality of alignment pins and one or more openings for receiving alignment pins to form a workpiece processing chamber with the first rotor. The 2nd rotor which has is provided. This rotor design keeps the first rotor in the middle of the lower rotor and also keeps the workpiece in the middle of the processing chamber. Thus, by reducing defects in microelectronic products or other end products, and by increasing the number of device chips that are manufactured on a wafer basis, system manufacturing yield, or efficiency, is increased.

  Another additional feature of one embodiment of the new system is the provision of a workpiece processing apparatus having a substantially annular opening on the outer periphery of the fluid applicator in the first rotor. The fluid applicator is positioned to deliver processing fluid to a central region of the workpiece within the processing chamber. The purge gas line is positioned to deliver purge gas toward the workpiece into the annular opening. As a result, the delivery of the purge gas to the processing chamber and the overall dispersion become more constant. As a result, the processing fluid is more efficiently removed from the processing chamber. As a result, manufacturing is more consistent and workpiece defects are reduced.

  In another separate aspect of the invention, the new system includes a fluid applicator in a second rotor that delivers processing fluid to an edge of the workpiece located in the processing chamber. One or more drain openings are preferably located in the first rotor to remove processing fluid from the processing chamber. Purge gas is advantageously delivered across the workpiece top surface. In one embodiment, a shield plate is positioned above the fluid applicator to direct processing fluid to the edge of the workpiece. In another embodiment, the fluid delivery path extends from the fluid applicator and terminates at the edge of the workpiece to deliver the processing fluid directly to the edge of the workpiece. These designs provide improved edge processing of the workpiece as well as improved particle removal from the processing chamber. Thus, particle deposition at the edge on the workpiece is substantially reduced or eliminated.

  One feature of the present invention is a new system that includes an upper rotor that is engageable with a lower rotor to form a workpiece processing chamber. The upper rotor has a central air inlet opening. This rotor design provides an airflow path through the processing chamber that tends to avoid contamination particles coming into contact with the workpiece. Thus, by reducing defects in microelectronic products or other end products, the manufacturing yield and efficiency of the system is increased.

  Another separate feature of the present invention is a fluid applicator or nozzle that is movable within a central air inlet opening to distribute processing fluid to different portions of the workpiece within the processing chamber. is there. The fluid delivery line leading to the nozzle preferably includes a collection portion that collects the processing fluid when fluid delivery to the nozzle is stopped. This prevents the processing fluid from dripping excessively onto the workpiece. As a result, manufacturing is more consistent and defects are reduced. The nozzle is preferably movable away from the upper rotor member, thereby raising the upper rotor member to facilitate loading the workpiece into the processing chamber.

  Another separate feature of the present invention is a movable drain assembly having a plurality of drain paths. Each drain path can be separately aligned with the processing chamber by moving the drain assembly to align the single drain path with the processing chamber. As a result, spent liquid processing chemicals can be separately removed, collected, and regenerated or processed for disposal. Mixing of spent liquid processing chemicals is avoided. Thus, the process is not very complicated or expensive.

Other features and advantages of the present invention will become apparent below. The features of the invention described above can be used separately or together, or in various combinations of one or more thereof, without having a single feature that is fundamental to the invention. The invention also comprises sub-combinations of the features described. The processing chamber can be used alone or in a system with robotic automation or various other processing chambers.
(Best Mode for Carrying Out the Invention)
1 to 3

  As shown in FIGS. 1 to 3, the processing system 10 includes a housing 15, a control / display 17, an input / output station 19, and a plurality of processing stations 14. The workpiece 24 is removed from the carrier 21 at the input / output station 19 and processed inside the system 10.

  The processing system 10 includes a support structure for the plurality of processing stations 14 inside the housing 15. At least one processing station 14 includes a workpiece processing device 16 and an actuator 13 that opens and closes the processing device 16. The processing apparatus 16 of the present invention is described, for example, in pending U.S. Patent Application No. 60 / 476,786, filed Jun. 6, 2003, U.S. Patent Application No. 10, filed Oct. 22, 2003. / 691,688, designed to be utilized within processing system 10 as disclosed in US patent application Ser. No. 10 / 690,864, filed Oct. 21, 2003. These US patent applications are incorporated herein by reference. The system 10 performs various functions including, but not limited to, a plurality of processing devices 16 or in addition to one or more processing devices 16, electrochemical processing, etching, rinsing, and / or drying. Other processing modules that can be configured as described above may be provided.

Although the system 10 of FIG. 2 is shown having ten processing stations 14, any desired number of processing stations 14 may be included in the enclosure 15. The processing station support preferably comprises a centrally located and longitudinally oriented platform 18 between each processing station 14. One or more robots 26 having one or more end effectors 31 deliver the workpiece 24 to and from the various processing stations 14 and further move the workpiece 24 into the processing station 14. The inside of the housing 15 is moved so as to load and unload to the outside. In the preferred embodiment, the robot 26 moves linearly along a track 23 in the space 18. The processing fluid source and the fluid supply conduit associated therewith are provided in a housing 15 below the platform 18 in fluid communication with the workpiece processing device 16 (shown in FIG. 3) and other processing stations 14. Can do.

Explanation regarding FIGS. 3 to 21

  3 to 11 show a workpiece processing apparatus 16 according to the present invention. The processing device 16 includes a processing head assembly 28 and a base assembly 30. The head assembly 28 includes a processing head 29, a head ring 33, an upper rotor 34, a fluid applicator 32, and a motor 38. The base assembly 30 includes a mounting base 40, a lower rotor 36, and a bowl mount 43. Head assembly 28 is movable vertically to engage and disengage from base assembly 30. The head assembly 28 and the base assembly 30 form a processing chamber 37 in which the upper rotor 34 and the lower rotor 36 are positioned.

  5-11, the process fluid applicator 32 extends upwardly from the central portion of the head assembly 28 and further extends downwardly through the sleeve 96 into the head assembly. Air inlet 140 and process fluid inlets 92, 94 are positioned in sleeve 96. The air inlet 140 and the processing fluid applicator 32 penetrate downward through the central opening in the processing head 29, the head ring 33, and the upper rotor 34. A processing fluid supply line (not shown) is connected to the upwardly extending portion of the processing fluid applicator 32 to deliver processing fluid into the workpiece processing chamber. The motor 38 is positioned into the head 29 and is coupled to the upper rotor 34. During operation, the motor 38 rotates the upper rotor 34. The head ring 33 attaches the upper rotor 34 and the motor 38 inside the head 29. The automated actuator 13 is attached to a head assembly 28 that moves the processing head assembly 28 from an open position for loading / unloading the workpiece into and out of the processing chamber 37 by the robot 26 to a closed position for processing the workpiece. Move. As will be described in more detail below, the head assembly 28 has a plurality of air inlets and passageways that are effective in the improved airflow management of the present invention.

  The lower rotor 36 of the base assembly 30 has an engagement ring 110 with three tabs 114, and a groove (slot) disposed at the bottom of the base 40 for attaching the lower rotor 36 to the base 40. ) With the mounting member 144. The tab 114 of the engagement ring 110 cooperates with the slot of the mounting member 144 to form a bayonet connection. In the base 40, at least a first annular magnet 42 is disposed. The lower rotor 36 includes at least one second magnet 44. It should be understood that instead of using a single annular magnet in the base 40 and lower rotor 36a, a plurality of non-annular magnets can also be used. The first magnet 42 and the second magnet 44 are adjacent to each other and have similar polarities. By using a magnet having a similar magnetic field and polarity, the first magnet 42 and the second magnet 44 repel each other, and thereby the lower rotor 36 is biased upward from the base 40 by a magnetic force. When the head assembly 28 and the base assembly 30 are separated, the magnetic force of the magnets 42, 44 separates the lower rotor 36 from the base 40, so that the tab 114 of the engagement ring 110 securely engages the base mounting member 144. As a result, it provides the necessary bayonet connection.

  When the head assembly and the base assembly are engaged, the actuator 13 lowers the head assembly 28 until the upper rotor 34 contacts the lower rotor 36. Due to the additional force from the actuator 13, the upper rotor 34 is pushed down onto the lower rotor 36 and, further, by the magnets 42, 44 until the head ring 33 is seated on the base, as shown at 33A in FIG. 7A. It is pushed down against the generated repulsive force. When the head ring 33 is seated on the base, the contact between the tab 114 of the engagement ring 110 and the mounting member 144 is released, and the lower rotor 36 can freely rotate together with the upper rotor 34. The repulsive force generated by the magnets 42 and 44, with the head ring 33 and base 40 in the position shown in FIGS. Maintain contact between the upper and lower rotors until raised to load / unload.

  With reference to FIGS. 5-7 and FIGS. 12-16, the base 40 includes an annular plenum 80 having several (eg, four) drains 82. The drain 82 is pneumatically operated via a poppet valve 84 and an actuator 86. Each drain 82 is provided with a matching connector 88 that provides a separate path for directing different types of process liquids to an appropriate system (not shown) for storage, disposal or recirculation. Thus, cross contamination of the processing fluid is minimized. As best shown in FIGS. 5-7, 18A-18C, and 20A-20C, the lower rotor 36 has a skirt 48 that faces down into the annular plenum 80. To allow the processing fluid to flow into the annular plenum 80 and through the drain 82.

  5-7, 18A-18C, and 20A-20C, the lower rotor 36 has a plurality of pins extending upward from the surface thereof. First, the lower rotor 36 includes a plurality of isolation (stand-off) pins 50. When the workpiece 24 is loaded into the processing chamber 37, the workpiece 24 is initially positioned on the isolation pin 50. The lower rotor 36 also includes a plurality of alignment pins 52 that align the workpiece 24 in the xy plane and place it in the center when the workpiece 24 is loaded into the processing chamber 37. The alignment pin 52 extends farther from the surface 150 of the lower rotor 36 than the isolation pin 50 to prevent the workpiece 24 from becoming misaligned in the processing chamber 16. Finally, the lower rotor 36 comprises at least one, preferably a plurality of engagement pins 54. The engagement pin 54 is formed from a compressible material to provide a slanted termination that enhances coupling with the upper rotor 34 (as described below) and flexible contact with the upper rotor 34. Preferably, it has an annular gasket or O-ring (56).

