JP2007297538A - Resin containing indole skeleton, epoxy resin containing indole skeleton, epoxy resin composition and cured product thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an epoxy resin that exhibits excellent high heat resistance and moisture resistance and gives a cured product exhibiting excellent flame retardancy and high adhesion to a material of a different kind, and also to provide a resin containing an indole skeleton that acts as an intermediate thereof. <P>SOLUTION: The resin containing an indole skeleton is represented by general formula (1) below and is obtained by causing 10-90 moles of a crosslinking agent such as an aldehyde or xylylene glycol to react with 100 moles of the total of indoles and phenols. The epoxy resin containing an indole skeleton is obtained by epoxidizing the resin containing an indole skeleton with epichlorohydrin. Formula (1) is represented by H-L-(X-L)<SB>n</SB>-H, where L is a bivalent group derived from indoles and phenols with an abundance ratio (by mole) within the range from 1:9 to 9:1; X is a bivalent group derived from a crosslinking agent such as aldehyde, ketone, xylylene glycol or divinylbenzene; and n is a numerical value of 1-10. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an indole skeleton-containing resin, an indole skeleton-containing epoxy resin useful as an epoxy resin curing agent, modifier, and the like, an epoxy resin composition using the same, and a cured product thereof. It is preferably used for insulating materials in the electric and electronic fields such as stoppers.

  Epoxy resins have been used in a wide range of industrial applications, but their required performance has become increasingly sophisticated in recent years. For example, there is a semiconductor sealing material in a typical field of a resin composition mainly composed of an epoxy resin, but as the integration degree of semiconductor elements is improved, the package size is becoming larger and thinner, and the mounting method is also increased. The transition to surface mounting is progressing, and the development of materials with excellent solder heat resistance is desired. Therefore, as a sealing material, in addition to reducing moisture absorption, improvement in adhesion and adhesion at the interface between different materials such as lead frames and chips is strongly demanded. Similarly, for circuit board materials, in addition to improving low heat absorption, high heat resistance, and high adhesion from the viewpoint of improving solder heat resistance, it is desirable to develop materials with excellent low dielectric properties from the viewpoint of reducing dielectric loss. Yes. In order to meet these requirements, various new structures of epoxy resins and curing agents have been studied. Furthermore, recently, from the viewpoint of reducing environmental impact, there has been a movement to eliminate halogen-based flame retardants, and epoxy resins and curing agents with more excellent flame retardancy have been demanded.

Japanese Patent Laid-Open No. 5-1093945 JP-A-11-140166 JP 2004-46522 A JP 2004-57992 A Japanese Patent Laid-Open No. 4-173831 JP 2000-129092 A Japanese Patent Laid-Open No. 3-90075 JP-A-3-281623

  Therefore, various epoxy resins and epoxy resin curing agents have been studied from the above background. As an example of the epoxy resin curing agent, a naphthalene-based resin is known, and Patent Document 1 discloses that a naphthol aralkyl resin is applied to a semiconductor sealing material. However, although the naphthol aralkyl resin is excellent in low hygroscopicity, low thermal expansion property, etc., it has a defect of poor curability. Moreover, although the hardening | curing agent which has a biphenyl structure is proposed in patent document 2 and it describes that it is effective for a flame retardance improvement, there existed a fault which is inferior to curability. Furthermore, both the naphthalene-based resin and the biphenyl-based resin have a main skeleton composed only of hydrocarbons, and thus are not sufficient for the expression of flame retardancy. Patent Document 3 describes an indole oligomer copolymerized with an aromatic olefin.

  On the other hand, an epoxy resin that satisfies these requirements is not yet known. For example, the well-known bisphenol type epoxy resin is in a liquid state at room temperature and is widely used because it is excellent in workability and easy to mix with a curing agent, an additive, etc. There is a problem in terms of moisture resistance. Further, novolak type epoxy resins are known as improved heat resistance, but there are problems in moisture resistance, adhesion and the like. Furthermore, the conventional epoxy resin whose main skeleton is composed of only hydrocarbons has no flame retardancy.

  As a measure for improving flame retardancy without using a halogen flame retardant, a method of adding a phosphate ester flame retardant is disclosed. However, the method using a phosphate ester flame retardant does not have sufficient moisture resistance. In addition, the phosphoric acid ester is hydrolyzed under a high temperature and humidity environment, and there is a problem that the reliability as an insulating material is lowered.

  Patent Documents 2, 5, and 6 disclose an example in which an aralkyl epoxy resin having a biphenyl structure is applied to a semiconductor encapsulant as a material that improves flame retardancy without containing phosphorus atoms or halogen atoms. Patent Document 4 discloses an example in which an aralkyl type epoxy resin having a naphthalene structure is used. However, these epoxy resins have insufficient performance in any of flame retardancy, moisture resistance, and heat resistance. Patent Documents 7 and 8 disclose a naphthol-based aralkyl epoxy resin and a semiconductor sealing material containing the naphthol-based aralkyl epoxy resin, but nothing focuses on flame retardancy.

  The object of the present invention is to provide an indole skeleton-containing resin useful as a curing agent, a modifier, etc. for an epoxy resin composition, which has excellent flame retardancy, moisture resistance, heat resistance, and adhesion to a metal substrate. Provides indole skeleton-containing epoxy resins that are useful for applications such as lamination, molding, casting, and adhesion, as well as excellent moldability and low moisture absorption, heat resistance, and adhesion. It is to provide an epoxy resin composition useful for sealing of electric / electronic parts, a circuit board material and the like which give a cured product having excellent properties and flame retardancy, and to provide a cured product thereof.

