JP2007294485A - Soldering method and equipment - Google Patents

Soldering method and equipment Download PDF

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JP2007294485A
JP2007294485A JP2006117037A JP2006117037A JP2007294485A JP 2007294485 A JP2007294485 A JP 2007294485A JP 2006117037 A JP2006117037 A JP 2006117037A JP 2006117037 A JP2006117037 A JP 2006117037A JP 2007294485 A JP2007294485 A JP 2007294485A
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solder
heating
melting point
temperature
soldering
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Hitoshi Goto
均 後藤
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Toyota Motor Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering method and equipment in which temperature control is performed well by detecting the melting point of solder. <P>SOLUTION: When the temperature of solder rises due to heating and the time of fusion of solder is reached, heat of fusion is absorbed by solder and such a tendency as the solder temperature T detected by a thermocouple falls off as the time elapses is shown, and the differentiated value ΔT of solder temperature shows a negative value. When a decision is made that the differentiated value ΔT of solder temperature became smaller than a heating off threshold th; a controller delivers a heating off control signal to a high frequency power supply, and stops current supply to a coil thus altering the heating condition to turn off heating for solder. Temperature control of soldering can be performed with high precision by detecting the melting point of solder exactly even if a thermocouple is used. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、プリント配線基板への電子部品の装着等に用いられるはんだ付け方法及びはんだ付け装置に関する。   The present invention relates to a soldering method and a soldering apparatus used for mounting an electronic component on a printed wiring board.

従来のはんだ付け方法の一例について図３を参照して説明する。図３に示す例では、放熱板１の上部に絶縁基板２が配置され、はんだ箔として供給されるはんだ３を介して素子４を絶縁基板２にはんだ付けする場合に、熱電対５を用いて放熱板１の絶対温度を測定し、この測定した放熱板１の絶対温度に基づいて、はんだ３に対して加熱を行う誘導加熱装置６を制御してはんだ付け時の温度制御を行う（特許文献１参照）。
はんだ付け工程を良好に実行するためには、はんだ３そのものの温度を把握することが望ましいが、はんだ３そのものの温度を直接測定することは困難であり、図３に示す例では、間接的な測定を行っている。 An example of a conventional soldering method will be described with reference to FIG. In the example shown in FIG. 3, when the insulating substrate 2 is disposed on the heat sink 1 and the element 4 is soldered to the insulating substrate 2 via the solder 3 supplied as a solder foil, the thermocouple 5 is used. The absolute temperature of the heat sink 1 is measured, and based on the measured absolute temperature of the heat sink 1, the induction heating device 6 that heats the solder 3 is controlled to control the temperature during soldering (Patent Document) 1).
In order to execute the soldering process satisfactorily, it is desirable to grasp the temperature of the solder 3 itself, but it is difficult to directly measure the temperature of the solder 3 itself. In the example shown in FIG. Measuring.

また、放熱板１を介してはんだ３を間接的に温度測定を行う熱電対５に代えて、図４に示すように、非接触温度計７を用い、はんだ３の温度を検出することが考えられる。
特開２００５−２０５４１８号公報 In addition, instead of the thermocouple 5 that indirectly measures the temperature of the solder 3 via the heat sink 1, it is considered to detect the temperature of the solder 3 using a non-contact thermometer 7 as shown in FIG. It is done.
JP-A-2005-205418

しかしながら、図３に示す方法では、はんだ３の温度について間接的に把握するため、はんだ付け時の温度制御の精度が劣ったものになる。
また、図４に示す方法では、絶縁基板２及び素子４にはんだ箔として供給されるはんだ３が挟まれることから、非接触温度計７を用いても、はんだ３の温度を精度高く検出することは難しかった。
また、はんだ付け時の温度制御は、特に、はんだ３が溶け始めたところで、高精度とされることが要求されている。これに対し、上述した図３、図４に示す方法では、はんだ付け時の温度制御の精度が劣っていることに加えて、はんだ３が溶け始めたところで、温度制御をより高精度で行うことが望まれるものの、何らの対処もなされておらず、改善が求められているというのが実情であった。 However, in the method shown in FIG. 3, since the temperature of the solder 3 is indirectly grasped, the accuracy of temperature control during soldering is inferior.
In addition, in the method shown in FIG. 4, since the solder 3 supplied as a solder foil is sandwiched between the insulating substrate 2 and the element 4, the temperature of the solder 3 can be detected with high accuracy even if the non-contact thermometer 7 is used. Was difficult.
Also, the temperature control during soldering is required to be highly accurate, particularly when the solder 3 starts to melt. On the other hand, in the method shown in FIGS. 3 and 4 described above, in addition to inferior accuracy of temperature control during soldering, temperature control is performed with higher accuracy when the solder 3 starts to melt. However, no action has been taken and improvement is required.

