JP2007335749A - Attachment and vacuum bonding device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an attachment and a vacuum bonding device which can cool efficiently components formed by the thermal bonding in a short time, when applying the thermal bonding under vacuum atmosphere in a stacked state of components. <P>SOLUTION: The attachment bonds a cavity 5 and a base 1a by thermal bonding in a vacuum chamber 9 which can introduce cooling gas. The attachment includes: a heater 8 for heating at least one of the cavity 5 and the base 1a; a holder 6 for holding the above base 1a; an elastic body 14 for carrying out elastic deformation by pressing; and a pressing member 7 for pressing the cavity 5 and the base 1a, or the above holder 6 via the elastic body 14. The vacuum bonding device comprises the attachment. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an attachment and a vacuum bonding apparatus used for semiconductor manufacturing, for example, and more particularly to an attachment and a vacuum bonding apparatus for bonding components to each other by applying heat and a load in a vacuum atmosphere.

  In recent years, by adding a member having an optical function such as a lens or a mirror to a semiconductor chip or a semiconductor substrate mounted on an optical product such as an optical communication device or a microscope, the number of parts used can be reduced. Development of devices that are miniaturized and highly functional has been actively conducted. Note that such devices often require a bonding process between semiconductor components in a vacuum atmosphere in an actual production process in order to effectively exhibit their functions and to ensure reliability.

  By the way, in a vacuum atmosphere, there arises a problem that heat radiation due to convection cannot be expected when the heated member is cooled, for example, in a process that requires heating to join components to form a predetermined device. Therefore, as compared with the case in an air atmosphere, the cooling time of the device inevitably becomes long, and the production efficiency is lowered. In view of such circumstances, a vacuum bonding apparatus capable of forcibly cooling a member formed by heating in order to bond components in a vacuum atmosphere has been developed. Disclosed is a method and apparatus for simply heating / cooling a substrate by placing the substrate on a substrate plate in a chamber and heating / cooling the substrate plate. Hereafter, the characteristic part of the method and apparatus of the said patent document 1 is demonstrated with reference to FIG.

  An apparatus disclosed in Patent Document 1 includes a substrate plate 103 that can hold and lift a substrate 102, a heating plate 104 that heats the substrate plate 103, and a cooling unit 105 that cools the substrate plate 103. Is a device installed in the vacuum chamber 101.

  With such a configuration, the substrate plate 103 is connected to the cooling unit 105 when it is raised (see FIG. 9A). The substrate plate 103 is connected to the heating plate 104 when the substrate plate 103 is lowered (see FIG. 9B).

Therefore, when the substrate 102 is heated, the substrate plate 103 is lowered and the substrate plate 103 and the heating plate 104 are brought into contact with each other. At this time, since the substrate plate 103 is separated from the cooling unit 105, the substrate 102 and the substrate plate 103 can be efficiently heated by the heating plate 104. On the other hand, when the substrate 102 is cooled, the substrate plate 103 is raised and the substrate plate 103 and the cooling unit 105 are brought into contact with each other. At this time, since the substrate plate 103 is separated from the heating plate 104, there is no heating by heat conduction from the heating plate 104, and the substrate 102 and the substrate plate 103 are efficiently moved by the cooling unit 105. Can be cooled.
Japanese Patent Laid-Open No. 2003-318076

  As described above, in the method and apparatus disclosed in Patent Document 1, when the substrate 102 is efficiently cooled, the substrate plate 103 is raised and separated from the heating plate 104 (FIG. 9A). Thus, the heat transfer from the heating plate 104 to the substrate plate 103 is blocked. However, the coating film applied on the substrate 102 has a low viscosity at a high temperature, and undulation is generated on the surface of the coating film due to vibration accompanying the ascending operation of the substrate plate 103. It can happen. And the wave | undulation in the said coating film can produce the hole of a molecular level in the said coating film.

  Therefore, the substrate plate 103 cannot be raised until the viscosity of the coating film is high enough to prevent the surface of the coating film from being wavy due to vibration. That is, until the substrate plate 103 can be raised, the substrate 102 and the substrate are connected in a state where the substrate plate 103 and the heating plate 104 are connected (see FIG. 9B). The plate 103 must be cooled.