  Referring to FIGS. 5 to 7, 17A to 17C and FIGS. 19A to 19C, the upper rotor 34 includes a plurality of isolation pins 120 and countersinks 46. In operation, and best shown in FIGS. 5-7, the workpiece 24 (not shown) is received between the isolation pin 120 of the upper rotor 34 and the isolation pin 50 of the lower rotor 36. The workpiece processing chamber 37 is formed between the inner surface 148 of the upper rotor 34 and the inner surface 150 of the lower rotor 36. Isolation pins 50, 120 do not secure the workpiece 24 between them, but instead house the workpiece within the desired clearance, allowing the workpiece 24 to be "clocked" slightly. I.e., allow to float within the desired clearance during processing. This prevents the workpiece 24 from being squeezed and accidentally damaged, allowing a larger surface area of the workpiece 24 to be processed. In the preferred embodiment, there is a 0.02 inch clearance between the isolation pins 50, 120 to allow the workpiece 24 to "clock" during processing. This configuration allows the entire surface of the workpiece 24 to be treated, including the surface area otherwise covered by the isolation pins 50, 120.

  With particular reference to FIG. 5, when the upper rotor 34 is engaged with the lower rotor 36, the angled end of the engagement pin 54 is associated with a corresponding one of the holes 46 in the upper rotor 34 (FIG. 17C). Inserted). An annular compressible gasket or O (“O-”) ring 56 enhances the contact between the upper rotor 34 and the lower rotor 36 and also acts as a vibration damper when the processing chamber 16 is used.

  The overall configuration of the upper rotor 34 and the lower rotor 36 is as described above, but the specific configuration can be changed depending on the desired process to be performed in the processing chamber 16. For example, FIGS. 17A-17C and 18A-18C show an upper rotor 34 and a lower rotor 36 that are utilized in a process that removes polymer or masking material from the wafer surface. In this preferred embodiment, the rotor configuration follows the outline shown above. However, as shown in FIGS. 17A-17C, the upper rotor 34 is sectioned or provided with a notch 160 so that the processing fluid can exit the processing chamber 37 more freely. .

  However, in different processes it may be preferred to give a slight change to the rotor configuration described above. For example, a rotor configuration for a process commonly known as “back-tilted etching” is disclosed in FIGS. 19A-19C and 20A-20C. In general, in a “back-tilted etch” process, a chemical solution (in order to etch or selectively remove a metal or oxide film from the back and / or peripheral edge of the wafer (ie, the sloping edge). For example, hydrofluoric acid) is provided. During this process, a chemical solution is supplied to the back and slopes, while the upper side of the wafer is supplied with an inert gas or deionized water rinse or alternative process solution. After etching, the etched side of the wafer and preferably both sides of the wafer are supplied with a rinse with deionized water, spun for fluid removal and dried with heated nitrogen. A detailed description of a semiconductor etch process including a “back-tilt etch” process is disclosed in US Pat. No. 6,632,292, assigned to the assignee of the present invention and incorporated herein by reference. .

  In the preferred embodiment, the upper rotor 34 utilized for the “back-tilted etch” process is disclosed in FIGS. 19A-19C. The upper rotor 34 includes a processing fluid passageway 108 that communicates with an annulus 146 formed in the inner surface 148 of the upper rotor 34. 20A to 20C, the lower rotor 36 suitable for use in the “back inclined etching” process includes a seal member 118 extending on the outer periphery of the lower rotor 36. The seal member 118 is preferably formed from a compressible material. When the upper rotor 34 and the lower rotor 36 are engaged, the seal member 118 is deformed and creates a contact surface seal with the rotor. Contact surface seals are not perfect seals. That is, even with a contact surface seal, a “leak” is provided to allow draining of the processing chamber 37. The magnetic force from the magnets 42, 44 keeps the lower rotor 36 and the upper rotor 34 engaged and keeps the contact seal in place during processing. During the “back-tilted etch” process, the acidic processing fluid provided to the back side of the wafer wraps around the perimeter or beveled edge on a portion of the front side of the wafer. As a result, the acidic processing fluid is forced into the ring 146 formed in the inner surface 148 of the upper rotor 34 by the inert gas provided to the front side of the wafer, and further the processing fluid of the upper rotor 34. It is discharged through the passage 108.

  Turning to FIGS. 21A-21C, the head ring 33 includes a rim 162 and a vertical cylindrical alignment surface 164, as shown in FIG. 7A. When the head assembly 28 and the base assembly 30 are closed, the vertical cylindrical alignment surface 164 aligns the head ring 33 with the base 40 to ensure proper alignment between the upper rotor 34 and the lower rotor 36. The edge 162 is placed on the edge of the base 40.

  The improved airflow and process fluid draining aspects of the new wafer processing system shown in FIGS. 1-21 will now be discussed.

  First, the head assembly 28 has a number of air passages that draw ambient air from the assembly environment into the head assembly 28 and through the base 40 of the processing chamber 16. As shown in FIG. 6, the ring 136 is disposed in the head 29 just below the motor 38. The ring 136 is connected to an air suction device (not shown) that sucks gaseous vapor or particles from the motor 38 from the head 29. An aspirator tube (not shown) exits the head 29 via a service conduit attached to the support 130. Also, the negative pressure generated by the aspirator 132 acts to remove any gaseous vapor or fume coming from the head assembly 28 or other air passages in the base 40.

  Secondly, when moving to FIGS. 5 to 7 and FIGS. 21A to 21C, a plurality of vent holes 60 are formed in the head ring 33. As clearly shown in FIGS. 21A-21C, the vent 60 is formed by the inclined outer surface of the upper rotor 34 and the head ring 33 from the mini-environment in the housing 15 through the wind tunnel 124. Drawn into the internal volume or air gap 134. The internal air gap 134 communicates with a channel 137 that encloses both the upper rotor 34 and the lower rotor 36, and continues to descend into the annular drain cavity 80 formed in the recess of the base 40. Eventually, the process fluid vapor is exhausted through an exhaust port 82 formed in the annular drain cavity 80.

  Third, the processing chamber 16 of the present invention is also designed to relieve the increased inherent pressure experienced by performing operations within the closed processing chamber 16. 12 to 14, a plurality of openings 71 are formed in the upper edge 73 of the base 40. The opening 71 is connected to an exhaust channel 142 formed in the lower portion of the base 40. A pump or the like (not shown) is connected to the exhaust channel 142 through at least one, preferably two, exhaust ports 72 that create a negative pressure and path that exhausts the processing fluid through the channel 142 (FIG. 14). Is indicated by a broken line). Returning now to FIG. 5, when the head assembly 28 is lowered and engages the base 40, the annular plenum 70 formed in the head ring 33 covers the upper edge 73 of the base 40. The annular plenum 70 of the head ring 33 allows the opening 71 in the upper edge 73 to receive “blow-by” processing fluid during operation. These “blow-by” process fluids are exhausted by the negative pressure in the exhaust channel 142. This processing path is also indicated by a broken line in FIG. Accordingly, undesirable pressures generated in the processing chamber 37 during operation are minimized.

  Fourth, air is introduced directly into the workpiece processing chamber through openings in the head assembly 28 and base assembly 30. Returning to FIGS. 12-16, the base assembly 30 includes a centrally positioned processing fluid applicator 62 that extends upwardly from the base 40. In general, the processing fluid may be a liquid, vapor or gas or a liquid / vapor / gas combination. The processing fluid applicator 62 in the base assembly 30 includes a back vent opening 64. In the preferred embodiment, the treatment fluid applicator 62 includes a plurality of back vent openings 64. The rear discharge port gap 64 communicates with the snorkel 68 via a wind tunnel 66 provided with the snorkel 68. The snorkel 68 is open toward the mini-environment in the housing 15 and allows air to be delivered directly to the back of the workpiece. Returning to the head assembly 28 and FIGS. 3 to 7, an air inlet 140 is formed in the central portion of the assembly 28. One end of the air inlet 140 is open toward the mini-environment and one end is open into the workpiece processing chamber through the opening 106 in the upper rotor 34. . Thus, air is drawn from the mini-environment to the workpiece processing chamber to supply air directly to the top and back of the workpiece.

  In operation, process fluid is supplied to the top and back of the workpiece. The processing fluid applicator of the present invention will now be discussed in more detail. Both head assembly 28 and base assembly 30 include a processing fluid applicator. Referring to FIG. 13, the base assembly 30 has a processing fluid applicator 62 within the base 40. The applicator 62 includes a connector 74 that connects the processing fluid applicator to various processing fluid supplies. Accordingly, the applicator 62 includes additional ports; for example, side slotted ports 76 and openings 78. The port and opening of the processing fluid applicator 62 directs processing fluid upward through the opening 112 in the lower rotor 36 toward the rear workpiece surface. For example, in a preferred embodiment, air is supplied through vent gap 64 and etchant (eg, hydrofluoric acid, sulfuric acid, or mixed acid / oxidizer) is supplied through side fluted port 76 and deionized water. Is supplied through the first opening 78 and nitrogen and isopropyl alcohol are supplied through the second opening 78. The applicator 62 may also include a purge nozzle that directs a purge gas flow, such as nitrogen across the surface of the workpiece.

  5-11, the head assembly 28 also includes a processing fluid applicator 32 as described above. The applicator 32 directs the flow of processing fluid through the inlets 92, 94 and through the openings 100 of the heads 29, 106 in the upper rotor 34, respectively, into the workpiece processing chamber. 35. The processing fluid provided through the nozzle 35 and the inlets 92 and 94 may be the same fluid or different fluids. Examples of such processing fluids include air nitrogen, isopropyl alcohol, deionized water, hydrogen peroxide, ST-250 (post ash residue removal solution), etchant (eg, hydrofluoric acid, sulfuric acid), or any of its There are combinations. The nozzle 35 and inlets 92, 94 extend axially downward through a sleeve 96 (including the air inlet 140) in the head 29 so as not to impede rotation of the upper rotor 34 coupled to the motor 38.