で表される基のいずれかであり、Ｒ₁は水素原子、水酸基、炭素数１〜８のアルコキシ基、ハロゲン原子又は炭素数１〜８の炭化水素基を示し、Ａは炭素数１〜８のアルキル基若しくは水酸基が置換してもよいベンゼン環又はナフタレン環からなる基を示し、式（２）と式（３）で表される基の存在割合（モル比）が１：９〜９：１の範囲であり、
Ｘは下記（ａ）又は式（ｂ）

で表される架橋基であり、Ｒ₂、Ｒ₃、Ｒ₄及びＲ₅は独立に、水素原子又は炭素数１〜８の炭化水素基を示し、Ｂはベンゼン環、ビフェニル環又はナフタレン環からなる基を示し、
ｎは１〜１０の数を示す。 The indole skeleton-containing resin of the present invention is represented by the following general formula (1).
HL- (XL) _n -H (1)
here,
L is the following formula (2) and formula (3)

R ₁ represents a hydrogen atom, a hydroxyl group, an alkoxy group having 1 to 8 carbon atoms, a halogen atom, or a hydrocarbon group having 1 to 8 carbon atoms, and A represents a group having 1 to 8 carbon atoms. A group consisting of a benzene ring or a naphthalene ring which may be substituted by an alkyl group or a hydroxyl group, wherein the abundance ratio (molar ratio) of the groups represented by the formulas (2) and (3) is 1: 9 to 9: 1 range,
X is the following (a) or formula (b)

R ₂ , R ₃ , R ₄ and R ₅ independently represent a hydrogen atom or a hydrocarbon group having 1 to 8 carbon atoms, and B represents a benzene ring, a biphenyl ring or a naphthalene ring. The group
n shows the number of 1-10.

但し、
Ｒ₁は水素原子、水酸基、炭素数１〜８のアルコキシ基、ハロゲン原子又は炭素数１〜８の炭化水素基を示し、
Ａは炭素数１〜８のアルキル基若しくは水酸基が置換してもよいベンゼン環又はナフタレン環からなる基を示し、
Ｒ₂、Ｒ₃、Ｒ₄及びＲ₅は独立に、水素原子又は炭素数１〜８の炭化水素基を示し、
Ｂはベンゼン環、ビフェニル環又はナフタレン環からなる基を示し、
Y及びZは独立にOH、アルコキシ又はハロゲンを示す。 In this indole skeleton-containing resin, the molar ratio of the indoles represented by the following formula (4) and the phenols represented by the following formula (5) is in the range of 1: 9 to 9: 1. It can obtain by making 10-90 mol of crosslinking agents represented by following formula (6), (7), (8) or (9) react with respect to mol.

However,
R ₁ represents a hydrogen atom, a hydroxyl group, an alkoxy group having 1 to 8 carbon atoms, a halogen atom or a hydrocarbon group having 1 to 8 carbon atoms,
A represents a group consisting of a benzene ring or a naphthalene ring which may be substituted by an alkyl group having 1 to 8 carbon atoms or a hydroxyl group;
R ₂ , R ₃ , R ₄ and R ₅ independently represent a hydrogen atom or a hydrocarbon group having 1 to 8 carbon atoms,
B represents a group consisting of a benzene ring, a biphenyl ring or a naphthalene ring,
Y and Z independently represent OH, alkoxy or halogen.

で表される基のいずれかであり、Ｒ₆は水素原子、グリシジルオキシ基、炭素数１〜８のアルコキシ基、ハロゲン原子又は炭素数１〜８の炭化水素基を示し、Ａは炭素数１〜８のアルキル基若しくはグリシジルオキシ基が置換してもよいベンゼン環又はナフタレン環からなる基を示し、式（１１）と式（１２）で表される基の存在割合（モル比）が１：９〜９：１の範囲であり、
Ｘは一般式（１）と同じ意味を有し、Ｙは水素原子、炭素数１〜８の炭化水素基又はグリシジル基を示し、Ｇはグリシジル基を示し、
ｎは１〜１０の数を示す。 The indole skeleton-containing epoxy resin of the present invention is represented by the following general formula (10).
HL _1- (XL ₁ ) _n -H (10)
here,
L ₁ is the following formula (11) or formula (12)

R ₆ represents a hydrogen atom, a glycidyloxy group, an alkoxy group having 1 to 8 carbon atoms, a halogen atom, or a hydrocarbon group having 1 to 8 carbon atoms, and A represents a carbon number of 1 A group consisting of a benzene ring or a naphthalene ring which may be substituted by an alkyl group or a glycidyloxy group of ˜8, and the abundance ratio (molar ratio) of the groups represented by the formulas (11) and (12) is 1: In the range of 9-9: 1,
X has the same meaning as in the general formula (1), Y represents a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms or a glycidyl group, G represents a glycidyl group,
n shows the number of 1-10.

  This indole skeleton-containing epoxy resin can be obtained by reacting an indole skeleton-containing resin represented by the general formula (1) with epichlorohydrin.

  The phenol resin composition of the present invention comprises 2 to 200 parts by weight of an indole skeleton-containing resin with respect to 100 parts by weight of polyhydric phenolic compounds. The epoxy resin composition of the present invention comprising an epoxy resin and a curing agent is formed by blending 2 to 200 parts by weight of an indole skeleton-containing resin as a part or all of the curing agent with respect to 100 parts by weight of the epoxy resin, or The indole skeleton-containing epoxy resin is blended as part or all of the epoxy resin. The cured epoxy resin of the present invention can be obtained by curing this phenol resin composition.

  The indole skeleton-containing resin (hereinafter also referred to as ISR) of the present invention is represented by the general formula (1). The indole skeleton-containing epoxy resin (hereinafter also referred to as ISE) of the present invention is represented by the general formula (10). Since ISE can be obtained by epoxidizing ISR, ISR is also an intermediate of ISE.

  In the general formula (1), L is a group selected from the groups represented by the formulas (2) and (3), and the abundance ratio thereof is 1: 9 to 9: 1, preferably 2: 8 to 8: 2. X is a group represented by formula (a) or formula (b), and n is a number from 1 to 10. Here, n + 1 L and n X in the formula (1) may be the same or different from each other, but L is a ratio of the above formula (2) and formula (3) in the resin. ) Is present. However, since the resin is a mixture, it may be present as an average. As for n, since the resin is a mixture, the average (number average) is preferably in the above range.

In Formula (2) and Formula (3), R ₁ represents a hydrogen atom, a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, a halogen atom, or a hydrocarbon group having 1 to 7 carbon atoms, and A represents a phenol (polyvalent A group derived from phenols or polycyclic aromatic phenols).

