JP2007242942A - Electronic device and method of manufacturing same - Google Patents

Electronic device and method of manufacturing same Download PDF

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JP2007242942A
JP2007242942A JP2006064228A JP2006064228A JP2007242942A JP 2007242942 A JP2007242942 A JP 2007242942A JP 2006064228 A JP2006064228 A JP 2006064228A JP 2006064228 A JP2006064228 A JP 2006064228A JP 2007242942 A JP2007242942 A JP 2007242942A
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terminals
group
substrate
terminal
straight lines
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Naoya Sato
直也 佐藤
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Seiko Epson Corp
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Seiko Epson Corp
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<P>PROBLEM TO BE SOLVED: To provide an electronic device which can ensure electric conduction and to provide a method of manufacturing the same. <P>SOLUTION: The electronic device includes a substrate 14, a first electronic part 10 having a plurality of first terminals 11 formed on the substrate 14, and a second electronic part 20 having a plurality of second terminals 21. The first terminals 11 and the second terminals 21 are overlaid and connected with each other electrically. The first terminals 11 are divided into at least first and second groups 101 and 102. The first terminals 11 of the first group are formed in a manner that they may extend along a plurality of first straight lines L<SB>1</SB>that pass a first point P<SB>1</SB>and are radially arranged. The first terminals 11 of the second group are formed in a manner that they may extend along second straight lines L<SB>2</SB>that pass a second point P<SB>2</SB>and are radially arranged. A cutting line 16 is formed between the first terminals 11 of the first group 101 and the first terminals 11 of the second group 102, on the first substrate 14. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、電子デバイス及びその製造方法に関する。   The present invention relates to an electronic device and a manufacturing method thereof.

従来、液晶パネルにフレキシブルプリント基板を接続するＣＯＦ実装のように、多数の電極同士を接続する場合、位置ズレが生じると電極間の導通を採ることができなくなる。特に、フレキシブルプリント基板のような薄い樹脂フィルムに形成された電極は、樹脂フィルムが熱や湿気によって膨張・収縮しやすいため、電極の位置ズレをなくすことは難しかった。
特開２００１−８５４７５号公報 Conventionally, when a large number of electrodes are connected as in the case of COF mounting in which a flexible printed circuit board is connected to a liquid crystal panel, it becomes impossible to establish electrical continuity between the electrodes if a positional shift occurs. In particular, in an electrode formed on a thin resin film such as a flexible printed circuit board, it is difficult to eliminate displacement of the electrode because the resin film easily expands and contracts due to heat and moisture.
JP 2001-85475 A

本発明の目的は、電気的な導通を確実にする電子デバイス及びその製造方法を提供することにある。   An object of the present invention is to provide an electronic device that ensures electrical continuity and a method for manufacturing the same.

