CN105458433A - Multi-segment temperature soldering packaging device and method for miniature solid laser - Google Patents
Multi-segment temperature soldering packaging device and method for miniature solid laser Download PDFInfo
- Publication number
- CN105458433A CN105458433A CN201610036464.7A CN201610036464A CN105458433A CN 105458433 A CN105458433 A CN 105458433A CN 201610036464 A CN201610036464 A CN 201610036464A CN 105458433 A CN105458433 A CN 105458433A
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- groove
- fixed
- tin material
- soldering tin
- substrate
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Ceramic Products (AREA)
Abstract
The invention provides a multi-segment temperature soldering packaging device and method for a miniature solid laser. The device comprises a base plate, a ceramic heating sheet and fixing parts; the fixing parts comprise optical elements and supports, and each optical element is fixed to the corresponding support; the ceramic heating sheet is closely attached to the lower surface of the base plate; the base plate is fixed to an operating platform which has the cooling function and is resistant to high temperature, the base plate is provided with one or more grooves, each groove is filled with soldering materials different in fusion point, and each support to which the corresponding optical element is fixed is fixed into the corresponding groove through the corresponding soldering materials; a thermistor is installed on the side wall of the base plate. The soldering materials adopted in all the grooves are different in temperature, when each fixing part is soldered, the previous fixing part which is soldered ready is not influenced, the fixing parts and the base plate are integrated permanently, and the structure is stable and firm.
Description
Technical field
The present invention relates to optics assembling encapsulation field, particularly relate to a kind of packaging system and method for packing of multistage temperature welding of miniature solid state laser.
Background technology
Laser technology has penetrated in the middle of every field, as industrial processes, and Medical Devices, military weapon, biological detection, scientific research etc.Along with the development of science and technology, laser technology has also come into our life gradually.Laser display, pursuing beautiful super large picture, pure color, high-resolution display effect, is always a kind of latent demands of people to visual experience.The large foundation to Command center, network management center, little the carrying out to video conference, academic report, technology lecture and multifunctional conference, more and more stronger to the serious hope of large picture, multicolour, high brightness, high-resolution display effect, and traditional video wall, project that hard mosaic screen and box body splicing wall etc. are very difficult meets people's requirement in this respect.Laser display technology utilizes All-Solid working-laser material, the light source that the continuous laser producing RGB three kinds of wavelength shows as color laser, and passing hole three primary colours are dry light source catoptric imaging on dmd chip just.As the light source of laser display, the stability of laser instrument and being reliably even more important, determines effect and the life-span of display.
Laser display instrument, as portable projecting apparatus, cube little as far as possible, is convenient to move and carry.In small size situation, also to there is higher power output.Usually, power requirement exports higher, and the heat of generation is larger, and the words that volume is little can be unfavorable for heat radiation, thus causes the phenomenon that power is unstable or decline.For traditional optical elements assembly technology, each optical element adheres on substrate by the general AB heat conduction elargol that adopts, but as elargol, its thermal conductivity factor is large not as metal itself, and when pump power is too high, accumulation appears in heat, and power output is unstable or decline.Meanwhile, adopt adhesion process, the glue time of doing will reach more than 4 hours, turns that to join the cycle very long, and efficiency is low.The present invention is directed to the deficiency of traditional assembly method, propose a kind of assembly period short, the optical element packaging system that band thermal effect is good and method for packing, all optical elements are fixed on substrate all in a welding manner, reach good heat conduction effect, firm compact structure.The packaging system that the present invention proposes and method for packing are to the stability of microlaser and reliability and can to realize more high-power output significant.
Summary of the invention
The technical problem to be solved in the present invention, the packaging system being to provide a kind of multistage temperature of miniature solid state laser to weld and method for packing thereof, solve the problem that existing efficiency of assembling is not high, stability is bad, power is low.
The present invention is achieved in that a kind of packaging system of multistage temperature welding of miniature solid state laser, comprises substrate, ceramic heating flake, fixture; Described fixture comprises optical element and support, and described optical element is fixed on support; Described ceramic heating flake is close to base lower surface; Described substrate is fixed on and has refrigerating function and on resistant to elevated temperatures operating platform, substrate is provided with at least one groove, is filled with the different soldering tin material of fusing point in each groove, described in be fixed with optical element support be fixed in groove by soldering tin material; The sidewall of described substrate is provided with thermistor.
Wherein, the high-temp glue that described optical element adopts fusing point to be greater than 250 ° is fixed on support.
Wherein, the sidewall of described substrate is provided with circular hole, installs thermistor in described circular hole.
