JP2007292537A - Apparatus and method for inspecting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To precisely inspect an electronic component such as a connector or the like by using an anisotropic conductive film having high abilities for elastic deformation and elastic recovery. <P>SOLUTION: An apparatus for inspecting the electronic component includes: the anisotropic conductive film 2 having a conductive section arranging area where conductive hollow sections making up conductive paths in the thickness direction are arranged, and being deformable elastically and compressively in the thickness direction; an inspection-use circuit board 5 which has an electrode 6 corresponding to an electrode 4 of the electronic component 3, and on which the anisotropic conductive film is stacked; a guide section 7 for positioning the electronic component relative to the inspection-use circuit board; and a pressing means 8 for making up a conductive path whose resistance is equal to or less than a prescribed value, between the electrode of the electronic component and the electrode of the inspection-use circuit board, by compressively sandwiching the anisotropic conductive film between the electrodes of the electronic component and the inspection-use circuit board. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component inspection apparatus and inspection method. More particularly, the present invention relates to an inspection apparatus and an inspection method used for inspecting electronic components such as semiconductor products, packages, circuit boards on which these are mounted, and connectors.

  In recent years, the pitch between electrodes of electronic components such as semiconductor products, packages, and circuit boards on which these are mounted has been increasingly narrowed. As a method for conducting an electrical inspection of these products, a method has been proposed in which an inspection contactor is applied to a circuit board for electrical inspection having a pitch corresponding to the electrode of the product to be inspected.

  However, when the pitch of the electrodes of the product to be inspected becomes narrow, it is difficult to bring the electrodes of the electronic component into contact with the electrodes of the circuit board for inspection with high accuracy. In addition, when a conventional contactor for inspection is used, the electrode of the electronic component itself is easily damaged. Similarly, the circuit board for inspection and the electrode of the contactor for inspection are easily damaged, and it is impossible to inspect many products.

  Moreover, in an electronic component having a large number of electrodes, it is difficult to bring these electrodes into contact with the electrodes of the circuit board for inspection with uniform pressure, and it is difficult to ensure inspection accuracy.

  Further, the inspection contactor and the like must be fixedly provided on the inspection circuit board, and the inspection circuit board must be frequently replaced.

  In order to solve the above problem, an inspection apparatus is provided in which an anisotropic conductive film is interposed between the electrode of the circuit board for inspection and the electrode of the electronic component.

JP2004-265844

  A conventional anisotropic conductive film is formed by aligning conductive particles coated with a highly conductive metal in a thickness direction in a film base made of an elastic polymer. In such an anisotropic conductive film made of an elastic polymer, when the amount of compressive deformation in the thickness direction is limited and the dimensional accuracy of the electrode of the electronic component is low, the contact pressure of the electrode against the anisotropic conductive film In some cases, inspection cannot be performed with sufficient accuracy.

  On the other hand, when the dimensional accuracy of the electrodes and the accuracy of the inspection apparatus are low, some of the electrodes are pressed against the anisotropic conductive film with a large force, so that the anisotropic conductive film is easily damaged and its life is also long. Shorter. There is also a problem that the electrodes of the electronic component are easily damaged. In particular, a connector connected to a substrate or the like has a lower accuracy than other electronic components, and it has been difficult to perform an inspection using a conventional anisotropic conductive film.

  The inventors of the present application have developed an anisotropic conductive film that has high elastic deformation ability in the film thickness direction and high elastic recovery ability, and that can conduct in the film thickness direction with a low compressive load ( Patent Document 1).

  This invention makes it a subject to provide the electronic component inspection apparatus and inspection method using the anisotropic conductive film with high elastic deformation ability and elastic recovery ability.

  An electronic component inspection apparatus according to claim 1 of the present application is provided with a conductive portion arrangement region in which hollow conductive portions that are conductive in the thickness direction are arranged, and an anisotropic conductive film that is elastically compressible and deformable in the thickness direction. And an inspection circuit board provided with electrodes corresponding to the electrodes of the electronic component and on which the anisotropic conductive film is laminated, a guide portion for positioning the electronic component with respect to the inspection circuit board, and the anisotropy A pressing means is provided that presses the conductive film between the electronic component and the electrode of the inspection circuit board to electrically connect the electrode of the electronic component and the electrode of the inspection circuit board.

