JP2010062002A - Exhaust pipe for plasma display panel, and manufacturing method for plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To uniformly heat a plasma display panel by reducing heating variations in an exhausting process in manufacturing processes of the plasma display panel; and to reduce impure gas and impurities remaining in the plasma display panel. <P>SOLUTION: In an exhaust pipe 50 for a plasma display panel 10 wherein one end is glued on a rear plate 30 so as to cover an exhaust hole arranged on the rear plate 30 and the other end is mounted on an exhaust head 53 and a sealing section is sealed after introducing a discharge gas in the plasma display panel 10, when one end is glued on the rear plate 30, the exhaust pipe 50 is formed to have a shape with at lease one bending section so as to make the exhaust head 53 mounted on the other end to be arranged outside a zone where a heater 73 for heating the plasma display panel 10 and the rear plate 30 are faced each other. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a plasma display panel exhaust pipe and a plasma display panel manufacturing method used in a manufacturing process of a plasma display device used for a wall-mounted television or a large monitor.

  A typical AC surface discharge type panel as a plasma display panel (hereinafter abbreviated as “panel”) has a large number of discharge cells formed between a front plate and a back plate arranged to face each other. In the front plate, a plurality of display electrode pairs each consisting of a pair of scan electrodes and sustain electrodes are formed in parallel with each other on the front glass substrate, and a dielectric layer and a protective layer are formed so as to cover the display electrode pairs. Yes. In the back plate, a plurality of parallel data electrodes are formed on a back glass substrate, a dielectric layer is formed so as to cover the data electrodes, and a plurality of data electrodes arranged in parallel with the data electrodes on the dielectric layer. A partition wall is formed, and a phosphor layer is formed on the surface of the dielectric layer and the side surface of the partition wall. Then, the front plate and the back plate are arranged opposite to each other so that the display electrode pair and the data electrode are three-dimensionally crossed and sealed, and a discharge gas containing, for example, 5% xenon is enclosed in the internal discharge space. Has been. Here, a discharge cell is formed at a portion where the display electrode pair and the data electrode face each other. In the panel having such a configuration, ultraviolet rays are generated by gas discharge in each discharge cell, and the phosphors of red (R), green (G) and blue (B) colors are excited and emitted by the ultraviolet rays, thereby performing color display. It is carried out.

  As a method for driving the panel, a subfield method, that is, a method of performing gradation display by combining subfields to emit light after dividing one field into a plurality of subfields is generally used.

  Each subfield has an initialization period, an address period, and a sustain period. During the initializing period, initializing discharge is generated, and wall charges necessary for the subsequent addressing operation are formed on each electrode, and priming particles (excited particles for generating addressing discharge) for stably generating the address discharge. ).

  In the address period, a scan pulse voltage is applied to the scan electrode and an address pulse voltage is selectively applied to the data electrode to selectively generate an address discharge in a discharge cell to be displayed to form a wall charge (hereinafter referred to as a wall charge). This operation is also referred to as “writing”). In the sustain period, a sustain pulse voltage is alternately applied to the display electrode pair composed of the scan electrode and the sustain electrode, and a sustain discharge is generated in the discharge cell that has caused the address discharge, and the phosphor layer of the corresponding discharge cell emits light. To display an image.

  In the process of manufacturing such a panel, on the surface of the front glass substrate and the back glass substrate, through a thick film forming step that repeats the steps of printing, drying, and firing, each electrode, dielectric layer, phosphor layer, A substrate forming step for sequentially forming each structure necessary for the panel configuration such as a partition wall (hereinafter referred to as “panel structure”), and a front plate and a back plate on which the panel structure is formed are arranged to face each other. There are an overlapping process, a sealing process for sealing the periphery of the panel, an exhaust process for exhausting impure gas inside the panel, a discharge gas introducing process for introducing a discharge gas into the panel, and the like.

  In the sealing step, a sealing member made of, for example, low-melting glass is formed around the front plate and the rear plate completed through the substrate forming step, and the front plate and the rear plate are aligned and opposed to each other. Is heated while being gripped by a gripping member such as a metal clip. As a result, the sealing member is softened, and the front plate and the rear plate are sealed with the discharge space interposed therebetween to form a panel.

