JP2007281328A - Photoelectric conversion device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To produce a photoelectric conversion device high in conversion efficiency, performance, and reliability from a large number of crystalline silicon particles on a conductive substrate. <P>SOLUTION: The photoelectric conversion device has a large number of crystalline silicon particles 101 on a conductive substrate 107, where the large number of crystalline silicon particles 101 are connected onto one main surface of the conductive substrate 107, an insulator 109 is between adjacent crystalline silicon particles 101, the crystalline silicon particles 101 are placed with the tops of the crystalline silicon particles 101 exposed from the insulators 109, transparent conductive layers 111 are formed on the crystalline silicon particles 101, and the surface of the crystalline silicon particle 101 is made smooth by a polishing process. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a photoelectric conversion device used for photovoltaic power generation and the like, and particularly to a photoelectric conversion device using crystalline semiconductor particles such as crystalline silicon particles, and a method for manufacturing the same.

  Photoelectric conversion devices such as solar cells capture market needs such as high efficiency in terms of performance such as photoelectric conversion efficiency (hereinafter also referred to as conversion efficiency), consideration of resource finiteness, and low manufacturing costs. Development is underway. As a material for a solar cell, a crystalline silicon substrate is produced by cutting a large single crystal or polycrystal bulk of silicon. However, this method has a problem in terms of resource saving because of many cutting losses. For this reason, there is a photoelectric conversion device using crystalline silicon particles as one of the promising photoelectric conversion devices in the future market in terms of resource saving.

As a raw material for producing crystalline silicon particles, for example, silicon fine particles generated as a result of pulverizing single crystal silicon, high-purity silicon vapor-phase synthesized by a fluidized bed method, or the like is used. In order to produce crystalline silicon particles from these raw materials, the raw materials are separated by size or weight, melted in a container using infrared rays or high frequency, and then freely dropped (for example, Patent Documents 1 and 2). Or a method using high-frequency plasma (see, for example, Patent Document 3).
WO99 / 22048 pamphlet U.S. Pat. No. 4,188,177 JP-A-5-78115

  However, only a photoelectric conversion characteristic of a photoelectric conversion device using crystalline silicon particles is lower than that of a photoelectric conversion device using a crystalline silicon substrate. Therefore, in terms of the total cost (yen / W) of the material cost and manufacturing cost per unit output, the photoelectric conversion device using crystalline silicon particles is not necessarily effective compared to the photoelectric conversion device using a crystalline silicon substrate. The situation is not good.

  In addition, as a method for producing crystalline silicon particles, there is a so-called jet method (melting and dropping method) in which a silicon raw material is melted in a container and freely dropped from a nozzle portion of the container to be solidified in a droplet form. When granular crystalline silicon particles are produced by this method, the following problems occur.

  That is, the molten droplet-like silicon particles are cooled and solidified from the surface toward the inside, but in the state where the surface is solidified and the inside is in a molten state, the inside expands in volume, so that part of it protrudes from the surface, Projections are often formed on the surface of crystalline silicon particles. Further, since the protrusion is easily formed at the final stage where the inside of the silicon particles is solidified, impurities are easily segregated in the protrusion.

  In addition, since crystalline silicon particles produced by the jet method are often not completely single crystals as they are, re-melting (remelting) to improve the crystal quality by crystallizing most of the crystalline silicon particles. A process may be performed. In this remelt process, a large number of crystalline silicon particles produced by the jet method are placed on a quartz plate in the furnace and the temperature is raised to a temperature range (about 1415 to 1450 ° C.) at which the crystalline silicon particles melt. In this step, the crystalline silicon particles are solidified upward from the base plate side (the lower end side of the crystalline silicon particles). In this case, since the solidification starts from the lower end side of the crystalline silicon particles, the impurities are segregated toward the upper end, and finally, the protrusions where the impurities are segregated at the upper end of the crystalline silicon particles due to the internal volume expansion described above. Is often formed.

  When a large number of crystalline silicon particles having projections formed on the surface in this way are arranged on a conductive substrate and joined together to produce a photoelectric conversion device, it is extremely difficult to regularly arrange a large number of crystalline silicon particles. In addition, even if it can be arranged using a jig or the like, the height of a large number of crystalline silicon particles becomes uneven, and furthermore, the bonding force and bonding depth of the large number of crystalline silicon particles to the conductive substrate are not uniform. There was a problem of becoming. In addition, even if a photoelectric conversion device can be manufactured using a large number of crystalline silicon particles with protrusions, the protrusions contain high-concentration impurities and a large number of crystalline silicon particles with respect to the conductive substrate. Since the joining force and the joining depth are not uniform, there is a problem that the conversion efficiency is lowered.

