JP2007266445A - Light emitting device and lighting device using same - Google Patents

Light emitting device and lighting device using same Download PDF

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JP2007266445A
JP2007266445A JP2006091519A JP2006091519A JP2007266445A JP 2007266445 A JP2007266445 A JP 2007266445A JP 2006091519 A JP2006091519 A JP 2006091519A JP 2006091519 A JP2006091519 A JP 2006091519A JP 2007266445 A JP2007266445 A JP 2007266445A
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light emitting
light
emitting device
optical member
emitting element
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Shingo Matsuura
真吾 松浦
Toru Miyake
徹 三宅
Hiroki Mori
裕樹 森
Tomoya Tabuchi
智也 田淵
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Kyocera Corp
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Kyocera Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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Abstract

<P>PROBLEM TO BE SOLVED: To improve optical characteristics of a light emitting device by improving position accuracy of an optical member. <P>SOLUTION: The light emitting device has a base 1, a light emitting element 2 mounted on the base 1, an optical member 3 which is arranged above the light emitting element 2 and has a projection 3a in contact with the base 1 and a translucent member 4 which is provided between the base 1 and the optical member 3 and covers the light emitting element 2. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、発光素子を収納して成る発光装置およびそれを用いた照明装置に関し、より詳細には発光効率および配光特性に優れた発光装置およびそれを用いた照明装置に関する。   The present invention relates to a light emitting device in which a light emitting element is housed and a lighting device using the same, and more particularly to a light emitting device excellent in luminous efficiency and light distribution characteristics and a lighting device using the same.

従来の発光装置として、基体と、基体に導電性部材を介してフリップチップ実装された発光素子と、発光素子上に配置された光学部材と、発光素子と光学部材の間に設けられ、発光素子を覆う透光性部材とを備えたものがある。   As a conventional light emitting device, a base, a light emitting element flip-chip mounted on the base via a conductive member, an optical member disposed on the light emitting element, a light emitting element provided between the light emitting element and the optical member, There is a thing provided with the translucent member which covers.

透光性部材は、シリコーン樹脂等の透光性を有する樹脂であり、透光性部材により発光素子12が封止されているとともに光学部材が固定されている。   The translucent member is a resin having translucency such as a silicone resin, and the light emitting element 12 is sealed by the translucent member and the optical member is fixed.

近年、この様な発光装置は、表示用光源や照明用光源または紫外光用光源として利用され始めており、特に発光装置の発光効率および配光分布の安定性に対する要求が高まってきている。
特開2005−158949号公報
In recent years, such light emitting devices have begun to be used as display light sources, illumination light sources, or ultraviolet light sources, and in particular, there has been an increasing demand for light emission efficiency and stability of light distribution.
JP 2005-158949 A

しかしながら、従来の発光装置においては、透光性部材が硬化するまでの間に、光学部材が沈降または傾斜する可能性がある。また、透光性部材が硬化するまでの間に、光学部材が透光性部材より所望の位置から移動してしまう可能性がある。このように、従来の発光装置においては、光学部材の基体に対する高さ精度、または、光学部材の発光装置に対する位置精度を向上させることができなかった。その結果、発光素子の光軸と光学部材の光軸との間にズレが発生し、発光装置の配光分布が安定しないといった問題があった。   However, in the conventional light emitting device, there is a possibility that the optical member settles or tilts before the translucent member is cured. In addition, the optical member may move from a desired position from the translucent member before the translucent member is cured. As described above, in the conventional light emitting device, the height accuracy of the optical member relative to the base or the positional accuracy of the optical member relative to the light emitting device cannot be improved. As a result, there is a problem that a deviation occurs between the optical axis of the light emitting element and the optical axis of the optical member, and the light distribution of the light emitting device is not stable.

本発明は、上記従来の発光装置の問題点に鑑みてなされたものであり、その目的は、光学部材の位置精度を向上させて、発光装置の光学特性を向上させることにある。   The present invention has been made in view of the above problems of the conventional light emitting device, and an object of the present invention is to improve the positional accuracy of the optical member and improve the optical characteristics of the light emitting device.

本発明の発光装置は、基体と、該基体に搭載された発光素子と、該発光素子の上方に配置されており、前記基体に接した突起を有する光学部材と、前記基体と前記光学部材との間に設けられ、前記発光素子を覆う透光性部材とを備えている。   The light emitting device of the present invention includes a base, a light emitting element mounted on the base, an optical member disposed above the light emitting element and having a protrusion in contact with the base, the base and the optical member, And a translucent member that covers the light emitting element.

また、本発明の発光装置において、前記光学部材は、前記突起を複数有していることを特徴とする。   In the light emitting device of the present invention, the optical member has a plurality of the protrusions.

また、本発明の発光装置は、前記突起の側面と、前記光学部材の前記発光素子と相対する面とが成す角度が鈍角であることを特徴とするものである。   In the light-emitting device of the present invention, an angle formed between a side surface of the protrusion and a surface of the optical member facing the light-emitting element is an obtuse angle.

また、本発明の発光装置は、前記基体の前記発光素子の搭載面に凹部が形成されており、前記光学部材の前記突起の先端が前記凹部の底面に位置していることを特徴とするものである。   Further, the light emitting device of the present invention is characterized in that a recess is formed in the mounting surface of the light emitting element of the base, and the tip of the projection of the optical member is located on the bottom surface of the recess. It is.

また、本発明の照明装置は、本発明の発光装置と、該発光装置が搭載され、該発光装置を駆動する電気配線を有する駆動部と、前記発光装置から出射された光を反射する光反射手段とを備えている。   The lighting device of the present invention includes a light emitting device of the present invention, a drive unit on which the light emitting device is mounted, and an electric wiring that drives the light emitting device, and a light reflection that reflects light emitted from the light emitting device. Means.

本発明の発光装置は、光学部材が基体に接した突起を有していることにより、光学部材の基体に対する高さ精度、または、光学部材の発光装置に対する位置精度を向上させることができ、発光装置の配光分布の安定化を図ることができる。   The light emitting device of the present invention can improve the height accuracy of the optical member relative to the base or the positional accuracy of the optical member relative to the light emitting device because the optical member has a protrusion in contact with the base. It is possible to stabilize the light distribution of the apparatus.

また、本発明の発光装置は、光学部材が、突起を複数有していることにより、光学部材の基体に対する高さ精度、または、光学部材の発光装置に対する位置精度をさらに向上させることができる。   In the light emitting device of the present invention, since the optical member has a plurality of protrusions, the height accuracy of the optical member with respect to the base or the positional accuracy of the optical member with respect to the light emitting device can be further improved.