X is a bridging group represented by formula (a) or formula (b), but R ₂ , R ₃ , R ₄ and R ₅ independently represent a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms. , B represents a group consisting of a benzene ring, a biphenyl ring or a naphthalene ring. In addition, these rings constituting B may be substituted with a hydrocarbon group having 1 to 6 carbon atoms. X bridges L, but the substitution position of X with respect to the groups represented by Formula (2) and Formula (3) constituting L is not particularly limited. For example, X is in the 1-position to 7-position of the indole ring. A hydrogen atom may be substituted with a bridging group to form a linked structure, but in the formula (2), it is preferable that the hydrogen atom at the 1-position of the indole ring remains. The hydrogen atom at the 1-position of all indole rings does not need to remain, but when the hydrogen atom at the 1-position of all indole rings is substituted, the indole skeleton-containing resin of the present invention functions as a curing agent. Is not fully expressed.

  The softening point of ISR is preferably 40 to 200 ° C, preferably 50 to 160 ° C, more preferably 60 to 120 ° C. Here, the softening point refers to a softening point measured based on the ring and ball method of JISK-6911. When lower than this, when this is mix | blended with an epoxy resin, the heat resistance of hardened | cured material will fall, and when higher than this, the fluidity | liquidity at the time of shaping | molding will fall.

  The ISR of the present invention can itself be a component of a phenol resin composition or an epoxy resin composition, but in some cases, an indole skeleton-containing resin can be substituted with a halogenated alkyl compound, a halogenated alkenyl compound, an epihalohydrin compound, or the like. By reacting, some or all of the —NH— and —OH hydrogen atoms in the indole skeleton-containing resin can be substituted with alkyl groups, alkenyl groups, glycidyl groups, and the like.

  The ISR of the present invention is represented by the indole represented by the formula (4) and the phenol represented by the formula (5), and the formula (6), the formula (7), (8) or (9). It can be synthesized by reacting a crosslinking agent. In this case, the amount of the crosslinking agent used is in the range of 0.1 to 0.9 mol, preferably in the range of 0.2 to 0.8 mol, with respect to a total of 1 mol of indoles and phenols. is there. If it is smaller than this, the amount of unreacted indoles and phenols increases during synthesis, the productivity of ISR decreases, the softening point of the synthesized ISR decreases, and curing when used as an epoxy resin curing agent The heat resistance of the object decreases. On the other hand, if it is larger than this, the softening point of ISR becomes high, and in some cases, ISR may gel during synthesis. In addition, the use ratio of indoles and phenols is adjusted so as to be the above ratio, but since indoles are more reactive with a crosslinking agent, it is better to make phenols somewhat higher than the theoretical amount. There is a case.

  This reaction can be carried out without a catalyst or in the presence of an acid catalyst. The acid catalyst can be appropriately selected from known inorganic acids and organic acids. For example, mineral acids such as hydrochloric acid, sulfuric acid, phosphoric acid, organic acids such as formic acid, oxalic acid, trifluoroacetic acid, p-toluenesulfonic acid, dimethyl sulfuric acid, diethyl sulfuric acid, zinc chloride, aluminum chloride, iron chloride, trifluoride. Examples thereof include Lewis acids such as boron fluoride or ion exchange resins, activated clay, silica-alumina, zeolite and other solid acids.

  Moreover, this reaction is normally performed at 10-250 degreeC for 1 to 20 hours. Further, during the reaction, alcohols such as methanol, ethanol, propanol, butanol, ethylene glycol, methyl cellosolve, ethyl cellosolve, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, dimethyl ether, diethyl ether, diisopropyl ether, Ethers such as tetrahydrofuran and dioxane, aromatic compounds such as benzene, toluene, chlorobenzene, and dichlorobenzene can be used as the solvent.

  As indoles used as a raw material, in addition to indoles, there are indoles substituted with a hydroxyl group, an alkoxy group, a halogen atom or a hydrocarbon group as a substituent. For example, the halogen atom includes a fluorine atom, a chlorine atom, a bromine atom and the like, and the alkoxy group includes a methoxy group, an ethoxy group, a vinyl ether group, an isopropoxy group, an allyloxy group, a propargyl ether group, a putoxy group, and a phenoxy group. . In addition, as the hydrocarbon group, various substituted indoles having a methyl group, an ethyl group, a vinyl group, an ethyne group, an isopropyl group, an allyl group, a propargyl group, a butyl group, an amyl group, a phenyl group, a benzyl group, etc. should be used. Indole is preferable.

  Examples of phenols include phenols, alkylphenols such as cresols and xylenols, polyhydric phenols such as hydroquinone, polycyclic phenols such as naphthols and naphthalenediols, bisphenols such as bisphenol A and bisphenol F, Or polyfunctional phenol compounds, such as a phenol novolak and a phenol aralkyl resin, are illustrated. These monomers can be used singly or in combination of two or more. From the physical properties of the cured product obtained by containing an indole skeleton-containing resin, inclusion of the indole skeleton of the indole skeleton-containing resin is included. Higher rates are better, but there are no particular restrictions.

  Examples of the crosslinking agent include aldehydes such as formaldehyde, acetaldehyde, propyl aldehyde, butyraldehyde, amyl aldehyde, and benzaldehyde represented by the formula (6), and formaldehyde is preferable. Preferred formaldehyde raw materials used in the reaction include an aqueous formalin solution, paraformaldehyde, trioxane and the like. In addition, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and acetophenone represented by the formula (7) can also be used as a crosslinking agent.

Furthermore, the crosslinking agent represented by the formula (8) includes p-xylylene glycol, p-xylylene glycol dimethyl ether, p-xylylene dichloride, 4,4′-dimethoxymethylbiphenyl, 4,4′-dichloromethyl. Biphenyl, dimethoxymethylnaphthalene and dichloromethylnaphthalene are mentioned.
In addition, divinylbenzenes, divinylbiphenyls, divinylnaphthalenes and the like represented by the formula (9) can also be used as a crosslinking agent.