本発明は、上記事情に鑑みてなされたもので、はんだの融解点を検出することにより良好に温度制御を行うことができるはんだ付け方法及びはんだ付け装置を提供することを目的とする。   The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a soldering method and a soldering apparatus that can perform temperature control satisfactorily by detecting a melting point of solder.

請求項１記載の発明は、第１、第２の接合部材をはんだを用いて接合するはんだ付け方法であって、前記はんだの融解点を検出する融解点検出工程と、該融解点検出工程で検出した前記はんだの融解点に基づいて、前記はんだに対する加熱条件を変更する加熱条件変更工程とを備えたことを特徴とする。
請求項２記載の発明は、請求項１記載のはんだ付け方法において、前記融解点検出工程での前記はんだの融解点検出は、前記はんだの融解熱に基づく温度変化を利用して行うことを特徴とする。
請求項３記載の発明は、請求項１又は２に記載のはんだ付け方法において、前記加熱条件変更工程では、前記はんだの融解熱に基づくはんだ温度の低下をトリガとして、所定時間、前記はんだへの加熱をオフし、その後、再度、加熱を行うことを特徴とする。 The invention according to claim 1 is a soldering method for joining the first and second joining members using solder, and includes a melting point detecting step for detecting a melting point of the solder, and a melting point detecting step. And a heating condition changing step of changing a heating condition for the solder based on the detected melting point of the solder.
According to a second aspect of the present invention, in the soldering method according to the first aspect, the melting point detection of the solder in the melting point detection step is performed using a temperature change based on the heat of fusion of the solder. And
According to a third aspect of the present invention, in the soldering method according to the first or second aspect, in the heating condition changing step, a decrease in the solder temperature based on the heat of fusion of the solder is used as a trigger for a predetermined time. Heating is turned off, and then heating is performed again.

請求項４記載の発明は、第１、第２の接合部材を接合するためのはんだを加熱する加熱手段と、該加熱手段を制御して前記はんだに対する加熱調整を行う加熱手段調整手段とを備えたはんだ付け装置であって、前記はんだの融解点を検出する融解点検出手段を有し、前記加熱手段調整手段は、該融解点検出手段が検出した前記はんだの融解点に基づいて、前記はんだに対する加熱条件を変更するように前記加熱手段を調整することを特徴とする。
請求項５記載の発明は、請求項４記載のはんだ付け装置において、前記融解点検出手段の前記はんだの融解点検出は、前記はんだの融解熱に基づく温度変化を利用して行うことを特徴とする。
請求項６記載の発明は、請求項４又は５記載のはんだ付け装置において、前記加熱手段調整手段は、前記はんだの融解熱に基づくはんだ温度の低下をトリガとして、所定時間、前記はんだへの加熱をオフし、その後、再度、加熱を行うように前記加熱手段を調整することを特徴とする。 According to a fourth aspect of the present invention, there is provided heating means for heating the solder for joining the first and second joining members, and heating means adjusting means for controlling the heating means to adjust the heating of the solder. A soldering apparatus having melting point detecting means for detecting the melting point of the solder, wherein the heating means adjusting means is based on the melting point of the solder detected by the melting point detecting means. The heating means is adjusted so as to change the heating condition.
According to a fifth aspect of the present invention, in the soldering apparatus according to the fourth aspect, the detection of the melting point of the solder of the melting point detecting means is performed using a temperature change based on the heat of fusion of the solder. To do.
According to a sixth aspect of the present invention, in the soldering apparatus according to the fourth or fifth aspect, the heating means adjustment means heats the solder for a predetermined time using a decrease in solder temperature based on the melting heat of the solder as a trigger. Then, the heating means is adjusted so that the heating is performed again.

