JP2007086408A - Electrooptical device, method for manufacturing electrooptical device, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrooptical device whose display quality is improved by easily and securely short-circuiting a fixed-potential wire arranged on a flexible circuit board without using a conductive tape, and to provide a method for manufacturing the electrooptical device, and electronic equipment. <P>SOLUTION: In the electrooptical device etc., including a substrate for the electrooptical device to which the flexible circuit board having the fixed-potential wire is connected, a housing into which the substrate for the electrooptical device is incorporated, and a frame fitted outside the housing, the flexible circuit board having the fixed-potential wire is arranged between the housing and the frame, the fixed-potential terminal is provided to the surface of at least one of the housing and the frame, and the fixed-potential terminal and fixed-potential wire are brought into press-contact with each other and are electrically connected. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electro-optical device, a method of manufacturing an electro-optical device, and an electronic apparatus, and in particular, an electric that can easily and reliably short-circuit a constant potential wiring on a flexible circuit board without using a conductive tape. The present invention relates to an optical device, a method for manufacturing an electro-optical device, and an electronic apparatus.

2. Description of the Related Art Conventionally, a liquid crystal device that is one embodiment of an electro-optical device is configured by disposing a pair of substrates each having an electrode, and disposing a liquid crystal material between the pair of substrates. In this liquid crystal device, an image is displayed by applying a voltage to opposing electrodes to align a liquid crystal material and deflecting light passing therethrough.
Here, in order to stably drive the liquid crystal device, a part of the wiring on the substrate is connected to a metal outer frame via a conductive tape and a flexible flexible circuit board (FPC). A method of short-circuiting is used. By using such a short-circuit method, even when the switching element is driven continuously, a reference potential is applied on the substrate, so that stable driving can be performed.
However, when such a short-circuit method is used, it is necessary to arrange the connection portion between the flexible circuit board and the metal outer frame in a frame area that is outside the image display area. There was a problem of making it difficult.

Therefore, in order to solve such a problem, as shown in FIG. 18, a flexible substrate 502 having a ground pattern 501 on the surface is bent to the back side of the circuit substrate 503, and the ground pattern 501 is connected to the conductive tape 504. A liquid crystal display device 500 that is electrically connected to a lower case 505 that is an outer frame is disclosed. (See Patent Document 1).
JP-A-11-305205 (Claims, FIG. 1)

  However, although the liquid crystal device described in Patent Document 1 can narrow the frame region by connecting the ground pattern and the outer frame on the back side of the substrate, the connection portion is not electrically conductive. Since the tape was used, there was a problem that the entire substrate was thickened by the thickness. In addition, this conductive tape is a material that is made conductive by containing conductive particles in the resin, so the resistivity may be higher than that of metal, and a sufficient short-circuit effect cannot be obtained. It was observed.

Therefore, as a result of intensive studies, the inventors of the present invention can solve such problems by pressing and electrically connecting the constant potential wiring arranged on the flexible circuit board and the constant potential terminal. And the present invention has been completed.
That is, the present invention relates to an electro-optical device that can be simply and reliably short-circuited by pressing a constant-potential wiring arranged on a flexible circuit board against a constant-potential terminal without using a conductive tape, It is an object to provide a manufacturing method and an electronic apparatus provided with such an electro-optical device.

According to the present invention, an electro-optical device substrate to which a flexible circuit board having constant potential wiring is connected, a housing in which the electro-optical device substrate is incorporated, and a frame attached to the outside of the housing; In the electro-optical device, the flexible circuit board including the constant potential wiring is disposed between the casing and the frame, and the constant potential terminal is provided on at least one surface of the casing and the frame. In addition, an electro-optical device is provided in which a constant potential wiring is pressed and electrically connected to each other, and the above-described problems can be solved.
In other words, the constant potential wiring arranged on the flexible circuit board can be short-circuited easily and reliably without using a conductive tape by short-circuiting using the constant-potential terminal arranged on the housing or the frame. it can. Therefore, it is possible to provide an electro-optical device that can be reduced in thickness and size by tapeless.

Further, in configuring the electro-optical device of the present invention, a convex portion is formed on at least one of the housing and the frame, and the constant potential terminal and the constant potential wiring are press-contacted by the convex portion. Thus, it is preferable to electrically connect them.
By configuring in this way, the constant potential wiring and the constant potential terminal can be further firmly and partially pressed using the convex portion, and the contact resistance can be controlled more easily.

In configuring the electro-optical device of the present invention, it is preferable that the constant potential wiring is arranged on both surfaces of the flexible circuit board.
With this configuration, the constant potential wiring can be short-circuited with both the frame and the casing, and the plurality of constant potential wirings can be reliably short-circuited.

In configuring the electro-optical device of the present invention, the frame is preferably a short-circuited conductive frame.
With this configuration, a ground frame in which the entire frame is short-circuited is configured, and noise generation in the transmission signal can be more effectively suppressed.

