JP2007301676A - Double-sided polishing apparatus with workpiece release device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent washing water and slurry from dispersing from a slurry trough upon supplying a release gas, so as to prevent work environments from being deteriorated in a double-sided polishing apparatus with a work release device. <P>SOLUTION: The double-sided polishing apparatus, comprising a sun gear 2, internal gear 3, carrier 81, upper and lower surface plates 5, 4, slurry supply device 63, washing liquid supply device, and release device by gas pressure, has a backflow prevention mechanism 64 having a slurry nozzle 61 with an idling ball 93. With this constitution, when supplying the release gas from a release nozzle 71, even passing the release gas through between the upper surface plate 5 and the lower surface plate 4 to reach the slurry nozzle 61, the release gas pushes up the idling ball 93, so that the idling ball 93 is brought into contact with a conical wall to block the gas stream. As a result, the release gas does not go upward further, so that the gas does not blow out of the slurry trough 62, thus preventing the work environments from being deteriorated. Furthermore, release ability due to blowing out of blown gas from a nozzle for slurry does not deteriorate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention is a double-side polishing apparatus for performing double-side polishing on a plate-like workpiece such as a semiconductor wafer using a slurry, and when the upper surface plate is pulled up for unloading after polishing, the semiconductor wafer ( The present invention relates to a double-side polishing apparatus provided with a workpiece peeling device for preventing a workpiece from adhering to an upper surface plate.

  The double-side polishing device is provided with a lower surface plate, a central sun gear, an internal gear on the outer periphery, and a driving device for driving them, and a carrier meshes with the sun gear and the internal gear. The plate-like workpiece (semiconductor wafer) is held in a holding hole provided in the carrier. The carrier is thinner than the workpiece.

  When the sun gear and the internal gear are rotationally driven by the drive device, the carrier meshing with them carries out a planetary motion that combines rotation and revolution. Furthermore, when a pressing force is applied to the upper and lower surface plates so as to face each other with the workpiece interposed therebetween, and the slurry is supplied to rotate, the workpiece in the carrier is polished. Since the rotation of the upper and lower surface plates and the above planetary motion are superimposed, the work moves relative to the upper and lower surface plates. For this reason, the upper and lower surfaces of the workpiece can be uniformly polished without deviation.

  When polishing a semiconductor wafer as a workpiece, the semiconductor wafer does not impair its surface characteristics, so it is very disliked for contamination. Cleaning is performed. The cleaning liquid is sprayed between the upper and lower surface plates from a cleaning nozzle provided on the upper surface plate. Slurry adhering to the semiconductor wafer or surrounding slurry is washed away from the upper and lower surface plates by this cleaning. In addition, the cleaning liquid may flow out from the nozzle for slurry in addition to the cleaning nozzle.

  Next, the upper surface plate is pulled up to remove the polished semiconductor wafer. At this time, the semiconductor wafer may be attached (adsorbed) to the upper surface plate and pulled up together with the upper surface plate due to the surface tension of the remaining cleaning water or the surface tension of the remaining slurry if not cleaned.

  In this case, the semiconductor wafer is normally removed from the lower surface plate, but must be removed downward from the upper surface plate. As a result, in the case of manual work, there is a problem in that the smoothness of the work is lacking, and further, when trying to automate, the automatic unloading device cannot be used due to this uncertainty. In addition, when a semiconductor wafer that has been pulled up and attached to the upper surface plate falls in the middle, the dropped semiconductor wafer itself is not only damaged or damaged, but is also damaged or damaged when dropped on another semiconductor wafer. There is a fear.

  Furthermore, if a large amount of cleaning water is left on the carrier and the lower surface plate, the semiconductor wafer floats on the carrier when automatic unloading is indexed, so that unloading cannot be automated. .

  In order to avoid the above problems, a peeling device has been devised, and this double-side polishing apparatus is often incorporated with this peeling device. This peeling device is provided with a large number of peeling nozzles that open between the upper and lower surface plates on the upper surface plate, and when the upper surface plate is pulled up, a peeling gas is ejected from this separation nozzle, and the adsorbed semiconductor wafer is forced by this gas pressure. Is peeled off from the upper surface plate. There is an advantage that the cleaning water remaining between the upper and lower surface plates can be eliminated by the gas pressure of the peeling gas.

