JP2007305443A - Gas burner for tipping off, method of manufacturing plasma display panel, and plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To melt and close an exhaust pipe uniformly so that the shape of the tip part of the exhaust pipe after tipping off may be uniform and to reduce occurrence of cracks which may cause leaking at the tip part of the exhaust pipe. <P>SOLUTION: A gas burner 60 is provided with at least four gas injection holes 61 arranged so that each may be two pairs mutually opposed to, and heats and melts to close by flame 62 the exhaust pipe 50 of a plasma display panel arranged in a prescribed location. The four gas injection holes 61 are installed so that the distance from the gas injection holes 61 to the exhaust pipe 50 may be mutually equal and the straight line extended from the gas injection holes 61 to the injection direction of gas may contact the outer circumferential face of the exhaust pipe 50, but does not have the gas injection holes that may be nearly perpendicular to the outer circumferential face of the exhaust pipe 50. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a chip-off gas burner, an apparatus for manufacturing a plasma display panel, and a plasma display panel, which are used in a wall-mounted television and a large monitor, and have an exhaust pipe for enclosing exhaust and discharge gas.

  A typical AC surface discharge type panel as a plasma display panel (hereinafter abbreviated as “panel”) has a large number of discharge cells formed between a front plate and a back plate arranged to face each other. The front plate is formed by forming a plurality of pairs of display electrodes each consisting of a pair of scan electrodes and sustain electrodes on a front glass substrate of sodium borosilicate glass by a float method so as to cover the display electrode pairs. A body layer and a protective layer made of magnesium oxide (MgO) are further formed thereon. The back plate has a plurality of parallel data electrodes on a back glass substrate provided with pores for exhaust and discharge gas introduction, a dielectric layer so as to cover the data electrodes, and a parallel to the data electrodes thereon. A plurality of barrier ribs are respectively formed, and phosphor layers that emit red (R), green (G), and blue (B) light are respectively formed on the surface of the dielectric layer and the side surfaces of the barrier ribs.

  The front plate and the back plate are arranged opposite to each other so that the display electrode pair and the data electrode are three-dimensionally crossed so that the periphery is sealed and exhaust and discharge gas can be introduced through the pores provided in the back plate. A glass exhaust pipe is secured to the back plate. And after exhausting from the discharge space in a panel through an exhaust pipe, introduction of discharge gas (For example, the pressure of about 530 hPa-800 hPa in the case of Ne-Xe) is performed through an exhaust pipe. Thereafter, the exhaust pipe is locally heated at an appropriate portion, melted and sealed to close and cut the exhaust pipe (hereinafter referred to as “chip-off”). Thus, the discharge gas is sealed in the discharge space. In the panel having such a configuration, discharge cells are formed in the portion where the display electrode pair and the data electrode face each other, and a discharge voltage is generated in each discharge cell by applying a driving voltage based on a video signal to each electrode. Color display is performed by exciting and emitting phosphors of R, G, and B colors with ultraviolet rays generated by discharge.

  When the exhaust pipe is chipped off, a gas burner, an energizing heater or the like can be used as a local heating means. However, although the energizing heater has the advantages of being able to control the heating temperature relatively accurately, easy to handle during mass production and easy to automate, the heating section (energizing heater) is larger than the gas burner. Since the time required for heating and sealing cutting is long and it is not easy to increase the manufacturing tact time, the time required for heating and sealing cutting is short, and the heating part can be configured to be relatively small. The tip-off by the gas burner which can be performed is generally performed. In addition, a gas burner capable of ejecting a flame having a sufficiently large amount of heat is used so that the time taken for tip-off can be shortened as much as possible.

  FIG. 15 is a diagram showing a state of tip-off using a gas burner according to the prior art. For example, as shown in FIG. 15, the gas burner 60e according to the prior art is disposed on both the left and right sides (in the drawing) of the exhaust pipe so that the surfaces provided with the gas ejection holes face each other. Are provided with a plurality of pairs (three pairs in FIG. 15) of gas ejection holes facing each other. And the exhaust pipe 50 arrange | positioned between the surfaces provided with the gas ejection hole is heated from both right and left sides (in the drawing) by three pairs of flames ejected from the gas ejection hole.

  In the gas burner 60e shown in FIG. 15, the flames ejected from the three pairs of gas ejection holes are flames having a sufficiently large calorific value, and the exhaust pipe 50 can be melted in a relatively short time. However, in such a gas burner, the amount of heating to the exhaust pipe 50 is uneven, and a region with a relatively large amount of heating is melted first. There is a possibility that a state such as non-uniformity or non-uniform thickness may occur. In the exhaust pipe tip having such a shape, residual stress may be generated due to a difference in cooling rate, or a location where stress generated by the difference between the pressure inside the exhaust pipe and the external pressure may be concentrated. As a result, cracks that cause outside air to leak into the exhaust pipe (hereinafter also referred to as “leak”) are likely to occur.

  Therefore, a first heating unit having a large heating amount and a second heating unit having a small heating amount are provided, and the first heating unit and the second heating unit are alternately switched at a repetition cycle of about 1 Hz to 50 Hz. A technique for uniformly heating an exhaust pipe is disclosed (for example, see Patent Document 1).

Further, Patent Document 1 discloses that while a flame having a sufficiently large amount of heat is ejected from a gas burner, at the same time, the gas burner is swung horizontally with respect to the panel so that heating by the gas burner is performed on the exhaust pipe. Reference is also made to a method of heating the exhaust pipe uniformly so as not to be localized.
JP 2004-31019 A

  However, in the above-described technique, since there is a difference in distance from each gas ejection hole to the outer peripheral surface of the exhaust pipe, the outer peripheral surface of the exhaust pipe hits the area where the flame from the gas burner hits relatively strongly and relatively weakly. Thus, the heating amount is not sufficiently uniform, and it is difficult to make the shape of the exhaust pipe tip after the chip-off sufficiently uniform.

  The present invention has been made in view of these problems, and it is possible to melt the exhaust pipe uniformly so that the shape of the exhaust pipe tip after chip-off is uniform, and to prevent leakage at the exhaust pipe tip. An object of the present invention is to provide a chip-off gas burner, a panel manufacturing apparatus, and a panel that can reduce the occurrence of cracks.

