JP2007308690A - Epoxy resin composition, package for electronic component device, and electronic component device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in moldability such as flowability, little occurrence of resin burr, etc., and in reliability on moisture resistance, etc., and to provide a package for an electronic component device, as well as an electronic component device. <P>SOLUTION: The epoxy resin composition contains (A) an epoxy resin, (B) a curing agent, and (C) an inorganic moisture absorbent which comprises an inorganic moisture absorbent (C1) whose average particle diameter is at least 15 μm and not more than 70 μm. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an epoxy resin composition excellent in reliability such as fluidity, moldability such as resin burrs, moisture resistance, and the like, a package for an electronic component device molded using the same, and an electronic component device.

  Semiconductor elements such as transistors, ICs, and LSIs may be damaged by moisture or fine dust in the atmosphere, so they are conventionally used after being hermetically sealed with ceramic or resin sealed. However, in recent years, sealing using a resin has become the mainstream in terms of productivity and cost, and in particular, a sealing resin composition based on an epoxy resin has been widely used. . Epoxy resins have an excellent balance in various properties such as electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesion to inserts among various resins.

  Solid-state image sensors such as CCDs and MOSs that require strict light transmission levels are also seeing a trend toward resin sealing. From conventional hermetic sealing with ceramics, hollow plastic packages are molded with epoxy resin, etc. A method of hermetically sealing the container after it has been accommodated has been spreading.

  Among the characteristics required for solid-state image sensor mounted packages such as CCD and MOS, preventing moisture from entering into the hollow package and preventing condensation inside the package, that is, the moisture resistance of the package is normal for the package. This is one of the most important characteristics for ensuring proper operation.

As a technique for improving package moisture resistance such as CCD and MOS, a technique of adding a specific amount of an inorganic hygroscopic agent such as silica gel or zeolite to a resin composition (for example, Patent Document 1), a zeolite having a specific property as a resin composition A method of adding to a product (for example, Patent Document 2), a method of adding silica having a specific property to an epoxy resin composition (for example, Patent Documents 3 and 4), an epoxy resin having a specific structure and a specific structure There is a report of a technique (for example, Patent Document 5) of adding an inorganic moisture absorbent to a resin composition comprising a phenolic curing agent.
Japanese Patent No. 2750254 Japanese Patent No. 3410173 Japanese Patent No. 2846551 Japanese Patent No. 3119104 Japanese Patent No. 3022135

  However, inorganic hygroscopic agents with high moisture absorption performance often have a relatively small average particle size and large specific surface area, and if they are added in a large amount to obtain sufficient moisture resistance, fluidity and resin burr properties It tends to cause deterioration of moldability such as curability. Therefore, if the addition of the inorganic moisture absorbent is made small in order to avoid the deterioration of the moldability, it becomes difficult to ensure the moisture resistance. The above method does not necessarily solve this dilemma.

  The present invention has been made in view of such circumstances, and realizes reduction of resin burrs while ensuring good fluidity, and is excellent in moldability such as curability and reliability such as moisture resistance. And an electronic component device package molded thereby, and an electronic component device.

  As a result of intensive studies to solve the above-mentioned problems, the present inventors can achieve the intended purpose by adding an inorganic moisture absorbent having a specific average particle diameter to the epoxy resin composition. As a result, the present invention has been completed.

  The present invention is an epoxy resin composition containing (1) (A) an epoxy resin, (B) a curing agent and (C) an inorganic moisture absorbent, wherein (C) the inorganic moisture absorbent has an average particle size of at least 15 μm. The present invention relates to an epoxy resin composition comprising an inorganic moisture absorbent (C1) of 70 μm or less.

Further, the present invention is, (2) BET specific surface area of the inorganic hygroscopic agent (C1) is an epoxy resin composition according to (1), characterized in that ^{20 m} 2 / g or more 100m ² / g or less Related to things.

  Further, the present invention is as described in (1) or (2) above, wherein (3) the blending amount of the inorganic moisture absorbent (C) exceeds 50% by mass of the entire epoxy resin composition. It relates to an epoxy resin composition.

  Moreover, this invention is (1)-(3) characterized by the compounding quantity of the said inorganic type moisture absorbent (C1) component being 1 mass% or more and 50 mass% or less of the whole epoxy resin composition. ). The epoxy resin composition as described in any one of 1).

