JP2007300536A - Image reader and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image reader and a manufacturing method thereof with which vivid images are read by irradiating the image with a high-luminance and uniform light. <P>SOLUTION: In the image reader A1 having a substrate 1 with a part, extended in the main scanning direction x, a light source 2 loaded on the substrate 1, light guide member 4 for emitting light from the light source 2 as a linear shape light, extended in the main scanning direction x, and a plurality of sensor IC chips 3 loaded on the substrate 1 along the main scanning direction x, the substrate 1 has a long part 11, on which the plurality of sensor IC chips 3 are loaded and a short part 12 on which the light source 2 is loaded, and a surface, on which the light source 2 is loaded turns, to the main scanning direction x and the light source 2 includes an LED chip 21 directly loaded on the short part 12. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an image reading apparatus and a manufacturing method thereof.

  FIG. 20 shows an example of a conventional image reading apparatus. The image reading apparatus X shown in the figure is for reading the description content of a document conveyed in the sub-scanning direction by, for example, a platen roller as image data. The image reading apparatus X includes a case 91, a substrate 92, a light source 93, a light guide member 94, a sensor IC chip 95, and a transparent plate 97. The case 91 has an elongated shape extending in the main scanning direction x. The substrate 92 has a long rectangular shape extending in the main scanning direction x and is fitted in the case 91. The light source 93 is for emitting light for reading an image, and is mounted on the substrate 92.

  The light guide member 94 is for emitting the light incident from the light source 93 toward the original, and is made of a transparent resin. The light guide member 94 has an elongated shape extending in the main scanning direction x, and includes a light incident surface 94a, a reflective surface 94b, and a light emitting surface 94c. The light incident surface 94 a faces the light source 93 and is a surface for introducing light from the light source 93 into the light guide member 94. The reflecting surface 94b is inclined with respect to the main scanning direction, and is a surface for reflecting the light coming from the light incident surface 94a in the main scanning direction x. The light emission surface 94c is an elongated shape extending in the main scanning direction x, and is a surface for emitting light traveling in the light guide member 94 to the original as linear light extending in the main scanning direction x. The light emitted from the light guide member 94 passes through the transparent plate 97 and is applied to the original and is reflected by the original. This reflected light is condensed onto a plurality of sensor IC chips 95 by a lens array (not shown). The sensor IC chip 95 is configured to be able to output a signal corresponding to the amount of received light. By storing light from the plurality of sensor IC chips 95 in a memory (not shown), it is possible to read the contents of the document as an image.

  However, when the light emitted from the light source 93 is reflected by the reflecting surface 94b, it is inevitable that the light is attenuated. Further, if the shape of the reflecting surface 94b is inappropriate, the light traveling in the light guide member 94 may be uneven. In such a case, it is obstructed to emit uniform linear light from the light emitting surface 94c. Therefore, in the image reading apparatus X, there is still room for improvement with respect to irradiating light for reading the original with high brightness and uniformity.

JP 2004-266313 A

  The present invention has been conceived under the circumstances described above, and provides an image reading apparatus capable of reading a clear image by irradiating with high luminance and uniform light, and a method for manufacturing the same. That is the issue.

  An image reading apparatus provided by the first aspect of the present invention includes a substrate having a portion extending in the main scanning direction, a light source mounted on the substrate, and a line extending light from the light source in the main scanning direction. And a plurality of light receiving elements mounted on the substrate along a main scanning direction, wherein the substrate includes the plurality of light receiving elements. A long portion mounted; and a short portion on which the light source is mounted and a surface on which the light source is mounted faces a main scanning direction. The light source is directly mounted on the short portion. It is characterized by including the above LED chip.

  According to such a configuration, after the light from the light source is incident on the light guide member, the light is directed in the main scanning direction in the light guide member without being reflected for the purpose of direction change. It is possible to proceed. Accordingly, attenuation of light due to reflection can be suppressed, and high-luminance light can be emitted. This is suitable for reading a clear image. Further, since the LED chip is directly mounted on the substrate, heat from the LED chip can be released to the substrate. This is advantageous for increasing the luminance by increasing the input power to the LED chip.