  The present invention constitutes an electronic component inspection apparatus using an anisotropic conductive film having a high elastic compressive deformability.

  As described in Patent Document 1, the anisotropic conductive film applied to the invention of the present application has not only the base film but also the conductive part having elasticity and elastic recovery force, and the electronic component and the circuit board for inspection Can be elastically deformed between the two.

  As the anisotropic conductive film, the one formed from a porous fluororesin that is elastically compressible and recoverable up to about a quarter of its thickness is adopted as in the invention described in claim 5. preferable. Moreover, in order to ensure the said deformability, it is preferable to form using a porous resin film with a porosity of 20% to 80%.

  In the present invention, since the electronic component is inspected by pushing the anisotropic conductive film until the anisotropic conductive film is largely compressed and deformed, even when the dimensional accuracy and shape accuracy of the electrode of the electronic component are low, the inspection circuit board and the electronic component are not inspected. It is possible to ensure reliable conduction. Further, accuracy is not required for the pressing means or the like, and the apparatus can be simplified.

  The form of the guide part is not particularly limited as long as the electrode of the electronic component and the electrode of the circuit board for inspection can be clamped while positioning the electrode through the anisotropic conductive film. For example, a bank-shaped guide part surrounding the side part of the electronic component can be formed.

  The pressing means may be various methods as long as the anisotropic conductive film is sandwiched and compressed and deformed so that the electrode of the electronic component and the electrode of the circuit board for inspection are conducted with a predetermined resistance value or less. Can be used. The amount of compressive deformation of the anisotropic conductive film can be set according to the accuracy of the electronic component to be inspected.

  As in the invention described in claim 2, the pressing means can be configured to include a control mechanism that compresses and deforms the anisotropic conductive film so as to have a predetermined resistance value or less.

  As in the invention described in claim 3, the control mechanism can be configured as a pressure control mechanism for controlling the compression pressure acting on the anisotropic conductive film. For example, as the pressure control mechanism, it is possible to employ a spring means, a pneumatic means or the like that can apply a constant pressure corresponding to the electronic component.

  Further, as in the invention described in claim 4, the control mechanism can be configured as a compression amount control mechanism for controlling the amount of compressive deformation of the anisotropic conductive film. For example, the compression amount control mechanism can be configured by providing a stopper or the like that restricts the stroke of the indenter.

  In this invention, since an anisotropic conductive film can be greatly compressed and deformed and inspected, the setting range of the pressing stroke at the time of inspection can be set large. For this reason, it becomes possible to comprise a pressing means on the basis of the amount of compressive deformation of the anisotropic conductive film. In other words, it is possible to set the amount of compression of the anisotropic conductive film in accordance with the accuracy of the electronic component to be inspected, and to perform the inspection without controlling the pressure in the pressing means. Thereby, it is not necessary to manage the accuracy of the working pressure of the pressing means, and the apparatus can be simplified. Also, a manual inspection device can be easily configured.

  The pitch of the conductive portions of the anisotropic conductive film is sufficiently smaller than the electrode pitch of the electronic component or the circuit board for inspection. Therefore, basically, positioning accuracy with respect to the anisotropic conductive film is not required, but when the amount of compressive deformation in the inspection is large, a film holding means for securely holding the anisotropic conductive film is provided on the inspection circuit board. Is preferred. According to a sixth aspect of the present invention, the anisotropic conductive film includes a film fixing means for fixing the anisotropic conductive film to a predetermined position of the circuit board for inspection. The film fixing means is preferably configured such that the anisotropic conductive film can be replaced. The configuration of the film fixing means is not limited, and can be set according to the form of the target electronic component.

  For example, as in the invention described in claim 7, the film fixing means is provided with an extending portion outside the conducting portion arrangement region of the anisotropic conductive film, and the extending portion is used for the inspection. It can be configured so as to be sandwiched between the circuit board and the guide portion.

