JP2007294562A - Charged particle beam drawing device, and drawing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a drawing preparation method for shortening time until drawing begins, or to provide a drawing device. <P>SOLUTION: The drawing method of the charged particle beam drawing device includes input steps (S102-S104 and S202-S204) for inputting substrate information of a substrate and drawing data in a predetermined pattern, and conveyance steps (S106-S110) for carrying the substrate into a vacuum chamber based on the mentioned substrate information whether or not the input of the drawing data has been made, in a drawing method of the charged particle beam drawing device for drawing the predetermined pattern on the substrate in the vacuum chamber using the charged particle beam drawing device equipped with the vacuum chamber. Owing to one aspect, time required until the drawing starts can be shortened. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a charged particle beam drawing apparatus and a drawing method of such a charged particle beam drawing apparatus. For example, the present invention relates to an electron beam drawing apparatus that irradiates a sample with an electron beam while variably shaping an electron beam, and a drawing method of the apparatus.

  Lithography technology, which is responsible for the progress of miniaturization of semiconductor devices, is an extremely important process for generating a pattern among semiconductor manufacturing processes. In recent years, with the high integration of LSI, circuit line widths required for semiconductor devices have been reduced year by year. In order to form a desired circuit pattern on these semiconductor devices, a highly accurate original pattern (also referred to as a reticle or a mask) is required. Here, the electron beam (electron beam) drawing technique has an essentially excellent resolution, and is used for producing a high-precision original pattern.

FIG. 8 is a conceptual diagram for explaining the operation of a conventional variable shaping type electron beam drawing apparatus.
In a first aperture 410 in a variable shaping type electron beam drawing apparatus (EB (Electron beam) drawing apparatus), a rectangular, for example, rectangular opening 411 for forming the electron beam 330 is formed. Further, the second aperture 420 is formed with a variable shaping opening 421 for shaping the electron beam 330 having passed through the opening 411 of the first aperture 410 into a desired rectangular shape. The electron beam 330 irradiated from the charged particle source 430 and passed through the opening 411 of the first aperture 410 is deflected by the deflector, passes through a part of the variable shaping opening 421 of the second aperture 420, and passes through a predetermined range. The sample 340 mounted on a stage that continuously moves in one direction (for example, the X direction) is irradiated. That is, the drawing area of the sample 340 mounted on the stage in which the rectangular shape that can pass through both the opening 411 of the first aperture 410 and the variable shaping opening 421 of the second aperture 420 is continuously moved in the X direction. Drawn on. A method of creating an arbitrary shape by passing both the opening 411 of the first aperture 410 and the variable shaping opening 421 of the second aperture 420 is referred to as a variable shaping method.

In general, the sample 340 is drawn after being kept at a constant temperature in a vacuum chamber evacuated in advance in a drawing apparatus. Here, the substrate is placed in the load lock, vacuumed, and connected to the robot chamber. The literature describes a technique in which the temperature is kept constant in a drawing standby chamber that has been similarly evacuated from a robot chamber that has been previously evacuated, and then transported to a drawing chamber that has been similarly evacuated and then drawn there. It is disclosed (for example, see Patent Document 1).
JP 2002-64050 A

  Here, when performing a predetermined drawing operation (JOB), plate data (substrate information) such as the material of a substrate (also referred to as a plate) for drawing and the material of a resist material applied on the substrate, and the drawing The pattern drawing data is integrated with the JOB, and is first input to the drawing apparatus. Then, when the JOB data including the plate data and the drawing data is input, the drawing apparatus starts drawing preparation. In other words, if drawing data is not input, the plate is not conveyed into the apparatus no matter how much plate data is input. The reason is that the drawing chamber is placed in the vacuum chamber, and drawing is performed there. Once the plate is transported into the vacuum chamber and the plate is mistaken, the plate is returned from the state to the outside of the vacuum chamber to create a new plate. However, it takes a considerable time (for example, 30 to 40 minutes) to evacuate the load lock chamber, to the atmosphere, and to inspect the dust. It was because there was.

