JP2007276040A - Optical film peeling device, substrate separation device and manufacturing method for liquid crystal display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To cleanly peel and cut off an optical film so that adhesives are removed almost completely. <P>SOLUTION: This optical film peeling device partially peels a deflecting plate 116 as an optical film attached to a glass substrate 102 as a substrate, and is provided with a moving unit 80 as a movable portion capable of linearly moving relatively to the substrate. The movable portion has a cutter 82 for cutting the optical film so as to scrape the optical film and a nozzle 10 as a solvent supply portion for supplying a solvent along the cutter. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical film peeling device, a substrate cutting device, and a method for manufacturing a liquid crystal display panel.

  An optical film such as a retardation plate or a polarizing plate may be attached to the surface of the display panel. For example, in a liquid crystal display panel, a polarizing plate or the like is attached to the surface of a glass substrate, and display is controlled by a combination of the optical properties of the liquid crystal and the action of the polarizing plate.

  As a manufacturing method of a liquid crystal display panel, for example, for a liquid crystal display panel size substrate bonded to each other through a sealing material, a liquid crystal is supplied from an opening of the sealing material by using a pressure difference between inside and outside. A so-called vacuum injection method is known in which injection is performed and then the opening is sealed.

  In contrast, the sealing material is drawn in a closed loop without an opening, so that the liquid crystal is dropped into the sealing material frame of the substrate before bonding, and the substrates are bonded together under reduced pressure. A matching method has been developed. This method has the advantage that the tact time for filling the liquid crystal can be drastically reduced.

  In the case of the drop laminating method, a large number of liquid crystal display panels can be collectively produced using a large substrate. For example, a manufacturing method of a liquid crystal display panel by so-called “multi-face drawing” as disclosed in Japanese Patent Application Laid-Open No. 2004-4636 (Patent Document 1) has been developed. In this manufacturing method, large glass substrates 101 and 102 having a size corresponding to a plurality of liquid crystal display panels are prepared as schematically shown in FIG. 10, and a sealing material 103 is formed in a frame shape on the surface of one of the glass substrates. The liquid crystal 4 is dropped inside the sealing material 103 and the glass substrates 101 and 102 are bonded together. In this way, a large-sized bonded substrate (also referred to as “multiple substrate”) 314 is obtained as shown in FIG. As shown in FIG. 12, a large polarizing plate 116 is attached to the surface of the bonded substrate 314.

Next, as shown in FIG. 13, the large bonded substrate 314 is divided into individual liquid crystal display panels 150. Therefore, in this method of manufacturing a liquid crystal display panel, a process of dividing the bonded substrate 314 formed with a plurality of liquid crystal cells into bonded substrates 150 each including a single liquid crystal cell (hereinafter referred to as “dividing process”). ) Is included. In this dividing step, as shown in FIG. 14, a part of the large polarizing plate 116 attached to the surface of the large bonded substrate 314 with the blade 82 is first stripped and cut, and thereafter, The bonded substrate board 314 itself is divided.
JP 2004-4636 A

  The polarizing plate is attached to the substrate with an adhesive. The work of cutting a part of the polarizing plate into a strip shape is performed by running the blade, but if the blade is moved and cut only, a part of the adhesive remains on the substrate surface, which hinders the cutting work of the board. There is a problem of causing The same applies to optical films other than polarizing plates.

  Then, an object of this invention is to provide the manufacturing method of the optical film peeling apparatus, board | substrate cutting apparatus, and liquid crystal display panel which can exfoliate and cut an optical film cleanly so that an adhesive agent may not remain substantially.

  In order to achieve the above object, an optical film peeling apparatus according to the present invention is an apparatus for partially peeling an optical film affixed on a substrate, and is capable of linear movement relative to the substrate. A movable part is provided, and the movable part includes a blade for cutting off the optical film so as to scoop out the optical film, and a solvent supply unit for supplying a solvent along the blade.

  In order to achieve the above object, a substrate cutting apparatus according to the present invention is an apparatus for producing a plurality of liquid crystal display panels by dividing a glass substrate on which an optical film having a size corresponding to the plurality of liquid crystal display panels is attached. The movable part includes a movable part linearly movable relative to the substrate, and the movable part supplies a cutting tool for cutting off the optical film so as to scoop the optical film and a solvent along the cutting tool. And a glass cutting wheel disposed on the rear side of the blade for cutting the glass substrate.

