JP2007242805A - Vacuum bonding equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide vacuum bonding equipment which can cool a component generated by bonding substrates efficiently in a short time when bonding the substrates in an overlapped state by applying heat in a vacuum environment. <P>SOLUTION: The vacuum bonding equipment bonds an upper substrate 9 and a base substrate 4 by applying heat in a vacuum environment. The vacuum bonding equipment is equipped with a contact member 19 which can be abutted against a side face of a component consisting of the bonded upper substrate 9 and base substrate 4, and can cool the abutting face; a pushing linear motion mechanism 15 which pushes the contact member 19 against the side face with a predetermined force; and a cooler 18 for cooling the contact member 19. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a vacuum bonding apparatus used in, for example, semiconductor manufacturing, and more particularly to a vacuum bonding apparatus that bonds an upper substrate and a base substrate by applying heat and a load in a vacuum atmosphere.

  In recent years, by adding a member having an optical function such as a lens or a mirror to a semiconductor chip or a semiconductor substrate mounted on an optical product such as an optical communication device or a microscope, the number of parts used can be reduced. Development of devices aiming at miniaturization and high functionality has been actively conducted. Many of these devices are required to join semiconductor components in a vacuum atmosphere in order to effectively exhibit their functions and to ensure reliability.

  In a vacuum atmosphere, for example, when there is a process that requires heating to join parts together to form a predetermined member, heat radiation due to convection cannot be expected when cooling the heated member. Occurs. Therefore, as compared with the case in an air atmosphere, the cooling time of the member is inevitably increased, resulting in a problem that the production efficiency is lowered. In view of such circumstances, a vacuum bonding apparatus capable of forcibly cooling a member formed by heating in order to bond components in a vacuum atmosphere has been developed. A vacuum hot press apparatus capable of forcibly cooling later components is disclosed.

  Hereinafter, the characteristic part of the vacuum hot press apparatus described in Patent Document 1 will be described with reference to FIG.

  This vacuum hot press apparatus is an apparatus that presses and presses the two stacked samples 100 together by heating them with the upper heater 114 and the lower heater 121 through the spacers 110 under a vacuum atmosphere.

Here, the vacuum hot press apparatus is provided with a pipe-shaped water channel 141 for cooling water close to the upper heater 114 and the lower heater 121. This point is a characteristic part of the vacuum hot press apparatus. That is, according to the vacuum hot press apparatus described in Patent Document 1, the upper heater 114 and the lower heater 121 are cooled by the cooling water flowing through the pipe-shaped water channel 141, so the upper heater 114 and the lower heater It is possible to cool the sample 100 sandwiched between 121 through the upper heater 114 and the lower heater 121. In the vacuum hot press apparatus described in Patent Document 1, the cooling time of the sample 100 in a vacuum atmosphere is shortened as described above.
JP-A-6-151265

  However, in the vacuum hot press apparatus described in Patent Document 1, the pipe-shaped water channel 141 for the cooling water is provided in the vicinity of the upper heater 114 and the lower heater 121, so that the cooling water The upper heater 114 and the lower heater 121 are cooled first. The sample 100 is cooled through the cooled upper heater 114 and lower heater 121. In other words, the sample 100 cannot be cooled until the upper heater 114 and the lower heater 121 are cooled.

  Further, in the vacuum hot press apparatus which is a kind of vacuum bonding apparatus disclosed in Patent Document 1, in order to cool the sample 100, it is necessary to simultaneously cool the upper heater 114 and the lower heater 121 having a large heat capacity. There arises a problem that it takes time to cool the sample 100.

  In other words, according to the vacuum hot press apparatus described in Patent Document 1, the sample 100 can be surely cooled, but the time required for the cooling cannot be sufficiently shortened. Therefore, it is difficult to shorten the production tact of the product, resulting in a problem that the product cost cannot be reduced.