  Here, in a state where the substrate plate 103 and the heating plate 104 are not separated, heat transfer from the heating plate 104 to the substrate plate 103 occurs due to conduction. Therefore, in such a state, even if the heat generation of the heating plate 104 is stopped, it is very difficult to cool the substrate 102 rapidly.

  In addition, when applying the technique disclosed in Patent Document 1 to joining parts in a vacuum, for example, a method using a brazing material or a solder material that is a joining material that melts by heating as the coating film. As a result, the substrate plate 103 cannot be raised and lowered until the molten bonding material is solidified, so that there is a problem that it takes time to cool the parts after heating and the tact time becomes long.

  The present invention has been made in view of the above circumstances, and when joining parts by applying heat in a state where the parts are superposed in a vacuum atmosphere, the parts produced by the joining can be efficiently performed in a short time. It is an object of the present invention to provide an attachment and a vacuum bonding apparatus that can be cooled in an automatic manner.

  In order to achieve the above object, an attachment according to the first aspect of the present invention is an attachment that heats and joins a cavity part and a base part in a vacuum chamber into which a cooling gas can be introduced. And a heater for heating at least one of the base parts, a holder for holding the base parts, and an elastic body that is elastically deformed by being pressed, and the cavity parts and the base parts or the above And a pressing member that presses the holder through the elastic body.

  In order to achieve the above object, a vacuum bonding apparatus according to the second aspect of the present invention includes an attachment according to the first aspect of the present invention, a vacuum chamber that can be set to a desired vacuum pressure atmosphere, and the pressing member. A head drive mechanism for driving and a valve for introducing cooling gas at a predetermined flow rate and pressure into the vacuum chamber are provided.

  The present invention provides an attachment and a vacuum bonding apparatus capable of efficiently cooling a component generated by the bonding in a short time when the components are bonded to each other in a vacuum atmosphere by applying heat. Can be provided.

Hereinafter, embodiments of the attachment and the vacuum bonding apparatus of the present invention will be described with reference to the drawings.
[First embodiment]
As shown in FIG. 1, the vacuum bonding apparatus according to the first embodiment includes a holder 6, a pressing member 7, a heater 8, a vacuum chamber 9, a pressure control mechanism 10, a vacuum pump 11, and a head drive. A mechanism 13, an elastic body 14, a cavity part pressing member 15, a valve 16, and a fan 20 are provided. In addition, the part which consists of the said holder 6, the said press member 7, the said heater 8, and the said elastic body 14 is an attachment which concerns on this 1st Embodiment.

  And in this 1st Embodiment, as shown in FIG. 1, the scene which joins the base component 1a with which the device 2 is mounted beforehand, and the cavity component 5 via the junction part 3a and the joining material 4 is assumed. . Here, the joint portion 3a is provided on the base component 1a. Further, it is assumed that the bonding material 4 is supplied to the bonding portion 3a in advance as shown in FIGS. In other words, the cavity part 5 is installed on the base part 1 a via the joint 3 a and the joining material 4. A component constituted by the base component 1 a, the bonding portion 3 a, the bonding material 4, and the cavity component 5 is referred to as a set component 17. Here, a gap portion 19 is formed between the bonding material 4 and the cavity component 5 due to the presence of the bonding material 4 having the convex portions 18 as shown in FIG. And the conductance which can control the pressure of the space inside the set component 17 (the space where the device 2 exists) to a desired value is secured by the convex portion 18 and the gap portion 19 in the bonding material 4. .

  Note that the bonding material 4 may be supplied in advance to the cavity component 5 instead of being supplied to the bonding portion 3a. Further, the bonding material 4 may be supplied in advance to both the bonding portion 3 a and the cavity component 5. Of course, if necessary, the base part 1a and the cavity part 5 may be temporarily secured.

  Hereinafter, the configuration of the attachment and the vacuum bonding apparatus according to the first embodiment of the present invention will be described with reference to FIG.

  First, the vacuum chamber 9 is a chamber in which the pressure control mechanism 10 can arbitrarily control the internal pressure. The vacuum chamber 9 can be evacuated by the vacuum pump 11. Further, the vacuum chamber 9 has a gate (not shown) that can be divided or opened and closed. With this gate, the base part 1a, the cavity part 5 and the like can be taken into and out of the vacuum chamber 9. The base part 1a is held by the holder 6 having a holding mechanism (not shown) (for example, a mechanical chuck or an electrostatic chuck).

