JP2004165497A - Charged particle beam exposure system and method for manufacturing the device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To dissolve an abuse caused by measurement by always providing a measuring sensor in an exposure space. <P>SOLUTION: A charged particle beam exposure system for radiating charged particle beams comprises a first vacuum space (6) on which the charged particle beams are radiated, a second vacuum space (9) which is isolated from the first vacuum space and does not receive the radiation of the charged particle beams, and transport parts (11, 20) for transporting a measuring sensor (7) for measuring an energy radiated on a substrate between the first vacuum space and the second vacuum space to set in a vacuum space. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to an exposure apparatus that performs exposure using a charged particle beam, and a method for manufacturing a device using the exposure apparatus.
[0002]
[Prior art]
2. Description of the Related Art In recent years, semiconductor elements have been miniaturized, and a semiconductor manufacturing apparatus for manufacturing the semiconductor, particularly a semiconductor exposure apparatus, is required to have an apparatus capable of miniaturization.
On the other hand, in order to improve the productivity and production efficiency of semiconductor devices, not only an apparatus having excellent exposure performance but also an apparatus having a high throughput is required.
An exposure apparatus using a charged particle beam has been receiving attention for miniaturization. In such an exposure apparatus, the function of a stage for holding and positioning a substrate such as a wafer is also required to be more precise by miniaturization and improvement of exposure performance.
[0003]
A stage apparatus such as an exposure apparatus that uses the above-described charged particle beam includes a charged particle beam intensity, in addition to a wafer chuck 80 that holds a wafer 160 on a wafer stage 220 in an exposure space 60 as shown in FIG. Various sensors 70 such as a sensor for measuring distribution and the like with high accuracy and a sensor for measuring a change with time of the charged particle beam are mounted, and the stage device moves on the surface plate of the exposure apparatus. The transfer of various sensor signals on the wafer stage is performed by a cable 75 connecting the wafer stage and a surface plate supporting the wafer stage.
[0004]
The cable 75 that electrically connects the wafer stage 220 to the surface plate and the like expands and contracts following the wafer stage, so that the shape of the cable changes depending on the position of the stage, such as being bent or stretched depending on the moving direction of the stage. become. In order to prevent the cable from adversely affecting the movement of the stage, use thin and soft wires and pay close attention to the wiring position etc. so that the exposure light is not blocked (can not be cut). Met. As such a configuration, for example, there is a configuration as shown in Patent Document 1.
[0005]
[Patent Document 1]
JP 2000-208412 A (FIG. 2)
[0006]
[Problems to be solved by the invention]
However, in the case of the conventional technology, the cable for electrically connecting the sensors and the like on the wafer stage to a power supply such as a surface plate or a controller is thin, and even when a soft wire is selected, the cable is routed due to the movement of the stage due to the movement of the stage. The stage is affected by the tension and the like, which adversely affects the positioning accuracy of the wafer stage, the control speed, and the like. As a result, problems such as the cable bending in an unexpected direction and blocking the exposure light have occurred.
[0007]
In addition, the sensor for measuring the charged particle beam intensity and the charged particle beam distribution on the stage device is in a state where the power is supplied even when the device is moving the stage device in the exposure state of the actual element. Yes, the sensor acts as a heat source and gives temperature disturbance to the stage device that moves with high accuracy, which adversely affects the positioning accuracy of the stage and causes a product defect due to a decrease in the positioning accuracy of the stage. There was also the problem of letting them do that.
[0008]
In addition, focusing on the cable itself, the leaked light of the exposed charged particle beam and the diffused charged particle beam light alter the conductive outer skin of the cable, peeling off the deteriorated conductive outer shell, diffused into the vacuum space, and become garbage in the vacuum space. There is also a problem that it adheres to a wafer in the inside or a charged particle beam generating part.
[0009]
In addition, the deterioration of the outer sheath causes poor insulation of the cable itself, and the accumulation of electric charges at the part where the conductive outer sheath has been peeled off, resulting in an unexpected shutdown of the device, which causes a drop in the productivity of the device. Had also occurred.
[0010]
The cable can be covered with a cover in order to solve the above-mentioned problems of the temperature generated from the sensor, the dust generated from the cable sheath, and the accumulation of electric charges. Since the weight increases and a higher driving force is required for high-speed movement, this causes an increase in the size and complexity of the device.
[0011]
In addition, if the countermeasures are taken without changing the driving force, the inertia force increases due to an increase in the weight of the movable portion, which causes a problem such as the occurrence of defective products due to a decrease in the positioning accuracy of the stage.
[0012]
The present invention has been made in view of the above-mentioned problems of the related art, and a first object of the present invention is to provide a sensor such as a charged particle beam intensity measurement and a charged particle beam distribution measurement when performing an exposure operation of a real element. Is moved from the stage device to a low vacuum space separate from the exposure space, and from another low vacuum space isolated only when performing charged particle beam intensity measurement, charged particle beam distribution measurement, etc. Movement to the stage device in the vacuum space, eliminating the cable connecting the substrate stage and the sensor that performs measurement and the device, and positioning accuracy due to the tension of the cable during exposure and drawing of the actual element during exposure and drawing To prevent a decrease in the operation rate due to a decrease in the wafer speed, a movement speed of the wafer stage, and a stop of the apparatus.
[0013]
Further, a second object is to prevent the occurrence of a defective product due to shielding (blurring) of exposure light due to bending of a cable based on the first object.
[0014]
In addition, the third object is to cause a temperature disturbance to the stage device, adversely affect the movement accuracy of the stage, and cause contamination of the wafer and the device due to foreign matter such as fine dust. In some cases, the occurrence of defective products is prevented by excluding the measurement sensor and the sensor cable from the exposure space.
[0015]
[Means for Solving the Problems]
In order to achieve the above object, a charged particle beam exposure apparatus according to the present invention and a device manufacturing method using the apparatus have the following configurations.
[0016]
That is, a charged particle beam exposure apparatus that irradiates a charged particle beam onto a substrate,
A first vacuum space irradiated with a charged particle beam;
A second vacuum space isolated from the first vacuum space and not receiving the irradiation of the charged particle beam;
A transfer unit for transferring a measurement sensor for measuring energy applied to the substrate between the first vacuum space and the second vacuum space, and setting the vacuum space;
It is characterized by having.
[0017]
Preferably, the above charged particle beam exposure apparatus includes a hermetic door for isolating the first vacuum space and the second vacuum space,
When the measurement sensor is carried by the carrying means, the closed door is opened, and the first vacuum space and the second vacuum space are connected.
[0018]
Preferably, in the above-described charged particle beam exposure apparatus, the transport unit can set the measurement sensor to any one of a plurality of measurement sensor holding units formed on a moving stage that holds the substrate. is there.
[0019]
Preferably, in the above charged particle beam exposure apparatus, the measurement sensor includes a sensor for measuring a charged particle beam applied to the substrate.
[0020]
Preferably, in the above charged particle beam exposure apparatus, a first measuring unit for measuring a degree of vacuum in the first vacuum space,
A first vacuum control unit for controlling a degree of vacuum in the first vacuum space based on a measurement result of the first measurement unit,
Based on the measurement result, the first vacuum control means controls a degree of vacuum at which the charged particle beam can be irradiated in the first vacuum space.