  The present invention has been made in view of the above circumstances, and when joining the substrates by applying heat in a vacuum atmosphere, for example, in a state where the substrates are superposed, the components generated by the bonding are An object of the present invention is to provide a vacuum bonding apparatus capable of performing efficient cooling in a short time.

  In order to achieve the above object, a vacuum bonding apparatus according to the first aspect of the present invention is a vacuum bonding apparatus that heats and bonds an upper substrate and a base substrate in a vacuum atmosphere. A contact member that is capable of abutting on a side surface portion of a member made of the base substrate and that cools the contact surface, a pressing mechanism that presses the contact member against the side surface portion with a predetermined force, and cooling the contact member. And a cooler.

  The present invention provides a vacuum bonding capable of efficiently cooling components generated by the bonding in a short time when the substrates are bonded together by applying heat in a state where the substrates are stacked in a vacuum atmosphere. An apparatus can be provided.

Hereinafter, embodiments of the vacuum bonding apparatus of the present invention will be described with reference to the drawings.
[First embodiment]
The configuration of the vacuum bonding apparatus according to the first embodiment of the present invention will be described below with reference to FIG. In addition, the thick line which connects each structural member in the same figure has shown the electric signal wire | line. Moreover, the dashed-two dotted line in the figure has shown the cooling water channel which is a water channel of cooling water.

  First, on the base 1, a vacuum chamber 2 capable of maintaining the inside thereof at a predetermined degree of vacuum is installed. The vacuum chamber 2 is provided with a vacuum pump 3, which can be evacuated from the inside of the vacuum chamber 2.

  In addition, a lower heater 5 capable of holding a base substrate 4 which is a semiconductor component by a chuck (for example, a gripping mechanism using a plate spring or an electrostatic chuck) is provided inside the vacuum chamber 2. The lower heater 5 can heat the base substrate 4 at a predetermined temperature for a predetermined time.

  The lower heater 5 is installed in close contact with a lower heater cooling member 7 in which a cooling water channel is provided. That is, the lower heater 5 can be cooled by the lower heater cooling member 7. The lower heater 5 and the lower heater cooling member 7 are installed on an XYθαβ stage 8. That is, the base substrate 4 held on the lower heater 5 can be positioned at an arbitrary position by the XYθαβ stage 8.

  Meanwhile, an upper heater 10 capable of holding an upper substrate 9 as a semiconductor component by a chuck (for example, a gripping mechanism using a leaf spring or an electrostatic chuck) is installed at a position facing the base substrate 4. The upper heater 10 is installed in close contact with an upper heater cooling member 11 having a cooling water channel provided therein. That is, the upper heater 10 can be cooled by the upper heater cooling member 11.

  Further, a shaft 12 is connected to the upper heater cooling member 11. And this shaft 12 is installed so that the upper surface wall of the said vacuum chamber 2 may be penetrated, without impairing a predetermined vacuum degree with the sealing material which is not shown in figure. Thereby, the shaft 12 is movable in the joining direction (vertical direction) between the base substrate 4 and the upper substrate 9.

  The shaft 12 preferably has a square cross-sectional shape and has a detent function. When the shaft has a round cross section, it is desirable to use two shafts or to add a rotation preventing function with pins or the like. The shaft 12 is connected to an actuator 13 installed outside the vacuum chamber 2. Thereby, the shaft 12 can be moved in the vertical direction by the actuator 13 at a predetermined speed and thrust. That is, when the shaft 12 is moved in the vertical direction by the actuator 13, the upper heater 10 is positioned at a predetermined height.

  Hereinafter, a characteristic configuration of the vacuum bonding apparatus according to the present embodiment will be described.

  First, in the vacuum chamber 2, as shown in FIG. 1, at least one cooling base 14 provided with a cooling water channel is provided in the vicinity of the side surface of the base substrate 4 (two in this embodiment). is set up. A contact member 19 as a cooling member is integrally provided on a surface of the outer surface of the cooling base 14 that faces the base substrate 4 and the upper substrate 9 (details will be described later). As a material of the contact member 19, a metal or ceramic having high thermal conductivity is suitable. Examples of the metal having high thermal conductivity include stainless steel, aluminum alloy, brass alloy, and copper alloy. Examples of ceramics include aluminum nitride and silicon carbide.