The pressing member 7 is a member made of a material having good heat conduction. As the material of the pressing member 7, brass (CuZn), aluminum (Al), aluminum nitride (AlN), silicon carbide (SiC), silicon nitride (Si ₃ N ₄ ), etc. having good thermal conductivity are suitable. . If necessary, a film capable of reflecting radiant heat may be formed on the inner wall of the pressing member 7. As this film formation, for example, Al, Ni, or Au coating is desirable.

  And the elastic body 14 is affixed to the front-end | tip (contact part with the said base component 1a) of the said press member 7, as shown in FIG. Since the elastic body 14 is a member that is elastically deformed by being pressed, the pressing member 7 can be in close contact with the base component 1 a via the elastic body 14. In other words, the elastic body 14 is a member that enables the base part 1a and the pressing member 7 to be in close contact with each other. The material of the elastic body 14 is preferably a polyimide resin or a polyimide amide resin. Further, the elastic body 14 has a thermal resistance that increases in proportion to its thickness, and the efficiency of heating and cooling is impaired. Therefore, the thickness of the elastic body 14 is desirably 1 μm or more and 20 μm or less.

  Further, the pressing member 7 is provided with the heater 8 in close contact as shown in FIG. In addition, the said heater 8 may be installed in the said holder 6 side as needed. The heater 8 may be installed on both the pressing member 7 side and the holder 6 side.

  A cavity part pressing member 15 for pressing the cavity part 5 against the base part 1a is provided on the inner wall of the pressing member 7 as shown in FIG. However, the cavity part pressing member 15 is not an essential constituent member. In other words, if no load is applied to the cavity component 5, the cavity component pressing member 15 is also unnecessary. Even when a load on the cavity part 5 is necessary, the same effect as that obtained when the cavity part pressing member 15 is used can be obtained by using a weight or the like.

  A portion including the pressing member 7, the heater 8, the elastic body 14, and the cavity part pressing member 15 is referred to as a head 12. The head drive mechanism 13 is a drive mechanism for driving the head 12 to move up and down to an arbitrary position. Further, by driving the head 12 by the head driving mechanism 13, an arbitrary load can be applied to the base part 1a, the cavity part 5 and the like.

  The valve 16 is a member for introducing a cooling gas for cooling the head 12 into the vacuum chamber 9 at a desired pressure and flow rate. Here, the cooling gas may be air, but is preferably an inert gas typified by nitrogen gas. The fan 20 is a member for stirring the cooling gas introduced into the vacuum chamber 9.

  Hereinafter, with reference to the flowchart shown in FIG. 3, a component bonding process using the attachment and the vacuum bonding apparatus according to the first embodiment will be described.

  First, the cavity part 5 is installed at a predetermined position on the joining part 3a provided on the base part 1a with the joining material 4 interposed (step S1). If necessary, the base part 1a, the bonding material 4 and the cavity part 5 may be fixed so as not to be displaced from each other by a binder or a pressure bonding (not shown). Here, the binder is an adhesive made of, for example, tin.

  Next, the gate (not shown) provided in the vacuum chamber 9 is opened, the set component 17 is carried into the vacuum chamber 9, and the set is performed by the chuck (not shown) of the holder 6. The component 17 is held (step S2).

  Then, the gate (not shown) provided in the vacuum chamber 9 is closed to seal the vacuum chamber 9, and the vacuum pump 11 is operated to evacuate the vacuum chamber 9 as shown in FIG. And the pressure in the vacuum chamber 9 is set to a predetermined value by driving the pressure control mechanism 10 (step S3). The gap 19 provides a conductance sufficient to exhaust the space formed by the base part 1a and the cavity part 5. Therefore, the pressure inside the vacuum chamber 9 and the pressure inside the set component 17 have the same value.

  Thereafter, as shown in FIG. 5, the head driving mechanism 13 is driven to lower the head 12, and the pressing member 7 and the base part 1a form an airtight space. That is, the pressing member 7 and the base part 1a are brought into close contact via the elastic body 14 (step S4), and the upper surface of the cavity part 5 is pressed with a desired load by the cavity part pressing member 15 ( Step S5).

  The adhesion between the pressing member 7 and the base component 1a obtained in step S4 is that of the elastic body 14 elastically deformed by being pressed by the head 12 driven by the head driving mechanism 13. Realized by existence.