  In a preferred embodiment of the present invention, the long portion and the short portion are connected by a conductive support member having flexibility. According to such a configuration, it is possible to appropriately supply power to the light source mounted on the short portion while the long portion and the short portion are in a state of being orthogonal to each other.

  In a preferred embodiment of the present invention, the end portion near the short portion of the long portion and the end portion near the long portion of the short portion are not joined to the conduction support member. According to such a structure, the part which is not joined with respect to the said long part and the said short part among the said conduction | electrical_connection support members will be in the state which is not restrained at all. For this reason, when the said short part and the said elongate part are made into a mutually orthogonal state, the part which is not joined will selectively bend. Therefore, it is possible to prevent the conductive support member from being unduly peeled off.

  In a preferred embodiment of the present invention, the substrate is made of ceramics. According to such a configuration, it is possible to make the substrate have a relatively high thermal conductivity. Therefore, heat radiation from the LED chip can be promoted.

  In a preferred embodiment of the present invention, the light source further includes a reflector surrounding the one or more LED chips. According to such a configuration, it is possible to reflect the light from the LED chip toward the light guide member.

  In a preferred embodiment of the present invention, the reflector is made of a white resin. According to such a configuration, light from the LED chip can be reflected with high reflectance.

  In a preferred embodiment of the present invention, the light source further includes a translucent member that covers the one or more LED chips. Such a configuration is suitable for protecting the LED chip. Moreover, the directivity of the light from the LED chip can be enhanced by the lens effect of the translucent member.

  In preferable embodiment of this invention, the recessed part which accommodates the said 1 or more LED chip is formed in the part facing the said short part among the said light guide members. According to such a configuration, light from the LED chip can be directly introduced into the light guide member, and attenuation of light due to reflection can be suppressed.

  In a preferred embodiment of the present invention, the apparatus further includes a case that accommodates the substrate and the light guide member, and the case includes a reference wall having a surface facing a main scanning direction, and the short length. The part is brought into contact with the reference wall. According to such a configuration, the position in the main scanning direction of the short portion can be determined by the reference wall.

  In a preferred embodiment of the present invention, there is further provided a light shielding member attached so as to straddle the surface of the short portion opposite to the surface on which the light source is mounted and the case. According to such a configuration, it is possible to prevent light from leaking from the gap between the case and the substrate. Moreover, the said short part can be fixed with respect to the said case with the said light-shielding member.

  In preferable embodiment of this invention, the said light-shielding member is affixed so that the said short part and the said long part may be straddled further. According to such a configuration, it is possible to prevent light from leaking from the gap between the short part and the long part.

  A method for manufacturing an image reading apparatus provided by the second aspect of the present invention is a method for manufacturing an image reading apparatus including a substrate on which a light source and a plurality of light receiving elements arranged in a main scanning direction are mounted. The step of applying a flexible conductive support member so as to straddle the planned division portion extending in the sub-scanning direction perpendicular to the main scanning direction, and dividing the substrate at the planned division portion, thereby the plurality of light receiving portions. And a step of dividing into a long portion on which the element is mounted and a short portion on which the light source is mounted.

  According to such a structure, the part which should become the said elongate part and the said elongate part among the said board | substrates can be appropriately conducted beforehand by the said conduction | electrical_connection support member. Thereafter, if the long portion and the short portion are divided into the long portion and the short portion, the conductive state can be maintained even when the long portion and the short portion are perpendicular to each other.

  In a preferred embodiment of the present invention, one or more LED chips constituting the light source are directly mounted on the substrate. According to such a configuration, heat from the LED chip can be released to the substrate.

  In a preferred embodiment of the present invention, the substrate is made of ceramic. According to such a configuration, heat dissipation from the LED chip can be promoted.

  In a preferred embodiment of the present invention, in the step of attaching the conductive support member, two anisotropic conductive films are attached in parallel to the substrate across the division planned portion, and these anisotropic conductive films are attached. The conductive support member is attached to the substrate using a film. According to such a structure, the said conduction | electrical_connection support member can be affixed on the said board | substrate in the state which the center side part is not being fixed to the said board | substrate. This non-fixed portion is suitable for selective flexing when the short portion and the long portion are in a right angle state. Moreover, if an anisotropic conductive film is used, the said conduction | electrical_connection support member can be easily conduct | electrically_connected to the wiring pattern etc. which were formed in the said board | substrate.

