JP2007283715A - Apparatus for injection compression molding of resin board, and method for producing the resin board integrated with component by using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin-board injection compression-molding apparatus for integrally molding a hook part to connect to the resin portion of an inner face of an automobile window material to solve such problems as the wraparound failure of resin feed in the window material and the occurrence of a weld mark or air reservoir in a groove portion or the like. <P>SOLUTION: The resin-board injection compression-molding apparatus is provided with: a runner 5 and a hot runner 4 disposed from the center over the nearly end of a fixed die 1 to inject a molten resin into a cavity comprising the fixed die 1 and a movable die 2 while heating and keeping warm; a sliding weir 3 positioned at nearly end of either fixed or movable die; and a movable piece for integrally molding the component forming an undercut part. The occurrence of wraparound failure (molding sink) of resin feed into a hook part or air reservation can be prevented by instantaneously varying the volume of the cavity or core forming the hook part before and after the molten resin passes therethrough. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention manufactures a resin plate injection compression molding apparatus capable of integrally molding a resin portion of an automobile window material and a hook portion connected thereto, and a resin plate integrated with a component using the device. Regarding the method.

  Currently, tempered glass made of laminated glass or one glass plate bonded with an interlayer adhesive of polyvinyl butyral (hereinafter referred to as PVB) is used for window glass for automobiles. Further, many types of window materials using a resin sheet are known. For example, in Japanese Patent Application Laid-Open No. 2005-35336, a transparent glass plate and a transparent resin molded body are bonded to the entire surface of a concave portion of the transparent resin molded body. An automobile window material is disclosed which is integrated and has a structure in which at least a part of the peripheral portion of the transparent resin molded body extends so as to wrap around the side surface or the upper surface of the concave portion.

  On the other hand, as a method for installing a room mirror by bonding to a windshield, as disclosed in Japanese Patent Application Laid-Open No. 07-215131, there is a method of attaching a hook portion for fixing a mirror by heating and curing a liquid silicone rubber adhesive. It is done. Alternatively, as disclosed in Japanese Patent Laid-Open No. 2002-321563, a method of attaching an electrode to each of a hook portion and a windshield sandwiching an adhesive and applying a high frequency voltage between both electrodes to subject the adhesive to high frequency dielectric heating Is mentioned.

JP 2005-35336 A Japanese Unexamined Patent Publication No. 07-215131 JP 2002-321563 A

  However, in Japanese Patent Application Laid-Open No. 07-215131, the liquid silicone rubber adhesive is heated and cured when attaching the hook portion for fixing the mirror. Alternatively, in Japanese Patent Laid-Open No. 2002-321563, an electrode is attached to each of a hook portion and a windshield sandwiching an adhesive, and a high frequency voltage is applied between both electrodes to heat the adhesive by high frequency dielectric heating. Yes. In these methods, a heating step must be performed when retrofitting the hook portion. For this purpose, the method using a laminated glass in which a transparent glass plate and a transparent resin molded body are bonded with an interlayer adhesive, or the method of attaching a hook portion to a transparent resin plate portion molded only with a resin material, is attached to the adhesive portion. There is a problem of deformation due to softening of the resin, and a problem that foaming of the intermediate film (PVB or the like) occurs in the heating portion. Further, the window portion of the latter front inner surface resinized portion also has a problem in the heat input process at the time of post-bonding as in the former case.

  It is conceivable to adopt a bonding method using room temperature curable adhesive for such problems, but the room temperature curable type has a different curing speed depending on the environmental temperature and humidity, and in some cases it takes several days to ship from the manufacturing site. Therefore, there is a problem in the assembly tact to the production vehicle.

  On the other hand, a method of fixing the rear-mirror connecting component to a structure disposed around the window glass for automobiles, for example, a column (A pillar) or a front roof rail is conceivable. However, these methods also have a problem that the field of view is partially blocked by the left and right ends of the windshield and the columns (A pillars) at the upper end and the front roof rail when looking forward from the outside of the vehicle occupant.

  Furthermore, in order to form a hook part etc. in a part of the window glass for automobiles, when performing general hot press molding using a mold having a partially recessed structure, blow molding, injection molding or injection When compression molding is carried out, there is a problem that welds or air accumulations in the groove portions occur because the resin wrap-around failure tends to occur in the groove portions that form the concave structure.

