JP2007242335A - Manufacturing method of organic el device, and manufacturing apparatus of organic el device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an organic EL device capable of improving light-emitting lifetime and luminous efficiency. <P>SOLUTION: The manufacturing method of an organic EL device having an electron block layer 65 and a luminous layer on a substrate 2 comprises a process of forming the electron block layer 65 by coating a material liquid of the electron block layer 65, a process in which (a) a solvent 91 of the electron block layer is dropped on the surface of the electron block layer 65 and (b) by rotating the substrate 2, the solvent 91 is coated, and a process in which (c) within five minutes after the solvent is coated, a material liquid 92 of the luminous layer is coated on the surface of the electron block layer 65. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an organic EL device manufacturing method and an organic EL device manufacturing apparatus.

An organic EL device in which organic EL elements are arranged and arranged has been developed. An organic EL element has an organic light emitting layer between an anode and a cathode, and holes supplied from the anode and electrons supplied from the cathode recombine in the light emitting layer to emit light. ing. In order to improve the hole injection efficiency from the anode to the light emitting layer, a hole injection layer is formed on the surface of the anode. In order to prevent electrons supplied from the cathode from passing through the light emitting layer, an electron blocking layer is formed on the surface of the hole injection layer (see, for example, Patent Documents 1 to 3).
JP 2001-203081 A JP 2002-175887 A JP 2005-302443 A

An organic EL device is required to have an improved emission lifetime. Further, there is a demand for improvement in light emission efficiency due to a decrease in driving current and driving voltage.
Accordingly, an object of the present invention is to provide an organic EL device manufacturing method and an organic EL device manufacturing apparatus capable of improving the light emission lifetime and the light emission efficiency.

In order to achieve the above object, a method of manufacturing an organic EL device according to the present invention is a method of manufacturing an organic EL device including a first organic film and a second organic film on a substrate, the method comprising: Applying the material liquid to form the first organic film, applying the organic solvent to the surface of the first organic film, and within 10 minutes after applying the solvent, Applying a material liquid for the second organic film to the surface of the organic film.
According to this configuration, it is possible to prevent molecules in the atmosphere from entering the first organic film, and it is possible to prevent a decrease in the hole transport function of the first organic film. Thereby, it is not necessary to apply a large drive current and drive voltage to obtain the same light emission luminance, and the light emission life and light emission efficiency of the organic EL device can be improved.

In the step of applying the material liquid of the second organic film, it is desirable to apply the material liquid of the second organic film to the surface of the first organic film within 5 minutes after applying the solvent.
According to this configuration, it is possible to suppress variations in the drive current, drive voltage, and light emission lifetime of the organic EL device.

The step of applying the solvent is performed by dropping the solvent on the surface of the first organic film and rotating the substrate in a plane, and the step of applying the material liquid of the second organic film includes the step of It is desirable to carry out by dropping the material liquid of the second organic film on the surface of the first organic film and rotating the substrate in the plane.
“Rotating the substrate in the plane” means rotating the substrate so that the surface rotates in a plane including the surface of the substrate.
According to this configuration, the solvent and the material liquid of the second organic film can be uniformly spread.

The step of applying the solvent is preferably performed by rotating the substrate in a plane after the entire surface of the first organic film is immersed in the solvent.
According to this configuration, the surface of the first organic film can be reliably rinsed.

The step of applying the solvent and / or the step of applying the material solution of the second organic film is preferably performed in an inert atmosphere.
According to this configuration, it is possible to more reliably prevent a decrease in the hole transport function of the first organic film due to intrusion of molecules in the atmosphere. Therefore, the light emission lifetime and light emission efficiency of the organic EL device can be further improved.

The second organic film is a light emitting layer, and the first organic film is an electronic block that prevents electrons supplied to the light emitting layer from the opposite side of the first organic film from passing through the light emitting layer. It may be a layer.
According to this configuration, the hole transport function of the electron block layer can be prevented from being lowered, and holes can be efficiently injected into the light emitting layer. Therefore, the light emission lifetime and the light emission efficiency of the organic EL device can be improved.

Further, it is desirable that the exposure time in the atmosphere from the formation of the light emitting layer to the formation of the cathode on the surface of the light emitting layer is within 5 minutes.
According to this configuration, the light emission lifetime of the organic EL device can be further improved.

