JP2007258053A - Manufacturing method of organic electroluminescent panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an organic electroluminescent panel in which there is scarcely an outside region of a light emitting area, that is, a frame, necessary for mounting and sealing a wiring member and a driving circuit, in which the light emitting area after mounting can be obtained widely, and moreover, in which there is no deterioration of the alignment precision of a connection part of an element board and a flexible circuit board in mounting because of the deformation of the board caused by heat in sealing. <P>SOLUTION: This manufacturing method of the organic electroluminescent panel is composed by successively carrying out a process of forming a first electrode layer on the board, a process of forming an organic layer including at least one layer of light emitting layer, a process of forming a second electrode layer, a mounting process of the mounting member including the wiring member or the driving circuit, and a sealing process. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for producing an organic electroluminescence panel and an organic electroluminescence panel produced thereby.

  In recent years, organic electroluminescence panels (organic EL panels) have attracted attention as surface light emitters that are lightweight, thin, and have excellent shape flexibility.

  2. Description of the Related Art An organic EL element structure is used as a unit pixel, and this unit pixel is two-dimensionally arranged and driven on a transparent substrate.

  For example, a striped transparent electrode group is formed on a transparent substrate, an organic layer including an organic EL light emitting layer is formed on the electrode group, and a striped metal electrode group orthogonal to the transparent electrode group is further formed thereon. In addition, the intersection between the transparent electrode group and the metal electrode group is two-dimensionally arranged in a plane as an organic EL element structure which is a unit pixel.

  After each element is formed, in order to drive each pixel by a signal from the driving IC, the transparent electrode group and the metal electrode group include wiring members that serve as electrode leads that individually connect the electrode groups to the driving IC. Are implemented respectively. As a result, the driving circuit including the wiring member and the driving IC is mounted, and the operation of the organic EL panel becomes possible. In addition, since the organic EL element is weak against an active gas such as oxygen, it is indispensable to enclose and seal the inert gas. After mounting the drive circuit, the organic EL element is sealed with a sealing material.

  Usually, the organic EL element is sealed after mounting a drive circuit, a wiring member, or a mounting member having at least a wiring member. However, in mounting an organic EL panel using a resin film substrate, a light emitting area has been used so far. There is a problem that a sealing part and a mounting part are required outside of the frame, and the frame becomes large.

  Further, when a mounting member such as a wiring member or a drive circuit is mounted after sealing, the substrate is deformed by heat generated at the time of sealing, and the alignment accuracy between the connecting portion of the substrate and the flexible substrate at the time of mounting is lowered.

  So far, in an inorganic EL device, a structure including a lead portion (connecting portion) from an electrode in a sealing structure has been disclosed, and this is a device that adjusts the thickness of the lead portion of the electrode portion to connect and seal. Therefore, the stress concentration of the lead portion due to the sealing is relieved, and the meaning is different from the sealing of the organic EL against moisture or the like, and the main purpose is to surely fix (Patent Document 1). In addition, the organic EL is known to perform sealing adhesive and electrode connection simultaneously with the ACF (Patent Document 2). However, since the ACF also serves as the sealing adhesive, the normal sealing performance is ensured. Is difficult.

Japanese Patent Application Laid-Open No. 2004-228688 is that aging is performed before sealing, but the mounting is performed after sealing and is different from the present invention.
JP-A-8-22892 JP 2000-243555 A JP 2005-276730 A

  An object of the present invention is to generate a large light emitting area after mounting without generating a large area outside the light emitting area, so-called frame, which is necessary for mounting and sealing a wiring member and a drive circuit. There is an organic electroluminescence panel manufacturing method in which the alignment accuracy of a connection portion of an element substrate and a flexible circuit board at the time of mounting is not lowered due to deformation of the substrate due to heat.

  The above object of the present invention is achieved by the following means.

  1. A step of forming a first electrode layer on a substrate, a step of forming an organic layer including at least one light emitting layer, a step of forming a second electrode layer, a mounting step of a mounting member including a wiring member or a drive circuit, And a sealing step, which are sequentially performed. A method for manufacturing an organic electroluminescence panel, comprising:

  2. 2. The method for producing an organic electroluminescence panel according to 1, wherein a resin film is used as the sealing member in the sealing step.