  According to the present invention, since the blade can be advanced while supplying the solvent along the blade from the solvent supply unit, the blade can be cut in a state where the adhesive layer between the optical film and the substrate is swollen. become able to. Therefore, the part to be removed of the optical film and the adhesive layer can be peeled off together and scraped off. As a result, the optical film can be peeled and cut cleanly so that almost no adhesive remains on the substrate surface.

(Embodiment 1)
(Constitution)
With reference to FIGS. 1-3, the optical film peeling apparatus in Embodiment 1 based on this invention is demonstrated. The optical film peeling apparatus in the present embodiment is an apparatus for partially peeling a polarizing plate 116 as an optical film stuck on a glass substrate 102 as a substrate, as shown in FIG. A movable unit 80 is provided as a movable unit that can move linearly relative to the substrate, and the movable unit supplies a cutter 82 for cutting off the optical film so as to scoop the optical film, and supplies the solvent along the cutter. And a solvent supply unit. The solvent supply unit will be described in detail later.

  FIG. 2 shows an enlarged view of the vicinity of the tip of the blade 82. As shown in FIG. 2, the nozzle 10 is disposed inside the blade 82 as a solvent supply unit. A solvent supply pipe 13 is connected to the nozzle 10. The relative movement of the moving unit 80 in the direction of the arrow 97 in FIG. 1 causes the blade 82 to move in the direction of the arrow 97 in FIG. 2 shows a state in which the side wall in front of the blade 82 is removed so that the inner space of the blade 82 can be seen. As shown in FIG. 3, the solvent 11 is supplied from the nozzle 10 during the peeling and cutting operation. The solvent 11 is an organic solvent, and may be, for example, ethyl alcohol, acetone, or isopropyl alcohol.

(Action / Effect)
When the moving unit 80 moves in the direction of the arrow 97, the blade 82 peels and cuts a part of the polarizing plate 116 into a strip shape. At that time, the adhesive bonding the polarizing plate 116 and the glass substrate 102 is swollen and softened by the solvent 11 supplied from the nozzle 10 as a solvent supply unit. Since the bottom of the blade 82 scrapes off the strip-shaped portion of the polarizing plate together with the adhesive while the adhesive is soft, the optical film can be peeled and cut cleanly so that the adhesive hardly remains on the substrate surface. The same applies to the case where an optical film other than the polarizing plate is applied.

  In addition, as shown in FIG. 4, the chip suction pipe 12 may be arrange | positioned above the cutter 82, and the chip 14 may be attracted | sucked. In this case, the movable part includes a chip suction tube 14 on the upper side of the blade. With such a configuration, the chip 14 can be reliably pulled in a desired direction, and the chip 14 can be prevented from blocking the solvent supply unit or being discharged in an undesired direction. The nozzle 10 may be a needle. The supply amount of the solvent 11 may be adjusted depending on the size of the inner diameter of the nozzle 10 or by other means.

  In this embodiment, the glass substrate 102 is used as the substrate. However, the optical film peeling apparatus according to the present invention may be a substrate other than the glass substrate. In addition, the glass substrate 102 is one of the two substrates constituting the bonded substrate 314 as shown in FIG. 12, but in this embodiment and other subsequent embodiments, the glass substrate 102 is used. The above description is only a representative example. It may be a substrate on either side constituting the bonded substrate. Moreover, even if it is a case where the thing which stuck the optical film on the board | substrate of one sheet instead of a bonding board | substrate for some reason, it can be made into the work object of this invention.