  Accordingly, the present invention has been completed in view of the above-mentioned problems in the prior art, and the object thereof is to efficiently arrange a large number of crystalline silicon particles on a conductive substrate to obtain uniform bonding force and bonding. It is an object to provide a photoelectric conversion device having high conversion efficiency, high performance, and high reliability that can be bonded at a depth and that does not have a protrusion containing a high concentration of impurities, and a manufacturing method thereof.

  In the photoelectric conversion device of the present invention, a large number of crystalline silicon particles are bonded to one main surface of a conductive substrate, an insulator is interposed between adjacent ones of the crystalline silicon particles, and an upper portion of the crystalline silicon particles Are exposed from the insulator, and the crystalline silicon particles are provided with a light-transmitting conductor layer, wherein the crystalline silicon particles have a smooth polished surface. Features.

  According to the method of manufacturing a photoelectric conversion device of the present invention, the silicon melt is discharged in a granular form from the nozzle part of the crucible and dropped, and the granular silicon melt is cooled and solidified during the dropping to segregate impurities. Crystal silicon particles having protrusions on the surface thereof, and then selectively removing the protrusions from the surface of the crystalline silicon particles by polishing, and then a large number of the conductive substrates on one main surface of the conductive substrate. Crystal silicon particles are bonded to each other so that an insulator is interposed between adjacent ones of the crystal silicon particles, and an upper portion of the crystal silicon particles is disposed so as to be exposed from the insulator. A photoconductive layer is provided.

  In addition, the method for producing a photoelectric conversion device of the present invention is characterized in that the silicon melt is discharged in a granular form from the nozzle part of the crucible and dropped, and the granular silicon melt is cooled and solidified while being dropped. The particles are manufactured, and then a base plate on which the crystalline silicon particles are placed is introduced into a heating furnace, the crystalline silicon particles are heated and melted, the temperature is lowered, and the molten crystalline silicon particles are By solidifying upward from the base plate side to be crystallized, a projection portion in which impurities are segregated is formed at the upper end portion of the surface of the crystalline silicon particle, and then the projection portion is formed from the surface of the crystalline silicon particle. Is then selectively removed by polishing, and then a large number of the crystalline silicon particles are bonded to one main surface of the conductive substrate, and an insulator is interposed between adjacent ones of the crystalline silicon particles. The upper portion of the crystalline silicon grains disposed exposed from the insulator causes a next and providing a light-transmitting conductive layer on these crystal silicon grains.

  Preferably, in the method for manufacturing a photoelectric conversion device of the present invention, the crystalline silicon particles are placed on the upper surface of the lower substrate when the protrusions are selectively removed from the surface of the crystalline silicon particles by polishing. In addition, the upper substrate is disposed opposite to the lower substrate so that the lower surface is in contact with the upper end of the crystalline silicon particles, the lower substrate is rotated in the plane of the main surface, and the upper substrate is rotated with respect to the lower substrate. The protrusions are selectively removed from the surface of the crystalline silicon particles by rotating in a reverse rotation direction.

  In the method of manufacturing a photoelectric conversion device according to the present invention, preferably, the lower substrate is rotated in the plane of the main surface and the upper substrate is rotated in the reverse rotation direction with respect to the lower substrate. The substrate is swung laterally with respect to the lower substrate.

  In the method for manufacturing a photoelectric conversion device of the present invention, it is preferable that the upper substrate is provided with a polishing cloth that elastically deforms in contact with the crystalline silicon particles on the lower surface.

  In the photoelectric conversion device of the present invention, a large number of crystalline silicon particles are bonded to one main surface of a conductive substrate, an insulator is interposed between adjacent ones of the crystalline silicon particles, and the upper part of the crystalline silicon particles is insulated. It is a photoelectric conversion device that is placed exposed from the body and provided with a translucent conductor layer on these crystalline silicon particles, and the crystalline silicon particles have a smooth surface by polishing, Since projections containing impurities at a concentration become crystalline silicon particles that do not exist on the surface, it is possible to efficiently arrange a large number of crystalline silicon particles on a conductive substrate and bond them with a uniform bonding force and bonding depth. In addition, it is possible to eliminate cracks and chipping of the crystalline silicon particles due to the protrusions in the manufacturing process, and further suppress leakage characteristics and obtain high conversion efficiency.

  In addition, the crystalline silicon particles were segregated to the protrusions, for example, by selectively removing the protrusions with segregated impurities formed on the surface by a polishing process and making the surface a smooth polished surface. Deterioration of the pn junction due to impurities can be prevented, and as a result, high conversion efficiency can be obtained.