  In this sealing process, the impurity gas inside the panel is exhausted in the subsequent exhaust process, and the exhaust hole formed in the back plate for introducing the discharge gas into the panel in the discharge gas introducing process is the same as described above. The glass exhaust pipe is bonded by the sealing member.

  In the exhaust process, the impure gas inside the panel is exhausted. FIG. 10 is a schematic view when performing an exhausting process in the manufacturing process of the panel 101 according to the prior art. In the exhaust process, first, the exhaust head 105 is connected to the other end of the exhaust pipe 104 whose one end is bonded to the panel 101 so as to cover the exhaust hole of the panel 101. The exhaust head 105 connects an exhaust pipe 104 to a vacuum exhaust device (not shown) that exhausts impure gas from the inside of the panel 101 and a discharge gas introduction device (not shown) that introduces a discharge gas into the panel 101. Have a function for.

  A heater 102 is disposed on the front plate side of the panel 101 and a heater 103 is disposed on the rear plate side of the panel 101 so as to face the panel 101. The panel 101 is heated and heated by the heaters 102 and 103 while being vacuumed. Activate the exhaust system. As described above, in the exhaust process, the panel 101 is evacuated through the exhaust hole, the exhaust pipe 104 and the exhaust head 105 while the panel 101 is heated by the heating means such as the heaters 102 and 103, and the impure gas is removed from the inside of the panel 101. To do.

  When the exhaust of the impure gas is completed, in the subsequent discharge gas introduction process, the discharge gas introduction device is operated to introduce the discharge gas into the panel 101 through the exhaust head 105, the exhaust pipe 104, and the exhaust hole. When the discharge gas inside the panel 101 reaches a predetermined pressure, the exhaust pipe 104 is melted and sealed, the exhaust holes are sealed, and the discharge space is sealed (see, for example, Patent Document 1).

  In order to reduce the concentration of the impure gas remaining inside the panel 101, a technique for forming an adsorption film that adsorbs the impure gas on the surface of the partition wall in the discharge cell has been proposed (see, for example, Patent Document 2). ).

Also disclosed is a technique that can prevent the discharge gas from leaking from the inside of the panel 101 without causing unnecessary stress in the exhaust pipe and its sealing portion in the exhaust process and the discharge gas introduction process. (For example, refer to Patent Document 3).
JP 2003-331725 A JP 2003-303555 A JP 2008-171791 A

The reason for exhausting while heating the panel 101 in the exhaust process is as follows. In the substrate forming step, a glass powder is mixed with an organic solvent, an organic binder or the like to form a paste, which is coated, dried and fired to generate a dielectric layer. At the time of firing, the glass powder is melted, and the organic binder and the like are thermally decomposed to form a dielectric layer. When the organic binder and the like are thermally decomposed, an impure gas having a property of inhibiting discharge ( For example, H ₂ O, CO ₂ , or organic gases such as hydrocarbon gas) are generated in large quantities.

  If this impure gas remains in the discharge space and enters the discharge gas, the discharge start voltage will rise and the discharge characteristics will become difficult to occur, resulting in variations in emission luminance, display flicker, etc. The image display quality of the panel 101 deteriorates. Thus, since the impure gas remaining in the discharge space is one of the main causes for deteriorating the image display quality, in the exhaust process, the panel 101 is exhausted by the vacuum exhaust device, and the impure gas generated during firing is removed. Remove.

  At this time, impurities remaining without being gasified exist in the panel structure and the discharge space formed on the front plate and the back plate. And it is difficult to remove the impurities only by vacuum evacuation at room temperature, the impurities that could not be removed and remained in the discharge space gradually gasify while the discharge is repeated in the discharge space, It becomes an impure gas and gets mixed into the discharge gas.

  Therefore, in the exhaust process, impurities are gasified and removed by evacuating the panel 101 while heating.

  However, in the exhaust process according to the prior art, as shown in FIG. 10, since the exhaust head 105 is disposed between the heater 103 and the panel 101, the heat generated by the heater 103 is blocked by the exhaust head 105. An area that cannot be transmitted directly has occurred in the panel 101. That is, the panel 101 has uneven heating, and there is a possibility that a region where impurities are not sufficiently gasified and remains is generated in the panel 101.

