JP2007258434A - Light-emitting module, and lighting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting module capable of improving the attachment and detachment workability of a module head with a semiconductor light-emitting element while being easy to inhibit the temperature rise of the semiconductor light-emitting element. <P>SOLUTION: The light-emitting module has a module head 12, a module body 21, and a pop-up mechanism 25. The head 12 has a light emitter 13 mounting a plurality of LED chips 15 on a substrate 14, a front hexagonal metallic head frame 18 housing the light emitter, and a plug 16 having a bayonet terminal 17 electrically connected to the light emitter 13 and being projected to the rear side of the frame 18. An opening 22 inserting and detaching the plug 16 is formed to the body 21. The mechanism 25 incorporated into the body has a receiving terminal 26 contacted and separated to and from the terminal 17 with the inserting and detaching of the plug 16 to and from the body 21. The pop-up mechanism 25 has a function holding the head 12 under the state, in which the terminal 17 is brought into contact with the terminal 26 when the plug 16 is inserted into the body 21, and pushing back the head 12 and projecting the frame 18 after the frame 18 is pushed in from the state in which the plug 16 is inserted into the body 21. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light emitting module using a semiconductor light emitting element such as an LED as a light source, and an illumination device including a light source unit in which a plurality of the light emitting modules are arranged in parallel.

Conventionally, an LED module in which an LED chip is mounted on a circular substrate and a circular lens arranged below the module are accommodated in a circular instrument body, and the lens is supported while covering the periphery of the lens. 2. Description of the Related Art An LED lighting fixture is known in which a ring-shaped fixture cover is attached to a fixture body, and the LED module can be replaced (see, for example, Patent Document 1).
JP 2003-593332 A (paragraph 0017, FIGS. 1 to 4)

  Patent Document 1 does not describe technical means for attaching and detaching the ring-shaped instrument cover to the circular instrument body. However, in Patent Document 1, since the instrument cover is fitted to the outer periphery of the instrument body as shown in FIG. 1 and there is no particular description of maintaining the fitted state, the fitted state is caused by the frictional engagement force on the fitting surface. Is considered to be retained. For this reason, when exchanging the LED chip, the ring-shaped instrument cover is grasped from the outer periphery so that the operator can pinch it with a finger and pulled down while rotating, or pulled down without rotation. Work procedure of removing the outer periphery of the main body and replacing the LED chip in this state, and then gripping the ring-shaped instrument cover from the outer periphery so that the operator pinches it with fingers and pushing it into the outer periphery of the instrument body. Can be considered. Since such an attachment / detachment operation of the instrument cover is performed against the frictional engagement force on the fitting surface, the workability is not good.

  Moreover, when the LED lighting apparatus of patent document 1 is used as one light emission part, and the light emission part is arranged in parallel and the illuminating device which obtains a larger light emission surface and light quantity is comprised, the ring-shaped instrument cover of an adjacent light emission part Are arranged in contact or close to each other. For this reason, when the instrument cover is grasped from the outer periphery as described above in the replacement operation of the LED chip, the instrument cover of the adjacent light emitting unit becomes an obstacle, and some measures are required.

  Furthermore, as described above, when a plurality of LED lighting fixtures of Patent Document 1 are arranged side by side to configure a lighting device that obtains a larger light emitting surface and light amount, the LED lighting fixture is circular, so that between adjacent light emitting units. A large gap partitioned by a circular arc surface is formed. Due to such a gap, the light emitting surface of the entire lighting device does not continuously spread in a flat shape without a gap, so that the appearance of the lighting device is impaired.

  Further, the LED chip is temperature-dependent, and the light emission efficiency and life of the LED chip decrease as the temperature of the LED chip increases. Therefore, it is necessary to release the heat generated by the LED chip during lighting. However, Patent Document 1 does not describe heat dissipation of an LED module on which a plurality of LED chips are mounted. Furthermore, as described above, when a plurality of LED lighting fixtures of Patent Document 1 are arranged side by side to configure a lighting device that obtains a larger light emitting surface and light amount, the LED is surrounded by a plurality of other LED lighting fixtures. The luminaire is difficult to dissipate heat, and the temperature of the plurality of LED chips it has is particularly likely to rise.