  Further, the surface of the outer surface of the contact member 19 that comes into contact with the base substrate 4 and the upper substrate 9 is subjected to flattening processing such as mirror finishing by polishing. In addition, by this planarization process, the roughness of the surface which contacts the said base substrate 4 and the said upper board | substrate 9 among the outer surfaces of the said contact member 19 may be set to average roughness Ra <= 1.6 [micrometers]. preferable.

  The contact member 19 is installed in view of the absence of a medium for heat transfer under vacuum conditions. That is, under vacuum conditions, it is important to improve the adhesion between the member to be cooled and the member for cooling, and the purpose of installing the contact member 19 is also there.

  By the way, the cooling base 14 is installed on the pressing linear motion mechanism 15. The pressing base 15 allows the cooling base 14 to move in a direction (namely, horizontal direction) orthogonal to the joining direction (namely, vertical direction). Hereinafter, the base substrate 4 and the upper substrate 9 after being bonded are referred to as bonding members, and the side surfaces thereof are referred to as bonding side surfaces.

  And by making the said cooling base 14 advance toward a joining member by the said press linear motion mechanism 15 (it is made to move to the direction which contacts the said joining side part), after this contact with a predetermined pressing force The contact member 19 can be brought into contact with the joint side surface portion. On the contrary, the contact member 19 can be separated from the joint side surface portion by moving the cooling base 14 backward by the pressing linear motion mechanism 15 (moving in the direction away from the joint side surface portion).

  By the way, the cooling water channel is a manifold installed outside the vacuum chamber 2 by a pipe indicated by a two-dot chain line in FIG. Member 16) and an introduction terminal (not shown). Further, a cooler 18 is similarly connected to the manifold 16 by piping. The manifold 16 and the cooler 18 are electrically connected to a controller 17, and the controller 17 allows the lower heater cooling member 7, the upper heater cooling member 11, and the cooling base at a desired timing. The cooling water can be circulated with respect to 14 at a desired temperature, water pressure and flow rate.

  The lower heater 5 and the upper heater 10 are also electrically connected to the controller 17. That is, the temperature of the lower heater 5 and the upper heater 10 can be adjusted to a predetermined temperature under the control of the controller 17.

  Further, the vacuum pump 3, the XYθαβ stage 8, the actuator 13, and the pressing linear motion mechanism 15 are also electrically connected to the controller 17. That is, the vacuum pump 3, the XYθαβ stage 8, the actuator 13, and the pressing linear motion mechanism 15 are driven and controlled by a control signal from the controller 17.

  The joint surface between the base substrate 4 and the upper substrate 9 is plated with gold, for example. In other words, the base substrate 4 and the upper substrate 9 can be bonded by gold-gold diffusion bonding in this example.

  Hereinafter, a component bonding process in the vacuum bonding apparatus according to the present embodiment will be described with reference to a flowchart shown in FIG. Each step shown in the flowchart is appropriately controlled by each unit via the controller 17. Of course, a step that can be processed by a human may be a step in which a human performs the processing.

  First, a gate (not shown) provided in the vacuum chamber 2 is opened, the upper substrate 9 and the base substrate 4 are carried into the vacuum chamber 2 through the gate, and a chuck (not shown) of the upper heater 10 is loaded. The upper substrate 9 is held by the above, and the base substrate 4 is held by a chuck (not shown) of the lower heater 5 (step S1). In step S1, the base substrate 4 and the upper substrate 9 are held so as to face each other.

  Subsequently, if necessary, a relative positional relationship between the upper substrate 9 and the base substrate 4 is measured using a positioning camera (not shown), and the upper substrate 9 and the base substrate 4 are measured. Is driven to determine the position of the base substrate 4 (step S2). That is, this step S2 is a step in which the upper substrate 9 and the base substrate 4 are relatively positioned.