  The present invention has been made in view of such a problem, and in the exhaust process in the panel manufacturing process, when the panel is heated with a heater, the heating unevenness can be reduced and the panel can be heated uniformly. It is an object of the present invention to provide a panel exhaust pipe and a panel manufacturing method capable of reducing impure gas and impurities remaining in the panel.

  The panel exhaust pipe of the present invention is used for a panel having a back plate provided with exhaust holes for impure gas exhaust and discharge gas introduction, and one end is bonded to the panel so as to cover the exhaust holes, The other end is attached to an exhaust head used for exhausting impure gas and introducing discharge gas, and is a panel exhaust pipe for sealing the sealing portion after introducing discharge gas into the panel. When one end of the tube is bonded to the panel, the exhaust head attached to the other end is disposed outside the region where the panel and the heater that heats the panel when impure gas is exhausted are opposed to each other. Further, it is characterized by having a shape having at least one bent portion.

  As a result, in the exhaust process in the panel manufacturing process, when the panel is heated by the heater, a region where the heat is blocked by the exhaust head is not generated, so that heating unevenness is reduced and the panel is heated uniformly. It is possible to reduce the impurity gas and impurities remaining in the panel.

  The panel exhaust pipe may be formed of a glass component not containing lead.

  The panel manufacturing method of the present invention is such that one end of the exhaust pipe is bonded to the panel so as to cover the exhaust hole formed in the panel, and the exhaust head is attached to the other end of the exhaust pipe, A panel manufacturing method for exhausting impure gas inside a panel through an exhaust hole, an exhaust pipe, and an exhaust head while heating the panel with a heater, the exhaust head attached to the other end of the exhaust pipe, Impurity gas is exhausted using an exhaust pipe having at least one bent portion so that the panel and the heater are arranged outside the facing region.

  As a result, in the exhaust process in the panel manufacturing process, when the panel is heated by the heater, a region where the heat is blocked by the exhaust head is not generated, so that heating unevenness is reduced and the panel is heated uniformly. It is possible to reduce the impurity gas and impurities remaining in the panel.

  According to the present invention, in the exhaust process in the panel manufacturing process, when the panel is heated with a heater, the panel can be heated uniformly by reducing heating unevenness, and the impurity gas and impurities remaining in the panel can be reduced. It is possible to provide a panel exhaust pipe and a panel manufacturing method that can be reduced.

  Hereinafter, a plasma display device manufactured using a panel exhaust pipe according to an embodiment of the present invention will be described with reference to the drawings.

(Embodiment)
FIG. 1 is an exploded perspective view showing the structure of panel 10 according to an embodiment of the present invention. The front plate 20 covers the plurality of display electrode pairs 24 formed of the scanning electrodes 22 and the sustain electrodes 23 formed on the front glass substrate 21, a light shielding layer (not shown), the display electrode pairs 24 and the light shielding layer. The dielectric layer 25 is formed, and the protective layer 26 is formed on the dielectric layer 25.

  The protective layer 26 has been used as a panel material in order to lower the discharge start voltage in the discharge cell, and has a large secondary electron emission coefficient and durability when neon (Ne) and xenon (Xe) gas is sealed. It is made of a material mainly composed of magnesium oxide (MgO) having excellent properties.

  The back plate 30 includes a plurality of data electrodes 32 formed on the back glass substrate 31, a dielectric layer 33 formed so as to cover the data electrodes 32, and a grid-like partition wall 34 formed thereon. A phosphor layer 35 that emits light of each color of red (R), green (G), and blue (B) is provided on the side surface of the partition wall 34 and on the dielectric layer 33.

  The front plate 20 and the back plate 30 are arranged to face each other so that the display electrode pair 24 and the data electrode 32 intersect each other with a minute discharge space interposed therebetween, and the outer peripheral portion thereof is sealed with a sealing material such as glass frit. Has been. A mixed gas of neon and xenon is sealed as a discharge gas in the internal discharge space. In the present embodiment, a discharge gas having a xenon partial pressure of about 10% is used in order to improve luminous efficiency. The discharge space is partitioned into a plurality of sections by partition walls 34, and discharge cells are formed at the intersections between the display electrode pairs 24 and the data electrodes 32. These discharge cells discharge and emit light to display an image.