  Thereafter, the heater 8 is driven to heat the pressing member 7 (step S6). In step S <b> 6, the heat of the heater 8 is sequentially conducted with the pressing member 7, the elastic body 14, the joint portion 3 a, and the joint material 4. Due to such heat conduction, the bonding material 4 is heated and melted.

  After heating the bonding material 4 at a desired temperature and time, the operation of the vacuum pump 11 is stopped, and the valve 16 and the pressure control mechanism 10 are driven to produce a cooling gas (not shown) as shown in FIG. ) Is introduced into the vacuum chamber 9 at a desired pressure and flow rate (step S7). In step S7, when the head 12 is cooled by the cooling gas (not shown), the elastic body 14, the bonding portion 3a, and the bonding material 4 are sequentially cooled efficiently by conduction.

  Further, by introducing the cooling gas (not shown) at a pressure (for example, atmospheric pressure) larger than the sealing pressure of the set component 17, the head 12 is pressed by the pressure of the cooling gas. Thereby, the airtightness of the space formed by the pressing member 7 is not lowered. In addition, the cooling gas introduced into the vacuum chamber 9 can be stirred by the fan 20 to promote cooling by convection.

  After cooling to a temperature at which the bonding material 4 is cured (step S8), the head drive mechanism 13 is driven to raise the head 12 as shown in FIG. At this time, since the bonding material 4 is already cured, the space formed by the cavity component 5 and the base component 1a can be maintained at a desired degree of vacuum even when the head 12 is raised. .

  Similarly, after raising the head 12, the cooling gas (not shown) is introduced into the vacuum chamber 9 at a desired pressure and flow rate, and the set component 17 is cooled to a desired temperature (step). S9).

  After the set part 17 is cooled to a desired temperature, the gate (not shown) provided in the vacuum chamber 9 is opened, and the joined set part 17 is recovered (step S10). finish.

  The joining process by the attachment and the vacuum joining apparatus according to the first embodiment is completed through the above steps.

  As described above, according to the first embodiment, when heat is applied in a state where the parts are superposed in a vacuum atmosphere, the parts generated by the joining can be efficiently performed in a short time. It is possible to provide an attachment and a vacuum bonding apparatus that can be cooled to each other.

  Specifically, according to the attachment and the vacuum bonding apparatus according to the first embodiment, the pressing member 7 and the base part 1a are brought into contact with each other via the elastic body 14 and are brought into close contact with each other. As described above, heat can be transferred by conduction even in a vacuum.

  Further, the elastic body 14 can ensure the airtightness of the internal space constituted by the pressing member 7 and the base part 1a. Therefore, by introducing the cooling gas into the vacuum chamber 9, the set component 17 can be cooled by convection. That is, it is possible to start cooling the set component 17 before the bonding material 4 is cured, which is impossible with the prior art. Thereby, the tact of the cooling process, that is, the manufacturing tact can be shortened, and the product can be provided at low cost.

  In the first embodiment, the component temporary assembly process has been described as step S1, but this process can be replaced by the following process.

  That is, instead of the step S1, the cavity component 5 is held by the pressing member 7 by a holding mechanism (not shown) (for example, a mechanical chuck or an electrostatic chuck), and the base component 1a and the above-mentioned by a positioning mechanism (not shown). After the relative positioning with respect to the cavity part 5 is performed, the head part 12 is lowered and pressed by the head driving mechanism 13 so that the base part 1a and the cavity part 5 are positioned and assembled. .

[Second Embodiment]
Next, an attachment and a vacuum bonding apparatus according to the second embodiment of the present invention will be described. Hereinafter, the attachment and the vacuum bonding apparatus according to the second embodiment will be described focusing on differences from the attachment and the vacuum bonding apparatus according to the first embodiment.

  In the second embodiment, the base part 1b is a part corresponding to the base part 1a in the first embodiment, the joint part 3b is a part corresponding to the joint part 3a in the first embodiment, and the first embodiment. There is a head 25 as a member corresponding to the head 12 in the form, and the elastic member 21 for sealing and the elastic member for heating are members serving as the elastic member 14 provided in the pressing member 7 in the first embodiment. There are 23.

