JP2007296590A5 - - Google Patents

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Publication number
JP2007296590A5
JP2007296590A5 JP2006124727A JP2006124727A JP2007296590A5 JP 2007296590 A5 JP2007296590 A5 JP 2007296590A5 JP 2006124727 A JP2006124727 A JP 2006124727A JP 2006124727 A JP2006124727 A JP 2006124727A JP 2007296590 A5 JP2007296590 A5 JP 2007296590A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006124727A
Other languages
Japanese (ja)
Other versions
JP2007296590A (en
JP5037849B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2006124727A priority Critical patent/JP5037849B2/en
Priority claimed from JP2006124727A external-priority patent/JP5037849B2/en
Priority to TW096114281A priority patent/TWI415726B/en
Priority to KR1020070040995A priority patent/KR101313322B1/en
Priority to CN2007101009268A priority patent/CN101064239B/en
Publication of JP2007296590A publication Critical patent/JP2007296590A/en
Publication of JP2007296590A5 publication Critical patent/JP2007296590A5/ja
Application granted granted Critical
Publication of JP5037849B2 publication Critical patent/JP5037849B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006124727A 2006-04-28 2006-04-28 Sheet cutting method Expired - Fee Related JP5037849B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006124727A JP5037849B2 (en) 2006-04-28 2006-04-28 Sheet cutting method
TW096114281A TWI415726B (en) 2006-04-28 2007-04-23 Plate cutting method
KR1020070040995A KR101313322B1 (en) 2006-04-28 2007-04-26 Sheet cutting method
CN2007101009268A CN101064239B (en) 2006-04-28 2007-04-28 Sheet material cutting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006124727A JP5037849B2 (en) 2006-04-28 2006-04-28 Sheet cutting method

Publications (3)

Publication Number Publication Date
JP2007296590A JP2007296590A (en) 2007-11-15
JP2007296590A5 true JP2007296590A5 (en) 2009-03-05
JP5037849B2 JP5037849B2 (en) 2012-10-03

Family

ID=38766514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006124727A Expired - Fee Related JP5037849B2 (en) 2006-04-28 2006-04-28 Sheet cutting method

Country Status (4)

Country Link
JP (1) JP5037849B2 (en)
KR (1) KR101313322B1 (en)
CN (1) CN101064239B (en)
TW (1) TWI415726B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5028233B2 (en) * 2007-11-26 2012-09-19 日東電工株式会社 Semiconductor wafer protective tape cutting method and protective tape cutting device
JP5603100B2 (en) * 2010-02-19 2014-10-08 リンテック株式会社 Sheet cutting device and cutting method
JP5603101B2 (en) * 2010-02-19 2014-10-08 リンテック株式会社 Sheet cutting device and cutting method
ITBO20110737A1 (en) * 2011-12-20 2013-06-21 Giuseppe Gallucci METHOD FOR THE RECEPTION OF PANELS AND DEVICE TO IMPLEMENT THIS METHOD
CN103600366B (en) * 2013-11-22 2016-05-04 芜湖集拓橡胶技术有限公司 Use the slitting method of the auxiliary slitting device of mill
CN107117804A (en) * 2017-06-26 2017-09-01 遵义医学院 Chromatographic sheet cuts out panel assembly
JP6548236B1 (en) * 2018-01-29 2019-07-24 Ａｃｓ株式会社 Control method of cutting device
CN108544030A (en) * 2018-06-26 2018-09-18 陈芮 A kind of machine-building cutter device
JP7296221B2 (en) * 2019-03-11 2023-06-22 リンテック株式会社 Sheet cutting device and sheet cutting method
KR102267731B1 (en) * 2019-05-03 2021-06-22 주식회사 탑 엔지니어링 Apparatus and method for cutting film
EP4048491A1 (en) * 2019-10-23 2022-08-31 Kongsberg Precision Cutting Systems AS Automatically adjustable system for cutting at variable notch angles
CN111673804B (en) * 2020-07-20 2021-07-06 常州纳捷机电科技有限公司 Flat edge cutting method for hard plate
CN113561264B (en) * 2021-07-12 2023-03-21 西安奕斯伟硅片技术有限公司 Device for processing raw materials into finished products

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03297136A (en) * 1990-04-16 1991-12-27 Nitto Denko Corp Pasting and clipping apparatus of protective tape for semiconductor wafer
JPH0469194A (en) * 1990-07-05 1992-03-04 Furukawa Electric Co Ltd:The Profile cutting device for film and the like sticked to disk body
JP2919938B2 (en) * 1990-09-26 1999-07-19 日東電工株式会社 How to cut an adhesive tape attached to a thin plate
JPH04223899A (en) * 1990-12-25 1992-08-13 Mitsubishi Heavy Ind Ltd Device and method for cutting chemical milling masking film
JP3303294B2 (en) * 1999-06-11 2002-07-15 株式会社東京精密 Cutting method of semiconductor protective tape
JP2002028885A (en) * 2000-07-12 2002-01-29 Sumitomo Rubber Ind Ltd Rubber sheet cutting method
JP4136890B2 (en) * 2003-10-17 2008-08-20 日東電工株式会社 Method and apparatus for cutting protective tape
JP4450696B2 (en) * 2004-08-19 2010-04-14 日東電工株式会社 Protective tape pasting device

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