The first organic film is a light-emitting layer, and the second organic film is a positive electrode that prevents holes supplied to the light-emitting layer from the opposite side of the second organic film from passing through the light-emitting layer. It may be a hole blocking layer.
Also with this configuration, the light emission life and light emission efficiency of the organic EL device can be improved.

Meanwhile, an organic EL device manufacturing apparatus according to the present invention is an organic EL device manufacturing apparatus including a first organic film and a second organic film on a substrate, and the substrate is mounted while the substrate is placed thereon. A stage that rotates in-plane, a first dropping device that drops the solvent of the first organic film on the substrate, and a second dropping device that drops the material liquid of the second organic film on the substrate. It is characterized by having.
According to this configuration, after dropping the solvent from the first dropping device and rotating the substrate to apply the solvent, the material liquid of the second organic film is immediately dropped from the second dropping device without moving the substrate. Can be rotated to apply the material liquid of the second organic film. Therefore, the material liquid of the second organic film can be applied to the surface of the first organic film within 5 minutes after applying the solvent.

Further, it is desirable that the manufacturing apparatus for the organic EL device can be disposed in an inert atmosphere.
According to this configuration, it is possible to prevent molecules in the atmosphere from entering the first organic film in the solvent application process and the material liquid application process of the second organic film. Therefore, the light emission lifetime and light emission efficiency of the organic EL device can be further improved.

  Embodiments of the present invention will be described below with reference to the drawings. In each drawing referred to below, the dimensions and the like of each component are appropriately changed and displayed for easy understanding.

(Organic EL device)
FIG. 1 is a side sectional view of an organic EL device according to an embodiment. The organic EL device 1 includes an element substrate 2, a drive circuit unit 5 disposed on the surface of the element substrate 2, a plurality of organic EL elements 3 disposed on the surface of the drive circuit unit 5, and an organic EL element 3 The sealing substrate 30 is mainly configured. The organic EL element 3 is formed in a substantially circular shape, a substantially oval shape, or the like when viewed from a direction perpendicular to the element substrate 2. In the present embodiment, a bottom emission type organic EL device 1 that extracts emitted light from the organic EL element 3 from the element substrate 2 side will be described as an example.

  In the bottom emission type organic EL device 1, light emitted from the light emitting layer 60 is extracted from the element substrate 2 side, and therefore, the element substrate 2 is transparent or semitransparent. For example, glass, quartz, resin (plastic, plastic film) or the like can be used, and a glass substrate is particularly preferably used.

  On the element substrate 2, a drive circuit unit 5 including a drive TFT 123 (drive element 4) of the organic EL element 3 is formed. Note that an organic EL device can be configured by mounting an IC chip having a drive circuit on the element substrate 2.

As a specific configuration of the drive circuit unit 5, a base protective layer 281 made of an insulating material is formed on the surface of the element substrate 2, and a silicon layer 241 that is a semiconductor material is formed thereon. A gate insulating layer 282 mainly composed of SiO ₂ and / or SiN is formed on the surface of the silicon layer 241. A gate electrode 242 is formed on the surface of the gate insulating layer 282. The gate electrode 242 is constituted by a part of a scanning line (not shown). Of the silicon layer 241, a region facing the gate electrode 242 with the gate insulating layer 282 interposed therebetween is a channel region 241a. On the other hand, a first interlayer insulating layer 283 mainly composed of SiO ₂ is formed on the surfaces of the gate electrode 242 and the gate insulating layer 282.

  Further, in the silicon layer 241, a low concentration source region 241b and a high concentration source region 241S are provided on one side of the channel region 241a, and a low concentration drain region 241c and a high concentration drain region 241D are provided on the other side of the channel region 241a. A so-called LDD (Lightly Doped Drain) structure is provided. Among these, the high-concentration source region 241S is connected to the source electrode 243 through a contact hole 243a penetrating the gate insulating layer 282 and the first interlayer insulating layer 283. The source electrode 243 is configured by a part of a power supply line (not shown). On the other hand, the high concentration drain region 241D is connected to a drain electrode 244 disposed in the same layer as the source electrode 243 through a contact hole 244a that penetrates the gate insulating layer 282 and the first interlayer insulating layer 283.

  Over the source electrode 243 and the drain electrode 244 and the first interlayer insulating layer 283 described above, a planarizing film 284 mainly composed of a heat-resistant insulating resin material such as acrylic or polyimide is formed. The planarizing film 284 is formed to eliminate surface irregularities due to the driving TFT 123 (driving element 4), the source electrode 243, the drain electrode 244, and the like.

