JP2007256209A - Connection state inspection method and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection state inspection method which enables automatic and accurate determination of the state of pressure-bonding connection of a board that uses ACF. <P>SOLUTION: In the connection state inspection method, the height of a flexible board is measured for each prescribed interval. For the height measurement data, in the surroundings of each prescribed reference position, corresponding to the vicinity of both ends of the pressure bonding connection portion, a range with the same height at a prescribed width is detected as the outermost electrode position. A position which is outside the electrode detected as the outermost electrode position on the flexible board and has a height the same as the electrode detected as the outermost electrode position is detected. The comparison of the distance from the outermost electrode position to the position with the same height is performed in each of both end parts of the pressure bonding connection portion on the flexible board, and this difference is determined as the connection failure, when the difference is not larger than the reference value. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a connection state inspection method and apparatus in a step of crimping and connecting a flexible substrate to a predetermined electrode surface with an anisotropic conductive adhesive.

In the connection process between the flexible substrate and the electrode, whether the connection state is good or bad is determined by manual appearance inspection or image inspection using an inspection apparatus. However, in the appearance inspection by hand, there is a problem that the cost increases as the number of inspection points increases, and in the inspection by the inspection apparatus, there is a problem that the quality of the connection state cannot be accurately determined.
JP 2003-269934 A

  The present invention has been made in view of such a conventional technical problem, and an object thereof is to provide a connection state inspection method and apparatus that can automatically and accurately determine the connection state between electrodes.

  The present invention is a connection state inspection method in which a flexible substrate is crimped and connected to a predetermined electrode surface with an anisotropic conductive adhesive, and the quality of the connection state is determined, and the surface height of the flexible substrate is determined. A height measurement step that measures at predetermined intervals and a range that is the same height with a predetermined width is detected as the outermost electrode position around each of the predetermined reference positions corresponding to the vicinity of both ends of the crimping connection portion on the flexible substrate. An outermost electrode position detecting step, and a position of the outermost electrode position on the flexible substrate outside the electrode determined as the outermost electrode position in the outermost electrode position detecting step and a height of the electrode set as the outermost electrode position. Detecting a position having the same height as the first electrode, and from the outermost electrode position in the vicinity of both ends of the crimp connection portion on the flexible substrate to the position having the same height. Distance determined, the distance is one having a determining connection quality determining step connected with poor if less than the reference value.

  The present invention also relates to a connection state inspection method in which a flexible substrate is crimped and connected to a wiring substrate with an anisotropic conductive adhesive, and the connection state inspection method for determining whether the connection state is good or not is provided. A height measuring step for measuring the height, an outermost electrode position detecting step for detecting an outermost electrode position around each of predetermined reference positions corresponding to the vicinity of both ends of the crimping connection portion on the flexible substrate, and the flexible A lowermost point detecting step for detecting a height of a lowermost point within a predetermined range outside the outermost electrode position detected by the outermost electrode position detecting step on the substrate; and the outermost electrode position on the flexible substrate. A connection quality determination step of comparing a difference between the height of the electrode position and the height of the lowest point and determining a connection failure when the difference is less than a reference value.

  In the connection state inspection method of the above invention, in the height measurement step, the surface height of the flexible substrate is measured at a predetermined interval with a laser displacement meter, and the predetermined reference position of the measurement data is measured. Leveling is performed based on the height, and the data after the leveling process can be used as height measurement data.

  The connection state inspection method according to the invention may further include a moving average step for obtaining a moving average of the height data measured in the height measuring step.

  In addition, the present invention is a connection state inspection apparatus for crimping and connecting a flexible substrate to a predetermined electrode surface with an anisotropic conductive adhesive, and determining the quality of the connection state, the outer surface of the flexible substrate A height measuring means for measuring the height of the outer peripheral electrode at a predetermined interval, and an outermost electrode having a predetermined width and the same height around a predetermined reference position corresponding to the vicinity of both ends of the crimping connection portion on the flexible substrate. An outermost electrode position detecting means for detecting a position of the electrode on the flexible substrate at a position outside the electrode at which the outermost electrode position detecting means is the outermost electrode position and the outermost electrode position. A position detecting means for detecting a position having the same height as the height, and a distance from the outermost electrode position to the position having the same height in the vicinity of both ends of the crimping connection portion on the flexible substrate. , In which the distance is a determining connection quality determination unit connected to the failure in the case of less than the reference value.

  In addition, the present invention is a connection state inspection apparatus that crimps and connects a flexible substrate to a wiring substrate with an anisotropic conductive adhesive, and determines whether or not the connection state is good. A height measuring means for measuring the height, an outermost electrode position detecting means for detecting an outermost electrode position around each of predetermined reference positions corresponding to the vicinity of both ends of the crimping connection portion on the flexible substrate, and the flexible A lowermost point detecting means for detecting a height of the lowest point within a predetermined range outside the outermost electrode position detected by the outermost electrode position detecting means on the substrate; and the outermost electrode on the flexible substrate. A connection quality determination unit is provided that compares the difference between the height of the electrode position and the height of the lowest point, and determines that the connection is defective when the difference is less than a reference value.