  In a preferred embodiment of the present invention, the method further includes a step of attaching the substrate divided into the long portion and the short portion to a case extending in the main scanning direction. In the step of attaching to the case, The short portion is brought into contact with a reference wall provided on the case and having a surface facing the main scanning direction. According to such a structure, the said short part can be appropriately positioned with respect to the said case.

  In a preferred embodiment of the present invention, in the step of attaching the substrate to the case, a light shielding member is pasted so as to straddle the short portion and the case. According to such a configuration, it is possible to prevent light from leaking from the gap between the substrate and the case. Further, the substrate can be easily fixed to the case.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 4 show a first embodiment of an image reading apparatus according to the present invention. The image reading apparatus A1 of this embodiment includes a substrate 1, a light source 2, a plurality of sensor IC chips 3, a light guide member 4, a lens array 5, a case 6, and a transparent plate 8. As shown in FIG. 2, the image reading apparatus A1 is, for example, a so-called sheet feed type image reading apparatus that reads, as image data, the contents of a document Dc conveyed on the transparent plate 8 in the sub-scanning direction y by a platen roller Pr. It is configured.

  The substrate 1 is made of, for example, ceramic and has a long portion 11 and a short portion 12. The long portion 11 has a long rectangular shape extending in the main scanning direction x and is attached to the lower end of the case 6. The short portion 12 has a rectangular shape, and is attached to one end side of the case 6 in a posture that stands up at a substantially right angle with respect to the long portion 11. The long part 11 and the short part 12 are connected by a flexible wiring board 13. The flexible wiring board 13 has a structure in which a metal layer forming a wiring pattern and a plurality of resin layers sandwiching the metal layer are laminated, and has excellent flexibility. As shown in FIG. 3, the joint portions 13 a that are both end portions of the flexible wiring board 13 are joined to the long portion 11 and the short portion 12 by anisotropic conductive films 14, respectively. A portion closer to the center of the flexible wiring board 13 is a non-joined portion 13 b that is not joined by the anisotropic conductive film 14. By means of the anisotropic conductive film 14, the metal layer of the flexible wiring board 13 is electrically connected to an appropriate place of the wiring pattern 15 formed in the long portion 11 and the short portion 12.

  The light source 2 includes three LED chips 21, a reflector 22, and a translucent member 23. The three LED chips 21 emit red light, green light, and blue light, for example, and are bonded to pads 15a formed on the short portion 12 of the substrate 1 as shown in FIG. The reflector 22 is made of white resin, for example, and surrounds the three LED chips 21. The reflecting surface 22a of the reflector 22 has a divergent shape in a direction in which the surface of the short portion 12 on which the three LED chips 21 are mounted faces. The light emitted from the three LED chips 21 in the in-plane direction of the short portion 12 is reflected in the main scanning direction x by the reflecting surface 22a. The translucent member 23 is made of, for example, a transparent epoxy resin and fills a region surrounded by the reflector 22. A lens 23 a is formed on the translucent member 23. The lens 23 a is for increasing the directivity of light from the three LED chips 21.

  The plurality of sensor IC chips 3 are semiconductor chips each having a rectangular shape in plan view, each having a light receiving portion (not shown). The plurality of sensor IC chips 3 are mounted on the long portion 11 and are disposed immediately below the lens array 5 as shown in FIG. The sensor IC chip 3 has a photoelectric conversion function and is configured to output an image signal having an output level corresponding to the amount of received light.