Wherein, the degree of depth of described groove is 0.5-1mm.
Wherein, the quantity of described groove is 3.
Wherein, the material of described substrate is aluminium, and its surface is coated with layer gold.
The present invention also discloses a kind of multistage temperature welding method for packing of miniature fixed laser, and the packaging system described in application, comprises the steps:
S001: fill soldering tin material in each groove of substrate, in N groove, soldering tin material fusing point is greater than N+1 groove weld tin material fusing point;
S002 a: fixture is suspended in above N groove;
S003: ceramic heating flake starts heating, utilizes thermistor to detect substrate temperature, and when substrate temperature reaches soldering tin material fusing point in N groove, ceramic heating flake keeps constant temperature to the fluted interior soldering tin material fusing of institute;
S004: fine setting fixture makes it to be fixed in N groove, cooling ceramic heating flake completes the fixing of fixture, and keeps soldering tin material in N+1 groove to be in melting state; Circulation step S004;
S005: terminate.
Wherein, the soldering tin material fusing point that scolding tin uses the earliest is 250 °, and the fusing point of the second order soldering tin material is 180 °, and the fusing point of the 3rd order soldering tin material is 80 °.
The invention has the advantages that:
Optical element is fixed on support and forms fixture, substrate is close to ceramic heating flake and substrate is fixed on and there is refrigerating function and on resistant to elevated temperatures operating platform, soldering tin material is filled in groove, fixture is suspended at the top of target recess, to ceramic heating flake for electrical heating, soldering tin material is melted, fine setting fixture position makes it to be fixed in target recess, cooling ceramic heating flake, only need wait for that ceramic heating flake temperature is cooled to the fusing point of next groove when completing the fixing next fixture of fixture, and continuation cooling ceramic heating flake fixes next fixture.The soldering tin material temperature adopted in each groove is different, the previous fixture welded can not be affected when welding each fixture, all fixtures so just can be made all firmly to be fixed on substrate, and make fixture and substrate permanent integrated, Stability Analysis of Structures is firm.
Meanwhile, whole operating process is simple, and the cycle is short, and efficiency is high, and traditional handicraft adopts AB heat conduction elargol, and heat conductivility is not good, and when laser pumping power is excessive, used heat is not easily transferred, at lower power could steady operation.
Accompanying drawing explanation
Fig. 1 is the overview of the packaging system of the multistage temperature welding of miniature solid state laser of the present invention;
Fig. 2 is the method for packing flow chart of the multistage temperature welding of miniature solid state laser of the present invention.
Label declaration:
Substrate-1 ceramic heating flake-2 groove-3 support-4 optical element-5 thermistor-6.
Detailed description of the invention
By describing technology contents of the present invention, structural feature in detail, realized object and effect, accompanying drawing is coordinated to be explained in detail below in conjunction with embodiment.
Consult the packaging system of the multistage temperature welding of a kind of miniature solid state laser shown in Fig. 1, comprise substrate 1, ceramic heating flake 2, fixture; Described fixture comprises optical element 5 and support 4, and described optical element 5 is fixed on support 4; Described ceramic heating flake 2 is close to substrate 1 lower surface; Described substrate 1 is fixed on and has refrigerating function and on resistant to elevated temperatures operating platform, substrate 1 is provided with at least one groove 3, be filled with the different soldering tin material of fusing point in each groove 3, described in be fixed with optical element 5 support 4 be fixed in groove 3 by soldering tin material; The sidewall of described substrate 1 is provided with thermistor 6.
Described fixture is combined by optical element 5 and support 4, and described optical element 5 can adopt high-temp glue to be bonded on support 4, and the fusing point of described high-temp glue is greater than 250 °, higher than the fusing point of soldering tin material.Described support 4 material can adopt the aluminum of heat conduction, perfect heat-dissipating, and is coated with the convenient welding of layer gold, fixing on its surface.
The substrate 1 of carrying laserresonator is pressed on ceramic heating flake 2, and substrate 1 is adopted be screwed in and there is refrigerating function and on resistant to elevated temperatures operating platform.Described substrate 1 is longer cuboid, can adopt heat conduction, the heat dispersion preferably metal material such as aluminum, and be coated with layer gold at metal material surface, convenient welding, fixing.The upper surface of described substrate 1 is provided with some grooves 3, preferably arranges 3 grooves 3, and the degree of depth of described groove is 0.5-1mm, and the degree of depth of groove should suitably control, and excessively dark, mistake is shallow is all unfavorable for the fixing of fixture.