（１）本発明に係る電子デバイスは、基板と、前記基板に形成された複数の第１の端子と、を有する第１の電子部品と、
複数の第２の端子を有する第２の電子部品と、
を有し、
前記複数の第１の端子と、前記複数の第２の端子と、が重なって電気的に接続され、
前記複数の第１の端子は、少なくとも第１及び第２のグループに分けられ、
前記第１グループの前記第１の端子は、それぞれ、第１の点を通って放射状に配列される複数の第１の直線に沿って延びるように形成され、
前記第２グループの前記第１の端子は、それぞれ、第２の点を通って放射状に配列される複数の第２の直線に沿って延びるように形成され、
前記基板には、前記第１のグループの前記第１の端子と前記第２のグループの前記第１の端子との間に、切れ目が形成されてなる。本発明によれば、切れ目を境に、複数の第１の端子が複数グループに分けられているので、グループごとに第１及び第２の端子の位置を補正することができる。
（２）この電子デバイスにおいて、
前記複数の第２の端子は、少なくとも第３及び第４のグループに分けられ、
前記第３グループの前記第２の端子は、それぞれ、前記複数の第１の直線に沿って延びるように形成され、
前記第４グループの前記第２の端子は、それぞれ、前記複数の第２の直線に沿って延びるように形成されていてもよい。
（３）本発明に係る電子デバイスの製造方法は、第１の電子部品の複数の第１の端子と、第２の電子部品の複数の第２の端子と、の電気的な接続を含む電子デバイスの製造方法であって、
前記複数の第１の端子は、第１の基板に形成されて、少なくとも第１及び第２のグループに分けられ、
前記第１グループの前記第１の端子は、それぞれ、第１の点を通って放射状に配列される複数の第１の直線に沿って延びるように形成され、
前記第２グループの前記第１の端子は、それぞれ、第２の点を通って放射状に配列される複数の第２の直線に沿って延びるように形成され、
前記第１の基板には、前記第１のグループの前記第１の端子と前記第２のグループの前記第１の端子との間に、切れ目が形成され、
前記複数の第２の端子は、第２の基板に形成されて、少なくとも第３及び第４のグループに分けられ、
前記第３グループの前記第２の端子は、それぞれ、第３の点を通って放射状に配列される複数の第３の直線に沿って延びるように形成され、
前記第４グループの前記第２の端子は、それぞれ、第４の点を通って放射状に配列される複数の第４の直線に沿って延びるように形成され、
前記電気的な接続は、
前記第１及び第３の点を重ね、かつ、前記第１及び第３の直線を重ねることで、前記第１のグループの前記第１の端子と、前記第３のグループの前記第２の端子と、を重ねて、前記第１の基板の、前記切れ目よりも前記第１のグループの前記第１の端子の側の部分を、前記第２の基板に取り付けること、及び、
前記第１の基板を屈曲させ、前記第２及び第４の点を重ね、かつ、前記第２及び第４の直線を重ねることで、前記第２のグループの前記第１の端子と、前記第４のグループの前記第２の端子と、を重ねて、前記第１の基板の、前記切れ目よりも前記第２のグループの前記第１の端子の側の部分を、前記第２の基板に取り付けること、
を含む。本発明によれば、切れ目を境に、複数の第１の端子が複数グループに分けられているので、グループごとに第１及び第２の端子の位置を補正することができる。 (1) An electronic device according to the present invention includes a first electronic component having a substrate and a plurality of first terminals formed on the substrate,
A second electronic component having a plurality of second terminals;
Have
The plurality of first terminals and the plurality of second terminals overlap and are electrically connected,
The plurality of first terminals are divided into at least first and second groups,
The first terminals of the first group are each formed to extend along a plurality of first straight lines arranged radially through a first point;
Each of the first terminals of the second group is formed to extend along a plurality of second straight lines arranged radially through a second point,
A cut is formed in the substrate between the first terminal of the first group and the first terminal of the second group. According to the present invention, since the plurality of first terminals are divided into a plurality of groups at the boundary, the positions of the first and second terminals can be corrected for each group.
(2) In this electronic device,
The plurality of second terminals are divided into at least third and fourth groups,
Each of the second terminals of the third group is formed to extend along the plurality of first straight lines,
Each of the second terminals of the fourth group may be formed to extend along the plurality of second straight lines.
(3) A method of manufacturing an electronic device according to the present invention includes an electronic device including an electrical connection between a plurality of first terminals of a first electronic component and a plurality of second terminals of a second electronic component. A device manufacturing method comprising:
The plurality of first terminals are formed on a first substrate and divided into at least a first group and a second group,
The first terminals of the first group are each formed to extend along a plurality of first straight lines arranged radially through a first point;
Each of the first terminals of the second group is formed to extend along a plurality of second straight lines arranged radially through a second point,
On the first substrate, a cut is formed between the first terminal of the first group and the first terminal of the second group,
The plurality of second terminals are formed on a second substrate and divided into at least third and fourth groups,
The second terminals of the third group are each formed to extend along a plurality of third straight lines arranged radially through a third point;
Each of the second terminals of the fourth group is formed to extend along a plurality of fourth straight lines arranged radially through a fourth point;
The electrical connection is
The first terminal of the first group and the second terminal of the third group by overlapping the first and third points and overlapping the first and third straight lines. And attaching a portion of the first substrate on the first terminal side of the first group with respect to the cut to the second substrate, and
Bending the first substrate, overlapping the second and fourth points, and overlapping the second and fourth straight lines, the first terminal of the second group, and the first A portion of the first substrate on the side of the first terminal of the second group with respect to the cut is attached to the second substrate by overlapping the second terminals of the fourth group. thing,
including. According to the present invention, since the plurality of first terminals are divided into a plurality of groups at the boundary, the positions of the first and second terminals can be corrected for each group.