また、本発明の発光装置は、突起の側面と、光学部材の発光素子と相対する面とが成す角度が鈍角であることにより、基体と光学部材との間に透光性部材を充填するときに、気泡は溜まる可能性を低減させ、発光効率の安定化および配光分布の安定化を図ることができる。   In the light emitting device of the present invention, when the angle formed between the side surface of the protrusion and the surface of the optical member facing the light emitting element is an obtuse angle, the translucent member is filled between the base and the optical member. In addition, it is possible to reduce the possibility of bubbles being accumulated, and to stabilize the light emission efficiency and the light distribution.

また、本発明の発光装置は、基体の発光素子の搭載面に凹部が形成されており、光学部材の突起の先端が凹部の底面に位置していることにより、光学部材の位置合わせの精度を向上させることができる。   In the light emitting device of the present invention, the concave portion is formed on the mounting surface of the light emitting element of the base, and the tip of the projection of the optical member is located on the bottom surface of the concave portion, thereby improving the alignment accuracy of the optical member. Can be improved.

本発明の発光装置について以下に詳細に説明する。   The light emitting device of the present invention will be described in detail below.

図1乃至図7は本発明の発光装置の実施の形態の一例を示す断面図および上視平面図である。これらの図において、1は上面に発光素子2が搭載された基体、3は発光素子2の上方に配置された光学部材、4は発光素子2を被覆するとともに発光素子2と相対する光学部材3の面3bと基体1との間に配された透光性部材であり、主としてこれらで発光素子2を搭載した本発明の発光装置が構成される。   1 to 7 are a cross-sectional view and a top plan view showing an example of an embodiment of a light-emitting device of the present invention. In these drawings, 1 is a base on which the light emitting element 2 is mounted on the upper surface, 3 is an optical member disposed above the light emitting element 2, and 4 is an optical member 3 that covers the light emitting element 2 and faces the light emitting element 2. The light-emitting member of the present invention in which the light-emitting element 2 is mounted is mainly composed of a translucent member disposed between the surface 3b and the substrate 1.

基体1は、酸化アルミニウム質焼結体(アルミナセラミックス)や窒化アルミニウム質焼結体,ムライト質焼結体,ガラスセラミックス等のセラミックス、またはエポキシ樹脂等の樹脂から成り、発光素子2が搭載される搭載部1aが基体1の上面に形成されている。基体1がセラミックスから成る場合、その上面に配線導体1bがタングステン(W),モリブデン(Mo)−マンガン(Mn)等から成る金属ペーストを高温で焼成して形成される。   The substrate 1 is made of a ceramic such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, a glass ceramic, or a resin such as an epoxy resin, and the light emitting element 2 is mounted thereon. A mounting portion 1 a is formed on the upper surface of the base 1. When the substrate 1 is made of ceramics, the wiring conductor 1b is formed on the upper surface thereof by firing a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn), or the like at a high temperature.

また、基体1がセラミックスから成る場合、配線導体1bが形成された金属から成る入出力端子が、基体1に設けた貫通孔に嵌着接合させることによって設けられてもよい。   When the substrate 1 is made of ceramics, an input / output terminal made of metal on which the wiring conductor 1b is formed may be provided by being fitted and joined to a through hole provided in the substrate 1.

さらに、基体1が樹脂から成る場合、銅(Cu)や鉄(Fe)−ニッケル(Ni)合金等から成るリード端子が一体にモールド成型されて基体1の内部に設置固定される。   Further, when the substrate 1 is made of resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, or the like are integrally molded and fixed inside the substrate 1.

そして、基体1は、発光素子2が搭載部1aに導出された配線導体1bの一端に、鉛(Pb)−錫(Sn)や金(Au)−Snなどの半田から成る導電性部材5および発光素子2の電極部を介して電気的に接続固定される。さらに、基体1内部に形成された配線層を介して発光装置の外表面に導出された配線導体1bの他端と、発光装置駆動回路基板とが電気的に接続されることにより、発光素子2と発光装置駆動回路基板とが電気的に接続されることとなる。   The base 1 includes a conductive member 5 made of solder such as lead (Pb) -tin (Sn) or gold (Au) -Sn at one end of the wiring conductor 1b from which the light emitting element 2 is led out to the mounting portion 1a. It is electrically connected and fixed via the electrode part of the light emitting element 2. Furthermore, the other end of the wiring conductor 1b led out to the outer surface of the light emitting device via the wiring layer formed inside the base body 1 and the light emitting device driving circuit board are electrically connected, whereby the light emitting element 2 And the light emitting device drive circuit board are electrically connected.

なお、配線導体1bは、その露出する表面にNiやAu等の耐食性に優れる金属を1〜20μm程度の厚さで被着させておくのが良く、配線導体1bの酸化腐食を有効に防止し得るともに、発光素子2と配線導体1bとの電気的な接続を強固にし得る。したがって、配線導体1bの露出表面には、例えば、厚さ1〜10μm程度のNiメッキ層と厚さ0.1〜3μm程度のAuメッキ層とが電解メッキ法や無電解メッキ法により順次被着されているのがより好ましい。   The wiring conductor 1b is preferably coated with a metal having excellent corrosion resistance, such as Ni or Au, with a thickness of about 1 to 20 μm on the exposed surface, effectively preventing oxidative corrosion of the wiring conductor 1b. In addition, the electrical connection between the light emitting element 2 and the wiring conductor 1b can be strengthened. Therefore, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the wiring conductor 1b by an electrolytic plating method or an electroless plating method. More preferably.

なお、発光素子2は、搭載部1aに導出された配線導体1bの一端にワイヤボンディング方式を用いて電気的に接続されてもよい。また、発光素子2は、発光素子2の電極を下側にして半田や金属バンプ等の導電性部材5を介してフリップチップボンディング方式によって電気的に接続されるのが好ましい。これにより、配線導体1bを発光素子2直下に設けることができるため、発光素子2周辺の基体1上面に配線導体1bを設けるためのスペースを設ける必要がなくなる。よって、発光素子2から発光された光が、この基体1の配線導体1bのスペースで吸収され、光の放射強度が低下するのを有効に抑制することができる。   The light emitting element 2 may be electrically connected to one end of the wiring conductor 1b led out to the mounting portion 1a using a wire bonding method. The light emitting element 2 is preferably electrically connected by a flip chip bonding method through a conductive member 5 such as solder or metal bump with the electrode of the light emitting element 2 facing down. Thereby, since the wiring conductor 1b can be provided immediately under the light emitting element 2, it is not necessary to provide a space for providing the wiring conductor 1b on the upper surface of the base 1 around the light emitting element 2. Therefore, it is possible to effectively suppress the light emitted from the light emitting element 2 from being absorbed in the space of the wiring conductor 1b of the substrate 1 and the light emission intensity from being lowered.