  A first object of the present invention is to provide a light emitting module capable of improving the detachability of a module head having a semiconductor light emitting element and easily suppressing a temperature rise of the semiconductor light emitting element.

  A second object of the present invention is to provide an illumination device that has each light emitting module capable of achieving the first object and has a good appearance.

  In order to achieve the first object, a light emitting module according to a first aspect of the present invention is a light emitting part in which a semiconductor light emitting element is mounted on a substrate, a hexagonal shape in a front view in which the light emitting part is accommodated, and made of metal. A module head comprising a head frame and a plug part having an insertion terminal electrically connected to the light emitting part and protruding to the back side of the head frame; and having an opening through which the plug part is inserted and removed. A module body; and a receiving terminal that is built in the module body and is brought into and out of contact with the insertion terminal as the plug portion is inserted into and removed from the module body, and the plug portion is inserted into the module body. The module head is held in a state where the insertion terminal is in contact with the receiving terminal, and the head frame is further pushed from this holding state. It is provided with; push back the module head based on Murrell and popup mechanism to project the head frame.

  According to the first aspect of the present invention, a temperature-dependent light emitting element such as an LED chip can be suitably used as the semiconductor light emitting element, and when there are a plurality of semiconductor light emitting elements mounted on the substrate, their emission colors May be different colors to obtain a desired color tone such as white, even if they are the same color. In the first aspect of the present invention, a metal material having a higher thermal conductivity than the synthetic resin, such as aluminum or an alloy thereof, can be suitably used as the material forming the head frame. Further, the shape of the head frame viewed from the front is most preferably a regular hexagon, but any shape may be used as long as it is a hexagon. In the invention of claim 1, the pop-up mechanism may have any configuration as long as it exhibits a predetermined function required for it. In addition, in invention of Claim 1, it does not prevent adding the light control member which is formed with a translucent material and covers a light emission part, and glass which does not have a lens and a lens function in that case. A board, an acrylic board, etc. can be used.

  According to the first aspect of the present invention, the light emitting module is assembled by pushing the module head and inserting the plug portion into the opening of the module body so that the pushed module head is held by the pop-up mechanism. In this assembled state, the plug-in plug-in terminal is held in contact with the receiving terminal in the module body. Also, in the assembled state, once the module head is further pushed in and then released, the pop-up mechanism releases the holding of the module head, and then pushes back the module head so that the head frame of the module head is removed. Since it protrudes, the module head can be detached from the module body by grasping the protruding head frame.

  When mounting the module head in this way, it is only necessary to push in the head, and when removing the module head, it is only necessary to push the head once and pull it out by replacement. The module head can be easily attached and detached.

  Then, when power is supplied to the light emitting portion of the module head in the assembled state, the semiconductor light emitting element emits light, and the light passes through the light control member and is used for illumination. In this case, the heat generated in the semiconductor light emitting element is mainly transmitted to the metal head frame by radiation or heat conduction through the substrate, and is released to the outside from the outer surface of the head frame. Thereby, it can suppress that a semiconductor light emitting element raises a temperature too much.

  In order to achieve the second object, an illumination device according to a second aspect of the present invention includes a light source unit including a plurality of the light emitting modules according to the first aspect, and a plurality of the light emitting modules arranged in parallel; A module holding device that supports the module bodies included in the plurality of light emitting modules and holds the side surfaces of the plurality of light emitting modules adjacent to each other in a hexagonal shape in contact with each other; A lighting device for supplying electric power;

  According to the second aspect of the present invention, the side surfaces of the hexagonal head frames of the adjacent light emitting modules can be held in contact with each other by causing the module support member to support the plurality of light emitting modules according to the first aspect. For this reason, the light emitting surface which the head frame of a several adjacent light emitting module spreads continuously planarly without gap is formed, and the external appearance of an illuminating device can be made favorable. Furthermore, the adjacent metal head frames can conduct heat with each other by the contact between the side surfaces. For this reason, the heat generated as the semiconductor light emitting element emits light by supplying power from the lighting device can be diffused to each head frame by heat conduction, thereby suppressing the temperature rise of the semiconductor light emitting element included in each light emitting module. .

