JP2007273148A - Electronic equipment and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment with a terminal structure capable of alleviating stress on a soldering joint part, excellent in vibration resistance as compared with the prior art, and capable of passing a large current. <P>SOLUTION: A first connecting part 15 of an electrode terminal member 14 constituting the terminal structure is connected to a substrate 12 with a soldering 16, at a position corresponding to a corner of the substrate 2 housed in a case 11. A second connecting part 18 of the electrode terminal member 14 is fixed to a fixing part 17 through a screw 19. The electrode terminal member 14 is provided with four bent parts 23 between the first connecting part 15 and the second connecting part 18, and two slits 26 extended nearly in parallel with the substrate 12. Each of the slits is provided at each of two vertical faces connected with a horizontal face 25 between the two bent parts 23. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic device and a method for manufacturing the same, and more specifically, a location where a first connection portion on one end side of an electrode terminal member is connected to a substrate by solder and a second connection portion on the other end side is separated from the substrate. The present invention relates to an electronic device having a terminal structure fixed in parallel to the substrate and a method for manufacturing the same.

  When the circuit of the substrate (circuit substrate) and the electronic component are electrically connected, the relatively small electronic component is soldered to the circuit by a flow soldering method or the like. However, a terminal structure that is connected by reflow soldering via a plate-like electrode terminal member (substrate connecting member) is used for connection to a large electronic component or an electronic component disposed at a location away from the circuit board. It is done.

  As a board connection member whose base end is soldered to the board and whose tip is fastened to a fastening terminal provided on the circuit component, soldering is performed to fix the board connection member while avoiding complicated work and high accuracy. A board connecting member that can improve the reliability of the part has been proposed (see Patent Document 1). 4A and 4B, a substrate connecting member 51 described in Patent Document 1 includes a pair of flat plate portions 52 and 53 that form a right angle with each other, and a bent portion that connects the flat plate portions 52 and 53 to each other. 54. The flat plate portions 52 and 53 are provided with groove portions (slits) 52a and 53a, respectively, and neck portions 55 and 56 that are narrowed by the groove portions 52a and 53a. Further, a hole 57 into which a screw can be inserted is formed in the flat plate portion 53 on the distal end side.

  Then, as shown in FIG. 4C, the board connecting member 51 electrically connects the circuit component module 59 fixed on the aluminum base 58 and the printed board 61 on which the circuit component 60 is mounted. The board connecting member 51 is soldered to the printed circuit board 61 at the base end and is fastened and fixed to the fastening terminal 62 of the circuit component module 59 by screws 63 so that the circuit component module 59 and the printed circuit board 61 are electrically connected. Connect.

The board connecting member 51 is easily deformed in the stress application direction even if stress is generated between the base end part and the tip end part of the board connecting member 51 due to the presence of the neck parts 55 and 56. Therefore, the stress is eliminated or reduced, and the stress applied to the solder joint portion (soldering portion) is relieved.
JP 2001-319701 A

  In Patent Document 1, when stress is generated between the base end portion and the tip end portion of the board connecting member 51, the neck portions 55 and 56 are deformed to relieve the stress applied to the solder joint portion. However, since the current path is narrowed by providing the neck portions 55 and 56, the heat generation is increased and the loss is increased when the neck portions 55 and 56 are used in locations where a large current flows. Therefore, it cannot be adopted in a portion where a large current flows. In addition, when the electrode terminal member having a narrow width is used in an in-vehicle electronic device or the like to which severe vibration is applied, there is a risk of early disconnection due to vibration.

  The present invention has been made in view of the above-described conventional problems, and the object thereof is to reduce the stress on the solder joint, which is superior in vibration resistance compared to the prior art and has a large current. It is an object of the present invention to provide an electronic device having a terminal structure that can flow.

  In order to achieve the above object, according to the first aspect of the present invention, the first connection portion on one end side of the electrode terminal member is connected to the substrate by solder and the second connection portion on the other end side is separated from the substrate. This is an electronic device having a terminal structure fixed to a location. The electrode terminal member has three or more bent portions between the first connection portion and the second connection portion, and is provided with one or more slits extending substantially parallel to the substrate. Here, “substantially parallel to the substrate” means not allowing strict parallelism but allowing deviation due to manufacturing tolerances or the like. In addition, “slit” means not a hole but a shape in which one end is cut out. Hereinafter, the same meaning is used in this specification.