  By adopting the above configuration, it becomes possible to securely hold the anisotropic conductive film on the inspection circuit board, and even if a large number of electronic components having low dimensional accuracy are repeatedly pressed, the anisotropic conductive film is different on the inspection circuit board. The isotropic conductive film is not displaced or lifted.

  When the electronic component to be inspected is small, it is troublesome to replace the anisotropic conductive film. In addition, if the relative position of the guide portion and the circuit board for inspection is shifted, highly accurate inspection cannot be performed. In such a case, as in the invention described in claim 8, the film fixing means is provided with an attachment portion outside the conductive portion arrangement region of the anisotropic conductive film, and the inspection circuit board or The guide portion may be provided with a fastening portion capable of fastening the mounting portion.

  By providing the attachment portion on the anisotropic conductive film, the anisotropic conductive film can be easily attached to and detached from the inspection apparatus. In particular, the exchange workability of the anisotropic conductive film in the case of inspecting a small electronic component is improved.

  An anisotropic conductive film having a conducting portion arrangement region in which hollow conducting portions that are elastically compressible and conductive in the thickness direction are arranged and arranged and held on the testing circuit substrate. And a guide portion that can position the electronic component such that the electrode of the electronic component corresponds to the electrode of the circuit board for inspection.

  By employ | adopting the said structure, the circuit board for a test | inspection which has a guide part and an anisotropic conductive film can be replaced | exchanged corresponding to an electronic component. Therefore, it can be configured to inspect various electronic components with one inspection apparatus.

  The inspection circuit board and the guide part are preferably formed integrally to ensure accuracy. On the other hand, it is preferable that the anisotropic conductive film is detachably held on the inspection circuit board or the guide part so that it can be easily replaced.

  According to the ninth aspect of the present invention, an anisotropic conductive film capable of elastic compression deformation is laminated on an inspection circuit board having an inspection electrode corresponding to an electronic component, and the electrode of the electronic component is formed on the anisotropic conductive film. A method for inspecting an electronic component in which the electronic component is in contact with the electronic component, wherein the electronic component is positioned and held with respect to the circuit board for inspection, and the anisotropic conductive film is connected to the electronic component and the circuit board for inspection. And inspecting by compressing and deforming between the two.

  In the invention described in claim 10 of the present application, the electric resistance of the anisotropic conductive film between the electrode of the electronic component and the electrode of the circuit board for inspection is less than a predetermined value. Inspection is performed by compressively deforming an anisotropic conductive film.

  In order to manage the amount of compression of the anisotropic conductive film, the anisotropic conductive film can be compressed by controlling the compression pressure as in the invention described in claim 11.

  Moreover, like the invention described in claim 12, the amount of compression can be controlled to compress the anisotropic conductive film.

  The amount of compressive deformation of the anisotropic conductive film is configured to inspect by performing compressive deformation between 20 μm and about ¼ of the film thickness, as in the invention described in claim 13. preferable.

  For example, when an anisotropic conductive film having a thickness of 600 μm is adopted, the pressing amount of the electronic component is set between 20 μm and 150 μm, that is, until the anisotropic conductive film is compressed to a thickness of 450 μm. It becomes possible to do. Therefore, it is possible to inspect electronic parts with low dimensional accuracy of the electrodes with high accuracy. In addition, it is possible to deal with an electronic component having a large unevenness of electrodes such as a connector.

  When the amount of compressive deformation is 20 μm or less, the electrical resistance value of the anisotropic conductive film itself and the contact resistance value with respect to the electrode increase. On the other hand, if the film is compressed and deformed by about a quarter or more of the film thickness, the elastic recovery force may be reduced or the film may be damaged. Therefore, the amount of compression is preferably controlled within the above range.

  In the electronic component inspection apparatus according to the present invention, the electronic component can be inspected by pushing it in until the anisotropic conductive film is largely compressed and deformed. For this reason, even when the accuracy of the electronic component and the accuracy of the inspection apparatus are low, the inspection can be performed in a state where an equal force is applied to these electrodes. Therefore, highly accurate inspection can be performed without damaging the electronic component.

