JP2007242739A - Light-emitting element storage package - Google Patents
Light-emitting element storage package Download PDFInfo
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- JP2007242739A JP2007242739A JP2006060365A JP2006060365A JP2007242739A JP 2007242739 A JP2007242739 A JP 2007242739A JP 2006060365 A JP2006060365 A JP 2006060365A JP 2006060365 A JP2006060365 A JP 2006060365A JP 2007242739 A JP2007242739 A JP 2007242739A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
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Abstract
Description
本発明は、発光素子を収納するパッケージに関し、特に、放熱性に優れ、かつ、高い反射効率を有するとともに、安価に製造することが可能な発光素子収納用パッケージに関する。 The present invention relates to a package for storing a light-emitting element, and more particularly to a light-emitting element storage package that has excellent heat dissipation and high reflection efficiency and can be manufactured at low cost.
発光ダイオード（ＬＥＤ：Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）などの発光素子を各種基板に実装するために用いられるパッケージは、平板状の基体の上面に発光素子を収納するキャビティが設けられ、キャビティの内壁面に形成された反射面で発光素子からの出力光を反射して外部に放射する構造となっている。このようなパッケージには高い反射効率が要求されるだけでなく、発光素子からの発熱を効率良く逃がすため、高い放熱性も要求される。そこで、これらの特性を満足するパッケージについて、従来、様々な研究や開発が行われており、これまでにも多くの発明や考案が開示されている。 A package used for mounting light emitting elements such as light emitting diodes (LEDs) on various substrates is provided with a cavity for housing the light emitting elements on the upper surface of a flat substrate, and is formed on the inner wall surface of the cavity. The reflecting surface reflects the output light from the light emitting element and radiates it to the outside. Such a package is required not only to have high reflection efficiency, but also to have high heat dissipation in order to efficiently release heat from the light emitting element. Thus, various researches and developments have been conducted on packages that satisfy these characteristics, and many inventions and devices have been disclosed so far.
例えば、特許文献１には、「発光ダイオードパッケージ」という名称で、良質な光反射面を有し、放熱性に優れるとともに、輝度や視野角の製造バラツキが小さい発光ダイオードパッケージに関する発明が開示されている。
特許文献１に開示された発明は、セラミック基板上にＬＥＤ素子を実装するためのキャビティが形成され、このキャビティの内部にＬＥＤ素子を取り囲むように金属製のリングが接合された構造となっている。そして、金属製のリングはその内周面にＬＥＤ素子からの発光光束を所定の方向に反射する光反射面が形成されるとともに、キャビティ底面の外周縁部に被着されたモリブデンやマンガンあるいはタングステン等からなるメタライズ層に銀ロウ材を用いてロウ付けされている。
この特許文献１に開示された発明においては、光反射面が金属製のリングに形成されており、その表面が滑らかであるため、高い反射率を有する。また、リングが銀ロウ材によってセラミック基板上にロウ付けされているため、放熱性が良い。
For example, Patent Document 1 discloses an invention related to a light-emitting diode package having a light-reflecting surface with a high-quality light reflection surface, excellent heat dissipation, and small manufacturing variations in luminance and viewing angle. Yes.
The invention disclosed in Patent Document 1 has a structure in which a cavity for mounting an LED element is formed on a ceramic substrate, and a metal ring is joined inside the cavity so as to surround the LED element. . The metal ring has a light reflecting surface for reflecting the luminous flux from the LED element in a predetermined direction on its inner peripheral surface, and molybdenum, manganese, or tungsten deposited on the outer peripheral edge of the cavity bottom surface. Etc. are brazed using a silver brazing material.
In the invention disclosed in Patent Document 1, the light reflecting surface is formed on a metal ring and the surface thereof is smooth, and thus has a high reflectance. Further, since the ring is brazed onto the ceramic substrate with a silver brazing material, heat dissipation is good.
また、特許文献２には、「発光素子収納用パッケージ及びその製造方法」という名称で、発光素子の発光効率と放熱性を向上できるとともに、安価に製造可能な発光素子収納用パッケージとその製造方法に関する発明が開示されている。
特許文献２に開示された発明は、窒化アルミニウム基板の片面に金属製又はセラミック製の枠体が接合され、窒化アルミニウム基板の表面にはタングステンやモリブデン等の金属導体ペーストを用いてスクリーン印刷により導体配線パターンが形成されており、この導体配線パターン上に発光素子が実装される構造となっている。そして、窒化アルミニウム基板は色彩色差計で白色１００から黒色０間において７０以上の呈色を有し、その表面粗さが０．３μｍＲａ未満であることを特徴とする。
この特許文献２に開示された発明においては、発光素子からの発熱が熱伝導率の良い窒化アルミニウム基板により速やかに放熱される。また、窒化アルミニウム基板の表面は白色系であり、かつ表面粗さが小さいため、発光素子からの光を効率良く反射する。
Japanese Patent Application Laid-Open No. H10-228561 is named “Light Emitting Element Storage Package and Manufacturing Method Thereof” and can improve the light emitting efficiency and heat dissipation of the light emitting element and can be manufactured at low cost and the manufacturing method thereof. An invention related to this is disclosed.