  The present invention has been made in view of such circumstances, and by integrally molding components such as a hook portion connected to a resin portion on the inner surface of an automotive window material molded with glass and resin or resin, An object of the present invention is to provide a resin molding apparatus capable of producing an automotive window glass at a low cost by eliminating the heat input process at the time of post-bonding, and a method for producing a resin plate using the apparatus.

  As a result of intensive studies to achieve the above-mentioned problems, the present inventors have a fixed mold and a movable mold provided so as to face each other, and the fixed mold is arranged from the central portion to the substantially end portion. A slide having a liner portion and a hot runner portion for injecting the molten resin into the cavity of the fixed mold and the movable mold while heating and maintaining the temperature, and one of the fixed mold and the movable mold is a slide positioned substantially at the end. In an injection compression molding apparatus for a resin plate comprising a weir part and a movable sesame for integrally molding a part constituted by an undercut part on one side of a molded product, after contacting the movable mold to the slide weir part, When an injection compression molding method is performed in which a required amount of molten resin is injected and molded by stopping in a desired space, the hook portion is inserted before and after the molten resin passes through the core or cavity portion constituting the hook portion or the like. By providing the mold with a function for instantaneously changing the volume of the core or cavity portion to be formed, resin wraparound failure (sink) to the core or cavity portion forming the hook portion, or welding or air accumulation The present inventors have found that the above-mentioned problem with respect to occurrence is solved, and have completed the present invention.

  That is, the present application provides the following invention as an injection compression molding apparatus having a mold mechanism for integrally molding a part such as a hook part connected to a resin part on the inner surface of an automobile window material and a method for producing the resin plate. .

  According to the first aspect of the present invention, the fixed mold and the movable mold are provided so as to be opposed to each other, and the fixed mold is heated and kept warm while the molten resin disposed from the central portion to the substantially end portion is heated and kept warm. A liner part and a hot runner part that are injected into the cavity of the fixed mold and the movable mold are provided, and one of the fixed mold and the movable mold is positioned on one side of the molded product, and a slide weir part positioned substantially at the end. Provided is an injection compression molding apparatus for a resin plate, comprising a movable sesame for integrally molding a part formed by an undercut portion.

  According to a second aspect of the present invention, the injection compression molding apparatus includes a movable sesame mechanism component for moving the movable sesame, and the movable sesame mechanism component is configured to move the movable sesame and the movable sesame. A resin comprising: a cylinder, an undercut collar inserted at a position located on the surface of any one of the fixed mold and the movable mold, and an undercut portion constituting a part of the molded product An injection compression molding apparatus for a plate is provided.

  According to a third aspect of the present invention, there is provided a resin plate injection compression molding apparatus comprising at least one of a temperature sensor and a pressure sensor at an end of the movable sesame.

  According to invention of Claim 4, it is a method of manufacturing the resin board integrated with components using the injection compression molding apparatus of any one of Claims 1-3, Comprising: An undercut collar is disposed in an undercut portion constituting a part, and the slide weir portion is narrowed while the movable mold is clamped to inject a necessary amount of molten resin into the cavity. A resin plate integrated with a component, wherein the component is integrally formed with the resin plate while the molten resin passes through the upper part of the movable sesame or while filling of the molten resin into the cavity is completed. A method of manufacturing is provided.

  According to invention of Claim 5, it is a method of manufacturing the resin board integrated with components using the injection compression molding apparatus of any one of Claims 1-3, Comprising: An undercut collar is arranged in the undercut part constituting the part, and the slide dam part is narrowed while the movable mold is clamped in a state where the movable sesame is moved backward to define a space for molding the part. The required amount of molten resin is injected into the cavity and the space is filled with the molten resin to complete the resin filling into the cavity while the movable sesame is moved forward. There is provided a method of manufacturing a resin plate integrated with a component, wherein the resin is integrally molded with the resin plate by pressurizing the resin in two stages.

  According to a sixth aspect of the present invention, the movement of the movable sesame is automatically controlled to move forward and backward by a signal from a sensor installed at the end of the movable sesame that contacts the molten resin. The method of manufacturing the resin board integrated with the components of claim | item 4 or 5 is provided.

  According to a seventh aspect of the present invention, there is provided a method for producing a resin plate integrated with a component according to the fourth or fifth aspect, wherein the sensor is at least one of a temperature sensor and a pressure sensor.

