JP2007294781A5 - - Google Patents
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- Publication number
- JP2007294781A5 JP2007294781A5 JP2006122844A JP2006122844A JP2007294781A5 JP 2007294781 A5 JP2007294781 A5 JP 2007294781A5 JP 2006122844 A JP2006122844 A JP 2006122844A JP 2006122844 A JP2006122844 A JP 2006122844A JP 2007294781 A5 JP2007294781 A5 JP 2007294781A5
- Authority
- JP
- Japan
- Prior art keywords
- vacuum
- suction
- circuit board
- vacuum suction
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 239000000758 substrate Substances 0.000 claims 8
- 230000008602 contraction Effects 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 238000001179 sorption measurement Methods 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
Claims (4)
開閉自在に配設され、搬送方向と平行な前記回路基板の周辺領域を前記搬送方向と平行な前記基板吸着面の両縁部に押し付けて前記真空吸引パッドの伸縮部吸引口に当接させる押さえ板と、
を有することを特徴とするボンディング装置。 The suction port of the expansion / contraction part is disposed so as to protrude from the substrate adsorption surface of the adsorption stage, and the central region of the curved circuit board conveyed on the adsorption stage is vacuum adsorbed and the pressure difference from the atmospheric pressure causes the In a bonding apparatus provided with a retractable vacuum suction pad that compresses and stretches the circuit board onto the substrate suction surface by compressing a stretchable part.
Openably disposed, it is brought into contact with the elastic portion suction ports of the vacuum suction pad is pressed against the conveyance direction parallel to the peripheral region of the circuit board to the opposite edges of the transport direction and parallel to the substrate attracting surface A holding plate,
A bonding apparatus comprising:
前記真空吸引パッドの伸縮部は、耐熱性ゴム材料で構成され、
前記吸着ステージ下部に配設され、前記吸着ステージの基板吸着面上に真空吸着される前記回路基板を加熱するヒーティングブロックを更に備えていること、
を特徴とするボンディング装置。 The bonding apparatus according to claim 1,
The stretchable part of the vacuum suction pad is made of a heat-resistant rubber material,
A heating block for heating the circuit board disposed under the suction stage and vacuum-sucked on the substrate suction surface of the suction stage;
A bonding apparatus characterized by the above.
前記押さえ板の前記搬送方向の長さは、前記搬送方向の吸着ステージ長さと略同等の長さであること、
を特徴とするボンディング装置。 The bonding apparatus according to claim 1 or 2,
The length of the holding plate in the transport direction is substantially the same length as the suction stage length in the transport direction;
A bonding apparatus characterized by the above.
押さえ板で搬送方向と平行な前記回路基板の周辺領域を前記搬送方向と平行な前記基板吸着面の両縁部に押し付けて、前記回路基板を前記真空吸引パッドの伸縮部吸引口に当接させる押し付け工程と、
前記押し付け工程の後、前記真空吸引パッドの伸縮部内部及び前記真空吸引孔を真空として前記回路基板の中央部領域を真空吸引すると共に前記真空吸引パッドの伸縮部を大気圧との圧力差で圧縮させて前記回路基板を前記吸着ステージの基板吸着面上に真空吸着する真空吸着工程と、
前記真空吸着工程の後、前記真空吸引パッド及び前記真空吸引孔によって前記回路基板を前記吸着ステージの基板吸着面上に真空固定する真空固定工程と、
前記真空固定工程の後、前記真空吸引パッドの真空を開放し、前記真空吸引孔によって前記回路基板を前記吸着ステージの基板吸着面上に真空固定保持及び加熱する真空固定保持工程と、
を備えることを特徴とする湾曲した回路基板を真空吸着固定する方法。 A method of vacuum suction fixing a curved circuit board transported to a suction stage having a vacuum suction pad having a stretchable part with a suction port and a vacuum suction hole,
The peripheral region of the conveyance direction and parallel to the circuit board by pressing plate is pressed against the opposite edges of the transport direction and parallel to the substrate attracting surface, abut the circuit board to the stretch unit suction port of the vacuum suction pad Pressing process to make,
After the pressing step, the inside of the expansion / contraction part of the vacuum suction pad and the vacuum suction hole are evacuated to vacuum the central region of the circuit board and the expansion / contraction part of the vacuum suction pad is compressed with a pressure difference from the atmospheric pressure. A vacuum suction step of vacuum-sucking the circuit board onto the substrate suction surface of the suction stage;
After the vacuum suction step, a vacuum fixing step of vacuum fixing the circuit board on the substrate suction surface of the suction stage by the vacuum suction pad and the vacuum suction hole;
After the vacuum fixing step, the vacuum suction pad is opened, and the circuit board is vacuum-fixed and held and heated on the substrate suction surface of the suction stage by the vacuum suction hole; and
A method of vacuum-fixing and fixing a curved circuit board, comprising:
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006122844A JP2007294781A (en) | 2006-04-27 | 2006-04-27 | Bonding apparatus, and method for sucking circuit board in the same |
| TW096102636A TW200741917A (en) | 2006-04-27 | 2007-01-24 | Bonding apparatus, and method for sucking circuit board in the same |
| KR1020070013242A KR100859990B1 (en) | 2006-04-27 | 2007-02-08 | Suction method for bonding device and circuit substrate in bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006122844A JP2007294781A (en) | 2006-04-27 | 2006-04-27 | Bonding apparatus, and method for sucking circuit board in the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007294781A JP2007294781A (en) | 2007-11-08 |
| JP2007294781A5 true JP2007294781A5 (en) | 2008-03-21 |
Family
ID=38765074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006122844A Withdrawn JP2007294781A (en) | 2006-04-27 | 2006-04-27 | Bonding apparatus, and method for sucking circuit board in the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2007294781A (en) |
| KR (1) | KR100859990B1 (en) |
| TW (1) | TW200741917A (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101448502B1 (en) * | 2012-03-21 | 2014-10-08 | 주식회사 케이엔제이 | Semiconductor package sliming apparatus and method of the same |
| JP2013243203A (en) * | 2012-05-18 | 2013-12-05 | Lintec Corp | Support device |
| TWI484879B (en) * | 2013-11-07 | 2015-05-11 | Nan Ya Printed Circuit Board | Method and apparatus for adjusting curvature of substrate |
| KR101535739B1 (en) * | 2014-01-27 | 2015-07-09 | 세메스 주식회사 | Apparatus for fixing a printed circuit board |
| JP2017007046A (en) * | 2015-06-23 | 2017-01-12 | 澁谷工業株式会社 | Gripper of soft container |
| TWI645913B (en) * | 2016-11-10 | 2019-01-01 | 辛耘企業股份有限公司 | Liquid processing device |
| KR102186816B1 (en) * | 2017-06-14 | 2020-12-04 | 주식회사 케이씨텍 | Substrate heating apparatus and substrate treating system having the same |
| JP6899314B2 (en) * | 2017-11-17 | 2021-07-07 | 浜松ホトニクス株式会社 | Adsorption method |
| CN115132642B (en) | 2022-09-01 | 2022-11-15 | 深圳宏芯宇电子股份有限公司 | Chip packaging device and method and packaged chip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002134597A (en) * | 2000-10-27 | 2002-05-10 | Ushio Inc | Stage apparatus |
-
2006
- 2006-04-27 JP JP2006122844A patent/JP2007294781A/en not_active Withdrawn
-
2007
- 2007-01-24 TW TW096102636A patent/TW200741917A/en unknown
- 2007-02-08 KR KR1020070013242A patent/KR100859990B1/en not_active IP Right Cessation
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