  Here, the operation of the new wafer processing system shown in FIGS. 1 to 21 will be described. When the processing head assembly is in the open position, the robot 26 loads the workpiece 24 into the processing chamber 37 and the workpiece 24 sits on an isolation pin 50 extending from the lower rotor 36. The actuator 13 begins to lower the base assembly 30 until it engages the head assembly 28. The shaft centering extension 122 of the head ring 33 initially contacts the chamber assembly to ensure that the head assembly 28 and base assembly 30 are axially aligned. The head assembly 28 continues to move downward until the upper rotor 34 contacts the lower rotor 36. Eventually, the force applied to the lower rotor 36 (from the actuator 13 passing through the upper rotor 34) overcomes the magnetic repulsive force between the magnet 42 of the baseball 40 and the magnet 44 of the lower rotor 36 (of the lower rotor 36). The engagement ring 110 is released from the grooved mounting member 144 (of the base 40). The engaging pin 54 of the lower rotor 36 is inserted into the corresponding hole 46 of the upper rotor 34. In order to align the engagement pin 54 with the hole 46, it may be necessary to rotate the rotors 34, 36 slightly.

  At this point in the operation of the processing apparatus 16, the processing chamber 37 is in a fully closed processing position. In this position, the top side of the apparatus or workpiece 24 and the inner surface 148 of the upper rotor 34 form the first processing chamber 102. The bottom side or back surface of the workpiece 24 and the inner surface 150 of the lower rotor 46 form a second processing chamber 104. As described above, the fluid applicator 32 introduces a processing fluid into the first processing chamber 102, while the fluid applicator 62 introduces a processing fluid into the second processing chamber 104. In the preferred embodiment, the motor 38 rotates either the upper rotor 34 or the lower rotor 36. Since the rotors 34, 36 are engaged, the workpiece 24 rotates, while processing fluid is applied to the top and back of the workpiece 24. The liquid flows outward on the workpiece 24 by centrifugal force. This coats the workpiece 24 with a relatively thin liquid layer. The tight tolerances between the upper and lower rotors 34, 36 and the workpiece 24 help to provide a controlled and uniform liquid flow. If used, the gas can purge or confine the liquid vapor, or provide chemical processing of the workpiece 24 as well. The rotational motion of the rotors 34, 36 drives fluid radially outward on the workpiece 24 and further directs it into an annular plenum 80 formed in the base 40. From there, the processing fluid exits base 40 through drain 82. Valve 84 controls the release of process fluid through fitting 88.

  After the processing is completed, the actuator 13 raises the head assembly 28 and moves it away from the base assembly 30 by operating the motor. In the system 10 shown in FIG. 2, the robot 26 moves along a track 23 and uses an end effector 31 to remove the workpiece 24 from the open processing chamber 16. Thereafter, the robot 26 moves along the linear track 23 for further processing of the workpiece 24 or to perform a transport operation at the input / output station 19.

Although the present invention has been described with respect to supplying different process fluids simultaneously to the bottom side of the apparatus and workpiece, a single process using two or more process fluids provided in succession through a single inlet. Multiple consecutive processes of the workpiece can be performed. For example, a processing fluid such as processing acid may be supplied by the lower processing fluid applicator 62 to the lower processing chamber 104 to process the lower surface of the workpiece 24, while an inert fluid such as nitrogen gas is used. , May be supplied to the upper processing chamber 102. In such a case, the treated acid can react with the lower surface of the workpiece 24, while the upper surface of the workpiece is effectively isolated from the hydrofluoric acid reaction.

Explanation regarding FIGS. 22 to 36

  Turning to FIGS. 22-24, another embodiment of a wafer processing system according to the present invention is shown. The system includes a processing device 150 having a head 153 and a base 163. Base 163 is preferably attached to frame 142 and does not move. The head 153 is supported on an actuator arm 151 that moves the entire head 153 up and down so that the head 153 and the base 163 are engaged / separated. The head 153 includes an upper frame ring 166 that is engageable with a lower frame ring 168 on the base. A cover 152 on the upper frame ring 166 isolates the internal components of the head 153 from the external environment. An upper rotor 156 in the head 153 is engageable with a lower rotor 158 in the base 163 to form a processing chamber 165 around the workpiece 160. When the head 153 is moved and engages or contacts the base 163, the upper rotor 156 moves and engages the lower rotor 158. A seal or “O-” ring 170 is preferably included between the flange 178 and the lower rotor 158 of the upper rotor 156 to control the flow rate within the processing apparatus 150.

  With further reference to FIGS. 22-24, the first or upper fluid applicator 157 delivers the processing fluid through the opening of the upper rotor 156, preferably to a central region on the upper surface of the workpiece 160. A second or lower fluid applicator 159 in the lower frame ring 168 passes processing fluid through the opening 190 in the lower rotor 158, preferably to a central region on the underside of the workpiece 160 and / or as described below. To the edge region of the workpiece 160. The first and second fluid applicators 157, 159 may include nozzles, orifices, brushes, pads, or other equivalents to apply or deliver processing fluid to the workpiece.

  One or more drain outlets 180 are preferably located near or at the outer edge of the upper rotor 156 or its edge so as to remove process fluid from the process chamber 165. In addition, one or more horizontal drain holes 181 extend through the flange 178. For example, in the preferred embodiment of FIGS. 28-29, three separated horizontally oriented drain holes (approximately 0.018-0.024 inches or approximately 0.4572 mm-0.6096 mm, respectively). Is provided to discharge process fluid trapped between the flange 178 and the lower rotor 158 above the seal 170.

  As shown in FIGS. 22 and 23, the motor 154 in the head 153 preferably includes a motor plate 164 attached to the upper rotor 156. The skirt 176 projects downward from the motor plate 164 and isolates the processing chamber from the upper and lower frame rings 166, 168. The motor 154 rotates the motor plate 164 and the upper rotor 156 in turn through a shaft 184 positioned about the first fluid applicator 157. When the upper rotor 156 engages the lower rotor 158, the two rotors 156, 158 rotate together. The first fluid applicator 157 is supported on the motor housing 155 and does not rotate with the upper rotor 156. The shaft 184 is supported on a bearing 262 and allows the shaft 184, the motor plate 164, and the upper and lower rotors 156, 158 to rotate about a vertical spin shaft 175.

  Turning to FIGS. 25-29, the upper rotor 156 includes a plurality of downwardly projecting alignment pins 200. Each alignment pin 200 preferably has a tapered tip. The alignment pins 200 are preferably located at least partially around the upper rotor 156 and, further, when the workpiece 160 is positioned within the processing chamber, each alignment pin 200 is at the edge of the workpiece 160. Positioned to contact. The alignment pins are arranged with strict dimensional tolerances concentric with the spin axis 175 or axis 184. As a result, the alignment pin 200 is centered on the workpiece 160 of the processing chamber, and the workpiece 160 is exactly concentric with the spin axis 175.

  Turning to FIGS. 30-34, a pair of spaced apart shoulders 192 are positioned on the outer edge of the lower rotor 158. The shoulder 192 includes a pin receiving surface in the form of a groove or slot 194 or individual hole that receives the tapered tip of the alignment pin 200. The slot 194 is preferably tapered so as to correspond to the tapered tip of the alignment pin 200.

  Each shoulder 192 on the lower rotor 158 supports the workpiece 160 and further includes a lower workpiece support pin 196 protruding upward to keep the workpiece 160 away from the inner surface or surface 195 of the lower rotor 158. Is preferred. The shoulder 192 is preferably separated and spaced to provide a load / unload slot 198 between the shoulders 192 for receiving an end effector or other workpiece loading device. Thus, the end effector that supports the workpiece 160 enters the lower rotor 158 through the slot 198 between the shoulders 192 and then sets the workpiece 160 on the lower support pin 196 when the processing device 150 is in the open position. Also good. 22, 30, and 32, the pins 196 on the shoulder 192 support the workpiece or wafer 160 in a plane P (shown by the dotted line in FIG. 32) above the upper surface 197 of the lower rotor. To do. Thus, the lower surface of the workpiece or wafer 160 is vertically spaced from the surface 197 by, for example, 2-10 or 4-6 mm. This allows the robot end effector to move under the workpiece in order to load / unload the workpiece into the processing apparatus. In contrast, as shown in FIG. 24, the spacing between the lower rotor inner surface 201 (FIG. 28) is fairly small, typically 1 mm (when the processing device is closed or in the processing position) 2 mm, 3 mm, or 4 mm. Further, as shown in FIG. 28, the surface 201 of the upper rotor has a section 203 slightly tapered in a conical shape at an angle of 2 to 8 degrees or 4 to 6 degrees.

  Turning to FIG. 34, the upper rotor 156 preferably includes a downwardly projecting upper workpiece support pin 210 to hold the workpiece 160 against the lower support pin 196. The upper support pins 210 are positioned at least 2 mm, 3 mm, 4 mm, 5 mm, or 6 mm radially inward from the outer periphery or edge of the workpiece 160 to contact the upper surface of the workpiece 160. It is preferable. By positioning the upper support pins 210 at least 4 mm from the outer periphery of the workpiece 160, the upper support pins 210 are out of the main fluid flow path during the edge processing of the workpiece 160, as described below. positioned. Thus, the result is a residual metal spot (eg copper plating) in the main fluid flow path resulting from the upper support pins positioned closer to the periphery of the workpiece.

  In addition, as shown in FIGS. 24 to 27, the shaft or shaft 184 of the motor 154 is directly connected to the motor plate 164 on the upper rotor assembly via the shaft plate 173. As a result, a more direct connection is made between the shaft 184 forming the spin axis and the pin 200 for positioning the workpiece. Compared to previous designs, the concentricity of rotation is improved (approximately ± 0.5 mm). In other designs where the workpiece is positioned by a pin or other mechanism on the lower rotor, the accumulation of dimensional tolerances results in a large eccentricity (eg, ± 9 mm) between the spin axis and the workpiece. I will let you.