[0021]
Preferably, in the above charged particle beam exposure apparatus, a second measuring unit for measuring a degree of vacuum in the second vacuum space,
A second vacuum control means for controlling the degree of vacuum in the second vacuum space,
Based on the measurement result, the second vacuum control means, when the measurement sensor is conveyed, the second vacuum control means, so that the degree of vacuum in the first vacuum space and the degree of vacuum in the second vacuum space substantially match. The degree of vacuum in the vacuum space 2 is controlled.
[0022]
Preferably, in the above charged particle beam exposure apparatus, the sealing door seals the first vacuum space and the second vacuum space during the start of the charged particle beam exposure and during the charged particle beam exposure,
The transfer means transfers the measurement sensor into the second vacuum space, and sets the measurement sensor in a setting unit in the second vacuum space.
[0023]
Preferably, in the above charged particle beam exposure apparatus, the transport unit selects one of the plurality of measurement sensor holding units according to an operation sequence of the apparatus or information of a job for operating the apparatus and performs the measurement. Set the sensor.
[0024]
Preferably, in the above charged particle beam exposure apparatus, the measurement sensor has communication means for transmitting the measured information by wireless communication.
[0025]
Preferably, in the above charged particle beam exposure apparatus, there is provided receiving means capable of receiving information measured by the measurement sensor and transmitted by wireless communication as wireless information unique to the measurement sensor.
[0026]
Preferably, in the above charged particle beam exposure apparatus, the measurement sensor has a storage unit for storing measured information therein,
The information stored in the storage unit is transmitted to the device via the setting unit of the second vacuum space where the measurement sensor is set.
[0027]
Preferably, in the above charged particle beam exposure apparatus, the measurement sensor includes a battery therein and a charging circuit for charging the battery,
The measurement sensor is charged via the set portion of the set second vacuum space.
[0028]
Preferably, in the above charged particle beam exposure apparatus, the measurement sensor can be connected to a connection unit provided in the second vacuum space by a wired signal transmission medium.
[0029]
Preferably, in the above charged particle beam exposure apparatus, the wired signal transmission medium includes an electric wire made of a Teflon insulating material and having a surface subjected to a conductive treatment.
[0030]
Preferably, in the above charged particle beam exposure apparatus, the measurement sensor is controlled to be in a measurable ON state a predetermined time before performing a measurement process in a state set in the second vacuum space. You.
[0031]
Further, the method for manufacturing a device according to the present invention,
A process of installing a plurality of semiconductor manufacturing apparatuses including a charged particle beam exposure apparatus in a factory,
Manufacturing a semiconductor device using the plurality of semiconductor manufacturing apparatuses,
Comprising, the charged particle beam exposure apparatus,
A first vacuum space irradiated with a charged particle beam;
A second vacuum space isolated from the first vacuum space and not receiving the irradiation of the charged particle beam;
Transport means for transporting a measurement sensor for measuring energy applied to the substrate between the first vacuum space and the second vacuum space and setting the vacuum space. Features.
[0032]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0033]
<First embodiment>
FIG. 1 is a view showing a schematic configuration of an electron beam exposure apparatus according to an embodiment of the present invention.
[0034]
In the first embodiment, a case where the present invention is applied to an exposure apparatus using an ion beam such as an electron beam will be described. In the case of an ion beam exposure apparatus including an electron beam, the exposure space 6 through which the ion beam passes is in a vacuum. Although the degree of vacuum differs by about 10 to 100 times depending on the ion beam used for exposure, the pressure inside the exposure apparatus is set to be very low as compared with the state of opening to the atmosphere. Reference numeral 22 denotes a moving stage that holds the wafer and positions it at a predetermined position, and 9 denotes an exposure space 6 and an isolated vacuum space.
[0035]
The detailed configuration of the electron beam exposure apparatus will be described with reference to FIG. As shown in FIG. 3, the electron beam exposure apparatus includes an exposure space 6 which is an ultra-vacuum space, a vacuum pump 26 for achieving the degree of vacuum, and a vacuum connecting the vacuum pump 26 and the exposure space 6. In the exposure space 6, a vacuum moving stage 22, an electron lens 21, a chuck 8 for electrostatically attracting a wafer, and a wafer 16 for drawing an exposure pattern by an electron beam are held by the chuck 8 in the exposure space 6. I have. Further, as shown in FIG. 4, a plurality of sensor holding units 10 are present at arbitrary positions on the moving stage 22 for vacuum.
[0036]
Referring back to FIG. 3, the measurement sensor holding space 9 exists adjacent to the exposure space 6. A transfer robot 20 is provided in the measurement sensor holding space 9, and a transfer hand 11 is provided on the transfer robot 20. The transfer robot 20 and the transfer hand 11 in the measurement sensor holding space 9 are configured as shown in FIG. 5, and the transfer hand 11 translates in the R direction in the figure by the transfer arms 77a and 77b forming a link mechanism. The direction of the transfer hand 11 can be changed by turning in the θ direction. The transfer hand 11 is vertically aligned by driving the transfer robot 20 in the Z-axis direction.
[0037]
Further, in the measurement sensor holding space 9, a measurement sensor 7 as shown in FIG. As shown in detail in FIG. 5, the measurement sensor 7 is mounted on the sensor holding base 14, and the holding unit 17 of the measurement sensor 7 is set on the holding base in a state of being fitted with the fitting mechanism 12. Considering that the measurement sensor 7 is used in a vacuum, the electric circuit and the storage battery are completely sealed to prevent explosion in a vacuum. The measurement sensor 7 includes a sensor called an SSD, a secondary electron detector, and the like.
[0038]
The transfer robot 20, the transfer hand 11, the sensor holder 14, and the measurement sensor 7 have a positional relationship such that the transfer robot 20 is opposed to the sensor holder 14, and the size of the main body diameter of the measurement sensor 7 is on the transfer robot 20. There is a suitable transport hand 11. In the present embodiment, the transfer robot 20 has an arm that can move in a telescopic direction (R direction) in which the transfer hand is driven in a radius R direction and a direction (θ direction) in which the transfer hand 11 is driven to rotate. The main body has a mechanism capable of moving in the vertical direction (Z direction). Using the mechanisms in the R, θ, and Z directions, the measurement sensor 7 on the sensor holder 14 in the measurement sensor holding space 9 is gripped by the transport hand 11 and moved through the sealing door 23 that is a sealing mechanism. It is possible to move to the sensor holding unit 10 (FIG. 4) of the stage 22.
[0039]
Further, the hermetically sealed door 23 existing between the measurement sensor holding space 9 and the exposure space 6 can maintain the airtightness of each space even if a pressure difference occurs between the exposure space 6 and the measurement sensor holding space 9. It has a structure.
[0040]
The measurement sensor holding space 9 is also in a vacuum state, and there is a vacuum pump 25 for holding the vacuum in the measurement sensor holding space 9 and a duct 24 for connecting the vacuum pump 25 and the measurement sensor holding space 9.
[0041]
The operation of the above configuration will be described. Regarding the operation, in the case of an electron beam exposure apparatus, the degree of vacuum in the exposure space 6 and contamination become problems. In other words, if an object is left in a space with a high degree of vacuum, the outgassing of the object will cause a reduction in the degree of vacuum, release of impurities into vacuum, released dust, impurities on the wafer, and the problem of adhesion to the inside of the device. This causes adverse effects such as the straightness of the electron beam and the diffusion of the electron beam, leading to the generation of a defective wafer. Therefore, in the case of the present embodiment, the operation of reducing this contamination is also an important issue.