  The light guide member 4 is a highly transparent member made of, for example, PMMA (polymethyl methacrylate). The light guide member 4 has a light incident surface 4a, a light reflecting surface 4b, and a light emitting surface 4c. The light incident surface 4 a is a surface for introducing light from the light source 3 into the light guide member 4, and is configured by one end surface of the light guide member 4 in the main scanning direction x. The light incident surface 4a has a mirror finish in order to prevent light from the light source 3 from being scattered. The light reflecting surface 4b is a surface for reflecting the light traveling from the light incident surface 4a along the main scanning direction x toward the light emitting surface 4c. A plurality of grooves each extending in the sub-scanning direction y are formed in the light reflecting surface 4b. The light emitting surface 4c is a surface that emits light toward the document Dc, and extends in the main scanning direction x. The light exit surface 4c has an arc shape in cross section, and exhibits a light collecting effect on a surface orthogonal to the main scanning direction x. As a result, linear light extending in the main scanning direction x is emitted from the light emitting surface 4c. The light guide member 4 is attached to the case 6 via a spacer 41. The spacer 41 is made of, for example, a white resin, and an internal space along the cross-sectional shape of the light guide member 4 is formed. The spacer 41 exhibits a function of reflecting light emitted from the side surface of the light guide member 4 and returning it to the light guide member 4 again.

  The lens array 5 is for focusing the light reflected by the document Dc on the plurality of sensor IC chips 3 at the same erect magnification. The lens array 5 includes a holder 51 and a plurality of lenses 52. The holder 51 has a block shape extending in the main scanning direction x, and is, for example, synthetic resin. The plurality of lenses 52 are arranged along the main scanning direction x and are held by the holder 51.

  The case 6 is made of a synthetic resin and has a substantially block shape extending in the main scanning direction x. The case 6 accommodates the substrate 1, the light source 2, the plurality of sensor IC chips 3, the light guide member 4, and the lens array 5. The long portion 11 of the substrate 1 is pressed against the step provided in the lower portion of the case 6. This pressing is performed by, for example, a metal elastic member (not shown). A reference wall 61 is formed near one end of the case 6 in the main scanning direction x. The reference wall 61 is for positioning the short portion 12 in the main scanning direction x. An opening 61 a is formed in the reference wall 61. The opening 61 a is provided at a position facing the light source 2 mounted on the short portion 12. By accommodating a part of the light source 2, light from the light source 2 is directed to the light incident surface 4 a of the light guide member 4. It is for making it reach.

  The light shielding film 7 is made of, for example, a black resin, and is attached to the long portion 11, the short portion 12, and the case 6 with, for example, an adhesive or an adhesive. As shown in FIG. 4, both side portions 7 a of the light shielding film 7 are stuck so as to straddle the short portion 11 and the side surface of the case 6. Further, the lower side portion 7 b of the light shielding film 7 is stuck so as to straddle the long portion 11 and the short portion 12.

  The transparent plate 8 is made of, for example, transparent glass, and is provided at the upper end of the case 6. The transparent plate 8 is used as a place where the original Dc to be read is pressed by the platen roller Pr and smoothly moved in the sub-scanning direction y.

  Next, an example of a manufacturing method of the image reading apparatus A1 will be described.

  First, as shown in FIG. 5, a substrate material 1A is prepared. The substrate material 1A is made of ceramic and has a size capable of producing five substrates 1 shown in FIG. The manufacturing method described below is a method of manufacturing the five image reading devices A1 in a lump. However, unlike this method, for example, the image reading devices A1 are manufactured one by one by preparing the substrate 1 in advance. May be.

  In the substrate material 1A, four dividing lines CLx and one dividing line CLy are set. The dividing lines CLx and CLy respectively correspond to four grooves 1Ax and one groove 1Ay formed on the back surface of the substrate material 1A. The groove 1Ax is a groove that extends in the direction that becomes the main scanning direction x, and the groove 1Ay is a groove that extends in the direction that becomes the sub-scanning direction y. After a wiring pattern (not shown) is formed on the surface of the substrate material 1A, a plurality of LED chips 21 and a plurality of sensor IC chips 3 are mounted. The plurality of LED chips 21 and the plurality of sensor IC chips 3 are mounted on each of the five regions partitioned by the dividing line CLx. Further, the reflector 22 is bonded to the substrate material 1 so as to surround each of the three LED chips 21.

  Next, as shown in FIG. 6, for example, a transparent epoxy resin material is potted in the space surrounded by the reflector 22. When this resin material is cured, a translucent member 23 covering the LED chip 21 is formed. By utilizing the surface tension of the resin material, the bulging lens 23a can be formed. The translucent member 23 may be formed by a technique using a mold instead of the potting technique. By forming the translucent member 23, the light source 2 is completed.