  Moreover, this invention relates to the package for electronic component apparatuses shape | molded by the epoxy resin composition as described in any one of (5) said (1)-(4).

  Moreover, this invention relates to the electronic component apparatus shape | molded by the epoxy resin composition as described in any one of (6) said (1)-(4).

  The epoxy resin composition according to the present invention realizes reduction of resin burrs while ensuring good fluidity, and is excellent in moldability such as curability and reliability such as moisture resistance. Therefore, by producing a package using such a resin composition, it is possible to give high reliability to an electronic component device mounted with a solid-state imaging device such as a CCD or MOS, for example, and its industrial value is high. .

  Details of the present invention will be described below.

  The epoxy resin composition according to the present invention is an epoxy resin composition containing (A) an epoxy resin, (B) a curing agent and (C) an inorganic moisture absorbent, and (C) the inorganic moisture absorbent is at least an average particle. An inorganic moisture absorbent (C1) having a diameter of 15 μm to 70 μm is included. In addition to the components (A) to (C), the epoxy resin composition according to the present invention contains various additives such as inorganic fillers, curing accelerators, mold release agents, coupling agents, and flame retardants as necessary. May be included. Hereinafter, various components constituting the epoxy resin composition according to the present invention will be described in detail.

(A) Epoxy resin In this invention, the epoxy resin generally used for the epoxy resin composition for sealing can be used individually or in combination. Examples of such an epoxy resin include phenols such as phenol novolac type epoxy resins, orthocresol novolac type epoxy resins, cresols, xylenol, resorcin, catechol, bisphenol A, bisphenol F and other phenols and / or α-naphthol, Epoxidized novolak resin obtained by condensation or cocondensation of naphthols such as β-naphthol and dihydroxynaphthalene with compounds having aldehyde groups such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, salicylaldehyde in the presence of an acidic catalyst , Diglycidyl ethers such as bisphenol A, bisphenol F, bisphenol S, bisphenol A / D, diglycidyl of alkyl-substituted or unsubstituted biphenol Epoxy compounds such as phenol / aralkyl resins, naphthol / aralkyl resins, biphenyl / aralkyl resins synthesized from biphenyl type epoxy resins, which are sidyl ethers, and phenols and / or naphthols and dimethoxyparaxylene or bis (methoxymethyl) biphenyl. , Stilbene type epoxy resin, hydroquinone type epoxy resin, glycidyl ester type epoxy resin obtained by reaction of polybasic acid such as phthalic acid and dimer acid and epichlorohydrin, and reaction by polyamine such as diaminodiphenylmethane, isocyanuric acid and epichlorohydrin Glycidylamine-type epoxy resin, dicyclopentadiene-type epoxy resin that is an epoxidized product of co-condensation resin of cyclopentadiene and phenols, and naphthalene ring Epoxy resin, triphenylmethane type epoxy resin, trimethylolpropane type epoxy resin, terpene modified epoxy resin, epoxy resin containing sulfur atom, linear aliphatic epoxy obtained by oxidizing olefin bond with peracid such as peracetic acid Examples thereof include resins, alicyclic epoxy resins, and epoxy resins obtained by modifying these epoxy resins with silicone, acrylonitrile, butadiene, isoprene rubber, polyamide resin, or the like.

  Among the above epoxy resins, from the viewpoint of ensuring good fluidity, it is preferable to use an epoxy resin having an ICI viscosity at 180 ° C. of 0.2 Pa · s or less alone or in combination, and 0.1 Pa · s. The following epoxy resins are more preferably used alone or in combination. As an example of such an epoxy resin, for example, Epicoat YX-4000H (trade name of Japan Epoxy Resin Co., Ltd., ICI viscosity 0.01 Pa · s at 180 ° C.) which is a biphenyl type epoxy resin, YSLV- which is a bisphenol F type epoxy resin 80XY (trade name of Toto Kasei Co., Ltd., ICI viscosity at 180 ° C. 0.01 Pa · s), EPICLON HP-7200, a dicyclopentadiene type epoxy resin (trade name, manufactured by Dainippon Ink & Chemicals, Inc., ICI viscosity at 180 ° C. 0.05 Pa · s), YSLV-120TE (trade name of Toto Kasei Co., Ltd., ICI viscosity 0.01 Pa · s at 180 ° C.) which is a sulfur atom-containing epoxy resin, glycidyl etherified product of biphenyl aralkyl type epoxy and biphenol blend There CER-3000-L, etc. (manufactured by Nippon Kayaku Co., Ltd. trade name, ICI viscosity 0.03 Pa · s at 180 ° C.), can be cited as examples of available epoxy resins in the market. Here, “ICI viscosity” means a value measured with an ICI cone plate rotational viscometer.