[0042]
With reference to FIG. 3, a processing sequence in which the correction parameter measurement operation is performed from the exposure operation of the electron beam exposure apparatus, and the process shifts to the exposure operation again will be specifically described.
[0043]
Usually, at the time of the exposure operation in the electron beam exposure apparatus, the measurement sensor 7 is held by the measurement sensor holding unit 17 on the holding table 14 in the measurement sensor holding space 9. At the same time, power is supplied to the rechargeable battery in the measurement sensor 7 through the fitting mechanism 12 while being held in the measurement sensor holding unit 17. Since the power is supplied, the measurement sensor 7 can operate in a state where there is no connection during the measurement even if there is no power supply by the cable alone. When the exposure operation of the electron beam exposure apparatus is completed and the wafer 16 is collected from the wafer chuck 8 on the vacuum moving stage 22, the apparatus prepares for a correction parameter measurement operation.
[0044]
In preparation for the correction parameter measurement operation, the transfer robot 20 performs a rotation operation to move the measurement sensor 7 onto the vacuum movement stage 22, and turns the transfer hand 11 on the robot 20 toward the holding table 14. The transfer robot 20 moves toward the holding table 14, extends the transfer hand 11, and engages the recess (recess as shown in FIG. 5) at the tip of the transfer hand 11 with the main body of the measurement sensor 7 to transfer the measurement sensor 7. It is fixed on the hand 11.
[0045]
When the transfer robot 20 fixes the measurement sensor 7 to the transfer hand 11, the transfer robot 20 moves up and down, that is, in the Z direction, and removes the holding unit 17 of the measurement sensor 7 from the holding table 14. Before the operation of extracting the measurement sensor 7, that is, when the transfer robot 20 is directed to the holding table 14, the power supply operation through the fitting mechanism 12 is stopped, and the measurement sensor 7 is freely removed from the holding table 14. Become.
[0046]
When the measurement sensor 7 is removed from the holding table 14 and the measurement sensor 7 is fixed on the transfer hand 11 on the transfer robot 20, the transfer robot 20 returns the transfer hand 11 to which the measurement sensor 7 is fixed, that is, the transfer hand. 11 is moved in the direction of contraction, and further rotated by 180 ° to change the direction to the direction of the sealing door 23 which is a completely sealing mechanism. In parallel with this operation, the vacuum moving stage 22 is a completely sealed mechanism so that the measurement sensor 7 can be easily attached to the measurement sensor holder 10 on the top plate, which is selected in sequence from the plurality of measurement sensor holders 10. It moves in the direction of the sealing door 23.
[0047]
Further, for the purpose of not lowering the degree of vacuum in the exposure space 6, the degree of vacuum in the exposure space 6 is made equal to the degree of vacuum in the measurement sensor holding space 9, and the contamination and the like in the measurement sensor holding space 9 are exposed. The duct 24 and the vacuum pump 25 are operated to evacuate the measurement sensor holding space 9 so as not to diffuse into the space 6. When the transfer robot 20 has finished changing its direction to the direction of the sealing door 23 which is a complete sealing mechanism, the moving stage 22 for vacuum moves in the direction of the sealing door 23 which is a complete sealing mechanism, and furthermore, the measurement sensor holding space 9 When the degree of vacuum in the exposure space 6 becomes the same, the sealing door 23 opens, and the exposure space 6 and the measurement sensor holding space 9 are connected.
[0048]
At this time, as described above, since the measurement sensor holding space 9 is evacuated, and contamination such as impurities is simultaneously eliminated by the action of evacuation, the degree of vacuum of the exposure space 6 is reduced. The measurement sensor 7 can be moved to the exposure space 6 without lowering it and without contaminating the exposure space 6 due to contamination such as impurities.
[0049]
When the sealing door 23 is opened and the exposure space 6 and the measurement sensor holding space 9 are connected, the transfer robot 20 moves the transfer hand 11 to move the measurement sensor 7 to the holding unit 10 on the vacuum movement stage 22. Stretch in the direction. The measurement sensor 7 on the transport hand 11 moves onto the vacuum moving stage 22, and the position of the holding unit 10 of the measurement sensor 7 and the position of the holding unit 14 on the measurement sensor 7 are aligned in the plane direction, that is, the XY direction. When fitted, the transfer robot 20 drives in the Z direction and downward, and inserts the holder 14 of the measurement sensor 7 into the holder 10 on the vacuum moving stage 22.
[0050]
When the measurement sensor 7 is fixed to the holding unit 10 on the moving stage 22 for vacuum, the transfer hand 11 on the transfer robot 20 removes the fixed state of the measurement sensor 7 and moves away from the moving stage 22 for vacuum, that is, , The transfer hand 11 is moved in the direction of contracting. When the transfer hand 11 on the transfer robot 20 is in a contracted state and has no interference relationship with the closed door 23 which is a completely closed mechanism, the closed door 23 closes the door and removes the exposure space 6 and the measurement sensor holding space 9. To separate.
[0051]
In the present embodiment, the operation of moving the measurement sensor 7 onto the vacuum movement stage 22 and then contracting the transfer hand 11 of the transfer robot 20 and the operation of closing the sealing door 23 which is a completely closed mechanism after contracting the transfer hand 11 are performed. However, if the space capacity of the measurement sensor holding space 9 is small and the position of the transfer robot 20 when the transfer hand 11 is extended does not interfere with the subsequent operation range of the vacuum moving stage 22. In order to shorten the collection time of the measurement sensor 7, it is also possible to execute the measurement operation by moving the movable stage 4 with the closed hand 23 opened and the transport hand 11 extended.
[0052]
Further, when there is an interference positional relationship with the movement range of the vacuum moving stage 22, the minimum operation for relieving the interference relationship, for example, only the upward movement in the Z direction, or the transfer hand 11 is moved to a position where the interference relationship disappears. It is also possible to retreat, wait at an intermediate position between the fully contracted position and the fully extended position, move the vacuum moving stage 22, and execute the measurement operation.
[0053]
When the measurement sensor 7 is fixed to the holding unit 10 on the vacuum moving stage 22 and the transfer hand 11 of the transfer robot 20 moves to a position that does not interfere with the moving range of the vacuum moving stage 22, the vacuum moving stage 22 According to the measurement sequence, positioning is performed by moving the measurement sensor 7 to a predetermined position below the electronic lens 21. When the measurement operation is started, the vacuum moving stage 22 is moved in synchronization with the operation of a unit such as an electron gun (not shown) which is an electron source of the electron beam exposure apparatus, and the electron beam intensity below the electron lens 21 is measured. .
[0054]
At this time, in the measurement sensor 7, the circuit for measurement is operated by the storage battery inside the measurement sensor 7, and the measurement operation can be performed without having a cable or the like for supplying power. Further, since the measurement data after the actual measurement is stored in a memory element formed inside the measurement sensor 7, there is no need for an electric signal line for transferring the measurement data to the main body of the electron beam exposure apparatus. It becomes.
[0055]
In the present embodiment, the measurement data is stored in a memory element existing inside the measurement sensor 7. However, in terms of storage, not only a semiconductor element but also a magnetic storage device is used. This function is satisfied even if 7 itself is magnetically shielded.