  A plurality of pixel electrodes 23 are arranged in the formation region of the organic EL element 3 on the surface of the planarizing film 284. The pixel electrode 23 is connected to the drain electrode 244 through a contact hole 23 a provided in the planarizing film 284. That is, the pixel electrode 23 is connected to the high concentration drain region 241D of the silicon layer 241 through the drain electrode 244.

In addition, an inorganic partition wall 25 made of an inorganic insulating material such as SiO ₂ is formed so as to surround the pixel electrode 23 on the surface of the planarizing film 284. A plurality of functional films are laminated on the surface of the pixel electrode 23 exposed from the opening of the inorganic partition wall 25 to constitute the organic EL element 3. The organic EL element 3 of the present embodiment includes a pixel electrode 23 that functions as an anode, a hole injection layer 70 that injects / transports holes from the pixel electrode 23, a light-emitting layer 60 that is made of an organic EL material, a cathode A common electrode functioning as 50 is laminated. In addition, an electron blocking layer 65 that prevents electrons supplied from the cathode 50 from passing through the light emitting layer 60 is formed between the light emitting layer 60 and the hole injection layer 70.

In the case of the bottom emission type organic EL device 1, the pixel electrode 23 that functions as an anode is formed of a transparent conductive material. As the transparent conductive material, ITO (indium tin oxide), IZO (registered trademark, indium zinc oxide), or the like can be used. Among them, ITO is composed of a material in which indium oxide (In ₂ O ₃ ) is doped with tin (Sn).

As a material for forming the hole injection layer 70, a dispersion of 3,4-polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) is preferably used. This PEDOT / PSS is obtained by dispersing 3,4-polyethylenedioxythiophene, which is a polythiophene derivative, in polystyrene sulfonic acid as a dispersion medium and further dispersing it in water.
The material for forming the hole injection layer 70 is not limited to those described above, and various materials can be used. For example, a material obtained by dispersing polystyrene, polypyrrole, polyaniline, polyacetylene or a derivative thereof in an appropriate dispersion medium such as the above-described polystyrene sulfonic acid can be used.

  A hole transport layer may be provided on the surface of the hole injection layer 70. The hole transport layer is preferably formed between the hole injection layer 70 and the light emitting layer 60 and has a role of assisting hole transport from the hole injection layer 70 to the light emitting layer 60. The constituent material of this hole transport layer is represented by chemical formula 1 (poly (2,7- (9,9-di-n-octylfluorene) -alt- (1,4-phenylene-((4-sec-butylphenyl ) imino-1,4-phenylene)))) is desirable.

  The electron blocking layer 65 has a function of preventing electrons supplied from the cathode from passing through the light emitting layer 60, promoting recombination of electrons and holes in the light emitting layer 60, and improving light emission efficiency. The electron blocking layer 65 also functions to improve the durability of the hole injection layer 70 by preventing electrons supplied from the cathode from passing through the light emitting layer 60 and recombining with holes in the hole injection layer 70. Have The constituent material of the electron block layer 65 is the same as the constituent material of the hole transport layer, but a material having a relatively high function of transporting holes is adopted for the hole transport layer. It is desirable to adopt a material having a relatively high function of suppressing the movement of electrons.

  On the other hand, as a material for forming the light emitting layer 60, a known light emitting material capable of emitting fluorescence or phosphorescence is used. Specifically, (poly) fluorene derivative (PF), (poly) paraphenylene vinylene derivative (PPV), polyphenylene derivative (PP), polyparaphenylene derivative (PPP), polyvinyl carbazole (PVK), polythiophene derivative, polymethyl Polysilanes such as phenylsilane (PMPS) are preferably used. In addition, these polymer materials include polymer materials such as perylene dyes, coumarin dyes, rhodamine dyes, rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, and quinacridone. It can also be used by doping a low molecular weight material such as.

  For example, MEHPPV (poly (3-methoxy6- (3-ethylhexyl) paraphenylenevinylene) is used as a material for forming the red light-emitting layer 60, and polydioctylfluorene and F8BT (for example) are used as a material for forming the green light-emitting layer 60. For example, polydioctylfluorene may be used as a material for forming the blue light-emitting layer 60 in a mixed solution of dioctylfluorene and benzothiadiazole). There is no limitation on the thickness, and a preferable film thickness is adjusted for each color.