  After completion of the reaction, in some cases, unreacted indoles and phenols remain in the obtained ISR. The remaining indoles and phenols are usually removed from the system by methods such as distillation under reduced pressure or solvent splitting. The amount of unreacted indole and phenol remaining in the ISR is preferably small, and is usually 5% by weight or less, preferably 3% by weight or less, more preferably 1% by weight or less. If the amount of the remaining indoles and phenols is large, it volatilizes during the production of the molded product, which may reduce molding workability and cause voids in the molded product. Moreover, the flame retardance of a molded product also falls.

  The phenol resin composition of the present invention comprises the above ISR in a polyhydric phenolic compound. The content of ISR is 2 to 200 parts by weight, preferably 5 to 100 parts by weight, and more preferably 10 to 80 parts by weight with respect to 100 parts by weight of the polyhydric phenolic compounds. If it is less than this, the modification effects such as low hygroscopicity, heat resistance, adhesion, and flame retardancy are small, and if it is more than this, the viscosity becomes high and the moldability deteriorates.

  The polyhydric phenolic compounds mentioned here refer to all compounds having two or more phenolic hydroxyl groups in one molecule, for example, bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, 4,4′-biphenol, Divalent phenols such as 2,2′-biphenol, hydroquinone, resorcin, naphthalenediol, or tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, There are trivalent or higher phenols represented by phenol novolak, o-cresol novolak, naphthol novolak, polyvinylphenol and the like. Furthermore, divalent phenols such as phenols, naphthols, bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, 4,4′-biphenol, 2,2′-biphenol, hydroquinone, resorcin, naphthalenediol, Formaldehyde, acetaldehyde, benzaldehyde, p-hydroxybenzaldehyde, p-xylylene glycol, p-xylylene glycol dimethyl ether, 4,4'-dimethoxymethylbiphenyl, 4,4'-dimethoxymethyldiphenyl ether, divinylbenzenes, divinylbiphenyls, There are polyhydric phenolic compounds synthesized by reaction with a crosslinking agent such as divinylnaphthalene. Hereinafter, the polyhydric phenolic compounds may be described as a phenol resin.

  The softening point of the phenol resin is usually in the range of 40 to 200 ° C, preferably 60 to 150 ° C. When lower than this, the heat resistance of the hardened | cured material obtained by using as a hardening | curing agent of an epoxy resin will fall. Moreover, when higher than this, the mixability with ISR will fall.

  The phenol resin composition of the present invention is obtained by dissolving both in a melt mixing method in which mixing is performed by stirring, kneading, etc. at a temperature equal to or higher than the softening point of either one of the phenol resin or ISR, and a solvent for dissolving each. Thus, it can be obtained by a method such as a solution mixing method in which the mixture is uniformly mixed by stirring, kneading or the like. Examples of the solvent used in the solution mixing method include alcohols such as methanol, ethanol, propanol, butanol, ethylene glycol, methyl cellosolve, and ethyl cellosolve, ketones such as acetone, methyl ethyl ketone, and methyl isobutyl ketone, dimethyl ether, diethyl ether, and diisopropyl ether. And ethers such as tetrahydrofuran and dioxane, and aromatic solvents such as benzene, toluene, xylene, chlorobenzene and dichlorobenzene. In addition, when obtaining this composition, an epoxy resin, an inorganic filler, another phenol resin, and another additive (material) can also be mix | blended.

  The phenol resin composition of this invention can be made into a phenol resin hardened | cured material by using together with the hardening | curing agent generally used for phenol resin molding materials, such as hexamethyltetramine.

Next, the ISE of the present invention represented by the general formula (10) will be described.
In the general formula (10), L ₁ is a group selected from groups represented by the formula (11) or the formula (12), and the abundance ratio thereof is 1: 9 to 9: 1, preferably 2: 8 to 8: 2. Moreover, X is group represented by Formula (a) or Formula (b), and n is a number of 1-10. Here, when there are a plurality of L ₁ and X in the formula (10), they may be the same or different, but L ₁ is represented by the formula (11) and the formula ( There is a group represented by 12). However, since the resin is a mixture, it may be present as an average.

In Formula (11) and Formula (12), R ₆ represents a hydrogen atom, an alkoxy group having 1 to 8 carbon atoms, a glycidyloxy group, a halogen atom, or a hydrocarbon group having 1 to 8 carbon atoms. Here, examples of the alkoxy group include a methoxy group, an ethoxy group, a vinyl ether group, an isopropoxy group, an allyloxy group, a propargyl ether group, a putoxy group, a phenoxy group, and a benzyloxy group, and the halogen atom includes a fluorine atom, a chlorine atom, Examples include bromine atoms. The hydrocarbon groups include methyl, ethyl, vinyl, ethyne, n-propyl, isopropyl, allyl, propargyl, n-butyl, sec-butyl, tert-butyl, n- Examples include amyl group, sec-amyl group, tert-amyl group, cyclohexyl group, phenyl group, benzyl group and the like. A is a group formed by epoxidizing phenols (which may be polyhydric phenols or polycyclic aromatic phenols).

X and n have the same meaning as X and n in the general formula (1). That is, X is a crosslinking group represented by formula (a) or formula (b). n is a number from 1 to 10. In addition, although resin is a mixture, it is good for n of the average (number average) to also exist in the said range.

  The ISE of the present invention is advantageously produced by reacting the ISR represented by the general formula (1) with epichlorohydrin, but is not limited to this reaction. The ISR represented by the general formula (1) is a resin in which at least a part, preferably all of the site epoxidized with epichlorohydrin is H or OH, and the above formulas (10) to (12 ) Corresponds to a compound in which the site that is a glycidyl ether group is OH and the site that is a glycidyl group is H. In addition, in general formula (11), it is advantageous in terms of flame retardancy to epoxidize such that a part of Y is H and a part is a glycidyl group.

  In addition to the reaction of reacting ISR with epichlorohydrin, a method of reacting ISR with an allyl halide to form an allyl ether compound and then reacting with a peroxide can be used. The reaction for reacting the ISR with epichlorohydrin can be carried out in the same manner as a normal epoxidation reaction.