  However, the slurry is generally guided to the slurry nozzle by natural fall from the slurry trough through the tube. For this reason, when peeling gas is blown from the peeling nozzle, this gas may flow backward through the space between the upper and lower surface plates to the nozzle and tube for slurry, and blown out from the slurry soot as shown in FIG.

  Since cleaning water or slurry remains in the space between the upper and lower surface plates, the slurry nozzle, and the tube, the cleaning water or slurry is blown upward together with the gas. For this reason, since the sprayed washing water or slurry scatters around the double-side polishing apparatus itself and its surroundings, the working environment is deteriorated. Further, since the blown gas escapes from the slurry nozzle, the peeling ability is also lowered.

Japanese Utility Model Publication No. 58-171825 Japanese Utility Model Publication No.59-032352 JP 2000-230978 A

  In the double-side polishing apparatus provided with the peeling apparatus, the present invention prevents the above-described cleaning water or slurry from splashing, prevents the working environment from deteriorating, and the gas blown from the slurry nozzle. It is an object of the present invention to prevent a decrease in peeling ability due to coming off.

  The above problem is solved by the following means. That is, the first invention has a sun gear to be rotationally driven, an internal gear to be rotationally driven, the sun gear, a carrier meshing with the internal gear, and a carrier having a holding hole for holding a workpiece, and facing each other. The upper surface plate and the lower surface plate, which are driven to rotate, sandwich the work held by the carrier, pressurize the upper surface plate toward the lower surface plate, and raise and lower the upper surface plate Provided on the upper platen, a first nozzle for supplying slurry between the upper platen and the lower platen, and provided on the upper platen. In the double-side polishing apparatus provided with the second nozzle for injecting the release gas toward the workpiece when pulling up, the double-side polishing apparatus is further injected from the second nozzle. A double-side polishing apparatus provided with a workpiece peeling device, comprising a backflow prevention mechanism provided in the first nozzle to prevent the peeled gas from flowing back through the first nozzle It is.

  A second invention is a double-side polishing apparatus provided with the workpiece peeling apparatus according to the first invention, wherein the second nozzle is capable of injecting a cleaning liquid in addition to the peeling gas. A double-side polishing apparatus provided.

  According to a third aspect of the present invention, in the double-side polishing apparatus provided with the workpiece peeling apparatus of the second invention, the peeling gas is jetted after the cleaning liquid has been jetted. A double-side polishing apparatus.

  According to a fourth aspect of the present invention, in the double-side polishing apparatus provided with the workpiece peeling apparatus according to any one of the first to third aspects, the cleaning liquid can be injected from the first nozzle in addition to the second nozzle. It is a double-side polishing apparatus provided with a workpiece peeling apparatus.

  According to a fifth aspect of the present invention, in the double-side polishing apparatus including the workpiece peeling device according to any one of the first to fourth aspects, the first nozzle is disposed in an attachment hole provided in the upper surface plate. A nozzle body that is fixed so that the nozzle hole opens on the lower surface of the upper surface plate, a ring groove provided in the nozzle hole, and a plurality of fluid passage holes provided in the nozzle hole. A receiving seat, a floating ball, a large-diameter cylindrical portion that fits into the nozzle hole, and a small-diameter cylindrical portion having an outer diameter smaller than this and formed with a male screw, and inside the large-diameter cylindrical portion A large-diameter cylindrical space portion having a downwardly opened space in which the floating ball can be stored with a sufficient gap, a small-diameter cylindrical space portion having an inner diameter smaller than the outer diameter of the idler ball and opened upward, and The small diameter cylindrical space and the above A ball storage cylinder having a conical space portion formed between the cylindrical portion, a resilient ring fitted into the small cylindrical portion so as to contact the shoulder of the large cylindrical portion, and the small cylindrical portion male screw A double-side polishing apparatus provided with a workpiece peeling device, characterized in that it comprises a tightening female screw that presses and expands the elastic ring by being screwed to the lower end portion and a shoulder portion of the large-diameter cylindrical portion It is.