請求項１ないし６記載の発明によれば、はんだの融解点を検出し、検出したはんだの融解点に基づいて、はんだに対する加熱条件を変更するので、はんだの融解点に対応したはんだ付け処理を行え、これにより良好なはんだ付けを実現できる。   According to the first to sixth aspects of the present invention, since the melting point of the solder is detected and the heating condition for the solder is changed based on the detected melting point of the solder, the soldering process corresponding to the melting point of the solder is performed. This can be done and good soldering can be realized.

はんだ付けにおける温度制御は、上述したように、はんだが溶け始めたところで高精度の制御が要求される。本願発明者は、はんだ付けにおける温度制御に対する上述した要求に応えるべく、はんだの溶け始めたところと、はんだの融解熱との対応関係に着目し、本願発明に想到した。すなわち、本願発明では、はんだが溶け始めたところ（はんだ溶融による変化点）、すなわち、はんだの融解点を検出することにより、はんだ付けにおける温度制御を高精度で行えるようにしている。以下に、本発明の一実施の形態を、図１及び図２に基づいて説明する。なお、図３及び図４に示す部材と同等の部材には、同等の符号を付し、その説明は適宜、省略する。   As described above, the temperature control in soldering requires high-precision control when the solder starts to melt. In order to meet the above-described demand for temperature control in soldering, the inventor of the present application has come up with the present invention by paying attention to the correspondence between the start of melting of solder and the heat of fusion of solder. That is, in the present invention, the temperature control in soldering can be performed with high accuracy by detecting the point where the solder starts to melt (change point due to solder melting), that is, the melting point of the solder. In the following, an embodiment of the present invention will be described with reference to FIGS. Note that members equivalent to those shown in FIGS. 3 and 4 are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

図１において、はんだ付け装置８は、加熱炉９内にて、プリント配線基板として用いられる絶縁基板２（第１の接合部材）及び素子４（第２の接合部材）について、はんだ３を用いて接合するようにしている。はんだ３は、はんだ箔として、絶縁基板２及び素子４間に配置され、この配置状態ではんだ付け処理が行われる。絶縁基板２における素子４と反対側の面部には、通電に伴う素子４の発熱分の放熱を行うための放熱板１が配置されている。放熱板１の図１下部側には、誘導加熱装置６（加熱手段）の高周波電源１０に接続されたコイル１１及び発熱部１２が配置されている。誘導加熱装置６は、電流がコイル１１に流れることにより発熱部１２がその電流に応じて熱を発生する。   In FIG. 1, a soldering apparatus 8 uses a solder 3 for an insulating substrate 2 (first bonding member) and an element 4 (second bonding member) used as a printed wiring board in a heating furnace 9. I try to join them. The solder 3 is disposed between the insulating substrate 2 and the element 4 as a solder foil, and a soldering process is performed in this disposed state. On the surface of the insulating substrate 2 opposite to the element 4, a heat dissipating plate 1 for dissipating heat generated by the element 4 due to energization is disposed. A coil 11 and a heat generating portion 12 connected to a high frequency power source 10 of an induction heating device 6 (heating means) are disposed on the lower side of the heat radiating plate 1 in FIG. In the induction heating device 6, when a current flows through the coil 11, the heating unit 12 generates heat according to the current.

放熱板１の図１上面部に接触して、絶縁基板２を介してはんだ３の温度を検出する熱電対５が配置されている。熱電対５及び高周波電源１０には、予め定められた加熱パターンに従って高周波電源１０を制御してコイル１１への電流供給を行わせるコントローラ１３（加熱手段調整手段）が接続されている。また、コントローラ１３は、熱電対５が検出するはんだ３の温度（以下、はんだ温度Ｔという。）の入力を受け、はんだ温度Ｔの微分値（以下、はんだ温度微分値ΔＴという。）を求める微分回路１５と、予め定めた加熱オフ閾値ｔｈを格納するメモリ１６と、を備えている。   A thermocouple 5 that detects the temperature of the solder 3 through the insulating substrate 2 is disposed in contact with the upper surface of the heat radiating plate 1 in FIG. Connected to the thermocouple 5 and the high frequency power supply 10 is a controller 13 (heating means adjusting means) that controls the high frequency power supply 10 according to a predetermined heating pattern to supply current to the coil 11. Further, the controller 13 receives an input of the temperature of the solder 3 detected by the thermocouple 5 (hereinafter referred to as solder temperature T) and obtains a differential value of the solder temperature T (hereinafter referred to as solder temperature differential value ΔT). A circuit 15 and a memory 16 for storing a predetermined heating off threshold th are provided.