  For example, after dissolving the ISR in excess epichlorohydrin, in the presence of an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide, 20 to 150 ° C., preferably 30 to 80 ° C. in the range of 1 to 10 The method of making it react for time is mentioned. The amount of the alkali metal hydroxide used in this case is 0.8 to 1.5 mol, preferably 0.9 to 1.2 mol with respect to 1 mol of the hydroxyl group of ISR. Epichlorohydrin is used in excess with respect to 1 mol of the hydroxyl group in the ISR, but is usually in the range of 1.5 to 30 mol, preferably 2 to 15 mol, with respect to 1 mol of the hydroxyl group in the ISR. After completion of the reaction, excess epichlorohydrin is distilled off, the residue is dissolved in a solvent such as toluene, methyl isobutyl ketone, filtered, washed with water to remove inorganic salts, and then the target epoxy is removed by distilling off the solvent. A resin can be obtained.

The epoxy resin composition of the present invention contains at least an epoxy resin and a curing agent, and there are the following three types.
1) A composition containing the ISR as a part or all of the curing agent.
2) The composition which mix | blended the said ISE as a part or all of an epoxy resin.
3) The composition which mix | blended the said ISR and ISE as part or all of an epoxy resin and a hardening | curing agent.

  In the case of the above compositions 1) and 3), the amount of ISR is usually in the range of 2 to 200 parts by weight, preferably 5 to 80 parts by weight with respect to 100 parts by weight of the epoxy resin. If it is less than this, the effect of improving low hygroscopicity, adhesion and flame retardancy is small, and if it is more than this, there is a problem that the moldability and the strength of the cured product are lowered.

  When the ISR of the present invention is used as the total amount of the curing agent, the amount of ISR is usually determined in consideration of the equivalent balance of the —NH— group and —OH group of the ISR and the epoxy group in the epoxy resin. The equivalent ratio of the epoxy resin and the curing agent is usually in the range of 0.2 to 5.0, preferably in the range of 0.5 to 2.0. If it is larger or smaller than this, the curability of the epoxy resin composition is lowered, and the heat resistance, mechanical strength and the like of the cured product are lowered.

  A curing agent other than the ISR of the present invention can be used in combination as the curing agent. The amount of the other curing agent is determined so that the amount of the ISR is usually 2 to 200 parts by weight, preferably 5 to 80 parts by weight, based on 100 parts by weight of the epoxy resin. . If the amount of ISR is less than this, the effect of improving low hygroscopicity, adhesion and flame retardancy is small, and if it is more than this, there is a problem that the moldability and the strength of the cured product are lowered.

  As the curing agent other than ISR, any of those generally known as curing agents for epoxy resins can be used, and examples thereof include dicyandiamide, acid anhydrides, polyhydric phenols, aromatic and aliphatic amines. Among these, polyhydric phenols are preferably used as a curing agent in a field where high electrical insulation properties such as a semiconductor sealing material are required. Below, the specific example of a hardening | curing agent is shown.

  Examples of the acid anhydride curing agent include phthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyl hymic anhydride, dodecynyl succinic anhydride, nadic anhydride, There are trimellitic anhydride and the like.

  Examples of the polyhydric phenols include divalent phenols such as bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, 4,4′-biphenol, 2,2′-biphenol, hydroquinone, resorcin, naphthalenediol, or the like. , Tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, phenol novolak, o-cresol novolak, naphthol novolak, polyvinylphenol, There are phenols. Furthermore, divalent phenols such as phenols, naphthols, bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, 4,4′-biphenol, 2,2′-biphenol, hydroquinone, resorcin, naphthalenediol, There are polyhydric phenolic compounds synthesized by a condensing agent such as formaldehyde, acetaldehyde, benzaldehyde, p-hydroxybenzaldehyde, p-xylylene glycol and the like. Moreover, the phenol resin composition of the present invention can be blended.

  Examples of amines include aromatic amines such as 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylpropane, 4,4′-diaminodiphenylsulfone, m-phenylenediamine, and p-xylylenediamine, ethylenediamine, There are aliphatic amines such as hexamethylenediamine, diethylenetriamine, and triethylenetetramine.

  One or more of these curing agents can be mixed and used in the composition.

  The epoxy resin used in the composition is selected from those having two or more epoxy groups in one molecule. For example, divalent phenols such as bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, 4,4′-biphenol, 2,2′-biphenol, tetrabromobisphenol A, hydroquinone, resorcin, or tris- (4 -Hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, novolak resins such as phenol, cresol and naphthol, and aralkyl resins such as phenol, cresol and naphthol There are glycidyl etherified compounds of the active compound. These epoxy resins can be used alone or in combination of two or more.

  In the case of the above compositions 2) and 3), as the curing agent, any of those generally known as epoxy resin curing agents can be used. Examples include dicyandiamide, polyhydric phenols, acid anhydrides, aromatic and aliphatic amines described above. Moreover, the ISR represented by the general formula (1) is also preferably exemplified. In the resin composition, one or more of these curing agents can be mixed and used.

  Moreover, in this epoxy resin composition, you may mix | blend another kind of epoxy resin other than ISE represented by General formula (10) as an epoxy resin component. As the epoxy resin in this case, all ordinary epoxy resins having two or more epoxy groups in the molecule can be used. Examples include divalent phenols such as bisphenol A, bisphenol S, fluorene bisphenol, 4,4′-biphenol, 2,2′-biphenol, hydroquinone, resorcin, or tris- (4-hydroxyphenyl) methane. , 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, phenol novolac, o-cresol novolak, and more trivalent phenols, phenol-based aralkyl resins, naphthol-based aralkyl resins, or tetrabromobisphenol There are glycidyl ethers derived from halogenated bisphenols such as A. These epoxy resins can be used alone or in combination of two or more. And in the case of the composition which has ISE of this invention as an essential component, the compounding quantity of ISE represented by General formula (1) is 5-100% in the whole epoxy resin, Preferably it is the range of 60-100%. It is good.

  In the epoxy resin composition of the present invention, an oligomer or a polymer compound such as polyester, polyamide, polyimide, polyether, polyurethane, petroleum resin, indene resin, indene-coumarone resin, phenoxy resin, etc. is used as another modifier. You may mix | blend suitably. The addition amount is usually in the range of 2 to 30 parts by weight with respect to 100 parts by weight of the epoxy resin.