Moreover, since the deformability of an anisotropic conductive film is large, when an electronic component is pressed, a big force does not act on a part of film. For this reason, the durability of the film is also increased, and many electronic components can be inspected.

  1 to 4 show a first embodiment of an electronic component inspection apparatus according to the present invention.

  FIG. 1 is a schematic sectional view of an inspection apparatus according to the first embodiment. In this embodiment, the present invention is applied to an inspection device 1 for a connector.

  The inspection apparatus 1 includes an anisotropic conductive film 2 that can be elastically compressed and deformed in the thickness direction, and an electrode 6 corresponding to the electrode 4 of the connector 3, and an inspection circuit board on which the anisotropic conductive film 2 is laminated. 5, a guide portion 7 that positions the connector 3 with respect to the inspection circuit board 5, and a pressing means 8 that presses the connector 3 against the anisotropic conductive film 2.

  As shown in FIG. 8, the anisotropic conductive film 2 has a plurality of through holes 10 penetrating from the front surface to the back surface at a plurality of locations of the insulating porous resin film 9. A conductive portion 12 having conductivity in the thickness direction is formed by attaching a conductive metal 11 to the surrounding porous resin. The conduction part arrangement region 13 in which the conduction parts 12 are arranged is provided corresponding to the electrodes of the electronic component.

  The anisotropic conductive film 2 can be formed using, for example, a polytetrafluoroethylene film (porous PTFE film) having a porosity of 20 to 80% as a base film. Since the base material is porous and the PTFE resin around the inner wall has a structure having a large number of the above-described through holes 10, the elastic deformation ability and the recovery ability are very high. In particular, in the present embodiment, the anisotropic conductive film 2 employs a material that can be elastically deformed and recovered up to about a quarter of its thickness. For example, when an anisotropic conductive film having a thickness of about 600 μm is employed, the inspection can be performed by compressing the film until the thickness of the film reaches 450 μm. In order to perform reliable contact, it is preferable to perform an inspection by compressing and deforming the anisotropic conductive film by 20 μm or more. By adopting the anisotropic conductive film 2, even if there is a variation in the height of the electrode of the electronic component, it becomes possible to absorb this variation by deformation in the thickness direction of the anisotropic conductive film 2. Therefore, it is possible to perform a highly accurate inspection.

  The inspection circuit board 5 is made of a known board material, and includes an electrode 6 corresponding to the electrode of the connector 3 to be measured. When the pitch of the electrodes 4 of the connector 3 is small, the inspection circuit board 6 can be composed of a multilayer board, and the pitch can be changed and connected to a lead wire L connected to an inspection device (not shown).

  In the present embodiment, a guide portion 7 is provided in order to position the electrode 4 of the connector 3 at a portion corresponding to the electrode 6 of the inspection circuit board 5.

  As shown in FIGS. 3 and 4, the guide portion 7 is made of a plate-like resin material provided with guide holes 14 corresponding to the side shape of the connector 3. The inspection circuit board 5 and the guide portion 7 are positioned and laminated with high accuracy by guide pins 15 provided at four corners. When the connector 3 is fitted in the guide hole 14, the electrode 4 of the connector 3 is positioned at a position corresponding to the electrode 6 of the inspection circuit board 5.

  In the present embodiment, an extending portion 16 provided outside the conductive portion arrangement region 13 of the anisotropic conductive film 2 is held between the test circuit board 5 and the guide portion 7 by holding pressure. Has been. The anisotropic conductive film 2 does not require assembly accuracy with respect to the apparatus, but the conductive film arrangement region 13 may be displaced from the electrode formation site or the test circuit board 5 electrode 6 when repeatedly inspecting. Can be prevented from floating up.

  The connector 3 is pressed toward the anisotropic conductive film 2 by the pressing means 8. In this example, the electronic component can be pressed toward the inspection circuit board 5 with a constant pressure by pressing means using a compression spring.

  As shown in FIG. 2, the pressing means 17 includes a base portion 18 that is fixedly provided at an upper end portion of the guide pin 15, and a sliding member that is slidably held along the guide pin 15. 19, the pressing member 20 provided on the lower surface of the sliding member 19, and the base portion 18 and the sliding member 19. The sliding member 19 is elastically biased downward. A compression coil spring 17 and an operation part 21 extending from the upper part of the sliding member 19 through the base member 18 are provided.