  According to the method of manufacturing a photoelectric conversion device of the present invention, the silicon melt is discharged in a granular form from the nozzle portion of the crucible and dropped, and the granular silicon melt is cooled and solidified during the dropping to segregate impurities. The crystalline silicon particles having the projected portions on the surface are manufactured, and then the projected portions are selectively removed from the surface of the crystalline silicon particles by polishing, and then a large number of crystalline silicon particles are formed on one main surface of the conductive substrate. Are bonded to each other so that an insulator is interposed between adjacent ones of the crystalline silicon particles, and the upper part of the crystalline silicon particles is exposed from the insulator, and then a transparent conductive layer is provided on the crystalline silicon particles. As a result, the pn junction formed on the surface of the crystalline silicon particles is formed after removing the protrusions containing the abnormally segregated impurities, so that the crystalline silicon particles are cracked. Not subjected to mechanical damage to chipping, and it is possible to obtain a high conversion efficiency.

  In the method for producing a photoelectric conversion device of the present invention, the silicon melt is discharged and dropped in a granular form from the nozzle part of the crucible, and the crystalline silicon particles are cooled and solidified by dropping the granular silicon melt during the dropping. Next, the base plate on which the crystalline silicon particles are mounted is introduced into the heating furnace, and the crystalline silicon particles are heated and melted, and then cooled down, and the molten crystalline silicon particles are moved upward from the base plate side. By solidifying it toward the surface, it is crystallized to form protrusions with segregated impurities at the upper end of the surface of the crystalline silicon particles, and then the protrusions are selectively removed from the surface of the crystalline silicon particles by polishing. Next, a large number of crystalline silicon particles are bonded to one main surface of the conductive substrate, an insulator is interposed between adjacent ones of the crystalline silicon particles, and the upper portion of the crystalline silicon particles is insulated. By arranging the crystal silicon particles so as to be exposed from the body, and then providing a translucent conductor layer on the crystal silicon particles, crystal silicon particles having high crystal quality can be obtained by remelting (remelting) of the crystal silicon particles. Since the crystalline silicon particles are solidified in one direction, a protrusion having a high impurity concentration is formed, and by removing the protrusion having a high impurity concentration, leakage at the pn junction is greatly suppressed, resulting in higher conversion efficiency. Can be obtained.

  The method for producing a photoelectric conversion device of the present invention preferably places the crystalline silicon particles on the upper surface of the lower substrate and selectively removes the projections from the surface of the crystalline silicon particles by polishing. The upper substrate is disposed opposite to the lower substrate so that the lower surface is in contact with the upper end of the substrate, and the lower substrate is rotated in the plane of the main surface and the upper substrate is rotated in the reverse rotation direction with respect to the lower substrate, By selectively removing the protrusions from the surface of the crystalline silicon particles, only the protrusions can be selectively and efficiently removed from the surface of the crystalline silicon particles.

  In the method for manufacturing a photoelectric conversion device of the present invention, preferably, the upper substrate is turned into the lower substrate while rotating the lower substrate in the plane of the main surface and rotating the upper substrate in the reverse rotation direction with respect to the lower substrate. On the other hand, the crystal silicon particles can be polished so as to be a clean sphere without making the ellipsoid sphere because the rocking is performed in the lateral direction. As a result, when manufacturing a photoelectric conversion device, a large number of crystalline silicon particles can be efficiently arranged on a conductive substrate and bonded with a uniform height, bonding force, and bonding depth, with high reliability. And a photoelectric conversion device having high conversion efficiency can be manufactured.

  Preferably, in the method for manufacturing a photoelectric conversion device of the present invention, the upper substrate is provided with a polishing cloth that elastically deforms in contact with the crystalline silicon particles on the lower surface, so that the protrusion does not slip on the lower substrate and is effective. It has the effect of being polished.

  Embodiments of the photoelectric conversion device of the present invention will be described in detail below with reference to the drawings.

  FIG. 1 is a cross-sectional view illustrating an example of an embodiment of a photoelectric conversion device of the present invention. FIG. 2 is a cross-sectional view illustrating another example of the embodiment of the photoelectric conversion device.

  In the photoelectric conversion device of the present invention, a large number of crystalline silicon particles 101 are bonded to one main surface of a conductive substrate 107, an insulator 109 is interposed between adjacent ones of the crystalline silicon particles 101, and the crystalline silicon particles 101 is a photoelectric conversion device in which an upper portion of 101 is exposed from the insulator 109 and a translucent conductor layer 111 is provided on the crystalline silicon particles 101. The crystalline silicon particles 101 have a polished surface and a smooth surface. It is the structure which is done. The first conductive type (for example, p-type) crystalline silicon particle 101 has a second conductive type (for example, n-type) semiconductor portion (semiconductor layer) 110 formed on the surface by a thermal diffusion method or the like. A translucent conductor layer 111 is provided on the silicon particles 101.

  Note that the surface of the crystalline silicon particle 101 is a smooth polished surface because JIS B 0621 (definition and display of geometric deviation) and JIS B 1501 (sphericity; minimum spherical surface in contact with the surface of the steel ball and steel) The maximum value in the radial direction with each point on the surface of the sphere). If there is a portion protruding from the sphere, the length becomes a number of sphericity, and can be, for example, 10% or less of the sphere diameter as a reference for polishing the protrusion.