  The present invention is a tip-off gas burner having a plurality of gas ejection holes and configured to heat and melt an exhaust pipe of a panel disposed at a predetermined position by a gas flame, the gas ejection holes The straight line extending from the gas ejection hole in the gas ejection direction is in contact with the outer peripheral surface of the exhaust pipe. This makes it possible to uniformly melt the exhaust pipe so that the shape of the tip of the exhaust pipe after tip-off becomes uniform.

  The chip-off gas burner according to the present invention includes at least four gas ejection holes provided so as to be in pairs with each other, and the distances from the four gas ejection holes to the exhaust pipe are equal to each other. You may comprise so that it may become. Thereby, it is possible to configure a gas burner with a relatively simple configuration such that a straight line extending in the gas ejection direction from the gas ejection hole contacts the outer peripheral surface of the exhaust pipe.

  The gas burner for chip-off according to the present invention may be configured such that the gas ejection holes facing each other are arranged on the same straight line in contact with the outer peripheral surface of the exhaust pipe. This also makes it possible to configure a gas burner with a relatively simple configuration such that a straight line extending in the gas ejection direction from the gas ejection hole contacts the outer peripheral surface of the exhaust pipe.

  Further, the gas burner for chip-off of the present invention has four gas ejection holes, and straight lines extending from the gas ejection holes in the gas ejection direction with respect to the outer peripheral surface of the exhaust pipe are ± d (d is the exhaust pipe). The thickness is preferably within the range of (thickness).

  Further, the panel manufacturing apparatus of the present invention includes a fixing means for fixing the panel, and an exhaust pipe for exhausting from the panel and introducing discharge gas into the panel via an exhaust pipe provided in the panel. A head and heating means for heating and melting the exhaust pipe are provided, and the chip-off gas burner described above is provided as the heating means. As a result, the exhaust pipe can be uniformly melted so that the shape of the tip of the exhaust pipe after chip-off becomes uniform.

  Further, the panel of the present invention comprises a front plate having a display electrode pair consisting of a scan electrode and a sustain electrode, and a back plate having a data electrode and provided with pores for introducing exhaust gas and discharge gas. The display electrode pair and the data electrode are placed opposite to each other so that the outer periphery is hermetically sealed, and an exhaust pipe for introducing exhaust gas and discharge gas is arranged so as to cover the pores on the back plate. The panel is a sealed panel, and the exhaust pipe is chipped off by the above-described chip-off gas burner, and the suction amount of the melted and closed portion into the exhaust pipe is 1.5 mm or less. It is characterized by being formed. As a result, it is possible to reduce the occurrence of cracks that lead to the leakage of outside air at the exhaust pipe tip.

  In the panel of the present invention, the exhaust pipe may be formed of a glass component that does not contain lead.

  According to the present invention, the exhaust pipe can be uniformly melted so that the shape of the exhaust pipe tip after chip-off is uniform, and the occurrence of cracks that lead to leakage at the exhaust pipe tip is reduced. It is possible to provide a chip-off gas burner and panel manufacturing apparatus and a panel that can be used.

  Hereinafter, a panel manufacturing apparatus according to an embodiment of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is an exploded perspective view showing the structure of panel 10 in accordance with the first exemplary embodiment of the present invention. On the glass front plate 21, a plurality of display electrode pairs 28 each composed of a scanning electrode 22 and a sustain electrode 23 and a light shielding layer are formed in parallel to each other. A dielectric layer 24 is formed so as to cover the scan electrode 22 and the sustain electrode 23, and a protective layer 25 made of magnesium oxide (MgO) or the like is formed on the dielectric layer 24. A plurality of data electrodes 32 are formed on the back plate 31, a dielectric layer 33 is formed so as to cover the data electrodes 32, and a grid-like partition wall 34 is formed thereon. A phosphor layer 35 that emits light of each color of red (R), green (G), and blue (B) is provided on the side surface of the partition wall 34 and on the dielectric layer 33.

  The front plate 21 and the back plate 31 are arranged to face each other so that the display electrode pair 28 and the data electrode 32 intersect each other with a minute discharge space interposed therebetween, and the outer periphery thereof is sealed with a sealing material such as glass frit. Has been. A discharge gas containing neon, xenon, or the like is sealed in the discharge space at a predetermined pressure (for example, a pressure of about 530 hPa to 800 hPa in the case of a Ne—Xe mixed gas). The discharge space is partitioned into a plurality of sections by partition walls 34, and discharge cells are formed at the intersections between the display electrode pairs 28 and the data electrodes 32. These discharge cells discharge and emit light to display an image.

  Note that the structure of the panel 10 is not limited to the above-described structure, and for example, the panel 10 may include a stripe-shaped partition wall.

  A method for manufacturing the panel 10 will be described. First, the scan electrode 22 and the sustain electrode 23 and the light shielding layer are formed on the glass front plate 21. These scan electrode 22 and sustain electrode 23 are composed of a transparent electrode and a metal bus electrode, and the transparent electrode and the metal bus electrode are formed by patterning using a photolithography method or the like. The transparent electrode is formed using a thin film process or the like, and the metal bus electrode is solidified by baking a paste containing a silver material at a desired temperature. Similarly, the light shielding layer is formed by screen printing a paste containing a black pigment or by forming a black pigment on the entire surface of the glass substrate, and then patterning and baking using a photolithography method.

  Thereafter, a dielectric paste is applied on the front plate 21 by a die coating method or the like so as to cover the scanning electrode 22, the sustain electrode 23, and the light shielding layer, thereby forming a dielectric paste layer (dielectric material layer). After the dielectric paste is applied, the surface of the applied dielectric paste is leveled by leaving it to stand for a predetermined time, so that a flat surface is obtained. Thereafter, the dielectric paste layer is formed by baking and solidifying the dielectric paste layer to cover the scan electrode 22, the sustain electrode 23, and the light shielding layer. The dielectric paste is a paint containing a dielectric material such as glass powder, a binder and a solvent. Next, a protective layer 25 made of magnesium oxide (MgO) is formed on the dielectric layer 24 by vacuum deposition. Through the above steps, predetermined constituent members (a display electrode pair 28 including a scanning electrode 22 and a sustain electrode 23, a light shielding layer, a dielectric layer 24, and a protective layer 25) are formed on the front plate 21, and the front plate 21 is completed. .