  As shown in FIG. 24, the upper rotor 156 preferably has a liner or chamber plate 177 made of a corrosion resistant material, such as the registered trademark “Teflon” (fluororesin). This chamber plate is attached to a motor plate 164. The motor plate 164 and other components in the head 153 are typically metals such as stainless steel. As shown in FIGS. 30 to 32, the lower rotor is usually made of a corrosion-resistant material such as a registered trademark “Teflon” or plastic. Thus, the processing apparatus 150 is more resistant to corrosion caused by highly reactive gases or liquids used in processing, such as acids. The pin 200 is fixed in the motor plate 164 and passes through the chamber plate 177. Although the pins will be used more or less, the eight pins 200 are usually placed evenly spaced on the upper rotor.

  22-25, the cover 152; the motor housing 155; the motor 154, the fluid applicator 157, and the upper frame ring 166 are fixed in place on the head 153 or in the head 153, and cannot be raised vertically. Yes, but not rotating. Shaft or mandrel 184 (connected to or form part of the motor shaft); shaft plate 173; motor plate 164 including flange 178, skirt 176, and liner plate 177 is motor 154; When is turned on, they all rotate together.

  In or on base 163, lower frame ring 168; drain 208; valve 206; cam actuator 204; fluid applicator or nozzle 159 is preferably fixed in place and does not rotate. The lower rotor 158 includes the seal 170, cam 172, latch ring 174, and other accessory components shown in FIGS. 30-32, which are engaged by the upper rotor with the lower rotor engaging the upper rotor. When moved, it rotates with the lower rotor.

Turning to FIGS. 35 and 36, an annular opening 220 is provided around the manifold forming the first fluid applicator 157 as well as around the liquid delivery path 161 leading to the first fluid applicator 157. Yes. A purge gas such as N ₂ gas is supplied from the inlet 221 to the annular opening 220. An annular opening 220 extends from the inlet into the processing chamber. By delivering the purge gas to the processing chamber via the annular opening 220, the delivery of the purge gas to the processing chamber will remain very uniform, providing a more uniform and consistent process.

  With reference to FIGS. 1-2 and 22-36, a pod, cassette, carrier or container 21 has been moved to an input / output station 19 in use. If the container is sealed, such as a FOUP or FOSBY container, the container door is removed by the robot actuator of the system 10. Thereafter, the robot 26 removes the workpiece 160 from the container 21, places the workpiece 160 into the processing apparatus 150, and sets the workpiece 160 on the lower support pin 196 of the lower rotor 158. To place the workpiece 160 on the lower support pin 196, the robot 26 moves the end effector 31, or a similar device that supports the workpiece 160, through the load / unload slot 198 of the lower rotor 158, and the workpiece 160. Is lowered onto the lower support pin 196. Thereafter, the robot 26 pulls out the end effector 31 from the processing device 150. The processing device 150 can alternatively be provided as a stand alone manual loading system (without the input / output station 19, the robot 26, or the housing 15), although FIG. The automatic system shown in Fig. 2 is preferred.

  Thereafter, the upper and lower rotors 156, 158 are preferably brought together and engaged with each other by lowering the head 153 into contact with the base 163. As this happens, the upper rotor 156 descends toward the lower rotor 158. The tapered tip of the alignment pin 200 on the upper rotor 156 is positioned on the lower rotor 158 to center the upper rotor 156 on the lower rotor 158 and further form a processing chamber 165 around the workpiece 160. Into a tapered opening or slot 194. The inner edge of the tapered portion of each alignment pin 200 preferably contacts the edge of the workpiece 160 in order to center the workpiece 160 inside the processing chamber. As a result, the workpiece 160 is positioned coaxially with the vertical spin axis 175 of the processing chamber. This helps to provide uniform and efficient processing, particularly edge processing of the workpiece 160.

  When the upper rotor 156 is lowered to engage the lower rotor 158, the upper support pins 210 on the upper rotor 156 are on the upper surface of the workpiece 160 to secure or confine the workpiece 160 within the processing chamber. Proximity approach or contact. After the rotors are brought together, the cam actuator 204 in the base 163 is lowered, thereby pivoting the cam 172 and opening the latch ring 174 portion. The latch ring portion then moves outward in the radial direction and further into the groove 182 in the flange 178 of the upper rotor. This operation is described in US Pat. No. 6,423,642, which is incorporated herein by reference. In this manner, the lower rotor 158 is fixed to the upper rotor 156 to form a combined rotor unit or assembly 185 (FIGS. 26 and 27).

  Once the processing device 150 is in a closed or processing position, processing fluid is supplied to the upper and / or lower surface of the workpiece 160 through one or both of the first and second fluid applicators 157, 159. . The rotor unit 185 is rotated by the motor 154. Centrifugal force causes a continuous fluid flow across the surface of the workpiece 160. The processing fluid moves across the surface of the workpiece and radially outward from the center of the workpiece 160 to the edge of the workpiece 160.

  In the vicinity of the processing chamber 165, spent processing fluid is fed through the drain outlets 180 and / or other drain holes 181 or drain paths in the upper and / or lower rotors 156, 158 by centrifugal force through the processing chamber. Get out of. The spent fluid collects in the drain region 208 and can be delivered to a recycling system for reuse or a disposal region for proper disposal by opening the valve 206.

Upon completion of the processing step with the first processing fluid, a purge gas, such as N ₂ gas, is preferably delivered into the processing chamber 165 to assist in removing any residual processing fluid from the chamber. The purge gas is preferably delivered from the purge gas inlet 222 into the annular opening 220 around the first fluid applicator 157. The purge gas travels through the annular opening 220 and into the processing chamber 165. Thus, the purge gas is delivered through the process chamber into the interior of the process chamber in the form of an annular ring of gas that facilitates uniform distribution of the purge gas. As a result, processing fluid is more effectively and efficiently removed from the processing chamber.

  Once the first processing fluid is removed from the processing chamber, similar processing and purging steps can be performed for one or more additional processing fluids. A rinsing step, preferably using deionized (DI) wash water, may be performed after each processing step or after completion of all processing steps. A drying step performed with isopropyl alcohol (IPA) vapor or other drying fluid may be performed after the final processing or rinsing step.

Once processing is complete, head 153 is raised or detached from base 163 to allow access to workpiece 160. In this open position, workpiece 160 can be removed from the processing chamber by robot 26, and other workpieces 160 can be placed into the processing chamber by the same robot 26 or other robots.

Explanation regarding FIGS. 37 and 38

  Turning to FIGS. 37 and 38, two alternative embodiments of processing apparatus 150 for use in processing the edges of workpiece 160 are shown. In these embodiments, a fluid delivery path is provided to direct processing fluid to the edge of workpiece 160 so that edge processing can be performed. In these embodiments, the processing fluid can be supplied via the second flow applicator 159 or via a separate fluid delivery device.

  Referring to FIG. 37, a lower fluid delivery path 230 is formed between the shield plate 232 and the inner surface of the lower rotor 158. The shield plate 232 is coaxial with the round workpiece 160 and preferably has a smaller diameter, approximately 2-12 mm, or 4-10 mm, or 5-8 mm, than the workpiece. The processing fluid is supplied toward the center of the lower surface of the shield plate, and is further directed outward in the radial direction along the shield plate 232 by centrifugal force. Fluid exits from the peripheral edge of the shield plate and the outer edge of the workpiece 160. As a result, only the edge of the workpiece 160 is processed.

  In the example shown in FIG. 38, a fluid delivery path 240 is provided from the second flow applicator 159 (or other fluid source) directly to the edge of the workpiece 160. Thus, the processing fluid enters the processing chamber directly at the edge of the workpiece 160, as opposed to entering the center of the workpiece 160 and being directed toward the edge of the workpiece by the shield plate 232. enter. The fluid delivery path 240 may include a fluid delivery line 242 or may simply be one or more paths or holes in the lower rotor 158.

  If processing of the underside of the workpiece 160 is also desired in the embodiment shown in FIG. 38, a valve or similar device selectively directs fluid to the fluid delivery path 240 and the center of the workpiece 160. It is placed in the second flow applicator 159 for application. In one embodiment, the fluid delivery path 240 may be coupled to the second flow application by a rotating union or similar device so that the fluid delivery path 240 can rotate while the second flow applicator 159 is stationary. It is possible to connect to the device 159.

In the embodiment shown in FIGS. 37 and 38, the drain hole 236 in the upper rotor 156 and the drain path 238 in the lower rotor 158 will cause the processing fluid to exit the processing chamber. Purge gas such as N ₂ gas, so that the processing fluid does not contact the inside or central surface of the workpiece 160, during processing, so that the processing fluid is an auxiliary directing the exiting through drain hole 236, on the workpiece 160 And are preferably oriented radially outward. As shown in FIG. 38, a fluid delivery tube 186 for DI water typically extends through an opening or path 161 in the manifold 167. Tube 186 terminates water discharge at the lower end of manifold 167. When the tube 186 is washed away, the drips are reduced compared to those having a tube 186 that is slightly recessed or protruding from the manifold 167.

  As shown in FIGS. 37 and 38, the seal 170 is positioned in a groove or channel 171 around the exterior of the lower rotor 158. The chamfer 169 at the edge of the groove 171 reduces the possibility of fluid droplets remaining on the upper rotor, further falling on the workpiece, further causing damage and contamination during separation, or Help to prevent. Instead, as shown in FIG. 32, the edge of the groove 171 may be rounded or rounded.

  With further reference to FIGS. 37 and 38, the processor 150 uses an improved air and gas flow design that dramatically speeds drying of the workpiece. This reduces the required processing time and increases production efficiency or throughput. During drying, clean dry air (filtered and / or heated) flows through the openings 167 due to the low pressure zone created around the center of the processor by rotational motion. This air, indicated by arrow A in FIG. 36, hits the top surface of the workpiece and then flows outward. Also, when (nitrogen) gas is used during drying, the air mixes with the gas flowing from the annular opening 220. Thereafter, air and gas flow out through the drain holes. For example, compared to previous designs that required 60 seconds to dry, the processing apparatus shown in FIGS. 35 and 36 dries the workpiece in approximately 20 seconds.

