JP2007509758A - 導体の溶接方法 - Google Patents
導体の溶接方法 Download PDFInfo
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- JP2007509758A JP2007509758A JP2006537195A JP2006537195A JP2007509758A JP 2007509758 A JP2007509758 A JP 2007509758A JP 2006537195 A JP2006537195 A JP 2006537195A JP 2006537195 A JP2006537195 A JP 2006537195A JP 2007509758 A JP2007509758 A JP 2007509758A
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- welded
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- 239000004020 conductor Substances 0.000 title claims abstract description 79
- 238000003466 welding Methods 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 42
- 230000006835 compression Effects 0.000 claims abstract description 72
- 238000007906 compression Methods 0.000 claims abstract description 72
- 238000002604 ultrasonography Methods 0.000 claims abstract description 9
- 238000007689 inspection Methods 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000006073 displacement reaction Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 9
- 230000033001 locomotion Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/029—Welded connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Quality & Reliability (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Conductive Materials (AREA)
- Ladders (AREA)
Abstract
【選択図】 図2
Description
−被溶接導体を少なくとも第1及び第2の部材により画定された圧縮室に入れ、
−導体を締め固めて溶接すると同時に、圧縮室の横断面を縮小し、
−圧縮室の圧力を解除し、その際溶接された導体は第1の部材と第2の部材の間に残り、
−超音波を再び印加すると同時に溶接された導体に圧力を加え、
−圧縮室の特性値及び/又は溶接された導体の幾何学的形状を測定する。
Claims (13)
- 少なくとも2個の画定部材によって画定された圧縮室(30)に導体を入れ、圧縮室を閉鎖した後に溶接し、その際、第1の部材、例えば振動音極(16)によって超音波を印加し、第1の部材又は第2の部材、例えば対極(18)によって被溶接導体に圧力を加え、圧縮室の特性値を測定して行う、超音波による電気導体(32)、例えば素線の溶接、特に中継及び端末節点の作製のための素線相互の溶接又は素線と支持体の溶接のための方法において、導体(32)の溶接の後に圧縮室(30)の圧力を解除し、溶接された導体に超音波を働かせ、続いて特性値を測定することを特徴とする方法。
- 圧縮室(30)が少なくとも3個の画定部材(16、18、20)によって画定され、あらかじめ固定され、例えばロックされた少なくとも1個の部材(29)が溶接の後に圧力を解除され、例えばロックを解除されることを特徴とする請求項1に記載の方法。
- 特性値として幾何学的値、例えば圧縮室(30)の高さ、幅又は対角線、特に第1及び第2の部材(16、18)の間隔を選択することを特徴とする請求項1に記載の方法。
- 幾何学的値を位置センサ(38)によって測定することを特徴とする請求項3に記載の方法。
- 少なくとも超音波を印加する第1の部材、例えば振動音極(16)及び第2の部材例えば対極(18)によって圧縮室が画定され、第2又は第1の部材により導体に圧力を加えて行う、超音波溶接装置(10)の圧縮室(30)で溶接された導体(32)、特に中継又は端末節点(54、56)のために溶接された素線もしくは支持体に溶接された素線の品質検査のための方法において、次の手順
即ち
−溶接される導体(32)を圧縮室(30)に入れ、
−導体(32)を締め固めて溶接すると同時に、圧縮室(30)の横断面を縮小し、
−圧縮室(16)の圧力を解除し、その際溶接された導体(32)は第1の部材(16)と第2の部材(18)の間に残り、
−超音波を再度印加すると同時に、溶接された導体(32)に第1ないしは第2の部材(16、18)によって圧力を加え、
−圧縮室の特性値ないしは溶接された導体(32)の幾何学的形状を測定する
ことを特徴とする方法。 - 第2の部材(18)によって導体(32)に圧力を加えることを特徴とする請求項1又は5に記載の方法。
- 圧縮室(30)の測定された特性値ないしは溶接された導体(32)の幾何学的形状に応じて、溶接の品質を評価することを特徴とする請求項5に記載の方法。
- 圧縮室(30)の特性値として圧縮室(30)の高さ、ないしは幅ないしは対角線を例えば位置センサ(38)によって測定することを特徴とする請求項5に記載の方法。
- 超音波の再度の印加を10ms≦T≦250msの期間Tにわたって行うことを特徴とする請求項1ないし8の少なくとも1つに記載の方法。
- 溶接された導体(32)に超音波を再び印加すると同時に、1バール≦P≦4バールの圧力Pで加圧することを特徴とする請求項1ないし9の少なくとも1つに記載の方法。
- 溶接された導体(32)に低品質の溶接が認められたならば、溶接部を破壊又はほぼ破壊するために、圧縮室(30)を開いて、再び超音波を印加すると同時に圧力を加えることを特徴とする請求項1ないし10の少なくとも1つに記載の方法。
- 溶接された導体(32)に正常な溶接が認められたならば、溶接部の適切な再圧縮のために、圧縮室(30)を開いて、再び超音波を印加すると同時に圧力を加えることを特徴とする請求項1ないし10の少なくとも1つに記載の方法。
- 溶接された導体、特に溶接された素線、例えば中継又は端末節点もしくは支持体に溶接された素線の品質検査のための請求項5に記載の方法において、超音波振動を印加する第1の部材、例えば振動音極と第2の部材例えば対極との間に、溶接された導体を配置し、溶接された導体に第1の部材により超音波を印加すると同時に圧力を加え、印加の時又は後に生じた第1及び第2の部材の間隔の変化を測定することを特徴とする方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10350809.0 | 2003-10-29 | ||
DE10350809A DE10350809B3 (de) | 2003-10-29 | 2003-10-29 | Verfahren zum Verschweissen von Leitern |