  According to the present invention, it is possible to integrally mold components such as a hook portion connected to a resin portion on the inner surface of an automobile window material. Molded products molded using the molding apparatus and molding method of the present invention eliminate the failure of the molten resin to wrap around the hook (groove having a recess), and prevent the occurrence of sink marks, welds, or air accumulation in the groove. We were able to. Furthermore, since the heat input process during post-bonding of fastening parts is not required, deformation due to softening of the laminated glass part or resin plate part due to heat input and foaming of the intermediate film (PVB, etc.) are eliminated, and the yield of the parts is eliminated. As a result, automobile window materials can be manufactured at low cost.

  Hereinafter, the molding apparatus and the manufacturing method of the window material for automobiles integrated with a component fixing portion according to the present invention will be described in more detail. Here, the molding process of the automotive window material with a component fixing part according to the present invention will be described with reference to FIGS. 1 to 8 as an embodiment, and a hook section of a molded product and an outline of mounting a rearview mirror will be described as an embodiment. This will be described with reference to FIGS.

  1 is a mold structure, FIG. 2 is a structure of a movable sesame mechanism, FIG. 3 is a molten resin injection process at the start of molding, FIG. 4 is a compression molding process of molten resin, and FIG. FIG. 6 shows the process of forming the hook part, FIG. 6 shows the process of forming the hook part by moving the movable sesame, FIG. 7 shows the process of completing the molding of the part fixing part-integrated automobile window material, and FIG. FIG. 9 shows a cross section of the hook portion when the undercut collar is removed, and FIG.

  As shown in FIG. 1, a mold for injection compression molding such a component fixing part-integrated automobile window material includes a fixed mold 1 and a movable mold 2 provided so as to face each other, and the fixed mold 1 includes: A slide weir portion 3 positioned at a substantially end portion, and a runner portion 5 for injecting the molten resin into the space portion of the fixed mold 1 and the movable mold 2 while heating and keeping the molten resin disposed at the substantially end portion from the center portion; A hot runner portion 4 is provided, and a movable sesame mechanism component 6 is provided at a position of an automobile window portion to which a rearview mirror is attached. The movable mold 2 may include a slide weir portion 3 and a movable sesame mechanism component 6. Examples of the mold material include SCM mold material, S mold material, and PX mold material. The runner portion 5 is provided with a valve gate.

  Next, as shown in FIG. 2, the movable sesame mechanism component 6 has an undercut collar 10 inserted in advance at a position located on the surface of the molded product of the fixed mold 1 and removes the undercut collar 10 after molding. The undercut portion 11 constituting the fixed part is formed. As will be described later, since the undercut portion is filled with resin to form a component such as a hook, a molded product of a resin plate integrated with the component can be obtained according to the present invention.

  Furthermore, a sensor 8 for detecting the timing when the molten resin passes through the surface of the movable sesame 7 is provided on the surface of the molded product of the movable sesame 7, and the movable sesame 7 is undercut by the cylinder 9 based on a signal from the sensor 8. It is a mechanism that retreats to the deepest part of the part 11. The drive system of the movable sesame 7 part is not particularly limited, and examples thereof include a hydraulic type, an electric type, an air type, a spring type, or a system incorporated in an ejector mechanism incorporated in an injection compression molding apparatus. However, it is preferable to use a hydraulic type because it requires a pressure drive that is equal to or higher than the pressure applied during injection compression molding. Furthermore, the pressurization drive of the movable sesame 7 can control the pressurization time, pressure, pressurization start timing, and the like. Next, as the type of the sensor 8, either one or both of temperature and pressure can be used, but is not limited thereto.

  Next, in the molten resin injection process at the start of molding, as shown in FIG. 3, the slide weir 3 is tightly pressed while the movable mold 2 is clamped to maintain a desired cavity 12 space, and then the molten resin 13 is moved into a certain amount of cavity. 12 shows a state where filling is completed. In this process, the molten resin 13 contact surface of the movable sesame 7 is set so as to be smooth at a position located on the surface of the molded product of the fixed mold 1.

  Next, in the compression molding process of the molten resin, as shown in FIG. 4, the slide weir 3 is tightly pressed while the movable mold 2 is clamped before and after filling the cavity 12 with a certain amount of the molten resin 13. A process in which the molten resin 13 is filled and the molten resin 13 passes through the surface of the movable sesame 7 is shown. In order to prevent the molten resin 13 from returning to the runner, the mold clamping of the movable mold 2 is preferably started when the valve gate of the runner 5 is closed.