  According to the present invention, when the peeling gas is blown from the peeling nozzle, even if this gas reaches the nozzle for slurry through the space between the upper and lower surface plates, the slurry does not reach the tube by the backflow prevention mechanism. It does not blow out from the bag. Therefore, even if cleaning water or slurry remains in the space between the upper and lower surface plates, the nozzle for slurry, or the tube, the cleaning water or slurry should be blown upward together with the gas. There is no such thing that the cleaning water or slurry blown out scatters around the double-side polishing apparatus itself and its surroundings, thereby deteriorating the working environment. Further, since the blown gas does not escape from the slurry nozzle, the peeling ability is not lowered.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a cross-sectional view of a main part of the double-side polishing apparatus 1. The first nozzle and the second nozzle in the claims correspond to the slurry nozzle 61 and the peeling nozzle 71, respectively, in this embodiment. The sun gear 2, the internal gear 3, and the lower surface plate 4 are supported by hollow shafts 21, 31, and 41 having the same axis, respectively, and these shafts are rotatably supported by an airframe (not shown). . The suspension shaft 52 is supported on an axis coaxial with the hollow shafts 21, 31, 41 so as to be movable up and down with respect to the airframe.

  The upper surface plate 5 is supported at the lower end of the suspension shaft 52 so as to be rotatable with respect to the suspension shaft 52. At the time of polishing, the suspension shaft 52 is pulled down, and the upper surface plate 5 is placed on the semiconductor wafer. Polishing pressure is applied by receiving the weight of the upper surface plate 5, the weight of the suspension shaft 52, and the push-down force of a lifting device (not shown) applied to the suspension shaft 52.

  The hollow shafts 21, 31, 41 and the upper surface plate drive shaft 51 described below are rotatable by receiving power from a drive source (not shown). The drive source is composed of a single motor or independent motors, and these shafts can be independently driven to rotate at an arbitrary rotational speed.

  An upper surface plate drive shaft 51 is provided in the hollow interior of the hollow shaft 21, and a driver 511 is formed on the upper surface thereof. The upper surface plate 5 is provided with a hook (not shown) that engages with the driver 511. When the upper surface plate 5 is pulled down, the driver 511 and the hook are engaged, so that the rotation of the upper surface plate drive shaft 51 is transmitted to the upper surface plate 5.

  The upper surface plate 5 is provided with a slurry nozzle 61 and a peeling nozzle 71 that open toward the lower surface. The slurry nozzle 61 is connected to the slurry basket 62 via a pipe line. The slurry bowl 62 is an annular bowl provided on the upper surface plate 5, and the slurry is supplied from the slurry supply device 63.

  The slurry valve 631 is for adjusting the supply and supply amount of slurry and cleaning water, and is controlled by the control device 19. As a result, the slurry or cleaning water is supplied between the upper and lower surface plates (polishing surface) through the slurry supply device 63, the slurry tank 62, and the slurry nozzle 61.

  The slurry nozzle 61 is provided with a backflow prevention mechanism 64, which will be described later, so that fluid can freely pass in the slurry supply direction (the direction from the top to the bottom in the drawing). Therefore, the backflow prevention mechanism 64 does not hinder the flow of slurry or cleaning water when supplying slurry or cleaning water.

  A fixed portion side member 524 (inside) of the rotary type fluid joint 523 is fixed to an intermediate portion of the suspension shaft 52 (the suspension shaft 52 is not rotated), and the rotating portion side member 525 is connected to the branching device 73. The branching device 73 is connected to a plurality of peeling nozzles 71 through pipe lines. Washing water or stripping gas is supplied to the fixed portion side member 524 via the valve 526.

  The supplied fluid (cleaning water or stripping gas) passes through the valve 526 on the fixed side and the fixed portion side member 524 of the fluid joint 523, and is guided to the rotating portion side member 525 on the rotating side and the stripping nozzle 71, Injection is possible from the lower surface of the upper surface plate 5. Rotary type fluid joints themselves are well known and will not be further described. The controller 19 controls the supply and supply amount from each fluid source to the valve 526.