  This thermal diffusion action is achieved by placing a plurality of other light emitting modules adjacent to each other so as to surround a certain light emitting module, thereby bringing the adjacent light emitting modules into contact with each other, thereby providing a larger planar light emitting surface. This is particularly effective in the case of a lighting device in which is formed. In other words, the enclosed light emitting module has a higher temperature than the other surrounding light emitting modules as a result of the heat radiation to the atmosphere being suppressed by the other plurality of surrounding light emitting modules. Nevertheless, the heat of the head frame of the certain light emitting module surrounded by the heat is diffused by heat conduction to the head frames of the plurality of other light emitting modules around it, and released from these head frames to the outside. By doing, the temperature rise of the enclosed said light emitting module can be suppressed.

  According to the light emitting module of the first aspect of the invention, the module head having the semiconductor light emitting element can be attached to and detached from the module body with a simple operation of mainly pushing the module head. In addition to improving the temperature, the heat generated by the semiconductor light emitting element can be released to the outside using the metal head frame of the module head as a heat radiating member at the time of light emission, so that the temperature rise of each semiconductor light emitting element can be easily suppressed.

  According to the illuminating device of the invention according to claim 2, since the light emitting module capable of achieving the first object is provided, and the light emitting surfaces thereof are continuous without gaps, the appearance of the illuminating device can be improved and each light emission Due to the heat conduction between the metal head frames of the module, there is an effect that the temperature rise of the semiconductor light emitting element included in each light emitting module can be suppressed.

  A first embodiment of the present invention will be described with reference to FIGS.

  Reference numeral 1 in FIG. 1 indicates an illumination device used as a stand-type projector, for example. The illuminating device 1 includes a light source unit 2, a module holding device 3 that supports the light source unit 2, a support device that supports the module holding device 3, such as a stand 4, and a light emitting unit described later of the light source unit 2. And a lighting device 5 (see FIG. 5) for supplying power suitable for lighting the unit.

  The stand 4 has a hollow column 4a, and the module holding device 3 is attached to the upper end of the column 4a. The module holding device 3 can be rotated in the vertical direction with respect to the support column 4a in order to adjust the light projecting direction of the light source unit 2, and is attached so that an arbitrary rotational position can be held unless an external force is applied. The lighting device 5 is built in the base part of the stand 4, for example. This lighting device 5 and each light-emitting part to be described later are connected by an insulated coated electric wire 6 indicated by a two-dot chain line in FIG. The insulated wire 6 is routed through the support 4a.

  The module holding device 3 includes, for example, a cylindrical metal device body 3a having one end opened, and a module holder 3b (only a part of which is shown in FIG. 5) housed inside the device body. . The module holder 3b has a plurality of fitting holes 3c formed in a socket shape, and is arranged in a posture in which the openings of the fitting holes 3c face the openings of the cylindrical device main body 3a.

  As shown in FIGS. 1 and 2, the light source unit 2 is formed by arranging a plurality of, for example, three light emitting modules 11 side by side. As shown in FIGS. 3 to 5, each light emitting module 11 includes a module head 12, a module body 21, positive and negative receiving terminals 26, a pop-up mechanism 25, and a body cover 29.

  The module head 12 includes a light emitting unit 13, a plug unit 16, a head frame 18, and a light-transmitting front cover 19 as a light control member, for example.

  The light emitting unit 13 is formed by mounting a plurality of semiconductor light emitting elements such as LED chips 15 on the surface of, for example, a circular hard substrate 14 provided with a predetermined wiring pattern on the surface.

  The plug portion 16 protrudes from the center of the back surface of the substrate 14. The plug portion 16 is formed by cylindrically molding an electrically insulating material such as a synthetic resin, and its tip is closed. The plug portion 16 has a pair of insertion terminals 17 that form a positive electrode or a negative electrode, and these are attached to the distal end portion of the plug portion 16. The insertion terminal 17 formed of brass or the like has a portion that is disposed on the peripheral side surface of the plug portion 16 and extends in the axial direction of the plug portion 16, and this portion is bent into a dogleg shape and elastically deformed. Is possible.