  In the connection state inspection apparatus according to the invention, the height measuring means measures the surface height of the flexible substrate at predetermined intervals, and the predetermined data is measured with respect to the measurement data of the laser displacement meter. Leveling means that performs leveling with reference to the height of the reference position and outputs the data after the leveling process as height measurement data can be used.

  The connection state inspection apparatus according to the present invention may further include a moving average calculating means for obtaining a moving average of height data measured by the height measuring means.

  According to the connection state inspection method and apparatus of the present invention, it is possible to automatically and accurately determine the connection state of the flexible substrate to a predetermined electrode surface.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  (First Embodiment) FIG. 1 shows a connection state inspection system according to a first embodiment of the present invention. For the crimped component 3 carried out from the stage 2 of the thermocompression bonding apparatus 1, FIG. It consists of a laser displacement meter 4 that performs shape measurement and a connection state inspection device 5.

  Here, the step of crimping and connecting the electrode of the flexible substrate to a predetermined electrode surface of the printed wiring board using an anisotropic conductive film ACF (Anisotropic Condactive Film) as the anisotropic conductive adhesive is shown in FIG. As shown in FIG. 6B, a printed wiring board 103 on which an electrode 102 is formed is placed on a stage 101, and an ACF 104 is overlaid thereon. Next, the flexible substrate 106 on which the electrode 105 is formed is overlaid on the ACF 104 with the electrode 105 surface facing the surface (electrode surface) on which the electrode on the printed wiring board 103 side is formed, and the flexible substrate 106 is used with the crimping tool 107. 106 is heated and pressurized. As a result, the charged particles 104A in the ACF 104 are interposed between the electrodes 102 and 105 to electrically connect both electrodes, and at the same time, the adhesive 104B of the ACF 104 insulates the printed wiring board 103 and the flexible board 106 from each other. Adhere mechanically. In this way, the crimped part 3 is obtained.

  The connection state inspection device 5 is realized by a computer system that takes in the measurement data of the laser displacement meter 4 and processes it according to a predetermined inspection program. This is a configuration as shown in FIG. That is, a shape measurement data input unit 6 for processing measurement data at predetermined intervals by the laser displacement meter 4, for example, every 5 μm, and an averaging processing unit 7 for calculating a moving average of the measurement data at predetermined intervals by a predetermined number, A leveling processing unit 8 that performs leveling processing on the measurement data after moving average processing, an electrode position detection unit 9 that detects the positions of both outermost electrodes from the data after leveling processing, and the electrode position detection unit 9 The connection state determination processing unit 10 determines whether the connection state between the connection substrate electrodes is good or bad from the positions of the electrodes at the outermost positions detected by the above.

  Next, a connection state inspection method by the connection state inspection apparatus having the above configuration will be described with reference to the flowchart of FIG. Measurement data at a predetermined interval, for example, every 5 μm is taken in from the laser displacement meter 4 by the displacement measuring unit 6 (steps S1 and S2). FIG. 4A is a graph showing height measurement data of a total length of 5 mm for each 5 μm of the crimped component 3.

  Next, the averaging processing unit 7 calculates a moving average of a predetermined number of pieces of measurement data, for example, five pieces of continuous data, and reduces measurement noise (step S3). FIG. 4B shows the result of moving average processing of five pieces of height measurement data of a total length of 5 mm for every 5 μm, that is, a range of 25 μm for the crimped part 3 shown in FIG.

  Next, with respect to the measurement data averaged from the measurement start point data to the measurement end point data by the leveling processing unit 8, the length of the non-measurement target crimped part 3 is taken into consideration, and the horizontal axis X Leveling is performed on the basis of the height of predetermined coordinate point X = −α, α of the axis (step S4). For example, FIG. 4C shows the result of leveling the measurement data after the averaging process of FIG. 4B with reference to the heights of X = −1.1 and X = 1.1. ing. This graph shows the result of leveling with reference to ± 0.1 and the maximum value as a reference.

  Subsequently, the electrode position detector 9 detects a range having the same height at a predetermined interval around the reference coordinate point X = −α, α as the outermost electrode position (step S5). FIG. 4D shows the result of detecting the outermost electrode.

  This electrode position detection method is shown in the flowcharts of FIGS.

  (i) As shown in FIG. 5A, the leveling reference point is determined as the temporary electrode center (step S11).

  (ii) The temporary electrode center determined in (i), that is, the height (A, B) at the position 0.1 mm to the left and right of the leveling reference point is extracted from the averaged measurement data (step S12).