  As shown in FIG. 2, the carriers 81, 82, 83, 84, 85 have holding holes for holding the semiconductor wafer W inside, and have teeth that can mesh with the sun gear 2 and the internal gear 3 on the outside. is doing. Here, an example in which five carriers 81 to 85 are engaged with the sun gear 2 and the internal gear 3 is shown.

  A polishing pad (not shown) is usually attached to the upper surface of the lower surface plate 4 and the lower surface of the upper surface plate 5. The polishing pad is provided with holes at locations corresponding to the slurry nozzle 61 and the peeling nozzle 71.

  The overall operation of the double-side polishing apparatus 1 is as follows. After setting all the carriers, unpolished semiconductor wafers W are set in the holding holes, and the upper surface plate 5 starts to descend. Next, the sun gear 2, the internal gear 3, the lower surface plate 4, and the upper surface plate 5 are started to rotate and the slurry valve 631 is opened.

  When the slurry valve 631 is opened, the slurry is supplied to the slurry tank 62, and passes from here to the slurry nozzle 61, and from the slurry nozzle 61 between the lower surface plate 4 and the upper surface plate 5. It is discharged between the boards. The slurry nozzle 61 is provided with a backflow prevention mechanism 64. However, since the slurry can freely pass in the direction from the top to the bottom, there is no problem in supplying the slurry.

  On the other hand, the carriers 81, 82, 83, 84, 85 are driven by the sun gear 2 and the internal gear 3 to rotate and revolve, so that the discharged slurry is between the upper surface of the lower surface plate 4 and the lower surface of the semiconductor wafer W. , And supplied between the upper surface of the upper surface plate 5 and the upper surface of the semiconductor wafer W to polish the wafer surface.

  The actual elapsed time from the start of polishing is managed by a timer in the control device 19, and the actual elapsed time from the start of polishing is compared with predetermined times T1 and T2.

  First, when the actual elapsed time matches or exceeds T1, the control device 19 issues a command to lower the load applied to the upper surface plate 5. Although an example in which the progress of polishing is monitored by time is shown here, it is also possible to monitor by other means such as a sizing device.

  Next, the control device 19 operates the slurry valve 631 to stop the supply of slurry, and instead starts supplying cleaning water to the slurry tank 62 and the slurry nozzle 61. The washing water can freely pass through the backflow prevention mechanism 64 like the slurry. At the same time, the valve 526 is operated to start supplying cleaning water to the peeling nozzle 71. Not only the slurry between the upper and lower surface plates is washed by the washing water, but also the slurry that has entered the peeling nozzle 71 and adhered to the inner wall surface during washing is washed away.

  When the time T2 elapses, the control device 19 closes the valve 526 and the slurry valve 631 to end the cleaning, and stops the rotation of the lower surface plate 4, the upper surface plate 5, the sun gear 2, and the internal gear 3, respectively. Next, before spraying the peeling gas, cleaning water is supplied into the peeling nozzle 71, and the inside of the peeling nozzle 71 is washed again.

  Next, the control device 19 operates the valve 526 to raise the upper surface plate 5 while sending a high-pressure peeling gas to the peeling nozzle 71. When the gas pressure of the peeling gas is applied to the semiconductor wafer W at the lower end of the peeling nozzle 71, the semiconductor wafer W is forcibly pulled off from the upper surface plate, and as a result, remains on the lower surface plate 4.

  At this time, the stripping gas also flows around the slurry nozzle 61 and tries to flow backward, but the flow is blocked as shown in FIG. Therefore, the stripping gas flows backward with the slurry or the washing water, and is not ejected or scattered from the slurry basket 62 as shown in FIG. 9 (prior art). In FIG. 9, the ejected slurry or cleaning water droplets are denoted by reference numeral 621.

  Since the slurry adhering to the inner surface of the peeling nozzle 71 in the previous cleaning step is removed, almost no slurry is contained in the ejected peeling gas. By cleaning the inner surface of the peeling nozzle 71, contamination of the wafer surface due to the collision of the slurry as seen in the conventional peeling process is also prevented. The upper surface plate 5 is pulled up again to a height at which the wafer can be carried in and out, the wafer is taken out, and the same operation is repeated.