  A hole blocking layer may be provided on the surface of the light emitting layer 60. The hole blocking layer has a function of preventing holes supplied from the fold from passing through the light emitting layer 60, promoting recombination of electrons and holes in the light emitting layer 60, and improving light emission efficiency. Fluorene or the like can be employed as a constituent material of the hole blocking layer.

  The cathode 50 preferably has a laminated structure of a main cathode and an auxiliary cathode. As the main cathode, it is desirable to employ a material such as Ca, Mg, LiF having a work function of 3.0 eV or less. Thereby, since the function as an electron injection layer is provided to the main cathode, the light emitting layer can emit light at a low voltage. The auxiliary cathode has functions of enhancing the conductivity of the entire cathode 50 and protecting the main cathode from oxygen and moisture. Therefore, it is desirable to employ a metal material such as Al, Au, or Ag having excellent conductivity as the auxiliary cathode.

On the other hand, the sealing substrate 30 is bonded to the upper side of the cathode 50 via the adhesive layer 40. A sealing cap that covers the entire cathode 50 may be fixed to the periphery of the element substrate 2, and a getter agent that absorbs moisture, oxygen, or the like may be disposed inside the sealing cap. Further, an inorganic sealing film made of SiO ₂ or the like may be laminated on the surface of the cathode 50.

  In the organic EL device 1 described above, the image signal supplied from the source electrode 243 of the drive circuit unit 5 is applied to the pixel electrode 23 by the drive element 4 at a predetermined timing. Then, the holes injected from the pixel electrode 23 and the electrons injected from the cathode 50 are recombined in the light emitting layer 60 and light having a predetermined wavelength is emitted. The emitted light passes through the pixel electrode 23 made of a transparent material, the drive circuit unit 5 and the element substrate 2 and is extracted outside. Since the inorganic partition wall 25 is made of an insulating material, a current flows only inside the opening of the inorganic partition wall 25 and the light emitting layer 60 emits light. Therefore, the inside of the opening of the inorganic partition wall 25 is a pixel region of the organic EL element 3.

(Method for manufacturing organic EL device)
Next, a method for manufacturing the organic EL device according to this embodiment will be described.
2 to 4 are process diagrams of the method for manufacturing the organic EL device according to the embodiment. 2 to 4, the description of the drive circuit unit 5 of FIG. 1 is omitted for easy understanding.

  First, as shown in FIG. 2A, an inorganic partition wall 25 is formed around the pixel electrode 23. Next, ultrasonic cleaning of the surface of the substrate 2 is performed using ultrapure water. Next, atmospheric pressure plasma treatment using oxygen gas or the like is performed as a lyophilic treatment on the surface of the pixel electrode 23. Then, the hole injection layer 70 is formed on the entire surface of the pixel electrode 23 and the inorganic partition wall 25 by a liquid phase process. Specifically, first, the material liquid for the hole injection layer 70 is applied to the entire substrate 2 by spin coating, spray coating, dipping, or the like. Next, the coating film is heated and dried to remove moisture contained in the film. For example, heat treatment is performed at 180 ° C. for 15 minutes in the atmosphere.

  Next, as shown in FIG. 2B, the electron block layer 65 is formed by a liquid phase process. Specifically, first, a TFB liquid material which is a material of the electron blocking layer 65 is applied to the entire substrate 2 by a spin coating method, a spray coating method, a dipping method, or the like.

Next, as shown in FIG. 2C, the electron block layer 65 is dried. This drying step is performed inside the N ₂ glove box 15. The N ₂ glove box 15 includes a chamber 16 in which the substrate 2 can be disposed, an N ₂ gas supply device 17 into the chamber 16, an exhaust device 18 in the chamber 16, and a heating device (hot plate) for the substrate 2. Etc.) 19. The N ₂ gas supply device 17 can replace the air in the chamber 16 with N ₂ gas.

In the chamber 16 of the N ₂ glove box 15, the substrate 2 on which the material liquid for the electronic block layer 65 is applied is disposed. Next, the inside of the chamber 16 is replaced with N ₂ gas, and the concentration of moisture and oxygen in the chamber 16 is reduced to 1 ppm or less. Next, the substrate 2 is heated by the heating device 19 to dry the coating film. For example, heat treatment is performed at 200 ° C. for 15 minutes. As a result, the electron blocking layer forming material is cross-linked to generate an insoluble component in the solvent, and the electron blocking layer 65 is formed.