[0056]
Further, instead of storing the measurement data in the measurement sensor 7, the measurement data is transmitted in a wireless manner, for example, using infrared communication, analog communication using modulated radio waves, or digital communication, in parallel with the measurement operation. Alternatively, this function can be satisfied by compressing the data after the measurement operation and sequentially transmitting the data to the electron beam exposure apparatus main body.
[0057]
Furthermore, needless to say, in the case of using radio waves, data transfer between the electron beam devices adjacent to each other is performed using different frequencies, and even if the timing of the measurement is correct, it does not interfere with each other. Data is passed.
[0058]
The moving stage for vacuum 22 having the measuring sensor 7 mounted on the holding unit 10 performs a series of predetermined driving under the electronic lens 21 and the correction parameter measuring operation is completed.
[0059]
As a preparation for performing the exposure operation after the correction parameter measurement operation, the vacuum movement stage 22 moves toward the sealing door 23 which is a completely sealing mechanism with the measurement sensor 7 mounted on the holding unit 10. At this time, the transfer robot 20 and the sealing door 23, which is a completely sealing mechanism, maintain the state when the measurement sensor 7 is delivered to the vacuum moving stage 22, or the position where interference with the moving stage 22 is avoided.
[0060]
In other words, as described in the sequence for moving the measurement sensor 7 from the holding table 14 onto the vacuum moving stage 22, the position where the interference relationship between the transfer hand 11 and the vacuum moving stage 22 on the transfer robot 20 disappears, In the case of the sequence in which the transport hand 11 and the closed door 23 stop, the collecting operation of the measurement sensor 7 is restarted at the stop position of each unit.
[0061]
In the present embodiment, the recovery operation will be described in a state where the sealing door 23 which is a completely sealing mechanism is closed. First, the moving stage 22 moves in the direction of the closed door 23 which is a completely closed mechanism. Further, the degree of vacuum in the measurement sensor holding space 9 is checked. If the high vacuum exposure space 6 and the measurement sensor holding space 9 have different degrees of vacuum, the duct 24 and the vacuum pump 23 are used to adjust the degree of vacuum. When the movement of the vacuum moving stage 22 and the evacuation of the measurement sensor holding space 9 are completed, the sealing door 23 performs an operation of opening the door. When the sealing door 23 is opened, the transfer robot 20 extends the transfer hand 11 toward the vacuum moving stage 22, and fixes the measurement sensor 7 on the vacuum transfer stage 22 by fitting it into the concave portion of the transfer hand 11. When the measurement sensor 7 is fixed on the transfer hand 11, the transfer robot 20 moves up and down using the Z-direction movement mechanism, and transfers the measurement sensor 7 from the measurement sensor holding unit 10 on the vacuum movement stage 22. It operates in the direction to remove, that is, the direction to pull out the holding unit 14 of the measurement sensor from the holding unit 10 on the moving stage side.
[0062]
When the holding unit 17 of the measurement sensor 7 and the holding unit 10 on the vacuum moving stage 22 are separated from each other, the transfer robot 20 moves in the direction in which the transfer hand 11 contracts, that is, from the vacuum moving stage 22 to the measurement sensor holding space 9 side. When the transfer hand 11 is contracted, the transfer robot 20 rotates 180 ° in the opposite direction to that when the measurement sensor 7 is carried in, and changes the direction to the direction of the measurement sensor holding table 14 in the measurement sensor holding space 9. When the transfer robot 20 turns to the direction of the measurement sensor holding table 14 in the measurement sensor holding space 9, the sealing door 23, which is a completely closed mechanism, performs a closing operation, and separates the measurement sensor holding space 9 from the exposure space 6 and seals. Form a space.
[0063]
The transfer robot 20 extends the transfer hand 11 in the measurement sensor holding space 9, and transfers the measurement sensor 7 to the measurement sensor holding table 14 in the measurement sensor holding space 9. When the transfer hand 11 transfers the measurement sensor 7 to the measurement sensor holder 14 on the measurement sensor holder 14, the transfer robot 20 moves downward using the Z-direction drive mechanism, and moves the holder of the measurement sensor 7. 17 is fitted into the measurement sensor holding portion 17 in the measurement sensor holding space 9. When the holding portion 17 of the measurement sensor 7 and the measurement sensor holding base 14 in the measurement sensor holding space 9 are fitted, the measurement sensor 7 and the electron beam are fitted by the fitting mechanism 12 at the bottom of the measurement sensor holding portion 17 in the measurement sensor holding space 9. The exposure apparatus main body is electrically connected. In the present embodiment, the connection of the fitting mechanism 12 includes an electric signal line and a power supply line for charging the sensor storage battery. As described above, there is a method of wirelessly communicating the measurement data of the data measured by the measurement sensor 7, but in this description, a case where the measurement data is transferred using the fitting mechanism 12 will be described.
[0064]
When a power supply line for supplying power to the storage battery in the measurement sensor 7 through the fitting mechanism 12 and a signal line for transferring measurement data stored in the measurement sensor 7 to the main body of the electron beam exposure apparatus are electrically connected,
1) The measurement sensor 7 is charged using the power supply line for the next measurement.
[0065]
2) The data stored in the measurement sensor 7 after the measurement operation is transferred to the main body of the electron beam device.
[0066]
Two operations of data transfer and charging operation are performed in parallel, and measurement data is transferred to the electron beam exposure apparatus. In the present embodiment, according to the following sequence of the electron beam exposure apparatus, measurement data is fetched into the electron beam exposure apparatus, and after the measurement data is processed, the exposure operation is started. However, depending on the device sequence, measurement data may be taken in parallel with the exposure operation.
[0067]
In a state where the sealing door 23 which is a completely closed mechanism is closed, that is, in a state where the high vacuum exposure space 6 and the measurement sensor holding space 9 are separated, the electron beam exposure apparatus checks the degree of vacuum in the exposure space 6. If the degree of vacuum does not match the exposure environment, the duct 27 in the exposure space 6 and the vacuum pump 26 are operated to adjust the degree of vacuum to perform the exposure operation.
[0068]
When the electron beam exposure apparatus is performing the exposure operation in the exposure space 6, the measurement sensor 7 is held in the measurement sensor holding space in an OFF state after the transfer of the measurement data. Normally, since the measurement sensor 7 measures weak light or light beam, there is a problem of a temporal change in output after the measurement sensor 7 is turned on.
[0069]
If the measurement sensor is turned on and then the measurement operation is performed within a certain period of time, accurate measurement becomes impossible due to the aging of the sensor itself and the drift phenomenon immediately after the ON state. Therefore, when the power supply is constantly turned on, the measurement circuit always consumes power, which is contrary to the current flow of energy saving, and the consumed power is released from the measurement sensor 7 as a heat source. . In the case where the laser beam is always held on the vacuum moving stage 22 as in the prior art, the temperature of the exposure space is disturbed due to this heat generation, and outgassing and contamination due to the application of heat to the object are increased. There is a concern that a movement amount measurement error of the moving stage 22 which causes the generation, a deterioration of the stage accuracy, and contamination attachment to the wafer due to impurities or the like may occur.