以下、本発明の実施の形態について図面を参照して説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は、本発明の実施の形態に係る電子デバイスを説明する図である。電子デバイスは、第１及び第２の電子部品１０，２０を有する。   FIG. 1 is a diagram illustrating an electronic device according to an embodiment of the present invention. The electronic device has first and second electronic components 10 and 20.

第１の電子部品１０は、複数の第１の端子１１を有する。第１の端子１１は、他の部品との電気的な接続に使用される。第１の端子１１は、第１の配線パターン１２の一部である。第１の配線パターン１２は、複数の第１の端子１１にそれぞれ電気的に接続される複数の配線１３を有する。   The first electronic component 10 has a plurality of first terminals 11. The first terminal 11 is used for electrical connection with other components. The first terminal 11 is a part of the first wiring pattern 12. The first wiring pattern 12 includes a plurality of wirings 13 that are electrically connected to the plurality of first terminals 11, respectively.

複数の第１の端子１１は、複数のグループ（少なくとも第１及び第２のグループ１０１，１０２）に分けられる。第１グループ１０１の第１の端子１１は、それぞれ、第１の点Ｐ１を通って放射状に配列される複数の第１の直線Ｌ１に沿って延びるように形成されている。第２グループ１０２の第１の端子１１は、それぞれ、第２の点Ｐ２を通って放射状に配列される複数の第２の直線Ｌ２に沿って延びるように形成されている。 The plurality of first terminals 11 are divided into a plurality of groups (at least the first and second groups 101 and 102). The first terminal 11 of the first group 101, are formed to extend along a plurality of first straight line L 1 which is arranged radially through the P 1 first point. The first terminal 11 of the second group 102, respectively, are formed to extend along a straight line L 2 a plurality of second arranged radially through the P 2 second point.

複数の第１の直線Ｌ１は、等角度の間隔で配列されていてもよい。変形例として、第１の点Ｐ１を通らない他の直線との交点のピッチが均一になるように配列されていてもよい。その場合、角度は均一にならない。この点は、第２の直線Ｌ２についても適用され、後述する第３及び第４の直線Ｌ３，Ｌ４についても適用される。 A plurality of first straight line L 1 may be arranged at equal angular intervals. As a modification, the pitches of the intersections with other straight lines that do not pass through the first point P 1 may be arranged to be uniform. In that case, the angles are not uniform. This point is also applicable to the second straight line L 2, it is also applied to the third and fourth straight lines L 3, L 4, which will be described later.

第１の端子１１（第１の配線パターン１２）は、第１の基板１４に形成されている。第１の基板１４の一方の面に、第１の端子１１等を含む第１の配線パターン１２が形成されている。第１の端子１１の先端と第１の基板１４の先端が一致しているが、第１の端子１１の先端が第１の基板１４の先端よりも中央側に位置していてもよい。第１の基板１４はフレキシブル基板であってもよい。第１の基板１４は、樹脂基板であってもよい。第１の基板１４には、第１のグループ１０１の第１の端子１１と第２のグループ１０２の第１の端子１１との間に、切れ目１６が形成されている。切れ目１６によって、第１の基板１４の端部が切断されているが、第１の基板１４が複数に分離はされない。   The first terminal 11 (first wiring pattern 12) is formed on the first substrate 14. A first wiring pattern 12 including the first terminals 11 and the like is formed on one surface of the first substrate 14. Although the tip of the first terminal 11 and the tip of the first substrate 14 coincide, the tip of the first terminal 11 may be located closer to the center than the tip of the first substrate 14. The first substrate 14 may be a flexible substrate. The first substrate 14 may be a resin substrate. In the first substrate 14, a break 16 is formed between the first terminal 11 of the first group 101 and the first terminal 11 of the second group 102. The end portion of the first substrate 14 is cut by the cut 16, but the first substrate 14 is not separated into a plurality.