  The head frame 18 is made of a metal such as aluminum having a high thermal conductivity and light weight, or an alloy thereof. The side wall of the head frame 18 includes a hexagonal cylindrical portion 18a that is visually recognized as a regular hexagon as shown in FIG. 1B when the headframe 18 is viewed from the front, and a tapered cylinder in which the hexagonal cylindrical portion 18a is continuous. It is formed with the part 18b. The tapered cylindrical portion 18b is also a regular hexagon, and its outer peripheral surface is formed with a tapered surface that narrows the outer diameter of the tapered cylindrical portion 18b as the distance from the hexagonal cylindrical portion 18a increases.

  A through hole is formed in the central portion of the end wall 18 c located in the back of the head frame 18. The light emitting portion 13 is accommodated in the head frame 18 and is fixed in a state where the back surface of the substrate 14 is in contact with the inner surface of the end wall 18c. The plug portion 16 protrudes through the through hole to the back side of the end wall 18c. The front opening of the head frame 18 is closed by a front cover 19 fixed to the opening by an adhesive. Therefore, the front cover 19 made of glass or the like covers the light emitting portion 13 and faces it.

  The module body 21 is made of synthetic resin, and its side wall is formed of a side wall large diameter portion 21a and a side wall small diameter portion 21b. The side wall large-diameter portion 21a is formed in a size equal to or smaller than the projected shape when the hexagonal cylinder portion 18a is viewed from the front. Specifically, the side wall large-diameter portion 21a is formed in a hexagonal shape having the same diameter as that of the hexagonal cylinder portion 18a, but has a diameter equal to or smaller than the diameter of a virtual circle inscribed on each side surface of the hexagonal cylinder portion 18a. The large-diameter side wall 21a can be made in a round shape or the like. An opening 22 is opened in the front wall 21c continuous to the side wall small diameter portion 21b. A back wall 22d that is continuous with the large-diameter side wall 21a functions as a spring receiving portion.

  The pop-up mechanism 25 includes a pair of brass receiving terminals 26 that form a positive electrode or a negative electrode, an operating portion 27, and an urging member 28, and is built in the module body 21.

  As the plug portion 16 is inserted into and removed from the module body 21 through the opening 22, the corresponding plug terminal 17 having the same polarity is connected to and separated from each of the receiving terminals 26. Each of the receiving terminals 26 is attached to the operating portion 27.

  As shown in FIGS. 4 and 5, the operating portion 27 is formed with a front recess 27 a in which the receiving terminal 26 is disposed. The front recess 27a is opened in the front direction. Further, the operating portion 27 has a protruding convex portion 23 that protrudes from the back end surface of the front concave portion 23d. The protruding protrusion 23 insulates between the positive and negative receiving terminals 26.

  The operating portion 27 slides on the inner surface of the side wall of the module body 21 and is provided so as to be reciprocally movable along the axial direction of the module body 21 between the first position shown in FIG. 5 and the second position shown in FIG. . The operating portion 27 is urged in the front direction of the module body 21 by an urging member 28 disposed over this and the back wall 22 d of the module body 21. With this urging force, the operating portion 27 is held at the first position, that is, at a position where it abuts against the back surface of the front wall 21 c of the module body 21. For the biasing member 28, an elastic member, for example, a coil spring is used.

  The operating unit 27 has a holding function and a holding release function. When the plug portion 16 is inserted into the module body 21 and the operating portion 27 is pushed and moved to the second position against the urging member 28, the holding function is activated and the insertion terminal 17 of the plug portion 16 receives the receiving terminal. The operating portion 27 is held in the second position while being in contact with the H.26. From this state, when the module head 12 is further pushed in, the holding release function is activated and the function of holding the operating portion 27 in the second position is released. Therefore, when the pushing force with respect to the module head 12 disappears in a state where the holding function is released, the operating portion 27 is pushed back to the first position by the force of the biasing member 28.

  The insulated wire 6 electrically connected to the receiving terminal 26 is drawn out from the operating portion 27, and these insulated wires 6 are connected to the lighting device 5 through the module holder 3b.

  The body cover 29 is formed of a soft synthetic resin that can be elastically deformed, such as silicon resin, and is formed in, for example, a bellows-like cylindrical shape so that it can expand and contract in the axial direction. The body cover 29 has one end 29 a bonded to a stepped portion between the large side wall portion 21 a and the small side wall portion 21 b of the module body 21 to cover the small side wall portion 21 b of the module body 21. The body cover 29 is formed to be longer than the side wall small-diameter portion 21b, and the back wall 22b of the module head 12 is brought into contact with and separated from the other end 29b on the front side.