In configuring the electro-optical device of the present invention, it is preferable that the gap between the convex portion and the other surface facing the convex portion is smaller than the thickness of the flexible circuit board.
With this configuration, the flexible circuit board can be securely held in the gap between the frame and the housing, the flexible circuit board can be fixed at a predetermined position, and the constant potential wiring and the constant potential terminal can be securely connected. Can be short-circuited.

In configuring the electro-optical device of the present invention, it is preferable that the constant potential terminal is provided on the surface of the frame and the convex portion is provided on the surface of the housing.
With this configuration, a ground frame in which a part of the frame is short-circuited is configured, and noise generation in the transmission signal can be suppressed.

In constructing the electro-optical device of the present invention, the constant potential terminal and the convex portion are both provided on the surface of the casing, and the constant potential terminal and the convex portion share a part thereof. It is preferable.
With this configuration, the constant potential wiring on the flexible circuit board and the constant potential terminal can be directly and firmly pressed against each other, and the contact resistance at the connection portion can be reduced.

In configuring the electro-optical device of the present invention, it is preferable that the convex portion is composed of a plurality of convex portions.
With this configuration, a plurality of contacts between the constant potential wiring and the constant potential terminal can be provided, and even if a part of the constant potential wiring is disconnected, the constant potential wiring is reliably short-circuited. be able to.

Further, in configuring the electro-optical device of the present invention, the convex portion is provided on the surface of the housing and the frame, respectively, the convex portion provided on the housing, the convex portion provided on the frame, Are preferably arranged at offset positions.
With this configuration, the flexible circuit board can be deformed in a complicated manner, the contact area between the constant potential wiring and the constant potential terminal can be expanded, and the contact resistance between the constant potential wiring and the constant potential terminal can be reduced. it can.

In constructing the electro-optical device of the present invention, a concave portion is provided at a position opposite to the convex portion, and the convex portion and the concave portion are engaged via the flexible circuit board. It is preferable.
With this configuration, the contact area between the constant potential wiring and the constant potential terminal can be increased, the displacement of the flexible circuit board can be prevented, and the constant potential wiring can be short-circuited more efficiently. Can do.

In configuring the electro-optical device of the present invention, it is preferable that the convex portion is a convex portion provided with a leaf spring mechanism.
With this configuration, it is possible to control the pressing force with respect to the constant potential terminal of the constant potential wiring, and it is possible to easily control the contact resistance between the constant potential wiring and the constant potential terminal.

  According to another aspect of the present invention, there is provided an electro-optical device substrate to which a flexible circuit board having a constant potential wiring is connected, a housing in which the electro-optical device substrate is incorporated, and an outer side of the housing. And a step of connecting the flexible circuit board to the electro-optic device substrate, a step of incorporating the electro-optic device substrate into the housing, and a frame housing. A step of attaching to the body, and a step of pressing and electrically connecting the constant potential terminal and the constant potential wiring by a convex portion provided on at least one surface of the housing and the frame. An electro-optical device that can short-circuit a constant potential wiring on a flexible circuit board without using a conductive tape. It can be efficiently produce.

Still another embodiment of the present invention is an electronic apparatus including any of the electro-optical devices described above.
In other words, since an electro-optical device that short-circuits a constant potential wiring disposed on a flexible circuit board without using a conductive tape is provided, an electronic device that is small, thin, and excellent in display quality is provided. can do.

  Hereinafter, exemplary embodiments of an electro-optical device, a method for manufacturing the electro-optical device, and an electronic apparatus according to the present invention will be specifically described with reference to the drawings. However, this embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the present invention.

[First Embodiment]
The first embodiment includes an electro-optical device substrate to which a flexible circuit board including constant potential wiring is connected, a housing in which the electro-optical device substrate is incorporated, and a frame attached to the outside of the housing. In the electro-optical device, the flexible circuit board including the constant potential wiring is disposed between the casing and the frame, and the constant potential terminal is provided on at least one surface of the casing and the frame. The constant potential wiring is press-contacted and electrically connected.

Hereinafter, an active matrix liquid crystal device including a TFT element (Thin Film Transistor) will be described as an example of the electro-optical device of the present embodiment. However, the present invention includes not only a liquid crystal device having a TFT element but also an active matrix liquid crystal device having a TFD element (Thin Film Diode) and a passive matrix liquid crystal device having no switching element. The present invention can be applied to various electro-optical devices.
In the following description, a liquid crystal panel refers to a state in which a liquid crystal material is injected between a pair of substrates bonded with a sealing material, and a flexible circuit board, an electronic component, a light source, and the like are included in the liquid crystal panel. The attached state is referred to as a liquid crystal device.

1. Liquid Crystal Device (1) Basic Configuration First, the liquid crystal device according to the present embodiment will be described. Here, FIG. 1A shows a cross-sectional view of the liquid crystal device 10, and FIG. 1B shows a plan view of the element substrate 60 in the liquid crystal device of FIG. Further, FIG. 2 is a schematic perspective view showing the appearance of the liquid crystal device 10.
As shown in these drawings, in the liquid crystal device 10, the counter substrate 30 and the element substrate 60 are bonded to each other through a sealing material at the periphery thereof, and the liquid crystal material 21 is disposed in a gap 21a formed thereby. Is formed.

