JP2007237556A - Droplet discharge head, its manufacturing process and droplet discharge apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a droplet discharge head excellent in connection reliability over a piezoelectric element of a wiring substrate used for an electric connection with the piezoelectric element and to provide its manufacturing process and a droplet discharge apparatus. <P>SOLUTION: A fixing member 9 which fixes an FPC12 and an oscillating board 7 is arranged from a predetermined domain E to a domain X of an input side of a driving signal (input side domain X) in the domains other than the predetermined domain E (domain where the arrangement of an electrode bump 12b was carried out) where the electrode bump 12b was arranged, between the surface of the FPC where the electrode bump 12b of the FPC 12 was arranged and the surface of the oscillating board 7 where the piezoelectric element 8 of the oscillating board 7 was arranged. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a droplet discharge head such as an inkjet head, a manufacturing method thereof, and a droplet discharge apparatus.

  In a recording head (droplet discharge head) that records information by deforming a piezoelectric element by a drive signal supplied to an electrode and discharging the liquid from a nozzle in the form of fine droplets, the density of the head is increased. Therefore, a structure in which a plurality of nozzles and piezoelectric elements are arranged in a matrix is adopted. In this case, a flexible substrate (FPC) is used as an electrical connection means for supplying drive signals to the electrodes of the piezoelectric element, and electrode bumps of the flexible substrate (FPC) are soldered to predetermined positions of the electrodes of the piezoelectric element. It has been proposed that the connection is made by using (see, for example, Patent Document 1).

The recording head (piezoelectric / electrostrictive actuator having a lattice arrangement structure) described in Patent Document 1 described above includes an electrode of a piezoelectric element and a corresponding signal line or conductive layer (conductive pattern) of a flexible substrate (FPC). Electrical connection is made in a manner having a desired gap through one electrode bump, the displacement of the piezoelectric element can be increased, and high-density and high-reliability electrical connection is ensured. Can be easily and accurately performed.
JP 2003-69103 A

  However, in order to electrically connect the electrode of the piezoelectric element and the corresponding signal line or conductive layer (conductive pattern) of the flexible substrate (FPC) as used in the invention described in Patent Document 1, one piezoelectric element is used. The electrode bumps used for each element are generally very small, with a diameter of 1 mm or less (usually 0.2 mm or less), so the strength is low (0.2 to 0.3 N in actual measurement of tensile strength). There is a problem that the soldered part is peeled off by contact with an operator or an external object.

  Further, in the manufacturing process, before protection with the cover member, the flexible substrate (FPC) is in an exposed state, and there is a problem that the flexible substrate (FPC) is peeled off by contact of an operator or the like. In particular, since the input side of the electric signal of the flexible substrate (FPC) is arranged outside the head, there is a problem that it is easy to peel off in contact with an external object.

  The present invention has been made in view of the above-described problems, and a droplet discharge head excellent in connection reliability with respect to a piezoelectric element of a wiring board used for electrical connection with the piezoelectric element, a manufacturing method thereof, and An object is to provide a droplet discharge device.

  In order to achieve the above object, according to an aspect of the present invention, the following droplet discharge head, a manufacturing method thereof, and a droplet discharge device are provided.

[1] A flow path member having a plurality of nozzles and pressure generation chambers communicated with each other by a flow path structure, a vibration plate disposed on the opposite side of the flow path member from the nozzle, and a vibration plate disposed on the vibration plate The electrode has an electrode, is deformed when a drive signal is supplied to the electrode, changes the volume in the pressure generating chamber, and discharges the liquid stored in the pressure generating chamber as droplets from the nozzle. A plurality of piezoelectric elements to be supplied, the drive signal supplied to the plurality of electrodes, the conductive pattern drawn to the input side of the drive signal, and the electrode and the conductive pattern of the piezoelectric element within a predetermined region A liquid droplet ejection head comprising a wiring board having a plurality of electrode bumps disposed and electrically connected to each other, wherein the surface of the wiring board on which the electrode bumps are arranged, and the diaphragm The piezoelectric element of Between the wiring board and the surface on the input side of the drive signal at least in the region other than the predetermined region where the electrode bumps are disposed, A droplet discharge head comprising a fixing member for fixing a vibration plate.

