JP2007242383A - Connector, electro-optical device with connector, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector in which impedance matching can be achieved by a simple constitution even in the case of being applied to a high frequency circuit, and provide an electro-optical device with the connector, and an electronic equipment. <P>SOLUTION: This is the connector in order to electrically connect a first electric wiring and a second electric wiring installed on different substrates, the electro-optical device with the connector and the electronic equipment. This has a first connector part including a first connector pin electrically connected to the first electric wiring, and a second connector part including a second connector pin electrically connected to the second electric wiring, the first connector pin is installed at a first base part including a convex part, the second connector pin is installed at the base part including a recessed part, and furthermore, since the convex part and the recessed part are engaged, the first connector pin and the second connector pin are crimped and electrically connectable, and a contact face in crimping the first connector pin and the second connector pin is inclined against the horizontal face of the substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a connector, an electro-optical device with a connector, and an electronic apparatus. In particular, the present invention relates to a connector, an electro-optical device with a connector, and an electronic apparatus that can easily perform impedance matching by forming a contact portion with a predetermined structure.

2. Description of the Related Art Conventionally, a liquid crystal device that is one embodiment of an electro-optical device is configured by disposing a pair of substrates each having an electrode, and disposing a liquid crystal material between the pair of substrates. In this liquid crystal device, an image is displayed by applying a voltage to opposing electrodes to align a liquid crystal material and deflecting light passing therethrough.
In operating such a liquid crystal device, there is a connector having a predetermined shape as an electronic component that electrically connects an electrical wiring arranged on a substrate and an external device as a driving means. Examples of the connectors used here include BtoB (Board To Board) connectors and ZIF (Zero Insertion Force) connectors as inter-board connectors, which are used appropriately according to the respective applications.
However, although such a general-purpose connector has a relatively simple structure and is excellent in economic efficiency, when a mechanical shock is applied from the outside, the contact is displaced and the contact resistance changes. In some cases, there was a problem that continuity was lost.

Therefore, in order to solve such a problem, by arranging a socket connector made of a conductive member at the contact interface between the connector pins, the contact state at the contact is stabilized, and the contact and non-contact of the pin connector are stabilized. A parallel board connector (inter-board connector) that can easily switch the contact state is disclosed.
More specifically, as shown in FIG. 12, in a parallel board connector 500 in which a socket connector 502 is interposed between a first board 503 and a second board 504 arranged in parallel, pin contacts When the 511 are electrically connected, the contact state between the pin contacts can be maintained by interposing the socket connector 502 and the contact portions 521d and 521e at the interface. (For example, refer to Patent Document 1).
JP 2000-294317 A (Claims, FIG. 1)

However, when the board-to-board connector described in Patent Document 1 is used, the contact state can be stabilized, but the contact portion is a point contact at the tip of the contact pin. In some cases, the contact resistance was greatly changed even when the value slightly changed.
When such a connector whose contact resistance is likely to change is applied to a high-frequency circuit that transmits high-speed signals, the impedance at the contact interface rises, and the values of the input impedance and output impedance are increased. There was a so-called impedance mismatch that caused a shift.
In this way, as a result of using a connector with mismatched impedance, there are cases where the signal is reflected at the connector part and adversely affects the original transmission signal, or the transmission signal itself deteriorates and causes a communication failure. It was.

Therefore, as a result of diligent investigations, the inventors of the present invention, in the connector used when electrically connecting the electrical wiring provided on a different substrate, by inclining the contact surface of the connector pin with respect to the substrate surface, The present invention has been completed by finding that the contact area can be expanded to prevent an increase in contact resistance and prevent occurrence of impedance mismatch in the connector portion.
That is, an object of the present invention is to provide a connector, an electro-optical device with a connector, and an electronic apparatus including the connector that can achieve excellent impedance matching in a connector portion even when applied to a high-frequency circuit. To do.