  However, for such a plate, there is a transport time (for example, about 20 minutes) for transporting into the drawing apparatus, and a soaking time (for example, about 2 hours) for performing a constant temperature treatment (soaking) after the transport. is necessary. Therefore, if drawing data is not ready, if it is not possible to proceed to the processing of such a plate, at least the time required to add the processing time of the plate for the waiting time of drawing data is required as the preparation time until the start of drawing become. Therefore, it takes a long time to start drawing.

  Accordingly, an object of the present invention is to provide a drawing preparation method or a drawing apparatus that overcomes such problems and shortens the time until drawing is started.

The drawing method of the charged particle beam drawing apparatus of one embodiment of the present invention includes:
In a drawing method of a charged particle beam drawing apparatus that draws a predetermined pattern on a substrate in a vacuum chamber using a charged particle beam drawing apparatus provided with a vacuum chamber,
An input process for inputting board information of the board and drawing data of a predetermined pattern;
Regardless of whether or not such drawing data is input, based on the substrate information described above, a transporting process for transporting the substrate into the vacuum chamber;
It is provided with.

  Regardless of whether drawing data is input or not, by transferring the substrate into the vacuum chamber based on the substrate information, when the drawing data is not ready, the substrate is transferred in parallel with the waiting time of the drawing data. Can do.

  In the transfer step, if the transferred substrate is an incorrect substrate as a result of inputting the drawing data, the substrate is temporarily placed at a predetermined position in the vacuum chamber.

  By temporarily placing the wrong substrate at a predetermined position in the vacuum chamber without returning it to the outside of the vacuum chamber, the time for returning the substrate to the outside of the vacuum chamber can be shortened.

  Further, the drawing method of the charged particle beam drawing apparatus according to the present invention further includes a thermostating process step of thermostating the substrate transported into the vacuum chamber based on the substrate information regardless of whether or not drawing data is input. It is characterized by having.

  Regardless of whether drawing data is input or not, if the drawing data is not ready by performing the temperature-controlled processing of the substrate transferred to the vacuum chamber based on the substrate information, in parallel with the waiting time of the drawing data A constant temperature treatment of the substrate can be performed.

A drawing chamber for drawing a predetermined pattern on the substrate is provided in the vacuum chamber,
In the transporting process described above, if the transported substrate is an incorrect substrate as a result of inputting the drawing data, the substrate is temporarily placed in a predetermined position different from the rendering chamber in the vacuum chamber. .

  When the transported substrate is the wrong substrate, the newly transported normal substrate can be transported to the drawing chamber by temporarily placing the substrate at a predetermined position different from the drawing chamber. it can. As a result, a predetermined pattern can be drawn on a regular substrate without returning the wrong substrate to the outside of the vacuum chamber.

A charged particle beam drawing apparatus according to one embodiment of the present invention includes:
A vacuum chamber controlled in a vacuum atmosphere;
A drawing chamber provided in a vacuum chamber for drawing a substrate using a charged particle beam;
A temporary placement stage that is provided at a position different from the drawing chamber in the vacuum chamber and temporarily places the substrate when the substrate is the wrong substrate;
It is provided with.

  By providing a temporary placement stage for temporarily placing such a substrate in the vacuum chamber, it is possible to shorten the time for returning the substrate to the outside of the vacuum chamber when the substrate is the wrong substrate. Then, by providing it at a position different from the drawing chamber, a predetermined pattern can be drawn on a regular substrate without returning the wrong substrate to the outside of the vacuum chamber.

  According to one embodiment of the present invention, substrate processing can proceed in parallel with drawing data waiting time. As a result, the time to start drawing can be shortened. According to another aspect of the present invention, a predetermined pattern can be drawn on a regular substrate without returning the wrong substrate to the outside of the vacuum chamber. As a result, the time for returning the wrong substrate to the outside of the vacuum chamber can be shortened, and the time until the start of drawing can be shortened.