また、発光素子2は、例えば、液相成長法やMOCVD法等によりサファイア等の単結晶基板上に、ガリウム(Ga)−Al−窒素(N)、亜鉛(Zn)−硫黄(S)、Zn−セレン(Se)、珪素(Si)−炭素(C)、Ga−リン(P)、Ga−アルミニウム(Al)−砒素(As)、Al−インジウム(In)−Ga−P、In−Ga−N、Ga−N、Al−In−Ga−N等の発光層が形成される。発光素子2の構造としては、MIS接合やPN接合を有したホモ構造、ヘテロ構造あるいはダブルへテロ構造成のものが挙げられる。また、発光素子2の発光波長は、発光層の材料やその混晶度によって紫外光から赤外光まで種々選択される。   The light emitting element 2 is formed on a single crystal substrate such as sapphire by liquid phase growth method, MOCVD method, or the like, for example, gallium (Ga) -Al-nitrogen (N), zinc (Zn) -sulfur (S), Zn -Selenium (Se), Silicon (Si) -Carbon (C), Ga-Phosphorus (P), Ga-Aluminum (Al) -Arsenic (As), Al-Indium (In) -Ga-P, In-Ga- A light emitting layer of N, Ga—N, Al—In—Ga—N, or the like is formed. Examples of the structure of the light emitting element 2 include a homo structure having a MIS junction and a PN junction, a hetero structure, and a double hetero structure. The emission wavelength of the light emitting element 2 is variously selected from ultraviolet light to infrared light depending on the material of the light emitting layer and the degree of mixed crystal thereof.

そして、発光素子2は、導電性部材5を介して搭載部1aに導出された配線導体1bに電気的に接続固定された後、未硬化のシリコーン樹脂,エポキシ樹脂,フッ素系樹脂,アクリル樹脂等の透光性の樹脂材料や、ゾル−ゲルガラス,水ガラス,低融点ガラス等の透光性のガラス材料から成る透光性部材4によって被覆される。   The light emitting element 2 is electrically connected and fixed to the wiring conductor 1b led out to the mounting portion 1a via the conductive member 5, and then uncured silicone resin, epoxy resin, fluorine resin, acrylic resin, etc. The translucent member 4 made of translucent glass material such as sol-gel glass, water glass, low melting point glass or the like.

さらに、その上に、シリコーン樹脂,エポキシ樹脂,フッ素系樹脂,アクリル樹脂等の透光性の樹脂材料や、ゾル−ゲルガラス,水ガラス,低融点ガラス,サファイア,石英ガラス,ホウ珪酸ガラス等の透光性の無機材料から成り、所定形状に硬化させて成形されたる光学部材3が、上記未硬化の透光性部材4を介して発光素子2の上方に配置された後、透光性部材4を硬化させることによって取着固定される。または、上記の光学部材3が発光素子2の上方に配置されるとともに、発光素子2と光学部材3との隙間部にディスペンサー等を用いて未硬化の上記透光性部材4を注入し、加熱や加水分解、自然放置や光照射によって硬化させることにより、光学部材3が透光性部材4を介して発光素子2の上方に取着固定される。   Furthermore, a transparent resin material such as a silicone resin, an epoxy resin, a fluorine resin, an acrylic resin, or a transparent material such as sol-gel glass, water glass, low-melting glass, sapphire, quartz glass, borosilicate glass, or the like. The optical member 3 made of a light inorganic material and cured and molded into a predetermined shape is disposed above the light emitting element 2 via the uncured light transmissive member 4 and then the light transmissive member 4. Is fixed by curing. Alternatively, the optical member 3 is disposed above the light emitting element 2, and the uncured translucent member 4 is injected into the gap between the light emitting element 2 and the optical member 3 using a dispenser or the like and heated. The optical member 3 is attached and fixed above the light emitting element 2 through the translucent member 4 by being cured by hydrolysis, natural standing, or light irradiation.

光学部材3は、図1(a)に示す断面図および図1(b)に示す上視平面図のように、発光素子2と相対する面3bの発光素子2の周囲に突起3aが形成されていることにより、発光装置の光出力や配光分布を安定させることが容易になる。つまり、光学部材3における発光素子2と相対する面の発光素子2の周囲に突起3aが形成されていることから、基体1と光学部材3の発光素子2と相対する面3bとの間隔、傾きは保持される。よって光学部材3の位置ズレや傾斜を抑制することで、透光性部材4を介した発光素子3からの光が所望の角度と異なる角度で光学部材3へ入射することを防ぐ。この結果、光学部材3から放射される光の角度や強度に偏りが生じることを抑制できるので、発光装置の配光分布を安定化させることができる。   As shown in the cross-sectional view of FIG. 1A and the top plan view of FIG. 1B, the optical member 3 has projections 3a formed around the light emitting element 2 on the surface 3b facing the light emitting element 2. Therefore, it becomes easy to stabilize the light output and light distribution of the light emitting device. That is, since the protrusion 3a is formed around the light emitting element 2 on the surface of the optical member 3 facing the light emitting element 2, the distance and inclination between the base 1 and the surface 3b of the optical member 3 facing the light emitting element 2 are inclined. Is retained. Therefore, by suppressing the positional deviation and inclination of the optical member 3, the light from the light emitting element 3 via the translucent member 4 is prevented from entering the optical member 3 at an angle different from a desired angle. As a result, it is possible to suppress the occurrence of bias in the angle and intensity of the light emitted from the optical member 3, so that the light distribution of the light emitting device can be stabilized.