(2) Counter substrate The counter substrate 30 has a colored layer 37r, 37g, 37b, a counter electrode 33, a layer thickness adjusting layer 41 for optimizing retardation, and an alignment film 45 on a base 31 made of glass or the like. And a substrate mainly comprising:
Here, the counter electrode 33 is a planar electrode formed over the entire surface with ITO (indium tin oxide) or the like. Further, a color layer 37r as a color filter element such as R (red), G (green), and B (blue) is provided below the counter electrode 33 so as to correspond to the pixel electrode 63 on the element substrate 60 side. 37g and 37b are arranged. A black matrix, that is, a light shielding film 39 is provided as a color mixture prevention region between adjacent colors at a position adjacent to the colored layers 37r, 37g, and 37b and not facing the pixel electrode 63.

(3) Element Substrate The element substrate 60 includes a TFT element 69 as a switching element on a base 61 made of glass or the like, and a pixel electrode 63 formed in an upper layer of the TFT element 69 with a transparent organic insulating film 81 interposed therebetween. Is a substrate mainly comprising:
Here, the pixel electrode 63 is formed in the reflective region R also as a light reflecting film 79 (63a) for performing reflective display, and in the transmissive region T is formed as a transparent electrode 63b by ITO or the like. Is done. The light reflecting film 79 as the pixel electrode 63 is formed of a light reflecting material such as Al (aluminum), Ag (silver), or the like. Further, an alignment film 85 made of a polyimide polymer resin is formed on the pixel electrode 63, and a rubbing process as an alignment process is performed on the alignment film 85.

  A phase difference plate 47 is formed on the surface of the counter substrate 30 outside (that is, the upper side in FIG. 1A), and a polarizing plate 49 is further formed thereon. Similarly, a phase difference plate 87 is formed on the surface of the element substrate 60 (that is, the lower side in FIG. 1A), and a polarizing plate 89 is further formed thereunder. Further, a backlight unit (not shown) is disposed below the element substrate 60.

The TFT element 69 includes a gate electrode 71 formed on the element substrate 60, a gate insulating film 72 formed on the entire area of the element substrate 60 on the gate electrode 71, and the gate insulating film 72 interposed therebetween. A semiconductor layer 70 formed above the gate electrode 71, a source electrode 73 formed on one side of the semiconductor layer 70 via a contact electrode 77, and a contact electrode 77 on the other side of the semiconductor layer 70. And a drain electrode 66 formed through the electrode.
The gate electrode 71 extends from the gate bus wiring (not shown), and the source electrode 73 extends from the source bus wiring (not shown). Further, a plurality of gate bus lines extend in the horizontal direction of the element substrate 60 and are formed in parallel in the vertical direction at equal intervals, and the source bus lines cross the gate bus lines with the gate insulating film 72 interposed therebetween. A plurality of lines extending in the vertical direction are formed in parallel in the horizontal direction at equal intervals.
Such a gate bus wiring is connected to a liquid crystal driving IC (not shown) and functions as, for example, a scanning line, while a source bus wiring is connected to another driving IC (not shown), for example, a signal line. Acts as
The pixel electrode 63 is formed in a region excluding a portion corresponding to the TFT element 69 in a rectangular region defined by the gate bus wiring and the source bus wiring intersecting each other.

The organic insulating film 81 is formed over the entire area of the element substrate 60 so as to cover the gate bus lines, the source bus lines, and the TFT elements. However, a contact hole 83 is formed in a portion corresponding to the drain electrode 66 of the organic insulating film 81, and the pixel electrode 63 and the drain electrode 66 of the TFT element 69 are electrically connected through the contact hole 83.
In addition, in the organic insulating film 81, a resin film having a concavo-convex pattern composed of a regular or irregular repetitive pattern of peaks and valleys is formed as a scattering shape in a region corresponding to the reflective region R. Has been. As a result, the light reflection film 79 (63a) laminated on the organic insulating film 81 also has a light reflection pattern composed of an uneven pattern. However, since this uneven pattern reduces the light transmission amount, it is not formed in the transmission region T.

2. Constant Potential Structure (1) Basic Configuration The liquid crystal device 10 as the electro-optical device of the present invention includes a constant potential wiring 98 provided on a flexible circuit board 93, as shown in FIGS. A constant potential structure configured to electrically connect a constant potential terminal 96 disposed on at least one surface of the housing 94 and the frame 95 is provided.
Here, the constant potential wiring and the constant potential terminal are a wiring or a terminal maintained at a predetermined potential, and can be, for example, a ground wiring or a ground terminal maintained at 0 volts.
Hereinafter, the constant potential structure will be described in detail for each component.