  On the other hand, the back plate 31 is formed as follows. First, the structure for the data electrode 32 is formed by a method of screen printing a paste containing a silver material on the glass back plate 31 or a method of patterning using a photolithography method after forming a metal film on the entire surface. A data electrode 32 is formed by forming a material layer to be an object and firing it at a desired temperature.

  Next, a dielectric paste is applied on the back plate 31 on which the data electrodes 32 are formed by a die coating method or the like so as to cover the data electrodes 32 to form a dielectric paste layer. Thereafter, the dielectric layer 33 is formed by firing the dielectric paste layer. The dielectric paste is a paint containing a dielectric material such as glass powder, a binder and a solvent.

  Thereafter, a partition wall forming paste including a partition wall material is applied onto the dielectric layer 33 and patterned into a predetermined shape to form a partition wall material layer and then fired to form the partition walls 34. Here, as a method of patterning the partition wall paste applied on the dielectric layer 33, a photolithography method or a sand blast method can be used.

  The back plate 31 on which the barrier ribs 34 are formed is coated with a phosphor paste containing a phosphor material on the dielectric layer 33 between the adjacent barrier ribs 34 and on the side surfaces of the barrier ribs 34, and is baked to phosphor layer 35. Is formed. Through the above steps, predetermined constituent members (data electrode 32, dielectric layer 33, partition wall 34, phosphor layer 35) are formed on back plate 31, and back plate 31 is completed.

  And it can apply | coat a sealing material to the predetermined position around the front board 21 or the back board 31, and can burn the resin component contained in a sealing material using the coating apparatus provided with thick film printing, an inkjet, or dispenser. Temporary baking is performed at a temperature. Thereafter, the front panel 21 and the rear panel 31 are arranged to face each other so that the electrode forming surface faces each other, and the panel 10 is assembled. Subsequently, the process proceeds to a step of hermetically sealing the periphery of the front plate 21 and the rear plate 31, and a step of hermetically sealing the exhaust pipe for introducing exhaust gas and discharge gas (so-called chip pipe) with a sealing material. Then, after evacuating the panel 10 through the exhaust pipe and introducing the discharge gas into the panel 10, the exhaust pipe is heated and melted to close and seal the exhaust pipe. This exhaust pipe is formed of a glass component that does not contain a lead component, and can be melted by heating at a temperature equal to or higher than the softening point temperature (here, about 630 ° C.). At the time of melting, it is desirable to heat at a temperature higher by 200 ° C. or more than the softening point temperature. Here, the melting is performed by heating at about 900 ° C.

  FIG. 2 is a schematic diagram showing a state of sealing between front plate 21 and rear plate 31 and sealing between exhaust pipe 50 and rear plate 31 in Embodiment 1 of the present invention. First, as shown to Fig.2 (a), the sealing material 41 is apply | coated using the coating device (not shown) provided with the dispenser. At this time, the sealing material 41 b is applied to a predetermined position around the front plate 21, and the sealing material 41 a is applied to a predetermined position around the back plate 31. As the sealing material 41, for example, a paste-like low melting point frit glass can be used.

  In addition, when applying the sealing materials 41a and 41b, thick film printing or an ink jet coating apparatus can be used in addition to a coating apparatus provided with a dispenser. Alternatively, a method of adhering sealing materials 41a and 41b formed by giving adhesiveness to a sheet-like base material with a predetermined thickness and shape to a predetermined position without using thick film printing or a coating apparatus is used. You can also. Moreover, it is good also as a structure which apply | coats or adhere | attaches sealing material 41a, 41b only to either one of the front plate 21 or the backplate 31. FIG.

  Then, after the sealing material 41 is dried for a certain period of time, temporary baking is performed at a predetermined temporary baking temperature (about 350 ° C.) lower than the sealing temperature, and then the display electrode pair 28 on the front plate 21 and the back plate 31 are preliminarily fired. The front plate 21 and the back plate 31 are arranged to face each other so as to cross the data electrode 32, and are fixed using a fixing jig (not shown) as fixing means.

  Next, the process moves to a sealing step for sealing the exhaust pipe 50 to the back plate 31. In this sealing step, a sealing material called a tablet (tablet 42 shown in the drawing) is formed in advance and used as a sealing material for the exhaust pipe 50. As a material of the tablet 42, for example, a low melting point frit glass can be used.

  Then, the center of the exhaust pore 40 provided at a predetermined position near the corner of the back plate 31 and the center of the hole 43 at the center of the tablet 42 are placed together. At this time, it is positioned and assembled so that the center of the opening at one end of the exhaust pipe 50 and the center of the exhaust pore 40 are substantially coincident with each other, and another fixing jig ( Hold it in place (not shown) and fix it. Thereafter, the other end of the exhaust pipe 50 is connected to an exhaust pipe head 51 for introducing exhaust gas and discharge gas.

  Next, the front plate 21, the back plate 31, and the exhaust pipe 50 fixed by a fixing jig are installed in a firing furnace (not shown), and the temperature is raised to a sealing temperature (about 450 ° C.) higher than the temporary firing temperature. Then, the sealing material 41 and the tablet 42 are melted, and then cooled and solidified, whereby the hermetic seal between the front plate 21 and the rear plate 31 and the hermetic seal between the exhaust pipe 50 and the rear plate 31 are achieved. Is going. This is shown in FIG. FIG. 2B is a diagram schematically showing a state in which the front plate 21 and the back plate 31 are hermetically sealed around the periphery, and the exhaust pipe 50 and the back plate 31 are hermetically sealed. As described above, the softening point temperature of the exhaust pipe 50 is about 630 ° C., which is higher than the sealing temperature (about 450 ° C.) here, so that the exhaust pipe 50 is not softened by this firing.