In the invention disclosed in Patent Document 2, a metal or ceramic frame is bonded to one side of an aluminum nitride substrate, and the surface of the aluminum nitride substrate is conductive by screen printing using a metal conductor paste such as tungsten or molybdenum. A wiring pattern is formed, and a light emitting element is mounted on the conductor wiring pattern. The aluminum nitride substrate is a color difference meter and has a coloration of 70 or more between white 100 and black 0, and its surface roughness is less than 0.3 μmRa.
In the invention disclosed in Patent Document 2, the heat generated from the light emitting element is quickly radiated by the aluminum nitride substrate having good thermal conductivity. In addition, since the surface of the aluminum nitride substrate is white and has a small surface roughness, light from the light emitting element is efficiently reflected.
特許文献３には、「半導体発光装置」という名称で、カメラの照明や液晶のバックライト等に用いられ、放熱性や光の取り出し効率に優れた半導体発光装置に関する発明が開示されている。
特許文献３に開示された発明は、配線が形成された樹脂製の絶縁基板に金属製又はセラミック製の補助基板が接合された複合基板に対して、絶縁基板を貫通するとともに補助基板により底面が閉塞される凹部が設けられ、内壁面に金属メッキ加工が施されたこの凹部の底面上に半導体発光素子が実装されるものである。
特許文献３に開示された発明においては、半導体発光素子が発する光が金属メッキ部分によって反射されるとともに、半導体発光素子からの発熱が補助基板を通じて拡散される。
Patent Document 3 discloses an invention relating to a semiconductor light-emitting device that is used for camera illumination, a liquid crystal backlight, and the like under the name of “semiconductor light-emitting device” and has excellent heat dissipation and light extraction efficiency.
In the invention disclosed in Patent Document 3, a composite substrate in which a metal or ceramic auxiliary substrate is bonded to a resin insulating substrate on which wiring is formed penetrates the insulating substrate and has a bottom surface formed by the auxiliary substrate. A semiconductor light emitting element is mounted on the bottom surface of the concave portion that is provided with a closed concave portion and whose inner wall surface is subjected to metal plating.
In the invention disclosed in Patent Document 3, light emitted from the semiconductor light emitting element is reflected by the metal plating portion, and heat generated from the semiconductor light emitting element is diffused through the auxiliary substrate.
しかしながら、上述の従来技術である特許文献１に開示された発明においては、金属リングに使用される鉄−ニッケル−コバルト合金などが高価なため、材料コストが高くなる。また、タングステンの粒径が不均一なため、キャビティ底面に被着されたメタライズ層の平坦性が損なわれる。従って、光反射面がキャビティ底面と所定の角度をなすように、金属リングをセラミック基板上に正確に接合することが困難となる。 However, in the invention disclosed in Patent Document 1 which is the above-described prior art, since the iron-nickel-cobalt alloy used for the metal ring is expensive, the material cost becomes high. Further, since the particle size of tungsten is not uniform, the flatness of the metallized layer deposited on the bottom surface of the cavity is impaired. Therefore, it is difficult to accurately join the metal ring onto the ceramic substrate so that the light reflecting surface forms a predetermined angle with the cavity bottom surface.
また、特許文献２に開示された発明においては、窒化アルミニウム基板上の導体配線パターンがタングステンやモリブデン等の金属導体ペーストによって形成されることから、発光素子の実装面の平坦性が損なわれる結果、発光素子が発する光の放射角度が設計値からはずれるおそれがあった。 Further, in the invention disclosed in Patent Document 2, since the conductor wiring pattern on the aluminum nitride substrate is formed of a metal conductor paste such as tungsten or molybdenum, the flatness of the mounting surface of the light emitting element is impaired, There is a possibility that the radiation angle of the light emitted from the light emitting element deviates from the design value.
さらに、特許文献３に開示された発明においては、凹部の内壁面にメッキ処理を施す必要があるため、製造工程が煩雑となり、製造コストが高くなってしまうという課題があった。 Furthermore, in the invention disclosed in Patent Document 3, since it is necessary to perform plating treatment on the inner wall surface of the recess, there is a problem that the manufacturing process becomes complicated and the manufacturing cost increases.
本発明はかかる従来の事情に対処してなされたものであり、放熱性と反射効率に優れ、製造コストの安い発光素子収納用パッケージを提供することを目的とする。 The present invention has been made in view of such conventional circumstances, and an object of the present invention is to provide a light-emitting element storage package that is excellent in heat dissipation and reflection efficiency and low in manufacturing cost.
上記目的を達成するため、請求項１記載の発明は、上面に発光素子の搭載部を有するセラミック製の基体と、この基体の表面に接合され貫通孔を形成するリング状のセラミックからなる枠体とを有する発光素子収納用パッケージにおいて、発光素子は搭載部に銅箔を用いて接合されることを特徴とするものである。
このような構成の発光素子収納用パッケージにおいては、表面研磨等によって発光素子の搭載部の平坦性が容易に確保される。また、発光素子の搭載部の放熱性が高まる。
In order to achieve the above object, the invention according to claim 1 is a frame made of a ceramic base having a light emitting element mounting portion on the upper surface and a ring-shaped ceramic bonded to the surface of the base to form a through hole. In the light-emitting element storage package, the light-emitting element is bonded to the mounting portion using a copper foil.
In the light emitting element storage package having such a configuration, the flatness of the light emitting element mounting portion is easily ensured by surface polishing or the like. In addition, the heat dissipation of the light emitting element mounting portion is enhanced.