  In this way, between the surface of the wiring board and the surface of the diaphragm, in a region other than the predetermined region where the electrode bumps are disposed and at least on the input side of the drive signal from the predetermined region, Since the fixing member is provided, the wiring board and the vibration plate are firmly bonded, and therefore, the wiring board is difficult to peel from the piezoelectric element provided on the vibration plate, and the piezoelectric element of the wiring board is provided. The connection reliability with respect to can be made excellent.

[2] The fixing member is linearly disposed in a region other than the predetermined region where the electrode bumps are disposed, and at least a region closer to the input side of the drive signal than the predetermined region. The liquid droplet ejection head according to [1], wherein: With this configuration, the connection reliability of the wiring board with respect to the piezoelectric element can be made sufficiently excellent.

[3] The fixing member is arranged in a plurality of dots in a region other than the predetermined region where the electrode bumps are disposed, and at least in a region closer to the input side of the drive signal than the predetermined region. The droplet discharge head according to [1], wherein the droplet discharge head is formed. Also with this configuration, the connection reliability of the wiring board with respect to the piezoelectric element can be made sufficiently excellent.

[4] The fixing member is an area other than the predetermined area in which the electrode bumps are disposed, and at least an area closer to the input side of the drive signal than the predetermined area and an outer peripheral edge of the predetermined area The droplet discharge head according to [1], wherein the droplet discharge head is provided. With this configuration, the bonding area between the wiring board and the vibration plate can be increased and the bonding can be more firmly performed, and the connection reliability of the wiring board to the piezoelectric element can be further improved.

[5] The droplet discharge head according to [1], wherein the fixing member is a thermosetting adhesive layer. By configuring in this way, the wiring board and the diaphragm can be firmly and simply and securely joined.

[6] The droplet discharge head according to [5], wherein the thermosetting adhesive layer is a thermosetting adhesive film. By configuring in this way, the wiring board and the diaphragm can be firmly and simply and securely joined.

[7] The droplet discharge head according to [1], wherein the thickness of the fixing member is equal to or less than a sum of a height of the electrode bump before connection and a thickness of the piezoelectric element. With this configuration, the electrode bumps of the wiring board and the electrodes of the piezoelectric element can be reliably electrically connected.

[8] A flow path member having a plurality of nozzles and pressure generation chambers communicated with each other by a flow path structure, a vibration plate disposed on the opposite side of the flow path member from the nozzle, and disposed on the vibration plate. The electrode has an electrode, is deformed when a drive signal is supplied to the electrode, changes the volume in the pressure generating chamber, and discharges the liquid stored in the pressure generating chamber as droplets from the nozzle. A plurality of piezoelectric elements to be supplied, the drive signal supplied to the plurality of electrodes, the conductive pattern drawn to the input side of the drive signal, and the electrode and the conductive pattern of the piezoelectric element within a predetermined region And a wiring board having a plurality of electrode bumps that are electrically connected to each other, and a method for manufacturing a droplet discharge head, comprising: a surface of the wiring board on which the electrode bumps are arranged; , The diaphragm The electrode bumps are disposed between the surface of the wiring board and the surface of the vibration plate that are positioned in a state of being opposed to the surface on the side where the electric elements are disposed. Disposing a fixing member for fixing the wiring board and the diaphragm in a region other than the predetermined region and at least in a region closer to the input side of the drive signal than the predetermined region. A manufacturing method of a droplet discharge head characterized by With this configuration, it is possible to easily and inexpensively manufacture a droplet discharge head that is difficult to peel off the wiring board and has excellent connection reliability with respect to the piezoelectric elements of the wiring board.

[9] The fixing member is linearly disposed in a region other than the predetermined region where the electrode bumps are disposed and at least in a region closer to the input side of the drive signal than the predetermined region. The method for manufacturing a droplet discharge head according to [8] above, wherein With such a configuration, it is possible to easily and inexpensively manufacture a liquid droplet ejection head that has a wiring board that is not easily peeled off and that is sufficiently excellent in connection reliability with respect to the piezoelectric element of the wiring board.

[10] The fixing member is arranged in a plurality of points in a region other than the predetermined region where the electrode bumps are disposed, and at least in a region closer to the input side of the drive signal than the predetermined region. The method of manufacturing a droplet discharge head according to [8], wherein With this configuration, it is also possible to easily and inexpensively manufacture a droplet discharge head that is not easily separated from the wiring board and sufficiently excellent in connection reliability with respect to the piezoelectric element of the wiring board.