(B) Hardener In this invention, the hardener generally used for the epoxy resin composition for sealing can be used individually or in combination. Examples of the curing agent (B) include phenols such as phenol, cresol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol, and aminophenol and / or naphthol such as α-naphthol, β-naphthol, and dihydroxynaphthalene. Novolak-type phenol resins, phenols and / or naphthols and dimethoxyparaxylene or bis (methoxymethyl) obtained by condensation or cocondensation of aldehydes with compounds having an aldehyde group such as formaldehyde, benzaldehyde, salicylaldehyde, etc. under an acidic catalyst ) Phenol-aralkyl resins synthesized from biphenyl, aralkyl-type phenol resins such as naphthol-aralkyl resins, biphenyl-aralkyl resins, dicyclopentadiene-type phenol trees Examples thereof include phenolic curing agents such as fat, terpene-modified phenolic resin, and triphenylmethane type phenolic resin.

  In the present invention, an acid anhydride curing agent, an amine curing agent, or the like may be used in addition to the phenol curing agent.

  The equivalent ratio of (A) epoxy resin to (B) curing agent (that is, the ratio of the number of epoxy groups in the epoxy resin / the number of phenolic hydroxyl groups, hydroxyl groups, amino groups, etc. in the curing agent) is particularly limited. It is not a thing. However, the equivalent ratio is preferably in the range of 0.5 / 1 to 2/1, more preferably in order to prevent the respective components from reacting excessively and insufficiently and remaining unreacted in the composition. The range is 0.6 / 1 to 1.5 / 1.

(C) Inorganic hygroscopic agent In the present invention, it is necessary to blend (C) an inorganic hygroscopic agent in order to achieve good moisture resistance reliability, and molding such as good fluidity and reduction of resin burrs. From the viewpoint of properties, it is important that (C) the inorganic moisture absorbent contains an inorganic moisture absorbent (C1) having an average particle size of 15 μm or more and 70 μm or less. The average particle diameter of the inorganic moisture absorbent (C1) is preferably 20 μm or more and 60 μm or less, and more preferably 25 μm or more and 50 μm or less. When the average particle size of the inorganic moisture absorbent (C1) is less than 15 μm, the moldability is insufficient, and when it exceeds 70 μm, the moldability and moisture resistance are insufficient, thereby achieving the object of the present invention. I can't.

(C) Although the shape of an inorganic type hygroscopic agent is not specifically limited, From the viewpoint of fluidity, a spherical shape or a shape close to a spherical shape is preferable.
The inorganic hygroscopic agent of the present invention is a compound having a single water absorption of 0.5% or more at 20 ° C. and a humidity of 50%, or a mixture thereof. (1) Chemically, silicon, Oxides (mixtures of metal oxides) of a plurality of metal elements typified by elements such as aluminum, sodium and calcium, (2) compounds corresponding to at least one of specific surface areas of 10 m ² / g or more, or a mixture thereof Is preferably used. In addition, the inorganic hygroscopic agent of the present invention has a pleated surface as compared with a normal inorganic filler when observed with, for example, a scanning electron microscope, and clearly has a large specific surface area. From the observation of the shape, it can be distinguished from the inorganic filler.

  Examples of the inorganic moisture absorbent (C1) include silica gel, zeolite, amorphous aluminosilicate having an average particle diameter of 15 μm or more and 70 μm or less. For example, an average particle diameter of 40 μm using coal ash as a raw material. A certain degree of zeolite (trade name “Cyculus” manufactured by Chubu Electric Power Co., Inc.) is available on the market.

In the present invention, the BET specific surface area of the inorganic moisture absorbent (C1) is 20 m ² / g or more and 100 m ² / g or less from the viewpoint of balance between reliability such as moisture resistance reliability and moldability. It is preferably 25 m ² / g or more and 80 m ² / g or less, and particularly preferably 30 m ² / g or more and 60 m ² / g or less. When the BET specific surface area is less than 20 m ² / g, the moisture resistance reliability may be insufficient, and when it exceeds 100 m ² / g, the moldability may be insufficient.