(Embodiment 2)
(Constitution)
With reference to FIG. 5, the board | substrate cutting apparatus in Embodiment 2 based on this invention is demonstrated. As shown in FIG. 5, the substrate cutting apparatus according to the present embodiment is for producing a plurality of liquid crystal display panels by cutting a glass substrate on which an optical film having a size corresponding to the plurality of liquid crystal display panels is attached. The apparatus includes a moving unit 81 as a movable part that is linearly movable relative to the substrate, and the movable part includes a blade 82 for cutting off the optical film, and the blade And a glass cutting wheel 31 disposed on the rear side of the blade for cutting the glass substrate. In this substrate cutting apparatus, the glass cutting wheel 31 is fixed to the movable part main body via a wheel support member 32. The glass cutting wheel 31 is configured to form a crack on the surface of the glass substrate while rotating. The moving unit 81 also includes a sensor 83 for detecting the position of the moving unit 81 itself. The configurations of the blade 82 and the solvent supply unit are the same as those described in the first embodiment. Although the solvent supply part is not visible in FIG. 5, a solvent supply part for supplying the solvent along the blade is provided above the blade 82.

(Action / Effect)
When the moving unit 81 moves in the direction of the arrow 97 in FIG. 5, the blade 82 cuts a part of the polarizing plate 116 into a band shape, and the cut region 86 is formed. The chips 14 are discharged above the blade 82. The glass cutting wheel 31 moves inside the cutting area 86. The glass cutting wheel 31 advances while forming a scribe line 85 on the surface of the glass substrate 102. At that time, the adhesive bonding the optical film and the glass substrate is swollen and softened by the solvent supplied from the solvent supply unit. Since the bottom of the blade 82 scrapes off the strip-shaped portion of the polarizing plate together with the adhesive while the adhesive is soft, the optical film can be peeled and cut cleanly so that the adhesive hardly remains on the substrate surface. Since the glass parting wheel 31 travels on the surface of the glass substrate on which almost no adhesive remains, and forms the scribe line 85, it is possible to avoid a situation in which the parting operation is hindered by the remaining adhesive. Further, after the substrate is divided, it is possible to obtain a clean finish in which almost no adhesive remains even if attention is paid to the exposed portion of the glass substrate in the vicinity of the divided ends.

  Note that a chip suction tube similar to that described in the first embodiment may be disposed on the upper side of the blade 82 so that the chip 14 is sucked. With such a configuration, the chip 14 can be reliably pulled out in a desired direction, and the chip can be prevented from interfering with the solvent supply or the dividing operation.

(Embodiment 3)
(Production method)
A method for manufacturing a liquid crystal display panel according to Embodiment 3 of the present invention will be described. The manufacturing method of the liquid crystal display panel includes a step of attaching an optical film having a size corresponding to a plurality of liquid crystal display panels to a glass substrate having a size corresponding to the plurality of liquid crystal display panels, and cutting the optical film so as to be scraped off. A step of supplying a solvent along the blade using the blade for cutting and peeling off the optical film while swelling the adhesive layer bonding between the optical film and the glass substrate. . The step of affixing the optical film is performed on a large bonded substrate 314 that has been prepared in advance by a known technique and is in the state shown in FIG. For example, if the optical film is the polarizing plate 116, the result is a bonded substrate 314 having a large polarizing plate 116 attached to the surface as shown in FIG. The step of peeling and cutting can be performed on the bonded substrate 314 using the optical film peeling apparatus as described in Embodiment 1 (see FIGS. 1 and 2). In the large-sized bonded substrate 314, the optical film in the belt-like region corresponding to the boundary line between the single-size liquid crystal display panels is peeled and cut, and the glass substrate exposed in the belt-like region is divided by a known technique. The step of peeling and cutting may be performed over all the boundary lines, and then the exposed glass substrate may be divided by performing a scribe process or the like. A mechanism for scribing the glass substrate is provided behind the optical film peeling apparatus in the first embodiment, and the optical film peeling and excision and the scribing process for the glass substrate are collectively performed by traveling together. May be. That is, the substrate cutting apparatus described in Embodiment 2 may be used.

(Action / Effect)
According to the method for manufacturing a liquid crystal display panel in the present embodiment, the step of peeling off the unnecessary portion of the optical film when dividing the large-sized bonded substrate into a single-size liquid crystal display panel is performed by removing the solvent along the blade. Since the adhesive is swelled, the adhesive is swollen and softened, and the optical film is peeled off so that it can be scraped off by the blade and adhered to the exposed glass substrate at the edge. A high-quality liquid crystal display panel in which almost no agent remains can be easily obtained.