  3. In the sealing step, a resin film is used, and the entire surface or a film peripheral part is adhered and sealed with an adhesive, and at least a part of the mounting part is included in the part to be sealed. 3. The method for producing an organic electroluminescence panel according to 1 or 2, wherein sealing is performed.

  4). 4. The method for manufacturing an organic electroluminescence panel according to any one of 1 to 3, wherein the substrate is a resin film.

  5. 5. The method for manufacturing an organic electroluminescence panel according to any one of 1 to 4, wherein the distance between the mounting member and the end of the light emitting area is 0.2 to 2 mm.

  6). 6. The method for producing an organic electroluminescence panel according to any one of 1 to 5, wherein an aging process and a sealing process are sequentially performed after the mounting process.

  7). An organic electroluminescence panel produced by the method for producing an organic electroluminescence panel according to any one of 1 to 6 above.

  By narrowing the frame, the light emitting area after mounting the organic EL panel can be widened, the manufacturing process can be simplified, the yield can be improved by improving the alignment accuracy, and the tact time can be improved.

  Hereinafter, the best mode for carrying out the present invention will be described.

  Conventionally, the organic EL manufacturing process is generally performed in the order of substrate cleaning / first electrode formation / organic layer formation (film formation) / second electrode formation / sealing / mounting. FIG. 3 shows a flow chart of a conventional organic EL manufacturing process. As described in Patent Document 3, after organic layer formation (film formation) and second electrode layer formation, sealing is performed immediately without exposing to the atmosphere as much as possible in order to suppress deterioration. Thereafter, a mounting member made of a wiring member or a driving electric circuit (driving IC) is mounted.

  However, when the organic EL element formed on the substrate is sealed using a resin film as a sealing member, or using a thermosetting or UV curable resin, There is a problem that thermal deformation occurs and alignment accuracy becomes more difficult when the wiring member or the driving electric circuit is mounted.

  This will be described with reference to FIGS. 5 and 6 in a general mounting process. FIG. 5 shows that a mounting member 6 (a flexible circuit board (FPC) on which wiring ICs and driving ICs are mounted) is mounted on a substrate 1 having an organic EL element, and further a sealing member (in this case, a resin film). It is the schematic which looked at the panel of the organic electroluminescent panel adhere | attached and sealed by this from the upper surface. Although not shown, for example, on the substrate 1 which is a transparent substrate, a stripe-shaped transparent electrode layer is formed as a first electrode constituting an organic EL element, for example, an anode, and an organic EL is formed thereon. Further, a cathode layer as a second electrode layer is also laminated in a stripe shape so as to be orthogonal to the stripe of the transparent electrode layer (for example, a simple matrix type organic EL element). On top of this, a resin film is stacked as the sealing member 7, and an organic EL element composed of a first electrode layer, an organic EL layer, and a second electrode layer is sandwiched and sealed between the substrate 1 and the substrate 1. ing.

  Each of the stripe-shaped first electrode layers (omitted in FIG. 5) has an electrode lead portion, which is different from the corresponding wiring member of the mounting member 6 having a driving IC, a wiring member, and the like. It has a structure bonded by the isotropic conductive adhesive layer 5.

  Referring to FIG. 6, the electrode lead portion 2a of the first electrode layer (for example, the ITO transparent electrode layer as the anode) formed in a stripe shape and the wiring member 6a of the mounting member 6 are formed of an anisotropic conductive adhesive layer. The process of bonding and connection according to 5 will be described.

  FIG. 6F is an enlarged view of the bonded portion between the electrode and the wiring member when the electrode lead portion 2a of the first electrode layer 2 and the wiring member 6a of the mounting member 6 are mounted using an anisotropic conductive adhesive. Is shown. In practice, the second electrode layer (for example, the cathode made of a metal such as aluminum) is simultaneously connected to the mounting member in exactly the same manner. Only the connection between the layer and the mounting member will be described.

  That is, in FIG. 6F, the connection portion with the mounting member, that is, the electrode lead-out portion 2a of the first electrode layer 2 and the mounting member, excluding the resin film as the sealing member from the element substrate. This shows that the wiring member 6a is adhered by the anisotropic conductive adhesive layer 5. Reference numeral 6b denotes a driving IC.

