JP2007266486A - Transfer method of object to be transferred using temporary transfer substrate, manufacturing method of thin-film device, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique capable of shortening a processing time required for transfer on forming a thin-film device using a transfer technique. <P>SOLUTION: This method includes a step of joining via an adhesive a first substrate on which an object to be transferred is formed on one surface side via a first peeling layer, to a temporary transfer substrate having a plurality of through-holes on which a second peeling layer is provided on one surface side; step of causing peeling by giving energy to the first peeling layer, and transferring the object to be transferred to the temporary transfer substrate; step of joining the temporary transfer substrate to the second substrate; step of sealing the plurality of through-holes with a light-shielding material during each of the steps; step of causing peeling by giving optical energy to the second peeling layer from the other surface side of the temporary transfer substrate; step of removing the light-shielding material; and step of removing the adhesive by supplying a solvent to the adhesive through the plurality of through-holes of the temporary transfer substrate, and transferring the object to the second substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an improvement in transfer technology for thin film devices.

As a method for forming a laminated body such as a semiconductor element, a technique using a transfer technique is known. For example, in Japanese Patent Application Laid-Open No. 10-125929 (Patent Document 1) or Japanese Patent Application Laid-Open No. 10-125930 (Patent Document 2), a transfer material such as a thin film transistor is formed on a manufacturer substrate in advance via a release layer. Then, a method is disclosed in which the transferred layer including the transferred object is bonded to the temporary transfer substrate, and the release layer is irradiated with light to cause peeling, thereby transferring the transferred object to the temporary transfer substrate. . According to this method, multiple types of thin film elements and thin film circuits with different manufacturing conditions are formed on a temporary transfer substrate under optimum conditions, and then moved to an arbitrary transfer destination substrate. The desired electronic device can be manufactured.
Japanese Patent Laid-Open No. 10-125929 JP-A-10-125930

  In the technique using the transfer technique described above, an adhesive that is soluble in a solvent such as water (for example, water-soluble) is used so that the transfer object can be temporarily held on the temporary transfer substrate so that it can be removed in a later step. Adhesive). At the time of the second transfer, the transfer destination substrate and the transfer object are joined with a water-insoluble adhesive, and then the water-soluble adhesive interposed between the transfer object and the temporary transfer substrate is dissolved with water. , Had been removed. However, in the process of removing the water-soluble adhesive, water is infiltrated and dissolved from the outer periphery of the joined body of the transfer destination substrate and the temporary transfer substrate through the gap between the two, for example. The area that can be contacted with water is small, and it takes a long time to dissolve the water-soluble adhesive.

  Therefore, an object of the present invention is to provide a technique capable of shortening the processing time required for transfer when forming a thin film device using the transfer technique.

  In order to achieve the above object, according to the present invention, a first substrate on which a transfer target is formed via a first release layer on one side and a second release layer on one side are provided. A temporary transfer substrate composed of a light-transmitting substrate and having a plurality of through-holes is bonded via a solvent-soluble adhesive in a direction in which the transfer target and the second release layer face each other. A first step, and a second step of transferring the transfer object from the first substrate to the temporary transfer substrate by causing the release by applying energy to the first release layer of the first substrate. A third step of bonding the temporary transfer substrate and the second substrate such that one surface of the temporary transfer substrate and one surface of the second substrate face each other, and the first step to the third step. A fourth step of selectively closing each of the plurality of through-holes of the temporary transfer substrate with a light-shielding material during or before or after A fifth step of causing peeling by selectively applying light energy to the second release layer from the other surface side of the temporary transfer substrate, a sixth step of removing the light-shielding material, and the temporary transfer A seventh step of removing the adhesive by supplying a solvent to the adhesive through a plurality of through holes of the substrate and transferring the transferred object from the temporary transfer substrate to the second substrate; A transfer method of a transfer object using a temporary transfer substrate is also provided.