  Next, as shown in FIG. 7, two anisotropic conductive films 14 are attached to the substrate material 1A. This sticking is performed so that these anisotropic conductive films 14 are arranged in parallel with the dividing line CLy interposed therebetween.

  Next, as shown in FIG. 8, the flexible wiring board 13 is stuck. At this time, the flexible wiring board 13 extended along the dividing line CLy is placed so as to overlap the two anisotropic conductive films 14. Thereby, the flexible wiring board 13 is bonded to the substrate material 1 </ b> A by the two anisotropic conductive films 14. As shown in FIG. 9, the flexible wiring board 13 is electrically connected to an appropriate position of the wiring pattern 15 formed on the board material 1 </ b> A via two anisotropic conductive films 14. Further, after the flexible wiring substrate 13, two joint portions 13 a on both ends are joined to the substrate material 1 </ b> A by the anisotropic conductive film 14. On the other hand, the non-joining part 13b near the center of the flexible wiring board 13 is not joined to the board material 1A.

  Next, the substrate material 1A is divided along four dividing lines CLx and divided into five substrates 1 as shown in FIG. The division along the dividing line CLx is performed by applying a force that folds the substrate material 1A along the groove 1Ax provided corresponding to the dividing line CLx. In this division, the flexible wiring substrate 13 and the anisotropic conductive film 14 are cut together with the substrate material 1A. A cutter etc. are used for these cuttings as needed.

  Next, in the divided substrate 1, the substrate 1 is cut along the dividing line CLy. This cutting is performed by applying a force that folds the substrate 1 along the groove 1Ay provided corresponding to the dividing line CLy. However, in this cutting, the flexible wiring board 13 is not cut. Thereby, as shown in FIG. 11, the substrate 1 is divided into the long portion 11 and the short portion 12. The long portion 11 and the short portion 12 are connected by the flexible wiring board 13. And it is set as the attitude | position which the long part 11 and the short part 12 become a right angle. At this time, as shown in FIG. 12, the non-joining portion 13 b of the flexible wiring substrate 13 is bent intensively, so that the flexible wiring substrate 13 is not likely to peel from the long portion 11 and the short portion 12.

  Next, as shown in FIG. 13, a case 6 is prepared. The case 6 is prepared in advance using a mold, for example. The short portion 12 is attached to the reference wall 61 of the case 6. The light source 2 attached to the short portion 12 is accommodated in the opening 61 a of the reference wall 61. Further, the long portion 11 is pressed against the lower portion of the case 6.

  Next, as shown in FIG. 14, the light shielding film 7 is attached to the substrate 1 and the case 6. At this time, the central portion of the light shielding film 7 is stuck to the short portion 12. Further, both side portions 7 a of the light shielding film 7 are wound around the side surface of the case 6. Further, the lower side portion 7 b of the light shielding film 7 is made to wrap around the long portion 11. Thereafter, the image reading device A1 shown in FIGS. 1 to 4 is obtained through the fixing of the long portion 11, the attachment of the light guide member 4, the lens array 5, the transparent plate 8, and the like.

  Next, the operation of the image reading apparatus A1 will be described.

  According to this embodiment, after the light from the LED chip 21 is incident on the light guide member 4 from the light incident surface 4a, the light guide member 4 is reflected in the main scanning direction x without reflecting much of the light. Can proceed to. The light traveling in the main scanning direction x is directed to the light emitting surface 4c by the light reflecting surface 4b and is emitted as linear light. Therefore, it is possible to suppress the attenuation of light due to reflection in the light guide member 4, and it is possible to increase the brightness of the linear light. Further, by arranging the three LEDs 21 along the optical axis of the light guide member 4, the brightness of the light in the light guide member 4 and further the linear light emitted from the light exit surface 4c is made uniform. Is possible. A clear image can be read by increasing the brightness and uniformity of the linear light.

  Each LED chip 21 is directly mounted on the pad 15 a of the short portion 12 of the substrate 1. For this reason, the heat transfer coefficient from the LED chip 21 to the short part 12 is large. Therefore, it is suitable for releasing the heat from the LED chip 21 to the short portion 12, and high brightness can be achieved by increasing the input power to the LED chip 21. Further, since the substrate 1 is made of ceramic, the short portion 12 has a relatively high thermal conductivity. This is advantageous for promoting heat dissipation from the LED chip 21.

