JP2007250967A5 - - Google Patents

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Publication number
JP2007250967A5
JP2007250967A5 JP2006074372A JP2006074372A JP2007250967A5 JP 2007250967 A5 JP2007250967 A5 JP 2007250967A5 JP 2006074372 A JP2006074372 A JP 2006074372A JP 2006074372 A JP2006074372 A JP 2006074372A JP 2007250967 A5 JP2007250967 A5 JP 2007250967A5
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JP
Japan
Prior art keywords
mounting table
substrate
ring portion
processing apparatus
plasma processing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006074372A
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Japanese (ja)
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JP2007250967A (en
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Publication date
Application filed filed Critical
Priority to JP2006074372A priority Critical patent/JP2007250967A/en
Priority claimed from JP2006074372A external-priority patent/JP2007250967A/en
Priority to US11/685,308 priority patent/US7988814B2/en
Priority to KR1020070025713A priority patent/KR20070094522A/en
Priority to TW096109199A priority patent/TWI411034B/en
Priority to CN2007100883758A priority patent/CN101038849B/en
Priority to CN2010101475014A priority patent/CN101807509B/en
Publication of JP2007250967A publication Critical patent/JP2007250967A/en
Priority to KR1020090008912A priority patent/KR100959706B1/en
Publication of JP2007250967A5 publication Critical patent/JP2007250967A5/ja
Priority to US13/176,407 priority patent/US20110272100A1/en
Pending legal-status Critical Current

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Claims (17)