The crystalline silicon particles 101 of the present invention are obtained by melting the entire silicon raw material in a quartz crucible, pressurizing the liquid surface of the silicon melt with argon gas, etc., from the nozzle hole of the nozzle part formed at the lower end of the crucible. By extruding, a large number of silicon melt droplets are ejected and solidified during free-fall, and they are stored as single crystal or polycrystalline crystalline silicon particles in a container, manufactured by the so-called jet method Is used. At this time, when the crystalline silicon particles rapidly solidify from the supercooled state, solidification starts from the surface of the droplets, and silicon expands in volume when the internal silicon melt is solidified. The shell of the solid part is broken to form a protrusion (hereinafter also referred to as protrusion j). The protrusion j has a length of several tens to several hundreds of μm. Since the projection j is finally solidified in the crystalline silicon particles, the concentration of impurities such as metal increases due to the segregation effect, and the crystal quality of the projection j is not good. Note that the concentration of impurities contained in the protrusion j is determined by etching the cross section with a Dash etching solution (HF: HNO ₃ : CH ₃ COOH = 1: 1: 10 (volume ratio)) and observing etch pits on the surface. This can be confirmed.

  Next, a remelting step can be performed to improve the crystal quality of the crystalline silicon particles, that is, to almost single-crystallize the crystalline silicon particles. In this case, the protrusion j is preferably removed by polishing. The remelting step is a step in which the crystalline silicon particles are placed on a quartz plate or the like and made into a single crystal by passing through a melting furnace. When the molten crystalline silicon particles solidify at this time, the platen Since it slowly solidifies upward from the side (the lower end side of the crystalline silicon particles), a small protrusion (hereinafter also referred to as a protrusion r) is formed at the upper end that solidifies last. In spite of impurity gettering due to solidification during production by the jet method, high-concentration impurities still often remain in the protrusions r formed in the remelting step. The high-concentration impurities contained in the protrusion r can be confirmed by SIMS (Secondary Ion Mass Spectroscopy) analysis.

  Since conventional photoelectric conversion devices using crystalline silicon particles use crystalline silicon particles with protrusions j and r remaining, a silicon substrate type (bulk type) using a wafer cut out from a polycrystalline bulk. ) Has a larger leakage current (current that leaks due to the parallel resistance of the photoelectric conversion device due to a pn junction defect), and conversion efficiency comparable to that of a bulk type photoelectric conversion device can be obtained. There wasn't. If the leak location that adversely affects the pn junction of the crystalline silicon particles is specified, the projection j or the projection r is damaged, so that the pn junction is broken or the projection j or the projection r is damaged. Even if not, it was found that a leak occurred inside the pn junction due to the impurities segregated in the protrusion j and the protrusion r.

  In order to avoid this, it is only necessary to perform a polishing process that polishes the entire surface of the crystalline silicon particles. In that case, a large loss occurs in terms of time and cost, and the efficiency and cost are reduced. It has been difficult to remove the protrusion j and the protrusion r.

  In addition, since the average particle diameter of the crystalline silicon particles 101 is used to configure a solar cell or the like, the silicon raw material is significantly larger at a size of 1 mm or more than a bulk solar cell having a thickness of 200 μm, for example. There is no saving. That is, the weight of silicon in a 100 mm square 200 μm thick polycrystalline silicon substrate is 4.66 g, whereas crystalline silicon particles having a diameter of 1 mm are arranged in a close-packed structure on a 100 mm square aluminum substrate. The weight of silicon is 5.23 g, and the amount of silicon is larger than that of a 200 μm thick polycrystalline silicon substrate. In the case of a polycrystalline silicon substrate, since there is a cutting loss for cutting a silicon lump (ingot) into a wafer shape, the necessary silicon raw material requires about 7 g, which is about 1.5 times 4.66 g. However, when the average particle diameter of the crystalline silicon particles is 1 mm or more, the silicon amount is not greatly saved by using the crystalline silicon particles. Therefore, the average particle diameter of the crystalline silicon particles is preferably 500 μm or less.

  Accordingly, since the crystal silicon particles have a small particle size, it is necessary to provide a technique for removing the protrusions j and the protrusions r by simply and accurately polishing a large amount of crystal silicon particles. The protrusion j and the protrusion r can be intensively polished and removed without polishing the entire surface.

  That is, in the method for manufacturing a photoelectric conversion device according to the first aspect of the present invention, the silicon melt is discharged in a granular form from the nozzle part of the crucible and dropped, and the granular silicon melt is cooled and solidified during the dropping. Thus, crystalline silicon particles having projections j on which the impurities are segregated are manufactured, and then the projections j are selectively removed from the surface of the crystalline silicon particles by polishing, and then the conductive substrate 107 A large number of crystalline silicon particles 101 are bonded to one main surface, an insulator 109 is interposed between adjacent ones of the crystalline silicon particles 101, and an upper portion of the crystalline silicon particles 101 is exposed from the insulator 109. Next, the transparent conductive layer 111 is provided on the crystalline silicon particles 101.