  According to this, since the plurality of through-holes of the temporary transfer substrate are closed with a light-shielding material, there is an influence such as deterioration due to light energy on the transfer target provided in the lower layer during the second transfer. Therefore, it is possible to selectively apply light energy to the peeling layer of the temporary transfer substrate to cause peeling. Further, the light-shielding material is removed, and an adhesive that joins the temporary transfer substrate and the second substrate (hereinafter, also referred to as temporary adhesive) is exposed in the plurality of through holes, so that it can come into contact with the solvent. Since the area can be remarkably increased, the time for removing the adhesive can be greatly shortened. Therefore, it is possible to reduce the transfer time and increase the efficiency of a transfer object such as a thin film circuit, which is not affected by light energy.

  Here, the material to be transferred is not limited, but includes, for example, a thin film transistor, a thin film resistor, a capacitor, an inductor, a circuit wiring, a thin film circuit (layer) including these, an integrated circuit, a microdevice, etc. Thin film element).

  Preferably, the light-shielding material is soluble in the solvent, and the sixth step and the seventh step are performed simultaneously by immersing in the solvent. According to this, it is possible to simultaneously remove the light-shielding material and the temporary adhesive by a simple method by being immersed in a solvent. Moreover, since peeling has occurred in the release layer, the penetration of the solvent from the outer periphery of the substrate is further promoted. Furthermore, after the light-shielding material is dissolved, the temporary adhesive dissolves not only from the outer periphery of the substrate but also through the through-holes, so that the processing time can be further shortened.

  Preferably, the light-shielding material is a paint, and the fourth step is selected by printing from the other surface side of the temporary transfer substrate during or before or after the first step to the third step. In other words, it is a step of applying and / or filling a plurality of through holes. This makes it possible to easily and selectively close the plurality of through holes. Each through hole only needs to be blocked to the extent that light can be shielded, and it is not always necessary to fill the entire through hole with a light shielding material. Therefore, only the upper part of the through hole may be closed.

  Another embodiment of the present invention is a light-transmitting substrate in which a transfer substrate is formed on one surface side via a first release layer, and a second release layer is provided on one surface side. And a temporary transfer substrate having a plurality of through-holes, in a direction in which the transferred object and the second release layer are opposed to each other via a solvent-soluble adhesive, A second step of transferring the transfer object from the first substrate to the temporary transfer substrate by causing energy to be applied to the first release layer of the first substrate; and the temporary transfer substrate. A third step of bonding the temporary transfer substrate and the second substrate such that one side of the second substrate faces the other side of the second substrate, and between the first step and the third step, or Before and after, the light-shielding material is selectively placed on the other side of the temporary transfer substrate at positions corresponding to the plurality of through holes. A fourth step of covering with the placed translucent sheet, a fifth step of causing separation by selectively applying light energy to the second release layer from the other side of the temporary transfer substrate, A sixth step of removing the light-sensitive sheet from the second substrate; and removing the adhesive by supplying a solvent to the adhesive through a plurality of through holes of the temporary transfer substrate; And a seventh step of transferring from the temporary transfer substrate to the second substrate. The present invention provides a transfer method of a transfer object using the temporary transfer substrate.

  According to this, since the temporary transfer substrate is covered with the light-transmitting sheet in which the light-shielding material is selectively disposed at the position corresponding to the through hole in advance, the covering provided in the lower layer is performed during the second transfer. It is possible to more easily avoid the influence of deterioration or the like due to light energy on the transfer body, and selectively apply light energy to the peeling layer of the temporary transfer substrate to cause peeling. Further, by removing the translucent sheet, it is possible to easily expose the temporary adhesive into the plurality of through holes, thereby significantly increasing the contact area with the solvent. The removal time can be greatly shortened. Therefore, it is possible to further reduce the transfer time and increase the efficiency of the transfer object such as a thin film circuit, which dislikes the influence of light energy.