  In the present invention, the electrode terminal member constituting the terminal structure has three or more bent portions between the first connection portion connected to the substrate by solder and the second connection portion fixed at a position away from the substrate. Therefore, the stress in the direction perpendicular to the substrate can be relaxed, and the strength against vibration in the direction perpendicular to the substrate is improved. Further, since a slit exists, when a force in a plane direction substantially parallel to the substrate is applied, the electrode terminal member is easily twisted, and the stress can be relieved by twisting. Therefore, the stress on the solder joint can be reduced. Further, when providing a plurality of slits to facilitate twisting of the electrode terminal member, by providing the slits on different plane portions partitioned by the bent portion, without increasing the distance between the first connection portion and the second connection portion, The width of the current path can be widened, and a large current can be passed as compared with the conventional technique.

  According to a second aspect of the present invention, in the first aspect of the present invention, the second connection portion is fixed substantially parallel to the substrate. Therefore, in the present invention, it is easier to relieve stress in the direction perpendicular to the substrate than when the second connection portion is fixed in a state perpendicular to the substrate, for example.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, the slit is provided on a surface extending in a direction orthogonal to the substrate in a state where the electrode terminal member is connected to the substrate. ing. Therefore, in this invention, compared with the case where the slit is provided in a portion substantially parallel to the substrate, the stress when the electrode terminal member is applied with a force in a plane direction substantially parallel to the substrate can be further relaxed. .

  The invention according to claim 4 is the invention according to any one of claims 1 to 3, wherein four or more of the bent portions are provided, two or more of the slits are provided, and a slit is provided. There are two or more bends between them. Therefore, according to the present invention, it is possible to effectively relieve the stress even when a force in a direction perpendicular to the substrate is applied to the electrode terminal member or when a force is applied substantially parallel to the substrate.

  According to a fifth aspect of the present invention, in the fourth aspect of the present invention, four bent portions are provided, two slits are provided, and two bent portions are provided inside the two slits. And one bending portion is provided on the outer side between the slits. Therefore, according to the present invention, even when a force in a direction perpendicular to the substrate is applied to the electrode terminal member, and even when a force is applied substantially parallel to the substrate, the number of bent portions and slits can be effectively reduced. Stress can be relaxed.

  The invention according to claim 6 is the invention according to any one of claims 1 to 5, wherein a hole through which a screw can be inserted is formed in the second connection portion, and the second connection portion is It is being fixed to the said location through the screw penetrated by the said hole. Therefore, in this invention, compared with the case where a 2nd connection part is fixed to a predetermined position by resistance welding or soldering, a 2nd connection part can be fixed accurately and easily.

  The invention according to claim 7 is the invention according to any one of claims 1 to 6, wherein the second connection portion includes a male connection terminal capable of fitting a female connection terminal, It forms so that it may continue via the connection surface extended so that the said 2nd connection part may make a right angle via a bending part. Therefore, according to the present invention, it is possible to easily provide a male connection terminal having the same potential as that of the second connection portion, rather than separately.

  According to the present invention, it is possible to provide an electronic device having a terminal structure that can reduce stress on a solder joint, has excellent vibration resistance as compared with the prior art, and can flow a large current. Can do.

Hereinafter, an embodiment embodying the present invention will be described with reference to FIGS.
As shown in FIG. 1, the electronic device 10 includes a housing 11, a substrate 12 accommodated in the housing 11, an electronic component 13 mounted on the substrate 12, and a cover member (not shown). . A first connection portion 15 on one end side of the plate-like electrode terminal member 14 constituting the terminal structure is connected to the substrate 12 with solder 16 at a position corresponding to one corner of the substrate 12. The housing 11 is provided with a fixing portion 17 that is one step higher than the upper surface of the substrate 12 at a position corresponding to one corner of the substrate 12. The upper surface of the fixing portion 17 is formed substantially parallel to the upper surface of the substrate 12. The upper surface of the fixing portion 17 corresponds to a location away from the substrate 12 to which the second connection portion 18 of the electrode terminal member 14 is fixed. The fixing portion 17 is formed with two screw holes 17a into which screws 19 for fixing the second connecting portion 18 are screwed. In FIG. 1, only one screw hole 17 a is shown, and the other screw hole is hidden by the screw 19. Further, in order to illustrate the screw hole 17a, the screw 19 screwed into the one screw hole 17a is not illustrated.