  Note that the structure of the panel 10 is not limited to the above-described structure, and for example, the panel 10 may include a stripe-shaped partition wall. Further, the mixing ratio of the discharge gas is not limited to the above-described numerical values, and may be other mixing ratios.

  FIG. 2 is an electrode array diagram of panel 10 according to the embodiment of the present invention. The panel 10 includes n scan electrodes SC1 to SCn (scan electrodes 22 in FIG. 1) and n sustain electrodes SU1 to SUn (sustain electrodes 23 in FIG. 1) that are long in the row direction. M data electrodes D1 to Dm (data electrodes 32 in FIG. 1) that are long in the column direction are arranged. A discharge cell is formed at a portion where one pair of scan electrode SCi (i = 1 to n) and sustain electrode SUi intersects one data electrode Dk (k = 1 to m), and the discharge cell is in the discharge space. M × n are formed. A region where m × n discharge cells are formed becomes a display region of the panel 10.

  Panel 10 in the present embodiment is divided into a subfield method, that is, one field is divided into a plurality of subfields on the time axis, luminance weights are set for each subfield, and each discharge cell is set for each subfield. It is assumed that gradation display is performed by controlling light emission / non-light emission.

  In this subfield method, for example, one field is composed of eight subfields (first SF, second SF,..., Eighth SF), and each subfield is 1, 2, 4, 8, 16, 32, A configuration having luminance weights of 64 and 128 can be adopted. In addition, in the initializing period of one subfield among a plurality of subfields, an all-cell initializing operation for generating an initializing discharge in all discharge cells is performed (hereinafter, the subfield for performing the all-cell initializing operation is referred to as a subfield for performing all-cell initializing operations). In the initializing period of other subfields, a selective initializing operation for selectively generating initializing discharge is performed for the discharge cells that have undergone sustain discharge (hereinafter referred to as “all-cell initializing subfield”). The subfield that performs the selective initialization operation is referred to as “selective initialization subfield”), and it is possible to reduce light emission not related to gradation display as much as possible and improve the contrast ratio.

  However, in the present embodiment, the number of subfields and the luminance weight of each subfield are not limited to the above values, and the subfield configuration may be switched based on an image signal or the like.

  Next, a method for manufacturing the panel 10 configured as described above will be described.

  First, on the front glass substrate 21, the scan electrode 22, the sustain electrode 23, and the light shielding layer are formed. These scan electrode 22 and sustain electrode 23 are composed of a transparent electrode and a metal bus electrode, and the transparent electrode and the metal bus electrode are formed by forming a predetermined pattern using a photolithography method or the like (hereinafter referred to as a predetermined electrode). Forming the pattern is also referred to as “patterning”). The transparent electrode is formed using a thin film process or the like, and the metal bus electrode is solidified by baking a paste containing a silver material at a predetermined temperature. Similarly, the light-shielding layer is also formed with a predetermined pattern by a screen printing method using a paste containing a black pigment, a method in which a black pigment is formed on the entire surface of the front glass substrate 21, and then patterning using a photolithography method. It is formed by firing.

  Thereafter, a dielectric paste is applied on the front glass substrate 21 by a die coating method or the like so as to cover the scanning electrode 22, the sustain electrode 23, and the light shielding layer, thereby forming a dielectric paste layer (dielectric material layer). After applying the dielectric paste, the surface of the applied dielectric paste is flattened by leaving it for a predetermined time. Thereafter, the dielectric paste layer is formed by baking and solidifying the dielectric paste layer to cover the scan electrode 22, the sustain electrode 23, and the light shielding layer. The dielectric paste is a paint containing a dielectric material such as glass powder, a binder and a solvent. Next, a protective layer 26 made of magnesium oxide (MgO) is formed on the dielectric layer 25 by vacuum evaporation. Through the above steps, a predetermined panel structure (a display electrode pair 24 including a scanning electrode 22 and a sustain electrode 23, a light shielding layer, a dielectric layer 25, and a protective layer 26) is formed on the front glass substrate 21. Complete.