  Further, instead of the fourth step, an eighth step of covering the other surface side of the temporary transfer substrate with a translucent sheet between or before and after the first step to the third step, and the light transmitting A ninth step of selectively disposing a light-shielding material at a position corresponding to each of the plurality of through holes of the conductive sheet.

  Preferably, the light-shielding material is a paint, and the ninth step is a step of applying the paint by printing. According to this, it becomes possible to easily dispose the light shielding material at positions corresponding to the plurality of through holes.

  Preferably, the seventh step is performed by immersing in the solvent. According to this, since the dissolution of the temporary adhesive proceeds simultaneously from the outer periphery and the through hole of the substrate, the processing time can be further shortened. In addition, since peeling occurs in the peeling layer, the penetration of the solvent from the outer periphery of the substrate is promoted, and the processing time can be further shortened.

  The method for manufacturing a thin film device of the present invention uses any of the above-described transfer methods for a transfer target. Therefore, the manufacturing time can be shortened and a thin film device can be manufactured with a high yield.

  An electronic apparatus according to the present invention includes a thin film device manufactured by the method for manufacturing a thin film device. According to this, since the thin film device manufactured using the transfer technique with high reliability and shortening of the processing time is used, it is possible to expect the cost reduction and the improvement of the reliability of the electronic apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
The present embodiment will be described with reference to FIGS. 1 to 4 by taking a method of manufacturing a thin film device as an example. 2 to 4 are process diagrams for explaining the method of manufacturing the thin film device of this embodiment, and FIG. 1 is a top view of the temporary transfer substrate for explaining the light energy application process of the present invention. It is. FIG. 3B corresponds to a cross-sectional view in the AA ′ direction in FIG.

  As shown in FIG. 2A, a release layer 14 (first release layer) is formed on one side of a transfer source substrate 12 (first substrate). As the transfer source substrate 12, a substrate having an appropriate thickness and made of a heat resistant material is used. Specifically, for example, a material made of a material that can withstand a process temperature of about 350 ° C. to 1000 ° C. that is a process temperature of a semiconductor device, for example, quartz glass or soda glass is used. Moreover, it is desirable that the transfer source substrate 12 is transparent with respect to the wavelength of light to be irradiated so that light energy can be applied to the release layer 14 in a later step. Moreover, as the peeling layer 14, what has the characteristic which produces peeling by receiving energy provision, such as light irradiation, is used. Examples of the peeling layer 14 include a semiconductor film such as an amorphous silicon film, a metal film, a conductive oxide film, a conductive polymer film, and a conductive ceramic film. The method for forming the release layer 14 is not particularly limited, and can be formed by a known method such as various vapor deposition methods such as CVD and sputtering, a plating method, and a coating method.

  As shown in FIG. 2B, a transfer layer 16 including a plurality of transfer objects 16 a is formed on the release layer 14. Each transferred body 16a includes, for example, a plurality of thin film elements (for example, thin film transistors), wirings, and the like.

  Further, as shown in the figure, between the surface on the release layer 22 (second release layer) side of the temporary transfer substrate 20 having a plurality of through holes 26 and the surface on the transfer target layer 16 side of the transfer source substrate 12. The temporary transfer substrate 20 and the transfer source substrate 12 are joined to each other by interposing a temporary adhesive 18 (a solvent-soluble adhesive) such as a water-soluble adhesive.

  The temporary transfer substrate 20 includes a translucent substrate 24 that is transparent with respect to the wavelength of light irradiated on the release layer 22 in a later step, and a release layer 22 provided on one side thereof. Since the light-transmitting substrate 24 does not need to have special heat resistance, various substrates such as a glass substrate and a plastic substrate can be used. In addition, the temporary transfer substrate 20 is provided with a plurality of through holes 26 penetrating the translucent substrate 24 and the release layer 22. The number and diameter of each through hole 26 are not particularly limited and can be determined as appropriate. The diameter of each through hole 26 is set to about 1 μm to 1 mm, for example. Such a through hole 26 can be formed using, for example, a photolithography technique, an etching technique, a laser processing technique, or the like.