Moreover, when using zeolite, an amorphous aluminosilicate, etc. as said inorganic type hygroscopic agent (C1), it is preferable that the extract liquid electrical conductivity is 2 * 10 ^<-2 > S / m or less. When the electrical conductivity of the extract exceeds 2 × 10 ⁻² S / m, there is a possibility that ionic impurities increase to cause problems such as curability.

  In the present invention, the inorganic hygroscopic agent (C1) may be used alone or in combination with other inorganic hygroscopic agents, but the inorganic hygroscopic agent (C1) is used alone. It is preferable that the compounding quantity shall be 1 to 50 mass% of the whole epoxy resin composition. When the blending amount of the inorganic moisture absorbent (C1) is less than 1% by mass, the moisture resistance reliability may be insufficient, and when it exceeds 50% by mass, moldability such as fluidity and curability is obtained. It may be insufficient. From the viewpoint of the balance of these characteristics, the blending amount of the inorganic moisture absorbent (C1) is more preferably 3% by mass or more and 45% by mass or less of the whole epoxy resin composition, and 5% by mass or more and 40% by mass or less. It is particularly preferable to do this.

In particular, from the viewpoint of reducing resin burrs, it is more preferable to use the inorganic moisture absorbent (C1) in combination with another inorganic moisture absorbent. In this case, the inorganic hygroscopic agent used in combination with the inorganic hygroscopic agent (C1) may be one type or two or more types. Although the following illustrations are possible as a combination example, it is not restricted to this illustration. For example, an inorganic moisture absorbent (C1) and other inorganic moisture absorbent (C2) having an average particle diameter of 1 to 5 μm and a specific surface area of 200 to 1000 m ² / g, an average particle diameter of 5 to 15 μm and a specific surface area Is a case of using together with other inorganic moisture absorbent (C3) having a 10 to 30 m ² / g. In this case, although the compounding quantity of each component is selected suitably, with respect to the whole inorganic moisture absorbent (C), ie, the total mass of (C1), (C2), and (C3), other inorganic moisture absorbent (C2 ) Is preferably 3 to 10% by mass, the other inorganic moisture absorbent (C3) is 10 to 80% by mass, and the remainder is inorganic moisture absorbent (C1).

The same chemical component may be sufficient as the other inorganic type hygroscopic agent used together with an inorganic type hygroscopic agent (C1), and may differ. In the case of using zeolite, amorphous aluminosilicate, or the like as such other inorganic moisture absorbent, the electrical conductivity of the extract is 2 × 10 ⁻² S / m or less from the viewpoint of moldability such as curability. It is preferable.

  When using an inorganic type hygroscopic agent (C1) and another inorganic type hygroscopic agent together, let the total amount be the compounding quantity of an inorganic type hygroscopic agent (C). It is preferable that the compounding quantity of this inorganic type hygroscopic agent (C) exceeds 50 mass% of the whole epoxy resin composition, and it is more preferable to set it as 52-70 mass%. When the blending amount of the inorganic moisture absorbent (C) is less than 50% by mass, the moisture resistance reliability may be insufficient.

  In the present invention, “average particle diameter” and “BET specific surface area” refer to values obtained by the following measurements. “Extract liquid conductivity” was determined by mixing 5 g of sample with 50 cc of pure water, boiled at 100 ° C. for 5 minutes, and then quantified filter paper No. 1 manufactured by Toyo Filter Paper Co., Ltd. at room temperature. It is the value which filtered using 5C and measured the electrical conductivity of the filtrate in a 20 degreeC environment using "GM-115" by Kyoto Electronics Co., Ltd.

For the measurement of the “average particle size”, a laser diffraction / scattering type particle size distribution measuring device LA-920 manufactured by Horiba, Ltd. is used as a measuring device, a sodium hexametaphosphate 0.2 wt / vol% aqueous solution is used as a dispersion medium, and relative refraction is measured. The measurement was performed under the conditions of a rate of 1.10, a transmittance of 70 to 90%, a circulation speed of 7, an ultrasonic time of 3 minutes, and an ultrasonic intensity of 7.