[11] The fixing member is an area other than the predetermined area where the electrode bumps are disposed, and at least an area closer to the input side of the drive signal than the predetermined area and an outer peripheral edge of the predetermined area The method for manufacturing a droplet discharge head according to [8], wherein the droplet discharge head is disposed. With this configuration, it is possible to easily and inexpensively manufacture a droplet discharge head that has a large bonding area between the wiring board and the vibration plate and is more firmly bonded and has excellent connection reliability.

[12] The method for manufacturing a droplet discharge head according to [8], wherein a thermosetting adhesive layer is used as the fixing member. By comprising in this way, a wiring board and a diaphragm can be joined firmly.

[13] The method for manufacturing a droplet discharge head according to [12], wherein a thermosetting adhesive film is used as the thermosetting adhesive layer. By comprising in this way, a wiring board and a diaphragm can be firmly joined simply and reliably.

[14] The method for manufacturing a droplet discharge head according to [8], wherein the fixing member has a thickness that is equal to or less than a sum of a height of the electrode bump before connection and a thickness of the piezoelectric element. . With this configuration, there is no gap between the electrode bumps of the wiring board and the electrodes of the piezoelectric element, so that the droplets in which the electrode bumps of the wiring board and the electrodes of the piezoelectric element are securely electrically connected. The discharge head can be manufactured easily and at low cost.

[15] The wiring board is heated from the surface side opposite to the side on which the electrode bumps are disposed, and the electrodes of the piezoelectric element and the conductive pattern are electrically connected by melting the electrode bumps. The method of manufacturing a droplet discharge head according to claim 8, further comprising the step of curing the thermosetting adhesive layer and fixing the wiring board and the diaphragm. In this way, by heating from the surface side opposite to the side where the electrode bumps are disposed, melting of the electrode bumps of the wiring board and curing of the thermosetting adhesive layer can be performed simultaneously. Since the operation can be completed only once, the wiring board is difficult to peel off, and a droplet discharge head excellent in connection reliability with respect to the piezoelectric element of the wiring board can be manufactured efficiently and at low cost.

[16] In a droplet discharge apparatus including a plurality of droplet discharge heads that discharge liquid as droplets from a plurality of nozzles toward a discharge target surface by driving a plurality of piezoelectric elements, the droplet discharge head Has a plurality of nozzles and pressure generation chambers that are communicated with each other by a flow path structure, and a laminate having a diaphragm disposed on the opposite side of the nozzle, and an electrode disposed on the diaphragm. And is deformed when a drive signal is supplied to the electrode, changes the volume in the pressure generating chamber via the diaphragm, and drops the liquid stored in the pressure generating chamber from the nozzle. A plurality of piezoelectric elements to be discharged, a conductive pattern supplied to the plurality of electrodes and drawn to the input side of the drive signal, and the electrodes and the conductive patterns of the piezoelectric elements, A droplet discharge head provided with a wiring board having a plurality of electrode bumps disposed in and electrically connected to the surface of the wiring board, the surface of the wiring board on which the electrode bumps are disposed, The drive signal is input to at least the predetermined region other than the predetermined region where the electrode bump is disposed between the surface of the diaphragm on which the piezoelectric element is disposed. A droplet discharge apparatus comprising: a droplet discharge head in which a fixing member for fixing the wiring substrate and the vibration plate is disposed in a side region. As described above, since the liquid droplet ejection head in which the electrode bumps of the wiring board and the electrodes of the piezoelectric element are reliably electrically connected is provided, a liquid droplet ejection apparatus having excellent ejection accuracy and ejection characteristics can be obtained. .

  According to the present invention, it is possible to improve the connection reliability of a wiring board used for electrical connection with a piezoelectric element to the piezoelectric element.

[First Embodiment]
(Configuration of droplet discharge head)
1 to 3 show a droplet discharge head according to a first embodiment of the present invention. FIG. 1 is a plan view, FIG. 2 is a sectional view taken along line AA in FIG. 1, and FIG. 4 is an exploded perspective view of the head, and FIG. 4 is an enlarged plan view of a part of the flexible printed wiring board.