  As shown in FIG. 2C, energy is applied to the release layer 14 of the transfer source substrate 12 to cause peeling at the interface between the release layer 14 and the transfer source substrate 12 or in the layer of the release layer 14. .

  Specifically, as shown in the figure, the release layer 14 is irradiated with laser light L1 through the transfer source substrate 12 to cause laser ablation in the release layer 14. Here, the ablation means that a solid material that absorbs irradiated light (a constituent material of the peeling layer 14) is photochemically or thermally excited, and its surface or internal atoms or molecules are cut and released. It appears mainly as a phenomenon in which all or part of the constituent material of the release layer 14 undergoes a phase change such as melting or transpiration (vaporization). In addition, a phase change may result in a fine foamed state, which may reduce the bonding force.

  As a result, as shown in FIG. 2D, the transferred layer 16 is separated from the transfer source substrate 12 and transferred to the temporary transfer substrate 20 side.

  Next, as shown in FIG. 3A, the temporary transfer is performed so that one surface of the temporary transfer substrate 20 where the transfer target layer 16 exists and one surface of the transfer destination substrate 32 (second substrate) face each other. The substrate 20 and the transfer destination substrate 32 are bonded via an adhesive 34. As the adhesive 34 used in this step, a permanent adhesive is used, and preferable examples thereof include a reaction curable adhesive, a thermosetting adhesive, and a photocurable adhesive (for example, an ultraviolet curable adhesive). ), Anaerobic curable adhesives and the like. The composition of the adhesive may be any of epoxy, acrylate, and silicone.

  As shown in FIG. 3B, each through hole 26 is selectively closed with a light shielding material 40 (see FIG. 1). Here, as the light-shielding material 40, a material that can be shielded by absorbing and / or reflecting light energy applied to the release layer 22 in a later step is used. Moreover, it is preferable that it is a material soluble with respect to the solvent which melt | dissolves a temporary adhesive in the process of dissolving a temporary adhesive later. Thereby, it becomes possible to remove the light-shielding material 40 at the same time in the process of dissolving the temporary adhesive later, and the process can be simplified.

  Each through-hole 26 only needs to be blocked by the light-shielding material 40 to the extent that light does not enter the through-hole 26 in a later step, and the entire through-hole 26 is necessarily filled with the light-shielding material 40. There is no. Therefore, only the upper part of each through hole 26 may be covered with the light shielding material 40.

  As such a light shielding material 40, for example, a paint can be used. The paint may be either a dye or a pigment. The hue of the paint is not particularly limited, but each system color such as red, green, blue, brown, purple, and black is preferably used. In particular, when a paint containing carbon particles typified by carbon black is used, light in a wide wavelength range can be absorbed. Moreover, as the light-shielding material 40, for example, a material obtained by mixing the above paint with a material that can be removed in a subsequent process such as a water-soluble adhesive may be used.

  The light shielding material 40 is not particularly limited, but the through holes 26 can be selectively applied and / or filled by a printing technique such as screen printing. This is preferable because selective application and / or filling can be easily performed. Note that the adhesive 18 may enter the through hole 26 in the process of joining the temporary transfer substrate 20 and the transfer source substrate 12 described above. It is possible to close the through hole 26 by applying a paint to the surface. However, when the adhesive 18 does not enter the through hole 26 and cannot be applied, it is preferable to fill the through hole 26 with a paint.

  As shown in FIG. 3C, light energy is applied to the release layer 22 from the surface side (the other surface side) of the temporary transfer substrate 20 where the transfer target layer 16 does not exist, thereby causing the release layer 22 to peel off. Specifically, the laser ablation is performed on the interface between the release layer 22 and the light-transmitting substrate 24 or in the layer of the release layer 22 by irradiating the release layer 22 with the laser light L2 through the light-transmitting substrate 24. Cause it to occur.