(2) Case and Frame As shown in FIGS. 3A to 3B, the liquid crystal device 10 includes a case 94 for incorporating the element substrate 60 and the counter substrate 30, and a case for incorporating the case 94. And a frame-like member comprising the frame 95. Here, FIG. 3A is a schematic perspective view of the liquid crystal device 10 and FIG. 3B shows an EE cross-sectional view thereof.
The housing 94 is a protective member for protecting the element substrate 60 and the counter substrate 30 from external impact, and the material thereof is not particularly limited as long as it has a predetermined strength. For example, an insulating material such as plastic or a conductive material such as aluminum or SUS can be used. At this time, which of the insulating material and the conductive material is selected can be determined in relation to the structure of the contact region described later.
The frame 95 is a member that protects the housing 94 from external impacts and has a function as an attachment jig when mounted inside the electronic device. The material is not particularly limited as long as it has a predetermined strength, but is preferably a conductive material such as aluminum or SUS. This is because the entire liquid crystal panel can be covered with a constant potential, and a liquid crystal device excellent in noise suppression effect can be obtained.

(3) Flexible Circuit Board Further, as shown in FIGS. 3A to 3B, a flexible circuit board 93 is connected to the liquid crystal device 10 at the projecting portion 60 </ b> T of the element substrate 60. The flexible circuit board 93 is a flexible film-like board provided with a wiring pattern for signal transmission and a constant potential wiring 98 on its surface, and is connected to an element via an external connection terminal 67. The wiring pattern on the substrate 60 and the constant potential wiring 98 are each electrically connected.
Further, as shown in FIG. 3B, the flexible circuit board 93 is disposed so as to be sandwiched between the casing 94 and the frame 95, and the constant potential wiring 98 formed on the surface thereof is In the contact region (A) in FIG. 3B, a constant potential structure is configured by being pressed against and electrically connected to the housing 94 or the frame 95.

(4) Contact Area (4) -1 Basic Configuration The contact area (A) shown in FIG. 3B is provided with a constant potential terminal 96 on at least one surface of the housing 94 and the frame 95, and the constant potential. This is a region where the constant potential terminal 96 and the constant potential wiring 98 are pressed and electrically connected by a convex portion 97 provided so as to face the terminal 96.
At this time, a convex portion 97 is formed on at least one of the housing 94 and the frame 95, and the constant potential terminal 96 and the constant potential wiring 98 are press-contacted by the convex portion 97 to electrically It is preferable to connect.
This is because the constant potential wiring and the constant potential terminal can be more firmly pressed using the convex portion, and the contact resistance can be controlled more easily.
Accordingly, a reference potential can be provided on the surface of the element substrate, and even when such an element is operated continuously, it can be driven stably.

The constant potential terminal 96 and the convex portion 97 are preferably in a positional relationship such that they overlap each other in plan view.
That is, when FIG. 3B is projected from the right side direction, it is preferable that the constant potential wiring, the constant potential terminal, and the convex portion partially overlap each other.
This is because the constant potential wiring 98 arranged on the flexible circuit board 93 is directly pressed by the convex portion without using a conductive tape at the contact portion between the constant potential wiring 98 and the constant potential terminal 96. This is because it can be transmitted and can be short-circuited easily and reliably.
Therefore, it is possible to prevent an increase in wiring resistance due to the conductive tape, and it is possible to fix the flexible substrate 93 in a predetermined position, so that the contact state can be maintained even when an external impact is applied to the apparatus. it can.
In addition, regarding the configuration of the contact region, various configurations can be adopted as described below by combining the mutual positional relationship and shape of the convex portion 97, the constant potential terminal 96, and the constant potential wiring 98 described above. Can do.
(4) -2 Configuration 1

More specifically, it is preferable that the constant potential terminal 96 a is disposed on the surface of the frame 95 and the convex portion 97 a is disposed on the surface of the housing 94 as shown in FIG.
This is because a ground frame in which a part of the frame is short-circuited is configured, and noise generation in the transmission signal can be suppressed. In other words, the liquid crystal device can be stably driven even when transmitting a high-speed signal in which noise is prominent or when used in a place where electromagnetic waves are strong.
4A is an enlarged view of the contact region (A) in FIG. 3B, and the right view is a plan view thereof (a plan view of the left view as viewed from the X direction). It is.

At this time, it is preferable that the gap between the convex portion 97a and the other surface facing the convex portion 97a is smaller than the thickness of the flexible circuit board.
More specifically, as shown in FIG. 4A, the gap (d) is preferably made smaller than the thickness (T) of the flexible circuit board.
This is because the flexible flexible substrate 93 can be fixed at a predetermined position while being pressed by the convex portion 97a, and the fixation of the flexible substrate and the stabilization of the contact area can be obtained simultaneously. It is.
Therefore, even when an external impact is applied, the contact state between the constant potential terminal and the constant potential wiring can be maintained, and stable electrical connection can be maintained.