第１の電子部品１０は、チップ部品１５を有している。チップ部品１５は、配線１３を介していずれかの第１の端子１１と電気的に接続される。ＣＯＦ（Chip On Film）実装を適用して、チップ部品１５を第１の基板１４に搭載してもよい。第１の電子部品１０には、ＴＣＰ（Tape Carrier Package）が適用されてもよい。   The first electronic component 10 has a chip component 15. The chip component 15 is electrically connected to one of the first terminals 11 via the wiring 13. The chip component 15 may be mounted on the first substrate 14 by applying COF (Chip On Film) mounting. TCP (Tape Carrier Package) may be applied to the first electronic component 10.

第２の電子部品２０は、複数の第２の端子２１を有する。第２の端子２１は、他の部品との電気的な接続に使用される。第２の端子２１は、第２の配線パターン２２の一部である。第２の電子部品２０が電気光学パネル（液晶パネル等）である場合、第２の配線パターン２２は、複数の第２の端子２１と、電気光学物質（液晶等）に電圧を印加（又は電流を供給）するための電極２３と、を有する。   The second electronic component 20 has a plurality of second terminals 21. The second terminal 21 is used for electrical connection with other components. The second terminal 21 is a part of the second wiring pattern 22. When the second electronic component 20 is an electro-optical panel (liquid crystal panel or the like), the second wiring pattern 22 applies a voltage (or current) to the plurality of second terminals 21 and the electro-optical material (liquid crystal or the like). And an electrode 23 for supplying).

複数の第２の端子２１は、複数のグループ（少なくとも第３及び第４のグループ１０３，１０４）に分けられる。第３グループ１０３の第２の端子２１は、それぞれ、複数の第１の直線Ｌ１に沿って延びるように形成されている。第４グループ１０４の第２の端子２１は、それぞれ、複数の第２の直線Ｌ２に沿って延びるように形成されている。 The plurality of second terminals 21 are divided into a plurality of groups (at least the third and fourth groups 103 and 104). The second terminal 21 of the third group 103, respectively, are formed to extend along a plurality of first straight line L 1. The second terminal 21 of the fourth group 104, respectively, are formed to extend along a plurality of second straight line L 2.

第２の端子２１（第２の配線パターン２２）は、第２の基板２４に形成されている。第２の基板２４はガラス基板であってもよい。第１及び第２の基板１４，２４は、熱膨張率（線膨張係数）において異なる材料で形成されている。   The second terminal 21 (second wiring pattern 22) is formed on the second substrate 24. The second substrate 24 may be a glass substrate. The first and second substrates 14 and 24 are made of different materials in terms of thermal expansion coefficient (linear expansion coefficient).

複数の第１の端子１１と、複数の第２の端子２１と、が重なって電気的に接続されている。その電気的な接続には、異方性導電膜や異方性導電ペーストを使用してもよいし、金属接合を適用してもよいし、絶縁性の接着剤による圧着を適用してもよい。   The plurality of first terminals 11 and the plurality of second terminals 21 are overlapped and electrically connected. For the electrical connection, an anisotropic conductive film or anisotropic conductive paste may be used, metal bonding may be applied, or crimping with an insulating adhesive may be applied. .

図２は、本発明の実施の形態に係る電子デバイスの分解図である。第１及び第２の電子部品１０，２０が接続される前の状態では、第２の電子部品２０において、第３グループ１０３の第２の端子２１は、それぞれ、第３の点Ｐ３を通って放射状に配列される複数の第３の直線Ｌ３に沿って延びるように形成されている。第４グループ１０４の第２の端子２１は、それぞれ、第４の点Ｐ４を通って放射状に配列される複数の第４の直線Ｌ４に沿って延びるように形成されている。図２に示す第１の電子部品１０については上述した通りである。 FIG. 2 is an exploded view of the electronic device according to the embodiment of the present invention. In a state before the first and second electronic components 10 and 20 are connected, in the second electronic component 20, a second terminal 21 of the third group 103, respectively, through the P 3 third point It is formed to extend along a plurality of third straight line L 3, which is arranged radially Te. The second terminal 21 of the fourth group 104, respectively, are formed to extend along a plurality of fourth straight line L 4, which is arranged radially through a fourth point P 4. The first electronic component 10 shown in FIG. 2 is as described above.

図３及び図４は、本発明の実施の形態に係る電子デバイスの製造方法を説明する図である。   3 and 4 are diagrams illustrating a method for manufacturing an electronic device according to an embodiment of the present invention.