  The long portion 11 and the short portion 12 are connected to each other by a flexible wiring board 13. According to the flexible wiring board 13 excellent in flexibility, the long portion 11 and the short portion 12 which are in a posture perpendicular to each other can be appropriately conducted. Further, by providing the non-joining portion 13b on the flexible wiring board 13, the non-joining portion 13b can be selectively bent. This is suitable for preventing the joint portion 13a of the flexible wiring board 13 from being unduly separated from the substrate 1.

  Light emitted from the LED chip 21 in the in-plane direction of the short portion 12 can be directed to the light incident surface 4a by the reflecting surface 22a of the reflector 22. Since the reflector 22 is made of white resin, the reflection surface 22a is a surface having a high reflectance. Furthermore, the directivity of light from the LED chip 21 can be increased by the lens 23 a of the translucent member 23. Therefore, more light from the LED chip 21 can be incident on the light incident surface 4a.

  By bringing the short portion 12 into contact with the reference wall 61 of the case 6, the position of the short portion 12 with respect to the case 6 in the main scanning direction x can be accurately determined. Thereby, positioning in the main scanning direction x of the LED chip 21 can be performed appropriately. Fixing the substrate 1 using the light shielding film 7 is relatively easy, and the manufacturing time can be shortened. Further, it is possible to prevent light from leaking from the gap between the short portion 12 and the case 6 and the gap between the long portion 11 and the short portion 12.

  15 to 19 show another embodiment of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

  FIG. 15 shows a second embodiment of the image reading apparatus according to the present invention. The illustrated image reading apparatus A2 is different from the first embodiment described above in the configuration of the light source 2 and the light guide member 4. In the present embodiment, the light source 2 is constituted by three LED chips 21 and does not include the reflector 22 and the light transmitting member 23 as shown in FIG. Moreover, the recessed part is formed in the edge part of the light guide member 4, and the inner surface of this recessed part is made into the entrance plane 4a. The space surrounded by the recess is sized to accommodate three LED chips 21. The light guide member 4 is brought into contact with the short portion 12 of the substrate 1.

  According to such an embodiment, it is possible to introduce all the light from the three LED chips 21 into the light guide member 4 without reflection. Therefore, attenuation of light due to reflection can be suppressed, and the amount of light emitted from the light guide member 4 can be increased. Further, it is possible to save the trouble of forming the reflector 22 and the translucent member 23, and it is possible to shorten the manufacturing time and the manufacturing cost.

  FIG. 16 shows a third embodiment of the image reading apparatus according to the present invention. The illustrated image reading apparatus A3 is different from the above-described embodiment in the shape of the case 6 and the manner in which the substrate 1 is attached to the case 6. In the present embodiment, the case 6 is provided with an outer wall 62 that faces the reference wall 61. Further, the opening 61a has a shape opened downward from the reference wall 61. The substrate 1 is attached to the case 6 by inserting the short portion 12 into the gap between the reference wall 61 and the outer wall 62. In this insertion, the light source 2 enters from below the opening 61a. Furthermore, you may stick the light shielding film 7 shown in FIG. 4 so that the outer wall 62 and the elongate part 11 may be straddled.

  Also according to such an embodiment, the substrate 1 having the long portion 11 and the short portion 12 can be appropriately attached to the case 6. Since the outer wall 62 is formed at the end of the case 6 in the main scanning direction x, light leakage from the light source 2 can be prevented.

  FIG. 17 shows an embodiment in which a printed wiring board 13 different from the above-described embodiment is used. The printed wiring board 13 of the present embodiment has a configuration in which the anisotropic conductive film 14 is provided on the lower surface of the joint portion 13a in advance. This printed wiring board 13 has two resin layers 13d made of a resin such as polyimide, polyester, or resist, with a metal layer 13e interposed therebetween. A plating layer 13f is formed on a portion of the metal layer 13e exposed from the lower resin layer 13d. An anisotropic conductive film 14 is attached to the plating layer f. Release paper 13g is provided to prevent the anisotropic conductive film 14 from unduly adhering when the printed wiring board 13 is handled.