In addition, the height (h) of the convex portion 97a can be appropriately selected according to the apparatus specifications. For example, from the viewpoint of thinning and downsizing of the apparatus, the height (h) is 1 mm or less. It is preferable that
This is because the contact resistance between the constant potential wiring and the constant potential terminal can be sufficiently reduced without hindering downsizing of the device. On the other hand, if the height (h) becomes too small, the constant potential wiring and the constant potential terminal may not come into contact with each other and cannot be short-circuited.
Therefore, it is preferable to make this value a value within the range of 0.2 to 0.8 mm as a range that satisfies the miniaturization of the device and the reduction of the contact resistance in a balanced manner, and a range of 0.4 to 0.6 mm. It is more preferable to set the value within the range.

Further, as shown in FIG. 4B, when the material of the frame 95 is a conductive material, the entire frame 95 is preferably configured as a constant potential terminal 96b.
This is because a ground frame in which the entire frame is short-circuited can be configured in a simple and reliable manner, and noise generation in the transmission signal can be suppressed. In other words, the liquid crystal device can be driven stably even when used in an environment where noise generation is significant.

Moreover, it is preferable that the convex-shaped part is comprised from the some convex-shaped part.
This is because the contact between the constant potential wiring and the constant potential terminal can be provided at a plurality of locations, the contact resistance can be lowered, and, for example, a part of the constant potential wiring is disconnected. Even if it exists, it is because it can be short-circuited reliably. That is, even when the wiring is used in an environment where the wiring is easily corroded, the wiring can be stably used without causing a short circuit failure.
At this time, the arrangement of the plurality of convex portions can be appropriately selected depending on the device mode. For example, as shown in FIG. 5A, the plurality of convex portions 97c are arranged in the height direction of the substrate ( It is preferable to arrange them at predetermined intervals in the vertical direction in the figure.
This is because the contact resistance can be effectively reduced by arranging in this way even when the width and number of the constant potential wirings 98c are changed. Therefore, the constant potential wiring and the constant potential terminal can be stably short-circuited even when the wiring pitch of the constant potential wiring is narrow.
Further, as shown in FIG. 5 (b), it is also preferable to arrange the plurality of convex portions 97d at a predetermined interval in the width direction of the substrate (lateral direction in the figure).
The reason for this is that even when the constant potential wiring is designed as a thin line, a plurality of contacts can be provided, and even when a part of the constant potential wiring is disconnected. This is because the constant potential wiring can be reliably short-circuited.
Furthermore, as shown to Fig.6 (a), it is also preferable to arrange | position the some convex-shaped part 97e in zigzag form.
This is because the flexible substrate 93 is deformed in a complicated manner by arranging in this way, the contact area between the constant potential wiring and the constant potential terminal is expanded, and the contact resistance can be effectively reduced. is there.
Therefore, even when the constant potential wiring is thinned or the wiring design is complicated, the constant potential wiring and the constant potential terminal can be stably short-circuited.

Further, from the viewpoint of reducing the contact resistance, as shown in FIG. 6B, a plurality of convex portions 97f and 97f ′ are arranged on both surfaces of the casing 94 and the frame 95, and the casing It is preferable that the convex portion 97f provided in 94 and the convex portion 97f ′ provided in the frame 95 are arranged at offset positions.
This is because the flexible circuit board 93 is further complicatedly deformed, the contact area between the constant potential wiring and the constant potential terminal is expanded, and the contact resistance can be effectively reduced.
That is, even if the constant potential wiring is arranged on both surfaces of the flexible circuit board and is designed in a complicated manner, the constant potential wiring and the constant potential terminal can be reliably short-circuited.

(4) -3 Configuration 2
Further, as shown in FIG. 7A, the constant potential terminal 96g and the convex portion 97g are both disposed on the surface of the housing 94, and the constant potential terminal 96g and the convex portion 97g are part of them. It is preferable to share.
This is because the constant potential wiring 98g on the flexible circuit board 93 and the constant potential terminal 96g are in direct contact with each other at the tip of the convex portion 97g, and the contact resistance is effectively reduced. It is because it can do. That is, even when it is necessary to reduce the convex portion due to the downsizing of the device, the constant potential wiring and the constant potential terminal can be stably brought into contact with each other.
At this time, the casing 94 is preferably a conductive casing made of a conductive material.
This is because the entire casing is short-circuited, so that the same effect as when the frame ground is configured can be obtained.

(4) -4 Configuration 3
Further, as shown in FIG. 7B, a concave portion 99 is provided at a position opposite to the convex portion 97h, and the convex portion 97h and the concave portion 99 are connected via a flexible circuit board 93. Are preferably combined.
This is because the contact area between the constant potential wiring 98h and the constant potential terminal 96h can be increased, and the displacement of the flexible circuit board 93 can be prevented.
Therefore, even when an external impact is applied to the housing and the frame, the constant potential wiring and the constant potential terminal can be stably short-circuited.