さらに、基体1と光学部材3とを突起3aによって保持できることから、基体1と光学部材3の発光素子2と相対する面との間隔を所望する距離に安定して配置することができ、透光性部材4を基体1と光学部材3との間隙に一定の厚みで保持させることができる。その結果、透光性部材4を基体1と光学部材3の発光素子2と相対する面3bとの間隔に一定量注入することにより、透光性部材4の表面張力が基体1と光学部材4の発光素子3と相対する面3bとの間隔にて安定に作用するため、透光性部材4の流動をある程度制御できる。その結果、透光性部材4が、基体1および光学部材3へ濡れ広がる(滲み出す)ことを抑制できる。 Furthermore, since the base body 1 and the optical member 3 can be held by the protrusions 3a, the distance between the base body 1 and the surface of the optical member 3 facing the light emitting element 2 can be stably arranged at a desired distance. The elastic member 4 can be held in the gap between the base 1 and the optical member 3 with a constant thickness. As a result, a certain amount of the translucent member 4 is injected into the space between the base 1 and the surface 3b of the optical member 3 facing the light emitting element 2, whereby the surface tension of the translucent member 4 is increased. Since it acts stably in the space | interval with the surface 3b which opposes the light emitting element 3, the flow of the translucent member 4 can be controlled to some extent. As a result, it is possible to suppress the translucent member 4 from spreading (exuding) into the base 1 and the optical member 3.

また、透光性部材4は、硬化する際に収縮する傾向があるため、光学部材3の突起3a先端を基体1に密着させるように取着することができる。従って、突起3aの高さ(突出量)を精確なものに調整することにより、基体1と光学部材3との距離を精確に保つことができ、光学部材3に所望の光学特性を発揮させることができる。例えば、光学部材3の焦点位置に発光素子2を配置することが容易になる。   Further, since the translucent member 4 tends to shrink when it is cured, the translucent member 4 can be attached so that the tip of the protrusion 3 a of the optical member 3 is in close contact with the base 1. Therefore, by adjusting the height (projection amount) of the protrusion 3a to be accurate, the distance between the base 1 and the optical member 3 can be accurately maintained, and the optical member 3 can exhibit desired optical characteristics. Can do. For example, it becomes easy to arrange the light emitting element 2 at the focal position of the optical member 3.

なお、突起3aは、図1(b)に示す上視平面図のように、発光素子2を取り囲むように発光素子2の全周に円形状や多角形状に形成されてもよいし、図3に示すように、発光素子2の周囲の適宜の位置、例えば、平面視において正三角形の頂点位置に設けられた柱状のものとしてもよい。   The protrusion 3a may be formed in a circular shape or a polygonal shape on the entire circumference of the light emitting element 2 so as to surround the light emitting element 2, as shown in a plan view in FIG. 1B. As shown in FIG. 4, it may be a columnar shape provided at an appropriate position around the light emitting element 2, for example, at the apex position of an equilateral triangle in plan view.

このように突起3aを柱状に設けることにより、基体1と光学部材2との間に透光性部材4を充填する際に、空気が柱状の突起3aの間から抜け易くなり、突起3aより内側の透光性部材4に気泡が残留し難くなる。そして、透光性部材4に混入した気泡によって散乱される光が少なくなり、発光装置の配光分布が安定するとともに、散乱されることにより基体1へ進行する発光素子3からの光が少なくなる。その結果、基体1に吸収される光が少なくなるので、発光装置の発光効率を安定にすることができる。   By providing the protrusions 3a in a columnar shape in this way, when filling the translucent member 4 between the base 1 and the optical member 2, air can easily escape from between the columnar protrusions 3a, and the inner side of the protrusions 3a. Air bubbles hardly remain in the translucent member 4. And the light scattered by the air bubbles mixed in the translucent member 4 is reduced, the light distribution of the light emitting device is stabilized, and the light from the light emitting element 3 traveling to the substrate 1 is reduced by being scattered. . As a result, the light absorbed by the substrate 1 is reduced, so that the light emission efficiency of the light emitting device can be stabilized.

なお、突起3aは、発光素子2を挟んで両側に線状に突出して延びる突起3aとしてもよい。しかしながら、突起3aを互いに密に並べて配置すると、気泡が突起3aの間を抜け難くなる。従って、図3に示すように、最小の突起3aで安定して支えられる正三角形の頂点位置に突起3aを配置するのが好ましい。   The protrusion 3a may be a protrusion 3a that protrudes linearly on both sides of the light emitting element 2 and extends. However, if the protrusions 3a are arranged closely to each other, it is difficult for bubbles to escape between the protrusions 3a. Therefore, as shown in FIG. 3, it is preferable to arrange the protrusion 3a at the apex position of an equilateral triangle that is stably supported by the minimum protrusion 3a.

また、突起3aは、図4に示す断面図のように突起3aの側面と、光学部材3の発光素子2と相対する面との間の成す角度3cが鈍角とされていることが好ましく、発光素子2と光学部材3との間に透光性部材4を配置させる際に、気泡が透光性部材4に残留することを抑制できる。すなわち、基体1と光学部材3との間に透光性部材4を充填する際、角度が直角または鋭角であるような角部が存在すると、その部分に気泡が溜まり易く、移動し難くなる。よって、光学部材3の発光素子2と相対する面と突起3aとの角部の角度を鈍角にすることにより、気泡が透光性部材4の内部に残留することを抑制できる。その結果、透光性部材4に混入した気泡によって発光素子2からの光が散乱されることを抑制できる。よって、基体1に吸収される光が抑制されるので、発光装置の発光効率および配光分布を安定化させることができる。   Further, the projection 3a preferably has an obtuse angle 3c formed between the side surface of the projection 3a and the surface of the optical member 3 facing the light emitting element 2 as shown in the sectional view of FIG. When the translucent member 4 is disposed between the element 2 and the optical member 3, it is possible to prevent bubbles from remaining in the translucent member 4. That is, when the translucent member 4 is filled between the base 1 and the optical member 3, if there is a corner portion having a right angle or an acute angle, bubbles easily accumulate in that portion and are difficult to move. Therefore, it is possible to suppress the bubbles from remaining inside the translucent member 4 by making the angle of the corner portion between the surface of the optical member 3 facing the light emitting element 2 and the protrusion 3 a an obtuse angle. As a result, it is possible to suppress light from the light emitting element 2 from being scattered by the bubbles mixed in the translucent member 4. Therefore, the light absorbed by the substrate 1 is suppressed, so that the light emission efficiency and light distribution of the light emitting device can be stabilized.