  In order to attach the printed wiring board 13 having such a configuration to the substrate material 1A, first, the release paper 13g is peeled off, and the anisotropic conductive film 14 is exposed. Next, the printed wiring board 13 is placed on the substrate material 1A so that the anisotropic conductive film 14 is disposed with the groove 1Ay interposed therebetween. Then, by applying pressure and heat to the printed wiring board 13, the printed wiring board 13 can be attached to the substrate material 1 </ b> A via the anisotropic conductive film 14. According to such a configuration, it is possible to affix the printed wiring board 13 and the anisotropic conductive film 14 in a lump without the need to apply the anisotropic conductive film 14 alone in advance. This is advantageous for shortening the time required for manufacturing.

  18 and 19 show an embodiment in which a printed wiring board 13 having a further different configuration is used. Unlike the printed wiring board 13 shown in FIG. 11, the printed wiring board 13 shown in FIG. 18 has a width that is significantly smaller than the width of the board 1. According to such a configuration, the printed wiring board 13 is easily twisted and deformed. Therefore, it is possible to make the long portion 11 and the short portion 12 have a twisted positional relationship, for example, and the attachment work to the case 6 can be facilitated. The printed wiring board 13 shown in FIG. 19 has a plurality of slits 13h. The slit 13 h extends in a direction connecting the long portion 11 and the short portion 12. Also with such a configuration, the work of attaching the substrate 1 to the case 6 can be facilitated.

  The image reading apparatus and the manufacturing method thereof according to the present invention are not limited to the above-described embodiments. The specific configuration of each part of the image reading apparatus and the manufacturing method thereof according to the present invention can be varied in design in various ways.

  The image reading apparatus according to the present invention is not limited to a so-called sheet feed type that reads a document Dc sent on the transparent plate 8 in the sub-scanning direction y by the platen roller Pr. For example, the image reading device is placed on a fixed transparent plate. The original may be configured as a so-called flat bed type in which the image reading apparatus itself reads the original in the sub-scanning direction y. In the case of a flat bed type, the light exit surface 4c of the light guide member 4 may be a flat surface.

1 is a cross-sectional view illustrating a first embodiment of an image reading apparatus according to the present invention. It is sectional drawing which follows the II-II line | wire of FIG. 1 is a cross-sectional view of a main part showing a first embodiment of an image reading apparatus according to the present invention. 1 is an overall perspective view showing a first embodiment of an image reading apparatus according to the present invention. It is a perspective view which shows the process of mounting a reflector in board | substrate material in an example of the manufacturing method of 1st Embodiment of the image reader which concerns on this invention. It is a perspective view which shows the process of forming a translucent member in an example of the manufacturing method of 1st Embodiment of the image reader which concerns on this invention. It is a perspective view which shows the process of sticking an anisotropic conductive film to a board | substrate material in an example of the manufacturing method of 1st Embodiment of the image reader which concerns on this invention. It is a perspective view which shows the process of mounting a flexible wiring board in board | substrate material in an example of the manufacturing method of 1st Embodiment of the image reader which concerns on this invention. It is principal part sectional drawing in alignment with the IX-IX line of FIG. It is a perspective view which shows the process of dividing | segmenting board | substrate material in an example of the manufacturing method of 1st Embodiment of the image reader which concerns on this invention. It is a perspective view which shows the process made into a right angle with a long part and a short part in an example of the manufacturing method of 1st Embodiment of the image reader which concerns on this invention. It is principal part sectional drawing which follows the XII-XII line | wire of FIG. It is a perspective view which shows the process of attaching a board | substrate to a case in an example of the manufacturing method of 1st Embodiment of the image reader which concerns on this invention. It is a perspective view which shows the process of sticking a light shielding film in an example of the manufacturing method of 1st Embodiment of the image reader which concerns on this invention. It is principal part sectional drawing which shows 2nd Embodiment of the image reader which concerns on this invention. It is a disassembled perspective view which shows 3rd Embodiment of the image reading apparatus which concerns on this invention. It is principal part sectional drawing which shows the other example of the flexible wiring board used for the image reading apparatus which concerns on this invention. It is a principal part perspective view which shows the other example of the flexible wiring board used for the image reading apparatus which concerns on this invention. It is a principal part perspective view which shows the other example of the flexible wiring board used for the image reading apparatus which concerns on this invention. It is sectional drawing which shows an example of the conventional image reading apparatus.