  Next, the exhaust pipe head 51 evacuates from the discharge space inside the panel 10 through the exhaust pipe 50, and then discharges a discharge gas containing neon, xenon, etc. through the exhaust pipe 50 to a predetermined pressure (for example, Ne−). In the case of the Xe mixed gas, it is sealed in the panel 10 at a pressure of about 530 hPa to 800 hPa).

  Finally, a predetermined portion (scheduled planned portion) of the exhaust pipe 50 is locally heated and melted, and the blocked portion is cut. In this way, the exhaust pipe 50 is sealed and hermetically sealed (chip off). In the present embodiment, a gas burner is used as the heating means at the tip-off.

  FIG. 3 is a diagram showing an outline of chip-off in the first embodiment of the present invention. As shown in FIG. 3A, the flame 62 by the gas ejected from the gas ejection hole 61 of the gas burner 60 heats the side surface of the exhaust pipe 50. When the temperature of the exhaust pipe 50 reaches the softening point temperature (about 630 ° C.) by this heating, the exhaust pipe 50 starts to melt gradually. At this time, since the inside of the exhaust pipe 50 has the same atmospheric pressure (about 530 hPa to 800 hPa) as the discharge space and is depressurized from the external air pressure (about 1013 hPa), as shown in FIG. Are gradually sucked into the exhaust pipe 50. When the heating by the gas burner 60 is further continued, the melted wall portions of the exhaust pipe 50 are fused and closed. Thereafter, the closed portion of the exhaust pipe 50 is cut as shown in FIG. In this way, the exhaust pipe 50 is sealed and hermetically sealed (chip off). In this cutting, the closed portion may be cut using a cutting means such as a cutter, or the melted portion may be melted by its own weight, or other cutting methods may be used. Alternatively, the exhaust pipe 50 may be cut while pulling the exhaust pipe head 51 side toward the exhaust pipe head 51.

  Thus, the mixed gas of neon and xenon is sealed as a discharge gas in the discharge space inside the panel 10 to complete the panel 10. In the completed panel 10, a drive voltage based on a video signal is selectively applied to the display electrode pair 28 and the data electrode 32 to generate a discharge in the discharge cell, and the ultraviolet rays generated by the discharge are phosphor layers 35 of the respective colors. Is excited to emit R, G, and B colors, thereby realizing a color image display.

  4A and 4B are a plan view and a cross-sectional view of the panel 10 according to Embodiment 1 of the present invention. FIG. 4A is a plan view of the panel 10 according to the embodiment of the present invention, and FIG. It is sectional drawing in the AA of the panel 10 shown to (a).

  As shown in FIG. 4, the front plate 21 and the back plate 31 are arranged to face each other so that the display electrode pair 28 and the data electrode 32 are orthogonal to each other, and the periphery thereof is hermetically sealed with a sealing material 41. Further, the exhaust pipe 50 and the back plate 31 arranged so as to cover the exhaust pores 40 are hermetically sealed by a tablet 42 which is a sealing material. A discharge gas introduced through the exhaust pipe 50 is sealed at a predetermined pressure in the discharge space inside the panel 10, and the exhaust pipe 50 used for introducing the exhaust gas and the discharge gas is sealed off by chip-off. It is obstructed by.

  FIG. 5 is an electrode array diagram of panel 10 in accordance with the first exemplary embodiment of the present invention. In panel 10, n scanning electrodes SC1 to SCn (scanning electrode 22 in FIG. 1) and n sustaining electrodes SU1 to SUn (sustaining electrode 23 in FIG. 1) long in the row direction are arranged and long in the column direction. M data electrodes D1 to Dm (data electrode 32 in FIG. 1) are arranged. A discharge cell is formed at a portion where one pair of scan electrode SCi (i = 1 to n) and sustain electrode SUi (i = 1 to n) intersects with one data electrode Dj (j = 1 to m). , M × n discharge cells are formed in the discharge space. As shown in FIGS. 1 and 2, scan electrode SCi and sustain electrode SUi are formed in parallel with each other, and therefore, between scan electrodes SC1 to SCn and sustain electrodes SU1 to SUn. There is a large interelectrode capacitance.

  The panel 10 is driven by a subfield method, that is, a method in which gradation display is performed by dividing one field period into a plurality of subfields and combining subfields to emit light. Each subfield has an initialization period, an address period, and a sustain period. In the initialization period, an initialization discharge is generated, and wall charges necessary for the subsequent address operation are formed on each electrode. In the address period, address discharge is selectively generated in the discharge cells to be displayed to form wall charges. In the sustain period, a sustain pulse is alternately applied to the display electrode pair composed of the scan electrode and the sustain electrode, and a sustain discharge is generated in the discharge cell in which the address discharge is generated, and the phosphor layer of the corresponding discharge cell is caused to emit light. The image is displayed.

  Next, details of heating of the exhaust pipe 50 by the gas burner 60 will be described. In this heating, if the heating by the gas burner 60 is not made uniform to the exhaust pipe 50, the exhaust pipe 50 is not melted uniformly, and the previously melted portion is sucked into the exhaust pipe 50, The tip shape of the exhaust pipe 50 after chip-off becomes non-uniform.

  First, for comparison with the chip-off in this embodiment, the chip-off according to the prior art will be described again.

  For example, as shown in FIG. 15, in the gas burner 60e according to the prior art, the surfaces having the gas ejection holes are arranged on the left and right sides (in the drawing) of the exhaust pipe 50 so as to face each other. A plurality of pairs (three pairs in FIG. 15) of gas ejection holes 61e1 and 61e2 are provided on the surface. The exhaust pipe disposed between the surfaces provided with the gas ejection holes 61e1 and 61e2 is caused by three pairs of flames 62 ejected from the gas ejection holes 61e1 and 61e2 (from the left and right sides). Heated.

  At this time, for example, if the amount of heat applied to the exhaust pipe 50 is reduced and the chip is turned off over time, the exhaust pipe 50 can be heated uniformly to make the shape of the tip of the exhaust pipe 50 after the chip off uniform. Is possible. However, in order to improve productivity, it is necessary to shorten the working time in each process at the time of manufacturing as much as possible and increase the manufacturing tact. To that end, it is necessary to be able to perform chip-off in as short a time as possible. .