また、基体1は、図5または図6に示す断面図のように基体1上面に凹部1cが形成され、突起3aの先端が凹部1cの底面に配置されていることが好ましく、光学部材3が突起3aを介して凹部1cに設置固定されることにより、透光性部材4を介して光学部材3を基体1上面に搭載する際に、光学部材3の位置が変わることを抑制することができる。その結果、発光装置の発光効率や配光分布を安定化させることができる。   Further, as shown in the cross-sectional view of FIG. 5 or FIG. 6, the substrate 1 is preferably formed with a recess 1c on the upper surface of the substrate 1, and the tip of the protrusion 3a is disposed on the bottom surface of the recess 1c. By being installed and fixed in the concave portion 1c via the protrusion 3a, it is possible to prevent the position of the optical member 3 from changing when the optical member 3 is mounted on the upper surface of the base 1 via the translucent member 4. . As a result, the light emission efficiency and light distribution of the light emitting device can be stabilized.

さらに、凹部1cは、突起3aを介して光学部材3を基体1上面に配置する際の目印となることから、光学部材3の基体1への設置を自動化できるとともに発光装置の製造コストを抑制することができる。   Furthermore, since the recess 1c serves as a mark when the optical member 3 is disposed on the upper surface of the base body 1 through the protrusion 3a, the installation of the optical member 3 on the base body 1 can be automated and the manufacturing cost of the light emitting device can be reduced. be able to.

またさらに、凹部1cは、図5に示す断面図のように基体1上面の搭載部1aの周辺に突起3aのみが挿入固定されるように形成されてもよく、これにより、光学部材3が基体1上面に一義的に位置決めされて設置固定される。その結果、光学部材3を基体1上面に搭載する際に生じる、搭載部1aの中心軸と光学部材3の光軸との軸ズレを有効に抑制することができる。   Furthermore, the recess 1c may be formed so that only the protrusion 3a is inserted and fixed around the mounting portion 1a on the upper surface of the base 1 as shown in the cross-sectional view of FIG. It is uniquely positioned and fixed on the upper surface of one. As a result, an axial shift between the central axis of the mounting portion 1a and the optical axis of the optical member 3 that occurs when the optical member 3 is mounted on the upper surface of the substrate 1 can be effectively suppressed.

なお、光学部材3は、エポキシ樹脂,シリコーン樹脂,アクリル樹脂,フッ素系樹脂等の透光性の樹脂材料や、ゾル−ゲルガラス,水ガラス,低融点ガラス,サファイア,石英ガラス,ホウ珪酸ガラス等の透光性の無機材料を、切削加工や研磨加工,金型加工,トランスファーモールド成型,インジェクション成型等の成形加工することにより、所望の形状に形成される。   The optical member 3 is made of translucent resin material such as epoxy resin, silicone resin, acrylic resin, fluorine resin, sol-gel glass, water glass, low melting point glass, sapphire, quartz glass, borosilicate glass, etc. The light-transmitting inorganic material is formed into a desired shape by molding such as cutting, polishing, mold processing, transfer molding, injection molding, or the like.

透光性部材4は、光学部材3の外周より内側に配置されていることが好ましく、基体1上面における光吸収損失が抑制される。すなわち、透光性部材4が光学部材3の外側に広がるにつれて、基体1上面に対して透光性部材4の側面の角度が緩やかな傾斜面になる。よって、空気と透光性部材との界面は発光素子の側面に対して急斜面になるため、発光素子の側面方向へ放出される光は空気と透光性部材との界面に対して鈍角に入射するため、光が透光性部材から空気に出射されにくくなる。その結果、透光性部材4に光が閉じこめられやすくなり、透光性部材4に接する基体1上面の光吸収損失によって光の強度が弱まる。よって、透光性部材4が、光学部材3の内側に配置されることにより、基体1上面に対して透光性部材4の側面の角度が急斜面に保つことができるため、発光素子2からの光は透光性部材4に閉じ込められ難くなり、基体1上面による光吸収損失が有効に抑制される。その結果、発光素子2からの光は、効率よく発光装置の外部に放射されることから、発光素子2への入力電力に対する、発光装置の外部に取り出される光量(光束)の割合(発光効率)は向上する。 The translucent member 4 is preferably arranged on the inner side of the outer periphery of the optical member 3, and the light absorption loss on the upper surface of the substrate 1 is suppressed. That is, as the translucent member 4 spreads outside the optical member 3, the angle of the side surface of the translucent member 4 with respect to the upper surface of the base 1 becomes a gently inclined surface. Therefore, since the interface between the air and the translucent member becomes a steep slope with respect to the side surface of the light emitting element, the light emitted toward the side surface of the light emitting element is incident at an obtuse angle with respect to the interface between the air and the translucent member. Therefore, it becomes difficult for light to be emitted from the translucent member to the air. As a result, the light is easily confined to the translucent member 4, and the light intensity is weakened by the light absorption loss on the upper surface of the substrate 1 in contact with the translucent member 4. Therefore, since the translucent member 4 is disposed inside the optical member 3, the angle of the side surface of the translucent member 4 with respect to the upper surface of the substrate 1 can be maintained on a steep slope. Light becomes difficult to be confined in the translucent member 4, and light absorption loss due to the upper surface of the substrate 1 is effectively suppressed. As a result, since the light from the light emitting element 2 is efficiently emitted outside the light emitting device, the ratio of the amount of light (light flux) extracted outside the light emitting device to the input power to the light emitting element 2 (light emission efficiency) Will improve.

なお、透光性部材4が光学部材3の内側から出さない方法としては、透光性部材4の表面張力を利用して発光素子2と光学部材3との隙間部に透光性部材4の適量を充填する(具体的な量については光学部材の大きさや足の高さに依存する)方法、さらに透光性部材4の粘性を上げることによって光学部材3の外周に濡れ広がり難くする方法(垂れにくくする方法)等がある。   As a method for preventing the translucent member 4 from coming out from the inside of the optical member 3, the surface tension of the translucent member 4 is used to make the translucent member 4 in the gap between the light emitting element 2 and the optical member 3. A method of filling an appropriate amount (the specific amount depends on the size of the optical member and the height of the foot), and a method of making the outer periphery of the optical member 3 less likely to spread by increasing the viscosity of the translucent member 4 ( There is a method to make it difficult to sag.

また、透光性部材4は、図2に示す断面図のように透光性部材4の側面が内側に向けて凹曲面状であることがより好ましく、発光素子2から側方に放射される光は、凹状の透光性部材4の測面で反射され、光学部材3に入射されるとともに光学部材3から上方に放射される。その結果、発光素子2から上方に放射される光の放射束または光束が増加し、発光装置の発光効率および輝度や光度は向上する。   Further, the translucent member 4 is more preferably a concave curved surface with the side surface of the translucent member 4 facing inward as shown in the cross-sectional view of FIG. The light is reflected by the measurement surface of the concave translucent member 4, enters the optical member 3, and is emitted upward from the optical member 3. As a result, the radiant flux or light flux of light emitted upward from the light emitting element 2 is increased, and the light emission efficiency, luminance, and luminous intensity of the light emitting device are improved.