  Hereinafter, in the embodiment, a configuration using an electron beam will be described as an example of a charged particle beam. However, the charged particle beam is not limited to an electron beam, and a beam using charged particles such as an ion beam may be used.

Embodiment 1 FIG.
FIG. 1 is a conceptual diagram illustrating a configuration of the drawing apparatus according to the first embodiment as viewed from above.
In FIG. 1, a drawing apparatus 100 as an example of a charged particle beam drawing apparatus includes a cassette chamber (C-Ch) 310, a load lock (L / L) chamber (L / L-Ch) 320, and a vacuum chamber 370. Yes. In the vacuum chamber 370, an alignment (ALN) chamber (ALN-Ch) 332, a temporary chamber 344, a robot chamber 350, and a writing chamber (W-Ch) 103 serving as a drawing room are arranged. In the cassette chamber 310, a cassette 312, a cassette 314, a cassette 316, a transfer robot 318, and a rail 317 are arranged. A gate valve 322 is disposed between the cassette chamber 310 and the L / L chamber 320, and the two are blocked. A gate valve 324 is disposed between the L / L chamber 320 and the vacuum chamber 370 and is blocked from both sides. A temporary placement stage 342 is disposed in the temporary placement chamber 344. A transfer robot 358 is arranged in the robot chamber 350. An XY stage 105 is disposed in the writing chamber 103. The transfer robot 318 can move in four axes in the XY direction, the rotation direction, and the vertical direction, moves along the rail 317, and transfers the plate 101 using the robot arm 319. The transfer robot 358 can move in three axes of the X or Y direction, the rotation direction, and the vertical direction, and transfers the plate 101 using the robot arm 359. The vacuum chamber 370 is evacuated by a vacuum pump (not shown) and is controlled to a vacuum atmosphere having a pressure lower than the atmospheric pressure. In FIG. 1, description of components other than those necessary for describing the first embodiment is omitted. It goes without saying that the drawing apparatus 100 usually includes other necessary configurations.

FIG. 2 is a conceptual diagram illustrating a configuration of the drawing apparatus according to the first embodiment when viewed from the front.
2, the drawing apparatus 100 includes the cassette chamber 310, the L / L chamber 320, the ALN chamber 332, the robot 358, the writing chamber 103 that constitutes the drawing unit, and the electron column 102. As a control system, a CPU 120, a memory 122, a magnetic disk device 124, a CPU 130, a memory 132, and a magnetic disk device 134 are provided. A vacuum pump 326 is connected to the L / L chamber 320.

  In the electron barrel 102, an electron gun 201, an illumination lens 202, a first aperture 203, a projection lens 204, a deflector 205, a second aperture 206, an objective lens 207, and a deflector 208 are arranged. . An XY stage 105 is disposed in the writing chamber 103.

  The CPU 120 serving as a computer is connected to a memory 122, a magnetic disk device 124, a CPU 130, each device in the writing chamber 103 and each device in the electronic column 102 via a control circuit, a bus, or the like (not shown). It is controlled by a control signal output from the CPU 120. Further, input data or output data calculated by the CPU 120 is stored in the memory 122.

  A CPU 130 serving as a computer is connected to a memory 132, a magnetic disk device 134, a vacuum pump 326, a cassette chamber 310, a robot 318 in the cassette chamber 310, an L / L chamber 320, via a control circuit or bus (not shown). It is connected to the ALN chamber 332 and the robot 358 and is controlled by a control signal output from the CPU 130. Further, input data or output data calculated by the CPU 130 is stored in the memory 132.

In the vacuum chamber 370, a predetermined pattern is drawn on the plate 101 serving as a substrate. This will be specifically described below.
An electron beam 200 as an example of a charged particle beam emitted from the electron gun 201 illuminates the entire first aperture 203 having a rectangular hole, for example, a rectangular hole by an illumination lens 202. Here, the electron beam 200 is first formed into a rectangle, for example, a rectangle. Then, the electron beam 200 of the first aperture image that has passed through the first aperture 203 is projected onto the second aperture 206 by the projection lens 204. The position of the first aperture image on the second aperture 206 is deflection-controlled by the deflector 205, and the beam shape and size can be changed. The electron beam 200 of the second aperture image that has passed through the second aperture 206 is focused by the objective lens 207, deflected by the deflector 208, and becomes a sample on the XY stage 105 that is movably arranged. The desired position of the plate 101 is irradiated.

