WO2005043593A3 - System for processing a workpiece - Google Patents

System for processing a workpiece Download PDF

Info

Publication number
WO2005043593A3
WO2005043593A3 PCT/US2004/034895 US2004034895W WO2005043593A3 WO 2005043593 A3 WO2005043593 A3 WO 2005043593A3 US 2004034895 W US2004034895 W US 2004034895W WO 2005043593 A3 WO2005043593 A3 WO 2005043593A3
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
processing
base
rotor
process chamber
Prior art date
Application number
PCT/US2004/034895
Other languages
French (fr)
Other versions
WO2005043593A2 (en
WO2005043593A8 (en
Inventor
Kyle M Hanson
Eric Lund
Coby Grove
Steven L Peace
Paul Z Wirth
Scott A Bruner
Jonathan Kuntz
Original Assignee
Semitool Inc
Kyle M Hanson
Eric Lund
Coby Grove
Steven L Peace
Paul Z Wirth
Scott A Bruner
Jonathan Kuntz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/690,864 external-priority patent/US6930046B2/en
Priority claimed from US10/693,668 external-priority patent/US6969682B2/en
Priority claimed from US10/867,458 external-priority patent/US7217325B2/en
Application filed by Semitool Inc, Kyle M Hanson, Eric Lund, Coby Grove, Steven L Peace, Paul Z Wirth, Scott A Bruner, Jonathan Kuntz filed Critical Semitool Inc
Priority to EP04795977A priority Critical patent/EP1676312A2/en
Priority to JP2006536790A priority patent/JP4685022B2/en
Publication of WO2005043593A2 publication Critical patent/WO2005043593A2/en
Publication of WO2005043593A8 publication Critical patent/WO2005043593A8/en
Publication of WO2005043593A3 publication Critical patent/WO2005043593A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

A system for processing a workpiece includes a process head assembly and a base assembly. The process head assembly has a process head and an upper rotor. The base assembly has a base and a lower rotor. The base and lower rotor have magnets wherein the upper rotor is engageable with the lower rotor via a magnetic force created by the magnets. The engaged upper and lower rotors form a process chamber where a semiconductor wafer is positioned for processing. Process fluids for treating the workpiece are introduced into the process chamber, optionally while the processing head spins the workpiece. Additionally, air flow around and through the process chamber is managed to reduce particle adders on the workpiece.
PCT/US2004/034895 2003-10-21 2004-10-21 System for processing a workpiece WO2005043593A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP04795977A EP1676312A2 (en) 2003-10-21 2004-10-21 System for processing a workpiece
JP2006536790A JP4685022B2 (en) 2003-10-21 2004-10-21 System for processing workpieces

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US10/690,864 2003-10-21
US10/690,864 US6930046B2 (en) 1999-01-22 2003-10-21 Single workpiece processing system
US10/693,668 US6969682B2 (en) 1999-01-22 2003-10-24 Single workpiece processing system
US10/693,668 2003-10-24
US10/867,458 2004-06-14
US10/867,458 US7217325B2 (en) 1999-01-22 2004-06-14 System for processing a workpiece

Publications (3)

Publication Number Publication Date
WO2005043593A2 WO2005043593A2 (en) 2005-05-12
WO2005043593A8 WO2005043593A8 (en) 2006-06-22
WO2005043593A3 true WO2005043593A3 (en) 2006-08-10

Family

ID=34557426

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/034895 WO2005043593A2 (en) 2003-10-21 2004-10-21 System for processing a workpiece

Country Status (5)

Country Link
EP (1) EP1676312A2 (en)
JP (1) JP4685022B2 (en)
KR (1) KR20060123174A (en)
TW (1) TWI355676B (en)
WO (1) WO2005043593A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8475636B2 (en) 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US9822461B2 (en) 2006-08-16 2017-11-21 Novellus Systems, Inc. Dynamic current distribution control apparatus and method for wafer electroplating
TWI550139B (en) 2011-04-04 2016-09-21 諾菲勒斯系統公司 Electroplating apparatus for tailored uniformity profile
US9909228B2 (en) 2012-11-27 2018-03-06 Lam Research Corporation Method and apparatus for dynamic current distribution control during electroplating
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US9752248B2 (en) 2014-12-19 2017-09-05 Lam Research Corporation Methods and apparatuses for dynamically tunable wafer-edge electroplating
US9567685B2 (en) 2015-01-22 2017-02-14 Lam Research Corporation Apparatus and method for dynamic control of plated uniformity with the use of remote electric current
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6213855B1 (en) * 1999-07-26 2001-04-10 Speedfam-Ipec Corporation Self-powered carrier for polishing or planarizing wafers
US6858088B1 (en) * 1999-02-16 2005-02-22 Steag Hama Tech Ag Method and apparatus for treating substrates
US6899765B2 (en) * 2002-03-29 2005-05-31 Applied Materials Israel, Ltd. Chamber elements defining a movable internal chamber
US20050211618A1 (en) * 2004-03-23 2005-09-29 Tautuhi Raymond T Rotor and methods of use

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232269A (en) * 1996-02-22 1997-09-05 Dainippon Screen Mfg Co Ltd Rotary substrate treatment device
JP3555724B2 (en) * 1997-09-04 2004-08-18 大日本スクリーン製造株式会社 Substrate processing equipment
JP3133735B2 (en) * 1999-02-08 2001-02-13 大日本スクリーン製造株式会社 Rotary coating device
JP4369022B2 (en) * 2000-06-21 2009-11-18 芝浦メカトロニクス株式会社 Spin processing equipment
JP2002164314A (en) * 2000-11-27 2002-06-07 Dainippon Screen Mfg Co Ltd Rotary support plate and substrate treatment apparatus using the rotary support plate
JP2002368066A (en) * 2001-06-06 2002-12-20 Tokyo Electron Ltd Processing device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6858088B1 (en) * 1999-02-16 2005-02-22 Steag Hama Tech Ag Method and apparatus for treating substrates
US6213855B1 (en) * 1999-07-26 2001-04-10 Speedfam-Ipec Corporation Self-powered carrier for polishing or planarizing wafers
US6899765B2 (en) * 2002-03-29 2005-05-31 Applied Materials Israel, Ltd. Chamber elements defining a movable internal chamber
US20050211618A1 (en) * 2004-03-23 2005-09-29 Tautuhi Raymond T Rotor and methods of use

Also Published As

Publication number Publication date
TWI355676B (en) 2012-01-01
WO2005043593A2 (en) 2005-05-12
JP4685022B2 (en) 2011-05-18
JP2007535126A (en) 2007-11-29
WO2005043593A8 (en) 2006-06-22
TW200523992A (en) 2005-07-16
KR20060123174A (en) 2006-12-01
EP1676312A2 (en) 2006-07-05

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