According to the present invention, a connector for electrically connecting a first electrical wiring and a second electrical wiring provided on different substrates, wherein the first connector pin is electrically connected to the first electrical wiring. And a second connector part including a second connector pin electrically connected to the second electrical wiring, wherein the first connector pin includes a convex part. And the second connector pin is provided on the second base including the recess, and further, the first connector pin and the second connector pin are engaged by engaging the protrusion with the recess. A connector is provided, wherein the connector pin is press-contacted to be electrically connected, and a contact surface when the first connector pin and the second connector pin are press-contacted is inclined with respect to a horizontal plane of the substrate. The above-mentioned problem can be solved.
That is, when the first connector pin and the second connector pin are brought into pressure contact and electrically connected, the contact area between the connector pins is inclined with respect to the horizontal plane of the substrate on which the connector portion is disposed, thereby bringing the contact area into contact. To increase the contact resistance.
Therefore, an increase in impedance at the contact portion between the connector pins can be suppressed, impedance matching at the connector portion can be easily performed, and a connector suitable for a high-frequency circuit can be obtained.

In configuring the connector of the present invention, it is preferable to place the first connector portion and the second connector portion directly on the substrate.
With this configuration, a so-called BtoB connector can be configured, and the connector portion can be reduced to contribute to downsizing of the device and expansion of the display area.

In configuring the connector of the present invention, the first connector pin and the second connector pin preferably have a semicircular cross section when cut along a plane perpendicular to the extending direction.
By comprising in this way, the contact surface of connector pins can further be expanded and impedance matching can be performed still more easily.

In configuring the connector of the present invention, it is preferable to set the inclination angle of the contact surface to a value within a range of 10 to 80 ° with respect to the horizontal plane of the substrate.
By comprising in this way, the area of a contact surface can be controlled within a predetermined range, As a result, the impedance value in a connector part can be controlled within a predetermined range.

In configuring the connector of the present invention, it is preferable that a conductive film for adjusting the contact resistance is formed on the surfaces of the first connector pin and the second connector pin.
With this configuration, the contact resistance can be controlled by the thickness and material of the conductive film, and impedance matching can be performed with higher accuracy by combining with the adjustment by the shape.

In configuring the connector of the present invention, a metal frame is provided on the outer periphery of at least one of the first connector portion and the second connector portion, and the metal frame is short-circuited. It is preferable to be electrically insulated from the first connector pin and the second connector pin.
By configuring in this way, it is possible to prevent malfunction due to the influence of external electromagnetic waves, and to prevent electromagnetic waves generated from the connector from leaking to the outside, so that EMC (Electro-Magnetic Compatibility) is possible. And EMS (Electro-Magnetic
Susceptibility: A connector with excellent electromagnetic sensitivity.

Another aspect of the present invention is an electro-optical device with a connector that includes a first electrical wiring and includes a first connector portion for electrically connecting the first electrical wiring and an external device. The first connector portion has a first connector pin that is electrically connected to the first electrical wiring and press-contacted with the second connector pin of the second connector portion disposed on the external device side. The first connector pin is provided on the first base including the first convex portion or the first concave portion, and the second convex portion or the second convex portion of the second connector portion disposed on the external device side. The second connector pin provided on the second base including the concave portion is pressed by the engagement of the first convex portion and the second concave portion, or the first concave portion and the second convex portion. The first connector pin is press-contacted with the second connector pin. Contact surface when that is, a connectorized electro-optical device in which the first connector portion and being inclined with respect to the arrangement surface of the substrate.
Therefore, the electro-optical device configured as described above can be driven accurately and stably at high speed with few occurrences of impedance mismatching even when driven using a high-speed signal.

Still another embodiment of the present invention is an electronic apparatus including any of the electro-optical devices described above.
That is, since an electro-optical device including a connector suitable for a high-frequency circuit is provided, it is possible to provide an electronic apparatus that can easily perform impedance matching even when the transmission signal is increased in speed.

[First Embodiment]
1st Embodiment in this invention is a connector which consists of the 1st connector part and 2nd connector part which have a predetermined shape, Comprising: The 1st convex part provided in the 1st connector part, 2nd A connector having a structure that engages with a second recess provided in the connector portion will be described as an example with reference to FIGS. 1 to 7 as appropriate.