  In addition, the epoxy resin composition of the present invention can contain additives such as inorganic fillers, pigments, refractory agents, thixotropic agents, coupling agents, fluidity improvers and the like. Examples of inorganic fillers include silica powder such as spherical or crushed fused silica and crystalline silica, alumina powder, glass powder, mica, talc, calcium carbonate, alumina, hydrated alumina, and the like. A preferable blending amount when used for a stopper is 70% by weight or more, and more preferably 80% by weight or more.

  Examples of the pigment include organic or inorganic extender pigments, scaly pigments, and the like. Examples of the thixotropic agent include silicon-based, castor oil-based, aliphatic amide wax, polyethylene oxide wax, and organic bentonite-based.

  Furthermore, a curing accelerator can be used in the epoxy resin composition of the present invention as necessary. Examples include amines, imidazoles, organic phosphines, Lewis acids, etc., specifically 1,8-diazabicyclo (5,4,0) undecene-7, triethylenediamine, benzyldimethylamine, Tertiary amines such as ethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol, 2-methylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 2- Imidazoles such as heptadecylimidazole, organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, and phenylphosphine, tetraphenylphosphonium tetraphenylborate, tetraphenyl Tetraphenyl such as ruphosphonium / ethyltriphenylborate, tetrabutylphosphonium / tetrabutylborate, tetrasubstituted phosphonium / tetrasubstituted borate, 2-ethyl-4-methylimidazole / tetraphenylborate, N-methylmorpholine / tetraphenylborate, etc. There is boron salt. The addition amount is usually in the range of 0.2 to 5 parts by weight with respect to 100 parts by weight of the epoxy resin.

  Further, if necessary, the resin composition of the present invention includes a release agent such as carnauba wax and OP wax, a coupling agent such as γ-glycidoxypropyltrimethoxysilane, a colorant such as carbon black, and trioxide. Flame retardants such as antimony, low stress agents such as silicone oil, lubricants such as calcium stearate, etc. can be used.

  The epoxy resin composition of the present invention is made into a varnish in which an organic solvent is dissolved, and then impregnated into a fibrous material such as glass cloth, aramid nonwoven fabric, polyester nonwoven fabric such as liquid crystal polymer, etc., and then the solvent is removed, It can be. Moreover, it can be set as a laminated body by apply | coating on sheet-like materials, such as copper foil, stainless steel foil, a polyimide film, and a polyester film depending on the case.

  If the epoxy resin composition of the present invention is cured by heating, an epoxy resin cured product can be obtained, and this cured product is excellent in terms of low hygroscopicity, high heat resistance, adhesion, flame retardancy, and the like. Become. This cured product can be obtained by molding the epoxy resin composition by a method such as casting, compression molding, transfer molding or the like. The temperature at this time is usually in the range of 120 to 220 ° C.

  The ISR of the present invention is useful as an epoxy resin intermediate, an epoxy resin curing agent, and a modifier. When applied to an epoxy resin composition, the ISR has excellent high heat resistance and moisture resistance, and flame retardancy. In addition, it can provide a cured product with excellent adhesion to different materials, and can be suitably used for applications such as sealing of electric / electronic parts and circuit board materials. If the epoxy resin composition containing the ISR or ISE of the present invention is heat-cured, it can be made into an epoxy resin cured product, and this cured product has flame retardancy, low moisture absorption, high heat resistance, adhesion, etc. It is excellent in terms of point and can be suitably used for applications such as sealing of electric / electronic parts, circuit board materials, and the like.

Hereinafter, the present invention will be described more specifically with reference to examples.
Here, the viscosity was measured using a B-type viscometer, and the softening point was measured by the ring and ball method according to JIS K-6911. GPC measurement conditions were as follows: apparatus; HLC-82A (manufactured by Tosoh Corp.), column; TSK-GEL2000 × 3 and TSK-GEL4000 × 1 (both manufactured by Tosoh Corp.), solvent: tetrahydrofuran, flow rate 1 ml / min, temperature; 38 ° C., detector; RI, and polystyrene standard solution was used for the calibration curve.

Example 1
A 500 mL, 3-neck separable flask equipped with a stirrer, a condenser tube, and a nitrogen inlet tube was charged with 25.0 g of indole, 276.9 g of 1-naphthol, 112.2 g of p-xylylene dichloride and 276 g of monochlorobenzene, and nitrogen was added. While being introduced, it was heated to 80 ° C. and dissolved. Thereafter, the mixture was heated to 150 ° C. with stirring under reduced pressure and reacted for 3 hours. During this time, hydrochloric acid and monochlorobenzene produced by the reaction were removed from the system. Thereafter, the temperature was raised to 230 ° C. under reduced pressure to remove hydrochloric acid, unreacted 1-naphthol, and indole, thereby obtaining 203.6 g of ISR-A. The softening point of the obtained resin was 100 ° C., and the melt viscosity at 150 ° C. was 0.65 Pa · s. The residual monomer amount determined by GPC measurement was 0.5 wt%.

Example 2
40.0 g of indole, 289.2 g of phenol, 257.4 g of 4,4′-bischloromethylbiphenyl and 147 g of monochlorobenzene were charged and heated to 80 ° C. and dissolved while introducing nitrogen. Then, it heated up to 150 degreeC, stirring under reduced pressure, and was made to react for 1 hour. During this time, hydrochloric acid and monochlorobenzene produced by the reaction were removed from the system. Thereafter, hydrochloric acid, unreacted phenol and indole were removed at 180 ° C. under reduced pressure to obtain 348.6 g of ISR-B. The resulting resin had a softening point of 94 ° C. and a melt viscosity at 150 ° C. of 0.93 Pa · s. The residual monomer amount determined by GPC measurement was 0.5 wt%.

Example 3
Reaction was carried out in the same manner as in Example 2 using 11.5 g of indole, 83.2 g of phenol, 49.3 g of bischloromethylnaphthalene, and 36 g of monochlorobenzene to obtain 70.1 g of ISR-C. The resulting resin had a softening point of 119 ° C. and a melt viscosity at 150 ° C. of 12.3 Pa · s. The residual monomer amount determined by GPC measurement was 0.4 wt%.