  (iii) The following determination is performed for (A, B) extracted in (ii) (step S13). When A> B, that is, in the state of FIG. 5A, the temporary electrode center is moved to the left as shown in FIG. 5B (step S14). Conversely, when A <B, The center of the electrode is moved to the right (step S15), and the process of step S12 of (ii) is executed again. As shown in FIG. 5B, when A = B, the points A and B are determined as electrode ends (step S16).

  When the shape measurement of the crimped component 3 is completed in this way, the process proceeds to the connection state determination process by the connection state determination processing unit 10 (step S6 in FIG. 3). Here, as shown in FIG. 7, distances DA and DB from the outermost electrodes on both the left and right sides determined in step S <b> 16 to the same height as the outermost electrodes on the outer side. Is detected. If the size of DA or DB is less than the predetermined value δ, it is determined that the connection state is bad, and if it is greater than or equal to the predetermined value δ, the connection state is determined to be good. The information is displayed and notified to the inspector, and necessary inspection data is stored in the storage device.

  As described above, in the connection state inspection apparatus and the connection state inspection method according to the first embodiment, the distance to the outer surface of the flexible substrate is measured at predetermined intervals, and the moving average of the measured height data is calculated. The moving average data is leveled based on the height of a predetermined reference position, and a range having the same height and a predetermined width is detected as the outermost electrode position around the predetermined reference position. Further, a position outside the electrode set as the outermost electrode position and the same height as the height of the electrode set as the outermost electrode position is detected, and the positions near both ends of the crimping connection portion are detected. The distance from the outermost electrode position to the position of the same height is obtained, and when the distance is less than the reference value, it is determined that the connection is defective, and the connection state of the flexible board to the specified electrode surface is automatically accurate. Good size It can be.

  In the above embodiment, the averaging process of the height measurement data is performed for noise cancellation, and is not necessarily required in an environment where the measurement data with high accuracy of each measurement data and low noise can be obtained. In such a case, it can be omitted from the device.

  (Second Embodiment) Next, a connection state inspection apparatus and a connection state inspection method according to a second embodiment of the present invention will be described. The feature of the second embodiment is that the height of a predetermined range of the flexible substrate is measured, and the outermost electrode position is detected around each of the predetermined reference positions corresponding to the vicinity of both ends of the crimping connection portion on the flexible substrate. In addition, the height of the lowest point within a predetermined range outside the outermost electrode position is detected, and the difference between the height of the outermost electrode position and the height of the lowest point is compared, and the difference is the reference value. If it is less than that, it is determined that the connection is poor.

  The configuration of the connection state inspection system of the second embodiment is the same as that of the first embodiment shown in FIG. 1, and the functional configuration of the connection state inspection device 5 is also the first embodiment. The connection state inspection method performed by the connection state inspection apparatus 5 is also shown in FIGS. However, in the case of the second embodiment, the connection state determination processing performed by the connection state determination processing unit 10, that is, the processing content of step S6 in the flowchart of FIG. 3 is different from the first embodiment and is as follows. is there. In the present embodiment also, components common to those in the first embodiment will be described using common reference numerals.

  If the shape measurement of the crimping part 3 is completed also in the present embodiment, the process proceeds to a connection state determination process (step S6 in FIG. 3) by the connection state determination processing unit 10 next. In the case of the present embodiment, as shown in FIGS. 8 and 9, in the left and right sides A and B determined in step S16 in the flowchart of FIG. 6, a predetermined range L1A to L2A outside the electrode and L1B to L2B The heights of the lowest points LmA and LmB are detected. If the difference between the heights of the lowest points LmA and LmB and the heights of the electrodes A and B is less than σ, it is determined that the connection state is bad, and the determination result is displayed and output by the connection state inspection device. And necessary inspection data is stored in a storage device.

  According to the present embodiment, as in the first embodiment, the connection state of the flexible substrate to the predetermined electrode surface can be automatically determined with high accuracy.

  Even in the above embodiment, the averaging process of the height measurement data is performed for noise cancellation, and is always necessary in an environment where the measurement data with high accuracy of each measurement data and low noise can be obtained. However, in such a case, it can be omitted from the apparatus.