また、請求項２に記載の発明は、上面に発光素子の搭載部を有するセラミック製の基体と、この基体の表面に接合され貫通孔を形成するリング状のセラミックからなる枠体とを有する発光素子収納用パッケージにおいて、枠体は基体に銅箔を用いて接合されることを特徴とするものである。
上記構成の発光素子収納用パッケージにおいては、表面研磨等を行うことにより、枠体と基体との接合面の平坦性が容易に確保される。
According to a second aspect of the present invention, there is provided a light emitting device comprising a ceramic base having a light emitting element mounting portion on an upper surface and a ring-shaped ceramic frame joined to the surface of the base to form a through hole. In the element storage package, the frame body is bonded to the base body using a copper foil.
In the light emitting element storage package having the above-described configuration, the flatness of the joint surface between the frame body and the substrate is easily ensured by performing surface polishing or the like.
請求項３に記載の発明は、請求項１又は請求項２に記載の発光素子収納用パッケージにおいて、銅箔に代えて銅ペーストを用いて接合されることを特徴とするものである。
上記構成の発光素子収納用パッケージにおいては、枠体が研磨加工の容易な銅ペーストを介して基体に接合されるため、枠体と基体との接合面の平坦性の確保が容易である。
According to a third aspect of the present invention, in the light emitting element storage package according to the first or second aspect, bonding is performed using a copper paste instead of the copper foil.
In the light emitting element storage package having the above configuration, since the frame body is bonded to the base body through a copper paste that is easily polished, it is easy to ensure the flatness of the bonding surface between the frame body and the base body.
請求項４に記載の発明は、上面に発光素子の搭載部を有するセラミック製の基体と、この基体の表面に接合され貫通孔を形成するリング状のセラミックからなる枠体とを有する発光素子収納用パッケージにおいて、枠体は切欠部を備え、この切欠部に掛着するかしめ用部材により枠体は基体にかしめ接合されることを特徴とするものである。
上記構成の発光素子収納用パッケージにおいては、枠体が基体に確実に固定される。特に、加工が容易で、かつ熱伝導性が高い金属材料によってかしめ用部材を形成することによれば、基体に当接するかしめ用部材の底面の平坦性が容易に確保される。
According to a fourth aspect of the present invention, there is provided a light emitting element housing comprising a ceramic base having a light emitting element mounting portion on an upper surface, and a ring-shaped ceramic frame joined to the surface of the base to form a through hole. In the packaging package, the frame body includes a notch portion, and the frame body is caulked and joined to the base body by a caulking member hooked on the notch portion.
In the light emitting element storage package having the above configuration, the frame is securely fixed to the base. In particular, by forming the caulking member with a metal material that is easy to process and has high thermal conductivity, the flatness of the bottom surface of the caulking member that comes into contact with the base is easily secured.
本発明の請求項１に記載の発光素子収納用パッケージによれば、発光素子を基体表面に所定の姿勢で正確に接合することが可能である。これにより、発光効率の製造バラツキが小さい、高品質な製品を製造することができる。また、発光素子からの発熱を効率良く放散して、温度上昇に伴う発光素子の故障や発光効率の低下を防ぐことが可能である。 According to the light emitting element storage package of the first aspect of the present invention, the light emitting element can be accurately bonded to the surface of the substrate in a predetermined posture. Thereby, it is possible to manufacture a high-quality product with small manufacturing variations in luminous efficiency. Further, it is possible to efficiently dissipate heat generated from the light emitting element, thereby preventing a failure of the light emitting element and a decrease in light emitting efficiency due to a temperature rise.
また、本発明の請求項２に記載の発光素子収納用パッケージでは、基体の上面に対して枠体を所望の姿勢で確実に接合することができる。従って、発光素子からの出力光を枠体の内壁面で効率良く反射させることが可能である。 In the light emitting element storage package according to claim 2 of the present invention, the frame body can be reliably bonded to the upper surface of the base body in a desired posture. Therefore, it is possible to efficiently reflect the output light from the light emitting element on the inner wall surface of the frame.
本発明の請求項３に記載の発光素子収納用パッケージによれば、請求項１又は請求項２に記載の発明と同様の効果を奏する。 According to the light emitting element storage package of claim 3 of the present invention, the same effect as that of the invention of claim 1 or claim 2 can be obtained.
本発明の請求項４に記載の発光素子収納用パッケージによれば、枠体を基体に容易に接合することが可能である。また、加工が容易で、かつ熱伝導性が高い金属材料を用いてかしめ用部材を形成した場合、底面の平坦性の確保が容易となるため、枠体を基体上面に正確な姿勢で接合して、発光素子からの出力光を枠体の内周面で効率良く反射させることができる。 According to the light emitting element storage package of the fourth aspect of the present invention, the frame body can be easily joined to the base. In addition, when the caulking member is formed using a metal material that is easy to process and has high thermal conductivity, it is easy to ensure the flatness of the bottom surface. Thus, the output light from the light emitting element can be efficiently reflected by the inner peripheral surface of the frame.
以下に、本発明の最良の実施の形態に係る発光素子収納用パッケージ１について説明する。 Hereinafter, the light emitting element storage package 1 according to the preferred embodiment of the present invention will be described.