  Two holes 18a through which the screws 19 can be inserted are formed in the second connecting portion 18, and the second connecting portions 18 are fixed to the fixing portion 17 via the screws 19 inserted through the holes 18a. The second connecting portion 18 is fastened and fixed to the fixing portion 17 with a screw 19 via the electrode terminal 21 and the washer 22 of the circuit component module 20.

  As shown in FIG. 2, the electrode terminal member 14 has four bent portions 23 between the first connection portion 15 and the second connection portion 18. A portion continuous with the first connection portion 15 is formed to be perpendicular to the first connection portion 15 via the bent portion 23 so that the first connection portion 15 is joined by the solder 16 in a state substantially parallel to the substrate. Has been. Therefore, between the first connection portion 15 and the second connection portion 18, in addition to the four bent portions 23, the electrode terminal member 14 extends in a direction orthogonal to the substrate 12 in a state where the electrode terminal member 14 is connected to the substrate 12. Two vertical surfaces 24 as surfaces and one horizontal surface 25 as a surface extending substantially parallel to the substrate 12 are provided. Each vertical surface 24 is provided with one slit 26 extending substantially parallel to the substrate 12 in a state where the electrode terminal member 14 is connected to the substrate 12. That is, the electrode terminal member 14 is provided with four bent portions 23 and two slits 26, and two bent portions 23 are provided inside the two slits 26, and the outer side between the slits 26 is provided. One bending portion 23 is provided in each.

  The slit 26 is not a hole but is formed in a shape in which one end is cut out. The length and width of the slit 26 are determined in advance according to the usage state of the electronic device 10 and the vertical force acting on the electrode terminal member 14 when the second connection portion 18 of the electrode terminal member 14 is fixed to the fixing portion 17. An appropriate value is set by calculating a tightening force or the like by 19 or performing a preliminary test.

  Further, the second connection portion 18 is integrally provided with a male connection terminal 28 into which the female connection terminal 27 can be fitted. The male connection terminal 28 is formed so as to continue to the connection surface 29 extending through the bent portion 29a so as to form a right angle with the second connection portion 18 via the bent portion 29b. The female connection terminal 27 is shown only in FIG. The connection surface 29 is formed to extend in a direction orthogonal to the substrate 12 in a state where the electrode terminal member 14 is connected to the substrate 12, and the male connection terminal 28 is perpendicular to the connection surface 29. That is, it is formed so as to extend substantially parallel to the substrate 12. The male connection terminal 28 includes an engagement hole 28 a that can be engaged with a lock portion 27 a provided in the female connection terminal 27. The lock portion 27 a protrudes from the tip of an elastic piece 27 b that constitutes a part of the female connection terminal 27.

  Next, a method for manufacturing the electronic device 10 configured as described above will be described. In this manufacturing method, as shown in FIG. 2, as the electrode terminal member 14, a holding portion 30 capable of holding the electrode terminal member 14 in a self-standing state in cooperation with the first connection portion 15 is detachably connected. Use things. Then, using the electrode terminal member 14 provided with the holding portion 30, the electrode terminal member 14 is self-supported, and in that state, the solder is melted to connect the electrode terminal member 14 to the substrate 12, and then A removing step of separating the holding unit 30 from the second connecting unit 18 and removing it.

  The holding part 30 extends from the second connection part 18 on the terminal member main body side, that is, on the side opposite to the side where the bent part 23, the vertical surface 24, the horizontal surface 25, the first connection part 15 and the male connection terminal 28 are present. Is formed. The holding portion 30 is formed in a substantially L shape, and has a connecting portion 30 a with the second connection portion 18 at the upper end. The lower end of the holding portion 30 places the first connection portion 15 on the substrate 12. In this state, it is formed to be lower than the lower surface of the substrate 12.

  When soldering the electrode terminal member 14 to the substrate 12, as a jig for supporting the substrate 12 and the electrode terminal member 14, as shown by the chain line in FIG. The provided jig 31 is used. The concave portion 31a is placed in a predetermined solder connection position on the substrate 12 by inserting the holding portion 30 into the concave portion 31a in a state where the substrate 12 is supported at a predetermined position of the jig 31. Formed in position and depth.