なお、透光性部材4は、エポキシ樹脂やシリコーン樹脂等の透明樹脂や透光性ガラスから成る。突起3aが上側に成るように光学部材3を配置し、突起3aによって形成される凹部に上記の未硬化の透光性部材4を充填し、搭載部1aに電気的に接続固定された発光素子2を下側にし、発光素子2が未硬化の透光性部材4に浸されるように基体1を突起3aに搭載し、その後、ディスペンサーなどを用いて光学部材3の側面から、さらに注入することにより、透光性部材4を配置できる。未硬化の透光性部材4を加熱,加水分解,自然放置,光照射によって硬化することにより、基体1上面に透光性部材4を介して光学部材3が取着固定される
また、基体1は、図7に示す断面図のように反射部材6が基体1上面の外周部に発光素子2を取り囲むように配置されて取着されていることが好ましい。これにより、発光素子2および光学部材3から側方に放射される光が、反射部材6の内周面6aによって反射され、発光装置の外側へ集光させて出射させることができることから、輝度や光度および被照射面の照度は向上する。この目的のために、内周面6aは上方に向かうに従って外側に拡がる傾斜面とされているのがよい。
The translucent member 4 is made of transparent resin such as epoxy resin or silicone resin, or translucent glass. A light emitting device in which the optical member 3 is disposed so that the protrusion 3a is on the upper side, the concave portion formed by the protrusion 3a is filled with the above-described uncured translucent member 4, and is electrically connected and fixed to the mounting portion 1a. The base 1 is mounted on the protrusion 3a so that the light emitting element 2 is immersed in the uncured translucent member 4, and then further injected from the side surface of the optical member 3 using a dispenser or the like. Thereby, the translucent member 4 can be arrange | positioned. The uncured translucent member 4 is cured by heating, hydrolysis, natural standing, and light irradiation, whereby the optical member 3 is attached and fixed to the upper surface of the substrate 1 via the translucent member 4. As shown in the cross-sectional view of FIG. 7, the reflecting member 6 is preferably disposed and attached to the outer peripheral portion of the upper surface of the base 1 so as to surround the light emitting element 2. Thereby, the light emitted from the light emitting element 2 and the optical member 3 to the side is reflected by the inner peripheral surface 6a of the reflecting member 6, and can be condensed and emitted to the outside of the light emitting device. Luminous intensity and illuminance of the irradiated surface are improved. For this purpose, the inner peripheral surface 6a is preferably an inclined surface that expands outward as it goes upward.

さらに、反射部材6は、発光装置に対する物理的な衝撃から発光素子2や光学部材3、透光性部材4を保護する機能を有する。これにより、発光素子2や光学部材3、透光性部材4の破損,破壊等による発光装置の故障が防止される。   Further, the reflecting member 6 has a function of protecting the light emitting element 2, the optical member 3, and the translucent member 4 from physical impact on the light emitting device. Thereby, the failure of the light emitting device due to the breakage or destruction of the light emitting element 2, the optical member 3, or the translucent member 4 is prevented.

なお、反射部材6は、Al,Ag,Au,Pt,Ti,Cr,Cu,Rh等の高反射率の金属を切削加工や金型成形等を行なうことによって形成される。もしくは、セラミックスや樹脂等の絶縁体から形成される。そして、反射部材6は、基体1上面の外周部に搭載部1aを取り囲むように、半田,Agロウ等のロウ材やエポキシ樹脂,アクリル樹脂等の樹脂接着剤によって取着固定される。   The reflecting member 6 is formed by cutting or molding a metal having a high reflectance such as Al, Ag, Au, Pt, Ti, Cr, Cu, and Rh. Or it forms from insulators, such as ceramics and resin. The reflecting member 6 is fixedly attached to the outer peripheral portion of the upper surface of the base 1 by a soldering material such as solder or Ag brazing, or a resin adhesive such as epoxy resin or acrylic resin so as to surround the mounting portion 1a.

また、反射部材6が光反射率の低いセラミックスや樹脂から成る場合、Al,Ag,Au,Pt,Ti,Cr,Cu,Rh等の高反射率の金属が、内周面6aにメッキや蒸着等によって膜状に形成されていてもよい。さらに、内周面6aが、Ag,Cu等の酸化により変色し易い金属からなる場合、その表面に例えばシリコーン樹脂,エポキシ樹脂,アクリル樹脂,ゾル−ゲルガラス,水ガラス等の透明性を有する透明性部材が、厚さ0.1〜1mm程度で被覆されているのがよい。これにより、内周面6aの耐腐食性が向上するとともに、反射率の劣化が抑制される。なお、内周面6aは、従来周知の電解研磨加工、化学研磨加工もしくは切削研磨加工等によって面精度が制御される。または、金型の面精度を利用した転写加工により、面精度が制御されてもよい。   When the reflecting member 6 is made of a ceramic or resin having a low light reflectance, a metal having a high reflectance such as Al, Ag, Au, Pt, Ti, Cr, Cu, Rh is plated or evaporated on the inner peripheral surface 6a. For example, it may be formed into a film shape. Further, when the inner peripheral surface 6a is made of a metal that is easily discolored by oxidation, such as Ag or Cu, the surface has transparency such as silicone resin, epoxy resin, acrylic resin, sol-gel glass, water glass, etc. The member is preferably covered with a thickness of about 0.1 to 1 mm. Thereby, the corrosion resistance of the inner peripheral surface 6a is improved and the deterioration of the reflectance is suppressed. The surface accuracy of the inner peripheral surface 6a is controlled by a conventionally known electrolytic polishing process, chemical polishing process or cutting polishing process. Alternatively, the surface accuracy may be controlled by transfer processing using the surface accuracy of the mold.

また、反射部材6は、内周面6aを直線状や湾曲状に形成してもよく、また外周面の縦断面形状を湾曲形状に変更してもなんら支障はない。   Moreover, the reflection member 6 may form the inner peripheral surface 6a in a linear shape or a curved shape, and there is no problem even if the longitudinal sectional shape of the outer peripheral surface is changed to a curved shape.