The block diagram of the connection state test | inspection system of the 1st, 2nd embodiment of this invention. The functional block diagram of the connection state inspection apparatus in the connection state inspection system of the said embodiment. The flowchart of the connection state inspection process by said connection state inspection apparatus. The graph which shows the process result of each step of the connection state inspection process by said connection state inspection apparatus. Explanatory drawing of the process of the electrode position determination step in said connection state inspection process. The flowchart which shows the detail of the process of the electrode position determination step in said connection state inspection process. Explanatory drawing of the connection state discrimination | determination process by the 1st Embodiment of this invention. Explanatory drawing 1 of the connection state discrimination | determination process by the 2nd Embodiment of this invention. Explanatory drawing 2 of the connection state discrimination | determination process by the 2nd Embodiment of this invention. Explanatory drawing which shows the method of the electrode crimping connection using ACF of the flexible substrate with respect to a general printed wiring board.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Thermocompression bonding apparatus, 2 ... Stage, 3 ... Crimped part, 4 ... Laser displacement meter, 5 ... Connection state inspection apparatus, 6 ... Shape measurement data input part, 7 ... Averaging process part, 8 ... Leveling process part, 9 ... Electrode position detection unit, 10 ... Connection state determination processing unit.

Claims (8)

A connection state inspection method for crimping and connecting a flexible substrate to a predetermined electrode surface with an anisotropic conductive adhesive, and determining the quality of the connection state,
A height measuring step for measuring the surface height of the flexible substrate at predetermined intervals;
An outermost electrode position detecting step for detecting a range having a predetermined width and the same height as the outermost electrode position around each of the predetermined reference positions corresponding to the vicinity of both ends of the crimping connection portion on the flexible substrate;
On the flexible substrate, a position outside the electrode determined as the outermost electrode position in the outermost electrode position detection step and a height equal to the height of the electrode determined as the outermost electrode position is detected. And steps to
Determine the distance from the outermost electrode position to the position of the same height in the vicinity of both ends of the crimp connection portion on the flexible substrate, and determine whether or not the connection is defective when the distance is less than a reference value A connection state inspection method comprising: a determination step. It is a connection state inspection method for crimping and connecting a flexible substrate to a wiring substrate with an anisotropic conductive adhesive, and determining whether the connection state is good or bad,
A height measuring step for measuring the height of a predetermined range of the flexible substrate;
In the periphery of each of the predetermined reference positions corresponding to the vicinity of both ends of the crimping connection part on the flexible substrate, an outermost electrode position detection step for detecting the outermost electrode position;
On the flexible substrate, the lowest point detection step for detecting the height of the lowest point within a predetermined range outside the outermost electrode position detected in the outermost electrode position detection step;
A connection state inspection including a connection pass / fail determination step of comparing a difference between the height of the outermost electrode position and the height of the lowest point on the flexible substrate and determining a connection failure when the difference is less than a reference value. Method.   In the height measurement step, the surface height of the flexible substrate is measured at a predetermined interval with a laser displacement meter, and the measurement data is leveled based on the height of the predetermined reference position, The connection state inspection method according to claim 1 or 2, wherein the data after the leveling process is used as height measurement data.   The connection state inspection method according to claim 1, further comprising a moving average step of obtaining a moving average of height data measured in the height measuring step. It is a connection state inspection device that crimps and connects a flexible substrate with an anisotropic conductive adhesive to a predetermined electrode surface, and determines the quality of the connection state,
Height measuring means for measuring the height of the outer surface of the flexible substrate at predetermined intervals;
Outer electrode position detecting means for detecting a range having a predetermined width and the same height as the outermost electrode position around a predetermined reference position corresponding to the vicinity of both ends of the crimping connection portion on the flexible substrate;
On the flexible substrate, the position where the outermost electrode position detection means detects a position outside the electrode as the outermost electrode position and the same height as the height of the electrode as the outermost electrode position. Detection means;
Determine the distance from the outermost electrode position to the position of the same height in the vicinity of both ends of the crimp connection portion on the flexible substrate, and determine whether or not the connection is defective when the distance is less than a reference value A connection state inspection apparatus comprising: a determination unit. A connection state inspection device that crimps and connects a flexible substrate to a wiring substrate with an anisotropic conductive adhesive, and determines whether the connection state is good or bad,
A height measuring means for measuring the height of the predetermined range of the flexible substrate;
In the periphery of each of the predetermined reference positions corresponding to the vicinity of both ends of the crimping connection portion on the flexible substrate, the outermost electrode position detecting means for detecting the outermost electrode position;
On the flexible substrate, the lowest point detection means for detecting the height of the lowest point within a predetermined range outside the outermost electrode position detected by the outermost electrode position detection means;
Comparing the difference between the height of the outermost electrode position and the height of the lowest point on the flexible substrate, and comprising a connection pass / fail judgment means for judging a connection failure when the difference is less than a reference value A connection state inspection device.   The height measuring means includes a laser displacement meter that measures the surface height of the flexible substrate at predetermined intervals, and leveling the measurement data of the laser displacement meter with reference to the height of the predetermined reference position. The connection state inspection device according to claim 5, further comprising leveling means for performing the leveling process and outputting the leveled data as height measurement data. The connection state inspection device according to any one of claims 5 to 7, further comprising moving average calculation means for obtaining a moving average of height data measured by the height measuring means.