  In the connecting step of soldering the electrode terminal member 14 to the substrate 12, the substrate 12 is placed at a predetermined position on the jig 31, and a solder paste is applied to the predetermined position. The electrode terminal member 14 has three or more (four in this embodiment) bent portions 23 between the first connection portion 15 and the second connection portion 18. For this reason, it is difficult to stand by itself without the holding portion 30 when the first connection portion 15 is solder-connected to the substrate 12, and the electrodes are in contact with the solder 16 applied on the substrate 12 and the first connection portion 15. The jig that supports the terminal member 14 needs to support the electrode terminal member 14 above the substrate 12 by the support portion. Therefore, when cream solder is applied on the substrate 12, a special structure is required such that the support portion moves to a retracted position so as not to interfere.

  However, since the electrode terminal member 14 can be self-supporting in cooperation with the holding portion 30, the jig 31 that supports the electrode terminal member 14 can support the holding portion 30 at a position lower than the solder application surface of the substrate 12. it can. Therefore, when applying the cream solder on the substrate 12, it is not necessary to provide a special structure such as moving to the retracted position so that the support portion does not interfere. Then, after the cream solder is applied on the substrate 12, when the electrode terminal member 14 is placed on the jig 31 with the lower portion of the holding portion 30 accommodated in the recess 31 a, the first connection portion 15 is placed on the solder 16. Placed in. In this state, the solder 16 is heated and melted, and then cooled, and the electrode terminal member 14 is soldered to the substrate 12. Thereafter, the substrate 12 is removed from the jig 31 together with the electrode terminal member 14, and a holding step 30 is removed from the electrode terminal member 14 while being supported by another jig (not shown). Therefore, as shown in FIG. 1, a part of the coupling portion 30 a remains in the second connection portion 18.

  And the board | substrate 12 provided with the electrode terminal member 14 from which the holding | maintenance part 30 was removed is arrange | positioned in the predetermined position of the housing | casing 11. FIG. At this time, the hole 18 a of the second connection portion 18 is in a state corresponding to the screw hole 17 a of the fixing portion 17. Then, the screw 19 is screwed into the screw hole 17 a to fasten and fix the second connection portion 18 to the fixing portion 17.

  Due to manufacturing tolerances of the substrate 12, the electrode terminal member 14, the fixing portion 17, and the like, when the second connecting portion 18 is fastened and fixed to the fixing portion 17 with the screw 19, a vertical compressive force or tensile force acts on the electrode terminal member 14. Or torsional force is applied. As a result, stress is applied to the solder joint. If the structure of the electrode terminal member 14 is a structure in which the first connection portion 15 and the second connection portion 18 are simply connected by a flat plate, the compression force, the tensile force, and the torsional force are not absorbed, and the solder joint portion A large stress is applied. However, since the electrode terminal member 14 has three or more bent portions 23 between the first connection portion 15 and the second connection portion 18, the compressive force and tensile force acting on the electrode terminal member 14 are Absorbed by the presence of the bent portion 23, the stress applied to the solder joint is reduced. Further, the torsional force acting on the electrode terminal member 14 is absorbed by the twisting of the electrode terminal member 14 due to the presence of the slit 26, and the stress applied to the solder joint portion is reduced.

  After the second connection portion 18 is fixed to the fixing portion 17, the female connection terminal 27 is fitted to the male connection terminal 28. In addition, assembly of other components to the housing 11 is performed and the manufacture of the electronic device 10 is completed.

Next, the operation of the electronic apparatus 10 configured as described above will be described.
When the electronic device 10 is used, a large current flows through the electrode terminal member 14 to generate heat, and stress is generated in the direction in which the electrode terminal member 14 expands. When the electrode terminal member 14 expands, stress is applied to the solder joint portion of the electrode terminal member 14, but the stress is relaxed by the spring action of the three or more bent portions 23, and the stress applied to the solder joint portion is suppressed. . In addition, depending on the usage environment of the electronic device 10, the electrode terminal member 14 expands due to an increase in the temperature around the electronic device 10, and the electrode terminal member 14 contracts due to the decrease in temperature. The spring action relaxes the stress and suppresses the stress applied to the solder joint.