Example 4
A 500 mL, 3-neck separable flask equipped with a stirrer, a condenser tube, and a nitrogen inlet tube was charged with 72.5 g of indole, 233.1 g of phenol, and 27.9 g of 92% paraformaldehyde, and the temperature was increased to 90 ° C. while introducing nitrogen. Heat to dissolve. Then, it heated up at 130 degreeC, stirring, and was made to react for 3 hours. During this time, water produced by the reaction was removed from the system. Then, it heated up at 180 degreeC under pressure reduction, condensed water, unreacted phenol, and indole were removed, and ISR-D150g was obtained. The resulting resin had a softening point of 83 ° C. and a melt viscosity at 150 ° C. of 0.12 Pa · s. The residual monomer amount determined by GPC measurement was 0.5 wt%.

Example 5
The reaction was carried out in the same manner as in Example 1 using 106.3 g of indole, 199.2 g of phenol, and 27.2 g of 92% paraformaldehyde to obtain 130 g of ISR-E. The resulting resin had a softening point of 135 ° C. and a melt viscosity at 180 ° C. of 0.58 Pa · s. The residual monomer amount determined by GPC measurement was 0.4 wt%.

FIG. 1 shows the ¹ H-NMR spectrum of ISR-A, FIG. 2 shows the infrared absorption spectrum, and FIG. 3 shows the GPC chart. FIG. 4 shows the ¹ H-NMR spectrum of ISR-B, FIG. 5 shows the infrared absorption spectrum, and FIG. 6 shows the GPC chart. FIG. 7 shows the ¹ H-NMR spectrum of ISR-C, FIG. 8 shows the infrared absorption spectrum, and FIG. 9 shows the GPC chart. FIG. 10 shows the ¹ H-NMR spectrum of ISR-D, FIG. 11 shows the infrared absorption spectrum, and FIG. 12 shows the GPC chart.

Example 6
In 100 g of phenol novolak (softening point 82 ° C., OH equivalent 103) melted at 150 ° C., 100 g of ISR-B obtained in Example 2 was added and uniformly melted to obtain 200 g of a phenol resin composition (resin Composition A). The obtained phenol resin composition had a softening point of 90 ° C. and a melt viscosity at 150 ° C. of 0.60 Pa · s.

Example 7
In 100 g of phenol novolak (softening point 82 ° C., OH equivalent 103) melted at 150 ° C., 100 g of ISR-D obtained in Example 4 was added and uniformly melted to obtain 200 g of a phenol resin composition (resin Composition B). The resulting phenol resin composition had a softening point of 82 ° C. and a melt viscosity at 150 ° C. of 0.18 Pa · s.

Examples 8-18 and Comparative Examples 1-4
An o-cresol novolak type epoxy resin (OCNE; epoxy equivalent 200, softening point 65 ° C.) as an epoxy resin component, and ISR-A, ISR-B, and ISR obtained in Examples 1, 2, 3, 4, and 5 as a curing agent. -C, ISR-D, ISR-E, phenol resin composition (resin compositions A and B) obtained in Examples 6 and 7, phenol novolak (curing agent A: manufactured by Gunei Chemical Co., PSM-4261; OH equivalent 103, softening point 82 ° C.), phenol aralkyl resin (curing agent B; manufactured by Meiwa Kasei Co., Ltd., MEH-7800SS, OH equivalent 175, softening point 67 ° C.), silica as filler (average particle size 18 μm), curing accelerator Triphenylphosphine was kneaded as shown in Tables 1 and 3 to obtain an epoxy resin composition. This epoxy resin composition was molded at 175 ° C. and post-cured at 175 ° C. for 12 hours to obtain a cured product test piece, which was then subjected to various physical property measurements.

  The glass transition point (Tg) and linear expansion coefficient (CTE) were measured at a rate of temperature increase of 10 ° C./min using a thermomechanical measuring device. Further, the water absorption is 50 mm in diameter and 3 mm in thickness using a circular test piece, and the water absorption obtained by absorbing moisture for 100 hours at 85 ° C. and 85% RH is 50 mm in diameter using the present epoxy resin composition. A disk with a thickness of 3 mm was formed, and the weight change rate after post-curing and after absorbing moisture at 133 ° C., 3 atm for 96 hours. The adhesive strength was obtained by molding a molded product of 25 mm × 12.5 mm × 0.5 mm between two copper plates at 175 ° C. with a compression molding machine, post-curing at 180 ° C. for 12 hours, and then adjusting the tensile shear strength. Evaluated by seeking. Flame retardance was measured by molding a 1/16 inch thick test piece, evaluated according to the UL94V-0 standard, and expressed as the total burning time of 5 test pieces. The results are summarized in Table 2 and Table 4.

Example 19
150 g of ISR-B obtained in Example 2 was dissolved in 403 g of epichlorohydrin and 60 g of diethylene glycol dimethyl ether. Then, 48.9 g of 48.9% sodium hydroxide was added over 4 hours at 65 ° C. under reduced pressure with stirring, and the reaction was continued at 70 ° C. for 1 hour after the addition. After completion of the reaction, epichlorohydrin was distilled off under reduced pressure and then dissolved in MIBK. The salt produced by filtration was removed, and after further washing with water, MIBK was distilled off under reduced pressure to obtain 146 g of an epoxy resin (ISE-B). The resulting epoxy resin had a softening point of 83 ° C., a melt viscosity of 0.97 Pa · s, and an epoxy equivalent of 330 g / eq. Met. The results of NMR, IR, and GPC measurements on ISE-B are shown in FIGS.

Example 20
100 g of ISR-D obtained in Example 4 was dissolved in 178 g of epichlorohydrin and 36 g of diethylene glycol dimethyl ether. Thereafter, 33.7 g of 96% potassium hydroxide was added over 3 hours at 50 ° C. with stirring, and the reaction was continued for another hour after the addition was completed. After completion of the reaction, the salt produced by filtration was removed, and after further washing with water, epichlorohydrin was distilled off to obtain 110 g of an epoxy resin (ISE-D). The resulting epoxy resin had a softening point of 78 ° C., a melt viscosity of 0.28 Pa · s, and an epoxy equivalent of 278 g / eq. Met. ISE-D measured by NMR, IR and GPC and shown in FIGS.