(4) -5 Configuration 4
Further, as shown in FIG. 8, the constant potential wiring is preferably arranged on both surfaces of the flexible circuit board 93.
More specifically, constant potential wirings 98 i and 98 i ′ are arranged on both surfaces of the flexible circuit board 93. These constant potential wirings, a constant potential terminal 96 i on the housing 94, and a constant potential terminal on the frame 95 are arranged. 96i ′ is preferably electrically connected.
This is because the constant potential wiring can be short-circuited at a plurality of contacts, and since both the frame and the housing are short-circuited, the noise suppression effect due to the construction of the frame ground can be further exhibited. It is.
At this time, as described above, the effect of suppressing noise can be further exhibited by using the conductive frame and the conductive casing made of a conductive material as the frame and the casing, respectively.

(4) -6 Configuration 5
As shown in FIG. 9, it is preferable that the housing 94j is composed of a plurality of housings, and the first housing 94j ′ on the outside is a conductive housing and short-circuited.
This is because a frame ground is formed by the first housing 94j ′ regardless of the material of the second housing 94j ″ on the inner side, and a liquid crystal device having an excellent noise suppression effect can be obtained. is there.
Further, like the housing 94j, the frame 95 is also preferably a conductive frame made of a conductive material.
This is because the frame ground can be configured in a double manner, and the noise suppression effect can be further exhibited. At this time, it is preferable that the constant potential wiring 98j on the flexible substrate 93 is disposed on both surfaces of the substrate, but even when the constant potential wiring 98j is disposed only on one surface, the first casing 94j and the frame 95 are connected to each other. By electrical connection at a predetermined location, both can be short-circuited.

(4) -7 Configuration 6
As shown in FIG. 10, a plurality of convex portions 97n and 97n ′ are provided on the housing 94, and a plurality of convex portions 97n and 97n ′, a constant potential terminal 96n, and a constant potential wiring 98n are provided. It is preferable that they are arranged at positions offset from each other.
This is because the flexible circuit board 93 can be deformed in a complicated manner to increase the contact area between the constant potential terminal 96n and the constant potential wiring 98n, thereby effectively reducing the contact resistance, This is because the contact resistance value described above can be easily controlled by changing the gap (L) with respect to 97n ′.

(4) -8 Formation Position The formation position of the constant potential structure as described above is not limited to the side position as shown in FIGS. 4 to 10, and the bottom surface side of the substrate according to the arrangement form of the flexible circuit board. It is also preferable that the upper surface side of the substrate.
This is because even if the wiring design and device specifications are complicated, the constant potential wiring and the constant potential terminal can be reliably short-circuited by appropriately changing the position of the contact area. is there.
More specifically, for example, as shown in FIG. 11, a constant potential structure including a convex portion 97k on the housing 94 and a constant potential terminal 96k on the frame 95 is formed on the bottom surface side of the substrate. Can do.

(5) Convex-shaped part Moreover, as shown to Fig.12 (a)-(b), it is preferable that a convex-shaped part is the convex-shaped part 97m provided with the leaf | plate spring mechanism.
This is because an elastic force acts in the direction of the arrow (R) shown in FIGS. 12A to 12B, and the contact resistance between the constant potential wiring 98m and the constant potential terminal 96m can be easily controlled. .
Moreover, as a material used for such a plate spring mechanism part, it is preferable to use a metal material rich in elastic deformation.

[Second Embodiment]
The second embodiment is a method of manufacturing the electro-optical device according to the first embodiment, and includes a step of connecting the flexible circuit board to the electro-optical device substrate, and the electro-optical device substrate to the housing. The step of mounting, the step of attaching the frame to the case, and the convex portion provided on at least one surface of the case and the frame, so that the constant potential terminal and the constant potential wiring are pressed into contact with each other. And an electro-optical device manufacturing method.
Hereinafter, an example of the manufacturing method of the liquid crystal device of this embodiment will be described in detail.

1. First, a liquid crystal panel including an element substrate and a color filter substrate as a counter substrate that are arranged to face each other is manufactured.
An element substrate constituting such a liquid crystal panel is obtained by laminating various members on a glass substrate or the like as a substrate of the element substrate, so that a TFT element, a predetermined pattern scanning line, a predetermined pattern data line, an external connection terminal, etc. Are formed as appropriate. Next, after laminating a transparent conductive film such as ITO by sputtering or the like, pixel electrodes are formed in a matrix in the display region by photolithography and etching. Further, an alignment film made of polyimide is formed on the substrate surface on which the pixel electrode is formed. In this way, an element substrate on which various resin films and conductive films are formed is manufactured.

  Next, by laminating various members on a glass substrate or the like as a base constituting a color filter substrate as a counter substrate, a colored layer or a light shielding film is appropriately formed. Next, after laminating a transparent conductive film such as ITO by sputtering or the like, a counter electrode over the entire display region is formed by photolithography and etching. Further, an alignment film made of polyimide is formed on the substrate surface on which the counter electrode is formed. In this way, a color filter substrate on which various resin films and conductive films are formed is manufactured.

  Next, the color filter substrate and the element substrate are bonded to each other through a sealing material to form a cell structure, and a liquid crystal material is injected into the cell structure. Then, a liquid crystal panel can be manufactured by sticking a polarizing plate etc. to the outer surface of a color filter substrate and an element substrate, respectively.