処理チャンバー内に配置された載置台上に被処理基板を載置させ，高周波電圧を与えることにより処理チャンバー内にプラズマを発生させて，被処理基板を処理するプラズマ処理装置であって，
前記載置台上に載置された被処理基板の周囲を囲むように配置されるフォーカスリングを備え，
前記フォーカスリングは，前記載置台上に載置された被処理基板の周囲外側に配置された導電性材料からなる外側リング部と，前記載置台上に載置された被処理基板の周縁部下方に所定の間隔を開けて配置された導電性材料からなる内側リング部を備え，
前記内側リング部と前記載置台の間は電気的に絶縁されていることを特徴とする，プラズマ処理装置。 A plasma processing apparatus for processing a substrate to be processed by placing the substrate to be processed on a mounting table disposed in the processing chamber and generating a plasma in the processing chamber by applying a high frequency voltage.
A focus ring arranged so as to surround the substrate to be processed placed on the mounting table;
The focus ring includes an outer ring portion made of a conductive material arranged on the outer periphery of the substrate to be processed placed on the mounting table, and a lower peripheral portion of the substrate to be processed placed on the mounting table. Provided with an inner ring portion made of a conductive material arranged at a predetermined interval,
The plasma processing apparatus, wherein the inner ring portion and the mounting table are electrically insulated. 前記外側リング部と前記内側リング部は，電気的に導通しており，前記外側リング部と前記載置台の間は絶縁されていることを特徴とする，請求項１に記載のプラズマ処理装置。 The plasma processing apparatus according to claim 1, wherein the outer ring part and the inner ring part are electrically connected, and the outer ring part and the mounting table are insulated from each other. 前記外側リング部および前記内側リング部と前記載置台の間に絶縁部材が配置されていることを特徴とする，請求項２に記載のプラズマ処理装置。 The plasma processing apparatus according to claim 2, wherein an insulating member is disposed between the outer ring part and the inner ring part and the mounting table. 前記外側リング部と前記内側リング部は，一体的に形成されていることを特徴とする，請求項２または３に記載のプラズマ処理装置。 The plasma processing apparatus according to claim 2, wherein the outer ring portion and the inner ring portion are integrally formed. 前記載置台上に載置された被処理基板の外周面とそれに対向する前記フォーカスリングの内周面との間隔が，前記内側リング部の上面と前記載置台上に載置された被処理基板の周縁部の下面との間隔よりも広いことを特徴とする，請求項４に記載のプラズマ処理装置。 The distance between the outer peripheral surface of the substrate to be processed placed on the mounting table and the inner peripheral surface of the focus ring facing the substrate is the upper surface of the inner ring portion and the substrate to be processed mounted on the mounting table. The plasma processing apparatus according to claim 4, wherein the plasma processing apparatus is wider than a distance from a lower surface of the peripheral edge of the substrate. 前記外側リング部および前記内側リング部は，グランドに対して電気的に絶縁されていることを特徴とする，請求項２〜５のいずれかに記載のプラズマ処理装置。 The plasma processing apparatus according to claim 2, wherein the outer ring portion and the inner ring portion are electrically insulated from a ground. 前記外側リング部と前記内側リング部は，電気的に絶縁されていることを特徴とする，請求項１に記載のプラズマ処理装置。The plasma processing apparatus according to claim 1, wherein the outer ring portion and the inner ring portion are electrically insulated. 前記外側リング部は，前記載置台に電気的に導通していることを特徴とする，請求項７に記載のプラズマ処理装置。The plasma processing apparatus according to claim 7, wherein the outer ring portion is electrically connected to the mounting table. 前記外側リング部の上面は，前記載置台上に載置された被処理基板の周囲に配置された，外側に向かって次第に高くなる傾斜面部と，前記傾斜面部の外側に連続して形成された水平面部を有することを特徴とする，請求項１〜８のいずれかに記載のプラズマ処理装置。The upper surface of the outer ring portion is formed continuously on the outer side of the inclined surface portion and the inclined surface portion which is arranged around the substrate to be processed placed on the mounting table and gradually increases toward the outside. The plasma processing apparatus according to claim 1, further comprising a horizontal plane part. 高周波電圧を与えることにより処理チャンバー内にプラズマを発生させて，被処理基板を処理するプラズマ処理装置において，前記処理チャンバー内に配置された載置台上の被処理基板の周囲を囲むように配置されるフォーカスリングであって，In a plasma processing apparatus for processing a substrate to be processed by generating a plasma in the processing chamber by applying a high frequency voltage, the plasma processing apparatus is disposed so as to surround the substrate to be processed on a mounting table disposed in the processing chamber. A focus ring,
前記載置台上に載置された被処理基板の周囲外側に配置される導電性材料からなる外側リング部と，前記載置台上に載置された被処理基板の周縁部下方に所定の間隔を開けて配置される導電性材料からなる内側リング部を備え，  A predetermined interval is provided below the outer ring portion made of a conductive material disposed on the outer periphery of the substrate to be processed placed on the mounting table, and below the peripheral portion of the substrate to be processed placed on the mounting table. It has an inner ring part made of conductive material that is placed open,
前記内側リング部と前記載置台の間は電気的に絶縁されていることを特徴とする，フォーカスリング。  The focus ring, wherein the inner ring portion and the mounting table are electrically insulated. 前記外側リング部と前記内側リング部は，電気的に導通しており，前記外側リング部および前記内側リング部と前記載置台の間を絶縁するための絶縁部材を備えることを特徴とする，請求項１０に記載のフォーカスリング。The outer ring portion and the inner ring portion are electrically connected, and include an insulating member for insulating between the outer ring portion and the inner ring portion and the mounting table. Item 11. The focus ring according to Item 10. 前記外側リング部と前記内側リング部は，一体的に形成されていることを特徴とする，請求項１１に記載のフォーカスリング。The focus ring according to claim 11, wherein the outer ring portion and the inner ring portion are integrally formed. 前記載置台上に載置された被処理基板の外周面に対向する内周面に凹部が形成されていることを特徴とする，請求項１２に記載のフォーカスリング。13. The focus ring according to claim 12, wherein a concave portion is formed on an inner peripheral surface facing the outer peripheral surface of the substrate to be processed placed on the mounting table. 前記外側リング部と前記内側リング部を電気的に絶縁させる絶縁部材を備えることを特徴とする，請求項１０に記載のフォーカスリング。The focus ring according to claim 10, further comprising an insulating member that electrically insulates the outer ring portion and the inner ring portion. 前記外側リング部は，前記載置台に電気的に導通して設置されることを特徴とする，請求項１４に記載のフォーカスリング。The focus ring according to claim 14, wherein the outer ring part is installed in electrical conduction with the mounting table. 前記外側リング部の上面は，前記載置台上に載置された被処理基板の周囲に配置された，外側に向かって次第に高くなる傾斜面部と，前記傾斜面部の外側に連続して形成された水平面部を有することを特徴とする，請求項１０〜１５のいずれかに記載のフォーカスリング。The upper surface of the outer ring portion is formed continuously on the outer side of the inclined surface portion and the inclined surface portion which is arranged around the substrate to be processed placed on the mounting table and gradually increases toward the outside. The focus ring according to claim 10, further comprising a horizontal plane portion. 請求項１０〜１６のいずれかに記載のフォーカスリングと，前記処理チャンバー内において前記載置台上の被処理基板の周囲を囲むように前記フォーカスリングを配置させる支持部材とからなることを特徴とする，フォーカスリング部品。The focus ring according to any one of claims 10 to 16, and a support member that arranges the focus ring so as to surround the substrate to be processed on the mounting table in the processing chamber. , Focus ring parts.
JP2006074372A 2006-03-17 2006-03-17 Plasma treating apparatus and method, and focus ring Pending JP2007250967A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2006074372A JP2007250967A (en) 2006-03-17 2006-03-17 Plasma treating apparatus and method, and focus ring
US11/685,308 US7988814B2 (en) 2006-03-17 2007-03-13 Plasma processing apparatus, plasma processing method, focus ring, and focus ring component
KR1020070025713A KR20070094522A (en) 2006-03-17 2007-03-15 Plasma process apparatus, focus ring, focus ring component and plasma process method
CN2010101475014A CN101807509B (en) 2006-03-17 2007-03-16 Plasma treating apparatus and focus ring
CN2007100883758A CN101038849B (en) 2006-03-17 2007-03-16 Plasma processing apparatus, plasma processing method and focus ring
TW096109199A TWI411034B (en) 2006-03-17 2007-03-16 A plasma processing apparatus and a method and a focusing ring
KR1020090008912A KR100959706B1 (en) 2006-03-17 2009-02-04 Plasma process apparatus, focus ring, focus ring component and plasma process method
US13/176,407 US20110272100A1 (en) 2006-03-17 2011-07-05 Plasma processing apparatus, plasma processing method, focus ring, and focus ring component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006074372A JP2007250967A (en) 2006-03-17 2006-03-17 Plasma treating apparatus and method, and focus ring

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012034034A Division JP5313375B2 (en) 2012-02-20 2012-02-20 Plasma processing apparatus and focus ring and focus ring component

Publications (2)

Publication Number Publication Date
JP2007250967A JP2007250967A (en) 2007-09-27
JP2007250967A5 true JP2007250967A5 (en) 2009-04-02

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Country Status (4)

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JP (1) JP2007250967A (en)
KR (2) KR20070094522A (en)
CN (2) CN101038849B (en)
TW (1) TWI411034B (en)

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