1. Basic Configuration FIG. 1 is a schematic perspective view of a connector 100 according to the present invention. The connector 100 mainly includes a first connector portion 101 and a second connector portion 201 that engages with the first connector portion 101.
The first connector portion 101 includes a first base portion 102 made of an insulating material such as a resin material, and a first electrical wiring provided on the substrate and provided on the first base portion 102 (see FIG. The first connector pins 103 are electrically connected to each other.
The second connector unit 201 includes a second base 202 made of an insulating material, and a second electrical wiring (not shown) provided on the second base 202 and provided in an external device. And a second connector pin 203 that is electrically connected to each other.
The first connector portion 101 and the second connector portion 201 configured as described above are composed of a first convex portion 104 provided on the first base portion 102 and a second concave portion provided on the second base portion. 204 can be engaged with each other. By combining in this way, the first connector pin 103 and the second connector pin 203 come into contact with each other at their contact points and are electrically connected.

2. Contact state 1
FIGS. 2A and 2B are enlarged cross-sectional views in the vicinity of contact points where the connector pins contact each other, and are cross-sectional views taken along a cross section (EE cross section in FIG. 1) along the extending direction of the connector pins. Is shown. Further, FIG. 2A shows a state in which the contact between the connector pins is opened, and FIG. 2B shows a state in which the contact is made.
As shown in FIGS. 2A to 2B, the connector of the present invention is characterized in that the contact surfaces of the connector pins are inclined with a predetermined inclination angle θ. This is because the contact area can be changed in a limited space by providing the inclined surface in this way, and an increase in contact resistance generated at the contact portion can be suppressed.
Therefore, if the connector suppresses the increase in contact resistance as described above, it is possible to easily perform impedance matching by preventing an increase in impedance at the connector portion, as will be described later.
In addition, the inclination angle θ is preferably set to a value in the range of 10 to 80 ° with respect to the horizontal plane of the substrate 60. That is, it is preferable that the angle of the slope of the engaging portion of the first convex portion 104 and the second concave portion 204 is inclined with respect to the horizontal plane of the substrate.
This is because the contact surface having such a shape can change the value of the contact resistance in accordance with the inclination angle θ and can be a connector having excellent impedance matching adjustability. is there.
Here, the influence of the contact resistance and the inclination angle θ of the connector portion on the impedance value of the connector will be described.
In general, the transmission path arranged on the substrate constitutes an equivalent circuit 160 shown in FIG. When an AC voltage V having a frequency ω (Hz) is applied to the equivalent circuit 160, resistance components generated in the circuit are a resistance R (Ω), a self-inductance L (H), and a capacitance C ( When F), the impedance Z ₀ (Ω) of the equivalent circuit 160 is expressed by the following equation (1).

このように表記されるインピーダンスＺ₀は、一般に、振動数ωに比べてＲが小さいことから、下記式（１）´のように近似することができる。

Since the impedance Z ₀ expressed in this way is generally smaller than the frequency ω, it can be approximated by the following equation (1) ′.

In this approximate expression, since both the self-inductance L and the capacitance C are values proportional to the length of the transmission path, as a result, the value of the impedance Z ₀ in the expression (1) ′ is The value does not depend on the length. Therefore, when impedance matching is performed in a predetermined electronic circuit, impedance matching of the entire circuit can be achieved by calculating an impedance value for each arbitrarily divided circuit block and matching the values.
However, this approximate expression does not necessarily hold when the value of the resistance R is not sufficiently small compared to other parameters or when the resistance R cannot be ignored as in high-speed transmission. In this case, it is necessary to obtain the impedance Z ₀ as the above equation (1), and it is necessary to consider the resistance R.
That is, in the connector as in the present invention, when the contact resistance between the connector pins is R ′, an equivalent circuit 160 ′ as shown in FIG. 3B is formed.
In this equivalent circuit, the impedance Z ₀ ′ can be expressed as the following equation (2).

このように表記されるインピーダンスＺ₀´において、接触抵抗Ｒ´は下記式（３）で表記することができる。

In the impedance Z ₀ ′ expressed in this way, the contact resistance R ′ can be expressed by the following formula (3).

In this equation (3), ρ is resistivity, S is the area of the contact surface when θ = 90 °, D is the length in the conduction direction, and θ is the inclination angle.
Accordingly, as the contact surface is inclined in the horizontal direction, the value of the contact resistance R ′ becomes smaller, and as a result, the value of the impedance Z ₀ can be lowered.
However, if the value of the inclination angle θ is excessively small, that is, if the contact area is excessively widened, the contact resistance can be suppressed, but the entire connector becomes wide and the entire device In some cases, the miniaturization is hindered.
On the other hand, if the value of the inclination angle θ is excessively increased, the contact resistance cannot be lowered sufficiently, which may cause impedance mismatch.
Therefore, the range of the inclination angle is preferably a value within a range of 20 to 80 °, and more preferably a value within a range of 30 to 70 °.