  The module body 21 of each light emitting module 11 is attached in the device main body 3 a of the module holding device 3. Specifically, the module body 21 is fixed by fitting the side wall large diameter portion 21a into the fitting hole 3c of each module holder 3b individually (see FIG. 5). And the module head 12 is attached to these module bodies 21 so that insertion / removal is possible from the front side of the apparatus main body 3a. This attachment / detachment procedure will be described below.

  First, in order to assemble the light emitting module 11 by inserting the module head 12 into the module body 21, the holding function of the operating part 27 is released, and the operating part 27 is arranged at the first position in FIG. In the state shown, the module head 12 may be pushed into the apparatus main body 3 a to insert the plug portion 16 into the opening 22 of the module body 21. By this insertion, the plug portion 16 that has passed through the opening 22 enters between the positive and negative receiving terminals 26, and the insertion terminal 17 of the plug portion 16 contacts the receiving terminals 26. In this case, at least the insertion terminal 17 of the insertion terminal 17 and the receiving terminal 26 is elastically deformed, so that they are in close contact with each other, and the plug portion 16 is held by the positive and negative receiving terminals 26 by the frictional engagement force by this close contact. Is done.

  Immediately after this state is formed, the distal end surface of the plug portion 16 hits the protruding convex portion 23 of the operating portion 27 and further pushing of the module head 12 proceeds, so that the operating portion 27 compresses the biasing member 28. It is pushed in and moved. Thereby, as the operating part 27 is arranged at the second position shown in FIG. 4, the holding function of the operating part 27 works, and this operating part 27 is held at the second position, Installation of the module head 12 is completed.

  Further, the back wall 22d of the module head 12 hits the other end 29b of the body cover 29 in accordance with the above operation, and the body cover 29 is elastically deformed in a compressing direction so as to shorten the length of the body cover 29. As a result, the other end 29b of the body cover 29 is in close contact with the back wall 22d, and the space between them is sealed. Therefore, the body cover 29 can improve the appearance of the light emitting module 11 and can also be dustproof and waterproof to the connecting portion between the module head 12 and the module body 21. For example, the environment in which at least one of dust and water acts is used. For example, it is preferable when the lighting device 1 is installed outdoors.

  The light source unit 2 is assembled by attaching each module head 12 in the apparatus main body 3a by the above procedure. In this assembled state, each light emitting module 11 is arranged around the central axis of the apparatus main body 3a, and the side surfaces of the hexagonal cylinder portion 18a included in the head frame 18 of each module head 12 are shown in FIG. They are brought into contact with each other as shown in (B). Further, the front surfaces of the adjacent module heads 12, that is, the front end surface of the hexagonal cylinder portion 18a and the surface of the front cover 19 form a continuous plane that forms the same surface along the direction orthogonal to the central axis. . Moreover, this plane is arranged at the same position as the front side end face 3d of the cylindrical device main body 3a in the direction in which the central axis extends, or in the vicinity of the front side end face 3d as shown in FIG.

  Furthermore, as described above, the head frame 18 of the module body 21 has the tapered cylindrical portion 18b. Thereby, in the above assembly of the light source unit 2, when another module head 12 is inserted later into the previously installed module head 12, the hexagonal cylinder portion 18 a of the installed module head 12 is attached to the module head 12. The retrofitted module head 12 can be pushed in while sliding the tapered cylindrical portion 18b of the retrofit module head 12. Accordingly, when the retrofitting module head 12 is inserted, it is possible to prevent the attached module head 12 from serving as a stopper, so that the insertion workability of the module head 12 can be improved.

  In order to remove the module head 12 from the module body 21 for replacement or the like from the state shown in FIG. 4, the module head 12 is first pushed in from the front direction, and then the pushing is released. As a result, the module head 12 pushes the protruding convex portion 23 of the operating portion 27 along with the pressing, and moves the operating portion 27 in this pushing direction, so that the operating portion 27 is held at the second position based on this behavior. The holding function of the actuating unit 27 is released. For this reason, the pushing of the module head 12 is released, and at the same time, the urging force of the urging member 28 pushes the operating portion 27 in the second position back to the first position positioned on the front wall 21c.