Next, as shown in FIG. 3A, a solvent 91 is applied on the substrate 2. This coating process is performed using an organic EL device manufacturing apparatus (spin coater) shown in FIG.
FIG. 5 is a schematic configuration diagram of an organic EL device manufacturing apparatus (spin coater). The spin coater 80 includes a stage 81 on which the substrate 2 is placed. The stage 81 can be rotated by a motor or the like. Thereby, the stage 81 can rotate the mounted substrate 2 within the plane. “Rotating the substrate in the plane” means rotating the substrate so that the surface rotates in a plane including the surface of the substrate. A cup 82 is disposed around the stage 81. The cup 82 is disposed so as to cover at least the lower side and the side of the stage 81.

  The spin coater 80 includes a first dropping device 83 for the first liquid material and a second dropping device 86 for the second liquid material. The first dropping device 83 mainly includes a reservoir 84 that stores a first liquid material to be dropped and a nozzle 85 that drops the first liquid material supplied from the reservoir 84. The nozzle 85 is disposed at a predetermined distance above the stage 81 and can move horizontally above the stage 81. Note that the second dropping device 86 is configured in the same manner as the first dropping device 83.

  In the present embodiment, an organic solvent such as xylene, toluene, benzene, hexane, cyclohexane, tetradecane, and isooctane is employed as the first liquid. In particular, it is desirable to employ a material that can be a solvent for the constituent material of the electronic block layer. Further, it is desirable to employ a solvent having a lower boiling point than the solvent used in the material liquid of the light emitting layer as the solvent of the first liquid. If the boiling point of the solvent of the first liquid material is higher than the boiling point of the solvent of the light emitting layer material solution, drying of the light emitting layer material solution will be inhibited when the solvent of the first liquid material remains on the substrate. is there.

The reservoir of the first dropping device 83 is previously filled with the solvent of the first liquid material.
And as shown to Fig.3 (a), the solvent 91 which is a 1st liquid body is discharged from the nozzle 85 of the dripping apparatus of a 1st liquid body. The solvent 91 is preferably dropped at a predetermined distance at a plurality of locations on the substrate 2.

  Next, as shown in FIG. 3B, the substrate 2 is rotated to spread the solvent 91 uniformly on the surface of the substrate 2. Specifically, the stage 81 of the spin coater 80 shown in FIG. 5 is rotated, and the substrate 2 disposed on the surface of the stage 81 is rotated. The solvent released from the end of the substrate 2 is collected by the cup 82 and collected. As shown in FIG. 3A, if the solvent 91 is dropped at a plurality of locations on the substrate 2, the solvent 91 can be spread more uniformly. If the entire surface of the substrate 2 is immersed in the solvent 91 and then the stage 81 is rotated to shake off the solvent 91, the surface of the substrate 2 can be reliably rinsed.

Next, as shown in FIG. 3C, a material liquid 92 for the light emitting layer is applied on the substrate 2. The application of the light emitting layer material liquid 92 is performed using the second dropping device 86 for the second liquid material in the spin coater shown in FIG. The light emitting layer material liquid is filled in the reservoir 87 in advance as the second liquid material. And as shown in FIG.3 (c), the light emitting layer material liquid 92 is dripped from the nozzle 88 of a 2nd dripping apparatus. At the same time, the spin coater stage is rotated to rotate the substrate 2 placed on the surface of the stage. Thereby, the light emitting layer material liquid 92 is uniformly spread on the surface of the substrate 2.
Here, the residence time from application of the solvent to application of the light emitting layer material liquid is set to be within 5 minutes. The reason will be described in detail later.

Next, as shown in FIG. 4A, the light emitting layer material liquid coating film is dried to form the light emitting layer 60. This drying step is performed inside the N ₂ glove box 15. Specifically, the substrate 2 is disposed in the chamber 16 of the N ₂ glove box, and the inside of the chamber 16 is replaced with N 2 gas, thereby reducing the concentration of moisture and oxygen in the chamber 16 to 1 ppm or less. Next, the substrate 2 is heated to dry the coating film of the light emitting layer material liquid. For example, heat treatment is performed at 160 ° C. for 30 minutes. Thus, the light emitting layer 60 is formed.

Next, as shown in FIG. 4B, the cathode 50 is formed by a vacuum deposition method or the like.
Thus, the organic EL device according to this embodiment is formed.