コントローラ１３は、さらに、はんだ温度微分値ΔＴ及び加熱オフ閾値ｔｈの比較結果に基づいて高周波電源１０に対する制御信号ｍを出力する判定回路１７を備えている。本実施の形態では、加熱オフ閾値ｔｈは負の値とされている。判定回路１７では、はんだ温度微分値ΔＴが加熱オフ閾値ｔｈより小さい値（はんだ温度Ｔが負の値で、かつはんだ温度微分値ΔＴの絶対値が加熱オフ閾値ｔｈの絶対値より大きい値）になったと判断すると、高周波電源１０からのコイル１１への電流供給を停止し、はんだ３への加熱をオフする旨の制御信号ｍ（以下、オフ制御信号ｍｔという。）を出力する。
本実施の形態では、熱電対５及びコントローラ１３が融解点検出手段を構成している。 The controller 13 further includes a determination circuit 17 that outputs a control signal m for the high-frequency power source 10 based on a comparison result between the solder temperature differential value ΔT and the heating-off threshold value th. In the present embodiment, the heating-off threshold th is a negative value. In the determination circuit 17, the solder temperature differential value ΔT is smaller than the heating off threshold th (the solder temperature T is a negative value, and the absolute value of the solder temperature differential value ΔT is larger than the absolute value of the heating off threshold th). When it is determined that the current has reached, the current supply from the high frequency power supply 10 to the coil 11 is stopped, and a control signal m (hereinafter referred to as an off control signal mt) for turning off the heating to the solder 3 is output.
In the present embodiment, the thermocouple 5 and the controller 13 constitute melting point detection means.

上述したようにコイル１１へ電流供給して発熱部１２が熱を発生することにより、はんだ３は図２（Ａ）に示すように、その温度が、はんだ３の融解時を除き、時間経過と共に上昇する。はんだ３の融解時（はんだ３が溶け始めたところに相当する。）には、発熱部１２からの熱の一部がはんだ３の状態変化（融解）に用いられ、熱電対５が検出する温度、ひいては、はんだ温度Ｔは、時間経過に伴い低下する傾向を示すことになる。   As described above, when the current is supplied to the coil 11 and the heat generating portion 12 generates heat, the temperature of the solder 3 is increased with time except when the solder 3 is melted, as shown in FIG. To rise. At the time of melting of the solder 3 (corresponding to the place where the solder 3 starts to melt), a part of the heat from the heat generating part 12 is used for the state change (melting) of the solder 3, and the temperature detected by the thermocouple 5 As a result, the solder temperature T tends to decrease with time.

熱電対５が、図２（Ａ）に示すはんだ温度Ｔを検出した場合、微分回路１５は、図２（Ｂ）に示すはんだ温度微分値ΔＴを算出することになる。上述したように、はんだ３の融解時には、はんだ温度Ｔは、時間経過に伴い低下する傾向を示すことから、はんだ温度微分値ΔＴは、負の値を示すことになる。
図２（Ａ）、（Ｂ）から明らかなように、はんだ３の融解時には、非融解時（はんだ３の融解時以外のとき）に比べ、温度の変化が大きく異なっている。 When the thermocouple 5 detects the solder temperature T shown in FIG. 2A, the differentiating circuit 15 calculates the solder temperature differential value ΔT shown in FIG. As described above, when the solder 3 is melted, the solder temperature T tends to decrease with time, so the solder temperature differential value ΔT shows a negative value.
As apparent from FIGS. 2A and 2B, the temperature change is greatly different when the solder 3 is melted compared to when the solder 3 is not melted (when the solder 3 is not melted).

