JP5044606B2 - ワイヤボンディング装置 - Google Patents
ワイヤボンディング装置 Download PDFInfo
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- JP5044606B2 JP5044606B2 JP2009108861A JP2009108861A JP5044606B2 JP 5044606 B2 JP5044606 B2 JP 5044606B2 JP 2009108861 A JP2009108861 A JP 2009108861A JP 2009108861 A JP2009108861 A JP 2009108861A JP 5044606 B2 JP5044606 B2 JP 5044606B2
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- bonding
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- spring
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- 238000012937 correction Methods 0.000 claims description 23
- 238000005259 measurement Methods 0.000 claims description 14
- 238000001514 detection method Methods 0.000 claims description 8
- 238000012360 testing method Methods 0.000 description 42
- 238000000034 method Methods 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 13
- 238000006073 displacement reaction Methods 0.000 description 5
- 230000008030 elimination Effects 0.000 description 3
- 238000003379 elimination reaction Methods 0.000 description 3
- 238000012790 confirmation Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
Wh=Mg+AY+B(X+Y)=Mg+BX+KY ・・・(1)
但し、Wh:ヘッド自重、M:ボンディングヘッド3の質量、g:重力加速度、A:2つの板ばね7の合算ばね定数、B:引張ばね9のばね定数、X:非ボンディング時の引張ばね9の伸び量、Y:沈み込み量、K:2つの板ばね7および引張ばね9の合算ばね定数、である。
そして、沈み込み量Y=0の状態では、上式(1)は下式(2)のように整理される。
Wh0=Mg+BX ・・・(2)
Fs1=−Wh0+1N ・・・(3)
Z=Lt×0.05/K ・・・(4)
2 装置本体
3 ボンディングヘッド
5 ボンディングツール
6 クランプ
7 板ばね
9 引張コイルばね
10 ストッパ
11 リニアモータ
12 モータ制御装置(駆動手段)
13 ギャップセンサ(位置検出手段)
14 ワイヤ
15 半導体装置(ボンディング対象物)
21 モード切替部
22 目標推力設定部
23 目標推力補正部
26 推力補正値設定部
F 目標推力
Y 沈み込み量
Claims (3)
- 装置本体と、
ボンディング対象物に近接および離間すべく、Z軸に沿って移動自在に前記装置本体により支持され、ボンディングツールおよびワイヤクランプを有するボンディングヘッドと、
前記装置本体と前記ボンディングヘッドとの間に設けられ、当該ボンディングヘッドにZ軸に沿う荷重を発生させるばねと、
推力を発生させることによって前記ボンディングヘッドに前記Z軸に沿う荷重を加えるリニアモータと、
前記リニアモータを駆動制御する駆動制御手段と、
前記ボンディングヘッドの前記装置本体に対する前記Z軸方向の相対位置を検出する位置検出手段と
を備えたワイヤボンディング装置であって、
前記駆動制御手段は、
前記ボンディングツールによって前記ボンディング対象物に接合されたワイヤを前記ワイヤクランプが把持した状態で当該ワイヤに所定の引張荷重を印加すべく、前記ボンディングヘッドの荷重および前記ばねのばね荷重を加味した上で前記リニアモータの目標推力を設定する目標推力設定手段と、
前記目標推力で前記リニアモータを駆動したときの前記位置検出手段の検出結果に基づいて算出される前記ばねの荷重変化分により、前記目標推力を補正する目標推力補正手段とを備えたことを特徴とするワイヤボンディング装置。 - 前記駆動制御手段は、前記位置検出手段の検出結果が所定の閾値以下となるまで前記補正を繰り返すことを特徴とする、請求項1に記載のワイヤボンディング装置。
- 前記駆動制御手段は、前記ボンディングヘッドの自重および前記ばねのばね定数を測定する測定モードを更に備えたことを特徴とする、請求項1または2に記載のワイヤボンディング装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009108861A JP5044606B2 (ja) | 2009-04-28 | 2009-04-28 | ワイヤボンディング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009108861A JP5044606B2 (ja) | 2009-04-28 | 2009-04-28 | ワイヤボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010258331A JP2010258331A (ja) | 2010-11-11 |
JP5044606B2 true JP5044606B2 (ja) | 2012-10-10 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2009108861A Active JP5044606B2 (ja) | 2009-04-28 | 2009-04-28 | ワイヤボンディング装置 |
Country Status (1)
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JP (1) | JP5044606B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7077650B2 (ja) * | 2018-02-16 | 2022-05-31 | トヨタ自動車株式会社 | ボンディング装置、及びボンディング方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07161779A (ja) * | 1993-12-02 | 1995-06-23 | Hitachi Ltd | ワイヤボンディング装置 |
JP3724875B2 (ja) * | 1996-03-29 | 2005-12-07 | 松下電器産業株式会社 | ワイヤーボンディング方法とそのワイヤーボンディング方法を使用した半導体実装方法ならびにワイヤーボンディング装置とそのワイヤーボンディング装置を備えた半導体実装装置。 |
JP2000003929A (ja) * | 1998-06-15 | 2000-01-07 | Rohm Co Ltd | ワイヤボンディングの良否判別方法 |
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- 2009-04-28 JP JP2009108861A patent/JP5044606B2/ja active Active
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