(Residence time)
The inventor of the present application prototyped and evaluated the organic EL device by changing the residence time from the end of the application of the solvent to the application of the light emitting layer material liquid.
FIG. 6A is a graph obtained by measuring the drive current necessary for obtaining the same light emission luminance for the organic EL devices having different residence times, and FIG. 6B is a graph obtained by measuring the drive voltage. In FIG. 6 (a), the drive current increases as the residence time increases. In FIG. 6 (b), the drive voltage increases as the residence time increases. The reason is presumed to be that molecules in the atmosphere enter the electron block layer due to an increase in residence time, and the hole transport function of the electron block layer decreases. From this result, it was found that the luminous efficiency of the organic EL device decreases as the residence time increases.

FIG. 7 is a graph showing the relationship between the light emission lifetime and the residence time of the organic EL device. The light emission lifetime of the organic EL device is improved with an increase in the residence time when the residence time is within 5 minutes, and is decreased with an increase in the residence time when the residence time exceeds 5 minutes. The reason is estimated to be that a large drive current and drive voltage are applied in order to obtain the same light emission luminance.
In addition, the drive current, drive voltage, and light emission lifetime of the organic EL device vary greatly as the residence time increases.

  From the above results, it can be said that the residence time from application of the solvent to application of the light emitting layer material liquid is preferably within 10 minutes and particularly preferably within 5 minutes. By setting the residence time to 10 minutes or less, it is possible to prevent molecules in the atmosphere from entering the electron block layer, and it is possible to prevent a decrease in the hole transport function of the electron block layer. Accordingly, it is not necessary to apply a large drive current and drive voltage to obtain the same light emission luminance, and it is possible to prevent a decrease in light emission efficiency and to ensure a light emission lifetime. Furthermore, if the residence time is within 5 minutes, it is possible to suppress variations in the drive current, drive voltage, and light emission lifetime of the organic EL device.

  By adopting the spin coater 80 shown in FIG. 5, the residence time can be set to within 5 minutes. The spin coater 80 includes a stage 81 that rotates the substrate 2 in-plane while the substrate 2 is placed thereon, a first dropping device 83 that drops the solvent of the electron block layer on the substrate 2, and a light emitting layer on the substrate 2. And a second dropping device 86 for dropping the material liquid. Therefore, after the solvent is dropped from the first dropping device 83 and the substrate 2 is rotated to apply the solvent (spin coating), the light emitting layer material liquid is immediately dropped from the second dropping device 86 without moving the substrate 2. The light emitting layer material liquid can be applied (spin coated) by rotating the substrate 2. Therefore, the residence time from the end of the application of the solvent to the application of the light emitting layer material liquid can be within 5 minutes.

In addition, it is desirable that the spin coater 80 be disposed in an inert atmosphere such as an N ₂ gas atmosphere or a vacuum, and the solvent coating process and the light emitting layer material liquid coating process be performed in an inert atmosphere. As a result, it is possible to more reliably prevent a decrease in the hole transport function of the electron block layer due to intrusion of molecules in the atmosphere. Therefore, the light emission lifetime and light emission efficiency of the organic EL device can be further improved.

  In this embodiment, the solvent is applied to the surface of the electronic block layer. However, even when an organic solvent solution is applied to form an organic film other than the electronic block layer and the solvent is applied to the surface of the organic film, The same effect as the embodiment can be obtained.

(Electronics)
Next, an electronic apparatus including the organic EL device according to the embodiment will be described with reference to FIG.
FIG. 8 is a perspective configuration diagram of a mobile phone which is an example of an electronic apparatus. A cellular phone 1300 shown in the figure includes a plurality of operation buttons 1302, an earpiece 1303, a mouthpiece 1304, and a display unit 1301 including the organic EL device of the previous embodiment. The display unit 1301 employs the organic EL device of the above embodiment. In the organic EL device of the above embodiment, since the light emission lifetime and the light emission efficiency can be improved, a mobile phone with high reliability and low power consumption can be provided.

  Note that the electronic device including the light emitting device according to the present invention is not limited to the above-described ones. For example, a digital camera, a personal computer, a television, a portable television, a viewfinder type / monitor direct view type video tape recorder, Examples include a PDA, a portable game machine, a pager, an electronic notebook, a calculator, a clock, a word processor, a workstation, a videophone, a POS terminal, and a device equipped with a touch panel. In addition, examples of the electronic device including the organic EL device according to the present invention include an in-vehicle audio device, an in-vehicle instrument, an in-vehicle display such as a car navigation device, an optical writing head for a printer, and the like.