  As shown in FIG. 4A, the joined body 50 of the transfer destination substrate 32 and the temporary transfer substrate 20 where peeling has occurred is placed in a tank 42 containing a solvent 44 capable of dissolving the adhesive 18. Soak. Specifically, for example, when a water-soluble adhesive is used as the adhesive 18, the joined body 50 is immersed in a water tank containing water. By immersing the entire bonded body 50 in the solvent 44, the adhesive 18 and the light-shielding material 40 can be removed at the same time. In addition, since peeling occurs in the peeling layer 22 of the bonded body 50, penetration of the solvent between the transfer destination substrate 32 and the temporary transfer substrate 20 is promoted, and further, when the light shielding material 40 is removed, Since the solvent permeates through the opened through hole 26, the dissolution of the adhesive 18 is further promoted. Thereby, the melt | dissolution processing time of the adhesive agent 18 is shortened further.

  Instead of immersing the entire bonded body 50 in the solvent, only the other surface side of the temporary transfer substrate 20 may be immersed in the solvent so that the solvent advances only in the through hole 26. Alternatively, the light-shielding material 40 may be removed by spraying the solvent from the other surface side of the temporary transfer substrate 20 while applying pressure, and the solvent may be introduced into each opened through hole 26. When the solvent is supplied through each through hole 26 and the adhesive 18 is dissolved and removed, the temporary transfer substrate 20 is separated from the transfer destination substrate 32.

  As shown in FIG. 4B, the transfer target layer 16 is transferred from the temporary transfer substrate 20 to the transfer destination substrate 32 (for example, a flexible resin substrate), and a transfer target is formed on the transfer destination substrate 32. Will be.

  According to the present embodiment, since the plurality of through holes of the temporary transfer substrate are closed with a light-shielding material, the thin film element (transfer object) provided in the lower layer is affected by light energy during the second transfer. It is possible to selectively give light energy to the peeling layer of the temporary transfer substrate without causing the peeling to cause peeling. Further, the light-shielding material is removed, and an adhesive that joins the temporary transfer substrate and the second substrate (hereinafter, also referred to as temporary adhesive) is exposed in the plurality of through holes, so that it can come into contact with the solvent. Since the region (area) can be remarkably increased, the time for removing the adhesive can be greatly shortened. Therefore, it is possible to reduce the transfer time and increase the efficiency of a transfer object such as a thin film circuit, which is not affected by light energy.

  In the above example, each through-hole 26 is closed with the light-shielding material 40 after the temporary transfer substrate 20 and the transfer destination substrate 32 are joined. Any time before the step of applying light energy to the layer 14 may be used.

(Second Embodiment)
In the first embodiment, each through hole 26 is individually covered with the light-shielding material 40, but in this embodiment, as shown in FIGS. 5A and 5B, it corresponds to each through hole 26 in advance. Before the step (refer to the step of FIG. 3 (C)) of applying light energy to the peeling layer 14 to cause peeling using the light-transmitting sheet 60 in which the light-shielding materials 62 are respectively disposed at the positions where By covering the other surface side of the temporary transfer substrate 20, it is possible to avoid the influence of light energy on the transfer target 16a provided in the lower layer.

  The thin film device manufacturing method according to the present embodiment uses a light-transmitting sheet 60 in which a light-shielding material 62 is previously arranged at a position corresponding to each through-hole 26 instead of individually applying the light-shielding material 40 and peeling. Except for removing the translucent sheet 60 after applying light energy to the layer 14, it can be performed in the same process as in the first embodiment.

  The translucent sheet 60 is transparent to the wavelength of light to be irradiated later, so that light energy can be selectively imparted to the release layer 14 in a later step, except for the region where the light shielding material 62 is disposed. What consists of material is used. As the light shielding material 62, the same material as described above is used.