  The back plate 30 is formed as follows. First, a method for screen-printing a paste containing a silver material on the back glass substrate 31 or a method for forming a predetermined pattern using a photolithography method after forming a metal film on the entire surface, etc. A data layer is formed by forming a material layer to be a constituent and firing it at a predetermined temperature.

  Next, a dielectric paste is applied on the rear glass substrate 31 on which the data electrodes 32 are formed by a die coating method or the like so as to cover the data electrodes 32 to form a dielectric paste layer. Thereafter, the dielectric layer 33 is formed by firing the dielectric paste layer. The dielectric paste is a paint containing a dielectric material such as glass powder, a binder and a solvent.

  Thereafter, a partition wall forming paste containing a partition wall material is applied on the dielectric layer 33 and patterned into a predetermined shape to form a partition wall material layer, and the partition wall 34 is formed by firing it. Here, as a method of patterning the partition wall forming paste applied on the dielectric layer 33, a photolithography method or a sand blast method can be used.

  Then, a phosphor layer containing a phosphor material is applied to the rear glass substrate 31 on which the barrier ribs 34 are formed on the dielectric layer 33 between the adjacent barrier ribs 34 and on the side surfaces of the barrier ribs 34, and then fired. 35 is formed. Through the above steps, predetermined panel structures (data electrodes 32, dielectric layers 33, barrier ribs 34, phosphor layers 35) are formed on the back glass substrate 31, and the back plate 30 is completed.

  And the temperature which can apply | coat a sealing material to the predetermined | prescribed position around the front board 20 or the back board 30 using a coating apparatus provided with thick film printing, an inkjet, or a dispenser, and can burn the resin component contained in a sealing material Then, the front plate 20 or the back plate 30 is heated and the front plate 20 or the back plate 30 is temporarily fired. Thereafter, the front panel 20 and the rear panel 30 are arranged to face each other so that the electrode forming surface faces each other, and the panel 10 is assembled. Subsequently, the process proceeds to a step of hermetically sealing the periphery of the front plate 20 and the rear plate 30 and a step of hermetically sealing the exhaust pipe for introducing exhaust gas and discharge gas (so-called chip pipe) with a sealing material. Then, after evacuating the panel 10 through the exhaust pipe and introducing the discharge gas into the panel 10, the exhaust pipe is heated and melted to close and seal the exhaust pipe. This exhaust pipe may be formed from a glass component that does not contain a lead component, and can be melted by heating at a temperature equal to or higher than the softening point temperature. At this time, in melting, it is desirable to heat at a temperature 200 ° C. or higher than the softening point temperature.

  FIG. 3 is a plan view and a cross-sectional view of panel 10 according to the embodiment of the present invention. 3A is a plan view of the panel 10 according to the embodiment of the present invention, and FIG. 3B is a cross-sectional view taken along the line AA of the panel 10 shown in FIG.

  As shown in FIG. 3, the front plate 20 and the back plate 30 are arranged to face each other so that the display electrode pair 24 and the data electrode 32 are orthogonal to each other, and the periphery thereof is hermetically sealed with a sealing material 41. The back plate 30 is provided with exhaust holes 40, and the exhaust pipe 50 and the back plate 30 disposed so as to cover the exhaust holes 40 are hermetically sealed by a tablet 42 which is a sealing material. A discharge gas introduced through the exhaust pipe 50 is sealed at a predetermined pressure in the discharge space inside the panel 10, and the exhaust pipe 50 used for introducing the exhaust gas and the discharge gas heats the sealing portion. And then closed (hereinafter also referred to as “chip-off”).

  Here, the exhaust pipe 50 in the present embodiment will be described. FIG. 4 is a schematic view showing the shape of the exhaust pipe 50 in one embodiment of the present invention. As shown in FIG. 4, the exhaust pipe 50 in the present embodiment is formed in a shape having two bent portions, and covers one end portion, that is, the exhaust hole bonding portion 51 so as to cover the exhaust hole 40. It adheres to the back plate 30 and the other end, that is, the exhaust head mounting portion 52 is mounted on the exhaust head.

  The exhaust pipe 50 has the shape shown in FIG. 4 because the exhaust head mounted on the exhaust head mounting portion 52 when the exhaust hole bonding portion 51 is bonded to the back plate 30 is used for the panel 10 in the exhaust process. This is because the heater for heating the panel and the panel 10 are arranged outside the facing region. When the chip is turned off after the introduction of the discharge gas, the sealing part set near the exhaust hole bonding part 51 is sealed off. It is the same as the later shape.