本実施の形態では、第１及び第２の配線パターン１２，２２を支持する部材（第１及び第２の基板１４，２４）は、熱や湿気等の影響で膨張・収縮することがある。本実施の形態では、第１の基板１４が第２の基板２４よりも、熱膨張率が大きい。例えば、第１の端子１１が形成された第１の基板１４が樹脂基板であり、第２の端子２１が形成された第２の基板２４がガラス基板である。図３及び図４には、図１に示す例と比較して、第１の基板１４が膨張した例が示してある。   In the present embodiment, the members (first and second substrates 14 and 24) that support the first and second wiring patterns 12 and 22 may expand and contract under the influence of heat, moisture, and the like. In the present embodiment, the first substrate 14 has a higher coefficient of thermal expansion than the second substrate 24. For example, the first substrate 14 on which the first terminals 11 are formed is a resin substrate, and the second substrate 24 on which the second terminals 21 are formed is a glass substrate. 3 and 4 show an example in which the first substrate 14 is expanded as compared with the example shown in FIG.

第１の端子１１を支持する部材（第１の基板１４）の膨張・収縮が縦横同倍率でなされるときには、第１のグループ１０１の複数の第１の端子１１は、それぞれ、第１の直線Ｌ1に沿って移動する。すなわち、第１のグループ１０１の複数の第１の端子１１は、これらの端子を支持する部材（第１の基板１４）が膨張・収縮しても、第１の直線Ｌ1上に配置される。同様に、第２のグループ１０２の複数の第１の端子１１は、それぞれ、第２の直線Ｌ２に沿って移動する。 When the member supporting the first terminal 11 (the first substrate 14) is expanded and contracted at the same magnification in both the vertical and horizontal directions, the plurality of first terminals 11 in the first group 101 are each a first straight line. to move along the L 1. That is, the plurality of first terminals 11 of the first group 101 are arranged on the first straight line L 1 even if the member (first substrate 14) supporting these terminals expands and contracts. . Similarly, a plurality of first terminal 11 of the second group 102, respectively, to move along the second straight line L 2.

図３に示すように、電子デバイスの製造方法では、第１及び第３の点Ｐ１，Ｐ３を重ね、かつ、第１及び第３の直線Ｌ１，Ｌ３を重ねる。これにより、第１のグループ１０１の第１の端子１１と、第３のグループ１０３の第２の端子２１と、を重ねることができる。 As shown in FIG. 3, in the electronic device manufacturing method, the first and third points P 1 and P 3 are overlapped, and the first and third straight lines L 1 and L 3 are overlapped. Thereby, the 1st terminal 11 of the 1st group 101 and the 2nd terminal 21 of the 3rd group 103 can be piled up.

図３に示す例では、第１の基板１４の膨張に伴って、第１の端子１１は、第１の直線Ｌ1に沿って、第１の点Ｐ1から離れる方向に移動したことになる。その場合であっても、第１及び第３の点Ｐ1，Ｐ３を一致させ、第１及び第３の直線Ｌ1，Ｌ３を一致させると、第１の端子１１の少なくとも一部と、第２の端子２１の少なくとも一部が重複するようになっている。ただし、第１の基板１４の膨張がない場合と比較して、第１の端子１１における第１の点Ｐ1に近い部分が、第２の端子２１と重複する。こうして、第１の基板１４が膨張しても、第１及び第２の端子１１，２１を電気的に接続することができる。 In the example shown in FIG. 3, with the expansion of the first substrate 14, the first terminal 11 has moved in the direction away from the first point P 1 along the first straight line L 1. . Even in this case, when the first and third points P 1 and P 3 are made to coincide with each other and the first and third straight lines L 1 and L 3 are made to coincide with each other, At least a part of the second terminal 21 is overlapped. However, a portion near the first point P 1 in the first terminal 11 overlaps with the second terminal 21 as compared with the case where the first substrate 14 is not expanded. In this way, even if the first substrate 14 expands, the first and second terminals 11 and 21 can be electrically connected.