[0070]
This embodiment also addresses the above-described problem, and separates the measurement sensor holding space 9 and the exposure space 6 from each other, and starts the correction parameter measurement operation of the electron beam exposure apparatus from the timing of opening and closing the sealing door 23 which is a completely sealing mechanism. Since the timing can be detected in advance, the measurement sensor 7 can be turned on in the measurement sensor holding space 9 a predetermined time before the correction parameter measurement operation is performed.
[0071]
Further, the measurement sensor holding space 9 is isolated from the exposure space 6 by the sealing door 23, and the degree of vacuum is held by the duct 24 and the vacuum pump 25, and since the outgassing and the contamination are evacuated, the measuring sensor 7 is held. This makes it possible to absorb the heat and outgas from the sensor, and to stabilize the output by turning on the measurement sensor 7 in advance without affecting the exposure space 6.
[0072]
In other words, in parallel with the electron beam exposure apparatus performing the exposure operation, the sequence for evacuating the measurement sensor holding space 9 to prepare for the correction parameter measurement operation to be started after the exposure operation is the timing of this control. Can be used to turn on the electric circuit in the measurement sensor 7 and create an ON state for a time when the signal output is stabilized.
[0073]
More specifically, the electron beam exposure apparatus turns on the electric circuit in the measurement sensor 7 through the fitting mechanism 12 of the holding table 14 at the time of exposing the final wafer to be switched to the correction parameter measurement operation. The measurement sensor 7 holds the ON state of the internal electric circuit on the holding table 14 by power supply from the main body of the electron beam exposure apparatus. When the measurement sensor 7 is transported onto the moving stage 22, a rechargeable battery is mounted on the measurement sensor 7. When the internal circuit of the measurement sensor 7 is turned on by power supply from the rechargeable battery, the transport robot 20, It can be transported by the transport hand 11. The subsequent operation is as described above.
[0074]
<Second embodiment>
FIG. 7 is a view for explaining the exposure space of the electron beam exposure apparatus according to the second embodiment of the present invention. In the second embodiment, a case where the present invention is applied to an exposure apparatus using an ion beam such as an electron beam and a case where the measurement sensor and the main body of the electron beam exposure apparatus are connected by an electric wire or the like will be described. In the case of the ion beam exposure apparatus as in the first embodiment, the exposure space through which the ion beam passes is vacuum. Although the degree of vacuum differs by about 10 to 100 times depending on the ion beam used for exposure, the pressure is set to be very low as compared with the state of opening to the atmosphere as in the first embodiment.
[0075]
As shown in FIG. 7, the electron beam exposure apparatus comprises an exposure space 6 which is an ultra-vacuum space, a vacuum pump 26 for achieving the degree of vacuum, and a vacuum duct 27 connecting the vacuum pump 26 and the exposure space 6. In the exposure space 6, a vacuum moving stage 22, an electron lens 21, a chuck 8 for electrostatically attracting a wafer, and a wafer 16 for drawing an exposure pattern by an electron beam are held by the chuck 8. . Further, as shown in FIG. 4, a plurality of sensor holding units 10 are present at arbitrary positions on the moving stage 22 for vacuum.
[0076]
Further, a measurement sensor holding space 9 exists adjacent to the exposure space 6. A transfer robot 20 and a transfer hand 11 are provided on the transfer robot 20 in the measurement sensor holding space 9. A measurement sensor 7b as shown in FIG. 6B is placed in the measurement sensor holding space 9. There is a connection port of the cable 15 connected to the measurement sensor 7b on the sensor holding base 14. In the present embodiment, only the electric circuit exists inside the measurement sensor 7b, and the storage battery and the like as in the first embodiment are not mounted. For this reason, the structure of the measurement sensor 7b itself, in particular, in terms of vacuum compatibility, is merely a closed electric circuit, and thus has a structurally simple configuration.
[0077]
The connection cable 15 is made of a chemically stable insulating material such as Teflon (registered trademark) for the purpose of preventing electrification and preventing the weak signal of the SSD and the secondary electron detector from disturbance such as noise. An electric wire using a material whose surface has been subjected to conductive treatment is used. The transfer robot 20, the transfer hand 11, the sensor holder 14, and the sensor holder 17 have a positional relationship such that the transfer robot 20 exists so as to face the sensor holder 14, and the measurement sensor 7 b is transferred onto the transfer robot 20. In addition, there is a transport hand 11 that matches the main body diameter of the measurement sensor 7b. In the present embodiment, the transfer robot 20 has transfer arms 77a and 77b that can move in the R direction that is a telescopic direction and the θ direction that is a rotation direction, and further, the main body of the transfer robot 20 can move in the Z direction that is a vertical direction. In addition, it has a moving mechanism capable of positioning the transfer hand 11 in the vertical direction. It is possible to move the measurement sensor 7b on the sensor holder 14 to the sensor holder 10 which is a fitting part of the moving stage 22 through the sealing door 23 which is a sealing mechanism by using a mechanism in the R direction, the θ direction, and the Z direction. is there.
[0078]
Further, the hermetically closed door 23 existing between the measurement sensor holding space 9 and the exposure space 6 holds the airtightness of each space even if a pressure difference occurs between the exposure space 6 and the measurement sensor holding space 9. It has a simple structure. The measurement sensor holding space 9 is also in a vacuum state, and there is a vacuum pump 25 for holding the vacuum in the measurement sensor holding space 9 and a duct 24 for connecting the vacuum pump 25 and the measurement sensor holding space 9. I do.
[0079]
The operation of the above configuration will be described. Regarding the operation, in the case of an electron beam exposure apparatus, the degree of vacuum in the exposure space 6 and contamination become problems. That is, when an object is left in a space having a high degree of vacuum, outgas is generated from the object, and the degree of vacuum in the exposure space 6 is reduced, and impurities are released into the vacuum, garbage that is released, wafers of impurities, and wafers inside the apparatus. This causes a problem of adhesion to the wafer, adversely affecting the straightness of the electron beam, the diffusion of the electron beam, and the like, thereby causing the generation of a defective wafer. Therefore, in the case of the present embodiment, the operation of reducing this contamination is also an important issue.
[0080]
The operation will be specifically described with reference to FIG. 7 based on a sequence when the electron beam exposure apparatus of the present embodiment shifts from the exposure operation to the correction parameter measurement operation and then to the exposure operation again.
[0081]
In the electron beam exposure apparatus according to the present embodiment, the measurement sensor 7b during the exposure operation is normally held on a holding table 14 in the measurement sensor holding space 9. The measurement sensor 7 b and the cable 15 connected to the electron beam exposure apparatus main body are bundled together in an open space beside the sensor holding unit 17. As for the cable 15, the cable itself is wound around a reel-shaped rotating body 28, a force is constantly applied in a winding direction with a weak tension, and the cable surface is exposed as little as possible in a vacuum space. It is designed.
[0082]
When the exposure operation of the electron beam exposure apparatus is completed and the wafer 16 is collected from the wafer chuck 8 on the vacuum moving stage 22, the apparatus prepares for a correction parameter measurement operation. As a preparation for the correction parameter measurement operation, the transfer robot 20 performs a rotating operation to turn the transfer hand 11 on the robot 20 toward the sensor holding base 14 in order to move the measurement sensor 7b onto the vacuum movement stage 22. When the transfer robot 20 faces the direction of the holding table 14, the transfer hand 11 is then extended in the R direction so that the recess at the tip of the transfer hand 11 (see the concave portion 11 in FIG. 5) and the main body of the measurement sensor 7b are fitted. The measurement sensor 7b is fixed on the transport hand 11.