そして、本実施の形態では、上述したように温度の変化が大きく異なる部分、ひいてははんだ３の融解点を、はんだ温度微分値ΔＴを用いて検出し、後述するように、はんだ３に対する加熱条件を変更し（加熱をオフし）、これによりはんだ付けにおける温度制御を高精度に行うようにしている。
図２（Ａ）、（Ｂ）に示すはんだ３の温度特性は、融解時を含めて、ある一定条件下で、はんだ３固有で定まっている。本実施の形態では、本実施の形態で用いるはんだ３の図２（Ｂ）に対応した温度特性に基づいて、前記加熱オフ閾値ｔｈを予め定めている。 In the present embodiment, as described above, the portion where the change in temperature is greatly different, that is, the melting point of the solder 3 is detected using the solder temperature differential value ΔT, and the heating condition for the solder 3 is set as described later. It is changed (heating is turned off), and thereby temperature control in soldering is performed with high accuracy.
The temperature characteristics of the solder 3 shown in FIGS. 2A and 2B are specific to the solder 3 under a certain condition including the time of melting. In the present embodiment, the heating off threshold th is determined in advance based on the temperature characteristics corresponding to FIG. 2B of the solder 3 used in the present embodiment.

上述したように構成されたはんだ付け装置８の作用を以下に説明する。
コイル１１へ電流供給して発熱部１２が熱を発生することにより、熱電対５が検出するはんだ温度Ｔは、図２（Ａ）に示すように、徐々に高くなる。熱電対５の検出データは、微分回路１５に入力され、微分回路１５ははんだ温度微分値ΔＴを算出する。 The operation of the soldering apparatus 8 configured as described above will be described below.
When the current is supplied to the coil 11 and the heat generating portion 12 generates heat, the solder temperature T detected by the thermocouple 5 gradually increases as shown in FIG. The detection data of the thermocouple 5 is input to the differentiation circuit 15, and the differentiation circuit 15 calculates the solder temperature differential value ΔT.

はんだ３の温度上昇がさらに進んで、はんだ３が溶け始める（すなわち、はんだ３の融解時に至る）と、発熱部１２からの熱の一部がはんだ３の状態変化（融解）に用いられ（熱がはんだ３に吸収され）、熱電対５が検出するはんだ温度Ｔは、時間経過に伴い低下する傾向を示す。これに伴い、微分回路１５が算出するはんだ温度微分値ΔＴは、負の値を示す。そして、微分回路１５が算出するはんだ温度微分値ΔＴが、加熱オフ閾値ｔｈより小さくなったと判定する（融解点検出工程）と、コントローラ１３は、加熱オフ制御信号ｍｔを高周波電源１０に出力し、コイル１１への電流供給を停止し、はんだ３に対する加熱をオフする（加熱条件変更工程）。このようにしてはんだ３の融解点を検出して、はんだ付けにおける温度制御を高精度で行えるようにしている。
なお、上記実施の形態では、はんだ３の融解熱に基づくはんだ温度の低下をトリガとして（温度微分値ΔＴ＜加熱オフ閾値ｔｈの判定に基づいて）、加熱オフ制御信号ｍｔを出力して加熱をオフし、はんだ付けにおける温度制御を高精度で行える場合を例にしたが、これに代えて、次のように構成してもよい。すなわち、微分回路１５が算出するはんだ温度微分値ΔＴが、加熱オフ閾値ｔｈより小さくなったと判定すると（すなわち、はんだ３の融解熱に基づくはんだ温度の低下をトリガとして）〔ここまでは、上記実施の形態と同様である。〕、所定時間、はんだ３への加熱をオフし、その後、再度、加熱を行うようにしてもよい。このように構成することにより、はんだ３の状態をタイミング良く安定させることができ、ひいては良好にはんだ付けできる。 When the temperature of the solder 3 further rises and the solder 3 starts to melt (that is, when the solder 3 is melted), a part of the heat from the heat generating part 12 is used for the state change (melting) of the solder 3 (heat Is absorbed by the solder 3), and the solder temperature T detected by the thermocouple 5 tends to decrease with time. Along with this, the solder temperature differential value ΔT calculated by the differentiating circuit 15 shows a negative value. Then, when it is determined that the solder temperature differential value ΔT calculated by the differentiating circuit 15 is smaller than the heating off threshold th (melting point detection step), the controller 13 outputs the heating off control signal mt to the high frequency power source 10, The current supply to the coil 11 is stopped, and the heating to the solder 3 is turned off (heating condition changing step). In this way, the melting point of the solder 3 is detected, and temperature control in soldering can be performed with high accuracy.
In the above embodiment, the heating off control signal mt is output for heating by using a decrease in solder temperature based on the heat of fusion of the solder 3 as a trigger (based on the determination of temperature differential value ΔT <heating off threshold th). Although the case where the temperature control in the soldering can be performed with high accuracy is taken as an example, the following configuration may be used instead. That is, when it is determined that the solder temperature differential value ΔT calculated by the differentiating circuit 15 is smaller than the heating-off threshold value th (that is, triggered by a decrease in solder temperature based on the heat of fusion of the solder 3) [ It is the same as the form. The heating to the solder 3 may be turned off for a predetermined time, and then the heating may be performed again. By comprising in this way, the state of the solder 3 can be stabilized with sufficient timing, and by extension, it can solder well.