なお、第２の基板２４が膨張した場合も同様である。さらに、第２の基板２４よりも第１の基板１４が収縮した場合には、第１の基板１４の収縮に伴って、第１の端子１１は、第１の直線Ｌ1に沿って、第１の点Ｐ1に近づく方向に移動する。そして、第１の基板１４の収縮がない場合と比較して、第１の端子１１における第１の点Ｐ1から遠い部分が、第２の端子２１と重複する。第２の基板２４が収縮した場合も同様である。 The same applies when the second substrate 24 expands. Furthermore, in the case where than the second substrate 24 first substrate 14 is contracted, along with the contraction of the first substrate 14, the first terminal 11, along a first straight line L 1, the It moves in a direction approaching the point P 1 of 1 . Then, as compared with the case where the first substrate 14 is not contracted, a portion of the first terminal 11 far from the first point P 1 overlaps with the second terminal 21. The same applies when the second substrate 24 contracts.

こうして、第１及び第２の端子１１，２１を重ね合わせて電気的に接続する。また、第１の基板１４の、切れ目１６よりも第１のグループ１０１の第１の端子１１の側（図３では左側）の部分を、第２の基板２４に取り付ける（例えば固定する）。電気的接続及び取付には、異方性導電膜や異方性導電ペーストを使用してもよいし、金属接合を適用してもよいし、絶縁性の接着剤による圧着を適用してもよい。   Thus, the first and second terminals 11 and 21 are overlapped and electrically connected. Further, the portion of the first substrate 14 on the side of the first terminal 11 (left side in FIG. 3) of the first group 101 with respect to the cut 16 is attached (for example, fixed) to the second substrate 24. For electrical connection and attachment, an anisotropic conductive film or anisotropic conductive paste may be used, metal bonding may be applied, or crimping with an insulating adhesive may be applied. .

以上説明したように、第１のグループ１０１の第１の端子１１と第２の端子２１との電気的接続を行うと、図３に示すように、第２のグループ１０２の第１の端子１１と、第４のグループ１０４の第２の端子２１は、ずれている。   As described above, when the first terminal 11 and the second terminal 21 of the first group 101 are electrically connected, as shown in FIG. 3, the first terminal 11 of the second group 102 is obtained. Then, the second terminals 21 of the fourth group 104 are shifted.

そこで、図４に示すように、基板１４を屈曲させて、第２のグループ１０２の第１の端子１１と、第４のグループ１０４の第２の端子２１との位置合わせを行う。基板１４は、切れ目１６が形成されているので、変形させやすくなっている。   Therefore, as shown in FIG. 4, the substrate 14 is bent to align the first terminals 11 of the second group 102 with the second terminals 21 of the fourth group 104. The substrate 14 is easily deformed because the cut 16 is formed.

位置合わせでは、第２及び第４の点Ｐ２，Ｐ４を一致させ、第２及び第４の直線Ｌ２，Ｌ４を一致させる。これにより、第２のグループ１０２の第１の端子１１の少なくとも一部と、第４のグループ１０４の第２の端子２１の少なくとも一部が重複する。その他の詳細は、第１のグループ１０１の第１の端子１１と、第３のグループ１０３の第２の端子２１と、の位置合わせの内容が該当する。 In the alignment, the second and fourth points P 2 and P 4 are matched, and the second and fourth straight lines L 2 and L 4 are matched. Thereby, at least a part of the first terminals 11 of the second group 102 overlaps with at least a part of the second terminals 21 of the fourth group 104. Other details correspond to the contents of alignment between the first terminal 11 of the first group 101 and the second terminal 21 of the third group 103.

こうして、第１及び第２の端子１１，２１を重ね合わせて電気的に接続する。また、第１の基板１４の、切れ目１６よりも第２のグループ１０２の第１の端子１１の側（図４では右側）の部分を、第２の基板２４に取り付ける（例えば固定する）。電気的接続及び取付には、異方性導電膜や異方性導電ペーストを使用してもよいし、金属接合を適用してもよいし、絶縁性の接着剤による圧着を適用してもよい。   Thus, the first and second terminals 11 and 21 are overlapped and electrically connected. Further, the portion of the first substrate 14 closer to the first terminal 11 (right side in FIG. 4) of the second group 102 than the cut 16 is attached (for example, fixed) to the second substrate 24. For electrical connection and attachment, an anisotropic conductive film or anisotropic conductive paste may be used, metal bonding may be applied, or crimping with an insulating adhesive may be applied. .