  FIG. 6E is a cross-sectional view of the connecting portion between the mounting member and the substrate. The electrode lead portion 2 a of the stripe-shaped first electrode 2 formed on the substrate and the wiring member 6 a are bonded and connected by the anisotropic conductive adhesive layer 5. Reference numeral 3 denotes an organic EL layer constituting an element of the display unit, and the second electrode as a counter electrode is omitted in the figure.

  FIG. 6A shows a state in which the electrode layer, the electrode lead portion, and the organic layer are formed on the substrate 1.

  FIG. 6B is a process of attaching an anisotropic conductive adhesive (ACF), where the anisotropic conductive adhesive layer 5 is formed and disposed on the electrode lead portion 2a of the electrode. Show. FIG. 6C is a process of temporarily adhering (aligning) the mounting member onto the anisotropic conductive adhesive layer 5, and each of the electrode lead portions of the striped electrode is a flexible circuit board (mounting member). FPC) is aligned, placed, and temporarily bonded so as to correspond to the wiring member 6a. FIG. 6D shows the main bonding step, in which the anisotropic conductive adhesive layer 5 is overlapped between the aligned wiring member 6a and the electrode lead-out portion 2a through a pressure dispersion rubber or the like. For example, each electrode lead-out portion 2a of the electrode is pressed by heating and / or pressurization with a heating head, and the corresponding wiring member 6a conducts, and the mounting member 6 is mounted on the organic EL element substrate.

  FIG. 7 shows an enlarged view of the connection part in such a mounting process. The electrode lead part 2a of the substrate 1 on which the organic EL element is formed and the wiring member 6a of the flexible circuit board (FPC) as the mounting member are different. When bonding is performed using an isotropic conductive adhesive (ACF), a line width of a pitch of several tens of μm must be aligned (alignment) in the case of a high-definition mounting position from about 100 μm.

  Therefore, actual alignment is performed with reference to alignment marks formed on the electrode lead-out portion 2a on the substrate and the wiring member 6a on the FPC as shown in FIG.

  If one FPC is 500 lines, for example, when the pitch is 50 μm (line / space = 25 μm / 25 μm), the distance between both ends is 25 mm (FIG. 7). At this time, if the substrate side is deformed by thermal expansion by 0.1% due to heat, a total deviation of 25 μm in width occurs. Then, when the line on one end side is aligned, the line on the opposite end part completely corresponds to the line, and the connection due to such misalignment becomes a problem.

  In the present invention, a mounting process requiring accuracy is performed before thermal deformation of the substrate occurs. Even in this case, after mounting, heat is applied by sealing, but the wiring member and the electrode lead-out portion of the electrode are already bonded with an anisotropic conductive adhesive (ACF), so that the effect of suppressing deformation itself is suppressed. In addition, even if it is somewhat deformed, conduction is maintained if the adhesive force by the anisotropic conductive adhesive (ACF) is strong. Therefore, it is more effective than alignment after deformation.

  When the mounting process is performed after sealing the organic EL element substrate, it is possible to design with the amount of deformation when sealing the organic EL element first, but how to apply heat during sealing Is unstable, and when a plurality of panels are produced from a single substrate, the amount of thermal deformation changes depending on the position of the substrate, so that the reproducibility is difficult, which is not practical.

  In addition, when the mounting process is performed prior to the sealing process as in the present invention, another merit is born. That is, since there is a mounting process after the panel sealing process in the normal order, an area required for mounting becomes large.

  For example, when sealing up to +2 mm with respect to the light emitting area, the mounting width is usually 1.5 to 2 mm, but in order not to affect the sealing portion, at least 1 to 1 from the sealing end to the mounting portion. A margin of 2 mm is required. This is because the head during mounting and the rubber during thermocompression bonding may be larger than the mounting portion. However, in the order of the present invention, since it is mounted before sealing, it can be mounted with a margin of 1 to 2 mm with respect to the light emitting area. Thereafter, sealing can be performed up to the end of the mounting portion, and the required width can be reduced by mounting.

  In the case of sealing later, the mounting portion can be sealed together, and the mounting portion can be reinforced.

  In Patent Document 2, the anisotropic conductive adhesive is used for sealing and mounting at the same time. In this case, the merit for deformation can be obtained as in the present invention. However, in the method using ACF sealing, It is difficult to ensure sealing performance.

  Therefore, in the present invention, by mounting before sealing with a sealing member such as a resin film, it is possible to bring the mounting area closer to the light emitting area than when mounting after sealing. That is, the frame portion of the panel can be reduced by performing sealing including the mounting portion.