  For example, when the electronic device 10 is mounted and used in an automobile or the like, the vibration of the vehicle body is transmitted to the housing 11 of the electronic device 10 while the automobile is running, and the housing 11 vibrates. The stress to be applied is applied to the solder joint portion of the electrode terminal member 14 through the electrode terminal member 14. However, due to the action of the bending portion 23 provided on the electrode terminal member 14, the stress is relaxed and the stress applied to the solder joint portion is suppressed.

  In the prior art of Patent Document 1, since the stress applied to the solder joint is relaxed by providing the neck portion, it is difficult to flow a large current because the current path becomes narrow. However, the electrode terminal member 14 is provided with a plurality of slits 26 in order to make the electrode terminal member 14 easy to twist, but the slits 26 are two vertical surfaces located across the horizontal surface 25 defined by the bent portion 23. 24 respectively. Therefore, the width of the current path can be increased without increasing the distance between the first connection portion 15 and the second connection portion 18, and the amount of heat generated is larger than that of the configuration of Patent Document 1 even when a large current is passed. Less.

  In addition, the noise reduction effect varies depending on the distance from the ground (GND) of the electrode terminal member 14 parallel to the substrate 12. And when the electrode terminal member 14 of the same length is bent at one place as shown in FIG. 3 (a) and the case where it is bent at three places as shown in FIG. 3 (b), When bending is performed at three locations, that is, when the distance from the ground (GND) in the portion parallel to the substrate 12 is closer, the noise becomes lower.

According to this embodiment, the following effects can be obtained.
(1) The electrode terminal member 14 constituting the terminal structure includes a first connection portion 15 connected to the substrate 12 with solder 16 and a second connection portion 17 fixed substantially parallel to the substrate 12 to a fixing portion 17 separated from the substrate 12. Since there are three or more bent portions 23 between the connecting portions 18, the stress in the direction perpendicular to the substrate 12 can be relaxed, and the stress applied to the solder joint portions can be reduced. Further, the strength against vibration in the direction perpendicular to the substrate 12 is improved. Further, the width of the current path can be increased compared to the case where the neck portion is provided, and a large current can flow. Furthermore, noise can be reduced as compared with the case where there is one bending portion 23 in the portion of the electrode terminal member 14 that is erected from the substrate 12.

  (2) Since the electrode terminal member 14 has one or more slits 26 extending substantially parallel to the substrate 12, when a force in a plane direction substantially parallel to the substrate 12 is applied, the electrode terminal member 14 is It becomes easy to twist, stress can be relieved by twisting, and the stress to a solder joint part can be reduced.

  (3) The slit 26 is provided on the vertical surface 24 extending in a direction orthogonal to the substrate 12 in a state where the electrode terminal member 14 is connected to the substrate 12. Therefore, compared with the case where the slit 26 is provided in a portion (lateral surface 25) substantially parallel to the substrate 12, more stress is applied when force is applied to the electrode terminal member 14 in a surface direction substantially parallel to the substrate 12. Can be relaxed.

  (4) Four bending portions 23 are provided, and one slit 26 is provided on each of the two vertical surfaces 24 continuous to the horizontal surface 25 sandwiched between the two bending portions 23. Therefore, even when a force perpendicular to the substrate 12 is applied to the electrode terminal member 14 or when a force is applied substantially parallel to the substrate 12, the stress can be effectively relieved. Further, it becomes easy to increase the distance between the slits, and it becomes easy to widen the width of the current path.

  (5) The second connecting portion 18 is formed with a hole 18a through which the screw 19 can be inserted, and the second connecting portion 18 is fixed to the fixing portion 17 via the screw 19 inserted through the hole 18a. Therefore, compared with the case where the 2nd connection part 18 is fixed to the fixing | fixed part 17 by resistance welding or soldering, the 2nd connection part 18 can be fixed accurately and easily.

  (6) In the second connection portion 18, the male connection terminal 28 into which the female connection terminal 27 can be fitted has a connection surface 29 extending so as to form a right angle with the second connection portion 18 through the bent portion 29 a. On the other hand, it is formed so as to be continuous through the bent portion 29b. Therefore, the male connection terminal 28 having the same potential as that of the second connection portion 18 can be provided more easily than separately provided.