[0083]
When the transfer robot 20 fixes the measurement sensor 7b on the transfer hand 11, the transfer robot 20 moves in the vertical direction, that is, the Z direction, and removes the holding unit 17 of the measurement sensor 7b from the holding table 14. Before performing the operation of extracting the measurement sensor 7b, that is, when the transfer robot 20 faces the holding table 14, the power supply operation through the fitting mechanism 12 is stopped, and the measurement sensor 7b can be freely removed from the holding table 14. become.
[0084]
When the measurement sensor 7b is withdrawn from the sensor holder 14 and the measurement sensor 7b is fixed on the transfer hand 11 on the transfer robot 20, the transfer robot 20 returns the transfer hand 11 to which the measurement sensor 7b is fixed, that is, The transfer hand 11 is moved in the direction of contraction, and further rotated by 180 ° to change the direction to the direction of the sealing door 23 which is a completely sealing mechanism. At this time, the cable 15 connecting the measurement sensor 7b and the main body of the electron beam exposure apparatus extends in the measurement sensor holding space 9 in such a manner as to be pulled by the measurement sensor 7b. At this time, the structure is such that the surface of the cable is not exposed to the vacuum as much as possible due to the tension of the reel-shaped rotating body 28 around which the cable 15 is wound.
[0085]
In parallel with this operation, the vacuum moving stage 22 is completely mounted so that the measuring sensor 7b can be easily attached to the measuring sensor holding unit 10 (FIG. 4) on the moving stage 22 selected in sequence from the plurality of measuring sensor holding units 10. It moves in the direction of the sealing door 23 which is a sealing mechanism.
[0086]
Further, for the purpose of not lowering the degree of vacuum in the exposure space 6, the degree of vacuum in the exposure space 6 and the degree of vacuum in the measurement sensor holding space 9 are equalized. The duct 24 and the vacuum pump 25 are operated to evacuate the measurement sensor holding space 9 so as not to be diffused.
[0087]
The transfer robot 20 has finished turning in the direction of the sealing door 23, which is a complete sealing mechanism, and the vacuum moving stage 22 has moved in the direction of the sealing door 23, which is a complete sealing mechanism. When the degree of vacuum in the space 6 becomes the same, the sealing door 23 opens and the exposure space 6 and the measurement sensor holding space 9 are connected. At this time, as described above, the measurement sensor holding space 9 is evacuated, and contaminants such as impurities are simultaneously removed by the action of evacuation, so that the degree of vacuum in the exposure space 6 is reduced. In addition, the measurement sensor 7b can be moved to the exposure space 6 without contaminating the exposure space 6 by the adhesion of contamination such as impurities.
[0088]
When the sealing door 23 is opened and the exposure space 6 and the measurement sensor holding space 9 are connected, the transfer robot 20 moves the transfer hand 11 in the direction of the vacuum transfer stage 22 to move the measurement sensor 7b to the holding unit 10 on the vacuum transfer stage 22. Stretch towards. The measurement sensor 7b on the transfer hand 11 moves onto the vacuum moving stage 22, and the position of the holding unit 10 of the measurement sensor 7b matches the position of the holding unit 17 of the measurement sensor 7b in the plane direction, that is, the XY direction. Then, the transfer robot 20 drives the transfer hand 11 downward in the Z direction, in this case, and inserts the holder 17 of the measurement sensor 7b into the holder 10 on the vacuum moving stage 22.
[0089]
When the measurement sensor 7b is fixed to the holding unit 10 on the moving stage 22 for vacuum, the transfer hand 11 on the transfer robot 20 releases the fixing of the measurement sensor 7b, and moves the transfer hand 11 away from the transfer stage 22 for vacuum. Move in the shrinking direction. Although FIG. 7 of the present embodiment shows a state in which the transfer hand 11 on the transfer robot 20 is contracted, the position of the transfer hand 11 on the transfer robot 20 when the transfer hand 11 is extended is the position of the vacuum transfer stage 22 after that. If the position does not interfere with the operation range, it is also possible to execute the measurement operation by moving the moving stage 22 with the transfer hand 11 extended to shorten the collection time of the measurement sensor 7b.
[0090]
In addition, when there is an interference positional relationship with the movement range of the vacuum moving stage 4, the minimum operation for relieving the interference relationship, for example, only the Z direction, in this case, only the upward movement of the transport hand 11, or the transport hand It is also possible to perform the measurement operation by moving the vacuum moving stage 22 by retracting 11 to a position where the interference relationship disappears, waiting at an intermediate position between the completely contracted position and the fully extended position, and moving the vacuum moving stage 22. .
[0091]
When the measurement sensor 7b is placed on the holding unit 10 on the vacuum moving stage 22, and the transfer hand 11 of the transfer robot 20 moves to a position that does not interfere with the moving range of the vacuum moving stage 22, the vacuum moving stage 22 Moves according to the measurement sequence so that the measurement sensor 7b is located at a predetermined position below the electronic lens 21. When the measurement operation is started, the vacuum movement stage 22 is moved in synchronization with the operation of a unit such as an electron gun (not shown) which is an electron source of the electron beam exposure apparatus, and the electron beam intensity below the electron lens 21 is reduced. Measure. At this time, the power supply and the transfer of the measurement data are performed by the cable 15 in the measurement sensor 7b. However, even in this case, in order to prevent the mirror surface of the cable from being exposed in a vacuum as much as possible, data serialization is performed in the measurement sensor 7b to minimize the number of cables.
[0092]
In addition, it is possible to transmit only a data transmission signal line that can be made relatively thin with a cable, and it is also possible to say that a circuit for measurement operates with a storage battery inside the measurement sensor 7b. The measurement data after the actual measurement is performed by connecting the cable can be stored in a memory element formed inside the measurement sensor 7b.
[0093]
Furthermore, instead of storing the measurement data in the measurement sensor 7b, the measurement data is transmitted in a wireless manner, for example, using infrared communication, analog communication using modulated radio waves, or digital communication, in parallel with the measurement operation, or in the measurement operation. This function can be satisfied by compressing the post-data and transmitting the data to the main body of the electron beam exposure apparatus sequentially.
[0094]
The vacuum moving stage 22 mounted on the sensor holding unit 10 with the measurement sensor 7b having the above function performs a predetermined series of driving under the electron lens 21 to complete the correction parameter measurement operation. After the correction parameter measurement operation, as a preparation for performing the exposure operation, the vacuum movement stage 22 moves in the direction of the sealing door 23 which is a completely sealing mechanism with the measurement sensor 7b of the sensor holding unit 10 mounted. . At this time, the transfer robot 20 and the sealing door 23, which is a completely sealing mechanism, maintain the state when the measurement sensor 7b is transferred to the vacuum moving stage 22, or the position where interference with the moving stage 22 is avoided. That is, as described in the sequence of moving the measurement sensor 7b from the holding table 14 onto the vacuum moving stage 22, the position where the interference relationship between the transfer hand 11 on the transfer robot 20 and the vacuum moving stage 22 is eliminated, the transfer robot 20, In the case of a sequence in which the transport hand 11 and the closed door 23 are stopped, the collecting operation of the measurement sensor 7b is restarted from the stop position of each unit.