  Next, the process of forming the hook portion by retracting the movable sesame is shown in FIG. In FIG. 5A, the molten resin 13 contact surface of the movable sesame 7 is set so as to be smooth at a location located on the surface of the molded product of the fixed mold 1.

  Next, FIG. 5 (2) shows the stage where the molten resin 13 has come into contact with the surface of the movable sesame 7, and is an enlarged view of the movable sesame mechanism component 6 portion of FIG. Next, in FIG. 5 (3), in the process in which the molten resin 13 in FIG. The state in which the molten resin 13 is filled is shown.

  On the other hand, as a method for forming the hook portion 14, the molten resin 13 is filled into the cavity 12 with the movable sesame 7 retracted in advance as shown in FIG. While the movable mold 2 is clamped, the slide weir 3 is narrowed to fill the cavity 12 with the molten resin 13, and the molten resin 13 is filled from the state in which the undercut portion 11 constituting the hook portion 14 is filled with the molten resin 13. Even in a method in which the movable sesame 7 is moved forward to cool and solidify and the hook portion 14 is compressed into the space of the cavity 12, the movable sesame 7 can be molded although there is a difference in the arrangement.

  However, in the method of FIG. 6, sink marks 16 are likely to occur on the surface of the hook portion 14 on the movable side 2 as shown in FIG. 6 (2), or air pools 15 are likely to occur in the undercut portion 11. Therefore, in order to eliminate the air reservoir 15 and sink 16, it is necessary to apply two-stage pressurization simultaneously with the process of pressurizing the molten resin in the cavity, or pressurize after pressurizing. Since the operating condition width of the movable sesame 7 for eliminating the sink 16 and the air reservoir 15 is narrowed, it is preferable to use the mechanism of FIG. 5 rather than FIG.

  Next, in the process of completing the molding of the component fixing part-integrated automobile window material, as shown in FIG. 7, the molten resin 13 is filled into the cavity 12 and solidified by cooling, and the molded product 17 is molded.

  Next, FIG. 8 shows a state in which the molded product 17 of the part fixing part-integrated automobile window material is taken out from the mold.

  Next, FIG. 9 shows a state where the undercut collar 10 is removed from the molded product 17. The undercut shape may be a structure that can be easily removed from the molded product 17, and a metal or a non-metal that is not deformed or melted by the molten resin 13 may be used.

  Next, the state which attached the hook part 14 integrally molded to the molded article 17 as a connection part in FIG. 10 was shown. FIG. 10 (1) shows the case of a normal front window, and FIG. 10 (2) shows the case of a front window in which the transparent part is wrapped up to the ceiling. In any case, the manufacturing apparatus of the present invention and According to the molding method, the resin plate can be integrally molded.

  Here, the molded object which can be shape | molded with the above-mentioned shaping | molding die is demonstrated. As a raw material resin for forming such a molded product, that is, a resin to be a molded product, any thermoplastic resin that softens when heated can be applied. For example, a general transparent or translucent material such as polystyrene, polycarbonate, acrylonitrile, etc. There are certain thermoplastic resins, polymer alloys that maintain transparency or translucency, and the like as used in the present invention includes all of them.

  In addition, such transparent or translucent thermoplastic resins include various fillers such as talc and glass fiber, or fine particles on the order of several tens of nm which are much smaller than the wavelength of visible light (380 to 770 nm). It may be a nanocomposite material in which materials are blended. Incidentally, clay, talc, silica, etc. are mentioned as a fine particle material. Various commonly used additives such as pigments, lubricants, antistatic agents, and antioxidants may be blended.

EXAMPLES Hereinafter, although an Example and a comparative example demonstrate this invention further in full detail, this invention is not limited by this.
1) Mold Die As shown in FIG. 1, the mold structure is a fixed mold 1 and a movable mold 2 provided so as to face each other. The fixed mold 1 has a slide weir portion 3 at a position to be an outer peripheral portion of the molded product. The runner part 5 and the hot runner part 4 for injecting the molten resin into the space part of the fixed mold 1 and the movable mold 2 while heating and keeping the molten resin arranged at the substantially end part of the slide dam part 3 from the center part. The movable sesame mechanism component 6 shown in FIG. 5 is provided at a portion where the hook portion is formed. Note that PX7 was used as a material for the molding die.