Moreover, as shown to Fig.4 (a)-(b), the contact which has a predetermined inclination angle exists in two places in a pair of connector pin which a convex part and a recessed part engage.
In the connector having such a shape, it is preferable that the connector has a base portion with different inclination angles at the left and right contact points. More specifically, as shown in FIG. 4A, when the inclination angles of the left and right contact portions are θ1 and θ2, respectively, the first protrusions 104a and the second projections having different θ1 and θ2 respectively. A connector 100a having a recess 204a is preferable.
The reason for this is that impedance matching can be achieved by independently controlling the two inclination angles in this way, and a connector with better impedance adjustment can be obtained.
Moreover, as shown in FIG.4 (b), it is also preferable to set it as the connector 100b which has the 1st convex part 104b and the 2nd recessed part 204b which made the inclined surface curved.
The reason for this is that by curving the inclined surface with a predetermined curvature, it is possible to smoothly engage with each other when engaging, and the contact area is smaller than when the inclined surface is a straight line. This is because the contact resistance can be increased and the increase in contact resistance can be further suppressed.
Note that the inclination angle when curved in this way can be defined as the inclination angle θ ′ of the virtual plane connecting the lowest point A and the highest point B of the inclined surface, as shown in FIG. it can.

3. Contact state 2
5A to 5C show cross-sectional views when cut along a cross section perpendicular to the extending direction of the connector pin at the contact point, that is, when cut along the AA cross section in FIG. 2B. .
As shown in this cross-sectional view, the shape when the first connector pin and the second connector pin are fitted can take various shapes according to the form.
More specifically, as shown in FIG. 5A, it is preferable that the first connector pin 103a and the second connector pin 203a have a semicircular cross section.
This is because, by adopting such a shape, the contact area can be increased without reducing the distance between adjacent connector pins, and impedance matching can be further facilitated.
Further, when the semicircular shape is used as described above, it is preferable that the length D of the string is set to a value within the range of 0.1 to 3 mm.
This is because the contact resistance can be suppressed while preventing contact between the connector pins by setting the value within such a range. Therefore, the contact resistance can be reduced by a simple method without a design change such as a change in the pitch interval of the connector pins.
However, if the length D of the string becomes excessively large, the shape of the connector pin itself becomes wide and may not be able to cope with a reduction in the pitch between wirings. On the other hand, if it becomes too small, the contact resistance may not be sufficiently suppressed.
Accordingly, the range of the length is preferably set to a value within the range of 0.15 to 2.5 mm, and more preferably set to a value within the range of 0.2 to 2.0 mm.
Further, as shown in FIG. 5B, it is also preferable that the first connector pin 103b and the second connector pin 203b each have a fine uneven shape at the contact interface.
The reason for this is that the first connector pin 103b and the second connector pin 203b can be firmly engaged with each other to further reduce the contact resistance.
Further, even when a mechanical impact in the left-right direction in the figure is applied, it is possible to prevent the contact interface from shifting and to prevent the contact resistance from increasing.
Further, as shown in FIG. 5C, the first connector pin 103c and the second connector pin 203c having conductive films 103c ′ and 203c ′ for adjusting the contact resistance on the surface of the connector pin, It is preferable to do.
The reason for this is that even when the diameter of the connector pin is reduced and it is difficult to perform the fine processing as described above, the conductive film is formed by a conventionally known simple method such as vapor deposition or coating, and contact is made. This is because the resistance can be effectively reduced.
In addition, the material of the conductive film is not particularly limited as long as it is a material having a low electrical resistivity. For example, a metal material that has been conventionally used for electrical wiring such as gold, silver, copper, and aluminum is used. Can do.