(Embodiment 4)
(Production method)
A method for manufacturing a liquid crystal display panel according to Embodiment 4 of the present invention will be described. The liquid crystal display panel manufacturing method includes a step of attaching an optical film having a size corresponding to a plurality of liquid crystal display panels to a glass substrate having a size corresponding to the plurality of liquid crystal display panels, and supplying a solvent at an outer peripheral portion of the optical film. Then, the step of swelling the adhesive layer bonding between the optical film and the glass substrate and the blade for cutting the optical film so as to be scraped off are inserted from the swollen portion by the step of swelling. And removing the optical film by moving it.

  In the method for manufacturing a liquid crystal display panel in the present embodiment, the solvent is supplied at the outer periphery of the optical film. That is, as shown in FIG. 6, the solvent is supplied from the nozzle 10 only while the blade 82 passes through the section A of the outer peripheral portion of the optical film 116. When the blade 82 reaches the section B, the supply of the solvent is stopped. In the section B, the blade 82 continues to travel without supplying the solvent.

  A plan view of the traveling state of the blade 82 on the bonded substrate 314 is as shown in FIG. As shown by an arrow 98, the blade (not shown in FIG. 7) advances. The cutting tool travels so as to scan a necessary cutting position of the optical film, that is, a boundary line between the single liquid crystal display panels. However, the cutting tool has portions A1, A2, A3,... Corresponding to the outer peripheral portion of the optical film. The solvent is fed only when passing. In other words, the solvent is supplied only in the vicinity of the travel start point in each locus of the cutter in FIG.

  In this way, after the cutter 82 has completely scanned the region to be cut in the first direction, that is, in the vertical direction in FIG. 7, the cutter 82 performs scanning in the second direction different by 90 °. That is, the second direction is the horizontal direction in FIG. In this case, the optical film is no longer continuous as a single piece, but is divided by a number of grooves extending in the longitudinal direction. As shown in FIG. 8, the blade 82 advances in the direction of the arrow 97 while traversing many grooves. In that case, it is preferable to treat the portion C in FIG. 8, that is, the portion corresponding to the outer peripheral portion of the optical film before dividing, as the section A in FIG. That is, the solvent is supplied at a site where the blade starts to cut into the optical film.

  In the scan in the second direction, the blade travels alternately across the section where the optical film is present and the section where the optical film is absent. Corresponds to the site where incision starts. Therefore, in FIG. 8, in addition to the part C, the parts D1, D2, D3,... Correspond to the part where the blade starts to cut into the optical film. These regions D1, D2, D3,... Are preferably handled as section A in FIG. As a result, the solvent supply unit attached to the blade supplies the solvent in a certain section where the transition is made from the section without the optical film to the section, and then stops the supply of the solvent, and the section without the section with the optical film. Then, when shifting from a section having no optical film to a certain section, the operation of supplying the solvent again over a certain section is repeated.

(Action / Effect)
In the present embodiment, since the solvent is supplied in the sections A1, A2, A3,..., That is, the section A shown in FIG. 6, the adhesive layer swells and the tip of the blade 82 is the adhesive layer. It becomes easier to enter the lower side. If the cross section of the sharp blade edge at the bottom of the blade 82 is also enlarged greatly, it has a certain roundness as shown in FIG. 9, but since the adhesive layer is swollen in the section A, the blade edge can be easily bonded with adhesive. Can enter under the layer. In section B, the adhesive layer does not swell because there is no supply of solvent, but in section A, the cutting edge 82 has already entered the lower side of the adhesive layer, and the blade 82 divides between the adhesive layer and the substrate. Since they enter the section B while scooping them upward, the blade 82 can continue to split between the adhesive layer and the substrate in the section B and advance so as to scoop them upward. Since the scanning in the first direction is performed in this manner, the optical film can be peeled and cut so that substantially no adhesive remains on the substrate surface along the dividing line extending in at least the first direction.

  If the solvent is supplied to the portion C shown in FIG. 8 in the scan in the second direction, the adhesive remaining on the exposed portion of the substrate along the dividing line extending in the second direction can be reduced. In particular, if the solvent is supplied to each of the portions D1, D2, D3,... Where the blade moves from a portion where there is no optical film to a certain portion, the adhesive swells and the blade cuts the optical film and the adhesive layer. It is preferable that the optical film can be peeled and cut so that almost no adhesive remains on the dividing line extending in the second direction.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and includes all modifications within the scope and meaning equivalent to the terms of the claims.