  As shown in FIGS. 1 to 3, the droplet discharge head 1 includes a nozzle plate 2 in which a plurality of nozzles 2 a are formed and a laminated plate 3 in which a pressure generation chamber 3 a is formed. Are formed on the opposite side of the flow path laminate S from the nozzle 2a, and the diaphragm 7 is disposed on the diaphragm 7 on the opposite side to the nozzle 2a. The electrode (individual electrode 8a and common electrode 8b) is provided and deformed by supplying a drive signal to the individual electrode 8a, and the volume in the pressure generating chamber 3a is changed via the diaphragm 7, A plurality of piezoelectric elements 8 that discharge liquid stored in the pressure generation chamber 3a as droplets from the nozzle 2a, and a conductive pattern 12a that is supplied to the plurality of individual electrodes 8a and drawn out to the input side of the drive signal. , And the individual electrodes 8a of the piezoelectric element 8 and the conductive pattern 12 Preparative, and a flexible printed wiring board (hereinafter referred to as "FPC".) 12 having a plurality of electrodes bumps 12b for electrically connecting is disposed within a predetermined area E.

  A predetermined region E (where the electrode bumps 12b are disposed) (between the surface of the FPC 12 where the electrode bumps 12b are disposed and the surface of the diaphragm 7 where the piezoelectric elements 8 are disposed). The FPC 12, the diaphragm 7, and the region X (hereinafter referred to as “input side region X”), which is a region other than the region where the electrode bumps 12 b are disposed, and is closer to the drive signal input side than the predetermined region E (hereinafter referred to as “input side region X”). It has the structure by which the linear fixing member 9 which fixes this is arrange | positioned. As shown in FIG. 3 and the like, the portion corresponding to the input side region X of the FPC 12 is likely to come into contact with an operator or an external object. Therefore, it is important to firmly fix the FPC 12 and the diaphragm 7 in this portion. . In FIG. 2, reference numeral 12 c indicates a cover film for insulatingly covering the conductive pattern 12 a of the FPC 12. In FIGS. 2 and 4, reference numeral 12 d indicates a via hole.

  Next, the configuration of each unit will be described.

(Diaphragm)
As shown in FIG. 1, the diaphragm 7 has a substantially parallelogram shape. The diaphragm 7 has conductivity and elasticity, for example, a metal material such as SUS, a composite material of dissimilar metals, a composite material of metal and resin, and a surface on which a metal film is formed by sputtering or vapor deposition A treatment material or the like can be used.

(Piezoelectric element)
The piezoelectric element 8 is made of, for example, lead zirconate titanate (PZT) or the like, and has electrodes (individual electrodes 8a and common electrodes 8b). The electrodes (individual electrode 8a and common electrode 8b) are formed by sputtering or the like, and the individual electrode 8a formed on the upper surface side is conductive so that a drive signal is supplied from the conductive pattern 12a via the electrode bump 12b. The common electrode 8b formed on the lower surface side of the pattern 12a is electrically connected to the diaphragm 7 through a conductive adhesive, and is electrically connected to the pad 121 of the pattern 12a. Grounded. The piezoelectric element 8 is individually joined to the position of the diaphragm 7 corresponding to the pressure generating chamber 3a.

(Flexible printed circuit board)
The FPC 12 supplies a drive signal to the plurality of individual electrodes 8a of the piezoelectric element 8, and the conductive pattern 12a drawn to the input side of the drive signal, and the individual electrode 8a and the conductive pattern 12a of the piezoelectric element 8 are set in a predetermined region E. It has a plurality of electrode bumps 12b which are disposed inside and electrically connected.

  The conductive pattern 12a has a two-layer structure in which the resin substrate 120 is sandwiched between both surfaces of the resin substrate 120 and connected via the via holes 12d in order to increase the wiring density. The film 12c is covered. The conductive pattern 12a is electrically connected to the individual electrode 8a of the piezoelectric element 8 through the electrode bump 12b in the pad 121 portion. As the conductive pattern 12a, one made of a metal such as copper can be suitably used. Moreover, as the resin substrate 120, what was comprised from the polyimide resin etc. which were excellent in heat resistance can be used suitably. Further, as the cover film 12c, a polyester resin such as a polyethylene terephthalate (PET) resin that is widely used as a film material, or a polyimide resin that requires heat resistance can be suitably used. . The conductive pattern 12a may have a single layer structure. The wiring board is not limited to the FPC, and may be a rigid printed wiring board (PWB) represented by a glass epoxy base material, a glass board, or a ceramic board.