2. Connection of flexible circuit board Next, the flexible circuit board is connected to a liquid crystal panel. Such a flexible circuit board has a wiring pattern and a constant potential wiring made of a metal material such as aluminum or tantalum or a transparent conductive material such as ITO (indium tin oxide) on the surface of an insulating flexible board made of polyimide or the like as a base. And can be manufactured by mounting an LED, a semiconductor element, or the like as a light source. Moreover, in order to ensure the insulation of the formed wiring pattern and constant potential wiring, an insulating protective film can be attached to a region other than a connection terminal portion with a light source, a semiconductor element, or the like.
The flexible circuit board manufactured in this way is electrically connected to an external connection terminal arranged at the end of the element substrate through a conductive adhesive such as an anisotropic conductive film (ACF). Connecting. At this time, both the signal transmission wiring pattern and the constant potential wiring are connected to the corresponding terminals.

3. Next, the liquid crystal panel to which the flexible circuit board is connected is incorporated into the casing. As shown in FIG. 13 (a), the housing 94 is a partially open box-shaped member. In order to arrange the flexible circuit board, a cut is provided in a part of its side surface. is there.
As shown in FIG. 13A, the liquid crystal panel 20 is incorporated in such a case 94, and then the flexible circuit board 93 is placed on the back surface of the case 94 as shown in FIG. Fold it so that it wraps around.
At this time, as shown in FIGS. 14A to 14B, the constant potential wiring 98 disposed on the flexible circuit board 93 and the convex portion 97 disposed on the housing 94 are seen in a plan view. It is necessary to arrange them while adjusting their positions so that they overlap. Here, FIG. 14A is an EE sectional view of FIG. 13B, and FIG. 14B shows a partially enlarged sectional view and an enlarged plan view of the region (A) in FIG. 14A. ing.
As described above, when the flexible circuit board is disposed on the rear surface of the housing, the liquid crystal panel 20 is a transmissive or transflective liquid crystal panel by providing an opening in a part of the flexible circuit board. However, the flexible circuit board can be arranged without covering the display area.

4). Attachment of frame and formation of constant potential structure Next, the frame is attached to a housing in which a liquid crystal panel is incorporated. Similar to the housing, this frame is a protective member that protects the liquid crystal panel, and also has a function as a mounting jig for mounting inside the electronic device.
Such a frame is attached to a casing 94 having the liquid crystal panel 20 as shown in FIG. 15A, and is disposed on the frame 95 as shown in FIGS. 16A and 16B. It is necessary to adjust the position so that the constant potential terminal 96, the convex portion 97, and the constant potential wiring 98 are overlapped in plan view. Here, FIG. 16A is an EE cross-sectional view in FIG. 15B, and FIG. 16B shows a partially enlarged cross-sectional view and an enlarged plan view of the region (A) in FIG. ing.
When a conductive frame is used as the material of the frame, such position adjustment is not necessary and positioning can be performed arbitrarily.
Finally, a liquid crystal device can be manufactured by appropriately attaching accessory parts such as an illumination device such as a backlight.
With the liquid crystal device thus manufactured, the constant potential wiring arranged on the flexible circuit board can be short-circuited easily and reliably without using a conductive tape.

[Third Embodiment]
3rd Embodiment of this invention is an electronic device provided with the liquid crystal device of 1st Embodiment.
FIG. 17 is a schematic configuration diagram showing the overall configuration of the electronic apparatus of the present embodiment. The electronic apparatus includes a liquid crystal panel 20 provided in the liquid crystal device and a control unit 200 for controlling the liquid crystal panel 20. In FIG. 17, the liquid crystal panel 20 is conceptually divided into a panel structure 20 </ b> A and a drive circuit 20 </ b> B composed of a semiconductor element (IC) or the like. The control means 200 also includes a display information output source 201, a display processing circuit 202, a power supply circuit 203, and a timing generator 204.
The display information output source 201 includes a memory composed of a ROM (Read Only Memory), a RAM (Random Access Memory), etc., a storage unit composed of a magnetic recording disk, an optical recording disk, etc., and a tuning that outputs a digital image signal in a synchronized manner. And is configured to supply display information to the display processing circuit 202 in the form of an image signal having a predetermined format based on various clock signals generated by the timing generator 204.

The display processing circuit 202 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to display the image. Information is supplied together with the clock signal CLK to the drive circuit 20B. Furthermore, the drive circuit 20B can include a first electrode drive circuit, a second electrode drive circuit, and an inspection circuit. Further, the power supply circuit 203 has a function of supplying a predetermined voltage to each of the above-described components.
And if it is an electronic device of this embodiment, it can be set as the electronic device which can short-circuit easily and reliably the constant potential wiring arrange | positioned on a flexible circuit board, without using a conductive tape.