  In the gas burner 60e shown in FIG. 15, the flames ejected from the three pairs of gas ejection holes are flames having a sufficiently large amount of heat, and the exhaust pipe can be melted in a relatively short time.

  At this time, among the three pairs of gas ejection holes, the central pair of gas ejection holes 61e2 is arranged such that the gas ejection direction is substantially perpendicular to the outer peripheral surface of the exhaust pipe 50. There is a difference in the distance from the three pairs of gas ejection holes to the outer peripheral surface of the exhaust pipe 50, and the distance from the pair of gas ejection holes 61e2 arranged in the center to the outer peripheral surface of the exhaust pipe 50 is The distance from the two gas jet holes 61e1 on the side to the outer peripheral surface of the exhaust pipe 50 is shorter. Here, the distance from the gas ejection hole to the outer circumferential surface of the exhaust pipe 50 represents the distance from the gas ejection hole to the outer circumferential surface of the exhaust pipe 50 closest to the gas ejection hole. In addition, the double arrows in the drawing indicate the distance.

  Thus, if there is a difference in the distance from each gas ejection hole to the outer peripheral surface of the exhaust pipe 50, a difference occurs in the amount of heating to the exhaust pipe 50, and a region where the heating amount is relatively large (indicated by a broken line in the drawing) Area) and areas that are not. At this time, heating by heat conduction is performed from the region where the heating amount is relatively large to the surrounding region. However, in the region where the ejection direction of the gas ejected from the gas ejection hole 61e2 is vertical on the outer peripheral surface of the exhaust pipe 50, the heating amount by the flame is large, and melting starts earlier than the region melted by heat conduction. Therefore, melting in the exhaust pipe 50 is not uniform. In addition, the single arrow in drawing shows the jet direction of gas.

  And since the pressure inside the exhaust pipe is the same pressure (about 530 hPa to 800 hPa) as the discharge space and is reduced more than the external pressure (about 1013 hPa), if the exhaust pipe 50 is not melted uniformly, it melts first. The portion is sucked into the exhaust pipe, and a state of non-uniform shape or non-uniform thickness occurs at the front end of the exhaust pipe after chip-off. And at the exhaust pipe tip having such a shape, a stress concentration occurs due to the difference between the atmospheric pressure inside the exhaust pipe and the external pressure, and micro cracks cause factors such as temperature change, moisture absorption, and impact. As a result, the possibility of the outside air progressing to a large crack that leaks into the exhaust pipe increases.

  FIG. 16 is a schematic view showing an example of the shape of the tip of the exhaust pipe when the exhaust pipe is chipped off without being uniformly melted. 16 (a) is a top view of the exhaust pipe tip, and FIG. 16 (b) is a side view of the exhaust pipe tip as seen from the X direction shown in FIG. 16 (a). FIG. 17 is a side view of the exhaust pipe tip as viewed from the Y direction shown in FIG.

  As described above, since the pressure inside the exhaust pipe is the same as the discharge space (about 530 hPa to 800 hPa) and is lower than the external pressure (about 1013 hPa), the exhaust pipe 50 is uniform at the time of chip-off. If not melted, the previously melted portion is sucked into the exhaust pipe. Then, if the previously melted portion is sucked into the exhaust pipe, the shape at the tip of the exhaust pipe after chip-off, for example, as shown by the arrows in FIGS. 16 (a) and 16 (b) The state of non-uniformity or thickness non-uniformity occurs. If it does so, as shown in Drawing 16 (b) and Drawing 16 (c), not only the shape in the exhaust pipe tip part will become non-uniform but thickness will also become non-uniform.

  In addition, the non-uniformity of the shape caused by the suction into the exhaust pipe at the exhaust pipe front end can be expressed numerically. Specifically, as shown in FIG. 16C, first, two tangent lines are drawn with respect to the wall surface of the exhaust pipe inner wall. The two tangents are selected so that the intersection of the two tangents is lowest (in the drawing). Then, the distance (in the vertical direction in the drawing) between the intersection and the highest position (in the drawing) of the inner wall of the exhaust pipe is obtained. This value is the “suction amount” representing the non-uniformity of the shape at the tip of the exhaust pipe. As the suction amount increases, the possibility of generating a large crack that causes a leak increases. For example, in the case of an exhaust pipe having an outer diameter of 5 mm and a thickness of 1 mm, practically 1.5 mm or less. It is desirable to limit the amount of inhalation.

  As described above, if the exhaust pipe 50 is not uniformly melted, problems such as non-uniform shape or non-uniform thickness occur at the tip of the exhaust pipe after chip-off, and there is a high possibility that cracks that cause leakage occur. In the gas burner 60 according to the present embodiment, the exhaust pipe 50 can be uniformly heated so that the tip of the exhaust pipe after chip-off can be made into a uniform shape. It is possible to reduce it. Next, details of the gas burner 60 in the present embodiment will be described.

  FIGS. 6A and 6B are schematic views showing a state of tip-off of the exhaust pipe 50 using the gas burner 60 according to Embodiment 1 of the present invention. FIG. 6A is a plan view and FIG. 6B is a side view. FIG. 6 (c) is a front view of a surface provided with gas ejection holes. FIG. 7 is a diagram showing an example of the configuration of the gas burner 60 according to Embodiment 1 of the present invention. FIG. 7 (a) is a perspective view, and FIG. 7 (b) is A in FIG. 7 (a). FIG. 7C is a cross-sectional view taken along the line -A, and FIG. In the present embodiment, an exhaust pipe 50 having an outer diameter r of 5 mm and a thickness d of 1 mm is used. However, the exhaust pipe 50 is not limited to this size, and may be of other sizes. Good.