  The washing water described above can be pure water or a chemical solution obtained by mixing a stain prevention additive with pure water. The stripping gas can be any one selected from an inert gas, nitrogen gas, argon gas, or air, or a mixture thereof.

  Next, the structure of the slurry nozzle 61 will be described in the order of assembly. As shown in FIG. 4 (A) and others, the nozzle body 91 of the slurry nozzle 61 opens the nozzle holes 911 in the lower surface of the upper surface plate 5 in the plurality of attachment holes 53 provided in the upper surface plate 5. To be fixed. The nozzle body 91 can be fixed by cutting a female screw on the upper surface plate 5 and screwing a male screw cut on the nozzle main body 91 thereto, or simply by an adhesive.

  The nozzle hole 911 has an upper large diameter portion 914 and a lower small diameter portion 915, and a step portion 913 is formed at the boundary between the large diameter portion 914 and the small diameter portion 915. A ring groove 912 is formed on the inner wall of the large diameter portion 914.

  The receiving seat 92 has a plurality of fluid passage holes 921 as shown in FIG. 4B, and has a diameter slightly smaller than the large diameter portion 914 but larger than the small diameter portion 915. Yes. Accordingly, the receiving seat 92 can be placed on the step portion 913.

  As shown in FIG. 5, the receiving seat 92 is placed on a stepped portion 913, and an idle ball 93 is placed thereon.

  The ball storage cylinder 94 includes a large-diameter cylindrical portion 941 that fits into the large-diameter portion 914 and a small-diameter cylindrical portion 942 that has an outer diameter smaller than this and has a male screw 943 formed therein. Inside the large-diameter cylindrical portion 941, a large-diameter cylindrical space portion 944 having a space opened downward in which the floating ball 93 can be accommodated with a sufficient gap is formed.

  Inside the small diameter cylindrical portion 942, a small diameter cylindrical space portion 945 having an inner diameter smaller than the outer diameter of the floating ball 93 and opening upward is formed. A conical space portion 946 is formed between the small diameter cylindrical space portion 945 and the large diameter cylindrical space portion 944.

  Further, an elastic ring 947 is fitted into the small diameter cylindrical portion 942 of the ball storage cylinder 94 so as to contact the shoulder portion of the large diameter cylindrical portion 941. The elastic ring 947 is a ring body as shown in FIG. 4C and is made of a material that can be easily deformed such as rubber.

  A female screw 951 is formed on the inner side of the tightening female screw 95 and can be screwed into the male screw 943 of the ball storage tube 94.

  When assembling the slurry nozzle 61, first, the receiving seat 92 is put in the nozzle body 91 fixed in the mounting hole 53 in advance, and is seated on the step portion 913. Next, an idle ball 93 is placed on the seat 92. Next, the ball storage cylinder 94 fitted with the elastic ring 947 is inserted into the large diameter portion 914 with the large diameter cylindrical portion 941 facing down.

  A tightening female screw 95 is screwed into the small diameter cylindrical portion 942 of the ball storage cylinder 94 inserted into the large diameter portion 914. When the screwing is continued, the lower end portion 952 of the tightening female screw 95 comes into contact with the elastic ring 947. When the screwing is further continued, the elastic ring 947 is flattened by the lower end portion 952 to expand the diameter. That is, the diameter of the elastic ring 947 is expanded by being sandwiched between the lower end portion 952 and the shoulder portion of the large diameter cylindrical portion 941.

  As the elastic ring 947 is pushed laterally (radially), a part of the elastic ring 947 enters the ring groove 912 at the same position (FIG. 6). As the elastic ring 947 enters the ring groove 912 in this way, the ball housing cylinder 94 is fixed to the nozzle body 91.

  The expanded elastic ring 947 not only fixes the ball housing cylinder 94 to the nozzle main body 91 but also seals to prevent the release gas from leaking upward through the gap between the large diameter portion 914 and the large diameter cylindrical portion 941. It also has an effect. Note that an inclined portion may be provided at the lower end portion 952 in order to make the elastic ring 947 easier to expand in diameter.