  This manufacturing method is applied when the crystal quality of the crystalline silicon particles manufactured by the jet method is good as it is. For example, the silicon particles once solidified during the dropping of the granular silicon melt Can be applied to the case where the crystal quality is improved by remelting in the dropping path. Remelting in the dropping path can be performed in a state where the silicon particles are suspended by a magnetic field or an air current.

  In the method for manufacturing a photoelectric conversion device according to the second aspect of the present invention, the silicon melt is discharged in a granular form from the nozzle part of the crucible and dropped, and the granular silicon melt is cooled and solidified during the dropping. Next, a crystalline silicon particle is manufactured, and then a base plate on which the crystalline silicon particle is placed is introduced into a heating furnace, and the crystalline silicon particle is heated and melted, and then the temperature is lowered to melt the crystalline silicon. The particles are solidified upward from the base plate side and crystallized to form a protrusion r in which impurities are segregated at the upper end of the surface of the crystalline silicon particle, and then the protrusion r from the surface of the crystalline silicon particle. Is then selectively removed by polishing, and then a large number of crystalline silicon particles 101 are bonded to one main surface of the conductive substrate 107, and the insulator 1 is interposed between adjacent ones of the crystalline silicon particles 101. 9 arranged to expose the upper portion of the crystalline silicon grains 101 with the interposition of an insulator 109, a next configuration in which a light-transmitting conductive layer 111 in these crystalline silicon grains 101.

  This manufacturing method is applied when the crystal quality of the crystalline silicon particles manufactured by the jet method cannot be said to be good as it is, and a separate remelting step of the crystalline silicon particles is performed. In this case, the protrusion j formed on the crystalline silicon particles produced by the jet method is preferably removed in advance by the polishing process of the present invention.

  A preferable polishing process in the method for manufacturing a photoelectric conversion device of the present invention is that the crystalline silicon particles are placed on the upper surface of the lower substrate and the crystal is crystallized when the protrusions are selectively removed from the surface of the crystalline silicon particles by the polishing process. An upper substrate is disposed opposite to the lower substrate so that the lower surface is in contact with the upper end of the silicon particles, the lower substrate is rotated within the plane of the main surface, and the upper substrate is rotated in the reverse rotation direction with respect to the lower substrate. It is. More preferably, the upper substrate is swung laterally with respect to the lower substrate while rotating the lower substrate within the plane of the main surface and rotating the upper substrate in the reverse rotation direction with respect to the lower substrate. It is something to be made. More preferably, the upper substrate is provided with a polishing cloth that is elastically deformed in contact with the crystalline silicon particles on the lower surface.

  The outline of the structure of the polishing method of the present invention is shown in FIG. In this polishing method, the lower substrate 102 made of a polishing grindstone and the upper substrate 103 made of a polishing grindstone rotate in opposite directions, and the crystalline silicon particles 101 disposed between the two substrates rotate between the two substrates. Polished. Without increasing the load on the crystalline silicon particles 101 and polishing for a long time, the protrusion 105 can be removed in a short time with a light load.

  In this case, for example, the rotation speed of the lower substrate 102 is set to 10 to 20 rpm. And the rotational speed of the upper substrate 103 is 3 to 10 rpm. It is good to do. If the relative rotational speed of polishing of these substrates is smaller than the above range, the crystalline silicon particles 101 will not rotate. If larger than the above range, the crystalline silicon particles 101 will be firmly fixed with a polishing cloth. Slipping occurs because it cannot be held.

The load on the crystalline silicon particles 101 depends on the thickness and hardness of the polishing cloth, but is preferably about 0.1 N / cm ² , and if it is too small, the protrusions are not polished and removed, and if it is too large, the crystalline silicon particles 101 is polished in a bowl shape.

  The time required for polishing is about 10 minutes.

  Further, while rotating the lower substrate 102 within the plane of the main surface and rotating the upper substrate 103 in the reverse rotation direction with respect to the lower substrate 102, the upper substrate 103 is swung in the lateral direction with respect to the lower substrate 102. In the case of moving, the sphericity increases and it can be prevented from being polished into an ellipsoidal sphere. In this case, the lateral swing (reciprocating motion) of the upper substrate 103 is performed in one direction parallel to the main surface within the plane of the main surface, but the swing amplitude is about 5 cm and the swing frequency is About 4 Hz is good.

  In the case where the upper substrate 103 is provided with a polishing cloth that elastically deforms in contact with the crystalline silicon particles 101 on the lower surface, the crystalline silicon particles 101 are rotated by being wrapped while being wrapped with the polishing cloth. The particles 101 can be rotated while preventing slipping, and as a result, only the protrusions 105 can be quickly removed from the crystalline silicon particles 101.