It is explanatory drawing of the optical film peeling apparatus in Embodiment 1 based on this invention. It is 1st expansion explanatory drawing of the front-end | tip part vicinity of the cutter with which the optical film peeling apparatus in Embodiment 1 based on this invention is provided. It is the 2nd expansion explanatory view near the front-end | tip part of the cutter with which the optical film peeling apparatus in Embodiment 1 based on this invention is provided. It is expansion explanatory drawing of the front-end | tip part vicinity with which the modification of the optical film peeling apparatus in Embodiment 1 based on this invention is provided. It is explanatory drawing of the board | substrate cutting device in Embodiment 2 based on this invention. It is 1st explanatory drawing of the manufacturing method of the liquid crystal display panel in Embodiment 4 based on this invention. It is 2nd explanatory drawing of the manufacturing method of the liquid crystal display panel in Embodiment 4 based on this invention. It is 3rd explanatory drawing of the manufacturing method of the liquid crystal display panel in Embodiment 4 based on this invention. It is an expanded sectional view of the front-end | tip of the base of the cutter used with the manufacturing method of the liquid crystal display panel in Embodiment 4 based on this invention. It is the 1st explanatory view of the manufacturing method of the liquid crystal display panel based on the prior art. It is 2nd explanatory drawing of the manufacturing method of the liquid crystal display panel based on a prior art. It is 3rd explanatory drawing of the manufacturing method of the liquid crystal display panel based on a prior art. It is 4th explanatory drawing of the manufacturing method of the liquid crystal display panel based on a prior art. It is explanatory drawing of the cutting process included in the manufacturing method of the liquid crystal display panel based on a prior art.

Explanation of symbols

  10 nozzle, 11 solvent, 12 chip suction pipe, 13 solvent supply pipe, 31 glass cutting wheel, 32 wheel support member, 80 moving unit, 82 blade, 83 sensor, 85 scribe line, 86 cutting area, 97, 98 arrow, 101, 102 (large format) glass substrate, 116 polarizing plate, 150 liquid crystal display panel, 314 bonded substrate.

Claims (6)

  An apparatus for partially peeling an optical film affixed on a substrate, comprising a movable part that is linearly movable relative to the substrate, the movable part scooping up the optical film An optical film peeling apparatus, comprising: a cutting tool for excising the film, and a solvent supply unit for supplying a solvent along the cutting tool.   The optical film peeling apparatus according to claim 1, wherein the movable portion includes a chip suction pipe on an upper side of the blade.   An apparatus for producing a plurality of liquid crystal display panels by dividing a glass substrate on which an optical film having a size corresponding to the plurality of liquid crystal display panels is attached, and is capable of linear movement relative to the substrates. A movable part, and the movable part cuts the optical film so as to scoop, a solvent supply part for supplying a solvent along the blade, and the glass substrate for cutting the glass substrate. A substrate cutting apparatus, comprising: a glass cutting wheel disposed on the rear side of the blade.   The substrate cutting apparatus according to claim 3, wherein the movable portion includes a chip suction pipe on an upper side of the blade. A process of attaching an optical film of a size corresponding to a plurality of liquid crystal display panels to a glass substrate of a size corresponding to a plurality of liquid crystal display panels;
While supplying a solvent along the blade using a blade for cutting out the optical film so as to scoop, while swelling the adhesive layer that bonds between the optical film and the glass substrate, A method for producing a liquid crystal display panel, comprising a step of peeling and cutting the optical film. A process of attaching an optical film of a size corresponding to a plurality of liquid crystal display panels to a glass substrate of a size corresponding to a plurality of liquid crystal display panels;
Supplying a solvent at the outer periphery of the optical film to swell the adhesive layer bonding between the optical film and the glass substrate;
A method for manufacturing a liquid crystal display panel, comprising: inserting a knife for cutting off the optical film so as to scoop out the optical film from the location swollen by the step of swelling and peeling the optical film by moving the blade.

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