DE10359368A DE10359368A1 (de) | 2003-12-18 | 2003-12-18 | Verfahren zum Verschweißen von Leitern |
DE10359368.3 | 2003-12-18 | ||
PCT/EP2004/012221 WO2005042202A1 (de) | 2003-10-29 | 2004-10-28 | Verfahren zum verschweissen von leitern |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007509758A true JP2007509758A (ja) | 2007-04-19 |
JP5142527B2 JP5142527B2 (ja) | 2013-02-13 |
Family
ID=34553317
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006537195A Active JP5142527B2 (ja) | 2003-10-29 | 2004-10-28 | 導体の溶接方法 |
Country Status (11)
Country | Link |
---|---|
US (1) | US7600665B2 (ja) |
EP (1) | EP1677942B1 (ja) |
JP (1) | JP5142527B2 (ja) |
KR (1) | KR20060102558A (ja) |
AT (1) | ATE451998T1 (ja) |
BR (1) | BRPI0415993B1 (ja) |
DE (1) | DE502004010531D1 (ja) |
MX (1) | MXPA06004855A (ja) |
PL (1) | PL1677942T3 (ja) |
PT (1) | PT1677942E (ja) |
WO (1) | WO2005042202A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013004406A (ja) * | 2011-06-20 | 2013-01-07 | Hitachi Cable Ltd | 端子付き電線の製造方法 |
JP2016526488A (ja) * | 2013-07-18 | 2016-09-05 | シュンク・ソノシステムズ・ゲーエムベーハー | 2つの溶接のために同一の幅でなされる溶接によってノードを製造するための方法 |
DE102018212947A1 (de) | 2017-08-02 | 2019-02-07 | Yazaki Corporation | Drahtverbindungsverfahren |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4597988B2 (ja) * | 2003-08-22 | 2010-12-15 | シュンク・ソノシステムズ・ゲーエムベーハー | 導体を圧縮および/または溶接するための装置 |
DE102005004899A1 (de) * | 2005-02-02 | 2006-08-03 | Schunk Ultraschalltechnik Gmbh | Verdichtungsraum sowie ein einen Verdichtungsraum begrenzendes Werkzeug |
DE102005048368B3 (de) * | 2005-10-10 | 2007-05-03 | Schunk Ultraschalltechnik Gmbh | Verfahren zum Herstellen einer Schweißverbindung zwischen elektrischen Leitern |
DE102008045751B4 (de) * | 2008-09-04 | 2020-01-30 | Te Connectivity Germany Gmbh | Vorrichtung und Verfahren zum Kompaktierschweißen |
JP5654242B2 (ja) | 2010-01-18 | 2015-01-14 | 矢崎総業株式会社 | 電線の端末処理方法 |
JP5400676B2 (ja) * | 2010-03-17 | 2014-01-29 | 古河電気工業株式会社 | 超音波溶接方法 |
DE102012111734A1 (de) * | 2012-12-03 | 2014-06-05 | Schunk Sonosystems Gmbh | Ultraschallschweißvorrichtung sowie Verfahren zum Verschweißen von elektrischen Leitern |
DE102013222938B3 (de) * | 2013-11-11 | 2015-04-30 | Schunk Sonosystems Gmbh | Vorrichtung zum Verschweißen von elektrischen Leitern |
EP3260229A1 (de) * | 2016-06-22 | 2017-12-27 | Delphi Technologies, Inc. | Spannsystem für eine ultraschall-schweissanlage und deren verwendung |
DE102016214227B3 (de) * | 2016-08-02 | 2017-12-07 | Schunk Sonosystems Gmbh | Vorrichtung und Verfahren zur Herstellung einer geprüften Schweißverbindung |
DE102016218308B4 (de) * | 2016-08-03 | 2018-04-05 | Schunk Sonosystems Gmbh | Vorrichtung und Verfahren zur Herstellung einer geprüften Schweißverbindung |
WO2018167929A1 (ja) * | 2017-03-16 | 2018-09-20 | 三菱電機株式会社 | 板状はんだの製造装置およびその製造方法 |
JP6887203B2 (ja) * | 2017-07-14 | 2021-06-16 | 古河電気工業株式会社 | 導体接続装置及び導体接続方法 |
JP6655056B2 (ja) * | 2017-11-28 | 2020-02-26 | 矢崎総業株式会社 | 電線の導体の超音波接合方法、端子付き電線の製造方法および電線 |
US10830316B2 (en) * | 2017-12-08 | 2020-11-10 | Gates Corporation | Tensioner |
US11980963B2 (en) * | 2019-11-05 | 2024-05-14 | Schunk Sonosystems Gmbh | Ultrasonic welding device with position detection of joint partners |
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DE1473400A1 (de) * | 1962-05-23 | 1969-01-09 | Deutsch Pruef Messgeraete | Verfahren und Vorrichtung zur zerstoerungsfreien Pruefung von Punkt- und anderen Pressschweissungen |
US3697837A (en) | 1970-10-05 | 1972-10-10 | Gen Electric | Electromagnetic force system for integrated circuit fabrication |