4). Connector Pin In the connector according to the present invention, as shown in FIGS. 6A to 6B, the connector pin as the signal transmission path is preferably a predetermined shield line for transmitting a high-frequency signal.
More specifically, as shown in FIG. 6A, a microstrip in which a ground wire 103d ′ is disposed so as to be embedded in the first base portion 102 at a position facing the first connector pin 103d. A line is preferred.
The reason for this is that the insulating material is interposed and opposed to the ground wiring, thereby preventing the electromagnetic radiation from the connector pin 103d and blocking the electromagnetic wave from the outside, so that the generation of noise is small and suitable for a high frequency circuit. It is because it can be set as a connector.
Further, as shown in FIG. 6B, it is preferable to use a coplanar line in which the first connector pins 103e and the ground wiring 103e ′ are alternately arranged in the plane direction.
The reason for this is that by alternately arranging the transmission lines and the ground lines in this way, it is possible to prevent the occurrence of noise due to electromagnetic interference between adjacent connector pins and to make a connector suitable for a high-frequency circuit. Because.
In addition, although the aspect of the connector pin mentioned above has shown taking the 1st connector pin as an example, all of these can be similarly applied to the 2nd connector pin.

5). Frame A connector suitable for high-speed transmission can be obtained by adding a predetermined frame to the connector 100 of the present invention.
More specifically, as shown in FIG. 7, it is preferable to dispose metal frames 171 and 172 inside the first base portion 102 and the second base portion 202, respectively.
The metal frames 171 and 172 are preferably short-circuited at one end connected to a ground terminal, and preferably provided with an uneven shape so as to be electrically insulated from the connector pins.
This is because by covering the connector with such a short-circuited metal member, electromagnetic waves from the outside can be blocked, and malfunctions due to noise or the like can be prevented. Further, electromagnetic waves generated from the connector itself can also be prevented from leaking to the outside.

[Second Embodiment]
The second embodiment of the present invention is an electro-optical device with a connector provided with a first connector portion having a predetermined shape.
Hereinafter, as the electro-optical device of this embodiment, a TFT element (Thin Film)
An example of a substrate for a liquid crystal device with a connector provided directly with a connector on an element substrate used in a liquid crystal device provided with a transistor and a liquid crystal device using the same will be described. However, the present invention is not limited to a liquid crystal device having a TFT element, but also a TFD element (Thin
The present invention can be applied to various electro-optical devices such as an active matrix liquid crystal device including a film diode and a passive matrix liquid crystal device including no switching element.
The substrate for a liquid crystal device with a connector can be at least one of an element substrate and a counter substrate. In the present embodiment, the substrate for a liquid crystal device having a connector on the element substrate side will be described as an example. To do.
Moreover, in each figure, what is attached | subjected with the same code | symbol shows the same member, and while abbreviate | omitting description suitably, the one part member is abbreviate | omitted suitably in each figure.
Also, the contents described in the first embodiment will be omitted as appropriate, and the second embodiment will be described focusing on characteristic parts.

1. Basic Configuration First, the basic configuration of the liquid crystal device according to the present embodiment will be described. Here, FIG. 8 is a schematic perspective view of the liquid crystal device 10 of the present embodiment, and FIG. 9 is a cross-sectional view of the pixel region portion.
As shown in FIG. 8, in the liquid crystal device 10, the counter substrate 30 and the element substrate 60 are bonded to each other at the peripheral portion by the sealing material 23, and are surrounded by the counter substrate 30, the element substrate 60, and the sealing material 23. A liquid crystal material (not shown) is sealed in the gap.
In the liquid crystal panel provided in the liquid crystal device 10, the element substrate 60 has a substrate extension portion 60 </ b> T that extends outward from the outer shape of the counter substrate 30. In addition, an external connection terminal 67 is formed on the surface of the substrate extension 60 </ b> T that holds a liquid crystal material (not shown), and the semiconductor element 91 is connected to the external connection terminal 67. A panel driving flexible substrate (FPC) 93 is connected. Furthermore, the liquid crystal panel to which the flexible substrate is connected is housed in a casing made of plastic or the like together with a light source (not shown) and the like, so that the liquid crystal device 10 is configured.