実施例１について図１乃至図３を用いて説明する（特に請求項１乃至請求項３に対応）。
図１（ａ）及び（ｂ）はそれぞれ本発明の実施の形態に係る発光素子収納用パッケージの実施例１の縦断面図及び平面図であり、図２は実施例１の発光素子収納用パッケージにおいて銅箔を用いて枠体を基体に接合する手順を示す工程図である。また、図３は実施例１の発光素子収納用パッケージにおいて銅ペーストを用いて枠体を基体に接合する手順を示す工程図である。
図１（ａ）及び（ｂ）に示すように、発光素子収納用パッケージ１ａは、貫通孔６を有するリング状の枠体３が略矩形平板状の基体２の上面２ａに銅箔や銅ペーストなどの接合部材７によって接合され、貫通孔６の開口部６ａから枠体３の内周面３ａを経て露出する基体２の上面２ａまでの空間として形成されるキャビティ４に発光素子５が収納されている。そして、発光素子５からの出力光を枠体３の内周面３ａに形成された反射面（３ａ）で反射することによって外部に放射する構造となっている。また、発光素子５は、基体２の上面２ａに接合された接合部材７に接続用バンプ８を用いてフリップチップ接続されている。さらに、接続用バンプ８はＡｕＳｎ、半田、異方性フィルム又は金バンプなどにより形成され、接合部材７には導体配線がパターニングされている。なお、基体２の下面２ｂには外部と電気的に接続するための端子部１０が形成され、この端子部１０にはタングステンやモリブデンなどによって導体配線がパターニングされている。また、接合部材７を介して基体２の上面２ａに搭載される発光素子５は、基体２に穿設されるとともに内部に導電性部材が充填されたビア９によって端子部１０と導通がとられている。さらに、図示していないが、キャビティ４の内部には発光素子５を封止するための樹脂等が充填され、貫通孔６の開口端には集光レンズとして機能する透明性部材（図示せず）が挿着されており、キャビティ４の内部は気密性が保たれている。
Embodiment 1 will be described with reference to FIGS. 1 to 3 (particularly corresponding to claims 1 to 3).
FIGS. 1A and 1B are a longitudinal sectional view and a plan view of Example 1 of the light emitting element storage package according to the embodiment of the present invention, respectively, and FIG. 2 is a light emitting element storage package of Example 1. It is process drawing which shows the procedure which joins a frame to a base | substrate using copper foil in FIG. FIG. 3 is a process diagram showing a procedure for joining the frame body to the base body using the copper paste in the light emitting element storage package of the first embodiment.
As shown in FIGS. 1A and 1B, a light emitting element storage package 1a includes a ring-shaped frame 3 having a through-hole 6 and a copper foil or a copper paste on an upper surface 2a of a substantially rectangular flat plate-like substrate 2. The light emitting element 5 is housed in a cavity 4 formed as a space from the opening 6a of the through-hole 6 to the upper surface 2a of the base 2 exposed through the inner peripheral surface 3a of the frame body 3. ing. And it has the structure which radiates | emits outside by reflecting the output light from the light emitting element 5 with the reflective surface (3a) formed in the internal peripheral surface 3a of the frame 3. FIG. Further, the light emitting element 5 is flip-chip connected to the bonding member 7 bonded to the upper surface 2 a of the base 2 using the connection bumps 8. Further, the connection bumps 8 are formed of AuSn, solder, anisotropic film, gold bumps, or the like, and the conductor wiring is patterned on the bonding member 7. A terminal portion 10 for electrical connection to the outside is formed on the lower surface 2b of the base 2, and conductor wiring is patterned on the terminal portion 10 with tungsten, molybdenum, or the like. Further, the light emitting element 5 mounted on the upper surface 2a of the base 2 through the bonding member 7 is electrically connected to the terminal portion 10 by a via 9 which is formed in the base 2 and filled with a conductive member. ing. Further, although not shown, the cavity 4 is filled with a resin or the like for sealing the light emitting element 5, and a transparent member (not shown) that functions as a condensing lens at the opening end of the through hole 6. ) Is inserted, and the inside of the cavity 4 is kept airtight.
基体２は、Ａｌ２Ｏ３を主原料とする複数のセラミックグリーンシートの焼結体が複数積層された構造となっている。セラミックグリーンシートとは、焼結助剤成分が添加・混合された原料粉末に、さらにバインダや溶剤が添加されたスラリーをドクターブレード法などを用いてシート状に成形したものである。なお、基体２の材質はＡｌ２Ｏ３に限定されるものではなく、適宜変更可能である。例えば、より高い放熱性が要求される場合には、放熱性に優れるＡｌＮ（窒化アルミニウム）を用いることもできる。 The base 2 has a structure in which a plurality of sintered bodies of a plurality of ceramic green sheets made mainly of Al 2 O 3 are laminated. The ceramic green sheet is obtained by forming a slurry in which a binder and a solvent are further added to a raw material powder to which a sintering aid component has been added and mixed, into a sheet shape using a doctor blade method or the like. The material of the substrate 2 is not limited to Al 2 O 3, it can be changed as appropriate. For example, when higher heat dissipation is required, AlN (aluminum nitride) excellent in heat dissipation can also be used.