  FIG. 5 is a schematic diagram showing a state of sealing between the front plate 20 and the back plate 30 and sealing between the exhaust pipe 50 and the back plate 30 in the embodiment of the present invention. First, as shown in FIG. 5A, a sealing material 41 is applied using an application device (not shown) provided with a dispenser. At this time, the sealing material 41 b is applied to a predetermined position around the front plate 20, and the sealing material 41 a is applied to a predetermined position around the back plate 30. As the sealing material 41, for example, a paste-like low melting point frit glass can be used.

  In addition, when applying the sealing materials 41a and 41b, thick film printing or an ink jet coating apparatus can be used in addition to a coating apparatus provided with a dispenser. Alternatively, a method of adhering sealing materials 41a and 41b formed by giving adhesiveness to a sheet-like base material with a predetermined thickness and shape to a predetermined position without using thick film printing or a coating apparatus is used. You can also. Moreover, it is good also as a structure which apply | coats or adhere | attaches sealing material 41a, 41b only to either one of the front plate 20 or the backplate 30. FIG.

  After the sealing material 41 is dried for a certain period of time, the sealing material 41 is temporarily fired at a predetermined temporary firing temperature (for example, about 350 ° C.) lower than the sealing temperature. The front plate 20 and the back plate 30 are arranged to face each other so that the data electrodes 32 of the face plate 30 intersect with each other, and are fixed using a fixing jig (not shown) as fixing means.

  Next, the process moves to a sealing step for sealing the exhaust pipe 50 to the back plate 30. In this sealing step, a sealing material is formed in a predetermined shape in advance (for example, tablet 42 shown in the drawing) and used as a sealing material for the exhaust pipe 50. As a material of the tablet 42, for example, a low melting point frit glass can be used.

  Then, the center of the exhaust hole 40 provided at a predetermined position near the corner of the back plate 30 and the center of the hole 43 at the center of the tablet 42 are placed together. At this time, positioning is performed so that the center of the opening of the exhaust hole bonding portion 51 of the exhaust pipe 50 and the center of the exhaust hole 40 substantially coincide. Further, when the exhaust head 53 is mounted on the exhaust head mounting portion 52 of the exhaust pipe 50, the exhaust head 53 is disposed outside the region where the heater for heating the panel 10 and the panel 10 face each other in the exhaust process. Next, the mounting direction of the exhaust pipe 50 is determined. In this way, the parts are assembled and fixed by pressing with another fixing jig (not shown) so that the center of each part does not shift.

  Next, the front plate 20, the back plate 30 and the exhaust pipe 50 fixed with a fixing jig are installed in a firing furnace (not shown), and at a sealing temperature (for example, about 450 ° C.) higher than the temporary firing temperature. The sealing material 41 and the tablet 42 are melted by heating. Thereafter, by cooling and solidifying, the hermetic seal between the front plate 20 and the rear plate 30 and the hermetic seal between the exhaust pipe 50 and the rear plate 30 are performed. This state is shown in FIG. FIG. 5B schematically shows a state in which the front plate 20 and the back plate 30 are hermetically sealed around the periphery, and the exhaust pipe 50 and the back plate 30 are hermetically sealed. The softening point temperature of the exhaust pipe 50 is, for example, about 630 ° C., which is higher than the sealing temperature here (for example, about 450 ° C.), so that the exhaust pipe 50 is not softened by this firing.

  Next, the exhaust head mounting portion 52 of the exhaust pipe 50 is connected to an exhaust head 53 for introducing exhaust gas and discharge gas. The exhaust head 53 connects the exhaust pipe 50 with a vacuum exhaust device (not shown) that exhausts impure gas from the inside of the panel 10 and a discharge gas introduction device (not shown) that introduces a discharge gas into the panel 10. The impure gas inside the panel 10 is evacuated through the exhaust pipe 50 and the exhaust head 53.