Examples 21-28 and Comparative Examples 5-10
As an epoxy resin component, ISE-B synthesized in Example 19, ISE-D synthesized in Example 20, o-cresol novolac type epoxy resin (OCNE; epoxy equivalent 200, softening point 65 ° C.), biphenyl type epoxy resin ( ISR-A synthesized in Example 1, ISR-D synthesized in Example 4, phenol novolak (curing agent A: Curing agent A: YX4000HK; Epoxy equivalent 195, melting point 105 ° C.) manufactured by Japan Epoxy Resin Made by Gunei Chemical Co., Ltd., PSM-4261; OH equivalent 103, softening point 82 ° C.), 1-naphthol aralkyl type resin (curing agent B: manufactured by Nippon Steel Chemical Co., Ltd., SN-475; OH equivalent 210, softening point 77 ° C.) Using. Furthermore, spherical silica (average particle size 18 μm) was used as a filler, triphenylphosphine was used as a curing accelerator, and epoxy resin compositions were obtained with the formulations shown in Tables 5 and 7. The numerical value in a table | surface shows the weight part in a mixing | blending.

  This epoxy resin composition was molded at 175 ° C., and further post-cured at 175 ° C. for 12 hours to obtain a cured product test piece, which was then subjected to various physical property measurements. The results are shown in Tables 6 and 8.

¹ H-NMR spectrum of ISR-A Infrared absorption spectrum of ISR-A ISR-A GPC chart ¹ H-NMR spectrum of ISR-B Infrared absorption spectrum of ISR-B ISR-B GPC chart ¹ H-NMR spectrum of ISR-C Infrared absorption spectrum of ISR-C ISR-C GPC chart ¹ H-NMR spectrum of ISR-D Infrared absorption spectrum of ISR-D ISR-D GPC chart ¹ H-NMR spectrum of ISE-B Infrared absorption spectrum of ISE-B ISE-B GPC Chart ¹ H-NMR spectrum of ISE-D Infrared absorption spectrum of ISE-D ISE-D GPC chart

Claims (10)

The following general formula (1)
HL- (XL) _n -H (1)
here,
L is the following formula (2) and formula (3)

R ₁ represents a hydrogen atom, a hydroxyl group, an alkoxy group having 1 to 8 carbon atoms, a halogen atom, or a hydrocarbon group having 1 to 8 carbon atoms, and A represents a group having 1 to 8 carbon atoms. A group consisting of a benzene ring or a naphthalene ring which may be substituted by an alkyl group or a hydroxyl group, wherein the abundance ratio (molar ratio) of the groups represented by the formulas (2) and (3) is 1: 9 to 9: 1 range,
X is the following (a) or formula (b)

R ₂ , R ₃ , R ₄ and R ₅ independently represent a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, and B represents a benzene ring, a biphenyl ring or a naphthalene ring. The group
n represents a number from 1 to 10;
An indole skeleton-containing resin represented by   The indole skeleton-containing resin according to claim 1, which has a softening point of 40 to 200 ° C. The molar ratio of the indoles represented by the following formula (4) and the phenols represented by the following formula (5) is in the range of 1: 9 to 9: 1. 6), (7), (8) or a method for producing an indole skeleton-containing resin characterized by reacting 10 to 90 moles of the crosslinking agent represented by (9).

here,
R ₁ represents a hydrogen atom, a hydroxyl group, an alkoxy group having 1 to 6 carbon atoms, a halogen atom or a hydrocarbon group having 1 to 8 carbon atoms,
A represents a group consisting of a benzene ring or a naphthalene ring which may be substituted by an alkyl group having 1 to 6 carbon atoms or a hydroxyl group;
R ₂ , R ₃ , R ₄ and R ₅ independently represent a hydrogen atom or a hydrocarbon group having 1 to 8 carbon atoms,
B represents a group consisting of a benzene ring, a biphenyl ring or a naphthalene ring,
Y and Z independently represent OH, alkoxy or halogen.   The phenol resin composition formed by mix | blending 2-200 weight part of indole skeleton containing resin of Claim 1 or 2 with respect to 100 weight part of polyhydric phenolic compounds.   In an epoxy resin composition comprising an epoxy resin and a curing agent, the indole skeleton-containing resin according to claim 1 or 2 as a part or all of the curing agent is blended in an amount of 2 to 200 parts by weight with respect to 100 parts by weight of the epoxy resin. An epoxy resin composition characterized by comprising:   An epoxy resin cured product obtained by curing the epoxy resin composition according to claim 5. The following general formula (10)
HL _1- (XL ₁ ) _n -H (10)
here,
L ₁ is the following formula (11) or formula (12)

R ₆ represents a hydrogen atom, a glycidyloxy group, an alkoxy group having 1 to 8 carbon atoms, a halogen atom, or a hydrocarbon group having 1 to 8 carbon atoms, and A represents a carbon number of 1 A group consisting of a benzene ring or a naphthalene ring which may be substituted by an alkyl group or a glycidyloxy group of ˜8, and the abundance ratio (molar ratio) of the groups represented by the formulas (11) and (12) is 1: In the range of 9-9: 1,
X is the following formula (a) or formula (b)

R ₂ , R ₃ , R ₄ and R ₅ independently represent a hydrogen atom or a hydrocarbon group having 1 to 6 carbon atoms, and B represents a benzene ring, a biphenyl ring or a naphthalene ring. Y represents a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms or a glycidyl group, G represents a glycidyl group,
n represents a number from 1 to 10;
An indole skeleton-containing epoxy resin represented by   An epoxy resin composition comprising an epoxy resin and a curing agent, wherein the epoxy resin according to claim 7 is blended as an essential component.   Hardened | cured material formed by hardening | curing the epoxy resin composition of Claim 8.   The method for producing an epoxy resin according to claim 7, wherein the indole skeleton-containing resin according to claim 1 is reacted with epichlorohydrin.

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