The components of the processing apparatus of the processing system 10 may be made of any suitable material, such as registered trademark “Teflon” (synthetic fluorine-containing resin) or stainless steel. Within the processing system 10, any processing fluid commonly used for processing workpieces such as semiconductor wafers can be used. For example, aqueous or gaseous ozone, aqueous or gaseous HF or HCL, ammonia, nitrogen gas, IPA vapor, DI rinse water, H ₂ SO _4, etc. can be used to perform various processing steps. In applications where strong acids or solvents such as HF and H ₂ SO ₄ are used, it is preferred to use the registered trademark “Teflon” component so that the rotor component is not damaged by processing chemistry. The first and second fluid applicators 157, 159 are connected and have separate outlets for DI water, clean dry air, nitrogen, and one or more of the liquid processing chemicals described above. It is preferable. One or more valves can be used to control the flow of liquid and gas through the first and second fluid applicators 157, 159.

Additional system components such as IPA vaporizers, DI feeds, heating elements, flow meters, flow control valves / temperature sensors, valve mechanisms, etc. are also included in the processing system 10 as is common in existing systems. It may be provided. All of the various components of the processing system 10 may be under control by a controller unit with appropriate soft programming.

Explanation regarding FIGS. 41 to 46

  FIG. 41 shows the workpiece handling device 316 in the raised position, the open position, or the workpiece load / unload position. When in the open position, the workpiece 324 can be loaded / unloaded to the processor 316. The robot arm 320 has an end effector 322 for loading / unloading the workpiece 324 to / from the processing device 316. In the preferred embodiment, robot arm 320 is supported on a robot base that moves linearly along track 23 in space 18 (as shown in FIG. 2). The robot moves in a housing that delivers workpieces between the processing station and the various processing stations 14. The processing device 316 (identified by 16 in FIG. 2) is configured in the first and second columns as shown in FIG. 2, and is only for the processing devices in the first and second columns, respectively. Preferably, a first and second robot 26 are provided for loading / unloading the workpiece. However, other designs can be used. For example, one robot may be used for loading / unloading all the processing devices 16 or 316. Alternatively, two robots may be used in a crossover operation so that either robot can load / unload any processor 16 or 316.

  Turning to FIG. 42, the processing apparatus 316 includes an upper rotor 326 that can engage the lower rotor 328 to form a processing chamber 351. In the illustrated embodiment, the workpiece 324 is a round wafer having flat top and bottom surfaces.

  Upper rotor 326 is preferably annular with a relatively large central opening or hole 332. The holes 332 preferably have a diameter that is 20-80%, 30-70%, or 40-60% larger than the diameter of the workpiece 324. For example, if the processing apparatus is configured to process a wafer having a diameter of 200 mm, the diameter of the hole 332 is preferably 100 to 150 mm, and more preferably about 125 mm.

  One or more pneumatic air cylinders 338 or other actuators are used to support plate 334 to raise and lower the upper rotor 326 between the open position shown in FIGS. 41-43 and the closed position shown in FIGS. Can be attached to.

  The lower rotor 328 is preferably secured in place on the base 340 such that the upper rotor 326 can be lowered to engage or contact the lower rotor 328 to form the processing chamber 351. . In alternative embodiments, the lower rotor 328 may be lifted to engage a fixed upper rotor 326, or the two rotors 326, 328 are movable toward each other to form a processing chamber 351. It may be.

  Workpiece 324 is preferably supported in a processing chamber on a plurality of lower supports 327 extending upwardly from lower rotor 328. Generally, the upper support pins 329 on the upper rotor 326 tend to limit upward movement of the workpiece from the lower support 327, as shown in FIG. Alternatively, the workpiece 324 may be fixed, as described in US Pat. No. 6,423,642, the disclosure of which is incorporated herein by reference.

  Referring to FIG. 42, the annular housing 355 is attached to the plate 334. An annular flange 343 on the upper rotor 326 extends into an annular groove (slot) 353 in the housing 355. The lower magnet ring 357 is attached on the top of the flange 343. Upper rotor 326, flange 343, and magnet ring 357 form upper rotor assembly 359 that rotates as a unit within housing 355. The upper rotor 326 preferably has an internal PVDF attached to a metal, such as a stainless steel ring 363 that supports a flange 351, or a registered trademark “Teflon” (fluororesin) liner 361, for example. The lower rotor is preferably PVDF or a registered trademark “Teflon”. Three pins 352 extend around the periphery of the lower rotor 328 for engagement or insertion into an opening in the upper rotor or into the container 354. Pin 352 has a tapered conical tip that aligns the lower and upper rotors when they are brought together. The pins 352 also transmit torque from the lower rotor to the upper rotor as the rotor rotates together as the rotor unit 335 during processing.

  A ring plate 367 is attached to the housing 355. The uppermost end of the upper rotor 326 extends through the ring plate 367. The upper magnet ring 369 is attached to the ring plate 367. The upper magnet ring 369 repels the lower magnet ring 357. The ring plate 367 has a conical portion 371 that overlays and is attached to the plate 334. Plate 334, housing 355, ring plate 367, conical portion 371, and upper magnet ring 369 form a housing assembly 373 that is moved vertically by actuator 338 but does not rotate. Rather, the upper rotor assembly 359 rotates within the fixed housing assembly 373. With the processing device 316 in the open or raised position, as shown in FIG. 42, the flange 343 of the upper rotor assembly rests on the annular lip or ledge 377 of the housing 355, and the rotor assembly 359 and There is no other contact with the housing assembly 373. Counterclockwise pin 358 (FIG. 45) extends from lip 377 into flange 343 to align the upper rotor at an angle with the lower rotor when the processing device is in the open or raised position.

  As shown in FIG. 45, the upper rotor assembly 359 floats or floats within the housing 355 with the processing device 316 in the lowered or closed position, in other words, the upper rotor assembly. There is no physical contact between 359 and any portion of housing 355 or housing assembly 373. The repulsive force of the magnet rings 357, 369 causes the upper rotor assembly 359 to move down into contact with the lower rotor 328 without physical contact. The magnet rings 357, 369 may be replaced with individual magnets, electromagnets, or other magnetic elements.

  Since the upper rotor 326 is floating and there is no physical or mechanical contact between the upper rotor 326 or the upper rotor assembly 359 and surrounding structures such as the housing 355, plate 367, or plate 334, The upper rotor 326 can automatically align itself with the lower rotor 328 (when they are brought together). Thus, the need to accurately align the upper rotor with the lower rotor is avoided. In addition, there is no physical contact between the fixed housing assembly 373 and the rotating rotor assembly 359 during processing, thus greatly reducing the possibility of generating contaminating particles.

  A face seal or other sealing element 331 can be used to form a seal between the upper and lower rotors 326, 328 (when they are brought together). In some applications, no seal is required. The upper and lower rotors 326 and 328 are preferably in contact with each other only at the seal 331. The seal 331 may be located on the inner surface of one or both of the rotors 326, 328, and is preferably located around the rotor.

  When the rotors 326, 328 are brought together, they form a combined rotor unit 335 that can be rotated by a motor 339 supported on a base 340. The motor 339 is contained in a motor housing 337 attached to the base plate 340 or the frame 312. The motor rotor 375 is coupled to a backing plate 341 that is attached to and supports the lower rotor 328. The motor rotor 375 has a diameter of at least 50%, 60%, 70%, 80%, 90%, or 100% of the diameter of the workpiece, as shown in FIGS. . This achieves an improved dynamic balance of the system and less vibration. The barrier ring 378 forms a twisted path at the bottom of the backing plate 341. This helps to suppress any particle movement from the motor outwards and further upwards toward the workpiece. A conical recess in the center of the lower rotor forms a drainage reservoir 381 for collecting and discharging drifting liquid. The drain outlet 330 extends through the upper rotor as shown in FIG.

  As the rotor unit 335 rotates, air is drawn into the processing chamber 351 through an opening or hole 332 in the upper rotor 326. The hole 332 is relatively large, and the chamber outlet is limited to a much smaller cross-sectional area. This creates a low pressure difference inside the processing chamber. This low pressure differential causes air to flow into the processing chamber at a low speed. As a result, compared to existing designs, much fewer contaminating particles are drawn into the processing chamber by incoming airflow. This reduces the possibility of workpiece contamination.

As shown in FIGS. 44 to 46, the upper nozzle 342 or the fluid application device extends into the hole 332 of the upper rotor 326. Nozzle 342 supplies one or more processing fluids to the upper surface of workpiece 324. Upper nozzle 342 is attached to the end of a relatively rigid upper fluid delivery tube or line 344. The upper fluid delivery line 344 is attached to an electric lifting and rotating mechanism 346 that causes the upper fluid delivery line 344 and the upper nozzle or outlet 342 to move up and down by alternating movement in the front-rear direction and further rotate. Thus, the upper nozzle 342 is movable over the upper workpiece surface to distribute the processing fluid to different portions of the upper workpiece surface. In addition, the upper nozzle 342 can be lifted out of the hole 332 and rotated away from the processing chamber to raise the upper rotor 326 to the open or workpiece receiving position.

47 to 48

  As shown in FIG. 47, the upper fluid delivery line 344 of the upper nozzle 342 provides a fluid collection area 345 or “Z-trap” for collecting process fluid after fluid delivery to the process chamber is stopped. May be provided. In existing systems, excess fluid may drip from the upper nozzle or tube to the workpiece after fluid delivery is stopped. This can lead to workpiece contamination or other defects. Suction back (suck-back) and gas purging (gas purging) techniques have been used with the intention of completely emptying the fluid delivery tube, but in many cases residual dripping It is still happening. Accordingly, a collection area 345 may be employed in combination with suck-back or purging to collect residual fluid so that it does not drip into the processing chamber.

  The fluid collection region 345 connects to a second section 349 included in the upper fluid delivery line 344 or the upper nozzle 342 so that the processing fluid is directed to the processing chamber, and a first tube extending upward at a certain angle. It is preferably formed by the section 347. The fluid collection area 345 is preferably large enough to contain a few drops of fluid that is purged or sucked back into the collection area 345. As shown in FIG. 48, the nozzle 342 incorporating the collection region 345 or Z trap can be manufactured as a separate component attached to the end of the upper fluid delivery tube or line 344.