  The polishing cloth that elastically deforms in contact with the crystalline silicon particles 101 is made of a material such as a hard sponge and has a thickness of about 1 to 2 mm.

  In the case of the crystalline silicon particles 101 having a large particle size of about 600 μm, almost the entire surface is polished, but the protrusion 105 can be selectively and efficiently polished and removed.

  After removing the protrusion 105 from the crystalline silicon particle 101, the surface of the crystalline silicon particle 101 is etched with hydrofluoric acid in order to remove minute cracks formed on the surface of the crystalline silicon particle 101. Thereafter, in order to form the second conductive type (n-type) semiconductor layer 110 on the surface of the crystalline silicon particles 101, the crystalline silicon particles 101 are formed by a thermal diffusion method prior to bonding the crystalline silicon particles 101 to the conductive substrate 107. As the n-type dopant, group V P, As, Sb, group III B, Al, Ga, or the like is used, and the second conductivity type is formed on the surface of the crystalline silicon particle 101 while introducing the dopant into a diffusion furnace made of quartz. The semiconductor layer 110 is formed. In the present invention, the thermal diffusion method in which the diffused n-type V group P is introduced into the heated quartz tube is preferable, but after the crystalline silicon particles 101 are bonded onto the conductive substrate 107 containing aluminum. Alternatively, an n-type amorphous silicon layer may be stacked over the crystalline silicon particles 101 as the semiconductor layer 110.

  As the conductive substrate 107, a substrate in which a conductive layer (metal layer) is formed on at least the surface of a substrate such as a metal substrate made of aluminum or the like, or an insulating substrate made of glass, ceramic, or the like is preferable. When a conductive layer is formed on the substrate surface, the conductive layer is preferably made of a metal such as silver, aluminum, copper, or tin. More preferably, a substrate having at least a surface of an aluminum layer is preferable.

  Hereinafter, a case where the conductive substrate 107 is an aluminum substrate will be described.

  Then, when the crystalline silicon particles 101 are bonded to one main surface of the conductive substrate 107, a load is applied on the crystalline silicon particles 101 so as to promote the formation of an eutectic of aluminum and silicon at the bonded portion. While pressing against the substrate 107, bonding is performed by allowing the Al—Si eutectic temperature of 577 ° C. or higher to pass through a bonding heating furnace in a reducing atmosphere of nitrogen or nitrogen hydrogen. At this time, an Al—Si eutectic bonding layer 108 is formed at the interface between the aluminum substrate and the crystalline silicon particles 101. By forming the bonding layer 108, the bonding strength between the crystalline silicon particles 101 and the aluminum substrate can be increased.

  At this time, prior to the bonding of the crystalline silicon particles 101 to one main surface of the conductive substrate 107, a large number of convex portions corresponding to the bonding positions of the crystalline silicon particles 101 are formed on the main surface of the plate-shaped jig. Then, a paste containing aluminum-silicon eutectic powder is applied to the convex portions, and the convex paste is applied and printed on the location of the crystalline silicon particles 101 on one main surface of the conductive substrate 107. Also good. Then, by pressing the crystalline silicon particles 101 against the paste of the aluminum-silicon eutectic powder, only the lower part of the crystalline silicon particles 101 is melted first near the eutectic point, and aluminum-silicon eutectic is started. The formation region of the bonding layer 108 made of silicon eutectic is limited to the region immediately below the crystal silicon particles 101 and the vicinity thereof.

Next, an insulator 109 having a light-transmitting property is coated between the crystalline silicon particles 101 without unevenness so that the crystalline silicon particles 101 are interposed between adjacent ones. The insulator 109 is made of an insulating material for separating the positive electrode and the negative electrode, and contains, for example, polyimide as a main component. Other insulating materials include silicon oxide (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), lead oxide (PbO), boron oxide (B ₂ O ₃ ), zinc oxide (ZnO), and the like as optional components. Although glass can also be selected, polyimide is preferable because the processing temperature can be kept low, the elastic coefficient is small, and the difference in thermal expansion between the conductive substrate 107 and the insulator 109 is absorbed.

  Further, the insulator 109 is formed so as to expose at least the upper part of the crystalline silicon particle 101, so that an effective electrical connection between the translucent conductor layer 111 formed on the upper part of the crystalline silicon particle 101 and the crystalline silicon particle 101 is achieved. Contact is possible.

  Further, a light-transmitting conductor layer 111 is formed on the crystalline silicon particles 101 and the insulator 109 so that photocurrents generated in the respective crystalline silicon particles 101 can be collected by the light-transmitting conductor layer 111. The translucent conductor layer 111 includes a tin-doped indium oxide layer, a tin oxide layer, a zinc oxide layer, and the like, and can have an antireflection effect by controlling the thickness to about 850 mm.