“BET specific surface area” is measured by using a flow method BET single point method specific surface area measuring device Monosorb manufactured by Yuasa Ionics Co., Ltd. as a measuring device, and using nitrogen / helium mixed gas 1.5 kg / cm ² as a carrier gas, nitrogen gas The test was performed under the conditions of 0.7 kg / cm ² and sample degassing conditions of 200 ° C./30 minutes.

  The epoxy resin composition by this invention contains various additives, such as an inorganic filler, a hardening accelerator, a mold release agent, a coupling agent, a flame retardant, as needed other than said (A)-(C). be able to.

  The epoxy resin composition according to the present invention can contain an inorganic filler for the purpose of reducing the linear expansion coefficient and improving the strength. Examples of such inorganic fillers include fused silica, crystalline silica, synthetic silica, alumina, zircon, calcium silicate, calcium carbonate, potassium titanate, silicon carbide, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, Examples include powders such as fosterite, steatite, spinel, mullite, and titania, or beads made of these spheroids, glass fibers, etc., and metal hydroxides such as aluminum hydroxide and magnesium hydroxide that have a flame-retardant effect. You may mix.

  From the viewpoint of moldability such as fluidity and curability, it is preferable to blend fused silica, crystalline silica, synthetic silica, etc., more preferably fused silica, synthetic silica, spherical fused silica, spherical It is particularly preferable to blend synthetic silica.

The shape of the inorganic filler is not particularly limited, but a spherical shape or a shape close to a spherical shape is preferable from the viewpoint of fluidity. Moreover, although the average particle diameter of an inorganic filler is not specifically limited, It is preferable that all the said (C) inorganic type hygroscopic agents and inorganic type fillers are combined, and an average particle diameter will be 3-30 micrometers.
The blending amount of the inorganic filler is preferably 5 to 50% by mass of the (C) inorganic hygroscopic agent from the viewpoint of moldability such as fluidity and curability and mechanical strength.

The epoxy resin composition according to the present invention preferably contains a curing accelerator in order to obtain good curability at the time of molding. Examples of the curing accelerator include organic phosphorus compound-based curing accelerators such as triphenylphosphine and tetraphenylphosphonium tetraphenylborate, and amine compound-based curing accelerations such as 1,8-diazabicyclo [5.4.0] undecene-7. The curing agent generally used in the epoxy resin composition for sealing, such as an agent and an imidazole compound-based curing accelerator, can be used alone or in combination of two or more, but the imidazole compound-based curing accelerator, or When at least one of addition products of the phosphine compound represented by the following general formula (I) and the quinone compound represented by the following general formula (II) is used, particularly good curability can be obtained.

R ¹ in the general formula (I) represents an alkyl group having 1 to 12 carbon atoms, R ² and R ³ represent a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms, and they are all the same or different. May be. Moreover, R < ⁴ > -R < ⁶ > in general formula (II) shows a hydrogen atom or a C1-C18 hydrocarbon group, and all may be same or different, respectively. R ⁴ and R ⁵ may be bonded to form a cyclic structure. )
In the present invention, for the purpose of enhancing the adhesion between the resin component and the inorganic filler, a known coupling agent generally used in an epoxy resin composition for sealing may be added. The coupling agent is not particularly limited. For example, various silane compounds such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, and vinyl silane, titanium compounds, aluminum chelates, and aluminum / zirconium compounds. A compound etc. are mentioned, They may be used individually or may be used in combination of 2 or more type.

  In this invention, you may add the well-known mold release agent generally used for the epoxy resin composition for sealing for the purpose of smooth mold release from a shaping | molding die. The release agent is not particularly limited, and examples thereof include higher fatty acid waxes such as stearic acid and montanic acid, higher fatty acid ester waxes, higher fatty acid amide waxes, polyethylene waxes, and the like. You may use individually or in combination of 2 or more types.

  In the present invention, in addition to the above-mentioned various additives, carbon black, organic dyes, organic pigments, various colorants such as titanium oxide, various adhesion imparting agents such as imidazole, triazole, tetrazole, and triazine, NBR rubber And additives such as various low-stress agents such as silicone rubber, additives such as brominated epoxy resins, antimony trioxide, organophosphorous flame retardants, nitrogen-based flame retardants, etc., if necessary It can be added to the composition. In addition, the additive which can be added is not limited to the above-mentioned illustration, Various additives well-known in this technical field may be used.