枠体３は内周面が基体２の上面２ａに対して所定の角度で傾斜した、いわゆるすり鉢状をなしており、セラミックの粉体プレスによって成形される。原料粉体には、焼結助剤成分としてＳｉＯ２、ＣａＯ、ＭｇＯ、ＢａＯが添加されたＡｌ２Ｏ３の仮焼粉末にバインダ、溶剤及び可塑剤を混合し、スプレードライヤーで乾燥させて造粒したものを使用する。そして、この原料粉体をプレス成形し、１，５００℃の酸化雰囲気中で焼結させることによって枠体３が形成される。一般に、原料中のＡｌ２Ｏ３の割合が多いと製品は高強度となるが、同時に材料価格も高くなってしまう。従って、基体２ほどの強度が要求されない枠体３には、原料中のＡｌ２Ｏ３の割合が少なく安価な材料を使用することが望ましい。 The frame 3 has a so-called mortar shape in which the inner peripheral surface is inclined at a predetermined angle with respect to the upper surface 2a of the base 2, and is formed by a ceramic powder press. In the raw material powder, a binder, a solvent and a plasticizer are mixed with a calcined powder of Al 2 O 3 to which SiO 2 , CaO, MgO and BaO are added as sintering aid components, and dried by a spray dryer. Use grained ones. The raw material powder is press-molded and sintered in an oxidizing atmosphere at 1,500 ° C. to form the frame 3. In general, when the proportion of Al 2 O 3 in the raw material is large, the product has high strength, but at the same time, the material price increases. Therefore, it is desirable to use an inexpensive material with a small proportion of Al 2 O 3 in the raw material for the frame 3 that does not require the strength as that of the base 2.
次に、枠体３を基体２に接合する方法について、図１を適宜参照しながら説明する。本実施例においては、接合部材７である銅箔又は銅ペーストをセラミックに直接接合する、いわゆるＤＢＣ（Ｄｉｒｅｃｔ Ｂｏｎｄ Ｃｏｐｐｅｒ）法を用いる。なお、ＤＢＣ法とは、薄板状の銅をセラミックに接触させ、窒素又はアルゴンの雰囲気中で加熱することにより接合界面にＣｕ−Ｏの共晶液相を生成させ、この共晶液相によって銅とセラミックとを接合する方法である。
まず、接合部材７として銅箔を用いる場合について説明する。
図２に示すように、ステップＳ１０において、接合部材７として用いる厚さ２０〜１００μｍの銅箔を枠体３の底面３ｂとほぼ同じ形状に加工した後、その両面にエッチング加工を施す。次に、ステップＳ１１において窒素又はアルゴンの雰囲気中、３００〜４００℃の温度条件で接合部材７を予備酸化させる。ステップＳ１２で、片面に接着剤が塗布された接合部材７を枠体３の底面３ｂに押し当てた状態で２５〜１００℃の温度条件で乾燥させて仮付けする。さらに、ステップＳ１３において、自動機によって枠体３を基体２に正確に位置合わせした後、ステップＳ１２で用いた接着剤により枠体３を基体２に仮付けする。ステップＳ１４では、窒素又はアルゴンの雰囲気中、８００〜１１００℃の温度条件で接合部材７を加熱し、接合界面７ａ，７ｂにＣｕ−Ｏ共晶液相を生成させる。このＣｕ−Ｏ共晶液相により、接合部材７は基体２及び枠体３に対してそれぞれ強固に接合されることになる。なお、ステップＳ１２及びステップＳ１３で用いた接着剤はこの工程で気化するため、製品に残留することはない。さらに、ステップＳ１５において、基体２と枠体３の接合部である接合部材７の露出部分にニッケルメッキ及び金メッキを施す。これにより、接合部の腐食が防止される。なお、ステップＳ１１やステップＳ１４の前に、接合部材７の表面に予めタングステンを用いてパターンを成形し、ニッケルメッキ処理を施しておくことが望ましい。銅の濡れ性を向上させて基体２や枠体３に対する接合部材７の接合強度を増加させるためである。
Next, a method for joining the frame 3 to the base 2 will be described with reference to FIG. In this embodiment, a so-called DBC (Direct Bond Copper) method is used in which the copper foil or copper paste as the joining member 7 is directly joined to the ceramic. In the DBC method, a thin plate-like copper is brought into contact with a ceramic and heated in an atmosphere of nitrogen or argon to form a Cu—O eutectic liquid phase at the bonding interface. And ceramic.
First, the case where a copper foil is used as the joining member 7 will be described.
As shown in FIG. 2, in step S <b> 10, a copper foil having a thickness of 20 to 100 μm used as the bonding member 7 is processed into the same shape as the bottom surface 3 b of the frame body 3, and then etching is performed on both surfaces thereof. Next, in step S11, the bonding member 7 is pre-oxidized in a nitrogen or argon atmosphere under a temperature condition of 300 to 400 ° C. In step S12, the bonding member 7 having one side coated with an adhesive is pressed against the bottom surface 3b of the frame 3 and dried and temporarily attached at a temperature of 25 to 100 ° C. Further, in step S13, the frame 3 is accurately aligned with the base 2 by an automatic machine, and then the frame 3 is temporarily attached to the base 2 with the adhesive used in step S12. In step S14, the bonding member 7 is heated in a nitrogen or argon atmosphere under a temperature condition of 800 to 1100 ° C. to generate a Cu—O eutectic liquid phase at the bonding interfaces 7a and 7b. Due to the Cu—O eutectic liquid phase, the bonding member 7 is firmly bonded to the base 2 and the frame 3. In addition, since the adhesive agent used by step S12 and step S13 is vaporized by this process, it does not remain in a product. Furthermore, in step S15, nickel plating and gold plating are performed on the exposed portion of the bonding member 7 which is a bonding portion between the base 2 and the frame 3. Thereby, corrosion of a junction part is prevented. In addition, before step S11 or step S14, it is desirable to form a pattern on the surface of the joining member 7 in advance using tungsten and to perform nickel plating. This is to improve the wettability of copper and increase the bonding strength of the bonding member 7 to the base 2 and the frame 3.