  The translucent conductor layer 111 is usually formed by a sputtering method in order to obtain a reliable film quality suitable for mass production, but can also be formed by a CVD method, a dipping method, an electrodeposition method, or the like. . The translucent conductor layer 111 is formed on the second conductivity type semiconductor layer 110 as an upper electrode and also on the insulator 109, and the photoelectric conversion elements composed of the individual crystalline silicon particles 101 are arranged in parallel. Can be connected.

  Thereafter, in order to reduce the series resistance value between the translucent conductor layer 111 and the grit electrode (collector electrode) 112, a silver paste or the like is applied onto the translucent conductor layer 111 in a comb shape to form a grit electrode ( By using the collector electrode, a photoelectric conversion element can be obtained. In this way, a solar cell composed of a large number of crystalline silicon particles 101 (a large number of photoelectric conversion elements) by using the conductive substrate 107 as one electrode and the translucent conductor layer 111 as the other electrode. As a result, a photoelectric conversion device can be obtained.

  As described above, the photoelectric conversion device of the present invention can obtain high conversion efficiency by selectively polishing and removing the protrusions on the surface of the crystalline silicon particles, which have deteriorated the photoelectric conversion characteristics.

  Examples of the photoelectric conversion device of the present invention will be described below.

  In an inert atmosphere of Ar gas or He gas, a silicon raw material is charged into a crucible, and the silicon melt melted by heating is ejected from the nozzle hole of the nozzle part formed at the lower end of the crucible and solidified. A spherical p-type crystalline silicon particle was produced by a so-called jet method (melting drop method). Note that boron was included in the crystalline silicon particles as a p-type dopant. A spherical diameter of 300 μm was used.

  Next, a remelting step (remelting step) was performed in order to crystallize the crystalline silicon particles. That is, the crystalline silicon particles are placed on a quartz base plate, the temperature is raised to about the melting temperature (1415 ° C.) at which the crystalline silicon particles melt, and the temperature is gradually lowered from the base plate side toward the upper side of the crystalline silicon particles. By doing so, crystallinity was increased. In this remelt process, when the melted crystalline silicon particles solidify, the surface of some of the crystalline silicon particles solidifies in advance, and the volume expands when the melted interior solidifies. A protrusion of about 70 μm was formed.

Next, the crystalline silicon particles having protrusions formed on the surface are made of a lower substrate made of a # 600 polishing grindstone, an upper substrate made of a hard sponge and having a thickness of 1.1 mm and a # 6000 polishing cloth attached to the lower surface, No polishing material is supplied, and polishing is performed by rotating and rotating in the lateral direction with only a pressure of 0.05 N / cm ² , so that almost only the protrusions are polished and removed, and the crystalline silicon particles The surface was not greatly polished. The fact that the surface of the crystalline silicon particles was a polished surface was measured according to JIS B 0621. As a result, the arithmetic average roughness Ra of the surface was 10 μm or less. Further, when measured according to JIS B 1501, it was confirmed that the sphericity was 30 μm or less.

  Thereafter, a portion having a depth of 20 μm from the surface of the crystalline silicon particles was etched using hydrofluoric acid to remove some polishing scratches.

  At this time, the rotation speed of the lower substrate is 15 rpm. , The rotation speed of the upper substrate (the reverse rotation direction with respect to the lower substrate) is 5 rpm. The amplitude of the lateral swing of the upper substrate was 5 cm, the frequency was 4 Hz, and the polishing time was about 10 minutes. Further, the polishing cloth made of hard sponge is elastically deformed in contact with the crystalline silicon particles because of its material.

  Next, the crystalline silicon particles are placed on a quartz boat and heated to thermally diffuse phosphorus impurities in the surface layer of the crystalline silicon particles, and the n-type semiconductor layer (n Mold semiconductor part).

  Next, a high purity (purity 99.9 wt%) aluminum substrate having a thickness of 300 μm was used as the conductive substrate, and a large number of the crystalline silicon particles were placed on one main surface thereof.

  Next, an aluminum substrate on which a large number of crystalline silicon particles are placed is placed in a pressure-type bonding heating furnace using a reducing atmosphere composed of nitrogen gas and hydrogen gas, and placed on the crystalline silicon particles on the aluminum substrate. The pressed block was pressed while being heated to 600 ° C. above the eutectic temperature of aluminum-silicon. At this time, the aluminum-silicon eutectic powder previously applied to the place where the crystalline silicon particles on one main surface of the aluminum substrate are placed is melted, and the eutectic portion (between the aluminum substrate and the crystalline silicon particles ( Bonding part) was formed, and the crystalline silicon particles were firmly bonded on the aluminum substrate. Thereby, the crystalline silicon particles were bonded to the aluminum substrate by an electrically ohmic bonding portion having sufficient adhesive strength.