[0095]
The moving stage 22 moves in the direction of the closed door 23 which is a completely closed mechanism. Further, in the measurement sensor holding space 9, the duct 24 and the vacuum pump 23 are used so that the high vacuum exposure space 6 and the measurement sensor holding space 9 have the same degree of vacuum and to prevent contamination in a vacuum. To adjust the degree of vacuum. The transfer robot 20 extends the transfer hand 11 toward the vacuum moving stage 22 and fixes the measurement sensor 7b on the vacuum moving stage 22. When the measurement sensor 7b is fixed on the transfer hand 11, the transfer robot 20 moves up and down using the Z-direction movement mechanism, and moves from the measurement sensor holding unit 10 on the vacuum movement stage 22 to the measurement sensor. 7b, that is, a direction in which the holding unit 17 of the measurement sensor is removed from the holding unit 10 on the moving stage side.
[0096]
When the holding unit 17 of the measurement sensor 7b and the holding unit 10 on the vacuum moving stage 22 are separated from each other, the transfer robot 20 moves in the direction of contracting the transfer hand 11, that is, from the vacuum moving stage 22 to the measurement sensor holding space 9 side. When the transfer hand 11 is contracted, the transfer robot 20 rotates 180 ° opposite to the case where the measurement sensor 7b is carried in, and changes its direction to the direction of the measurement sensor holding table 14 in the measurement sensor holding space 9. During this operation, the reel-shaped rotating body 28 accommodating the cable 15 connecting the measurement sensor 7b and the main body of the electron beam exposure apparatus simultaneously performs the winding operation and exposes the cable coating as much as possible in a vacuum. Not to be.
[0097]
When the transfer robot 20 turns to the direction of the measurement sensor holding table 14 in the measurement sensor holding space 9, the sealing door 23, which is a completely closed mechanism, performs a closing operation, and separates the measurement sensor holding space 9 from the exposure space 6 and seals. Form a space. In the measurement sensor holding space 9, the transfer robot 20 extends the transfer hand 11 and transfers the measurement sensor 7 b to a position on the measurement sensor holding table 14 in the measurement sensor holding space 9. When the transport hand 11 transports the measurement sensor 7b onto the measurement sensor holder 14, the transport robot 20 moves the transport hand 11 downward using the Z-direction drive mechanism, and the holding unit 17 of the measurement sensor 7b. Is positioned on the sensor support 14 and fitted with the fitting mechanism 12. When the measurement data is held in the measurement sensor 7b, when the holding unit 17 of the measurement sensor 7b and the fitting mechanism 12 in the measurement sensor holding space 9 are fitted, the bottom of the measurement sensor holding unit 17 in the measurement sensor holding space 9 is fitted. The measurement sensor 7b and the main body of the present electron beam exposure apparatus are connected by a fitting mechanism described in FIG. As the connection of the fitting mechanism 12, an electric signal line and a power supply line for charging can be selected depending on what is built in the measurement sensor 7b.
[0098]
In the present embodiment, according to the following sequence of the electron beam exposure apparatus, measurement data is fetched into the electron beam exposure apparatus, the measurement data is processed, and then the exposure operation is started. However, depending on the apparatus sequence, measurement data may be taken in parallel with the exposure operation.
[0099]
In a state where the sealing door 23 which is a completely closed mechanism is closed, that is, in a state where the high vacuum exposure space 6 and the measurement sensor holding space 9 are separated, the electron beam exposure apparatus checks the degree of vacuum of the exposure space 6. If the degree of vacuum does not match the exposure environment, the duct 27 in the exposure space 6 and the vacuum pump 26 are operated to make the degree of vacuum appropriate, and then the exposure operation is performed.
[0100]
When the electron beam exposure apparatus is performing an exposure operation in the exposure space 6, the measurement sensor 7b is held in the measurement sensor holding space in an OFF state. Usually, there is a problem that the output of the measurement sensor 7b with time after being turned on to measure weak light or light beam is measured.
[0101]
If the measurement sensor is turned on and then a measurement operation is performed within a certain period of time, accurate measurement cannot be performed due to a temporal change of the sensor itself and a drift phenomenon immediately after the ON state. In order to solve this problem, if the power is constantly turned on, the measuring circuit always consumes power, which is contrary to the current flow of energy saving, and the consumed power becomes a heat source and becomes the measurement sensor 7b. Released from If the measurement sensor is always held on the vacuum moving stage 22 as in the conventional case, the temperature of the exposure space is disturbed by the heat generated from the measurement sensor, and the generation of outgas due to the application of the temperature to the object and the contamination In the exposure operation under such an environment, there is a concern that an error in measuring the movement amount of the moving stage 22 which causes defective products, deterioration of stage accuracy, and adhesion of contamination to the wafer due to impurities or the like may occur.
[0102]
In the present embodiment, in response to the above-described problem, the measurement sensor holding space 9 and the exposure space 6 are isolated, and the timing of opening and closing the sealing door 23 which is a completely sealing mechanism, that is, measurement of correction parameters of the electron beam exposure apparatus Since the operation timing can be detected in advance, the measurement sensor 7b can be turned on in the measurement sensor holding space 9 a predetermined time before the correction parameter measurement operation is performed.
[0103]
Further, the measurement sensor holding space 9 is isolated from the exposure space 6 by the sealing door 23, and the degree of vacuum is maintained by the duct 24 and the vacuum pump 25, and the outgassing and contamination are exhausted. It is possible to absorb the heat generated from the gas and the outgas, so that even when the measurement sensor 7b is placed in the exposure space 6, the measurement sensor 7b is turned on in advance without affecting the degree of vacuum or cleanliness of the exposure space. It is possible to stabilize the output by setting the state.
[0104]
In other words, in a sequence in which the electron beam exposure apparatus is performing the exposure operation, and then, in a sequence in which the correction parameter measurement operation is performed, the electron beam exposure apparatus evacuates the measurement sensor holding space 9. It can be used to turn on the electrical circuit in the measurement sensor 7b and create an ON state for a time when the signal output stabilizes.
[0105]
More specifically, the electron beam exposure apparatus turns on the electric circuit in the measurement sensor 7b through the fitting mechanism 12 of the holding table 14 at the time of exposing the final wafer to be switched to the correction parameter measurement operation. The measurement sensor 7b holds the internal electric circuit in the ON state on the sensor holding base 14 by power supply from the main body of the electron beam exposure apparatus. When the measurement sensor 7b is transported onto the moving stage 22, a rechargeable battery is mounted on the measurement sensor 7b. The power is supplied from the rechargeable battery, and the transport robot 20 is transported while the internal circuit of the measurement sensor 7b is ON. It can be transported by the hand 11. The subsequent operation is as described above.
[0106]
<Embodiment relating to manufacture of semiconductor device>
A description will be given of a semiconductor device manufacturing process according to the first and second embodiments described above, in particular, a semiconductor device manufacturing process using a charged particle beam exposure apparatus.
[0107]
FIG. 8 shows a flow of the entire semiconductor device manufacturing process. In step 1 (circuit design), the circuit of the semiconductor device is designed. In step 2 (exposure control data preparation), exposure control data of the exposure apparatus is prepared based on the designed circuit pattern. On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is referred to as a preprocess, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and assembly such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). Process. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7). For example, the pre-process and the post-process may be performed in separate dedicated factories, and in this case, maintenance is performed for each of these factories by the remote maintenance system described above. Also, information for production management and device maintenance may be data-communicated between the pre-process factory and the post-process factory via the Internet or a dedicated line network.