  The joint portion 3b is provided in a similar shape of the joint surface between the base part 1b and the cavity part 5. Further, as shown in FIG. 8, the upper surface of the cavity component 5 is opposed to the attachment inner surface upper wall 24 having an area larger than the area of the upper surface. The heating elastic body 23 is affixed to the attachment inner surface upper wall 24, and the heating elastic body 23 can come into contact with the upper surface of the cavity component 5. The material and thickness of the heating elastic body 23 are the same as those of the elastic body 14 in the first embodiment. The size of the surface of the heating elastic body 23 that comes into contact with the upper surface of the cavity component 5 is preferably larger than the upper surface of the cavity component 5 (in FIG. 8, the heating elastic body 23 is The size of the surface in contact with the upper surface of the cavity component 5 is shown as being the same area as the upper surface of the cavity component 5).

  Further, as shown in FIG. 8, the sealing elastic body, which is an elastic body for bringing the distal end surface and the holder 6 into close contact with the distal end surface (the contact surface with the holder 6) of the pressing member 22. 21 is affixed.

  The material of the sealing elastic body 21 is preferably a material having heat resistance that lasts with respect to the maximum temperature of the heater 8 that is actually used. Specifically, examples of the material of the sealing elastic body 21 include polyimide resin, polyamide resin, fluorine-based rubber (elastomer), and silicon-based rubber (elastomer). It is assumed that the sealing elastic body is thicker than the heating elastic body.

  In the second embodiment, the head 25 is constituted by the pressing member 22 and the heater 8. The head drive mechanism 13 can raise and lower the head 25 to a desired position and apply a desired load to the member that is in contact with the head 25.

  Hereinafter, a component bonding process using the attachment and the vacuum bonding apparatus according to the second embodiment will be described. The component bonding process using the attachment and the vacuum bonding apparatus according to the second embodiment is the same as the component bonding process described with reference to FIG. 3 in the first embodiment, except for steps S4 to S6. It is the same. Therefore, here, the description will focus on steps S4A to S6A, which are component joining steps in place of steps S4 to S6 in the first embodiment.

  First, in steps S1 to S3, as in the first embodiment, after assembling the components, supplying / holding the components, and controlling the sealing pressure, the head driving mechanism 13 is driven to drive the head 25. , The seal elastic body 21 affixed to the tip of the pressing member 22 and the holder 6 are brought into contact with each other, and a desired load is applied by the head drive mechanism 13 to thereby provide the seal elastic body 21. Is elastically deformed to ensure the airtightness of the space formed by the pressing member 22 and the holder 6 (step S4A).

  Thereafter, the heating elastic body 23 affixed to the attachment inner surface upper wall 24 of the pressing member 22 is brought into contact with the upper surface of the cavity component 5, and a desired load is applied by the head driving mechanism 13. Then, the sealing elastic body 21 is elastically deformed to ensure adhesion between the pressing member 22 and the cavity part 5 and to apply a desired load to the cavity part 5 (step S5A).

  Then, the heater 8 is driven to heat the pressing member 22 (step S6A). Here, in the second embodiment, the pressing member 22 and the cavity component 5 are secured to each other by the heating elastic body 23, so that heat is efficiently transmitted by conduction even in a vacuum. Therefore, the bonding material 4 can be heated.

  Thereafter, in steps S7 to S10, the introduction of the cooling gas, the cooling of the bonding material, the cooling of the components, and the recovery of the components are performed, and the bonding process by the attachment and the vacuum bonding apparatus according to the second embodiment is completed. .

  As described above, according to the second embodiment, when heat is applied in a state where the components are superposed in a vacuum atmosphere, the components generated by the bonding can be efficiently performed in a short time. It is possible to provide an attachment and a vacuum bonding apparatus that can be cooled to each other.

  Specifically, the sealing elastic body 21 ensures adhesion between the holder 6 and the pressing member 22. Thereby, the airtightness of the space comprised by the said holder 6 and the said press member 22 is securable. The heating elastic body 23 ensures adhesion between the pressing member 22 and the cavity component 5. Thereby, efficient heat conduction between the pressing member 22 and the cavity component 5 is possible even in a vacuum. With such a configuration, the set component 17 can be cooled by convection by introducing a cooling gas into the vacuum chamber 9. Therefore, the set component 17 can be cooled before the bonding material 4 is cured, which is impossible with the conventional technique. Thereby, the tact of the cooling process, that is, the manufacturing tact can be shortened, and the product can be provided at low cost.