Explanation of symbols

A1 Image reading device Dc Document Pr Platen roller Clx, CLy Dividing line (part to be divided)
1 substrate 1A substrate material 1Ax, 1Ay groove 2 light source 3 sensor IC chip (light receiving element)
4 Light guide member 4a Light incident surface 4b Light reflecting surface 4c Light emitting surface 5 Lens array 6 Case 7 Light shielding film (light shielding member)
7a Both sides 7b Lower side 8 Transparent plate 11 Long part 12 Short part 13 Flexible wiring board (conduction support member)
13a Bonding portion 13b Non-bonding portion 14 Anisotropic conductive film 15 Wiring pattern 15a Pad 21 LED chip 22 Reflector 22a Reflecting surface 23 Translucent member 23a Lens 41 Spacer 51 Holder 52 Lens 61 Reference wall 61a Opening

Claims (17)

A substrate having a portion extending in the main scanning direction;
A light source mounted on the substrate;
A light guide member for emitting light from the light source as linear light extending in the main scanning direction;
A plurality of light receiving elements mounted on the substrate along the main scanning direction;
An image reading apparatus comprising:
The substrate has a long portion on which the plurality of light receiving elements are mounted, and a short portion on which the light source is mounted and the surface on which the light source is mounted faces the main scanning direction,
The image reading apparatus, wherein the light source includes one or more LED chips mounted directly on the short part.   The image reading apparatus according to claim 1, wherein the long part and the short part are connected by a conductive support member having flexibility.   The image reading apparatus according to claim 2, wherein the end portion near the short portion of the long portion and the end portion near the long portion of the short portion are not joined to the conduction support member.   The image reading apparatus according to claim 1, wherein the substrate is made of ceramics.   The image reading device according to claim 1, wherein the light source further includes a reflector surrounding the one or more LED chips.   The image reading apparatus according to claim 5, wherein the reflector is made of a white resin.   The image reading apparatus according to claim 5, wherein the light source further includes a translucent member that covers the one or more LED chips.   5. The image reading apparatus according to claim 1, wherein a concave portion that accommodates the one or more LED chips is formed in a portion of the light guide member that faces the short portion. A case for accommodating the substrate and the light guide member;
The image reading apparatus according to claim 1, wherein a reference wall having a surface facing a main scanning direction is formed in the case, and the short portion is in contact with the reference wall. .   The image reading apparatus according to claim 9, further comprising: a light shielding member attached so as to straddle the surface of the short portion opposite to the surface on which the light source is mounted and the case.   The image reading apparatus according to claim 10, wherein the light shielding member is further pasted so as to straddle the short part and the long part. A method of manufacturing an image reading apparatus including a substrate on which a light source and a plurality of light receiving elements arranged in a main scanning direction are mounted,
A step of attaching a conductive support member having flexibility so as to straddle a division planned portion extending in the sub-scanning direction perpendicular to the main scanning direction;
Dividing the substrate at the division part to be divided into a long part on which the plurality of light receiving elements are mounted and a short part on which the light source is mounted. A method for manufacturing an image reading apparatus.   The method for manufacturing an image reading apparatus according to claim 12, wherein one or more LED chips constituting the light source are directly mounted on the substrate.   The image reading apparatus according to claim 13, wherein the substrate is made of ceramic.   In the step of attaching the conductive support member, two anisotropic conductive films are attached in parallel to the substrate across the planned division portion, and the conductive support member is attached to the substrate using these anisotropic conductive films. The method for manufacturing an image reading apparatus according to claim 12, wherein the image reading apparatus is attached to a substrate.   The method further includes a step of attaching the substrate divided into the long portion and the short portion to a case extending in the main scanning direction. In the step of attaching to the case, the main scanning direction provided in the case is changed. The method for manufacturing an image reading apparatus according to claim 12, wherein the short portion is brought into contact with a reference wall having a facing surface.   The method for manufacturing an image reading apparatus according to claim 16, wherein in the step of attaching the substrate to the case, a light shielding member is pasted so as to straddle the short portion and the case.

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