  As shown in FIG. 6, the gas burners 60 are arranged on the left and right sides of the exhaust pipe 50 (in the drawing) so that the surfaces provided with the gas ejection holes face each other. Two gas ejection holes 61 are provided. For example, as shown in FIG. 7, the gas burner 60 is provided with a gas ejection hole 61 by drilling a side surface of a metal block or the like, and an introduction port (not shown) for introducing gas and an introduction It can be formed by providing a gas conduit 63 for guiding the generated gas to the gas ejection hole 61 inside. A flammable gas is supplied from the gas inlet at a predetermined pressure, and the gas ejected from the gas ejection hole 61 is ignited to form a flame. The gas ejection hole 61 has, for example, an inner diameter of about 0.4 mm and is formed in a direction perpendicular to the surface as shown in FIGS. 7 (b) and 7 (c). The gas ejection direction is indicated by an arrow. The two pairs of gas ejection holes 61 are disposed at positions facing each other. Further, as shown in FIGS. 6B and 6C, the four gas ejection holes 61 are arranged so as to be located on a virtual one plane that is orthogonal to the exhaust pipe 50. When viewed from the side, the exhaust pipe 50 can be heated at the same height. And the exhaust pipe 50 arrange | positioned between the gas burners 60 is heated from both right and left sides by the flame 62 by the gas ejected from the gas ejection hole 61 (in the drawing).

  At this time, as shown in FIG. 6A, the two pairs of gas ejection holes 61 are arranged such that a line segment connecting the gas ejection holes 61 facing each other is in contact with the outer peripheral surface of the exhaust pipe 50. The distances from the gas ejection holes 61 to the outer peripheral surface of the exhaust pipe 50 are equal to each other as shown by double arrows in the drawing. And each gas ejection hole 61 is provided so that the straight line extended in the gas ejection direction from each gas ejection hole 61 may each contact | connect the outer peripheral surface of the exhaust pipe 50, as shown by the single arrow in drawing. Therefore, the flame 62 due to the gas ejected from the gas ejection hole 61 is also in a direction in contact with the outer peripheral surface of the exhaust pipe 50. Further, the gas burner 60 does not have a gas ejection hole in which the gas ejection direction is perpendicular to the outer peripheral surface of the exhaust pipe 50. Therefore, the exhaust pipe 50 is perpendicular to the outer peripheral surface. It will not be heated with a strong flame.

  That is, in the present embodiment, the flame caused by the gas ejected from each gas ejection hole 61 heats the outer peripheral surface of the exhaust pipe 50 with a substantially equal heating amount, and the heating to the exhaust pipe 50 is biased. It has no configuration. Here, the distance from the gas ejection hole 61 to the outer circumferential surface of the exhaust pipe 50 represents the distance from the gas ejection hole 61 to the outer circumferential surface of the exhaust pipe 50 closest to the gas ejection hole 61.

  FIG. 8 is a schematic view showing a state of heating the exhaust pipe 50 by the gas burner 60 in the first embodiment of the present invention. As shown in this drawing, in the present embodiment, there is no flame that is heated perpendicularly to the exhaust pipe 50, and the flame caused by the gas ejected from each gas ejection hole 61 forms an outer peripheral surface of the exhaust pipe 50. Heat with approximately equal heating amount. For this reason, in the relatively large area 63 (area surrounded by a broken line in the drawing) of the exhaust pipe 50, the heating by the flame is performed almost uniformly. On the other hand, the region 64 around the region 63 is mainly heated by heat conduction from the region 63, but since the region is smaller than the region 63, the melting starts without substantial delay from the melting in the region 63. Thereby, the exhaust pipe 50 is melted substantially uniformly in a ring shape.

  In addition, each gas ejection hole 61 shown in FIG. 6 has a straight line extending from each gas ejection hole 61 in the gas ejection direction with respect to the outer peripheral surface of the exhaust pipe 50 ± d (d is the thickness of the exhaust pipe 50. It is desirable to be provided so as to fall within the range of

  FIG. 9 is a schematic diagram showing the shape of the tip of the exhaust pipe 50 after tip-off in the first embodiment of the present invention. 9A is a top view of the distal end portion of the exhaust pipe 50, and FIG. 9B is a side view of the distal end portion of the exhaust pipe 50 viewed from the X direction shown in FIG. 9A. FIG. 10C is a side view of the exhaust pipe tip as viewed from the Y direction shown in FIG.

  As shown in this drawing, in this embodiment, the exhaust pipe 50 can be melted almost uniformly at the time of chip-off, so that the exhaust pipe is shown in FIGS. 9 (b) and 9 (c). The shape of the tip can be made uniform when viewed from either the X direction or the Y direction. Further, the suction amount here is approximately 0 mm, and the stress applied to the exhaust pipe tip is substantially uniform. Therefore, even if there are factors such as temperature change, moisture absorption, and impact, the occurrence of cracks that lead to leakage can be greatly reduced. For example, in the case of an exhaust pipe having an outer diameter of 5 mm and a thickness of 1 mm, if the suction amount is 1.5 mm or less as described above, the possibility of occurrence of cracks leading to leakage is greatly reduced. Therefore, in the present embodiment, the suction amount of 1.5 mm or less is defined as “the shape of the exhaust pipe tip is uniform”. However, since this value varies depending on the shape and material of the exhaust pipe, it is desirable to select an optimal value according to the characteristics of the exhaust pipe.

  In addition, in the material which forms the exhaust pipe 50, the temperature-viscosity relationship differs between the non-lead (not including lead) material and the lead-containing material. FIG. 10 is a diagram illustrating a temperature-viscosity relationship in a lead-free material and a lead-containing material. As shown in this drawing, up to a predetermined temperature, a non-lead material has a higher viscosity than a lead-containing material. However, if it exceeds a predetermined temperature and melts, the non-lead material has a lower viscosity than the lead-containing material. That is, if the melting is not performed uniformly at the time of chip-off, the exhaust pipe 50 made of a non-lead material is likely to have a larger amount of suction than the exhaust pipe made of a material containing lead. In other words, the exhaust pipe 50 made of a non-lead material needs to be melted more uniformly when the chip is turned off. In this embodiment, since the exhaust pipe 50 can be melted more uniformly, a higher effect can be obtained in the tip-off of the exhaust pipe 50 made of a non-lead material, which is useful.

(Embodiment 2)
In the first embodiment, the configuration in which the gas burner 60 is provided with a total of four gas ejection holes 61, two on each opposing surface, and the exhaust pipe 50 is heated with four flames has been described. However, the present invention is not limited to four gas ejection holes, and may be configured to further include gas ejection holes outside the two adjacent gas ejection holes. In the present embodiment, a configuration in which gas ejection holes are further provided outside the two adjacent gas ejection holes will be described.