The sidewall of described substrate is provided with circular hole, and circular hole internal fixtion has thermistor, and thermistor 6 is used for detecting the temperature of substrate, and to weld soldering tin material fusing point used different for each optical element 5 here, so must carry out detection control to temperature.The ceramic heating flake 2 used can realize the melting temperature reaching soldering tin material in groove 3 in the short time, realize completing welding process fast, make laser complete machine realize integration, improve while laser instrument manufactures efficiency and overall laser reliability and stability are improved.Described ceramic heating flake 2 can convert electrical energy into heat energy, thus heats to substrate 1.
The soldering tin material adopted can be solder plate or solder(ing) paste, the fusing point of the soldering tin material of filling in each groove 3 is different, the fusing point that first fixture welding uses is the highest, the next soldering tin material fusing point used of welding reduces gradually, thus fixture and substrate 1 permanent integral can be made, make its structure more firmly compact.
As shown in Figure 2, the multistage temperature welding packaging system of described miniature fixed laser, its method for packing comprises the steps:
S001: fill soldering tin material in each groove of substrate, in N groove, soldering tin material fusing point is greater than N+1 soldering tin material fusing point, N be equal greatly 1 integer;
S002: the first fixture is suspended in above N groove;
S003: ceramic heating flake 2 starts heating, and utilize described thermistor 6 to detect substrate 1 temperature, when substrate 1 temperature reaches the fusing point of N groove, ceramic heating flake 2 keeps constant temperature to melt to soldering tin material;
S004: finely tune the first fixture and make it to be fixed in N groove, cooling ceramic heating flake 2 completes the fixing of the first fixture, and keeps soldering tin material in N+1 groove to be in melting state;
S005: be fixed in N+1 groove by the second fixture, cooling ceramic heating flake makes substrate temperature lower than the fusing point of soldering tin material in N+1 groove and higher than soldering tin material fusing point in N+2 groove, completes the second fixture and fix.
S006: be fixed in N+2 groove by the 3rd fixture, cooling ceramic heating flake makes substrate temperature lower than the fusing point of soldering tin material in N+2 groove, completes the 3rd fixture and fixes.
Reduce ceramic heating flake temperature gradually according to the method described above, and successively fixture is fixed in groove, until complete the welding of all optical elements 5, the all optical elements 5 of laser resonant cavity all adopt the method for welding fixedly make resonator firmly and stablize, the method is applicable to the simple laser instrument of structure, welding method is more conducive to dispel the heat compared with original technique, is more conducive to realize high power, simultaneously overall laser constancy of volume.The soldering tin material fusion temperature adopted during each fixture welding in above-mentioned embodiment is different, adopts the fusing point of soldering tin material to reduce gradually according to welding sequence, can not affect the fixture welded above like this when welding next fixture.Utilize all fixtures of multistage temperature welding method that welding method can be adopted to be welded on same substrate 1, realize permanent integration.The method assembling is firmly compact, efficiency simple to operate is high, the microlaser of the method assembling is more solid and reliable and stable than traditional gluing technique, can realize more high-power output when constancy of volume, the raising of this assembly method to the reliability of miniature solid state laser is significant.
Method for packing as above, when described substrate 1 is provided with three grooves, for encapsulating in the embodiment of three fixtures, its concrete assembling process is as follows:
S101: fill soldering tin material in groove, its fusing point of soldering tin material of filling in described first groove is 250 °, and the soldering tin material fusing point of filling in the second groove is 180 °, and the soldering tin material fusing point of filling in the 3rd groove is 80 °.
S102: the first fixture is suspended in above the first groove;
S103: ceramic heating flake energising starts heating, utilizes described thermistor 6 to detect substrate 1 temperature, when substrate 1 temperature reaches soldering tin material fusing point 250 ° in the first groove, ceramic heating flake keeps constant temperature to the fluted interior soldering tin material fusing of institute;
S104: finely tune the first fixture and make it to be fixed in the first groove, cooling ceramic heating flake completes the fixing of the first fixture; Now the temperature of substrate is lower than 250 °, equals greatly 180 °.
The fixing of the second fixture is proceeded after having fixed the first fixture
S205: the second fixture is fixed in the second groove, cooling ceramic heating flake, makes substrate temperature equal greatly 80 ° lower than 180 degree, completes the fixing of the second fixture;
S106: the 3rd fixture is fixed in the 3rd groove, cooling ceramic heating flake, makes substrate temperature lower than 80 °, completes the fixing of the 3rd fixture;
S107: terminate.