  As shown in FIGS. 42 and 45, the lower nozzle 348, or other fluid delivery outlet, is located in the lower center of the workpiece 324 to deliver one or more process fluids to the lower surface of the workpiece 324. It is preferred that A lower fluid delivery tube or line 350 is attached to the lower nozzle 348 for supplying fluid to the lower nozzle 348. The lower fluid delivery line 350 may be supplied with processing fluid from the same fluid reservoir from which the upper fluid delivery line 344 is supplied, or from a different fluid reservoir. Accordingly, the upper and lower surfaces of the workpiece 324 can be processed with the same or different processing fluids simultaneously or sequentially. The nozzles 342, 348 may be spray nozzles or applicators of any shape or pattern to supply process liquid or gas or vapor to the workpiece in any form or state, or a simple outlet or It may be an opening.

  As shown in FIG. 42, the drain outlet 330 is disposed around the upper rotor 326 at a distance. The drain outlet 330 allows fluid to exit the processing chamber 351 by centrifugal force when the rotor unit 335 rotates during processing. Alternatively, the drain outlet 330 may be present in the lower rotor or on both the upper and lower rotors. The drain outlet 330 may be provided in other forms such as a slot or an opening between the rotors. As shown in FIGS. 41 to 46, an annular drain assembly 370 is disposed around the rotor unit 335. The drain assembly 370 is preferably vertically movable by a lifting mechanism or an elevator 372. The elevator 372 includes an armature 374 attached to the drain assembly 370. Motor 379 rotates jack screw 376 to raise and lower armature 374 and drain assembly 370.

  The drain assembly 370 has a plurality of drain paths that can be separated and aligned with the outlet 330 in the processing chamber. Although three drain paths 380, 382, 384 are shown in FIGS. 42 and 43, any desired number of drain paths may be included in the drain assembly 370. Multiple drain paths, like deionized (DI) water, are provided to allow different process chemicals to be removed from the process chamber along separate paths, which means that process chemicals and DI water are removed. Eliminate cross-contamination between. The drain paths 380, 382, 384 are preferably connected to a system drain tube 386 that extends from below the drain paths 380, 382, 384 to the outside of the processing device 316.

  When the upper rotor member 326 is open or is in a position to receive the workpiece, the drain assembly 370 is in its lowest position, adjacent to the base 340, as shown in FIGS. Is preferred. As a result, as shown in FIG. 41, the workpiece 324 can be loaded / unloaded to the processing apparatus. When the upper rotor 326 is lowered to the closed or process position, the drain assembly 370 is aligned with one of the drain paths 380, 382, 384 and the process chamber outlet 330, as shown in FIGS. To be lifted by the elevator 372.

  The processing fluid is removed from the processing chamber through the outlet 330 by the centrifugal force generated by the rotation of the rotor unit. This fluid then flows into the tube 376 along a drain path aligned with the process chamber outlet, which removes the fluid from the workpiece processor 316. Thereafter, the processing fluid is regenerated or sent to a waste area.

  Referring to FIG. 2 in use, the pod, cassette, carrier or container 21 has been moved onto the input / output station 19. If the container is sealed, such as a FOUP or FOSBY container, the door is removed by the robot actuator of the system 10. Thereafter, the robot 26 (indicated by reference numeral 320 in FIG. 41) takes the workpiece 24 (indicated by 224 and 324 in FIGS. 22 to 40 and FIGS. 41 to 46, respectively) from the container 21, and FIG. As shown, the workpiece 24 is placed in the processing device 316. The processing device 316 is in the raised position or the open position, and the drain assembly 70 is in the lowered position as shown in FIG. Although the processing unit 316 could be provided as a stand alone manual loading system (without the input / output station 19, robot 26 or housing 15), the automation shown in FIGS. A system is preferred.

  Returning to FIGS. 41-46, a workpiece 324 is disposed on a workpiece support 327 on the lower rotor 328. Thereafter, the upper rotor 326 is lowered by the actuator 338 and engages the lower rotor member 328 to form a processing chamber 351 around the workpiece 324. The repulsion of the magnets or magnet rings 357 and 369 presses the upper rotor against the lower rotor with a face seal that forms a seal around it. A space member or support pin 329 on the upper rotor member 326 approaches or contacts the top surface of the workpiece 324 to secure or confine the workpiece in place.

  Once the rotor unit 335 is in the closed or processing position, the drain assembly 370 is raised by the elevator 372 so that it is positioned around the rotor unit. The drain path 380 is aligned with the outlet 330 to remove the first processing fluid used to process the workpiece 324. The space between the inlet to the drain path 380, 382, 384 and the outlet 330 is minimized so that the liquid exiting the outlet 330 moves into the drain path rather than running down the side of the lower rotor. The Alternatively, an annular ring seal can be used to assist in moving liquid from the outlet 330 into the drain path without dripping or leaking.

  After the drain passages 380 are properly aligned, the process fluid delivers process fluid to the upper and / or lower surface of the workpiece 324 via one or both of the upper and lower fluid supply tubes 344, 350. One or both of the nozzles or discharge ports 342 and 328 or the discharge ports 342 and 328 are supplied. The entire rotor unit is rotated by a motor 339 and generates a continuous flow of fluid across the surface of the workpiece 324 by centrifugal force. Accordingly, the processing fluid is driven across the surface of the workpiece radially outward from the center of the workpiece 324 to the edge of the workpiece 324. The upper nozzle 342 may move back and forth within the hole 332 by a powered lifting rotation mechanism 346 to more evenly distribute the processing fluid to the upper workpiece surface.

  As the rotor unit rotates, air is drawn into the processing chamber through holes 332 in the upper rotor assembly 359 and the housing assembly 373. Because the hole 332 is relatively large and the processing chamber 351 is substantially closed except for the outlet 330, the air passes through the processing chamber at a relatively low speed and thus entrains particles that can contaminate the workpiece. To reduce the likelihood of losing.

  In the vicinity of the chamber 351, the spent processing fluid moves out of the processing chamber through the outlet 330 by centrifugal force. The process fluid then flows down drain path 380 and exits through drain tube 386. The spent fluid is delivered to a recycling system for reuse or a disposal area for proper disposal. The drain tube 386 can be expanded and contracted to move up and down together with the drain assembly 370.

Upon completion of the processing step with the first processing fluid, a purge gas, such as N ₂ gas, is directed from nozzle 324 and / or 342 toward outlet 330 to assist in removing any remaining processing fluid from the chamber. Preferably sprayed. Depending on whether a second processing fluid or DI rinse water is subsequently used, drain assembly 370 is further raised by lift mechanism 372 to align one of the appropriate drain paths 382, 384 with outlet 330. .

  For example, if a rinse step using DI rinse water is subsequently performed, the elevator 372 raises the drain assembly 370 until the drain path 384 is aligned with the outlet in the processing chamber. The DI rinse water is then sprayed onto the workpiece surface by centrifugal force and moves across the workpiece surface to the outer periphery of the workpiece 324. The DI rinse water flows through the outlet 330 to the drain path 384. Thereafter, the DI rinse water flows into the tube 386 along the drain path 384 to be removed from the workpiece processor 316. Because separate drain paths are used for the first processing fluid and DI rinse water, these liquids are not mixed upon exiting the processing chamber and no cross contamination occurs.

  Similar steps can be performed on one or more additional process fluids. The rinsing step may be performed after each processing step, or may be performed after all processing steps are completed. A drying step performed with isopropyl alcohol (IPA) vapor or other drying fluid may be performed after the final processing or rinsing step. In the preferred embodiment, one drain path is assigned to each type of processing fluid used, including DI rinse water. Thus, cross-contamination between different processing chemistries and DI rinse water is avoided.

  Once the process is complete, the drain assembly 370 is lowered and the upper rotor member 326 is raised to allow access to the workpiece 324, as shown in FIGS. In this open position, workpiece 324 is removed from the processing chamber, and other workpieces can be placed in the processing chamber.

The rotor and drain components in the processing system 10 can be made of any suitable material, such as the registered trademark “Teflon” (synthetic fluorine-containing resin) or stainless steel. The processing system 10 can use any processing fluid that is typically used for processing workpieces such as semiconductor wafers. For example, aqueous or gaseous ozone, aqueous or gaseous HF or HCL, ammonia, nitrogen gas, IPA vapor, DI rinse water, H ₂ SO _4, etc. can be used to perform various processing steps. In applications where strong acids or solvents such as HF and H ₂ SO ₄ are used, the registered trademark “Teflon” processing components should be used so that the rotor components and drain are not damaged by the processing chemistry. Is preferred. The upper nozzle or outlet 342 and the lower nozzle 348 are connected and have separate outlets for DI water, clean dry air, nitrogen, and one of the liquid processing chemicals described above. Is preferred. One or more valves 390 near the lower end of tube 350 control the flow of liquid and gas through lower nozzle 348. Each of the lower nozzles 348 may include a single liquid or gas-only one, such as four separate sub-nozzles.

  Additional system components such as IPA vaporizer, DI feed, optional heating element, optional flow meter, optional flow control valve / temperature sensor, valve mechanism, etc. are also included in the processing system, as with existing systems It may be done. All of the various components of the processing system 10 may be under the control of the controller unit 17 with appropriate soft programming.

  Also, although the processing head, processing head assembly, chamber assembly, rotor, workpiece, and other components have been described as having a diameter, they need not be round. Furthermore, the present invention has been shown with respect to wafers or workpieces. However, it will be appreciated that the present invention has a wider range of applicability. As an example, the present invention is applicable in flat panel display processing, microelectronic masks, and other devices that require efficient and controlled wet chemical processing.