次に、接合部材７に銅ペーストを用いる場合について説明する。
図３に示すように、ステップＳ２０において、印刷機を用いて枠体３の底面３ｂに接合部材７として用いる厚さ２０〜１００μｍの銅ペーストを印刷する。次に、この銅ペーストをステップＳ２１において、２００℃以下の温度条件で仮硬化させる。なお、銅ペーストの粘度が高い場合には、この工程を省略することもできる。また、銅の濡れ性を向上させ、基体２と枠体３との接合強度を増加させるために、銅ペーストの表面にタングステンによりパターンを成形し、ニッケルメッキ処理を施しても良い。ステップＳ２２では、自動機によって枠体３を基体２に対して正確に位置合わせする。銅ペーストの粘度が低い場合や粘着性が弱い場合には、この工程でステップＳ１２で用いた接着剤を基体２の上面２ａに塗布することが望ましい。そして、位置合わせが完了した枠体３の底面３ｂを基体２の上面２ａに押し当てて仮付けする。ステップＳ２３では、窒素又はアルゴンの雰囲気中、８００〜１１００℃の温度条件で銅ペーストを加熱することにより接合界面７ａ，７ｂにＣｕ−Ｏ共晶液相を生成し、このＣｕ−Ｏ共晶液相により銅ペーストは基体２及び枠体３とそれぞれ強固に接合される。最後に、ステップＳ２４において、基体２と枠体３との接合部の腐食を防ぐために、銅ペーストの露出部分にニッケルメッキ及び金メッキを施す。
Next, the case where a copper paste is used for the joining member 7 will be described.
As shown in FIG. 3, in step S <b> 20, a copper paste having a thickness of 20 to 100 μm used as the joining member 7 is printed on the bottom surface 3 b of the frame 3 using a printing machine. Next, this copper paste is temporarily cured in step S21 under a temperature condition of 200 ° C. or less. In addition, when the viscosity of a copper paste is high, this process can also be skipped. Further, in order to improve the wettability of copper and increase the bonding strength between the base 2 and the frame 3, a pattern may be formed on the surface of the copper paste with tungsten and subjected to nickel plating. In step S22, the frame 3 is accurately aligned with the base 2 by an automatic machine. When the viscosity of the copper paste is low or the tackiness is weak, it is desirable to apply the adhesive used in step S12 to the upper surface 2a of the substrate 2 in this step. Then, the bottom surface 3b of the frame 3 that has been aligned is pressed against the top surface 2a of the base body 2 to be temporarily attached. In step S23, a Cu—O eutectic liquid phase is generated at the bonding interfaces 7a and 7b by heating the copper paste under a temperature condition of 800 to 1100 ° C. in an atmosphere of nitrogen or argon. The copper paste is firmly bonded to the base 2 and the frame 3 by the phases. Finally, in step S24, nickel plating and gold plating are applied to the exposed portion of the copper paste in order to prevent corrosion of the joint portion between the base 2 and the frame 3.
さらに、発光素子５を基体２に接合する方法について説明する。
銅箔を接合部材７として用いる場合には、まず、図２を用いて説明したように、予備酸化した銅箔をその片面にステップＳ１２で用いた接着剤を塗布して基体２の上面２ａに押し当て、２５〜１００℃の温度条件で乾燥させることにより、仮付けする。さらに、この銅箔に導体配線パターンを形成した後、窒素又はアルゴンの雰囲気中、８００〜１１００℃の温度条件で加熱し、銅箔の表面にＣｕ−Ｏ共晶液相を生成させる。このＣｕ−Ｏ共晶液相により、銅箔と基体２の上面２ａとの接合強度が向上する。そして、この銅箔上に発光素子５を搭載するのである。なお、上記工程において、銅箔に導体配線パターンを形成する前に予め表面研磨を行っておくと、発光素子５を搭載する面の平坦性が向上する。
次に、銅ペーストを接合部材７として用いる場合には、基体２の上面２ａに図３で説明した銅ペーストを印刷して導体配線パターンを形成する。その後、２００℃以下の温度条件で銅ペーストを仮硬化させ、さらに、８００〜１１００℃の温度条件で加熱して、銅ペーストの表面にＣｕ−Ｏ共晶液相を生成させる。このＣｕ−Ｏ共晶液相によって銅ペーストは基体２の上面２ａに強固に接合される。
Further, a method for bonding the light emitting element 5 to the base 2 will be described.