The foregoing is only the packaging system of multistage temperature welding and the embodiment of method for packing of a kind of miniature solid state laser of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (8)
1. a packaging system for the multistage temperature welding of miniature solid state laser, is characterized in that: comprise substrate, ceramic heating flake, fixture;
Described fixture comprises optical element and support, and described optical element is fixed on support;
Described ceramic heating flake is close to base lower surface;
Described substrate is fixed on and has refrigerating function and on resistant to elevated temperatures operating platform, substrate is provided with at least one groove, is filled with the different soldering tin material of fusing point in each groove, described in be fixed with optical element support be fixed in groove by soldering tin material;
The sidewall of described substrate is provided with thermistor.
2. the packaging system of the multistage temperature welding of miniature fixed laser according to claim 1, is characterized in that:
The high-temp glue that described optical element adopts fusing point to be greater than 250 ° is fixed on support.
3. the packaging system of the multistage temperature welding of miniature fixed laser according to claim 2, is characterized in that: the sidewall of described substrate is provided with circular hole, installs thermistor in described circular hole.
4. the packaging system of miniature fixed laser multistage temperature welding according to claim 3, is characterized in that: the degree of depth of described groove is 0.5-1mm.
5. the multistage temperature welding packaging system of miniature fixed laser according to claim 4, is characterized in that: the quantity of described groove is 3.
6. the multistage temperature welding packaging system of miniature fixed laser according to claim 5, is characterized in that: the material of described substrate is aluminium, and its surface is coated with layer gold.
7. a multistage temperature welding method for packing for miniature fixed laser, application rights requires the packaging system described in 1 to 6 any one, it is characterized in that comprising the steps:
In each groove of substrate, fill soldering tin material, in N groove, soldering tin material fusing point is greater than N+1 groove weld tin material fusing point, N be equal greatly 1 integer;
One fixture is suspended in above N groove;
Ceramic heating flake starts heating, utilizes thermistor to detect substrate temperature, and when substrate temperature reaches soldering tin material fusing point in N groove, ceramic heating flake keeps constant temperature to the fluted interior soldering tin material fusing of institute;
Fine setting fixture makes it to be fixed in N groove, and cooling ceramic heating flake completes the fixing of fixture, and keeps soldering tin material in N+1 groove to be in melting state; This step that circulates to all fixtures have been fixed.
8. the multistage temperature welding method for packing of miniature fixed laser according to claim 6, is characterized in that:
The soldering tin material fusing point that scolding tin uses the earliest is 250 °, and the fusing point of the second order soldering tin material is 180 °, and the fusing point of the 3rd order soldering tin material is 80 °.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610036464.7A CN105458433B (en) | 2016-01-20 | 2016-01-20 | A kind of packaging system and method for packing of the welding of miniature solid state laser multistage temperature |
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| CN201610036464.7A CN105458433B (en) | 2016-01-20 | 2016-01-20 | A kind of packaging system and method for packing of the welding of miniature solid state laser multistage temperature |
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| CN105458433B CN105458433B (en) | 2017-08-29 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112444098A (en) * | 2020-10-08 | 2021-03-05 | 中山市光大光学仪器有限公司 | Cooling table and rapid cooling method thereof |
| CN113681522A (en) * | 2021-08-23 | 2021-11-23 | 安徽光智科技有限公司 | Method for assembling and fixing optical element |
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| CN102324690A (en) * | 2011-09-29 | 2012-01-18 | 马英俊 | Semiconductor solid laser |
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| CN102543893A (en) * | 2010-12-17 | 2012-07-04 | 株式会社东芝 | Preparation method of semiconductor device |
| CN102922076A (en) * | 2012-11-05 | 2013-02-13 | 大恒新纪元科技股份有限公司 | Lens welding device and welding method for using same |
| CN102950350A (en) * | 2012-10-05 | 2013-03-06 | 中国电子科技集团公司第十研究所 | Process for welding electronic microcomponents based on multi-temperature gradient |
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2016
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| JP2004140141A (en) * | 2002-10-17 | 2004-05-13 | Mitsubishi Electric Corp | Semiconductor laser |
| JP2007294485A (en) * | 2006-04-20 | 2007-11-08 | Toyota Motor Corp | Soldering method and equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112444098A (en) * | 2020-10-08 | 2021-03-05 | 中山市光大光学仪器有限公司 | Cooling table and rapid cooling method thereof |
| CN113681522A (en) * | 2021-08-23 | 2021-11-23 | 安徽光智科技有限公司 | Method for assembling and fixing optical element |
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| CN105458433B (en) | 2017-08-29 |
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