1 is a perspective view of a workpiece processing system according to the present invention. FIG. 2 is a plan view of the workpiece processing system shown in FIG. 1 with components removed for illustration purposes. It is a perspective view of the workpiece processing apparatus which concerns on one Example of this invention. FIG. 4 is a plan view of the workpiece processing chamber shown in FIG. 3. FIG. 5 is a cross-sectional view of the workpiece processing apparatus shown in FIG. 4 cut along a broken line AA. FIG. 5 is a cross-sectional view of the workpiece processing apparatus shown in FIG. 4 cut along a broken line BB. FIG. 5 is a cross-sectional view of the workpiece processing apparatus shown in FIG. 4 cut along a broken line CC. It is the partial projection figure which expanded and showed the area | region of the processing apparatus shown by A in FIG. 1 is a perspective view of a processing head assembly according to the present invention. FIG. 9 is a plan view of the processing head assembly shown in FIG. 8. FIG. 10 is a cross-sectional view of the processing head assembly shown in FIG. 9 cut along a broken line AA. It is a perspective view of the lower part part of the processing head assembly concerning the present invention. It is a perspective view of the upper end part of the base assembly which concerns on this invention. It is a top view of the base assembly shown in FIG. It is sectional drawing which cut | disconnected and showed the process base assembly shown in FIG. 13 along broken line AA. It is sectional drawing which cut | disconnected and showed the process base assembly shown in FIG. 13 along the broken line BB. It is sectional drawing which cut | disconnected and showed the process base assembly shown in FIG. 13 along broken line CC. 1 is a top perspective view of an upper rotor according to one embodiment of the present invention. It is sectional drawing of the upper rotor shown to FIG. 17A. 18 is a bottom perspective view of the upper rotor shown in FIGS. 17A and 17B. FIG. 1 is a top perspective view of a lower rotor according to one embodiment of the present invention. It is sectional drawing of the lower rotor shown to FIG. 18A. FIG. 19 is a bottom perspective view of the lower rotor shown in FIGS. 18A and 18B. FIG. 6 is a top perspective view of an upper rotor according to another embodiment of the present invention. FIG. 19B is a cross-sectional view of the upper rotor shown in FIG. 19A. FIG. 20 is a bottom perspective view of the upper rotor shown in FIGS. 19A and 19B. FIG. 6 is a top perspective view of a lower rotor according to another embodiment of the present invention. It is sectional drawing of the lower rotor shown to FIG. 20A. 20B is a bottom perspective view of the lower rotor shown in FIGS. 20A and 20B. FIG. It is a top perspective view of the head ring of the processing head assembly according to the present invention. It is sectional drawing of the head ring shown to FIG. 21A. FIG. 21B is an enlarged partial view of a head ring region designated by A in FIG. 21B. FIG. 3 is a perspective cutaway view of the processing apparatus shown in FIG. 2 according to one embodiment of the present invention. It is sectional drawing of the processing apparatus of FIG. It is an expanded partial sectional view of the processing apparatus of FIG. It is a disassembled perspective view of the processing apparatus of FIG. FIG. 26 is a cross-sectional view taken along line aa of FIG. FIG. 26 is a cross-sectional view taken along line bb in FIG. 25. FIG. 26 is a cross-sectional view taken along line aa of FIG. 25, showing only the upper rotor for illustration purposes. FIG. 26 is a cross-sectional view taken along line bb of FIG. 25, showing only the upper rotor for illustration purposes. FIG. 23 is a top perspective view of a lower rotor of the processing apparatus of FIG. 22. FIG. 31 is a bottom perspective view of the lower rotor of FIG. 30. FIG. 32 is a cross-sectional view of the lower rotor of FIGS. 30 and 31. FIG. 23 is an enlarged partial cross-sectional view of the upper rotor engaged with the lower rotor in the processing apparatus of FIG. 22, showing a workpiece alignment pin. FIG. 23 is an enlarged partial cross-sectional view of the upper rotor engaged with the lower rotor of the processing apparatus of FIG. 22, showing the upper workpiece support pins. FIG. 23 is a cross-sectional view of the head of the processing apparatus shown in FIG. 22 with the upper rotor removed for purposes of illustration. FIG. 36 is an enlarged sectional view of a purge gas manifold of the head shown in FIG. 35. FIG. 6 is a partial cross-sectional view of an alternative embodiment processing apparatus having a shield plate that directs processing fluid to an edge of a workpiece in the processing chamber. 1 is a partial cross-sectional view of a processing apparatus having a fluid delivery path for delivering processing fluid directly to an edge of a workpiece in a processing chamber. FIG. 6 is a cross-sectional view of the base of an alternative processing apparatus having a lower rotor air inlet. FIG. 26 is a perspective view of the inside of the upper rotor shown in FIG. 25. FIG. 3 is a perspective view of the processing apparatus shown in FIG. 2 according to one embodiment of the present invention in a load / unload position. It is sectional drawing of the processing apparatus of FIG. FIG. 42 is a cross-sectional view of the processing apparatus of FIG. 41 with a movable fluid delivery tube oriented into the processing chamber. It is a perspective view of the processing apparatus of FIG. 41 shown in the processing position. It is sectional drawing of the processing apparatus of FIG. FIG. 45 is a cross-sectional view of the processing apparatus of FIG. 44 with a movable fluid delivery tube oriented into the processing chamber. 2 is a cross-sectional view of a fluid delivery line having a fluid collection region. FIG. FIG. 5 is a perspective view of a nozzle or liquid supply outlet having a fluid collection region.

Claims (75)