  Therefore, the module head 12 protrudes forward (front direction) of the module body 21 so as to pop up via the operating portion 27. A state in which one module head 12 is projected is shown in FIG.

  Next, the module head 12 protruding as described above is gripped and pulled out against the frictional force between the insertion terminal 17 and the receiving terminal 26. In this case, since the module head 12 to be pulled out projects forward from the other module heads 12, it is possible to prevent the module head 12 other than the drawing target from being a restriction on the drawing work in the drawing. Therefore, as shown in FIG. 2, the module head 12 to be pulled out can be easily grasped and pulled out even under conditions where the periphery of the light source unit 2 is surrounded by the apparatus main body 3a.

  As described above, the module head 12 can be attached to and detached from the module body 21 by a simple operation such as mainly pressing the module head 12 from the front side. Therefore, the light emission color of the module head 12 of the light source unit 2 is changed. The module head 12 can be easily replaced. In addition, the work space for attaching and detaching the module head 12 is the front side of the module head 12, and it is not necessary to secure a work space for attachment and detachment around the module head 12 in advance in the cylindrical device body 3 a. Thereby, the diameter of the apparatus main body 3a which accommodated the light source part 2 can be made small, and the illuminating device 1 can be formed small in connection with it.

  Further, in the assembled state of the light source part 2, as shown in FIGS. 1A and 1B, the hexagonal cylindrical parts 18a of the module heads 12 are in surface contact so as not to form a gap between the outer surfaces. In addition, the front surfaces of the plurality of light emitting modules 11 form a light emitting surface that spreads continuously in a planar shape. Thus, the illumination device 1 in which the planar light emitting surface without a gap between the head frames 18 of the adjacent light emitting modules 11 is formed has a good appearance when viewed from the front.

  When power is supplied from the lighting device 5 to the light source unit 2 of the assembled lighting device 1, the LED chip 15 included in each light emitting module 11 emits light, so that the light passes through the front cover 19 and is used for illumination. . In this case, heat generated in each LED chip 15 is mainly transmitted to the metal head frame 18 by radiation or heat conduction through the substrate 14, and is released to the outside from the outer surface of the head frame 18. The light emitting modules 11 adjacent to each other are arranged side by side so that the side surfaces of the hexagonal head frame 18 are brought into contact with each other and heat conduction is possible. Therefore, as described above, the heat released from the head frame 18 to the outside can be transmitted to each head frame 18 and diffused. Thereby, since the excessive temperature rise of the LED chip 15 which each light emitting module 11 had was suppressed, the fall of the luminous efficiency and lifetime of the LED chip 15 can be suppressed.

  A second embodiment of the present invention will be described with reference to FIGS. Since 2nd Embodiment is the same as 1st Embodiment except the matter demonstrated below, the same code | symbol is attached | subjected to the part same as 1st Embodiment, and the description is abbreviate | omitted.

  In the second embodiment, one light emitting module 11 disposed at the center of the apparatus main body 3a and six light emitting modules surrounding the one light emitting module 11 and continuously disposed in the circumferential direction therearound. 11 is used to form the light source unit 2. At the same time, the apparatus main body 3a is made large enough to accommodate these seven light emitting modules 11. The side surface of the hexagonal cylindrical portion 18a of the module head 12 included in each light emitting module 11 is in contact with the side surface of the hexagonal cylindrical portion 18a of the adjacent light emitting module 11 without a gap. Furthermore, heat receiving convex portions 3e are integrally formed at equal intervals in the circumferential direction at six locations on the inner peripheral surface of the apparatus main body 3a. These heat receiving projections 3e sandwich the other light emitting module 11 between the light emitting module 11 at the central position. The hexagonal cylindrical portion 18a of the light emitting module 11 that is sandwiched is in slight contact with the heat receiving convex portion 3e. Configurations other than those described above are the same as those in the first embodiment, including configurations not shown in FIGS. 6 and 7.

  Therefore, also in 2nd Embodiment, the temperature rise of the LED chip in the module head 12 with which each light emitting module 11 is provided can be suppressed. At the same time, the detachability of each module head 12 can be improved. In this case, as already described in the first embodiment, each light emitting module 11 is attached / detached mainly by a pushing operation from the front surface, so that a work space for attaching / detaching operation is surrounded by the six light emitting modules 11. The middle light emitting module 11 that cannot be secured can be easily detached from the front side without removing the surrounding light emitting modules. Also in the second embodiment, since a continuous light emitting surface is formed without a gap, the illumination device 1 having a good appearance can be obtained.