As shown in FIG. 9, the counter substrate 30 is formed of glass, plastic, or the like. On the counter substrate 30, a color filter, that is, colored layers 37r, 37g, and 37b, and the colored layers 37r, 37g, and 37b are formed. The counter electrode 33 is formed on the counter electrode 33, and the alignment film 45 is formed on the counter electrode 33. In addition, an insulating layer 41 for optimizing retardation is provided between the colored layers 37r, 37g, and 37b and the counter electrode 33 in the reflective region R.
Here, the counter electrode 33 is a planar electrode formed over the entire surface of the counter substrate 30 with ITO (indium tin oxide) or the like. In addition, the colored layers 37r, 37g, and 37b are disposed at positions facing the pixel electrode 63 on the element substrate 60 side, such as R (red), G (green), B (blue), or C (cyan), M (magenta), and Y. A color filter element of any color such as (yellow) is provided. A black mask or black matrix, that is, a light shielding film 39 is provided next to the colored layers 37 r, 37 g, and 37 b and at a position that does not face the pixel electrode 63.

The element substrate 60 facing the counter substrate 30 is formed of glass, plastic, or the like. On the element substrate 60, a TFT element 69 as an active element functioning as a switching element and a transparent insulating film 81 are sandwiched. And the pixel electrode 63 formed in the upper layer of the TFT element 69.
Here, the pixel electrode 63 is formed as a light reflection film 79 (63a) for performing reflective display in the reflective region R, and is formed as a transparent electrode 63b with ITO or the like in the transmissive region T. . The light reflection film 79 as the pixel electrode 63a is formed of a light reflective material such as Al (aluminum) or Ag (silver). An alignment film 85 made of a polyimide-based polymer resin is formed on the pixel electrode 63, and a rubbing process as an alignment process is performed on the alignment film 85.

  Further, a phase difference plate 47 is formed on the outer surface (that is, the upper side in FIG. 9) of the counter substrate 30, and a polarizing plate 49 is further formed thereon. Similarly, a retardation film 87 is formed on the outer surface of the element substrate 60 (that is, the lower side in FIG. 9), and a polarizing plate 89 is further formed thereunder. Further, a backlight unit (not shown) is disposed below the element substrate 60.

The TFT element 69 includes a gate electrode 71 formed on the element substrate 60, a gate insulating film 72 formed on the entire area of the element substrate 60 on the gate electrode 71, and the gate insulating film 72 interposed therebetween. A semiconductor layer 70 formed above the gate electrode 71, a source electrode 73 formed on one side of the semiconductor layer 70 via a contact electrode 77, and a contact electrode 77 on the other side of the semiconductor layer 70. And a drain electrode 66 formed through the electrode.
The gate electrode 71 extends from the gate bus wiring (not shown), and the source electrode 73 extends from the source bus wiring (not shown). Further, a plurality of gate bus lines extend in the horizontal direction of the element substrate 60 and are formed in parallel in the vertical direction at equal intervals, and the source bus lines cross the gate bus lines with the gate insulating film 72 interposed therebetween. A plurality of lines extending in the vertical direction are formed in parallel in the horizontal direction at equal intervals.
Such a gate bus wiring is connected to a liquid crystal driving IC (not shown) and functions as, for example, a scanning line, while a source bus wiring is connected to another driving IC (not shown), for example, a signal line. Acts as
The pixel electrode 63 is formed in a region excluding a portion corresponding to the TFT element 69 in a rectangular region defined by the gate bus wiring and the source bus wiring intersecting each other.

  Here, the gate bus wiring and the gate electrode can be formed of chromium, tantalum, or the like, for example. The gate insulating film is formed of, for example, silicon nitride (SiNx), silicon oxide (SiOx), or the like. Further, the semiconductor layer can be formed of, for example, doped a-Si, polycrystalline silicon, CdSe, or the like. Further, the contact electrode can be formed of, for example, a-Si, and the source electrode and the source bus wiring and the drain electrode integrated therewith can be formed of, for example, titanium, molybdenum, aluminum, or the like.

The organic insulating film 81 is formed over the entire area of the element substrate 60 so as to cover the gate bus lines, the source bus lines, and the TFT elements. However, a contact hole 83 is formed in a portion corresponding to the drain electrode 66 of the organic insulating film 81, and the pixel electrode 63 and the drain electrode 66 of the TFT element 69 are electrically connected at the contact hole 83.
In addition, in the organic insulating film 81, a resin film having a concavo-convex pattern composed of a regular or irregular repetitive pattern of peaks and valleys is formed as a scattering shape in a region corresponding to the reflective region R. Has been. As a result, the light reflection film 79 (63a) laminated on the organic insulating film 81 also has a light reflection pattern composed of an uneven pattern. However, this uneven pattern is not formed in the transmission region T.