  Next, the tube receiver 96 is attached to the small diameter cylindrical portion 942. Since the tube receiver 96 is a cylindrical body and includes a female screw 961 at the lower portion and a tube receiving seat 962 at the upper portion, the female screw 961 may be screwed into the male screw 943. The tube 97 connected to the slurry basket 62 is fitted into the tube receiving seat 962 and fixed.

  FIG. 7 shows a flow state when the slurry is supplied from the slurry nozzle 61. The idle ball 93 is pressed against the seat 92 by the slurry flowing from above, but the size of the idle ball 93 is smaller than that of the large-diameter cylindrical space 944 in which the idle ball 93 is accommodated. It flows through the fluid passage hole 921 to the lower polishing portion.

  FIG. 8 is a diagram when the stripping gas is supplied. The floating ball 93 is pushed upward by the pressure of the stripping gas and stops in contact with the conical wall of the conical space portion 946. As a result, the flow of the peeling gas is blocked and does not flow above the line A, that is, in the direction of the small diameter cylindrical space 945.

  In other words, the backflow prevention mechanism 64 is formed by the idle ball 93, the conical space portion 946, and the like. Therefore, the stripping gas is prevented from flowing upward by the formed backflow prevention mechanism 64, so that the stripping gas flows back with the slurry or washing water, and as shown in FIG. No eruption or scattering from 62.

  Since the semiconductor wafer W does not like to be exposed to metal ions, the nozzle body 91, the receiving seat 92, the idle ball 93, the ball storage cylinder 94, and the like are made of a synthetic resin that does not ionize the members that come into contact with the slurry and cleaning water. It is preferable to do this. If the idle ball 93 is made of a material having a lighter specific gravity than the wash water and the slurry, the idle ball tends to float when the wash water and the slurry are accumulated in the nozzle after the completion of processing. The liquid can be prevented from rising above the line A in FIG.

  As disclosed above, in the present invention, since the slurry nozzle is provided with the backflow prevention mechanism, when the peeling gas is blown from the peeling nozzle, this gas passes through the space between the upper and lower surface plates and is used for the slurry. It does not flow back to the nozzle and tube, and as seen in the prior art, it does not blow out with the remaining washing water from the slurry tank. Therefore, the work environment is not deteriorated by the sprayed cleaning water or slurry splashing around the double-side polishing apparatus itself and its surroundings. In addition, since the blown release gas does not escape from the slurry nozzle, the release ability is not reduced.

It is sectional drawing of the principal part in the double-side polish apparatus 1 of this invention Example. It is explanatory drawing which shows the example in which the five carriers 81 thru | or 85 have meshed | engaged with the sun gear 2 and the internal gear 3 in the double-side polish apparatus 1 of this invention Example. In an Example of this invention, it is explanatory drawing (it shows with the AA cross section of FIG. 2) for demonstrating a peeling gas which turned around from the peeling nozzle 71 by the backflow prevention mechanism 64 of the slurry nozzle 61 preventing backflow. is there. FIG. 8 is an explanatory view showing the structure and assembly procedure of the slurry nozzle 61 in the embodiment of the present invention together with FIG. 5, FIG. 6 and FIG. 4A is an exploded view of the slurry nozzle 61, FIG. 4B is a plan view of a receiving seat 92, and FIG. 4C is a perspective view of the elastic ring 947. 4, FIG. 6 and FIG. 7 are explanatory views showing the structure and assembly procedure of the slurry nozzle 61 in the embodiment of the present invention. FIG. 8 is an explanatory view showing the structure and assembly procedure of the slurry nozzle 61 in the embodiment of the present invention together with FIG. 5, FIG. 6 and FIG. 4, FIG. 5 and FIG. 6 are explanatory diagrams illustrating the structure and assembly procedure of the slurry nozzle 61 in the embodiment of the present invention and explaining the flow of slurry or cleaning water. It is explanatory drawing explaining a mode that the backflow of the peeling gas which turned around from the peeling nozzle 71 is prevented in the slurry nozzle 61 in this invention Example. In the conventional slurry nozzle, when peeling gas is blown in from the peeling nozzle, it is explanatory drawing explaining a mode that this gas flows backward and blows out from a slurry tank.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Double-side polish apparatus 19 Control apparatus 2 Sun gear 21 Hollow shaft 3 Internal gear 31 Hollow shaft 4 Lower surface plate 41 Hollow shaft 5 Upper surface plate 51 Upper surface plate drive shaft 511 Driver 52 Suspension shaft 523 Fluid joint 524 Fixed part side member 525 Rotation Part side member 526 Valve 53 Mounting hole 61 Slurry nozzle 62 Slurry bottle 621 Droplet 63 Slurry supply device 631 Slurry valve 64 Backflow prevention mechanism 71 Peeling nozzle 73 Branching device 81-85 Carrier 91 Nozzle body 911 Nozzle hole 912 Ring groove 913 Step portion 914 Large diameter portion 915 Small diameter portion 92 Receiving seat 921 Fluid passage hole 93 Free ball 94 Ball storage tube 941 Large diameter cylindrical portion 942 Small diameter cylindrical portion 943 Male screw 944 Large diameter cylindrical space portion 945 Small diameter cylindrical space portion 946 Conical space portion 947 Elasticity Ring 95 Tightening female screw 951 Female screw 952 Lower end 96 Tube receiver 961 Female screw 962 Tube receiving seat 97 Tube W Semiconductor wafer