本実施の形態によれば、第１及び第２の端子１１，２１を、放射状に配列される直線に沿って延びるように形成したので、第１及び第２の基板１４，２４が膨張・収縮しても位置合わせが可能になっている。また、切れ目１６を境に、複数の第１の端子１１が複数グループに分けられているので、グループごとに第１及び第２の端子１１，２１の位置を補正することができる。さらに、第１の基板１４は、切れ目１６が形成されているので変形しやすくなっており、グループごとの位置補正を容易に行うことができる。   According to the present embodiment, since the first and second terminals 11 and 21 are formed so as to extend along the radially arranged straight lines, the first and second substrates 14 and 24 expand and contract. Even so, alignment is possible. Further, since the plurality of first terminals 11 are divided into a plurality of groups with the break 16 as a boundary, the positions of the first and second terminals 11 and 21 can be corrected for each group. Furthermore, since the cut | interruption 16 is formed in the 1st board | substrate 14, it becomes easy to deform | transform and the position correction for every group can be performed easily.

本発明は、上述した実施の形態に限定されるものではなく、種々の変形が可能である。例えば、本発明は、実施の形態で説明した構成と実質的に同一の構成（例えば、機能、方法及び結果が同一の構成、あるいは目的及び結果が同一の構成）を含む。また、本発明は、実施の形態で説明した構成の本質的でない部分を置き換えた構成を含む。また、本発明は、実施の形態で説明した構成と同一の作用効果を奏する構成又は同一の目的を達成することができる構成を含む。また、本発明は、実施の形態で説明した構成に公知技術を付加した構成を含む。   The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same purposes and results). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

図１は、本発明の実施の形態に係る電子デバイスを説明する図である。FIG. 1 is a diagram illustrating an electronic device according to an embodiment of the present invention. 図２は、本発明の実施の形態に係る電子デバイスの分解図である。FIG. 2 is an exploded view of the electronic device according to the embodiment of the present invention. 図３は、本発明の実施の形態に係る電子デバイスの製造方法を説明する図である。FIG. 3 is a diagram for explaining a method of manufacturing an electronic device according to an embodiment of the present invention. 図４は、本発明の実施の形態に係る電子デバイスの製造方法を説明する図である。FIG. 4 is a diagram for explaining a method for manufacturing an electronic device according to an embodiment of the present invention.

符号の説明Explanation of symbols

１０…第１の電子部品、 １１…第１の端子、 １２…第１の配線パターン、 １３…配線、 １４…第１の基板、 １５…チップ部品、 ２０…第２の電子部品、 ２１…第２の端子、 ２２…第２の配線パターン、 ２３…電極、 ２４…第２の基板、 １０１…第１のグループ、 １０２…第２のグループ、 １０３…第３のグループ、 １０４…第４のグループ   DESCRIPTION OF SYMBOLS 10 ... 1st electronic component, 11 ... 1st terminal, 12 ... 1st wiring pattern, 13 ... Wiring, 14 ... 1st board | substrate, 15 ... Chip component, 20 ... 2nd electronic component, 21 ... 1st 2 terminals, 22 ... second wiring pattern, 23 ... electrode, 24 ... second substrate, 101 ... first group, 102 ... second group, 103 ... third group, 104 ... fourth group

Claims (3)