  Also, mounting before sealing prevents the substrate from being deformed due to heat generated during sealing, and lowering the alignment accuracy between the board connection portion and the flexible circuit board (FPC) during mounting. It can be mounted without deformation of the substrate. Therefore, problems such as alignment failure can be reduced.

  As will be described later, by mounting before sealing, aging can be performed using a drive circuit before sealing, and oxygen sealing or the like is unnecessary.

  Hereinafter, although the preferable embodiment of the process is described about the manufacturing method of the organic electroluminescent panel of this invention, this invention is not limited by this.

  FIG. 1 shows a flowchart of an example of the manufacturing process of the present invention.

  Hereafter, each process is demonstrated sequentially using FIG.2 and FIG.4.

  The first electrode layer forming step is a step of forming the first electrode layer 2, for example, a transparent electrode such as ITO as an anode in a stripe shape on the substrate 1. Each stripe of the first electrode layer 2 is formed to have an electrode lead portion for mounting.

  In the first electrode layer forming step, as shown in FIG. 2A, the first electrode layer 2 and its electrode lead-out portion 2a are, for example, an anode on the substrate (corresponding to the number of pixels). In this case, a transparent electrode layer such as ITO is formed in a stripe shape by using a mask or etching after forming a thin film on the entire surface.

  Further, in the organic layer forming step, one or more organic layers 3 including the light emitting layer are sequentially formed on the entire surface of the first electrode layer.

  Further, in the second electrode layer forming step, for example, a mask or the like is used, and the second electrode layer 4 is also striped. For example, in the case of a cathode, a metal electrode layer such as aluminum is used as the first electrode layer. It is formed in a shape perpendicular to the electrodes. This is shown in FIG. Each overlapping portion of the anode and cathode stripes becomes a light emitting region of the organic EL element.

  The transparent first electrode 2 that is an anode or the second electrode 4 (cathode) made of aluminum also has electrode lead portions 2a and 4a, respectively, on which a wiring member of a flexible circuit board (FPC) that is a mounting member Are bonded and connected to mount the FPC.

  Connection between the electrode lead portions 2a and 4a on the organic EL element substrate and a wiring member such as FPC which is a mounting member is made using an anisotropic conductive adhesive. Here, a mounting process is shown by using the electrode lead portion 2 a of the first electrode layer 2. Actually, the FPC is mounted on the cathode as the second electrode as well as at the same time as the first electrode.

  FIG. 2 (c) shows, for example, a case where the anisotropic conductive adhesive layer 5 is disposed on the electrode lead portion 2a of the transparent electrode that is the anode. After application of the anisotropic conductive adhesive, the wiring members 6a of the mounting member 6 (FPC) are aligned and overlapped as shown in FIG. 6D, and further via a pressure dispersion rubber or the like. For example, by heating and pressurizing with a heating head, each stripe-shaped electrode and the corresponding wiring member are bonded and conducted by pressure bonding with the anisotropic conductive adhesive layer 5.

  4A to 4D are sectional views showing the steps of bonding the mounting member and sealing with the sealing member.

  FIGS. 4A and 4B are cross-sectional views showing the bonding of the mounting member.

  After the formation of the first electrode layer (here, the anode made of a transparent conductive film), the organic layer 3 and the second electrode layer 4 (FIG. 4A), on the electrode lead-out portion 2a of the first electrode layer After the anisotropic conductive adhesive layer 5 is disposed, the wiring member 6a of the mounting member 6 such as an FPC is overlaid and bonded by heat and pressure to be connected to the drive circuit ((b) in FIG. 4). ).

  Here, for the sake of explanation, the connection between the electrode lead portion of the first electrode layer and the wiring member is shown. However, the same applies to the second electrode layer, and it is desirable to carry out simultaneously with one mounting member.

  The substrate on which the FPC is mounted in this way is then sealed with a sealing member 7 such as a gas barrier resin film so as to cover the organic layer 3 and the second electrode layer 4, for example, an epoxy resin system, an acrylic resin system, etc. It is cured, adhered, and sealed using a thermosetting or photocurable adhesive made of

  FIG. 2E shows a top view when a gas barrier resin film is overlapped on the substrate so as to cover an adhesion portion between the electrode lead portion and the FPC wiring member, and a sealing structure is formed. 4C and 4D are cross-sectional views of the sealing portion.