  (7) The first connection portion 15 is connected to the substrate 12 via the solder 16 in a state along the substrate 12, that is, is surface-mounted. Therefore, it is not necessary to form a hole as compared with the configuration in which the first connection portion 15 is inserted into the hole formed in the substrate 12 and connected by the solder 16, and the substrate 12 is brought into contact with the housing 11. The first connecting portion 15 does not hinder when placing in the state.

  (8) When manufacturing the electronic device 10, the electrode terminal member 14 extends from the second connection portion 18 on the side opposite to the terminal member main body side and cooperates with the first connection portion 15 as the electrode terminal member 14. A holding part 30 that can be held in a state is connected in a detachable manner. In the connecting step of soldering the electrode terminal member 14 to the substrate 12, the first connecting portion 15 is brought into contact with the solder 16 applied on the substrate 12, and the holding portion 30 is separated from the substrate 12 by a jig 31. In this state, the electrode terminal member 14 is self-supported, and in this state, the solder is melted to connect the electrode terminal member 14 to the substrate 12. Therefore, when applying the cream solder on the substrate 12, a special structure is provided such that the support part supporting the electrode terminal member 14 does not interfere with the application device during the melting process of the solder so that the support part is moved to the retracted position. No simple jigs can be used. Since the holding part 30 is separated and removed from the second connection part 18 in the removing process after the connecting process, there is no possibility that the subsequent process will be hindered.

  (9) Since the lower end of the holding portion 30 is formed to be lower than the lower surface of the substrate 12 in a state where the first connection portion 15 is placed on the substrate 12, the portion that supports the holding portion 30 is It can be supported at a position lower than the lower surface of the substrate 12. Therefore, the formation position of the concave portion 31a into which the lower end of the holding portion 30 is inserted as the jig 31 can be provided on the same plane as the placement surface of the substrate 12, and the formation position of the concave portion 31a is formed one step higher than the placement surface. Compared with the case where it does, the structure of the jig | tool 31 becomes simple.

The embodiment is not limited to the above, and may be embodied as follows, for example.
The number of slits 26 is not limited to two, but may be three or more or one. Further, the ratio of the length of the slit 26 to the width of the electrode terminal member 14 is not limited to the above embodiment and may be changed as appropriate. If the number of the slits 26 is increased, the electrode terminal member 14 is easily twisted. Therefore, when the second connection portion 18 is fixed to the fixing portion 17, the stress applied to the solder joint portion of the first connection portion 15 can be reduced. However, the width of the current path flowing through the electrode terminal member 14 is reduced. Moreover, since the electrode terminal member 14 is easily twisted if the slit 26 is lengthened, the stress applied to the solder joint portion of the first connection portion 15 can be reduced, but the width of the current path flowing through the electrode terminal member 14 is narrow. Become. Therefore, the number and length of the slits 26 are determined by the balance between the necessary stress relaxation effect and the width of the current path. Then, an appropriate value is set by performing a simulation or performing a preliminary test.

The formation position of the slit 26 is not limited to the vertical surface 24 but may be provided on the horizontal surface 25 or may be provided on both the vertical surface 24 and the horizontal surface 25. However, it is preferable to provide the vertical surface 24.
The position of the male connection terminal 28 is not limited to the same height as the horizontal surface 25, and may be provided to have a height different from that of the horizontal surface 25.

  The first connection portion 15 is not limited to the configuration connected to the substrate 12 via the solder 16 in a state along the substrate 12, but is configured to be inserted into the insertion hole formed in the substrate 12 and connected by the solder 16. Also good.

  The number of bending portions may be three or more so that at least one lateral surface 25 exists between the first connection portion 15 and the second connection portion 18. If the number of the bent portions 23 is increased, when the electrode terminal member 14 is bonded to the substrate 12, even if the height of the second connecting portion 18 is low, a wide current path is ensured when a plurality of slits 26 are provided. can do. Therefore, when it is necessary to reduce the height of the fixed portion 17 due to the layout, it can be easily handled by changing the number and interval of the bent portions 23. However, it is preferable that four or more bent portions 23 are provided, two or more slits 26 are provided, and two or more bent portions 23 exist between the slits 26.