  By the way, in 2nd Embodiment, the heat radiation to the air | atmosphere from the middle light emitting module 11 enclosed by the six light emitting modules 11 is suppressed by the six surrounding light emitting modules 11. FIG. Nevertheless, the temperature rise of the light emitting module 11 in the middle can be suppressed as follows.

  That is, the side surfaces of the middle light emitting module 11 and the head frame 18 of the surrounding light emitting module 11 adjacent thereto are in contact with each other and can conduct heat with each other. For this reason, the heat generated by the LED chip with the lighting of the middle light emitting module 11 is conducted to the module heads 12 of the surrounding light emitting modules 11, and the module heads 12 of these surrounding light emitting modules 11 are transmitted to the outside. Can be released. Due to this heat dissipation, the temperature rise of the six light emitting modules 11 surrounding the middle light emitting module 11 is suppressed, and the temperature rise of the middle light emitting module 11 is suppressed, and the temperature of the LED chip included in each light emitting module 11 is suppressed. The rise can be suppressed.

  Moreover, in the present embodiment, not only the heat transmitted to the module head 12 of the surrounding light emitting module 11 surrounding the light emitting module 11 in the middle is released into the atmosphere, but also the heat receiving convex portion 3e of the metal device main body 3a. The apparatus main body 3a can be discharged to the outside of the apparatus main body 3a as a heat radiating member. Therefore, the temperature rise of the LED chip can be suppressed more effectively.

  A third embodiment of the present invention will be described with reference to FIG. Since 3rd Embodiment is the same as 1st Embodiment except the matter demonstrated below, the same code | symbol is attached | subjected to the same part as 1st Embodiment, and the description is abbreviate | omitted.

  In the third embodiment, the module holding device is formed by the socket 30, and the support device that supports the socket 30 is formed by the lighting tail 40. A plurality of sockets 30 are used, and they are supported by the lighting tail 40 so that they can be moved to any position along the longitudinal direction of the rail. A module body 21 of the light emitting module 11 is attached to each socket 30. Of course, the module head 12 of the light emitting module 11 is attached to and detached from the module body 21 by pushing operation. In the third embodiment, each light emitting module 11 arranged in a non-contact manner individually constitutes a light source unit. The configuration other than the points described above is the same as that of the first embodiment including the configuration not shown in FIG.

  Therefore, also in 3rd Embodiment, while being able to improve the attachment or detachment operativity of the module head 12 with which the light emitting module 11 is provided, the temperature rise of the LED chip in this head can be suppressed. Further, since the light emission colors of the module heads 12 may be the same or different, it is possible to illuminate with a desired light color by selecting the light emission color.

  A fourth embodiment of the present invention will be described with reference to FIG. Since the fourth embodiment is the same as the first embodiment except for the items described below, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  In 4th Embodiment, it is an example which comprised the illuminating device as the illumination apparatus 50, and the board-shaped module holder 51 is used for the module holding | maintenance apparatus. The module holder 51 has a large number of fitting holes 3c opened in the front thereof. Each fitting hole 3c is provided in a honeycomb shape. The module body 21 of the light emitting module 11 is inserted and attached to these fitting holes 3c in advance. And the module head 12 of the light emitting module 11 selects the arbitrary fitting hole 3c, and is attached or detached to the module body 21 in the selected fitting hole 3c. Of course, the module head 12 of the light emitting module 11 is attached to and detached from the module body 21 by pushing operation. The configuration other than the points described above is the same as that of the first embodiment including the configuration not shown in FIG.

  Therefore, also in 4th Embodiment, while being able to improve the attachment or detachment operativity of the module head 12 with which the light emitting module 11 is provided, the temperature rise of the LED chip in this head can be suppressed. In the fourth embodiment, the light emission color of each module head 12 is arbitrarily selected, and the module head 12 having the selected light emission color is attached by selecting an arbitrary fitting hole 3c of the module holder 51. Thus, for example, as shown in FIG. 9, a tree-shaped light source unit 2 can be obtained, and an arbitrary illumination device 50 desired by the user can be formed by changing the emission color of each unit.