  It should be noted that the technical scope of the present invention is not limited to the above-described embodiments, and includes those in which various modifications are made to the above-described embodiments without departing from the spirit of the present invention. That is, the specific materials and configurations described in the embodiments are merely examples, and can be changed as appropriate.

In the above embodiment, the bottom emission type organic EL device has been described as an example. However, the present invention can also be applied to a top emission type organic EL device.
In the above embodiment, the organic EL device has been described as an example. However, in order to stably drive an organic semiconductor that actively uses an organic substance, the present invention can be applied to all organic semiconductors.

It is side surface sectional drawing of the organic electroluminescent apparatus which concerns on embodiment. It is process drawing of the manufacturing method of the organic electroluminescent apparatus which concerns on embodiment. It is process drawing of the manufacturing method of the organic electroluminescent apparatus which concerns on embodiment. It is process drawing of the manufacturing method of the organic electroluminescent apparatus which concerns on embodiment. It is a schematic block diagram of the manufacturing apparatus (spin coater) of an organic EL apparatus. It is a graph which shows the relationship between drive current and drive voltage, and dwell time. It is a graph which shows the relationship between the light emission lifetime and residence time. It is a perspective view of a mobile phone.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Organic EL apparatus 2 ... Board | substrate 3 ... Organic EL element 60 ... Light emitting layer (2nd organic film) 65 ... Electron block layer (1st organic film) 80 ... Spin coater (manufacturing apparatus of an organic EL apparatus) 81 ... Stage (rotation) Apparatus) 83 ... 1st dripping apparatus 86 ... 2nd dripping apparatus 91 ... Solvent 92 ... Material liquid of electron block layer (1st organic film)

Claims (10)

A method of manufacturing an organic EL device comprising a first organic film and a second organic film on a substrate,
Applying a material solution of the first organic film to form the first organic film;
Applying an organic solvent to the surface of the first organic film;
Applying the material liquid of the second organic film to the surface of the first organic film within 10 minutes after applying the solvent;
A method for producing an organic EL device, comprising:   In the step of applying the material liquid of the second organic film, the material liquid of the second organic film is applied to the surface of the first organic film within 5 minutes after applying the solvent. The manufacturing method of the organic electroluminescent apparatus of Claim 1. The step of applying the solvent is performed by dropping the solvent on the surface of the first organic film and rotating the substrate in a plane.
The step of applying the material liquid of the second organic film is performed by dropping the material liquid of the second organic film on the surface of the first organic film and rotating the substrate in a plane. The manufacturing method of the organic electroluminescent apparatus of Claim 1 or Claim 2.   4. The method according to claim 1, wherein the step of applying the solvent is performed by rotating the substrate in a plane after the entire surface of the first organic film is immersed in the solvent. 2. A method for producing an organic EL device according to item 1.   The organic according to any one of claims 1 to 4, wherein the step of applying the solvent and / or the step of applying the material liquid of the second organic film is performed in an inert atmosphere. Manufacturing method of EL device. The second organic film is a light emitting layer;
The first organic film is an electron blocking layer that prevents electrons supplied to the light emitting layer from the opposite side of the first organic film from passing through the light emitting layer. Item 6. A method for manufacturing an organic EL device according to any one of Items 5 to 6.   The method for producing an organic EL device according to claim 6, wherein the exposure time in the atmosphere from the formation of the light emitting layer to the formation of the cathode on the surface of the light emitting layer is within 5 minutes. The first organic film is a light emitting layer,
2. The hole blocking layer for preventing the holes supplied to the light emitting layer from the opposite side of the second organic film from passing through the light emitting layer. The manufacturing method of the organic EL device of any one of Claim 5 thru | or 5. An apparatus for manufacturing an organic EL device comprising a first organic film and a second organic film on a substrate,
A stage for rotating the substrate in a plane while placing the substrate;
A first dropping device for dropping the solvent of the first organic film on the substrate;
A second dropping device for dropping the material liquid of the second organic film on the substrate;
An apparatus for manufacturing an organic EL device, comprising:   The apparatus for manufacturing an organic EL device according to claim 9, wherein the apparatus for manufacturing the organic EL device can be disposed in an inert atmosphere.

Images