  Next, as shown in FIG. 11, the shape of the molded product was 150 mm × 150 mm × variable plate thickness (A dimension), and was a curved surface of R1000. Next, the hook has an outer dimension of 30 mm x 30 mm x plate thickness 6 mm, and is manufactured to have the cross-sectional shape shown in FIG. 9, and an undercut collar 10 having the same shape as that shown in FIG. did. The shape of the molten resin injection portion is the gate shape shown in FIG.

2) Sensor and movable sesame mechanism component As shown in FIG. 5, the sensor has a structure capable of detecting the temperature and pressure of the molten resin at the tip of the movable sesame. As a sensor type, a Kistler in-mold piezoelectric resin pressure / temperature sensor 6190A0.4 was used, and the temperature change point was used as a trigger. The cylinder part of the movable sesame mechanism part uses a mechanism that is pressurized and held by hydraulic pressure, and a mechanism that exhausts the cylinder part by using a temperature change point as a trigger to retract the movable sesame.

3) Molding of molded product In the steps of FIGS. 1 to 8, the temperature of the fixed mold and the movable mold is set to 110 ° C., and the fixed mold is arranged at the substantially end portion from the slide weir portion and the central portion. The molten resin is poured into the space (cavity) of the fixed mold and the movable mold while heating and keeping warm. The hot runner portion was set near the melting temperature of the polycarbonate resin, and the movable mold was brought into contact with the slide weir portion, then stopped in a desired space, and a required amount of the molten resin was injected to perform compression molding. Next, a Nissei Resin 110t injection molding machine (NF2000-25A) was used as the molding machine. The resin used was a polycarbonate resin (Novalex 7025A (Mitsubishi Engineering Plastics)).

(Example)
Table 1 shows the evaluation results of air accumulation, sink marks, and weld marks on the hook portion of the molded product obtained by varying the compression molding time and the molded product plate thickness in the steps of FIGS.

(Comparative example)
The molded product obtained by molding the movable sesame without moving in the state of FIG. 6 (1) under the same molding conditions as in the example, that is, the hook part of the molded product obtained without two-stage pressurization. Table 1 shows the evaluation results of air accumulation, sink marks, and weld marks.

4) Evaluation of formability <Air accumulation>
The contamination of the air reservoir (including voids) in the hook portion of the molded product was visually observed. When there is no air accumulation, the symbol is indicated as “Good” as “Good”, and when there is air accumulation, “×” is shown in Table 1.
<Sink>
The occurrence of sink marks (16 sites in FIG. 6 (2)) in the hook portion of the molded product was visually observed. When there is no sink mark, the symbol is indicated as “Good”, and when sink mark is generated, “X” is shown in Table 1.
<Weld marks>
The occurrence of welds in the hook part of the molded product was visually observed. When there is no weld, the symbol is shown as “good”, and when weld is generated, “×” is shown in Table 1.
<Comprehensive judgment>
When all the evaluation results of the air accumulation, sink mark, and weld mark of the molded product were good, the symbol was indicated by ○, and when any of them was defective, it was indicated by ×.

  As is apparent from Table 1, the molded product formed by using the molding apparatus and molding method of the component fixing part-integrated automobile window material, which is a preferred embodiment of the present invention, generates air stagnation, sink marks, and weld marks in the hook portion. It can be seen that the appearance quality is excellent, and the moldability is remarkably improved.

  The preferred embodiments and examples of the present invention have been described in detail above. However, the present invention is not limited to these, and various modifications are possible within the scope of the present invention.

  For example, in the present specification, “fixed type” and “movable type” are equivalent to each other, and those in which both are replaced also belong to the invention of the present invention. In addition, when the above molding method is used as an automobile part and a hook is attached to a resin glass part such as a window shield, a side glass, a bag door glass, a sunroof, etc., further, for forming a hook part for attaching a front visor and a room lamp. Is also applicable.