  FIG. 6 is a schematic view when performing the exhausting process of panel 10 in one embodiment of the present invention. In the exhaust process, the heater 72 is arranged to face the front plate 20 and the heater 73 is arranged to face the back plate 30 so that the entire panel 10 can be heated by the heaters 72 and 73. Then, while the entire panel 10 is heated by the heaters 72 and 73, a vacuum exhaust device (not shown) provided at the tip of the exhaust head 53 is operated to perform vacuum exhaust. As described above, in the exhaust process, the panel 10 is evacuated through the exhaust hole 40, the exhaust pipe 50 and the exhaust head 53 while the panel 10 is heated by the heaters 72 and 73 which are heating means, and the impure gas is discharged from the inside of the panel 10. Remove.

  At this time, in the exhaust process according to the prior art, the exhaust head 105 is disposed between the heater 103 and the panel 101 as described above, so that the heat generated by the heater 103 is directly transmitted to the exhaust head 105. The panel 101 has a region where the heat generated by the heater 103 is not directly transmitted. As a result, heating unevenness may occur, and there may be a region in the panel 101 where impurities are not sufficiently gasified and remain.

  However, in the exhaust process performed using the exhaust pipe 50 in the present embodiment, as shown in FIG. 6, the exhaust pipe 50 has a bent portion, so that the heater 73 and the panel 10 face each other. An exhaust head 53 can be disposed outside. Therefore, the heat generated by the heater 73 can be uniformly transmitted to the back plate 30 without being blocked by the exhaust head 53. That is, in the exhaust process in the present embodiment, the panel 10 can be heated uniformly by reducing heating unevenness, so that the impurity gas and impurities can be removed with higher accuracy, and the impurity remaining in the panel 10 can be removed. Gases and impurities can be reduced.

  After the exhaust is finished, a discharge gas introduction device (not shown) provided at the tip of the exhaust head 53 is operated, and a discharge gas containing neon, xenon, etc. is provided via the exhaust head 53 and the exhaust pipe 50. Is introduced into the panel 10 at a predetermined pressure (for example, in the case of a Ne—Xe mixed gas, a pressure of about 530 hPa to 800 hPa).

  Finally, a predetermined portion (sealing portion) of the exhaust pipe 50 is locally heated and melted by using a heating means such as a gas burner, and the blocked portion is cut. In this way, the exhaust pipe 50 is sealed and hermetically sealed (chip off).

  As described above, according to the present embodiment, since the exhaust pipe 50 has a shape having two bent portions, when the exhaust head 53 is mounted on the exhaust head mounting portion 52 in the exhaust process, The exhaust head 53 can be disposed outside the region where the heater 73 and the panel 10 face each other. Thus, the heat generated by the heater 73 is not blocked by the exhaust head 53, and the back plate 30 can be heated uniformly. Therefore, in the exhaust process, it is possible to uniformly heat the panel 10 by reducing heating unevenness, to remove the impure gas and impurities more accurately, and to reduce the impure gas and impurities remaining in the panel 10. It becomes possible.

  In this embodiment, the exhaust pipe 50 having two bent portions is described as an example. However, if the exhaust pipe has a shape having at least one bent portion, the exhaust head is out of the region. It is possible to arrange in FIG. 7 is a schematic view showing another example of the shape of the exhaust pipe according to the embodiment of the present invention, and is a schematic view when the exhaust process is performed using the exhaust pipe 54. Although the exhaust pipe 54 shown in FIG. 7 has a shape having one bent portion, the exhaust head 53 connected to the exhaust pipe 54 is connected to the heater 73 and the panel 10 even if the exhaust pipe 54 has a shape like the exhaust pipe 54, for example. Can be placed outside the opposing areas. In addition, an exhaust pipe having a shape with only one bent portion has an advantage that it is easier to manufacture than an exhaust pipe having two or more bent portions.