  According to this embodiment, since the translucent sheet 60 in which the translucent material 62 is arranged in advance at a predetermined position is used, when light energy is applied to the release layer 14 by a simpler method, it is provided in the lower layer. It is possible to protect the thin film element (transfer object) from the influence of light energy. In addition, since each through-hole 26 can be exposed by simply removing the translucent sheet 60 before supplying the solvent to each through-hole 26, the working time can be further shortened and made more efficient. It becomes possible.

  Instead of using the light-transmitting sheet 60 on which the light-shielding material 62 is previously disposed, the light-transmitting sheet 60 on which the light-shielding material 62 is not disposed is once placed on the temporary transfer substrate 20 and then light-shielded. The property material 62 may be disposed at a position corresponding to each through hole 26.

  The present invention is not limited to the contents of the above-described embodiments, and various modifications can be made within the scope of the gist of the present invention.

  For example, the number, size, and distribution of the through holes 26 in the temporary transfer substrate 20 can be made to correspond to the arrangement pattern of the transfer object on the transfer source substrate. More specifically, for example, the position of the through-hole 26 may be provided at a position corresponding to a region other than the region where the transfer target 16a is formed, whereby the temporary transfer substrate 20 and the transfer destination substrate 32 When the through holes 26 are positioned on the transfer target body 16a at the time of joining, it is possible to avoid variations in the pressure distribution applied to the transfer target body 16a, and to avoid bending and distortion of the transfer target body 16a. be able to.

  In the above-described embodiment, the case where a water-soluble adhesive is used as an example of a liquid-soluble adhesive and water is used as a solvent has been described. However, the scope of application of the present invention is not limited thereto. Any adhesive that can be dissolved and removed using any solvent can be adopted as a solvent-soluble adhesive.

  Next, an example of an electronic apparatus including a thin film device manufactured by the manufacturing method described above will be described. The thin film device according to the present embodiment can be applied to the manufacture of a liquid crystal display panel, an electroluminescence display panel, and the like that constitute a display unit, a circuit unit, and the like in various electronic devices.

  FIG. 6 is a schematic perspective view illustrating an example of an electronic device. FIG. 6A shows an application example to a mobile phone, and the mobile phone 530 includes an antenna portion 531, an audio output portion 532, an audio input portion 533, an operation portion 534, and a display portion 535.

  FIG. 6B shows an application example to a video camera. The video camera 540 includes an image receiving unit 541, an operation unit 542, an audio input unit 543, and a display unit 544.

  FIG. 6C illustrates an example of application to a television device. The television device 550 includes a display portion 551.

  FIG. 6D illustrates an application example to a roll-up television device, and the roll-up television device 560 includes a display portion 561. Further, the thin film device according to the present invention is not limited to the above-described example, and can be applied to various electronic devices. For example, in addition to these, it can also be used for a fax machine with a display function, a finder for a digital camera, a portable TV, an electronic notebook, an electric bulletin board, a display for advertisements, and the like.

FIG. 1 is a top view of a temporary transfer substrate for explaining the light energy application process of the present invention. FIG. 2 is a process diagram for explaining the thin film device manufacturing method of the present embodiment. FIG. 3 is a process diagram for explaining the thin film device manufacturing method of the present embodiment. FIG. 4 is a process diagram for explaining the thin film device manufacturing method of the present embodiment. FIG. 5 is an explanatory diagram for explaining the second embodiment. FIG. 5A is a top view of a joined body of a temporary transfer substrate and a transfer destination substrate on which a translucent sheet is placed, and FIG. 5B is a cross-sectional view in the BB ′ direction. FIG. 6 is an explanatory diagram illustrating an example of an electronic device using a thin film device.