  FIG. 1 shows a state in which the operation unit 21 is pulled upward against the elasticity of the compression coil spring 17. By pulling up the operation portion 21, a space in which the connector 3 can be inserted is provided between the sliding member 19 and the guide portion 7, and the connector 3 is fitted into the guide hole 14.

  Thereafter, when the operation portion 21 is released, the sliding member 19 is lowered by the elasticity of the spring 17, and a certain pressing force is applied to the upper surface of the connector 3 via the pressing element 20. As a result, the electrode 4 of the connector 3 is pushed into the anisotropic conductive film 2, and conduction with the electrode 6 of the circuit board 5 for inspection is ensured for inspection.

  By using the elasticity of the spring 17, it is possible to perform an inspection by applying a constant pressing force to the connector. This makes it possible to perform a highly accurate inspection.

  5 to 7 show a second embodiment.

  FIG. 5 is a schematic view of a second embodiment of the inspection apparatus according to the present invention, and is a cross-sectional view corresponding to FIG.

  In the inspection apparatus 201 according to this embodiment, guide portions 207 having guide holes 214 corresponding to the shape of the connector 203 are positioned by guide pins 215 provided at the four corners and directly stacked on the inspection circuit board 205. Yes. On the other hand, as shown in FIG. 7, the guide portion 207 is formed with a film fastening portion 231 that opens to one side of the guide hole 207.

  The anisotropic conductive film 202 in this embodiment is formed in a T-shape including a conductive portion arrangement region 232 that is fitted and held in the guide hole 214 and an extension portion 233 that is held in the film fixing portion 231. Has been. The extension part 233 is clamped and fixed between the test circuit board and a holding member fitted and fixed to the fixing part 231.

  By adopting the above configuration, it is not necessary to remove the guide portion 207 when exchanging the anisotropic conductive film. For this reason, there is no possibility that the accuracy of the inspection apparatus is lowered. In addition, the anisotropic conductive film and the guide part can be integrally formed by adhesion or the like.

  The pressing means 208 according to the second embodiment includes a base portion 218 that is fixedly provided at the upper end portion of the guide pin 215 and a sliding member 219 that is slidably held along the guide pin 215. The pressing member 220 held on the lower surface of the sliding member 219, the operation part 221 extended through the base member 218 from the upper part of the sliding member 219, and the sliding member 219 And a regulating member 222 that regulates downward sliding and regulates the amount of compressive deformation of the anisotropic conductive film.

  As in the first embodiment, the operating portion 221 is pulled upward to move the sliding member 219 upward to provide an insertion space for the connector 3. On the other hand, a spring for applying a pressing force as in the first embodiment is not provided.

  In this embodiment, the anisotropic conductive film 202 is configured to be inspected with a constant compression amount. In order to make the amount of compressive deformation of the anisotropic conductive film 202 constant, the restriction member 222 is provided. The restricting member 222 extends from the upper surface of the guide portion 207 to a predetermined height along the guide pin 215. The height of the regulating member 222 is set so that the electrode of the connector 203 bites into the anisotropic conductive film 202 by a predetermined depth. Thereby, it becomes possible to perform an inspection in a state where the anisotropic conductive film 202 is compressed and deformed by a certain amount.

  By adopting the above configuration, it is not necessary to control the force pressing the connector 203. That is, even if the operation unit 221 is manually pushed down, it is possible to inspect the anisotropic conductive film 202 by compressing and deforming the anisotropic conductive film 202 by a certain amount. As a result, it is not necessary to control the compression force, and not only various pressure generating means can be adopted, but also the apparatus configuration is simplified and automation can be easily performed. It is also possible to perform a highly accurate inspection manually.

  The present invention is not limited to the above-described embodiment. In the embodiment, the present invention is applied to the connector, but can be applied to other electronic components such as a semiconductor device.

  The electronic component inspection apparatus and electronic component inspection method according to the present invention can be used for inspection of electronic components such as semiconductor products, packages, circuit boards on which these are mounted, and connectors.