  A fifth embodiment of the present invention will be described with reference to FIG. Since the fifth embodiment is the same as the first embodiment except for the items described below, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The fifth embodiment is an example in which the lighting device is configured as an outdoor garden lamp 60. That is, reference numeral 61 in FIG. 10 denotes a stand, and the upper end of the stand 61 is open. On the stand 61, a globe 62 made of a light diffusing material such as milky white translucent synthetic resin or glass is attached. The globe 62 is formed in an arc shape along the cylindrical portion of the stand 61. A ceiling member 63 made of a light shielding material is connected to the globe 62. A reflective member 64 having a conical shape protrudes from the lower surface of the ceiling member 63. In addition, the light source unit 2 including, for example, three light emitting modules 11 is accommodated in the column portion of the stand 61. The light emitting surface of each light emitting module 11 faces the reflecting member 64 from below. For this reason, the light emitted from the light source unit 2 can be reflected by the reflecting member 64 toward the globe 62, and the globe 62 can be illuminated to illuminate the surroundings of the garden lamp 60. There is a space between the light emitting module 11 and the reflecting member 64, and the module head of each light emitting module 11 is attached and detached through this space. Configurations other than those described above are the same as those in the first embodiment, including configurations not shown in FIG.

  Therefore, also in 5th Embodiment, while being able to improve the attachment or detachment operativity of the module head with which the light emitting module 11 is provided, the temperature rise of the LED chip in this module head can be suppressed.

(A) is a perspective view which shows the illuminating device which concerns on 1st Embodiment of this invention. (B) is a front view which shows the light source part of the illuminating device of FIG. 1 (A). The perspective view which shows the light source part of the illuminating device which concerns on 1st Embodiment in the state which made the one module head protrude. The perspective view of the light emitting module of the illuminating device which concerns on 1st Embodiment. Sectional drawing which shows the light emitting module of FIG. 3 in an assembly state. Sectional drawing which shows the light emitting module of FIG. 3 in the state which isolate | separated the module body from the module body. The front view which shows the light source part of the illuminating device which concerns on 2nd Embodiment of this invention. The perspective view which shows the light source part of FIG. The perspective view which shows the illuminating device which concerns on 3rd Embodiment of this invention. The perspective view which shows the illuminating device which concerns on 4th Embodiment of this invention. The perspective view which shows the illuminating device which concerns on 5th Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Illuminating device, 2 ... Light source part, 3 ... Module holding apparatus, 5 ... Lighting apparatus, 11 ... Light emitting module, 12 ... Module head, 13 ... Light emitting part, 14 ... Substrate, 15 ... LED chip (semiconductor light emitting element), DESCRIPTION OF SYMBOLS 16 ... Plug part, 17 ... Plug-in terminal, 18 ... Head frame, 18a ... Hexagonal cylinder part, 18b ... Tapered cylinder part, 18c ... End wall, 19 ... Front cover (light control member), 21 ... Module body, 22 ... Opening 25 ... Pop-up mechanism, 26 ... Receiving terminal, 27 ... Actuator, 28 ... Biasing member.

Claims (2)

A light-emitting unit having a semiconductor light-emitting element mounted on a substrate; a hexagonal and metal head frame in which the light-emitting unit is accommodated; and a plug terminal electrically connected to the light-emitting unit. A module head comprising a plug portion protruding on the back side of the head frame;
A module body having an opening through which the plug portion is inserted and removed;
The module body has a receiving terminal that is brought into and out of contact with the insertion terminal as the plug portion is inserted into and removed from the module body, and the plug portion is inserted when the plug portion is inserted into the module body. A pop-up mechanism that holds the module head in a state in which a terminal is in contact with the receiving terminal, and pushes back the module head based on the further pressing of the head frame from the holding state to project the head frame;
A light emitting module comprising: A light source unit comprising a plurality of the light emitting modules according to claim 1 and a plurality of the light emitting modules arranged in parallel;
A module holding device that supports module bodies included in the plurality of light emitting modules, and that holds the side surfaces of the hexagonal head frames adjacent to each other in contact with each other;
A lighting device for supplying power to each light emitting unit of the light source unit;
An illumination device comprising:

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