In the liquid crystal device 10 having the above-described structure, during reflective display, external light such as sunlight or indoor illumination light enters the liquid crystal device 10 from the counter substrate 30 side, and the colored layers 37r, 37g, 37b, the liquid crystal material 21, and the like, reach the light reflection film 79, reflected there, and again pass through the liquid crystal material 21, the colored layers 37r, 37g, 37b, etc., and then exit from the liquid crystal device 10 to be reflected. Display is performed.
On the other hand, the illuminating device is turned on during transmissive display, and light emitted from the illuminating device passes through the translucent transparent electrode 63b and passes through the colored layers 37r, 37g, 37b, the liquid crystal material 21, and the like. By passing through and exiting the liquid crystal device 10, transmissive display is performed.

2. Arrangement Position In addition, by arranging the connector of the present invention on the element substrate 60, the connector-equipped liquid crystal device substrate 60 can be configured.
At this time, the connector can be arranged in various forms depending on the wiring design or the like. For example, as shown in FIG. 10 (a), the first connector portion 101 or the second connector portion 102 is provided. It is preferable to arrange them directly on the element substrate 60.
This is because by using such a connector, even if it is applied to a small device such as a mobile phone, it can be used without hindering the downsizing of the entire apparatus.
In general, when a connector is arranged directly on a board, when a mechanical impact is applied to the board, a load tends to be easily applied to the connector which is a connection portion. When a load is applied to the connector in this way, the connector portion is displaced and the contact resistance changes, which may cause noise and adversely affect the transmission signal. However, in the case of the connector according to the present invention, even if a slight distortion occurs in the connector portion due to an external mechanical impact, the contact area of the contact surface is wide and stable electrical connection is made. Therefore, it is possible to prevent such a problem from occurring and perform accurate signal transmission.
Further, as shown in FIG. 10B, the first connector portion 101 or the second connector portion 102 is placed on the flexible circuit board 93 electrically connected to the projecting portion 60T of the element substrate via an ACF or the like. It is preferable to use an electro-optical device substrate (element substrate) 60 on which is disposed.
The reason for this is that an interface corresponding to a liquid crystal device adopting a high-speed transmission signal can be configured by disposing it on the flexible circuit board that is an interface with an external device.

[Third Embodiment]
3rd Embodiment of this invention is an electronic device provided with the connector of 1st Embodiment.
FIG. 11 is a schematic configuration diagram showing the overall configuration of the electronic apparatus of the present embodiment. The electronic apparatus includes a liquid crystal panel 20 provided in the liquid crystal device and a control unit 200 for controlling the liquid crystal panel 20. In FIG. 11, the liquid crystal panel 20 is conceptually divided into a panel structure 20 </ b> A and a drive circuit 20 </ b> B composed of a semiconductor element (IC) or the like. The control means 200 also includes a display information output source 201, a display processing circuit 202, a power supply circuit 203, and a timing generator 204.
The display information output source 201 includes a ROM (Read Only Memory) and a RAM (Random
Access memory), a storage unit composed of a magnetic recording disk, an optical recording disk, and the like, and a tuning circuit that tunes and outputs a digital image signal. Based on various clock signals generated by the timing generator 204 The display information is supplied to the display processing circuit 202 in the form of a predetermined format image signal or the like.

The display processing circuit 202 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to display the image. Information is supplied together with the clock signal CLK to the drive circuit 20B. Furthermore, the drive circuit 20B can include a first electrode drive circuit, a second electrode drive circuit, and an inspection circuit. Further, the power supply circuit 203 has a function of supplying a predetermined voltage to each of the above-described components.
In the electronic device of this embodiment, since each component is electrically connected by a connector suitable for a high frequency circuit, a high-speed transmission signal is adopted as a transmission signal from the external device to the driving driver IC. Even in this case, impedance matching can be effectively achieved and an electronic device with less noise can be obtained.