Explanation of symbols

12 Transfer source substrate, 14 Release layer, 16 Transfer layer, 16a Transfer object, 18 Adhesive, 20 Temporary transfer substrate, 22 Release layer, 24 Translucent substrate, 26 Through hole, 32 Transfer destination substrate, 34 Adhesive 40 light-shielding material, 42 tanks, 44 solvent, 50 joined body, 60 translucent sheet, 62 light-shielding material, 530 mobile phone, 540 video camera, 550 television device, 560 roll-up television device, L1 laser Light, L2 laser light

Claims (9)

A plurality of through-holes composed of a first substrate having a transfer member formed on one surface side via a first release layer and a translucent substrate having a second release layer provided on one surface side A first step of bonding a temporary transfer substrate having holes to each other via a solvent-soluble adhesive in a direction in which the transfer target and the second release layer face each other;
A second step of causing peeling by applying energy to the first peeling layer of the first substrate, and transferring the transferred object from the first substrate to the temporary transfer substrate;
A third step of bonding the temporary transfer substrate and the second substrate such that one surface of the temporary transfer substrate and one surface of the second substrate face each other;
A fourth step of selectively closing each of the plurality of through holes of the temporary transfer substrate with a light-shielding material during or before or after the first step to the third step;
A fifth step of causing peeling by selectively applying light energy to the second peeling layer from the other surface side of the temporary transfer substrate;
A sixth step of removing the light-shielding material;
The adhesive is removed by supplying a solvent to the adhesive through the plurality of through holes of the temporary transfer substrate, and the transfer object is transferred from the temporary transfer substrate to the second substrate. Process,
And a transfer method of a transfer object using a temporary transfer substrate.   2. The transfer method of a transfer object according to claim 1, wherein the light-shielding material is soluble in the solvent, and the sixth step and the seventh step are simultaneously performed by immersing in the solvent.   The light-shielding material is a paint, and the fourth step is selectively performed by printing from the other surface side of the temporary transfer substrate between the first step and the third step or before and after the fourth step. The method for transferring a transfer object according to claim 1 or 2, wherein the through hole is applied and / or filled. A plurality of through-holes are formed of a first substrate having a transfer member formed on one surface side via a first release layer and a translucent substrate having a second release layer provided on one surface side. A first step of bonding a temporary transfer substrate having a first and second transfer layers and a second release layer facing each other via a solvent-soluble adhesive;
A second step of causing peeling by applying energy to the first peeling layer of the first substrate, and transferring the transferred object from the first substrate to the temporary transfer substrate;
A third step of bonding the temporary transfer substrate and the second substrate such that one surface of the temporary transfer substrate and one surface of the second substrate face each other;
A light-transmitting material in which a light-shielding material is selectively disposed on the other surface side of the temporary transfer substrate at positions corresponding to the plurality of through-holes during or before and after the first step to the third step. A fourth step of covering with an adhesive sheet;
A fifth step of causing peeling by selectively applying light energy to the second peeling layer from the other surface side of the temporary transfer substrate;
A sixth step of removing the translucent sheet from the second substrate;
The adhesive is removed by supplying a solvent to the adhesive through the plurality of through holes of the temporary transfer substrate, and the transfer object is transferred from the temporary transfer substrate to the second substrate. Process,
And a transfer method of a transfer object using a temporary transfer substrate.   Instead of the fourth step, an eighth step of covering the other surface side of the temporary transfer substrate with a translucent sheet during or before and after the first step to the third step, and the translucent sheet And a ninth step of selectively disposing a light-shielding material at a position corresponding to each of the plurality of through-holes.   The method for transferring a transfer object according to claim 5, wherein the light-shielding material is a paint, and the ninth step is a step of applying the paint by printing.   The method for transferring a transfer object according to claim 4 or 5, wherein the seventh step is carried out by immersing in the solvent.   The manufacturing method of the thin film device using the transfer method of the to-be-transferred body in any one of Claims 1-7. The electronic device comprised including the thin film device manufactured by the manufacturing method of the thin film device of Claim 8.

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