When using a copper foil as the joining member 7, first, as described with reference to FIG. 2, the adhesive used in step S12 is applied to one surface of the pre-oxidized copper foil and applied to the upper surface 2a of the substrate 2. It is temporarily attached by pressing and drying at a temperature of 25 to 100 ° C. Furthermore, after forming a conductor wiring pattern on this copper foil, it heats in 800-1100 degreeC temperature conditions in the atmosphere of nitrogen or argon, and produces | generates a Cu-O eutectic liquid phase on the surface of copper foil. This Cu—O eutectic liquid phase improves the bonding strength between the copper foil and the upper surface 2 a of the substrate 2. And the light emitting element 5 is mounted on this copper foil. In the above process, if surface polishing is performed in advance before forming the conductor wiring pattern on the copper foil, the flatness of the surface on which the light emitting element 5 is mounted is improved.
Next, when using a copper paste as the bonding member 7, the copper paste described in FIG. 3 is printed on the upper surface 2 a of the base 2 to form a conductor wiring pattern. Thereafter, the copper paste is temporarily cured under a temperature condition of 200 ° C. or lower, and further heated under a temperature condition of 800 to 1100 ° C. to generate a Cu—O eutectic liquid phase on the surface of the copper paste. By this Cu—O eutectic liquid phase, the copper paste is firmly bonded to the upper surface 2 a of the substrate 2.
このような構造の発光素子収納用パッケージ１ａにおいては、枠体３と基体２との接合面に研磨加工の容易な銅箔又は銅ペーストを用いているため、表面研磨によって、その平坦性を容易に確保することができる。これにより、枠体３をその内壁面が上面２ａに対して所望の角度をなすように基体２に正確に接合することが可能となる。従って、反射効率に優れた発光素子収納用パッケージ１ａを容易に製造することができる。
また、発光素子５の搭載部にも銅箔又は銅ペーストを用いているため、表面研磨によって、その平坦性を容易に確保することができる。これにより、発光素子５を搭載部に対して所望の姿勢で正確に接合することが可能となる。従って、発光効率の製造バラツキを小さくして、製品の品質を向上させることができる。さらに、銅は熱伝導率の大きい材料であるため、発光素子５の搭載部の放熱性を高めることができる。従って、温度上昇に伴う発光素子５の故障や発光効率の低下を防ぐことが可能である。加えて、枠体３に高価な金属を使用しないため、材料単価を下げることができる。また、枠体３の内周面に反射面を形成するためのメッキ処理を施す必要がないため、製造工程が簡略化される。さらに、基体２と枠体３が別々に形成されるため、それぞれの目的に応じた適切な材料を選択することが可能である。従って、製品の品質向上と材料コストの削減を同時に図ることができる。
In the light emitting element storage package 1a having such a structure, since the copper foil or the copper paste that is easily polished is used for the joint surface between the frame 3 and the base body 2, the flatness is easily achieved by surface polishing. Can be secured. As a result, the frame 3 can be accurately bonded to the base 2 so that the inner wall surface forms a desired angle with respect to the upper surface 2a. Therefore, the light emitting element storage package 1a having excellent reflection efficiency can be easily manufactured.
Further, since the copper foil or the copper paste is also used for the mounting portion of the light emitting element 5, the flatness can be easily ensured by surface polishing. Thereby, the light emitting element 5 can be accurately bonded to the mounting portion in a desired posture. Therefore, it is possible to reduce the manufacturing variation in luminous efficiency and improve the product quality. Furthermore, since copper is a material having a high thermal conductivity, the heat dissipation of the mounting portion of the light emitting element 5 can be improved. Therefore, it is possible to prevent the failure of the light emitting element 5 and the decrease in light emission efficiency due to the temperature rise. In addition, since an expensive metal is not used for the frame 3, the material unit price can be reduced. In addition, since it is not necessary to perform a plating process for forming a reflective surface on the inner peripheral surface of the frame 3, the manufacturing process is simplified. Furthermore, since the base body 2 and the frame body 3 are formed separately, it is possible to select an appropriate material according to each purpose. Accordingly, it is possible to simultaneously improve product quality and reduce material costs.
実施例２について図４を用いて説明する（特に請求項４に対応）。
図４（ａ）及び（ｂ）はそれぞれ本発明の実施の形態に係る発光素子収納用パッケージの実施例２の縦断面図及び平面図である。ただし、図１に示した構成要素と同じものについては、同一の符号を付してその説明を省略する。
図４（ａ）及び（ｂ）に示すように、発光素子収納用パッケージ１ｂは実施例１の発光素子収納用パッケージ１ａにおいて、基体２の４箇所にかしめ用孔１３が穿設されるとともに、上面１１ａの外縁部の４箇所に切欠部１４が設けられた枠体１１と、枠体１１の底面１１ｂの一部と外周面１１ｃとを覆うかしめ用部材１２とを備えるものである。そして、かしめ用部材１２には切欠部１４に掛着可能な凸部１２ａと、かしめ用孔１３に挿通可能なかしめ部１２ｂとが設けられている。
上記構造の発光素子収納用パッケージ１ｂにおいては、凸部１２ａを切欠部１４に掛着させ、かしめ部１２ｂをかしめ用孔１３に挿通させてかしめることにより、枠体１１を基体２の上面２ａに容易かつ確実に接合することが可能である。また、かしめ用部材１２を加工が容易で、かつ熱伝導性が高い銅などの金属材料を用いて形成することによれば、底面１２ｃの平坦性の確保が容易となり、枠体１１を基体２の上面２ａに正確な姿勢で接合することが可能となる。これにより、発光素子５からの出力光が枠体１１の内周面１１ｄによって所望の角度で正確に反射されるため、反射効率の優れた発光素子収納用パッケージ１ｂを精度良く製造することができる。また、かしめ用部材１２は放熱面積が広いため、発光素子５からの発熱を効率良く放散させることが可能である。
Example 2 will be described with reference to FIG. 4 (corresponding to claim 4 in particular).