A processing head assembly having a processing head with an upper rotor;
A base assembly having a base and a lower rotor;
The base having a first magnet and the lower rotor having a second magnet;
The upper rotor is engageable with the lower rotor by a magnetic force generated by the first magnet and the second magnet to form a workpiece processing chamber.
A workpiece processing apparatus.   The apparatus of claim 1, further comprising an aspirator connected to an internal cavity formed in the processing head for releasing gaseous fluid from the processing head assembly.   The apparatus of claim 1, further comprising a motor that rotates at least one of the upper and lower rotors.   The apparatus of claim 1, further comprising at least one vent opening formed in the processing head assembly.   The apparatus of claim 1, further comprising a plurality of vent openings formed in the processing head assembly.   The apparatus of claim 1, wherein the processing head assembly comprises a nozzle for introducing a processing fluid into the apparatus.   A treatment fluid source, wherein the treatment fluid is a fluid selected from the group consisting of nitrogen, isopropyl alcohol, water, ozonated water, hydrosulfuric acid, air, hydrogen peroxide, and ST-250. Item 6. The device according to item 6.   The apparatus of claim 1, wherein the lower rotor comprises a plurality of alignment pins that position the workpiece in an xy plane.   The lower rotor has at least one pin extending from a surface thereof, the upper rotor has at least one hole, and the pin engages with the hole when the upper and lower rotors are engaged. Item 1. The apparatus of item 1.   The apparatus of claim 1, wherein the upper and lower rotors comprise a plurality of pins for receiving the workpiece.   The apparatus of claim 1, further comprising one or more processing fluid sources connected to the processing head assembly.   The apparatus of claim 1, further comprising one or more processing fluid sources connected to the base assembly.   The apparatus of claim 1, further comprising at least one discharge port formed in the base.   The apparatus of claim 1, further comprising a plurality of discharge ports formed in the base.   The apparatus of claim 1, wherein an annular plenum is formed between the interface and base assembly of the processing head assembly.   The apparatus of claim 1, further comprising a processing head assembly lifter that moves the processing head assembly relative to the base assembly.   The apparatus of claim 16, wherein the processing head assembly lifter moves the processing head assembly away from the base assembly to an open position.   The apparatus of claim 17, wherein the processing head assembly lifter moves the processing head assembly toward the base assembly, thereby engaging the upper rotor with the lower rotor.   When the first magnet in the base repels the second magnet in the lower rotor and the processing head assembly lifter moves the processing head assembly toward the base assembly, the upper rotor is moved to the lower rotor. The apparatus of claim 18, wherein a contact seal is formed between the upper and lower rotors while contacting the base and pushing the lower rotor toward the base.   The apparatus of claim 1, wherein the lower rotor comprises an annular member that runs around the lower rotor paired with the upper rotor to form a fluid seal.   The apparatus of claim 1, wherein at least one annular discharge channel is formed in the base.   The apparatus of claim 1, wherein an annular plenum is formed in the base for collecting processing fluid.   23. The apparatus of claim 22, wherein the annular plenum is in communication with a drain port formed in the base for discharging the processing fluid from a processing chamber.   24. The apparatus of claim 23, further comprising a valve actuator that opens and closes the drain port. The processing head is
A head ring connecting the processing head and the upper rotor;
A motor coupled to the upper rotor;
A vent for introducing air into the workpiece processing chamber;
The apparatus of claim 1, further comprising:   25. The apparatus of claim 24, wherein a plurality of air inlet holes are formed in the head ring.   25. The apparatus of claim 24, wherein a cavity is formed between the upper rotor and the head ring.   28. The apparatus of claim 27, wherein a cavity formed between the upper rotor and the head ring is connected to an evacuation device. A snorkel having a first opening vertically above the head assembly and around the outside of the apparatus and a second opening in which a nozzle for spraying into the processing chamber is disposed;
A motor for rotating the processing chamber;
And when the workpiece is positioned in the processing chamber and the motor rotates the processing chamber and the workpiece, a low air pressure region is created adjacent to the center of the workpiece and from the surroundings. The apparatus of claim 1, wherein air is drawn into the processing chamber. A plurality of workpiece stations with at least one station having an apparatus comprising:
A processing head assembly having an upper rotor;
A base assembly having a base and a lower rotor;
An upper rotor engageable with the lower rotor to form a workpiece processing chamber;
A first magnet and a second magnet that generate a force that maintains contact between the upper and lower rotors when the upper and lower rotors are engaged;
A robot movable between the workpiece stations to move the workpiece from one station to another;
A workpiece system comprising:   32. The system of claim 30, further comprising a processing head assembly lifter that communicates with at least one station.   32. The system of claim 30, wherein a magnetic force is generated by repulsion between the first magnet and the second magnet.   32. The system of claim 30, wherein the upper rotor has an opening through which process fluid is supplied to the workpiece surface.   32. The system of claim 30, wherein the lower rotor has an opening through which process fluid is supplied to the workpiece surface.   31. The system of claim 30, wherein the first surface of the upper rotor and the workpiece forms an upper processing chamber, and the second surface of the lower rotor and the workpiece forms a lower processing chamber.   32. The system of claim 30, further comprising means for connecting the lower rotor to the base. Placing a workpiece into a base assembly having a base and a first rotor;
Applying a magnetic force to retract the first rotor from the base;
Engaging a second rotor with the first rotor to form a processing chamber around the workpiece;
Urging the engaged rotor against a magnetic repulsive force to create an engagement between the first rotor and the second rotor;
Rotating the first rotor and the second rotor;
Applying a processing fluid to the workpiece;
A workpiece processing method comprising the steps of: 38. The method of claim 37, wherein applying the processing fluid to the workpiece comprises the following steps:
Applying a first processing fluid to the first surface of the workpiece; and
Applying a second processing fluid to the second surface of the workpiece;   38. The method of claim 37, further comprising draining the processing fluid from the processing chamber.   The first treatment fluid comprises a fluid selected from the group consisting of air, nitrogen, isopropyl alcohol, water, ozonated water, hydrofluoric acid, sulfuric acid, hydrogen peroxide, and ST-250. 38 methods.   The second treatment fluid comprises a fluid selected from the group consisting of air, water, ozonated water, nitrogen, isopropyl alcohol, hydrofluoric acid, sulfuric acid, hydrogen peroxide, and ST-250. 38 methods. A head assembly having a head and a first rotor;
A base assembly having a base and a second rotor;
Means for engaging the first rotor with the second rotor to create a processing chamber;
A motor coupled to one of the first rotor and the second rotor to rotate a processing chamber;
A workpiece processing apparatus comprising:   43. The apparatus of claim 42, wherein the means for engaging the first rotor with the second rotor comprises a magnetic repulsion force.   43. The apparatus of claim 42, wherein the means for engaging comprises an element that generates a magnetic force between the first rotor and the second rotor. 43. The apparatus of claim 42, wherein the means for engaging the first rotor with the second rotor comprises:
A first magnet having a polarity positioned within the head; and
A second magnet having the same polarity as the first magnet and positioned within the first rotor;   46. The apparatus of claim 45, wherein the first magnet and the second magnet are ring-shaped. 43. The apparatus of claim 42, wherein the means for engaging the first rotor with the second rotor comprises:
A first magnet having a polarity positioned within the base; and
A second magnet having the same polarity as the first magnet and positioned within the first rotor; A first rotor having a latch ring;
A second rotor having a slot suitable for receiving the latch ring, wherein when the first rotor and the second rotor are brought together, the latch ring is inserted into the slot, and the first rotor is the second rotor; A second rotor fixed to the rotor;
A motor coupled to one of the first rotor and the second rotor to rotate the first rotor and the second rotor;
A workpiece processing apparatus comprising:   49. The apparatus of claim 48, wherein the first rotor has a plurality of alignment pins and the second rotor has a plurality of corresponding holes for receiving alignment pins.   When the first rotor and the second rotor are brought together, an alignment pin contacts an edge of the workpiece and places the workpiece in the middle between the first rotor and the second rotor. 48. Apparatus according to item 48. A first rotor;
A second rotor;
Means for directing the first rotor into contact with the second rotor to form a processing chamber;
Means for securing the first rotor to the second rotor;
A motor for rotating the processing chamber;
A workpiece processing apparatus comprising:   51. The apparatus of claim 50, wherein the means for directing the first rotor into contact with the second rotor comprises a magnetic force.   51. The apparatus of claim 50, wherein the means for securing the first rotor to the second rotor comprises an interlocking latch mechanism.   54. The apparatus of claim 53, wherein the interlocking latch mechanism comprises a latch ring connected to the first rotor and a slot formed in the second rotor. A first rotor;
A second rotor;
Means for engaging the first rotor with the second rotor to form a processing chamber;
A snorkel comprising a first opening in an ambient environment outside the apparatus and a second opening having a nozzle arranged to spray into the processing chamber;
A motor for rotating the processing chamber;
A workpiece is placed in the processing chamber, the motor rotates the processing chamber and the workpiece, and a low air pressure region is created adjacent to the center of the workpiece, from the ambient environment into the processing chamber. Draw air,
Workpiece processing apparatus characterized in that A plurality of workpiece processing devices comprising at least one workpiece processing device including:
A first rotor including a plurality of alignment pins;
A second rotor including one or more receiving surfaces for receiving alignment pins, wherein the first rotor and the second rotor form a processing chamber when the alignment pins engage the second rotor. ;
A robot movable between the workpiece processing devices to load / unload the workpiece to one or more processing devices;
A workpiece processing system comprising: A plurality of workpiece processing devices comprising at least one workpiece processing device including:
First rotor;
A second rotor engageable with the first rotor to form a workpiece processing chamber;
A fluid applicator for delivering a processing fluid to a central portion of a workpiece disposed within the processing chamber;
A substantially annular opening around the exterior of the fluid applicator;
A purge gas source for delivering purge gas into the process chamber through the annular opening;
A robot movable between the workpiece processing devices to load / unload the workpiece to one or more workpiece processing devices;
A workpiece processing system comprising: A plurality of workpiece processing devices comprising at least one workpiece processing device including:
First rotor;
A second rotor engageable with the first rotor to form a workpiece processing chamber;
A shield plate between the first rotor and the second rotor for directing the first processing fluid toward the edge of the workpiece;
A robot movable between said workpiece processing devices for loading / unloading workpieces to one or more workpiece processing devices;
A workpiece processing system comprising: A plurality of workpiece processing devices comprising at least one workpiece processing device including:
First rotor;
A second rotor engageable with the first rotor to form a workpiece processing chamber;
A process in the second rotor having an outlet adjacent to the outer surface of the processing chamber and for supplying processing fluid directly to the edge region of the workpiece when the workpiece is placed into the processing apparatus Fluid supply line;
A robot movable between the processing devices;
A workpiece processing system comprising: A plurality of workpiece processing devices comprising at least one workpiece processing device including:
A first rotor including alignment means;
A second rotor including receiving means for receiving the alignment means, wherein the first rotor and the second rotor form a workpiece processing chamber when the alignment means engages the receiving means;
A robot movable between workpiece processing devices to load / unload workpieces to one or more workpiece processing devices;
A workpiece processing system comprising: A first rotor having a through vent opening;
A second rotor engageable with the first rotor to form a workpiece processing chamber;
Means for rotating the processing chamber;
A workpiece processing apparatus comprising:   62. The apparatus of claim 61, wherein a through vent opening in the first rotor has a diameter of 20-80% of the diameter of the workpiece.   62. The apparatus of claim 61, further comprising an upper fluid applicator that extends into a through opening in the first rotor to provide processing fluid to a workpiece surface.   The upper fluid applicator includes a nozzle having a collection portion that collects processing fluid when fluid delivery to the nozzle is stopped, thereby preventing excess processing fluid from dripping from the upper nozzle into the processing chamber; 64. The apparatus of claim 63. A first rotor having a through vent opening;
A second rotor engageable with the first rotor to form a workpiece processing chamber;
Means for rotating the processing chamber;
A movable drain assembly including a plurality of drain paths, wherein each drain path can be separately aligned with the processing chamber by moving the drain assembly;
A workpiece processing apparatus comprising:   66. The apparatus of claim 65, further comprising a fluid applicator extending into a through vent opening in the first rotor to provide processing fluid to a workpiece surface.   The fluid applicator includes a nozzle having a collection portion that collects the processing fluid when fluid delivery to the nozzle is stopped, thereby preventing excess processing fluid from dripping from the upper nozzle into the processing chamber. 68. The apparatus of claim 66. A plurality of workpiece processing devices comprising at least one workpiece processing device including:
An upper rotor having a through vent opening;
A lower rotor engageable with the upper rotor to form a workpiece processing chamber;
A robot movable between said workpiece processing devices for loading / unloading workpieces to one or more workpiece processing devices;
A workpiece processing system comprising:   69. The system of claim 68, wherein the at least one workpiece processing apparatus further comprises a movable drain assembly including a plurality of drain paths, wherein each drain path can be separately aligned with the processing chamber by moving the drain assembly.   The at least one workpiece processing apparatus further comprises a fluid applicator extending into a through vent opening in the first rotor for providing processing fluid to the workpiece surface, the fluid applicator delivering fluid to the nozzle. 69. The apparatus of claim 68, comprising a nozzle having a collection portion that collects processing fluid when is stopped, so that excess processing fluid does not drip from the upper nozzle into the processing chamber. A plurality of workpiece processing devices comprising at least one workpiece processing device including:
Upper rotor;
A lower rotor engageable with the upper rotor to form a workpiece processing chamber;
A movable drain assembly including a plurality of separate drain paths, wherein the drain mechanism is moved to align one drain path with the processing chamber so that each drain path can be separately aligned with the processing chamber. Drain assembly;
A robot movable between workpiece processing devices to load / unload workpieces to one or more workpiece processing devices;
A workpiece processing system comprising:   72. The system of claim 71, wherein the movable drain assembly is separated from the processing chamber by a gap that creates a downward airflow when the drain assembly is lowered and / or when the upper rotor is raised. A plurality of workpiece processing devices comprising at least one workpiece processing device including:
First rotor;
Second rotor;
Engaging means for engaging the first rotor with the second rotor without requiring physical contact with the first rotor;
Loading means for loading a workpiece into or out of one or more processing units;
A workpiece processing system comprising: Placing the workpiece on the first rotor;
Engaging a second rotor to the first rotor with a non-contact force to form a processing chamber around the workpiece;
Rotating the first rotor and the second rotor;
Applying the first processing fluid to the first side of the workpiece such that the first processing fluid flows radially outward on the first side of the workpiece by centrifugal force;
A workpiece processing method comprising the steps of: An upper rotor;
A lower rotor engageable with the upper rotor to form a workpiece processing chamber;
A movable drain assembly including a plurality of separate drain paths, wherein each drain path can be separately aligned with the processing chamber by moving the drain assembly to align one drain path with the processing chamber; A movable drain assembly;
A workpiece processing apparatus comprising:

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