本実施の形態では、はんだ３の融解点の検出は、はんだ温度微分値ΔＴを用いて行っている。このため、本実施の形態では、熱電対５、すなわち温度測定精度が必ずしも高くない温度センサの検出値を用いているものの、はんだ３の融解点を適切に検出することができ、これにより、はんだ付けにおける温度制御を高精度で行え、ひいては良好なはんだ付け加工を実現することが可能となる。   In the present embodiment, the melting point of the solder 3 is detected using the solder temperature differential value ΔT. For this reason, in the present embodiment, although the detection value of the thermocouple 5, that is, the temperature sensor whose temperature measurement accuracy is not necessarily high, is used, the melting point of the solder 3 can be appropriately detected. It is possible to control the temperature in the soldering with high accuracy and to realize a good soldering process.

上記実施の形態では、素子４（第２の接合部材）が１個である場合を例にしたが、本発明はこれに限らず、素子４を２個以上、はんだ付けする場合にも用いることができる。
また、上記実施の形態では、第１の接合部材が絶縁基板２で、第２の接合部材が素子４である場合を例にしたが、第１の接合部材を放熱板１、第２の接合部材を絶縁基板２として、放熱板１及び絶縁基板２について、はんだ３により接合する場合に用いてもよい。 In the above embodiment, the case where there is one element 4 (second bonding member) is taken as an example. However, the present invention is not limited to this, and it is also used when two or more elements 4 are soldered. Can do.
Moreover, in the said embodiment, although the case where the 1st joining member was the insulating substrate 2 and the 2nd joining member was the element 4 was taken as an example, the 1st joining member is made into the heat sink 1 and the 2nd joining. The member may be used as the insulating substrate 2 when the heat radiating plate 1 and the insulating substrate 2 are joined by the solder 3.

本発明の一実施の形態に係るはんだ付け装置を模式的に示す図である。It is a figure which shows typically the soldering apparatus which concerns on one embodiment of this invention. 図１のはんだ付け装置のはんだ昇温時における作用を示すための図であり、（Ａ）は、熱電対が検出するはんだの温度を示す図、（Ａ）は、微分回路が算出するはんだ温度微分値を示す図である。It is a figure for showing the effect | action at the time of the solder temperature rise of the soldering apparatus of FIG. 1, (A) is a figure which shows the temperature of the solder which a thermocouple detects, (A) is the solder temperature which a differentiation circuit calculates It is a figure which shows a differential value. 熱電対を用いたはんだ付け装置の従来の一例を示す図である。It is a figure which shows an example of the conventional soldering apparatus using a thermocouple. 非接触温度計を用いたはんだ付け装置の従来の一例を示す図である。It is a figure which shows an example of the conventional soldering apparatus using a non-contact thermometer.

符号の説明Explanation of symbols

２…絶縁基板（第１の接合部材）、３…はんだ、４…素子（第２の接合部材）、５…熱電対（融解点検出手段）、８…はんだ付け装置、１３…コントローラ（加熱手段調整手段、融解点検出手段）。

2 ... Insulating substrate (first joining member), 3 ... Solder, 4 ... Element (second joining member), 5 ... Thermocouple (melting point detecting means), 8 ... Soldering device, 13 ... Controller (heating means) Adjusting means, melting point detecting means).