  Sealing is performed by applying a sealing adhesive, for example, an epoxy resin-based or acrylic resin-based light or thermosetting adhesive to the entire surface of the substrate including the second electrode layer, and then adjusting the size of the gas barrier resin. The film is used as a sealing member (the sealing adhesive may be applied to the sealing member), and after overlapping so that no gas enters inside, the sealing adhesive is applied by light or heat. The whole surface between the substrate 1 and the sealing member 7 is sealed with a sealing adhesive 8 and sealed. The substrate 1 and the sealing member 7 are bonded together by this method, and the sealed organic EL panel is shown in FIG.

  As the sealing method, for example, a sealing adhesive may be applied to the periphery of the substrate, and the gas barrier resin film and the periphery may be bonded and sealed, and the sealing method is not limited. In this case, it is preferable to seal in an inert atmosphere so that active gas and moisture are not mixed inside.

  In the present invention, since the sealing is performed after the mounting member is mounted, the entire area including the mounting work area can be sealed. In addition to the area required for bonding, the work area at the time of mounting, for example, the area where the pressure dispersion rubber is larger than the mounting part such as the head and wiring member at the time of mounting, etc. There is no need to take a separate area for the purpose.

  Therefore, in the present invention, the working area for mounting can be reduced such that the distance between the mounting member and the end of the light emitting area (L in FIG. 4C) is 0.2 to 2 mm. The feature is that the non-light emitting area around the area can be reduced and the light emitting area can be increased.

  Therefore, since the sealing can be performed by using the work area for mounting as the work area for sealing, as shown in FIG. 4D, the work area for sealing can also be reduced. The working area for both sealing can be minimized. Since only the work area necessary for the mounting can be left from the display area boundary, the mounting can be performed only by this work area (the portion of the width L from the display area in FIG. 6D). However, it is preferable in terms of sealing performance that sealing is performed so that at least a part of the mounting portion is included in the sealed portion. However, even if the sealing is performed so as to include a part of the mounting member, the work area including the both can be surely minimized (FIG. 4D).

  In the case of further mounting outside the sealing region after sealing, this is not achieved because it is further mounted on a part of the electrode lead-out portion outside the sealing region.

  In the present invention, the flow is shown in FIG. 8, but it is preferable to perform the sealing step after performing the aging after the mounting step.

  According to the present invention, since the mounting process and the sealing process are sequentially performed, the aging process can be performed before the sealing. The organic EL element after mounting can be driven, and by applying driving, that is, current, to each element, a minute defect portion between the first electrode and the second electrode on each organic EL element can be removed. Can be removed. This defect part is derived from a defect caused by dust or dust because the organic EL layer is very thin. However, if there is a minute defect, the minute defect is caused by Joule heat when the anode and cathode are short-circuited. The part can be destroyed. It is more advantageous to destroy this defect in the presence of oxygen, and aging after packaging and before sealing can be easily performed.

  The support substrate according to the organic EL panel of the present invention is not particularly limited in kind, such as glass and plastic, and may be transparent or opaque. However, when light is extracted from the support substrate, it is transparent. Preferably there is. The transparent substrate preferably used includes glass, quartz, and a transparent resin film. Particularly, polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) that can give flexibility to the organic EL element. Resin films including cycloolefin resins such as polyimide, polyethersulfone (PES), Arton (trade name, manufactured by JSR) or Apel (trade name, manufactured by Mitsui Chemicals) are preferred.

  Further, the method of the present invention is suitable when a resin film substrate that easily expands and deforms due to heat or the like at the time of sealing is used.

Further, the surface of the resin film may be a film having a high gas barrier property in which an inorganic film, an organic film or a hybrid film thereof is formed. Water vapor permeability (40 ° C., 90% RH) measured by a method according to JIS K 7129-1992 is 0.01 g / m ² / day or less, more preferably 10 ⁻³ g / m ² / day or less, Moreover, it is preferable that it is a high barrier film whose oxygen permeability (20 degreeC, 100% RH) measured by the method based on JISK7126-1992 is 10 < ^-3 > g / m < ² > / day or less. In particular, the water vapor permeability and oxygen permeability are more preferably 10 ⁻⁵ g / m ² / day or less. For example, silicon oxide, silicon dioxide, silicon nitride, or the like can be used as a barrier film material formed on the surface of the resin film to form a gas barrier film.