FIG. 3 is a conceptual diagram showing an example of a time schedule until the drawing apparatus of the first embodiment starts drawing.
In order to draw a predetermined pattern on the plate 101 serving as a substrate such as a mask or a semiconductor substrate in the drawing apparatus 100, preparations before the start of drawing are necessary. Here, as a drawing preparation process of the electron beam drawing apparatus, for example, selection of a plate as an input process of substrate information, JOB registration, transfer from the cassette chamber 310 to a L / L chamber 320 as a transfer process (1), L / L transport from the L chamber 320 to the ALN chamber 332 (2), transport from the ALN chamber 332 to the writing chamber 103 (3), soaking as a constant temperature treatment process, drawing data preparation as a drawing data input process, drawing data Each process such as allocation is required.

  First, in S102, as a plate selection step, in which of the plurality of cassettes (in FIG. 1, three cassettes of cassette 312, cassette 314, and cassette 316), the cassette 101 to be drawn is arranged. The position of the plate such as the position of the plate is selected by an input means (not shown) input by the user. For example, the input means may be input from a keyboard or mouse not shown. Alternatively, it is also preferable to input from a touch panel such as a monitor screen (not shown).

In step S <b> 104, as a job registration step, the user registers a combination of the selected plate 101 and a virtual job having no drawing data in the drawing apparatus 100. For example, registration is performed by pressing a registration button. Here, it is assumed that drawing data of a predetermined pattern to be drawn is not yet prepared and desired drawing data is not stored in the magnetic disk device 124 as an example of the storage device. Other drawing data that is not used for the current drawing may be stored in the magnetic disk device 124.
When the job is registered, the ID (identifier) engraved on the selected plate 101 is read in the selected cassette (for example, the cassette 312) in the cassette chamber 310. Then, the CPU 120 inputs such an ID, and a magnetic field as an example of a storage device in which plate data (an example of substrate information) such as the material of the plate 101 selected from the ID and the material of the applied resist is stored in advance. Read from the disk device 134 and input.

  Then, as a transport process, the plate 101 is transported into the vacuum chamber 370 based on the plate data regardless of whether drawing data is input.

  In step S106, as a transfer step (1) that is a part of the transfer step, the transfer robot 318 unloads the plate 101 from the cassette (for example, the cassette 312) in which the selected plate 101 is disposed using the robot arm 319, The gate valve 322 is opened and the plate 101 is conveyed into the L / L chamber 320. When the plate 101 is transported into the L / L chamber 320, the gate valve 322 is closed, the inside of the L / L chamber 320 is exhausted by the vacuum pump 326, and the internal pressure is the same as or slightly lower than the vacuum chamber 370. Vacuum is pulled to pressure. By providing the L / L chamber 320, the pressure in the cassette chamber 310 and the vacuum chamber 370 on the outside air side can be maintained. Further, by pulling the internal pressure to the same pressure as the vacuum chamber 370 or slightly lower than the vacuum chamber 370, the entry of particles from the cassette chamber 310 side to the vacuum chamber 370 can be suppressed.

  In step S108, as a transfer step (2) that is a part of the transfer step, the gate valve 324 is opened and the transfer robot 358 uses the robot arm 359 to transfer the plate 101 placed in the L / L chamber 320 to the robot chamber 350. Then, it is carried into the ALN chamber 332. In the ALN chamber 332, alignment (alignment) such as the orientation of the transported plate 101 is performed. By performing alignment, it is possible to draw at a desired position.

  In S110, as a transfer process (3) which is a part of the transfer process, the transfer robot 358 uses the robot arm 359 to transfer the plate 101 arranged in the ALN chamber 332 into the robot chamber 350, and becomes a drawing chamber. It is transferred to the writing chamber 103 and placed on the XY stage 105.