Claims (5)

Sun gear, which is rotationally driven,
Internal gear,
A carrier having teeth meshing with the sun gear and the internal gear and having a holding hole for holding a workpiece;
An upper surface plate and a lower surface plate that face each other and are driven to rotate.
A lifting device that pressurizes the upper surface plate toward the lower surface plate and pulls up the upper surface plate so as to sandwich the work held by the carrier,
Provided on the upper surface plate, a first nozzle for supplying slurry between the upper surface plate and the lower surface plate, and
Provided on the upper surface plate, and when the upper surface plate is pulled up, a second nozzle for injecting a peeling gas toward the workpiece;
In addition, the double-side polishing apparatus comprises:
A backflow prevention mechanism provided in the first nozzle to prevent the peeling gas sprayed from the second nozzle from flowing back through the first nozzle;
A double-side polishing apparatus provided with a workpiece peeling device. In the double-side polishing apparatus provided with the workpiece peeling apparatus according to claim 1,
The double-side polishing apparatus provided with a workpiece peeling device, wherein the second nozzle can jet a cleaning liquid in addition to the peeling gas. In the double-side polishing apparatus provided with the workpiece peeling apparatus according to claim 2,
The stripping gas is sprayed after spraying of the cleaning liquid is completed;
A double-side polishing apparatus provided with a workpiece peeling device characterized by the above. In the double-side polishing apparatus provided with the workpiece peeling apparatus according to any one of claims 1 to 3,
A double-side polishing apparatus provided with a workpiece peeling device, wherein the cleaning liquid can be sprayed from the first nozzle in addition to the second nozzle. In the double-side polish apparatus provided with the workpiece | work peeling apparatus as described in any one of Claim 1- Claim 4,
The first nozzle is
In a mounting hole provided in the upper surface plate, a nozzle body fixed so that the nozzle hole opens on the lower surface of the upper surface plate,
A ring groove provided in the nozzle hole,
A receiving seat provided inside the nozzle hole and having a plurality of fluid passage holes;
Idle ball,
The large-diameter cylindrical portion that fits into the nozzle hole, and a small-diameter cylindrical portion that has a smaller outer diameter and is formed with a male screw, and the floating ball is disposed inside the large-diameter cylindrical portion. A large-diameter cylindrical space portion having a downwardly opened space that can be stored with a sufficient gap, a small-diameter cylindrical space portion having an inner diameter smaller than the outer diameter of the idle ball and opened upward, and the small-diameter cylindrical space portion; A ball storage cylinder provided with a conical space formed between the large-diameter cylindrical space,
An elastic ring fitted into the small diameter cylindrical portion so as to be in contact with the shoulder of the large diameter cylindrical portion;
A workpiece peeling device comprising a fastening female screw that is screwed into the male screw of the small diameter cylindrical portion and sandwiched between a lower end portion thereof and a shoulder portion of the large diameter cylindrical portion to press and expand the elastic ring. Provided double-side polishing equipment.

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