本発明の照明装置は、上記本発明の発光装置と、発光装置が搭載され、発光装置を駆動する電気配線を有する駆動部と、発光装置から出射される光を反射する光反射手段とを含むことにより、発光装置の輝度が向上し、放射される光の波長等の変動およびそれぞれの発光装置の強度むらが抑制され、それらを集めて照明装置とした本発明の照明装置の強度むらも抑制され、輝度の高いものとなる。   The lighting device of the present invention includes the above-described light emitting device of the present invention, a drive unit on which the light emitting device is mounted and having electric wiring for driving the light emitting device, and a light reflecting means for reflecting light emitted from the light emitting device. As a result, the brightness of the light emitting device is improved, fluctuations in the wavelength of the emitted light and the unevenness of the intensity of each light emitting device are suppressed, and the unevenness of the intensity of the lighting device of the present invention, which is collected as a lighting device, is also suppressed. As a result, the luminance becomes high.

また、本発明の照明装置において、図8,図9,図10,図11に示されるように、一個の発光装置101を所定の配置となるように設置したり、または、複数個を、例えば、格子状や千鳥状、放射状等の所定の配置となるように設置したりしてもよい。あるいは、複数の発光装置101から成る円形状や多角形状の発光装置101群を同心状に複数群形成したもの等を所定の配置となるように設置してもよい。   Further, in the illumination device of the present invention, as shown in FIGS. 8, 9, 10, and 11, one light emitting device 101 is installed in a predetermined arrangement, or a plurality of light emitting devices 101, for example, Alternatively, it may be installed so as to have a predetermined arrangement such as a lattice shape, a staggered shape, or a radial shape. Or you may install so that the circular shape which consists of the several light-emitting device 101, or the polygonal-shaped light-emitting device 101 group may form several groups concentrically, etc. may become predetermined arrangement | positioning.

例えば、図8の平面図およびその断面図を示す図9のように複数個の発光装置101が発光装置101を駆動するための電気配線を有する駆動部102上に複数列に配置され、発光装置101の周囲に任意の形状に光学設計された反射板等の光反射手段103が設置されてなる発光装置の場合、隣り合う発光装置101との間隔が最短にならない配置、例えば一列に配置された複数個の発光装置101の間に隣り合う列の発光装置101が配置された配置、いわゆる千鳥状の配置とすることが好ましい。即ち、発光装置101が格子状に配置される場合には、発光装置101が縦横直線状の格子に配列されることによりグレアが強くなり、このような発光装置101が人の視覚に入ってくることにより、不快感を起こしやすくなるのに対し、千鳥状とすることにより、グレアが抑制され人の眼に対する不快感を低減することができる。さらに、隣り合う発光装置101間の距離が長くなることにより、隣接する発光装置101間の熱的な干渉が有効に抑制され、発光装置101が実装された駆動部102内における熱のこもりが抑制され、発光装置101の外部に効率よく熱が放散される。その結果、人の眼に対して不快感が少なく、長期間にわたって光学特性の安定した長寿命の発光装置を作製することができる。   For example, as shown in the plan view of FIG. 8 and the cross-sectional view of FIG. 9, a plurality of light emitting devices 101 are arranged in a plurality of rows on a drive unit 102 having electrical wiring for driving the light emitting devices 101, In the case of a light emitting device in which light reflecting means 103 such as a reflecting plate optically designed in an arbitrary shape is installed around 101, the distance between adjacent light emitting devices 101 is not shortest, for example, arranged in a row It is preferable to adopt an arrangement in which adjacent rows of light emitting devices 101 are arranged between a plurality of light emitting devices 101, that is, a so-called staggered arrangement. That is, when the light emitting devices 101 are arranged in a grid, glare is strengthened by arranging the light emitting devices 101 in a vertical and horizontal linear grid, and such a light emitting device 101 enters human vision. Thus, discomfort is likely to occur, but the staggered shape can suppress glare and reduce discomfort to the human eye. Further, since the distance between the adjacent light emitting devices 101 is increased, thermal interference between the adjacent light emitting devices 101 is effectively suppressed, and heat accumulation in the drive unit 102 in which the light emitting devices 101 are mounted is suppressed. Then, heat is efficiently dissipated outside the light emitting device 101. As a result, it is possible to manufacture a light-emitting device with a long life with less discomfort to human eyes and stable optical characteristics over a long period of time.

また、発光装置が、図10の平面図およびその断面図を示す図11のような駆動部102上に複数の発光装置101からなる円形状や多角形状の発光装置101群を、同心状に複数群形成した発光装置の場合、一つの円形状や多角形状の発光装置101群における発光装置101の配置数を発光装置の中央側より外周側ほど多くすることが好ましい。これにより、発光装置101同士の間隔を適度に保ちながら発光装置101をより多く配置することができ、発光装置の照度をより向上させることができる。また、発光装置の中央部の発光装置101の密度を低くして駆動部102の中央部における熱のこもりを抑制することができる。その結果、駆動部102内における温度分布が一様となり、発光装置を設置した外部電気回路基板やヒートシンクに効率よく熱が伝達され、発光装置101の温度上昇を抑制することができ、発光装置101は長期間にわたり安定して動作することができるとともに長寿命の発光装置を作製することができる。   Further, the light emitting device includes a concentric arrangement of a plurality of circular or polygonal light emitting device groups 101 each made up of a plurality of light emitting devices 101 on the drive unit 102 as shown in the plan view of FIG. 10 and a cross-sectional view thereof. In the case of a group of light emitting devices, it is preferable to increase the number of light emitting devices 101 arranged in one circular or polygonal light emitting device 101 group from the center side of the light emitting device to the outer peripheral side. Thereby, it is possible to arrange more light emitting devices 101 while maintaining an appropriate interval between the light emitting devices 101, and it is possible to further improve the illuminance of the light emitting devices. Further, the density of the light emitting device 101 at the center of the light emitting device can be lowered to suppress the accumulation of heat at the center of the driving unit 102. As a result, the temperature distribution in the drive unit 102 becomes uniform, heat is efficiently transmitted to the external electric circuit board or heat sink on which the light emitting device is installed, and the temperature rise of the light emitting device 101 can be suppressed. Can operate stably over a long period of time and can produce a light-emitting device with a long lifetime.