  In S112, as a soaking process, a constant temperature treatment of the plate 101 arranged on the XY stage 105 is performed. Here, as an example, soaking is performed in the writing chamber 103, but the present invention is not limited to this. As long as it is in the vacuum chamber 370, it may be performed in another place. For example, it may be performed in the ALN chamber 332 or the temporary storage chamber 344. Alternatively, it may be performed in the robot chamber 350.

  On the other hand, as the drawing data preparation step in S202, a drawing data creation step for drawing a predetermined pattern by the external device and the drawing data created by the external device are transferred to the drawing device 100 (input to the drawing device 100). ) And the like. The drawing data is stored in the magnetic disk device 124 in the drawing apparatus 100.

  In the drawing data assignment step in S204, the user selects drawing data of a desired pattern from the drawing data stored in the magnetic disk device 124. For example, the drawing data is selected from a plurality of drawing data stored in a library in the magnetic disk device 124. Then, the CPU 120 reads out and inputs drawing data selected from the drawing data stored in the magnetic disk device 124. Then, the format of the input drawing data is checked.

  As shown in FIG. 3, when (Td + Ta) <(Tl + Ts), as in the drawing preparation method of the first embodiment, the plate 101 is changed based on the plate data regardless of whether drawing data is input or not. When the transferred plate 101 is transferred into the vacuum chamber 370 and is subjected to a constant temperature treatment, the time until drawing starts Tsum = Tr + Tl + Ts. Therefore, the time of shortening time T = Td + Ta can be shortened. Here, Tr is the time required for plate selection and job registration, Tl is the time required for plate conveyance, Ts is the time required for soaking, Td is the time required for drawing data preparation, and Ta is the time required for drawing data allocation. did.

FIG. 4 is a conceptual diagram showing another example of the time schedule until the drawing apparatus of the first embodiment starts drawing.
As shown in FIG. 4, contrary to the case of FIG. 3, when (Td + Ta)> (Tl + Ts), as in the drawing preparation method of the first embodiment, regardless of whether or not drawing data is input, When the plate 101 is transported into the vacuum chamber 370 based on the plate data, and the transported plate 101 is subjected to a constant temperature process, the time until drawing starts Tsum = Tr + Td + Ta. Therefore, the time of shortening time T = Tl + Ts can be shortened.

FIG. 5 is a conceptual diagram illustrating an example of a time schedule up to the start of drawing when parallel processing is not performed as in the drawing method according to the first embodiment.
As shown in FIG. 5, when drawing data and plate data are integrated and there is no input of drawing data, the plate 101 cannot be transported into the vacuum chamber 370, or the transported plate 101 cannot be subjected to a constant temperature process. The time until the start of drawing is Tsum = Td + Ta + Tr + Tl + Ts. Therefore, a lot of time is required before drawing starts.

  As described above, by registering a job as a virtual job having no drawing data, drawing data can be assigned at any timing until just before the drawing apparatus 100 starts drawing. Therefore, the conveyance of the plate 101 and the constant temperature treatment of the conveyed plate 101 can be advanced. Then, by assigning drawing data during transport or constant temperature processing, the time required for preparing and assigning the drawing data and the time required for transport and constant temperature processing can be overlapped in parallel. Can be shortened.

Here, a process when the plate 101 is transported to the vacuum chamber 370 and it is determined that the plate is different from the plate for drawing the predetermined pattern defined in the inputted drawing data will be described.
In the first embodiment, the temporary chamber 344 is provided in the vacuum chamber 370. Therefore, if the transported plate 101 is the wrong plate, the transport robot 358 can transport the wrong plate 101 (for example, the plate 101a). Is loaded into the robot chamber 350 using the robot arm 359 and is transferred to the temporary chamber 344. Then, temporary placement is performed by placing the temporary placement stage 342 in the temporary placement chamber 344. Therefore, it is not necessary to return to the cassette chamber 310 outside the vacuum chamber 370. Therefore, the time for returning the plate 101 to the outside of the vacuum chamber 370 can be shortened. Then, for example, the plate 101b that becomes a correct plate can be transferred from the cassette (for example, the cassette 316) in the cassette chamber 310 into the vacuum chamber 370.