  The epoxy resin composition according to the present invention can be prepared by any method as long as various raw materials can be uniformly dispersed and mixed. As a general method, there can be mentioned a method in which raw materials having a predetermined blending amount are sufficiently mixed with a mixer or the like, then melt kneaded with a mixing roll, a kneader, an extruder or the like, then cooled and pulverized. The melt-kneading may be performed a plurality of times using a plurality of apparatuses, or after kneading a part of the raw material with a mixing roll or the like, the whole raw material may be kneaded again with a kneader or an extruder. . In addition, in order to handle easily, an epoxy resin composition may be tableted with the dimension and weight which meet molding conditions.

  As a method for sealing a semiconductor element using the epoxy resin composition according to the present invention, a low-pressure transfer molding method is the most common, but other molding methods such as an injection molding method and a compression molding method may be used. . When the epoxy resin composition is liquid or paste at normal temperature, a dispensing method, a casting method, a printing method, or the like can also be applied.

The package for an electronic component device according to the present invention is sealed and molded with the above epoxy resin composition. Examples of the electronic component device package include a semiconductor device hollow package, and the epoxy resin composition of the present invention is particularly suitable for molding a semiconductor device hollow package among electronic component device packages. As shown in FIG. 1, the hollow package for a semiconductor device usually has a box-like shape with an upper opening, and the upper surface thereof is sealed by a lid 5 such as glass or transparent plastic via a sealing agent 6. The semiconductor element 3 is placed in the central recess of the package and is connected to the lead frame 2 via the bonding wire 4.
In addition, an electronic component device according to the present invention is formed by the above epoxy resin composition. As an electronic component device, for example, a semiconductor element is hermetically sealed in the semiconductor hollow package.

  EXAMPLES Hereinafter, although an Example demonstrates this invention more concretely, the scope of the present invention is not limited by a following example.

(Examples 1-5, Comparative Examples 1-5)
Hereinafter, various raw materials used in each example and each comparative example are shown.

(A) Epoxy resin Epoxy resin 1: Biphenyl type epoxy resin having an epoxy equivalent of 192 and a melting point of 105 ° C. (trade name “Epicoat YX4000H” manufactured by Japan Epoxy Resin Co., Ltd.).

(B) Curing agent Curing agent 1: Phenol aralkyl resin having a softening point of 70 ° C. and a hydroxyl group equivalent of 175 (trade name “Mirex XL-225” manufactured by Mitsui Chemicals, Inc.).

(C) Inorganic hygroscopic agent (C1) component: zeolite having an average particle size of 40 μm and a specific surface area of 40 m ² / g (manufactured by Chubu Electric Power Co., Ltd., trade name “Cyculus”, the electrical conductivity of the extract is about 1 × 10 ⁻² S / m).

Component (C2): silica gel having an average particle size of 3.5 μm and a specific surface area of 600 m ² / g (manufactured by Mizusawa Chemical Co., Ltd., trade name “S-200”).

Component (C3): amorphous aluminosilicate having an average particle size of 10 μm and a specific surface area of 5 m ² / g (manufactured by Mizusawa Chemical Industry Co., Ltd., trade name “AMT-100R”).

(Other additives)
Inorganic filler Inorganic filler 1: fused spherical silica (trade name “FB-105”, manufactured by Denki Kagaku Kogyo Co., Ltd.) having an average particle size of 12 μm and a specific surface area of 5.0 m ² / g.

Inorganic filler 2: Synthetic spherical silica having an average particle size of 0.5 μm and a specific surface area of 6.5 m ² / g (manufactured by Admatechs Co., Ltd., trade name “SO-25R”).

Inorganic filler 3: Synthetic silica having an average particle size of 12 nm (primary particles) and a specific surface area of 200 m ² / g (trade name “AEROSIL200V” manufactured by Nippon Aerosil Co., Ltd.).

Curing accelerator: 2-phenyl-4-methylimidazole Mold release agent: Oxidized polyethylene wax Coupling agent: γ-glycidoxypropyltrimethoxysilane (epoxysilane)
Colorant: Carbon black (trade name MA-100 manufactured by Mitsubishi Chemical Corporation)
Flame retardant: Brominated epoxy resin, antimony trioxide (C) The “average particle diameter” and “specific surface area” of the inorganic moisture absorbent are values obtained by the measurement method described above.