  Further, in the present embodiment, the exhaust pipe 50 having a shape in which the bent portion is bent at an angle of about 90 degrees has been described as an example, but the bent portion is not limited to this angle in the present invention. . For example, the exhaust pipe in the present invention may have a shape having a bent portion bent at an acute angle of more than 90 degrees. FIG. 8 is a schematic view showing still another example of the shape of the exhaust pipe in the embodiment of the present invention, and is a schematic view when an exhaust process is performed using the exhaust pipe 55. The exhaust pipe 55 shown in FIG. 8 has two bent portions so as to have a shape similar to the letter “Z” of the alphabet, and each bent portion is bent at an acute angle of more than 90 degrees. For example, even with an exhaust pipe having such a shape, the same effect as described above can be obtained. Also, an exhaust pipe having a bent portion bent at an acute angle of more than 90 degrees has a sealing portion at the time of chip-off compared to an exhaust pipe bent at an angle of 90 degrees or wider than that. It was confirmed that effects such as easy sealing were obtained.

  FIG. 9 is a schematic view showing still another example of the shape of the exhaust pipe in the embodiment of the present invention, and is a schematic view when the exhaust process is performed using the exhaust pipe 56. Although the exhaust pipe 56 shown in FIG. 9 has a shape having one bent portion, the bent portion is bent at an acute angle of more than 90 degrees. For example, even with an exhaust pipe having such a shape, the same effect as described above can be obtained. In addition to the advantage that the exhaust pipe having such a shape is easier to manufacture than an exhaust pipe having two or more bent portions, it also has the effect of easily sealing the sealing portion at the time of chip-off. Obtainable.

  In the exhaust process of the panel manufacturing process according to the present invention, when the panel is heated with a heater, the unevenness of heating can be reduced and the panel can be heated uniformly, so that impurities and impurities remaining in the panel are reduced. This is useful as a panel exhaust pipe and a method for manufacturing a panel.

The disassembled perspective view which shows the structure of the panel in one embodiment of this invention. Electrode arrangement of the panel Plan view and sectional view of the panel Schematic which shows the shape of the exhaust pipe in one embodiment of this invention Schematic showing the state of sealing between the front plate and the back plate and sealing between the exhaust pipe and the back plate in one embodiment of the present invention Schematic when performing the exhaust process of the panel in one embodiment of the present invention Schematic which shows the other example of another shape of the exhaust pipe in one embodiment of this invention Schematic which shows another example of another shape of the exhaust pipe in one embodiment of this invention. Schematic which shows another example of another shape of the exhaust pipe in one embodiment of this invention. Schematic when performing the exhaust process in the panel manufacturing process according to the prior art

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,101 Panel 20 Front plate 21 Front glass substrate 22 Scan electrode 23 Sustain electrode 24 Display electrode pair 25, 33 Dielectric layer 26 Protective layer 30 Back plate 31 Back glass substrate 32 Data electrode 34 Partition 35 Phosphor layer 40 Exhaust hole 41 , 41a, 41b Sealing material 42 Tablet 43 Air holes 50, 54, 55, 56, 104 Exhaust pipe 51 Exhaust hole bonding part 52 Exhaust head mounting part 53, 105 Exhaust head 72, 73, 102, 103 Heater

Claims (3)

Used for a plasma display panel having a back plate provided with exhaust holes for exhaust of impure gas and introduction of discharge gas, one end is bonded to the plasma display panel so as to cover the exhaust holes, and the other end A plasma display panel exhaust pipe that is attached to an exhaust head used for exhausting the impure gas and introducing the discharge gas, and sealing the sealing portion after introducing the discharge gas into the plasma display panel There,
The exhaust pipe has a heater that heats the plasma display panel when the impure gas is exhausted when the exhaust head attached to the other end when the one end is bonded to the plasma display panel; An exhaust pipe for a plasma display panel, characterized by having a shape having at least one bent portion so as to be disposed outside a region facing the plasma display panel. 2. The exhaust pipe for a plasma display panel according to claim 1, wherein the exhaust pipe is made of a glass component not containing lead. Adhering one end of the exhaust pipe to the plasma display panel so as to cover the exhaust hole formed in the plasma display panel, and mounting an exhaust head on the other end of the exhaust pipe, A method for manufacturing a plasma display panel in which an impurity gas inside the plasma display panel is exhausted through the exhaust hole, the exhaust pipe, and the exhaust head while being heated by a heater,
The exhaust pipe having at least one bent portion so that the exhaust head attached to the other end of the exhaust pipe is disposed outside a region where the plasma display panel and the heater face each other. A method for manufacturing a plasma display panel, characterized in that the impure gas is exhausted using a gas.

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