  Then, the gate (not shown) is closed so that the vacuum chamber 2 is hermetically sealed, and the vacuum pump 3 is operated to evacuate the interior of the vacuum chamber 2 to a predetermined degree of vacuum (step S3). .

  Thereafter, the base substrate 4 and the upper substrate 9 are joined (step S4). In this step S4, first, the actuator 13 is driven to apply a predetermined load to the upper substrate 9 in a state where the upper substrate 9 is lowered to a predetermined height in contact with the base substrate 4. Simultaneously with this load, the upper substrate 9 and the base substrate 4 are heated at a predetermined temperature for a predetermined time by the upper heater 10 and the lower heater 5. Through the above steps, the gold plating on the bonding surface between the upper substrate 9 and the base substrate 4 is diffusion bonded, so that the upper substrate 9 and the base substrate 4 are bonded to form a bonding member.

  After the joining process in step S4, the heating by the upper heater 10 and the lower heater 5 is stopped and the operation of the cooler 18 is started to cool the joining member (step S5). The cooling process in step S5 is roughly performed by two types of cooling methods.

  The following method is adopted as the first cooling method. That is, the operation of the cooler 18 is started so that the cooling water circulates in the cooling water passages in the upper heater cooling member 11 and the lower heater cooling member 7, and the cooling water pressure and flow rate by the valve of the manifold 16 are started. Control. Thereby, the upper heater cooling member 11 and the lower heater cooling member 7 are cooled by the cooling water, and the upper heater 10 and the lower heater that are in contact with the upper heater cooling member 11 and the lower heater cooling member 7 respectively. 5 is cooled. Along with these coolings, the upper substrate 9 and the base substrate 4 in the bonding member are also cooled.

  In addition, the following method is adopted as a second cooling method that is a cooling method that is executed simultaneously with the first cooling method in principle and that is characteristic of the vacuum bonding apparatus according to the present embodiment. First, the water pressure and flow rate of the cooling water are controlled by the valves of the manifold 16 so that the cooling water circulates through the cooling water passage in the cooling base 14. Next, the cooling base 14 is advanced by the pressing linear motion mechanism 15 (by moving in the direction in contact with the bonding side surface portion), so that the contact member 19 is moved to the bonding side surface portion of the bonding member. Further, after the contact, the contact member 19 is brought into contact with the joint side surface portion with a predetermined pressing force. More specifically, in order to ensure that the contact member 19 abuts against the joining side surface portion of the joining member, the action lines of the forces applied by the pressing linear motion mechanism 15 to the cooling base 14 face each other. The contact member 19 is brought into contact with the joint side surface portion from two directions.

  Here, since the contact member 19 is provided integrally with the cooling base 14, the contact member 19 is cooled by the cooling water circulating in the cooling water passage built in the cooling base 14. Therefore, the upper substrate 9 and the base substrate 4 in the joining member can be cooled by the contact member 19.

  In addition, the contact member 19 is subjected to a flattening process on the contact surface with the joint side surface portion. Thereby, the contact member 19 can be in close contact with the joint side surface portion. And the adhesiveness of the said contact member 19 and the said joining side part improves the efficiency which cools the said upper board | substrate 9 and the said base board | substrate 4. FIG.

  In the present embodiment, as described above, the first cooling method and the second cooling method are simultaneously executed in principle, but one of the cooling methods is started first. Of course, cooling may be performed.

  After finishing the cooling process in step S5, the joining member is released (step S6). In this step S6, specifically, the pressing linear motion mechanism 15 is driven to retract the cooling base 14 and the contact member 19 (move away from the joint side surface), and the cooler 18 Is stopped and the valve of the manifold 16 is controlled to stop the circulation of the cooling water. Then, the holding of the upper substrate 9 by the chuck of the upper heater 10 is released, and then the actuator 13 is driven to retract the upper heater 10 upward.