  The above-mentioned various raw materials are blended in parts by weight shown in Table 1 below, and roll kneading is performed under conditions of a kneading temperature of 80 ° C. and a kneading time of 20 minutes. Each resin composition was prepared.

  Next, the prepared epoxy resin compositions of Examples 1 to 5 and Comparative Examples 1 to 5 were evaluated by the following tests. The evaluation results are shown in Table 1 below. The epoxy resin composition was molded using a transfer molding machine under conditions of a mold temperature of 180 ° C., a molding pressure of 6.9 MPa, and a curing time of 90 seconds. Further, post-curing was performed at 175 ° C. for 6 hours.

(1) Spiral flow (indicator of fluidity / fillability)
The epoxy resin composition was molded under the above conditions using a spiral flow measurement mold in accordance with EMMI-1-66, and the flow distance (cm) was determined.

(2) Hardness during heating A cull portion having a diameter of 30 mm and a depth of 4 mm in the center portion, and 2 μm, 3 μm, 5 μm, 10 μm, 20 μm, 30 μm, and 50 μm extending radially from the cull portion periphery toward the mold periphery. An epoxy resin molding material was molded into a 30 mm diameter × 4 mm thick disc under the above conditions using a Mitani Metal Co., Ltd. varis mold having a slit having a thickness (slit width 5 mm). The mold was taken out 5 seconds after the lower mold of the transfer press started to open, and immediately after that, the Shore D hardness of the molded product (the cull portion at the center of the mold) was measured.

(3) Burr length Molding was performed using the same mold as (2) above, and the resin length (burr length) on the 2-50 μm slit was measured. Of the resin lengths on the six types of slits excluding 50 μm, the largest was the burr length.

(4) Moisture resistance The epoxy resin composition is molded under the above conditions to prepare a test piece of φ50 × 3.0 mmt, after post-curing, left in an 85 ° C./85% RH environment, left for 500 hours, and after 1000 hours The weight change of the test piece was measured, and the water absorption X ₅₀₀ after 500 hours of standing and the water absorption X ₁₀₀₀ after 1000 hours of standing were determined from the following formula.

(Water absorption rate (%)) = (W ₁ −W ₀ ) × 100 / W ₀
(Wherein, _{W 0:} initial weight of the test piece, _{W 1:} Weight after standing of the test piece)
500 hours after water absorption _{X 500} is large, the difference _X 1000 _{-X 500} is large resin composition 500 hours after the water absorption _{X 500} and allowed to stand after 1000 hours water absorption _{X 1000,} excellent moisture resistant resin It was judged as a composition.

  As apparent from Table 1, Examples 1 to 5 containing the component (C1) of the present invention were found to be excellent in fluidity, in particular, moldability such as burr length, and excellent in moisture resistance. On the other hand, Comparative Examples 1 to 5 not including the component (C1) are inferior in fluidity, burr length, moisture resistance, and the like.

It is sectional drawing of the hollow package for semiconductor devices shape | molded by the epoxy resin composition.

Explanation of symbols

1 Molded product of epoxy resin composition 2 Lead frame 3 Semiconductor element 4 Bonding wire 5 Lid 6 Sealant

Claims (6)

  (A) An epoxy resin composition containing an epoxy resin, (B) a curing agent, and (C) an inorganic moisture absorbent, wherein (C) the inorganic moisture absorbent has an average particle size of at least 15 μm to 70 μm. An epoxy resin composition comprising an agent (C1). The epoxy resin composition according to claim 1, wherein the inorganic moisture absorbent (C1) has a BET specific surface area of 20 m ² / g or more and 100 m ² / g or less.   3. The epoxy resin composition according to claim 1, wherein a blending amount of the inorganic moisture absorbent (C) exceeds 50% by mass of the entire epoxy resin composition.   The compounding quantity of the said inorganic type moisture absorbent (C1) component is 1 to 50 mass% of the whole epoxy resin composition, The epoxy resin composition as described in any one of Claims 1-3 characterized by the above-mentioned. object.   The package for electronic component apparatuses shape | molded with the epoxy resin composition as described in any one of Claims 1-4.   The electronic component apparatus shape | molded with the epoxy resin composition as described in any one of Claims 1-4.

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