  Furthermore, according to the second embodiment, the base component 1a and the cavity component 5 in the attachment and the vacuum bonding apparatus according to the first embodiment can be reduced in size. That is, according to the second embodiment, the set component 17 can be reduced in size as compared with the first embodiment. Thereby, the material cost of parts can be reduced, and it becomes possible to provide a product more inexpensively.

  As mentioned above, although this invention was demonstrated based on 1st Embodiment and 2nd Embodiment, this invention is not limited to embodiment mentioned above, A various deformation | transformation and application are within the range of the summary of this invention. Of course it is possible.

  Further, the above-described embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the effect described in the column of the effect of the invention Can be extracted as an invention.

The figure which shows the structure of the attachment and vacuum bonding apparatus which concern on 1st Embodiment of this invention. The figure which shows the clearance gap formed between a joining material and cavity components. The flowchart which shows the component joining process using the attachment and vacuum bonding apparatus which concern on 1st Embodiment of this invention. The figure which shows the mode of the component joining process of step S3 in the flowchart shown in FIG. The figure which shows the mode of the component joining process of step S4 in the flowchart shown in FIG. The figure which shows the mode of the component joining process of step S7 in the flowchart shown in FIG. The figure which shows the mode of the component joining process of step S8 in the flowchart shown in FIG. The figure which shows the structure of the attachment and vacuum bonding apparatus which concern on 2nd Embodiment of this invention. The figure which shows the characteristic part in the technique disclosed by patent document 1. FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1a, 1b ... Base part, 2 ... Device, 3a, 3b ... Joint part, 4 ... Joining material, 5 ... Cavity part, 6 ... Holder, 7, 22 ... Pressing member, 8 ... Heater, 9 ... Vacuum chamber, 10 ... Pressure control mechanism, 11 ... Vacuum pump, 12 ... Head, 13 ... Head drive mechanism, 14 ... Elastic body, 15 ... Cavity component pressing member, 16 ... Valve, 17 ... Set component, 18 ... Projection, 19 ... Gap, DESCRIPTION OF SYMBOLS 20 ... Fan, 21 ... Sealing elastic body, 23 ... Heating elastic body, 24 ... Attachment inner surface upper wall, 25 ... Head.

Claims (11)

An attachment for heating and joining a cavity part and a base part in a vacuum chamber capable of introducing a cooling gas,
A heater for heating at least one of the cavity part and the base part;
A holder for holding the base part;
A pressing member that includes an elastic body that is elastically deformed by being pressed, and that presses the cavity part and the base part or the holder via the elastic body;
The attachment characterized by having. The elastic body is provided at a contact portion of the pressing member with the base component,
A space having airtightness is formed by the elastic body, the pressing member, and the base part by elastically deforming the elastic body by contacting and pressing the base part. Item 1. The attachment according to item 1.   The elastic body is a heating elastic body provided at a contact portion of the pressing member with the cavity part and a sealing elastic body provided at a contact portion of the pressing member with the holder. The attachment according to claim 1, characterized in that:   The attachment according to claim 2, wherein a material of the elastic body is a polyimide resin or a polyimide amide resin. The material for the heating elastic body is a polyimide resin or a polyimide amide resin,
The attachment according to claim 3, wherein a material of the sealing elastic body is any one of a polyimide resin, a polyamide resin, a fluorine rubber, and a silicon rubber.   The attachment according to claim 2, wherein the elastic body has a thickness of 1 μm to 20 μm.   The attachment according to claim 3, wherein the heating elastic body has a thickness of 1 μm to 20 μm.   The attachment according to claim 3, wherein the sealing elastic body is thicker than the heating elastic body. The material of the pressing member, the attachment according to claim 1, wherein AlN, SiC, and _Si 3 that _N is any one of the _four. The attachment of claim 1;
A vacuum chamber that can be set to a desired vacuum pressure atmosphere;
A head driving mechanism for driving the pressing member;
A valve for introducing a cooling gas into the vacuum chamber at a predetermined flow rate and pressure;
A vacuum bonding apparatus comprising:   The vacuum bonding apparatus according to claim 10, further comprising stirring means for stirring the cooling gas in the vacuum chamber.

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