It is a figure which shows 1st Example of this invention, and is sectional drawing which shows the state before mounting | wearing an inspection apparatus with an electronic component (connector). It is sectional drawing which shows the state which is inspecting a connector with the inspection apparatus of FIG. It is a disassembled perspective view of the principal part of the inspection apparatus shown in FIG. It is a perspective view which shows the form of the guide part of the inspection apparatus shown in FIG. It is a figure which shows 2nd Embodiment of this invention, and is sectional drawing equivalent to FIG. It is sectional drawing which shows the state which is inspecting a connector with the inspection apparatus of FIG. It is a perspective view which shows the form of the guide part of the inspection apparatus shown in FIG. 5, and a control means. It is a figure which shows schematic structure of the anisotropic conductive film which concerns on this invention.

Explanation of symbols

2 Anisotropic Conductive Film 3 Electronic Component 4 Electronic Component Electrode 5 Inspection Circuit Board 6
6 Electrode of circuit board for inspection 7 Guide part 8 Pressing means

Claims (13)

An anisotropic conductive film capable of elastically compressive deformation in the thickness direction, including a conductive portion arrangement region in which hollow conductive portions that are conductive over the thickness direction are arranged.
A circuit board for inspection provided with electrodes corresponding to the electrodes of the electronic component and on which the anisotropic conductive film is laminated;
A guide portion for positioning the electronic component with respect to the inspection circuit board;
An electronic device comprising: pressing means for sandwiching the anisotropic conductive film between the electronic component and the electrode of the inspection circuit board, and electrically connecting the electrode of the electronic component and the electrode of the inspection circuit board; Parts inspection device.   The electronic component inspection apparatus according to claim 1, wherein the pressing unit includes a control mechanism that compresses and deforms the anisotropic conductive film so as to have a predetermined resistance value or less.   The electronic component inspection apparatus according to claim 2, wherein the control mechanism is a pressure control mechanism that controls a compression pressure acting on the anisotropic conductive film.   The electronic component inspection apparatus according to claim 2, wherein the control mechanism is a compression amount control mechanism that controls a compression deformation amount of the anisotropic conductive film.   5. The electronic component according to claim 1, wherein the anisotropic conductive film is formed of a porous fluororesin that can be elastically deformed and recoverable up to about a quarter of its thickness. Inspection device.   The electronic component inspection apparatus according to claim 1, further comprising a film fixing unit that fixes the anisotropic conductive film to a predetermined position of the circuit board for inspection. The film fixing means is
While providing an extension part outside the conductive part arrangement region of the anisotropic conductive film,
The electronic component inspection apparatus according to claim 6, wherein the extension portion is configured to be sandwiched between the inspection circuit board and the guide portion. The film fixing means is
While providing an attachment portion outside the conductive portion arrangement region of the anisotropic conductive film,
The electronic component inspection apparatus according to claim 6, wherein a fastening portion capable of fastening the attachment portion is provided on the inspection circuit board or the guide portion. An electronic component that is inspected by laminating an anisotropic conductive film that can be elastically compressed and deformed on a circuit board for inspection that includes an inspection electrode corresponding to the electronic component, and contacting the electrode of the electronic component with the anisotropic conductive film The inspection method of
While positioning and holding the electronic component with respect to the circuit board for inspection,
An inspection method for an electronic component, wherein the inspection is performed by compressing and deforming the anisotropic conductive film between the electronic component and the circuit board for inspection.   Inspection is performed by compressing and deforming the anisotropic conductive film so that the electric resistance of the anisotropic conductive film between the electrode of the electronic component and the electrode of the circuit board for inspection becomes a predetermined value or less. The method for inspecting an electronic component according to claim 9.   The electronic component inspection method according to claim 10, wherein the anisotropic conductive film is compressed by controlling a compression pressure.   The electronic component inspection method according to claim 10, wherein the anisotropic conductive film is compressed by controlling a compression amount.   The method for inspecting an electronic component according to any one of claims 9 to 12, wherein the inspection is performed by compressing and deforming the anisotropic conductive film between 20 µm and about ¼ of the film thickness.

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