  In particular, since the temporary placement stage 342 is provided at a position different from the writing chamber 103 in the vacuum chamber 370, the correct plate, for example, the plate 101 b can be transported to the XY stage 105 in the writing chamber 103. As a result, even when the wrong plate 101a is held in the vacuum chamber 370, a predetermined pattern can be drawn on the regular plate 101b. Further, after drawing the drawn plate 101 b back to the cassette 312, when drawing another pattern on the plate 101 a held in the vacuum chamber 370, the plate 101 a is soaked by the temporary placement stage 342. If so, there is no need to perform new soaking, so the soaking time can be shortened. Alternatively, soaking may be performed in another place in the vacuum chamber 370, for example, the ALN chamber 332 or the robot chamber 350 while a predetermined pattern is drawn on the regular plate 101b.

In FIG. 1, the temporary placement stage 342 is provided at a position facing the ALN chamber 332 across the robot chamber 350, but is not limited thereto. Any position where the transfer robot 358 can transfer the plate 101 using the robot arm 359 in the vacuum chamber 370 may be used.
FIG. 6 is a diagram for explaining a temporary placement stage provided at another position in the first embodiment.
As shown in FIG. 6, for example, a temporary storage chamber 344 may be provided below the ALN chamber 332. Even in such a case, the plate 101 can be transported to the temporary placement stage 342 in the temporary placement chamber 344 by moving the transport robot 358 up and down. Alternatively, it is also preferable that the temporary placement stage 342 is provided below the alignment stage of the ALN chamber 332 without dividing the chamber.

Embodiment 2. FIG.
In the first embodiment, the temporary placement stage 342 is intentionally provided. However, in the second embodiment, a case where an existing drawing apparatus not provided with the temporary placement stage 342 is used will be described.
Since the apparatus configuration is the same as that of the apparatus in which the temporary storage chamber 344 in FIG. 1 is deleted, illustration and description thereof are omitted. Or you may use the same apparatus as FIG. The time schedule until the drawing apparatus starts drawing is the same as that in FIG. 3 or FIG.
In the second embodiment, since the temporary placement stage 342 is not provided, the plate is different from the plate that draws a predetermined pattern defined in the inputted drawing data after the plate 101 is transferred to the vacuum chamber 370. Processing when it becomes clear becomes a problem.

FIG. 7 is a diagram illustrating an example of the transport process of the drawing preparation method when the temporary placement stage in the second embodiment is not used.
As shown in FIG. 7, when the wrong plate 101 a is transferred from the cassette chamber 310 to the L / L chamber 320, the robot chamber 350, and the ALN chamber 332, the plate 101 a is wrong in the ALN chamber 332. If it is found, before the correct plate 101 b enters the robot chamber 350, the wrong plate 101 a is transferred to the writing chamber 103 through the robot chamber 350. Then, while the wrong plate 101 a is positioned in the writing chamber 103, the correct plate 101 b is transferred from the cassette chamber 310 to the L / L chamber 320, the robot chamber 350, and the ALN chamber 332. Then, while the correct plate 101 b is aligned in the ALN chamber 332, the wrong plate 101 a is transferred to the L / L chamber 320 via the robot chamber 350. Then, while the wrong plate 101 a is positioned in the L / L chamber 320, the correct plate 101 b is conveyed to the writing chamber 103 via the robot chamber 350 and drawn. As described above, it is possible to prevent the return to the cassette chamber 310 outside the vacuum chamber 370 by changing the position where the wrong plate 101a is temporarily placed by controlling the position of the wrong plate 101a and the correct plate 101b. You can do it. Therefore, the time for returning the wrong plate 101a to the outside of the vacuum chamber 370 can be shortened.

  The embodiments have been described above with reference to specific examples. However, the present invention is not limited to these specific examples.