  These gas barrier films are also suitable as a sealing member used for sealing the substrate.

  As the sealing member, those having a low water vapor permeability or oxygen permeability such as glass and resin film are used. In the present invention, a resin film capable of giving flexibility to the organic EL element is preferable. In particular, a composite film having the barrier film material film on the surface of the resin film is preferable because it has low water vapor permeability and low oxygen permeability.

  Further, a resin-laminated (polymer film) metal foil (for example, aluminum foil) or the like is also a low-cost material with low moisture permeability and is preferable as a sealing member.

  As an adhesive used for sealing, an adhesive generally used for glass, plastic substrates and the like can be used without limitation.

  For example, polyvinyl acetate-based adhesives, acrylic acid-based oligomers, methacrylic acid-based oligomers, etc., photocuring and thermosetting acrylic adhesives having reactive vinyl groups, epoxy resin adhesives, 2-cyanoacrylates, etc. Moisture curable adhesives, phenolic resin adhesives, polyurethane adhesives, rubber adhesives, and the like can be mentioned. Particularly preferred adhesives include acrylic adhesives, epoxy adhesives, and the like. I can list them. Among them, an epoxy adhesive having a small shrinkage upon curing is preferable.

  Examples of the epoxy-based adhesive include 3950, 3951, 3952, 2083, 2086, 2230, 2230B, 3124C, etc., manufactured by Three Bond Co., Ltd., and XNR5576 / 5576LV and XNR5516 / 5516HV manufactured by Nagase ChemteX Corporation. , XNR5570, and the like.

  Examples of acrylic adhesives include Three Bond Co., Ltd., 3003, 3027B, 3033B, 3042B, etc., and Cemedine Co., Ltd., Cemedine Y600, Y600H.

  These adhesives are polymerized and cured by irradiation with energy rays such as ultraviolet rays and electron beams, and heat.

  Regarding the organic layer including the light emitting layer constituting the element on the organic EL panel in the present invention, and the cathode and the anode, regarding the material constituting them, for example, JP-A-2005-340121, 2005- No. 353297 and the like can be referred to.

It is a flowchart which shows an example of the manufacturing process of this invention. It is a figure explaining each process of the manufacturing process of this invention. It is a figure which shows the flowchart of the manufacturing process of the conventional organic electroluminescent panel. It is sectional drawing which shows the process of adhesion | attachment of a mounting member, and the sealing by a sealing member. It is the upper surface schematic diagram of the organic electroluminescent panel by which the mounting member was mounted in the board | substrate and sealed with the member for sealing. It is a figure explaining a general mounting process. The enlarged view of the connection part in a mounting process is shown. It is a figure which shows the flow of this invention which performs an aging and performing a sealing process after a mounting process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 1st electrode layer 2a, 4a Electrode extraction part 3 Organic layer 4 2nd electrode layer 5 Anisotropic conductive adhesive layer 6 Mounting member 7 Sealing member

Claims (7)

A step of forming a first electrode layer on a substrate, a step of forming an organic layer including at least one light emitting layer, a step of forming a second electrode layer, a mounting step of a mounting member including a wiring member or a drive circuit, And a sealing step, which are sequentially performed. A method for manufacturing an organic electroluminescence panel, comprising: In the said sealing process, a resin film is used as a sealing member, The manufacturing method of the organic electroluminescent panel of Claim 1 characterized by the above-mentioned. In the sealing step, a resin film is used, and the entire surface or a film peripheral part is adhered and sealed with an adhesive, and at least a part of the mounting part is included in the part to be sealed. 3. The method for producing an organic electroluminescence panel according to claim 1, wherein sealing is performed. The said board | substrate is a resin film, The manufacturing method of the organic electroluminescent panel of any one of Claims 1-3 characterized by the above-mentioned. The method for manufacturing an organic electroluminescence panel according to claim 1, wherein the distance between the mounting member and the end of the light emitting area is 0.2 to 2 mm. The method of manufacturing an organic electroluminescence panel according to claim 1, wherein an aging process and a sealing process are sequentially performed after the mounting process. An organic electroluminescence panel produced by the method for producing an organic electroluminescence panel according to claim 1.

Images