Claims (6)

第１、第２の接合部材をはんだを用いて接合するはんだ付け方法であって、
前記はんだの融解点を検出する融解点検出工程と、
該融解点検出工程で検出した前記はんだの融解点に基づいて、前記はんだに対する加熱条件を変更する加熱条件変更工程とを備えたことを特徴とするはんだ付け方法。 A soldering method for joining the first and second joining members using solder,
A melting point detecting step for detecting a melting point of the solder;
A soldering method comprising: a heating condition changing step of changing a heating condition for the solder based on the melting point of the solder detected in the melting point detecting step. 前記融解点検出工程での前記はんだの融解点検出は、前記はんだの融解熱に基づく温度変化を利用して行うことを特徴とする請求項１記載のはんだ付け方法。   The soldering method according to claim 1, wherein the melting point detection of the solder in the melting point detection step is performed using a temperature change based on the heat of fusion of the solder. 前記加熱条件変更工程では、前記はんだの融解熱に基づくはんだ温度の低下をトリガとして、所定時間、前記はんだへの加熱をオフし、その後、再度、加熱を行うことを特徴とする請求項１又は２に記載のはんだ付け方法。   The heating condition changing step is characterized by turning off the heating to the solder for a predetermined time using a decrease in the solder temperature based on the heat of fusion of the solder as a trigger, and then heating again. 2. The soldering method according to 2. 加熱条件変更工程第１、第２の接合部材を接合するためのはんだを加熱する加熱手段と、該加熱手段を制御して前記はんだに対する加熱調整を行う加熱手段調整手段とを備えたはんだ付け装置であって、
前記はんだの融解点を検出する融解点検出手段を有し、
前記加熱手段調整手段は、該融解点検出手段が検出した前記はんだの融解点に基づいて、前記はんだに対する加熱条件を変更するように前記加熱手段を調整することを特徴とするはんだ付け装置。 Heating condition changing step A soldering apparatus comprising a heating means for heating the solder for joining the first and second joining members, and a heating means adjusting means for controlling the heating means to adjust the heating of the solder. Because
Having a melting point detecting means for detecting the melting point of the solder;
The said heating means adjustment means adjusts the said heating means so that the heating conditions with respect to the said solder may be changed based on the melting point of the said solder detected by this melting point detection means, The soldering apparatus characterized by the above-mentioned. 前記融解点検出手段の前記はんだの融解点検出は、前記はんだの融解熱に基づく温度変化を利用して行うことを特徴とする請求項４記載のはんだ付け装置。   5. The soldering apparatus according to claim 4, wherein the melting point detection of the solder by the melting point detection means is performed using a temperature change based on the heat of fusion of the solder. 前記加熱手段調整手段は、前記はんだの融解熱に基づくはんだ温度の低下をトリガとして、所定時間、前記はんだへの加熱をオフし、その後、再度、加熱を行うように前記加熱手段を調整することを特徴とする請求項４又は５記載のはんだ付け装置。

The heating means adjusting means adjusts the heating means to turn off the heating to the solder for a predetermined time using a decrease in the solder temperature based on the heat of fusion of the solder as a trigger, and then to heat again. 6. The soldering apparatus according to claim 4 or 5, wherein:

JP2006117037A 2006-04-20 2006-04-20 Soldering method and equipment Withdrawn JP2007294485A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010247180A (en) * 2009-04-15 2010-11-04 Mitsubishi Electric Corp Brazing apparatus and brazing method using the same
CN105458433A (en) * 2016-01-20 2016-04-06 福建中科晶创光电科技有限公司 Multi-segment temperature soldering packaging device and method for miniature solid laser
CN106735664A (en) * 2015-11-19 2017-05-31 松下知识产权经营株式会社 Method for welding

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010247180A (en) * 2009-04-15 2010-11-04 Mitsubishi Electric Corp Brazing apparatus and brazing method using the same
CN106735664A (en) * 2015-11-19 2017-05-31 松下知识产权经营株式会社 Method for welding
JP2017094346A (en) * 2015-11-19 2017-06-01 パナソニックＩｐマネジメント株式会社 Brazing method
CN105458433A (en) * 2016-01-20 2016-04-06 福建中科晶创光电科技有限公司 Multi-segment temperature soldering packaging device and method for miniature solid laser

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