The location where the second connecting portion 18 of the electrode terminal member 14 is fixed is not limited to a surface substantially parallel to the substrate 12, but may be a surface perpendicular to the substrate 12 or an inclined surface.
○ The male connection terminal 28 may be omitted.

  O Fixation of the second connecting portion 18 to the fixing portion 17 is not limited to fixing with the screw 19 but may be fixed by resistance welding or soldering. In these cases, instead of providing the fixing portion 17 with the screw hole 17a, a resistance welded portion or a soldered portion is provided so as to be exposed on the upper surface of the fixing portion 17. Even when the second connecting portion 18 is fixed by resistance welding or soldering. The second connecting portion 18 needs to be positioned at an appropriate position and fixed to the resistance welded portion or the soldered portion. At that time, a force in a plane direction substantially parallel to the substrate 12 is applied to the electrode terminal member 14, and a compressive force or a tensile force is applied. However, due to the presence of the bent portion 23 and the slit 26, the stress applied to the solder joint portion is relieved.

The electronic device 10 may include a plurality of electrode terminal members 14.
The holding unit 30 is not limited to a single plate shape, and may be, for example, a rod shape, a narrow plate shape, or a mixture of a rod shape and a plate shape.

  The length of the holding unit 30 is formed so that the lower end of the holding unit 30 is at the same height as the lower surface of the substrate 12 or higher than the lower surface when the first connection unit 15 is placed on the substrate 12. Also good.

The following technical idea (invention) can be understood from the embodiment.
(1) An electrode terminal member comprising a first connection portion connectable to a substrate by solder and a second connection portion that can be fixed to a portion having a height different from the connection surface of the substrate, wherein the first connection portion There are three or more bent portions between the first connecting portion and the second connecting portion, and one or more slits are provided, and the second connecting portion is provided with an electrode in cooperation with the first connecting portion. The electrode terminal member to which the holding | maintenance part which can hold | maintain a terminal member in a self-supporting state is connected so that disconnection is possible.

  (2) The electrode terminal member is bent so that the distance from the ground (GND) is closer than the distance from the ground (GND) to the second connection portion fixed substantially parallel to the substrate and noise is reduced. It has.

  (3) In the invention described in the technical idea (1), the lower end of the holding portion is formed to be lower than the lower surface of the substrate in a state where the first connection portion is placed on the substrate.

The partial schematic perspective view of the electronic device of one Embodiment. The perspective view of the electrode terminal member before removing a holding | maintenance part. (A), (b) is a schematic diagram explaining an effect | action. (A) is a top view of the board connection member of a prior art, (b) is a front view of a board connection member, (c) is a partial side view of an electronic device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Electronic device, 12 ... Board | substrate, 14 ... Electrode terminal member, 15 ... 1st connection part, 16 ... Solder, 17 ... Fixed part as a location away from a board | substrate, 18 ... 2nd connection part, 18a ... Hole, 19 ... Screw, 23, 29a, 29b ... Bending part, 26 ... Slit, 27 ... Female connection terminal, 28 ... Male connection terminal, 29 ... Connection surface.

Claims (7)

An electronic device having a terminal structure in which the first connection portion on one end side of the electrode terminal member is connected to the substrate by solder and the second connection portion on the other end side is fixed at a position away from the substrate,
The electrode terminal member has three or more bent portions between the first connection portion and the second connection portion, and is provided with one or more slits extending substantially parallel to the substrate. Electronic equipment.   The electronic device according to claim 1, wherein the second connection portion is fixed substantially parallel to the substrate.   The electronic device according to claim 1, wherein the slit is provided on a surface extending in a direction orthogonal to the substrate in a state where the electrode terminal member is connected to the substrate.   4. The electron according to claim 1, wherein four or more bent portions are provided, two or more slits are provided, and two or more bent portions exist between the slits. 5. machine.   Four bending portions are provided, two slits are provided, two bending portions are provided inside the two slits, and one bending portion is provided outside the slit. The electronic device according to claim 4.   The said 2nd connection part is formed with the hole which can insert a screw | thread, and the said 2nd connection part is fixed to the said location via the screw | thread penetrated by the said hole. The electronic device according to one item.   A male connection terminal capable of fitting a female connection terminal is formed in the second connection part so as to be continuous via a connection surface extending at right angles to the second connection part via a bent part. The electronic device according to claim 1, wherein the electronic device is used.

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