このような発光装置を用いた照明装置としては、例えば、室内や室外で用いられる、一般照明用器具、シャンデリア用照明器具、住宅用照明器具、オフィス用照明器具、店装、展示用照明器具、街路灯用照明器具、誘導灯器具および信号装置、舞台およびスタジオ用の照明器具、広告灯、照明用ポール、水中照明用ライト、ストロボ用ライト、スポットライト、電柱等に埋め込む防犯用照明、非常用照明器具、懐中電灯、電光掲示板等や、調光器、自動点滅器、ディスプレイ等のバックライト、動画装置、装飾品、照光式スイッチ、光センサ、医療用ライト、車載ライト等が挙げられる。   Examples of the lighting device using such a light emitting device include, for example, general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, and display lighting fixtures that are used indoors and outdoors. Street lighting fixtures, guide lights and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency use Examples include lighting fixtures, flashlights, electric bulletin boards, backlights such as dimmers, automatic flashers, displays, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, vehicle lights, and the like.

なお、本発明は上記の実施の形態に限定されず、本発明の要旨を逸脱しない範囲内で種々の変更を行なうことは何等支障ない。例えば、反射部材6の上面に発光素子2や光学部材3より放射される、光を所要に集光し拡散させる光学レンズや平板状の透光性の蓋体を半田や樹脂接合剤等で接合することにより、所望する放射角度で光を取り出すことができる発光装置としてもよい。これにより、発光装置内への浸水性が改善され長期信頼性および作動寿命が向上する。   It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are not hindered without departing from the gist of the present invention. For example, an optical lens that radiates light from the light-emitting element 2 or the optical member 3 and collects and diffuses the light as required on the upper surface of the reflecting member 6 or a flat light-transmitting lid is bonded with solder or a resin bonding agent. Thus, a light emitting device that can extract light at a desired radiation angle may be used. Thereby, the water immersion in a light-emitting device is improved and long-term reliability and an operating life improve.

また、上記実施の形態例において、反射部材6の内周面6aが平面視において円形状である例を示して説明したが、円形状に限定されることはなく、四角形状やその他の多角形状、楕円形状、その他星型等の不定形状であってもよい。また、反射部材6および基体1の外周形状も円形状に限定されることはなく、その他の多角形状、四角形状や楕円形状、その他の不定形状であってもよい。また、反射部材6の断面形状が直角三角形状のブロック状に示したが、例えば板材等で錐台状に形成されたものでもよい。   In the above embodiment, the inner peripheral surface 6a of the reflecting member 6 has been described as an example of a circular shape in plan view. However, the present invention is not limited to a circular shape, and may be a rectangular shape or other polygonal shapes. Further, it may be an indefinite shape such as an elliptical shape or a star shape. Further, the outer peripheral shape of the reflecting member 6 and the base 1 is not limited to a circular shape, and may be other polygonal shapes, quadrangular shapes, elliptical shapes, or other indefinite shapes. Moreover, although the cross-sectional shape of the reflecting member 6 is shown as a right triangle block, it may be formed in a frustum shape with a plate material or the like, for example.

また、上記実施の形態の説明において上下左右という用語は、単に図面上の位置関係を説明するために用いたものであり、実際の使用時における位置関係を意味するものではない。   In the description of the above embodiment, the terms “upper, lower, left and right” are merely used to describe the positional relationship in the drawings, and do not mean the positional relationship in actual use.

本発明の発光装置の実施の形態の一例を示す断面図および平面図である。It is sectional drawing and a top view which show an example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す平面図である。It is a top view which shows the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. 本発明の照明装置の実施の形態の他の例を示す平面図である。It is a top view which shows the other example of embodiment of the illuminating device of this invention. 図8の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG. 本発明の照明装置の実施の形態の他の例を示す平面図である。It is a top view which shows the other example of embodiment of the illuminating device of this invention. 図10の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG. 本発明の発光装置の実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention.

符号の説明Explanation of symbols

1:基体
1a:搭載部
1b:配線導体
1c:凹部
2:発光素子
3:光学部材
3a:突起
3b:発光素子と相対する面
3c:突起の側面と、光学部材の発光素子と相対する面との間の成す角度
4:透光性部材
5:導電性部材
6:反射部材
6a:内周面
DESCRIPTION OF SYMBOLS 1: Base | substrate 1a: Mounting part 1b: Wiring conductor 1c: Concave part 2: Light emitting element 3: Optical member 3a: Protrusion 3b: The surface facing a light emitting element 3c: The side surface of a protrusion, and the surface facing a light emitting element of an optical member 4: Translucent member 5: Conductive member 6: Reflective member 6a: Inner peripheral surface

Claims (5)

基体と、
該基体に搭載された発光素子と、
該発光素子の上方に配置されており、前記基体に接した突起を有する光学部材と、
前記基体と前記光学部材との間に設けられており、前記発光素子を覆う透光性部材とを備えた発光装置。
A substrate;
A light emitting device mounted on the substrate;
An optical member disposed above the light emitting element and having a protrusion in contact with the substrate;
A light-emitting device provided with a translucent member provided between the base and the optical member and covering the light-emitting element.
前記光学部材は、前記突起を複数有していることを特徴とする請求項1に記載の発光装置。 The light emitting device according to claim 1, wherein the optical member includes a plurality of the protrusions. 前記突起の側面と、前記光学部材の前記発光素子と相対する面とが成す角度が鈍角であることを特徴とする請求項4に記載の発光装置。 The light-emitting device according to claim 4, wherein an angle formed between a side surface of the protrusion and a surface of the optical member facing the light-emitting element is an obtuse angle. 前記基体の前記発光素子の搭載面に凹部が形成されており、前記光学部材の前記突起の先端が前記凹部の底面に位置していることを特徴とする請求項1乃至請求項3のいずれかに記載の発光装置。 4. The concave portion is formed on the mounting surface of the light emitting element of the base, and the tip of the projection of the optical member is located on the bottom surface of the concave portion. The light emitting device according to 1. 請求項1乃至請求項4のいずれかに記載の発光装置と、
該発光装置が搭載され、該発光装置を駆動する電気配線を有する駆動部と、
前記発光装置から出射された光を反射する光反射手段とを備えた照明装置。
A light emitting device according to any one of claims 1 to 4,
A drive unit on which the light emitting device is mounted and having electrical wiring for driving the light emitting device;
A lighting device comprising: a light reflecting means for reflecting light emitted from the light emitting device.
JP2006091519A 2006-03-29 2006-03-29 Light emitting device and lighting device using same Pending JP2007266445A (en)

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JP2011018863A (en) * 2009-07-10 2011-01-27 Sharp Corp Light-emitting element module, method of manufacturing the same, and backlight apparatus
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