US3890831A (en) * | 1973-01-19 | 1975-06-24 | Us Navy | Ultrasonic bond monitor |
FR2302172A1 (fr) * | 1975-02-27 | 1976-09-24 | Podselver Michel | Perfectionnements aux appareils de soudage avec pression |
US4746051A (en) * | 1982-12-08 | 1988-05-24 | General Motors Corporation | Ultrasonic welding control |
DE3335254A1 (de) * | 1983-09-29 | 1985-04-18 | Schunk Ultraschalltechnik Gmbh, 8750 Aschaffenburg | Vorrichtung zum verbinden bzw. verdichten elektrischer leiter |
US4631685A (en) * | 1984-12-07 | 1986-12-23 | General Motors Corporation | Method and apparatus for ultrasonic plastic forming and joining |
DE3667930D1 (de) * | 1985-07-12 | 1990-02-08 | Siemens Ag | Verfahren zum regeln des prozessverlaufes und zur qualitaetskontrolle beim ultraschallschweissen von werkstuecken. |
DE3719083C2 (de) | 1987-06-06 | 1994-04-28 | Stapla Ultraschalltechnik Gmbh | Verfahren zum Verbinden elektrischer Leiter und Vorrichtung zur Durchführung des Verfahrens |
DE4335108C1 (de) * | 1993-10-14 | 1995-01-05 | Schunk Ultraschalltechnik Gmbh | Verfahren und Vorrichtung zum Kompaktieren und anschließenden Schweißen von elektrischen Leitern |
DE4429684A1 (de) * | 1994-08-22 | 1996-02-29 | Schunk Ultraschalltechnik Gmbh | Verfahren zum Kompaktieren und anschließenden Schweißen von elektrischen Leitern |
ES2116020T3 (es) | 1994-08-22 | 1998-07-01 | Schunk Ultraschalltechnik Gmbh | Procedimiento para el compactado y la soldadura ulterior de conductores electricos. |
DE19749682A1 (de) * | 1997-11-10 | 1999-05-12 | Draexlmaier Lisa Gmbh | Prüfverfahren zum zerstörungsfreien Prüfen eines Schweißverbinders, Prüfvorrichtung und Ultraschallschweißgerät mit einer solchen Vorrichtung |
-
2004
- 2004-10-28 EP EP04790990A patent/EP1677942B1/de active Active
- 2004-10-28 US US10/577,013 patent/US7600665B2/en active Active
- 2004-10-28 PL PL04790990T patent/PL1677942T3/pl unknown
- 2004-10-28 KR KR1020067010498A patent/KR20060102558A/ko not_active Application Discontinuation
- 2004-10-28 JP JP2006537195A patent/JP5142527B2/ja active Active
- 2004-10-28 MX MXPA06004855A patent/MXPA06004855A/es active IP Right Grant
- 2004-10-28 WO PCT/EP2004/012221 patent/WO2005042202A1/de active Application Filing
- 2004-10-28 PT PT04790990T patent/PT1677942E/pt unknown
- 2004-10-28 DE DE502004010531T patent/DE502004010531D1/de active Active
- 2004-10-28 BR BRPI0415993-4A patent/BRPI0415993B1/pt active IP Right Grant
- 2004-10-28 AT AT04790990T patent/ATE451998T1/de not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013004406A (ja) * | 2011-06-20 | 2013-01-07 | Hitachi Cable Ltd | 端子付き電線の製造方法 |
JP2016526488A (ja) * | 2013-07-18 | 2016-09-05 | シュンク・ソノシステムズ・ゲーエムベーハー | 2つの溶接のために同一の幅でなされる溶接によってノードを製造するための方法 |
DE102018212947A1 (de) | 2017-08-02 | 2019-02-07 | Yazaki Corporation | Drahtverbindungsverfahren |
Also Published As
Publication number | Publication date |
---|---|
EP1677942A1 (de) | 2006-07-12 |
WO2005042202A1 (de) | 2005-05-12 |
BRPI0415993A (pt) | 2007-01-09 |
PL1677942T3 (pl) | 2010-05-31 |
MXPA06004855A (es) | 2006-07-06 |
DE502004010531D1 (de) | 2010-01-28 |
KR20060102558A (ko) | 2006-09-27 |
JP5142527B2 (ja) | 2013-02-13 |
US20060283912A1 (en) | 2006-12-21 |
US7600665B2 (en) | 2009-10-13 |
BRPI0415993B1 (pt) | 2013-04-16 |
ATE451998T1 (de) | 2010-01-15 |
PT1677942E (pt) | 2010-03-17 |
EP1677942B1 (de) | 2009-12-16 |
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