[0108]
FIG. 9 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. Step 14 (ion implantation) implants ions into the wafer. In step 15 (resist processing), a photosensitive agent is applied to the wafer. In step 16 (exposure), a circuit pattern is drawn (exposed) on the wafer by the above-described exposure apparatus. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist removal), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns can be formed on the wafer.
[0109]
【The invention's effect】
As described above, according to the present invention, when performing an exposure operation of a real element, by eliminating the cable connecting the measurement sensor and the apparatus, the positioning accuracy is reduced due to the influence of the cable tension, and the movement of the wafer stage is reduced. It is possible to prevent a reduction in operation rate due to a reduction in speed and a stoppage of the apparatus.
[0110]
Further, it is possible to prevent the occurrence of defective products due to shielding of the exposure light due to the bending of the cable.
[0111]
In addition, it eliminates the effects of temperature disturbances on the moving stage, and eliminates defective sensors by eliminating measurement sensors and sensor cables from the exposure space, which cause contamination of wafers and equipment, which may cause dust. It becomes possible.
[Brief description of the drawings]
FIG. 1 is a view schematically showing an electron beam exposure apparatus according to a first embodiment.
FIG. 2 is a diagram illustrating a conventional exposure space.
FIG. 3 is a diagram illustrating a configuration of an electron beam exposure apparatus according to the first embodiment.
FIG. 4 is a diagram showing a sensor holding unit on a moving stage for vacuum.
FIG. 5 is a diagram illustrating a configuration of a measurement sensor, a transfer robot, and a transfer hand.
FIG. 6 is a diagram showing a measurement sensor.
FIG. 7 is a diagram illustrating a configuration of an electron beam exposure apparatus according to a second embodiment.
FIG. 8 is a diagram illustrating a flow of a device manufacturing process.
FIG. 9 is a diagram illustrating a flow of a device manufacturing process.
[Explanation of symbols]
6. Exposure space where environment such as vacuum degree is managed almost constant
7 Measurement sensor
8 Wafer chuck
9 Measurement sensor holding space
10 Holder to which measurement sensor is attached
11 Transport hand
12 Fitting mechanism on holding table for holding measuring sensor
14 Holder for holding measurement sensor
15 Measurement sensor cable
16 wafers
17 Holder on measurement sensor side
20 Transfer robot to transfer measurement sensor
21 Electronic lens
22 Vacuum transfer stage
23 Sealed door with complete sealing mechanism
24 Duct for measuring sensor holding space
25 Vacuum pump for measuring sensor holding space
26 Vacuum pump for exposure space
27 Duct for exposure space
28 Reel-shaped rotating body for winding cable

Claims (16)

In a charged particle beam exposure apparatus that irradiates a charged particle beam onto a substrate,
A first vacuum space irradiated with a charged particle beam;
A second vacuum space isolated from the first vacuum space and not receiving the irradiation of the charged particle beam;
A transfer unit for transferring a measurement sensor for measuring energy applied to the substrate between the first vacuum space and the second vacuum space, and setting the vacuum space;
A charged particle beam exposure apparatus comprising: A sealing door for isolating the first vacuum space and the second vacuum space,
2. The charged particle beam exposure according to claim 1, wherein when the measurement sensor is transported by the transport unit, the closed door is opened, and the first vacuum space and the second vacuum space are connected. 3. apparatus. 2. The transfer device according to claim 1, wherein the transfer unit can set the measurement sensor to any one of a plurality of measurement sensor holding units formed on a moving stage that holds the substrate. 3. Charged particle beam exposure equipment. The charged particle beam exposure apparatus according to claim 1, wherein the measurement sensor includes a sensor for measuring a charged particle beam irradiated to the substrate. First measuring means for measuring the degree of vacuum in the first vacuum space;
A first vacuum control unit for controlling a degree of vacuum in the first vacuum space based on a measurement result of the first measurement unit,
2. The charging device according to claim 1, wherein the first vacuum control unit controls a degree of vacuum at which the charged particle beam can be irradiated in the first vacuum space based on the measurement result. 3. Particle beam exposure equipment. Second measuring means for measuring the degree of vacuum in the second vacuum space;
A second vacuum control means for controlling the degree of vacuum in the second vacuum space,
Based on the measurement result, the second vacuum control means, when the measurement sensor is conveyed, the second vacuum control means, so that the degree of vacuum in the first vacuum space and the degree of vacuum in the second vacuum space substantially match. The charged particle beam exposure apparatus according to claim 1, wherein the degree of vacuum in the second vacuum space is controlled. The sealing door seals the first vacuum space and the second vacuum space during the start of the charged particle beam exposure and during the charged particle beam exposure,
3. The charged particle beam exposure apparatus according to claim 2, wherein the transport unit transports the measurement sensor into the second vacuum space, and sets the measurement sensor in a setting unit in the second vacuum space. 4. 4. The apparatus according to claim 3, wherein the transport unit selects one of the plurality of measurement sensor holding units to set the measurement sensor in accordance with an operation sequence of the apparatus or information on a job for operating the apparatus. A charged particle beam exposure apparatus according to item 1. 5. The charged particle beam exposure apparatus according to claim 1, wherein the measurement sensor includes a communication unit configured to transmit measured information by wireless communication. 6. The charged particle beam exposure apparatus according to claim 9, further comprising a receiving unit configured to receive information measured by the measurement sensor and transmitted by wireless communication as wireless information unique to the measurement sensor. . The measurement sensor has a storage unit for storing the measured information therein,
The charged particle beam according to claim 7, wherein the information stored in the storage unit is transmitted to a device via a setting unit of the second vacuum space in which the measurement sensor is set. Exposure equipment. The measurement sensor includes a battery therein and a charging circuit for charging the battery,
The charged particle beam exposure apparatus according to claim 7, wherein the measurement sensor is charged via a setting unit of the set second vacuum space. 5. The charged particle according to claim 1, wherein the measurement sensor is connectable to a connection unit provided in the second vacuum space by a wired signal transmission medium. 6. Line exposure equipment. 14. The charged particle beam exposure apparatus according to claim 13, wherein the wired signal transmission medium includes a wire made of a Teflon insulating material and having a surface subjected to a conductive process. 2. The measurement sensor according to claim 1, wherein the measurement sensor is controlled to be in a measurable ON state a predetermined time before executing a measurement process in a state set in the second vacuum space. 3. Charged particle beam exposure equipment. A method of manufacturing a device, comprising:
A process of installing a plurality of semiconductor manufacturing apparatuses including a charged particle beam exposure apparatus in a factory,
Manufacturing a semiconductor device using the plurality of semiconductor manufacturing apparatuses,
Comprising, the charged particle beam exposure apparatus,
A first vacuum space irradiated with a charged particle beam;
A second vacuum space isolated from the first vacuum space and not receiving the irradiation of the charged particle beam;
Transport means for transporting a measurement sensor for measuring energy applied to the substrate between the first vacuum space and the second vacuum space and setting the vacuum space. A method for manufacturing a device, comprising:

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