  According to the present invention, since the constant potential wiring arranged on the flexible circuit board is short-circuited without using a conductive tape, an electro-optical device suitable for downsizing and thinning can be provided. Accordingly, electro-optical devices and electronic devices such as liquid crystal devices equipped with TFT elements, such as mobile phones and personal computers, liquid crystal televisions, viewfinder type / monitor direct view type video tape recorders, car navigation devices, pagers, etc. , Electrophoresis device, electronic notebook, calculator, word processor, workstation, video phone, POS terminal, electronic device with touch panel, device with electron emission element (FED: Field Emission Display or SCEED: Surface-Conduction Electron-Emitter It can be widely applied to Display).

(A)-(b) is sectional drawing and a top view for demonstrating the electro-optical apparatus which concerns on this invention. FIG. 3 is a perspective view for explaining an electro-optical device according to the invention. (A)-(b) is the schematic for demonstrating the liquid crystal device in 1st Embodiment. (A)-(b) is a figure for demonstrating the structural example of a constant potential structure. (Part 1) (A)-(b) is a figure for demonstrating the structural example of a constant potential structure. (Part 2) (A)-(b) is a figure for demonstrating the structural example of a constant potential structure. (Part 3) (A)-(b) is a figure for demonstrating the structural example of a constant potential structure. (Part 4) It is a figure for demonstrating the structural example of a constant potential structure. (Part 5) It is a figure for demonstrating the structural example of a constant potential structure. (Part 6) It is a figure for demonstrating the structural example of a constant potential structure. (Part 7) It is a figure for demonstrating the arrangement position of a constant potential structure. (A)-(b) is a figure for demonstrating the modification of a convex-shaped part. (A)-(b) is a figure for demonstrating the housing | casing incorporation process in 2nd Embodiment. (Part 1) (A)-(b) is a figure for demonstrating the housing | casing incorporation process in 2nd Embodiment. (Part 2) (A)-(b) is a figure for demonstrating the flame | frame incorporation process in 2nd Embodiment. (Part 1) (A)-(b) is a figure for demonstrating the flame | frame incorporation process in 2nd Embodiment. (Part 2) It is a block diagram which shows schematic structure of the electronic device of 3rd Embodiment. It is a figure which shows the structure of the conventional liquid crystal device.

Explanation of symbols

10: Liquid crystal device (electro-optical device), 20: Liquid crystal panel, 30: Counter substrate (color filter substrate), 60: Element substrate, 60T: Substrate extension, 93: Flexible circuit board, 94: Housing, 95: Frame, 96: constant potential terminal, 97: convex portion, 98: constant potential wiring, 99: concave portion

Claims (13)

An electro-optical device comprising: an electro-optical device substrate to which a flexible circuit board having a constant potential wiring is connected; a housing in which the electro-optical device substrate is incorporated; and a frame attached to the outside of the housing. In
A flexible circuit board provided with the constant potential wiring is disposed between the housing and the frame,
A constant potential terminal is provided on at least one surface of the housing and the frame,
An electro-optical device, wherein the constant potential terminal and the constant potential wiring are pressed and electrically connected.   A convex portion is formed on at least one of the casing and the frame, and the constant potential terminal and the constant potential wiring are pressed and electrically connected by the convex portion. The electro-optical device according to claim 1.   The electro-optical device according to claim 1, wherein the constant potential wiring is disposed on both surfaces of the flexible circuit board.   The electro-optical device according to claim 1, wherein the frame is a short-circuited conductive frame.   The electro-optical device according to claim 2, wherein a gap between the convex portion and the other surface facing the convex portion is smaller than a thickness of the flexible circuit board.   The electro-optical device according to claim 2, wherein the constant potential terminal is provided on a surface of the frame, and the convex portion is provided on a surface of the casing.   The constant potential terminal and the convex portion are both provided on the surface of the housing, and the constant potential terminal and the convex portion share a part thereof. The electro-optical device described.   The electro-optical device according to claim 2, wherein the convex portion includes a plurality of convex portions.   The convex portions are provided on the surfaces of the housing and the frame, respectively, and the convex portions provided on the housing and the convex portions provided on the frame are arranged at offset positions. The electro-optical device according to claim 2, wherein the electro-optical device is provided.   The concave shape part is provided in the position which the said convex shape part opposes, The said convex shape part and the concave shape part are engaged through a flexible circuit board, Any one of Claims 2-9 characterized by the above-mentioned. The electro-optical device according to claim 1.   The electro-optical device according to claim 2, wherein the convex portion is a convex portion having a leaf spring mechanism. An electro-optical device comprising: an electro-optical device substrate to which a flexible circuit board having a constant potential wiring is connected; a housing in which the electro-optical device substrate is incorporated; and a frame attached to the outside of the housing. In the manufacturing method of
Connecting the flexible circuit board to the electro-optical device substrate;
Incorporating the electro-optic device substrate into the housing;
Attaching the frame to the housing;
A step of pressing and electrically connecting the constant potential terminal and the constant potential wiring by a convex portion provided on at least one surface of the housing and the frame;
A method for manufacturing an electro-optical device.   An electronic apparatus comprising the electro-optical device according to claim 1.

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