基板と、前記基板に形成された複数の第１の端子と、を有する第１の電子部品と、
複数の第２の端子を有する第２の電子部品と、
を有し、
前記複数の第１の端子と、前記複数の第２の端子と、が重なって電気的に接続され、
前記複数の第１の端子は、少なくとも第１及び第２のグループに分けられ、
前記第１グループの前記第１の端子は、それぞれ、第１の点を通って放射状に配列される複数の第１の直線に沿って延びるように形成され、
前記第２グループの前記第１の端子は、それぞれ、第２の点を通って放射状に配列される複数の第２の直線に沿って延びるように形成され、
前記基板には、前記第１のグループの前記第１の端子と前記第２のグループの前記第１の端子との間に、切れ目が形成されてなる電子デバイス。 A first electronic component having a substrate and a plurality of first terminals formed on the substrate;
A second electronic component having a plurality of second terminals;
Have
The plurality of first terminals and the plurality of second terminals overlap and are electrically connected,
The plurality of first terminals are divided into at least first and second groups,
The first terminals of the first group are each formed to extend along a plurality of first straight lines arranged radially through a first point;
Each of the first terminals of the second group is formed to extend along a plurality of second straight lines arranged radially through a second point,
An electronic device in which a cut is formed in the substrate between the first terminal of the first group and the first terminal of the second group. 請求項１に記載された電子デバイスにおいて、
前記複数の第２の端子は、少なくとも第３及び第４のグループに分けられ、
前記第３グループの前記第２の端子は、それぞれ、前記複数の第１の直線に沿って延びるように形成され、
前記第４グループの前記第２の端子は、それぞれ、前記複数の第２の直線に沿って延びるように形成されてなる電子デバイス。 The electronic device according to claim 1,
The plurality of second terminals are divided into at least third and fourth groups,
Each of the second terminals of the third group is formed to extend along the plurality of first straight lines,
Each of the second terminals of the fourth group is an electronic device formed so as to extend along the plurality of second straight lines. 第１の電子部品の複数の第１の端子と、第２の電子部品の複数の第２の端子と、の電気的な接続を含む電子デバイスの製造方法であって、
前記複数の第１の端子は、第１の基板に形成されて、少なくとも第１及び第２のグループに分けられ、
前記第１グループの前記第１の端子は、それぞれ、第１の点を通って放射状に配列される複数の第１の直線に沿って延びるように形成され、
前記第２グループの前記第１の端子は、それぞれ、第２の点を通って放射状に配列される複数の第２の直線に沿って延びるように形成され、
前記第１の基板には、前記第１のグループの前記第１の端子と前記第２のグループの前記第１の端子との間に、切れ目が形成され、
前記複数の第２の端子は、第２の基板に形成されて、少なくとも第３及び第４のグループに分けられ、
前記第３グループの前記第２の端子は、それぞれ、第３の点を通って放射状に配列される複数の第３の直線に沿って延びるように形成され、
前記第４グループの前記第２の端子は、それぞれ、第４の点を通って放射状に配列される複数の第４の直線に沿って延びるように形成され、
前記電気的な接続は、
前記第１及び第３の点を重ね、かつ、前記第１及び第３の直線を重ねることで、前記第１のグループの前記第１の端子と、前記第３のグループの前記第２の端子と、を重ねて、前記第１の基板の、前記切れ目よりも前記第１のグループの前記第１の端子の側の部分を、前記第２の基板に取り付けること、及び、
前記第１の基板を屈曲させ、前記第２及び第４の点を重ね、かつ、前記第２及び第４の直線を重ねることで、前記第２のグループの前記第１の端子と、前記第４のグループの前記第２の端子と、を重ねて、前記第１の基板の、前記切れ目よりも前記第２のグループの前記第１の端子の側の部分を、前記第２の基板に取り付けること、
を含む電子デバイスの製造方法。 An electronic device manufacturing method including electrical connection between a plurality of first terminals of a first electronic component and a plurality of second terminals of a second electronic component,
The plurality of first terminals are formed on a first substrate and divided into at least a first group and a second group,
The first terminals of the first group are each formed to extend along a plurality of first straight lines arranged radially through a first point;
Each of the first terminals of the second group is formed to extend along a plurality of second straight lines arranged radially through a second point,
On the first substrate, a cut is formed between the first terminal of the first group and the first terminal of the second group,
The plurality of second terminals are formed on a second substrate and divided into at least a third and a fourth group,
The second terminals of the third group are each formed to extend along a plurality of third straight lines arranged radially through a third point;
Each of the second terminals of the fourth group is formed to extend along a plurality of fourth straight lines arranged radially through a fourth point;
The electrical connection is
The first terminal of the first group and the second terminal of the third group by overlapping the first and third points and overlapping the first and third straight lines. And attaching a portion of the first substrate on the first terminal side of the first group with respect to the cut to the second substrate, and
Bending the first substrate, overlapping the second and fourth points, and overlapping the second and fourth straight lines, the first terminal of the second group, and the first A portion of the first substrate on the side of the first terminal of the second group with respect to the cut is attached to the second substrate by overlapping the second terminals of the fourth group. thing,
A method of manufacturing an electronic device comprising:
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