  In addition, although descriptions are omitted for parts and the like that are not directly required for the description of the present invention, such as a device configuration and a control method, a required device configuration and a control method can be appropriately selected and used. For example, although the description of the control unit configuration for controlling the drawing apparatus 100 is omitted, it goes without saying that the required control unit configuration is appropriately selected and used.

  In addition, all charged particle beam writing apparatus drawing methods and charged particle beam writing apparatuses that include elements of the present invention and whose design can be appropriately changed by those skilled in the art are included in the scope of the present invention.

FIG. 2 is a conceptual diagram showing a configuration of the drawing apparatus according to the first embodiment when viewed from above. 1 is a conceptual diagram illustrating a configuration of a drawing device according to Embodiment 1 as viewed from the front. 3 is a conceptual diagram illustrating an example of a time schedule until the drawing apparatus starts drawing in the first embodiment. FIG. FIG. 10 is a conceptual diagram showing another example of a time schedule until the drawing start of the drawing apparatus in the first embodiment. FIG. 5 is a conceptual diagram illustrating an example of a time schedule up to the start of drawing when parallel processing is not performed as in the drawing method according to Embodiment 1; FIG. 6 is a diagram for explaining a temporary placement stage provided at another position in the first embodiment. It is a figure which shows an example of the conveyance process of the drawing preparation method when not using the temporary placement stage in Embodiment 2. FIG. It is a conceptual diagram for demonstrating operation | movement of the conventional variable shaping type | mold electron beam drawing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Drawing apparatus 101 Plate 102 Electronic lens tube 103 Writing chamber 105 XY stage 120,130 CPU
122, 132 Memory 124, 134 Magnetic disk device 200 Electron beam 201 Electron gun 202 Illumination lens 203, 410 First aperture 204 Projection lens 205, 208 Deflector 206, 420 Second aperture 207 Objective lens 310 Cassette chambers 312, 314 , 316 Cassette 317 Rail 318, 358 Robot 319, 359 Robot arm 320 L / L chamber 322, 324 Gate valve 326 Vacuum pump 330 Electron beam 332 ALN chamber 340 Sample 342 Temporary placement stage 344 Temporary chamber 350 Robot chamber 370 Vacuum chamber 411 Opening 421 Variable shaping opening 430 Charged particle source

Claims (5)

In a drawing method of a charged particle beam drawing apparatus for drawing a predetermined pattern on a substrate in the vacuum chamber using a charged particle beam drawing apparatus provided with a vacuum chamber,
An input step of inputting substrate information of the substrate and drawing data of the predetermined pattern;
Regardless of the presence or absence of input of the drawing data, based on the substrate information, a transport step of transporting the substrate into the vacuum chamber;
A drawing method of a charged particle beam drawing apparatus comprising:   2. The substrate is temporarily placed at a predetermined position in the vacuum chamber when the transported substrate is an incorrect substrate as a result of inputting the drawing data in the transporting step. The drawing method of the described charged particle beam drawing apparatus.   The drawing method of the charged particle beam drawing apparatus further includes a thermostating process step of thermostating the substrate transported into the vacuum chamber based on the substrate information regardless of whether the drawing data is input. The drawing method of the charged particle beam drawing apparatus according to claim 1, wherein the drawing method is provided. A drawing chamber for drawing the predetermined pattern on the substrate is provided in the vacuum chamber,
In the transfer step, when the drawing data is input, if the transferred substrate is an incorrect substrate, the substrate is temporarily placed in a predetermined position different from the drawing chamber in the vacuum chamber. The drawing method of the charged particle beam drawing apparatus according to claim 2 or 3, characterized in that: A vacuum chamber controlled in a vacuum atmosphere;
A drawing chamber provided in the vacuum chamber for drawing a substrate using a charged particle beam;
A temporary placement stage that is provided at a position different from the drawing chamber in the vacuum chamber, and temporarily places the substrate when the substrate is an incorrect substrate;
A charged particle beam drawing apparatus comprising:

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