  Next, an insulator made of a polyimide resin is applied between the crystalline silicon particles to a thickness of about 100 μm on the conductive substrate on which the crystalline silicon particles are disposed, and is dried at 200 ° C. for 30 minutes in a nitrogen atmosphere. Then, baking was performed at 350 ° C. for 1 hour to form an insulating layer.

  An ITO film as a light-transmitting conductor layer was formed on the entire surface of these crystalline silicon particles by a sputtering method with a temperature of the aluminum substrate of 190 ° C. and a thickness of 85 nm.

  Finally, a silver paste pattern is formed in a grid pattern with a dispenser on the translucent conductive layer, and fired at 250 ° C. in the atmosphere to form finger electrodes and bus bar electrodes as upper electrodes. Was made.

  As a result of evaluating the electrical characteristics of this photoelectric conversion device using an AM1.5 solar simulator, a conversion efficiency of 15.1% could be obtained.

[Comparative example]
As a result of evaluating the electrical characteristics of the photoelectric conversion device manufactured by the same method as in Example 1 without polishing the crystalline silicon particles using an AM1.5 solar simulator, the conversion was 13.1%. Only efficiency was obtained. The main reason for this is thought to be a decrease in the fill factor, which is considered to be caused by a leak caused by the protrusion formed by segregation of impurities formed in the crystalline silicon particles.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of a polishing apparatus used in a polishing step, showing an example of an embodiment of a method for manufacturing a photoelectric conversion device of the present invention. It is sectional drawing which shows an example of embodiment about the photoelectric conversion apparatus of this invention.

Explanation of symbols

101: Crystalline silicon particle 102: Lower substrate 103: Upper substrate 104: Polishing cloth 105: Protrusion 107: Conductive substrate 108: Bonding layer 109: Insulator 110: Second conductive type semiconductor layer 111: Translucent conductor Layer 112: Top electrode

Claims (6)

  A large number of crystalline silicon particles are bonded to one main surface of the conductive substrate, an insulator is interposed between adjacent ones of the crystalline silicon particles, and an upper portion of the crystalline silicon particles is exposed from the insulator. A photoelectric conversion device, wherein the crystalline silicon particles are provided with a light-transmitting conductive layer, wherein the crystalline silicon particles have a smooth polished surface.   The silicon melt is discharged in a granular form from the nozzle part of the crucible and dropped, and the granular silicon melt is cooled and solidified during the dropping, so that crystalline silicon particles having projections on the surface with segregated impurities are formed. Next, the protrusions are selectively removed from the surface of the crystalline silicon particles by polishing, and then a large number of the crystalline silicon particles are bonded to one main surface of the conductive substrate. In addition, an insulator is interposed between adjacent ones of the crystal silicon particles, and an upper portion of the crystal silicon particles is disposed so as to be exposed from the insulator, and a transparent conductive layer is then provided on the crystal silicon particles. A method for manufacturing a photoelectric conversion device.   Crystal silicon particles are produced by discharging and dropping the silicon melt in a granular form from the nozzle part of the crucible, and cooling and solidifying the granular silicon melt during the dropping. Is introduced into a heating furnace, the crystalline silicon particles are heated and melted, the temperature is lowered, and the melted crystalline silicon particles are solidified upward from the base plate side to form crystals. By forming the protrusion, a protrusion with segregated impurities is formed at the upper end of the surface of the crystalline silicon particle, and then the protrusion is selectively removed from the surface of the crystalline silicon particle by polishing, and then conductive. A large number of the crystalline silicon particles are bonded to one main surface of the conductive substrate, an insulator is interposed between adjacent ones of the crystalline silicon particles, and the top of the crystalline silicon particles The insulation is exposed from the body and placed next manufacturing method of a photoelectric conversion device characterized by providing a light-transmitting conductive layer in these crystalline silicon particles.   When selectively removing the protrusions from the surface of the crystalline silicon particles by polishing, the crystalline silicon particles are placed on the upper surface of the lower substrate, and the upper surface so that the lower surface is in contact with the upper end of the crystalline silicon particles A substrate is disposed opposite to the lower substrate, and the lower substrate is rotated in the plane of the main surface, and the upper substrate is rotated in the reverse rotation direction with respect to the lower substrate, thereby forming the crystalline silicon particles. 4. The method of manufacturing a photoelectric conversion device according to claim 2, wherein the protrusion is selectively removed from the surface.   The lower substrate is rotated in the lateral direction with respect to the lower substrate while rotating the lower substrate in the plane of the main surface and rotating the upper substrate in the reverse rotation direction with respect to the lower substrate. The method for producing a photoelectric conversion device according to claim 4. 6. The method of manufacturing a photoelectric conversion device according to claim 4, wherein the upper substrate is provided with a polishing cloth that elastically deforms in contact with the crystalline silicon particles on the lower surface.

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