4A and 4B are a longitudinal sectional view and a plan view, respectively, of Example 2 of the light emitting element storage package according to the embodiment of the present invention. However, the same components as those shown in FIG. 1 are denoted by the same reference numerals and description thereof is omitted.
As shown in FIGS. 4A and 4B, the light-emitting element storage package 1b is formed in the light-emitting element storage package 1a of Example 1 with caulking holes 13 formed in four locations of the base 2; The frame 11 is provided with cutouts 14 at four locations on the outer edge of the upper surface 11a, and the caulking member 12 covers a part of the bottom surface 11b of the frame 11 and the outer peripheral surface 11c. The caulking member 12 is provided with a convex portion 12 a that can be hooked to the notch portion 14 and a caulking portion 12 b that can be inserted into the caulking hole 13.
In the light emitting element storage package 1b having the above-described structure, the frame 12 is attached to the upper surface 2a of the base body 2 by hooking the convex portion 12a to the notch 14 and inserting the caulking portion 12b into the caulking hole 13. Can be easily and reliably joined. In addition, by forming the caulking member 12 using a metal material such as copper that is easy to process and has high thermal conductivity, it is easy to ensure the flatness of the bottom surface 12c, and the frame 11 is attached to the base body 2. It becomes possible to join to the upper surface 2a in an accurate posture. Thereby, since the output light from the light emitting element 5 is accurately reflected at a desired angle by the inner peripheral surface 11d of the frame 11, the light emitting element storage package 1b having excellent reflection efficiency can be manufactured with high accuracy. . Moreover, since the caulking member 12 has a large heat radiation area, it is possible to efficiently dissipate heat generated from the light emitting element 5.
本発明の発光素子収納用パッケージの材質は上記実施例に示すものに限定されない。例えば、枠体を金属製リングとして、銀ロウ材等を用いて基体にロウ付けした構造とすることもできる。また、かしめ用部材は枠体に掛着可能な構造であれば良いため、凸部及び切欠部の形状や個数及びその設置箇所は上記実施例に示す場合に限定されない。さらに、かしめ用部材は基体にかしめ可能な構造であれば良く、かしめ部及びかしめ用孔の形状や個数及びその設置箇所も上記実施例に示す場合に限定されるものではなく、適宜変更可能である。 The material of the light emitting element storage package of the present invention is not limited to that shown in the above embodiment. For example, a structure in which the frame body is made of a metal ring and brazed to the base using a silver brazing material or the like may be used. Further, since the caulking member only needs to have a structure that can be hooked to the frame, the shape and number of the convex portions and the cutout portions, and the installation location thereof are not limited to those shown in the above embodiment. Further, the caulking member only needs to have a structure that can be caulked to the base body, and the shape and number of caulking portions and caulking holes and their installation locations are not limited to those shown in the above embodiment, and can be appropriately changed. is there.
本発明の請求項１乃至請求項４に記載された発明は、発光素子を基板に搭載するために使用するパッケージに対して適用可能である。 The invention described in claims 1 to 4 of the present invention can be applied to a package used for mounting a light emitting element on a substrate.
１ａ，１ｂ…発光素子収納用パッケージ ２…基体 ２ａ…上面 ２ｂ…下面 ３…枠体 ３ａ…内周面 ３ｂ…底面 ４…キャビティ ５…発光素子 ６…貫通孔 ６ａ…開口部 ７…接合部材 ７ａ，７ｂ…接合界面 ８…接続用バンプ ９…ビア １０…端子部 １１…枠体 １１ａ…上面 １１ｂ…底面 １１ｃ…外周面 １１ｄ…内周面 １２…かしめ用部材 １２ａ…凸部 １２ｂ…かしめ部 １２ｃ…底面 １３…かしめ用孔 １４…切欠部 DESCRIPTION OF SYMBOLS 1a, 1b ... Light emitting element storage package 2 ... Base | substrate 2a ... Upper surface 2b ... Lower surface 3 ... Frame 3a ... Inner peripheral surface 3b ... Bottom surface 4 ... Cavity 5 ... Light emitting element 6 ... Through-hole 6a ... Opening 7 ... Joining member 7a 7b: Bonding interface 8 ... Connection bump 9 ... Via 10 ... Terminal 11 ... Frame 11a ... Upper surface 11b ... Bottom 11c ... Outer peripheral surface 11d ... Inner peripheral surface 12 ... Caulking member 12a ... Protruding portion 12b ... Caulking portion 12c ... bottom surface 13 ... caulking hole 14 ... notch
Claims (4)
In a light emitting element storage package having a ceramic base having a light emitting element mounting portion on an upper surface and a ring-shaped ceramic frame joined to the surface of the base to form a through hole, the frame is notched A light emitting element storage package, wherein the frame body is caulked and joined to the base by a caulking member hooked on the notch.
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