  FIG. 11 is a diagram showing an example of the configuration of the gas burner 60a according to Embodiment 2 of the present invention, in which FIG. 11 (a) is a plan view and FIG. 11 (b) is a perspective view. In the present embodiment, the outer diameter and thickness of the exhaust pipe 50, the formation of the gas burner 60a, the gas ejection holes 61a1, 61a2, and the like will be described as in the first embodiment.

  As shown in FIGS. 11 (a) and 11 (b), the gas burner 60a is arranged on both the left and right sides (in the drawing) of the exhaust pipe 50 so that the surfaces provided with the gas ejection holes face each other. Two pairs of gas ejection holes 61a1 provided on the side close to the exhaust pipe 50 and gas ejection ports 61a2 provided outside the adjacent gas ejection holes 61a1 are provided on these surfaces. That is, the gas burner 60a is provided with a total of eight gas ejection holes.

  The gas ejection holes 61a1 and 61a2 have, for example, an inner diameter of about 0.4 mm and are formed in a direction perpendicular to the surface, and the direction of the holes is the gas ejection direction. The four pairs of gas ejection holes 61a1 and 61a2 are disposed at positions facing each other. Further, as shown in FIG. 11B, these eight gas ejection holes 61a1 and 61a2 are arranged so as to be positioned on a virtual plane that is orthogonal to the exhaust pipe 50, as viewed from the side. In some cases, the exhaust pipe 50 can be heated at the same height.

  At this time, each gas ejection hole 61a1 is provided so that the straight line extending in the gas ejection direction from the gas ejection hole 61a1 is in contact with the outer peripheral surface of the exhaust pipe 50 as indicated by a single arrow in the drawing. The ejection direction of the gas ejected from the ejection hole 61a1 is a direction in contact with the outer peripheral surface of the exhaust pipe 50. Further, as indicated by double arrows in the drawing, the distances from the gas ejection holes 61a1 to the outer peripheral surface of the exhaust pipe 50 are equal to each other.

  Further, in the present embodiment, the gas ejection holes 61a2 are provided so that the inner flame formed by the gas ejection holes 61a2 is adjacent to the inner flame formed by the gas ejection holes 61a1. Thus, one flame 62a is formed by the flame caused by the gas ejected from the gas ejection hole 61a1 and the flame caused by the gas ejected from the gas ejection hole 61a2.

  That is, in the configuration shown in the present embodiment, it is possible to generate a flame that is wider than a flame caused by a gas ejected from one gas ejection hole. Therefore, it is possible to have a wider margin for the displacement of the arrangement position of the exhaust pipe 50.

  In the embodiment of the present invention, the gas burner 60 has been described as having two pairs of gas ejection holes 61 on two surfaces facing each other. For example, the gas burner 60 may be configured as shown in FIG. Good. FIG. 12 is a diagram showing an example of another configuration of the gas burner in the embodiment of the present invention. The gas burner 60b is disposed on the left and right sides of the exhaust pipe 50 (in the drawing) so that two pairs of conduits face each other, and each of the conduits is provided with a gas ejection hole 61b. The two pairs of gas ejection holes 61b are arranged such that a line segment connecting the gas ejection holes 61b facing each other is in contact with the outer peripheral surface of the exhaust pipe 50. And each gas ejection hole 61b is provided so that the straight line extended in the gas ejection direction from each gas ejection hole 61b may contact the outer peripheral surface of the exhaust pipe 50, respectively. Therefore, the distance from each gas ejection hole 61b to the outer peripheral surface of the exhaust pipe 50 is equal to each other, and the flame 62 by the gas ejected from each gas ejection hole 61b is directed tangential to the outer peripheral surface of the exhaust pipe 50. Thus, the exhaust pipe 50 can be melted almost uniformly. Therefore, even if it is such a structure, the effect which is not different from the effect mentioned above can be acquired.

  FIG. 13 is a diagram showing an example of still another configuration of the gas burner according to the embodiment of the present invention. As shown in FIG. 13 (a), the gas burner 60c is disposed on the left and right sides of the exhaust pipe 50 (in the drawing) so that the surfaces provided with the gas ejection holes face each other. Each is provided with two gas ejection holes 61c. The two pairs of gas ejection holes 61c are arranged at positions facing each other, and the distances from the gas ejection holes 61c to the outer peripheral surface of the exhaust pipe 50 are equal to each other. However, unlike the configuration shown in FIG. 6, the gas ejection holes 61 c are arranged so that the line segment connecting the gas ejection holes 61 c facing each other passes through the exhaust pipe 50 instead of the outer peripheral surface of the exhaust pipe 50. . However, each gas ejection hole 61c is provided so that a straight line extending in the gas ejection direction from each gas ejection hole 61c is in contact with the outer peripheral surface of the exhaust pipe 50. That is, the flame 62 by the gas ejected from each gas ejection hole 61c is directed tangential to the outer peripheral surface of the exhaust pipe 50, and the exhaust pipe 50 can be melted almost uniformly. Therefore, even if it is such a structure, the effect which is not different from the effect mentioned above can be acquired. As shown in the cross-sectional view of FIG. 13 (b), when forming the gas ejection hole 61c, the side surface of the gas burner 60c is drilled at a predetermined angle, so that the gas ejection direction, That is, the direction of the flame 62 can be set to a desired direction.

  FIG. 14 is a diagram showing an example of still another configuration of the gas burner according to the embodiment of the present invention. The gas burner 60d has four surfaces each provided with a gas ejection port 61d, and these four surfaces consist of two pairs of surfaces facing each other. 14 is different from the gas burner 60 shown in FIG. 6 in that the gas outlets 61d are not arranged at positions facing each other. That is, the distances from the gas outlet 61d to the outer peripheral surface of the exhaust pipe 50 are equal to each other, and the straight lines extending from the gas outlet 61d in the gas jetting direction are in contact with the outer peripheral surface of the exhaust pipe 50 and adjacent to each other. The gas outlets 61d are provided so that the gas jetting directions 61d are substantially perpendicular to each other. Then, the flames 62 of four gases ejected from the gas ejection holes 61d in four different directions are heated so as to surround the periphery of the exhaust pipe 50, and the exhaust pipe 50 can be melted almost uniformly. Therefore, even if it is such a structure, the effect which is not different from the effect mentioned above can be acquired.