According to the present invention, when the first connector pin and the second connector pin are brought into pressure contact and electrically connected, the contact surface between the connector pins is inclined with respect to the horizontal plane of the substrate on which the connector portion is disposed. Thus, it is possible to provide a connector that expands the contact area and suppresses an increase in contact resistance. Accordingly, electro-optical devices and electronic devices such as liquid crystal devices including TFT elements, such as mobile phones and personal computers, liquid crystal televisions, viewfinder type / monitor direct view type video tape recorders, car navigation devices, pagers, etc. , Electrophoresis device, electronic notebook, calculator, word processor, workstation, video phone, POS terminal, electronic device with touch panel, device with electron emission element (FED: Field Emission Display or SCEED: Surface-Conduction Electron-Emitter
It can be widely applied to Display).

1 is a schematic perspective view of a connector according to the present invention. (A)-(b) is an expanded sectional view which shows the contact of a connector pin. (A)-(b) is a figure for demonstrating the relationship between an impedance and contact resistance. (A)-(b) is a figure for demonstrating the inclined surface in a contact part. (A)-(c) is a figure for demonstrating the shape of the contact interface of a connector pin. (A)-(b) is the figure which applied the shield wire to the connector pin. It is a figure for demonstrating a flame | frame. It is a schematic perspective view of the liquid crystal device of 2nd Embodiment. It is sectional drawing of the liquid crystal panel used for the liquid crystal device of 2nd Embodiment. (A)-(b) is the schematic for demonstrating the arrangement position of a connector. It is a block diagram which shows schematic structure of the electronic device of 3rd Embodiment. It is sectional drawing which shows the conventional board-to-board connector.

Explanation of symbols

10: Liquid crystal device (electro-optical device), 20: Liquid crystal panel, 30: Counter substrate (color filter substrate), 60: Element substrate, 60T: Substrate extension, 93: Flexible substrate (FPC for panel drive), 100: Connector: 101: 1st connector part, 102: 1st base part, 103: 1st connector pin, 104: 1st convex part, 171, 172: Metal frame, 201: 2nd connector part, 202: 2nd base, 203: 2nd connector pin, 204: 2nd recessed part

Claims (8)

A connector for electrically connecting a first electrical wiring and a second electrical wiring provided on different substrates,
A first connector portion including a first connector pin electrically connected to the first electrical wiring; a second connector portion including a second connector pin electrically connected to the second electrical wiring; Have
The first connector pin is provided on a first base including a convex portion, and the second connector pin is provided on a second base including a concave portion, and the convex portion and the By engaging the recess, the first connector pin and the second connector pin are pressed and electrically connected,
A connector, wherein a contact surface when the first connector pin and the second connector pin are in pressure contact with each other is inclined with respect to a horizontal plane of the substrate.   The connector according to claim 1, wherein the first connector portion and the second connector portion are directly placed on the substrate.   The connector according to claim 1 or 2, wherein the first connector pin and the second connector pin have a semicircular cross-sectional shape when cut along a plane perpendicular to the extending direction.   The connector according to claim 1, wherein an inclination angle of the contact surface is set to a value within a range of 10 to 80 ° with respect to a horizontal plane of the substrate.   The conductive film for adjusting contact resistance is formed in the surface of the said 1st connector pin and the 2nd connector pin, The connector as described in any one of Claims 1-4 characterized by the above-mentioned. .   A metal frame is provided on an outer periphery of at least one of the first connector portion and the second connector portion, and the metal frame is short-circuited, and the first connector pin and the second connector frame are short-circuited. The connector according to claim 1, wherein the connector is electrically insulated from the connector pin. An electro-optical device with a connector including a first connector and a first connector for electrically connecting the first electrical wiring and an external device,
The first connector portion is electrically connected to the first electrical wiring and has a first connector pin that is press-contacted with a second connector pin of a second connector portion disposed on the external device side. And
The first connector pin is provided on the first base including the first convex portion or the first concave portion, and the second convex portion or the second convex portion of the second connector portion disposed on the external device side. The second connector pin provided on the second base including the two concave portions is engaged with the first convex portion and the second concave portion, or the first concave portion and the second convex portion. Can be electrically connected by pressure contact,
An electro-optic with a connector, wherein a contact surface when the first connector pin is in pressure contact with the second connector pin is inclined with respect to a surface of a substrate on which the first connector portion is disposed. apparatus. The electronic device provided with the connector as described in any one of Claims 1-6.

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