  As described above, according to the present invention, a molded product molded by using a molding apparatus and molding method for a part fixing part-integrated automobile window material is obtained by applying molten resin to a hook part (a groove part having a concave part). The above manufacturing apparatus has a hook portion for integrating the support and connection of automotive parts provided on the inner surface of an automotive window material, which can prevent the occurrence of sink marks, welds, or air accumulation in the groove portion, and eliminates wraparound defects. And could be provided by the manufacturing method. In addition, since the heat input process during post-bonding of fastening parts is not required, deformation due to softening of the laminated glass or resin plate due to heat input and foaming of the intermediate film (PVB, etc.) are eliminated, and the yield of the parts It has become possible to improve and manufacture low-cost automotive window materials.

FIG. 1 is a view showing a mold structure of the present invention. FIG. 2 shows the structure of the movable sesame mechanism. FIG. 3 is a diagram showing a molten resin injection process at the start of molding. 4 is a diagram showing a compression molding process of the molten resin. FIG. 5 is a view showing a process of forming the hook portion by retracting the movable sesame. FIG. 6 is a diagram showing a process of forming the hook portion by moving the movable sesame. FIG. 7 is a diagram showing a process of completing the molding of the component fixing part-integrated automobile window material. FIG. 8 is a view showing a process of taking out the molded product. FIG. 9 is a view showing a cross section of the hook portion when the undercut collar is removed. FIG. 10 is a view showing an outline of attaching the rearview mirror. FIG. 11 is a diagram showing the shape of a molded product in the example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Fixed type 2 Movable type 3 Slide dam part 4 Hot runner 5 Runner 6 Movable sesame mechanism component 7 Movable sesame 8 Sensor (temperature, pressure)
9 Cylinder 10 Undercut collar 11 Undercut part 12 Cavity 13 Molten resin 14 Hook part 15 Air accumulation part 16 Weld and sink part 17 Molded part 18 Front window 19 Lap round window 20 Rearview mirror 21 Mirror fixed hinge 22 Gate

Claims (7)

  A fixed mold and a movable mold provided so as to face each other are provided, and the fixed mold is injected into the cavities of the fixed mold and the movable mold while heating and keeping the molten resin arranged from the central portion to the substantially end portion. A fixed weir and a movable mold, and one of the fixed mold and the movable mold is integrally formed with a slide weir positioned at the substantially end, and a part formed by an undercut on one side of the molded product. An injection compression molding apparatus for a resin plate, comprising: a movable sesame for the purpose.   The injection compression molding apparatus includes a movable sesame mechanism part for moving the movable sesame, and the movable sesame mechanism part includes the movable sesame, the cylinder for moving the movable sesame, the fixed mold, and the movable mold. 2. The injection compression molding apparatus according to claim 1, further comprising an undercut collar inserted at a location located on the surface of any one of the molded products, and an undercut portion constituting a part of the molded product.   The injection compression molding apparatus according to claim 1 or 2, wherein at least one of a temperature sensor and a pressure sensor is provided at an end of the movable sesame.   It is a method of manufacturing the resin board integrated with components using the injection compression molding apparatus of any one of Claims 1-3, Comprising: Undercut in the undercut part which comprises this component of a resin plate molded product While placing the collar, clamping the movable mold and narrowing the slide weir part to inject a required amount of molten resin into the cavity, while the molten resin passes through the undercut collar and the upper part of the movable sesame Alternatively, the method of manufacturing a resin plate integrated with a component, wherein the component is integrally formed with the resin plate while filling of the molten resin into the cavity is completed.   It is a method of manufacturing the resin board integrated with components using the injection compression molding apparatus of any one of Claims 1-3, Comprising: Undercut in the undercut part which comprises this component of a resin plate molded product In a state where a collar is arranged and the movable sesame is moved backward in advance to define a space for molding the part, the slide dam is narrowed while the movable mold is clamped to melt the required amount in the cavity. While the resin is injected and the molten resin is filled into the space for molding the part and the resin filling into the cavity is completed, the movable sesame is advanced to pressurize the resin in the cavity in two stages. A method for producing a resin plate integrated with a component, wherein the component is integrally formed with the resin plate.   6. The operation of the movable sesame is integrated with the component according to claim 4 or 5, wherein the movement of the movable sesame is automatically controlled to move forward and backward by a signal from a sensor installed at an end of the movable sesame in contact with the molten resin. Method for manufacturing a resin plate. 6. The method for producing a resin plate integrated with a component according to claim 4, wherein the sensor is at least one of a temperature sensor and a pressure sensor.

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