  12, 13, and 14, a straight line extending in the gas ejection direction from each gas ejection hole is ± d (d is the exhaust gas) with respect to the outer peripheral surface of the exhaust pipe 50. It is desirable to provide each gas ejection hole so as to fall within the range of the thickness of the tube 50.

  In the embodiment of the present invention, the gas burner 60 has been described as having a structure that does not include a gas ejection hole that ejects gas perpendicular to the outer peripheral surface of the exhaust pipe 50. However, the gas burner 60 includes such a gas ejection hole. It may be a different configuration. However, in that case, gas is not ejected from the gas ejection holes, or the amount of gas ejection is suppressed to a weak flame so as not to make heating non-uniform.

  Further, in the embodiment of the present invention, the usefulness of the effect of the present invention in the configuration in which the exhaust pipe 50 is formed of a material not containing lead has been described. However, the present invention is not limited to this configuration. Even when the exhaust pipe 50 is formed of a material containing the same effect, the same effect can be obtained.

  Further, in the embodiment of the present invention, the configuration for swinging the gas burner is not particularly mentioned, but in addition to the configuration in the embodiment of the present invention described above, by configuring the gas burner to swing, It is also possible to obtain a higher effect.

  In addition, the specific numerical values used in the embodiments of the present invention are merely examples, and can be appropriately set to optimal values according to the panel characteristics, the specifications of the plasma display device, and the like. desirable.

  The chip-off gas burner and panel manufacturing apparatus and panel of the present invention can uniformly melt the exhaust pipe so that the shape of the exhaust pipe front-end after chip-off is uniform. Since the occurrence of cracks leading to leakage can be reduced, it is useful as a chip-off gas burner, panel manufacturing apparatus, and panel.

The disassembled perspective view which shows the structure of the panel in Embodiment 1 of this invention. Schematic showing a state of sealing between the front plate and the back plate and sealing between the exhaust pipe and the back plate in the first embodiment of the present invention. The figure which shows the outline of the chip | tip off in Embodiment 1 of this invention (A) is a top view of the panel in Embodiment 1 of this invention, (b) is sectional drawing in the AA of the panel shown to Fig.4 (a). Panel electrode arrangement diagram of embodiment 1 of the present invention Schematic showing the state of exhaust pipe tip-off using the gas burner in Embodiment 1 of the present invention The figure which showed an example of the structure of the gas burner in Embodiment 1 of this invention Schematic showing how the exhaust pipe is heated by the gas burner in Embodiment 1 of the present invention Schematic which shows the shape of the exhaust pipe front-end | tip part after the tip-off in Embodiment 1 of this invention Diagram showing temperature-viscosity relationship for non-lead and lead-containing materials The figure which showed an example of the structure of the gas burner in Embodiment 2 of this invention The figure which showed an example of the other structure of the gas burner in embodiment of this invention The figure which showed an example of the further another structure of the gas burner in embodiment of this invention The figure which showed an example of the further another structure of the gas burner in embodiment of this invention The figure which showed the state of tip-off using the gas burner by a prior art Schematic showing an example of the shape of the exhaust pipe tip when the exhaust pipe is chipped off without being uniformly melted

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Panel 21 (made of glass) Front plate 22 Scan electrode 23 Sustain electrode 24, 33 Dielectric layer 25 Protective layer 28 Display electrode pair 31 Back plate 32 Data electrode 34 Partition 35 Phosphor layer 40 Exhaust pore 41, 41a, 41b Sealing material 42 Tablet 43 Hole 50 Exhaust pipe 51 Exhaust pipe head 60, 60a, 60b, 60c, 60d Gas burner 61, 61a, 61b, 61c, 61d Gas ejection hole 62 Flame

Claims (7)

A gas burner for chip-off having a plurality of gas ejection holes and configured to heat and melt an exhaust pipe of a plasma display panel arranged at a predetermined position by a gas flame,
A gas burner for chip-off, wherein the gas ejection hole is configured such that a straight line extending in the gas ejection direction from the gas ejection hole is in contact with the outer peripheral surface of the exhaust pipe. It is characterized by comprising at least four gas ejection holes provided so as to be in two pairs facing each other, and configured such that the distances from the four gas ejection holes to the exhaust pipe are equal to each other. The gas burner for chip-off according to claim 1. 3. The chip-off gas burner according to claim 2, wherein the gas ejection holes facing each other are provided so as to be arranged on the same straight line in contact with the outer peripheral surface of the exhaust pipe. The four gas ejection holes have a straight line extending in the gas ejection direction from each gas ejection hole within a range of ± d (d is the thickness of the exhaust pipe) with respect to the outer peripheral surface of the exhaust pipe. 2. The gas burner for chip-off according to claim 1, wherein the gas burner is provided. Fixing means for fixing the plasma display panel;
An exhaust pipe head for exhausting from the plasma display panel and introducing a discharge gas into the plasma display panel through an exhaust pipe provided in the plasma display panel;
Heating means for heating and melting the exhaust pipe,
A plasma display panel manufacturing apparatus comprising the chip-off gas burner according to any one of claims 1 to 4 as the heating means. A front plate having a display electrode pair consisting of a scan electrode and a sustain electrode;
A back plate having a data electrode and provided with pores for exhaust and discharge gas introduction,
The display electrode pair and the data electrode are opposed to each other across the discharge space, and the outer periphery thereof is hermetically sealed,
A plasma display panel in which an exhaust pipe for introducing exhaust gas and discharge gas is disposed so as to cover the pores and sealed to the back plate,
The exhaust pipe is tipped off by the tip-off gas burner according to any one of claims 1 to 4, and a suction amount into the exhaust pipe at a melted and closed portion is 1.5 mm. A plasma display panel formed as follows. 7. The plasma display panel according to claim 6, wherein the exhaust pipe is made of a glass component not containing lead.

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