  After the release of the joining member by the upper heater 10 in step S6, the joining member is collected (step S7). In this step S7, first, the holding of the base substrate 4 by the chuck of the lower heater 5 is released, then a leak valve (not shown) of the vacuum chamber 2 is opened, and the vacuum chamber 2 is opened to the atmosphere. Then, the gate (not shown) provided in the vacuum chamber 2 is opened to release the holding of the base substrate 4 by the chuck of the lower heater 5 in the bonding member, and the bonding member is discharged to the outside of the vacuum chamber 2. To do.

  The joining process by the vacuum joining apparatus according to the present embodiment is completed through the above steps.

  As described above, according to the present embodiment, when the semiconductor substrates are bonded together by applying heat in a state where the semiconductor substrates are stacked in a vacuum atmosphere, the members generated by the bonding are shortened. A vacuum bonding apparatus capable of performing efficient cooling in time can be provided.

  Specifically, according to the vacuum bonding apparatus according to the present embodiment, the upper heater cooling member 11 and the lower heater cooling member 7 pass the upper heater 10 and the lower heater 5 after heating is stopped. In addition to the conventional cooling method of cooling the upper substrate 9 and the base substrate 4, the apparatus configuration unique to the present embodiment, that is, the pressing linear motion mechanism 15 (the cooling base 14 and the above). The contact member 19 is brought into contact with the joining side surface portion of the joining member, and the contact member 19 enables the upper substrate 9 and the base substrate 4 of the joining member to be directly cooled from the joining side surface portion. Thereby, the said upper board | substrate 9 and the said base board | substrate 4 in a joining member can be cooled very efficiently. Further, with such an effect, the manufacturing tact of the product can be shortened, and the product can be provided at low cost.

[Modification]
Next, a modification of the vacuum bonding apparatus according to this embodiment will be described with reference to FIGS. Here, FIGS. 3A and 3B are cross-sectional views of the vacuum bonding apparatus. Accordingly, FIGS. 3A and 3B show a space that exists between the upper substrate 9 and the berth substrate 4.

  The feature of this modification is that the contact member 19 is brought into contact with the four joint side surfaces of the joint member from two opposing directions.

  In this case, the positional relationship between the bonding side surface of the bonding member and the contact member 19 is as shown in FIGS. 3 (1) and 3 (2). Here, FIG. 3A is a diagram showing a positional relationship between the bonding side surface portion and the contact member 19 at the time of the heating in the component bonding step (step S4). That is, in the present modification, the contact member 19, the cooling base 14, and the pressing member can be brought into contact with each other from the two opposing directions with respect to the joint side surface portion. A linear motion mechanism 15 is disposed and provided. FIG. 3B is a diagram showing the positional relationship between the joining side surface portion and the contact member 19 at the time of cooling (the step S5) in the component joining step. In other words, in the present modification, the contact member 19 can cool the entire joining side surface 4 of the joining member.

  As described above, according to this modification, it is possible to provide a vacuum bonding apparatus that can further increase the cooling efficiency in step S5 as compared with the vacuum bonding apparatus according to the first embodiment.

[Second Embodiment]
Next, a vacuum bonding apparatus according to the second embodiment of the present invention will be described. Note that the difference between the vacuum bonding apparatus according to the first embodiment and the first embodiment of the vacuum bonding apparatus according to the present embodiment is only the contact member 19. That is, in the vacuum bonding apparatus according to the present embodiment, a resin having heat resistance and elasticity is used as the material of the contact member 19 in the first embodiment. And as said resin which has the heat resistance and elasticity, it is preferable to use polyimide-type resin, such as a polyimide resin and a polyimide amide resin, for example. As described above, by using a resin having heat resistance and elasticity as the material of the contact member 19, the contact member 19 can be brought into close contact with the joint side surface portion.

  As described above, according to the present embodiment, in addition to the same effects as the vacuum bonding apparatus according to the first embodiment, it is possible to provide a vacuum bonding apparatus that has the following effects. That is, according to the vacuum bonding apparatus according to the present embodiment, since the contact member 19 is an elastic member, when the pressing linear movement mechanism 15 is brought into contact with the bonding side surface portion with a predetermined pressing force, the bonding member Deforms according to the shape of the side part. Thereby, the adhesion degree of the said joining side part and the said contact member 19 becomes large compared with the vacuum joining apparatus which concerns on the said 1st Embodiment, and can improve the cooling efficiency in said step S5 more.

  It should be noted that the importance of the present embodiment increases when flatness cannot be expected with respect to the side surface shape of the upper substrate 9 and the base substrate 4, that is, the shape of the bonded side surface portion.

  As mentioned above, although this invention was demonstrated based on 1st Embodiment and 2nd Embodiment, this invention is not limited to embodiment mentioned above, A various deformation | transformation and application are within the range of the summary of this invention. Of course it is possible.

  For example, even if the device configuration other than the above-described cooling mechanism specific to the present invention is a device configuration other than the device configuration shown in FIG. 1, the same effect as the effect specific to the present invention can be obtained.

  The above-described embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the effect described in the column of the effect of the invention Can be extracted as an invention.

The figure which shows the structure of the vacuum bonding apparatus which concerns on 1st Embodiment of this invention. The flowchart which shows the component joining process in the vacuum bonding apparatus which concerns on 1st Embodiment of this invention. The figure which shows the modification of the vacuum bonding apparatus which concerns on 1st Embodiment of this invention. The figure which shows the structure of the vacuum hot press apparatus of patent document 1. FIG.

Explanation of symbols

    DESCRIPTION OF SYMBOLS 1 ... Base, 2 ... Vacuum chamber, 3 ... Vacuum pump, 4 ... Base substrate, 5 ... Lower heater, 6 ... Cooling water channel, 7 ... Lower heater cooling member, 8 ... XYθαβ stage, 9 ... Upper substrate, 10 ... Upper heater 11 ... Upper heater cooling member, 12 ... Shaft, 13 ... Actuator, 14 ... Cooling base, 15 ... Pressing linear motion mechanism, 16 ... Manifold, 17 ... Controller, 18 ... Cooler, 19 ... Contact member.

Claims (7)

In a vacuum bonding apparatus that heats and bonds an upper substrate and a base substrate in a vacuum atmosphere,
A contact member capable of abutting on a side surface portion of a member composed of the joined upper substrate and the base substrate and cooling the corresponding contact surface;
A pressing mechanism for pressing the contact member against the side surface portion with a predetermined force;
A cooler for cooling the contact member;
A vacuum bonding apparatus comprising: The vacuum bonding apparatus is
A cooling water channel through which cooling water for cooling the contact member circulates;
A cooling base provided with a part of the cooling water channel and in close contact with the contact member;
Further comprising
The vacuum bonding apparatus according to claim 1, wherein the cooler performs heat exchange of the cooling water.   The vacuum bonding apparatus according to claim 1, wherein the material of the contact member includes at least one of stainless steel, aluminum alloy, brass alloy, aluminum nitride, and silicon carbide.   The vacuum according to claim 3, wherein the outer surface of the contact member that comes into contact with a side surface portion of the member composed of the bonded upper substrate and the base substrate is subjected to a flattening process. Joining device.   The vacuum bonding apparatus according to claim 1, wherein a material of the contact member is a resin having heat resistance and elasticity.   The vacuum bonding apparatus according to claim 1, wherein the resin having heat resistance and elasticity is a polyimide resin. The vacuum bonding apparatus is
An upper heater for holding the upper substrate and a lower heater for holding the base substrate;
A heater cooling member for cooling at least one of the upper heater and the lower heater;
The vacuum bonding apparatus according to claim 1, further comprising:

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