  The fixing member 9 is preferably a thermosetting adhesive layer, and more preferably a thermosetting adhesive film. As such a thermosetting adhesive film, a cover made of polyethylene terephthalate (PET) resin or the like constituting the surface of the diaphragm 7 made of metal such as SUS and the outermost surface of the FPC 12, which are two objects to be fixed. From the viewpoint that a film excellent in adhesion to the surface of the film 12c is preferable, for example, an epoxy adhesive film having a thickness of 180 to 230 μm can be cited as a suitable example.

  FIG. 5 is a cross-sectional view showing the relationship between the thickness of the fixing member and the sum of the height of the electrode bump and the thickness of the piezoelectric element before connection. The thickness (t3) of the fixing member (thermosetting adhesive film) 9 is 150 μm as the height (t1) of the electrode bump 12b before connection, for example, the height of the core portion that does not melt even when heated. And the thickness (t2) of the piezoelectric element 8, for example, about 30 μm, for example, about 180 μm or less is preferable. The height (t1) of the electrode bump 12b means the height at which the electrode bump 12b protrudes to the outside with reference to the cover film 12c of the FPC 12 (this surface and the fixing member 9 are fixed).

(Other configurations)
The nozzle plate 2 is made of, for example, a self-bonding polyimide resin from the viewpoint of ink resistance, heat resistance, and the like, and the laminated plate 3 is made of a metal such as SUS from the viewpoint of ink resistance.

(Liquid flow)
The flow of the liquid will be described with reference to FIG. When a drive signal is supplied to the individual electrode 8 a of the piezoelectric element 8 disposed on the diaphragm 7, the piezoelectric element 8 is deformed and the volume in the pressure generation chamber 3 a of the laminated plate 3 is reduced via the diaphragm 7. The liquid that is changed and supplied to the supply hole (not shown) of the vibration plate 7 causes the liquid stored in the pressure generation chamber 3 a of the laminated plate 3 to be ejected as droplets from the nozzle 2 a of the nozzle plate 2.

(Method for manufacturing droplet discharge head)
Hereinafter, a method for manufacturing the droplet discharge head 1 will be described with reference to FIG.

  As shown in FIG. 6A, first, the surface of the FPC 12 on which the electrode bumps 12b are disposed and the surface of the diaphragm 7 on which the piezoelectric elements 8 are disposed are opposed to each other. Position. In this case, as shown in FIG. 5, the thickness (t3) of the fixing member (thermosetting adhesive film) 9 is configured to be equal to or less than the total thickness (t2) of the piezoelectric element 8 before connection. Then, it is preferable to position. The electrode bump 12b is connected to the conductive pattern 12a of the FPC 12 and the pad 121. There is no restriction | limiting in particular as a positioning method, For example, the method of using a reference | standard hole and a positioning pin etc. can be mentioned.

  Next, as shown in FIG. 6B, a fixing member 9 that fixes the FPC 12 and the diaphragm 7 is disposed in the input side region X between the surface of the positioned FPC 12 and the surface of the diaphragm 7. To do. Note that the fixing member 9 may be provided in advance before positioning.

  In the case of the present embodiment, as the fixing member 9, as described above, it is preferable to use a thermosetting adhesive layer, more preferably a thermosetting adhesive film, and the thickness thereof is It is preferable to use one that is equal to or less than the sum of the height of the electrode bump 12b and the thickness of the piezoelectric element 8 before connection.

  In the present embodiment, the FPC 12 is heated by a heater or the like at 230 ° C. for about 2 seconds from the surface side opposite to the side on which the electrode bumps 12b are disposed, and the piezoelectric bumps 12b are melted to melt the piezoelectric elements. It is preferable that the fixing member (thermosetting adhesive layer) 9 is cured to fix the FPC 12 and the diaphragm 7 at the same time that the electrode 8 and the conductive pattern 12a are electrically connected. In this case, when the electrode bump 12 b made of solder or the like is melted by heating, the FPC 12 sinks to the piezoelectric element 8 side, and the fixing member (thermosetting adhesive layer) 9 is in close contact with the diaphragm 7. Further, the heating is continued, the fixing member (thermosetting adhesive layer) 9 is cured, and the FPC 12 and the diaphragm 7 are bonded and fixed. At the start of heating, since the electrode bump 12b has not melted yet, the fixing member (thermosetting adhesive layer) 9 is not in contact with the diaphragm in terms of dimensions, but the heating is finished. Since the electrode bumps 12b are sometimes melted, the fixing member (thermosetting adhesive layer) 9 is sufficiently deformed (compressed) so that it completely contacts the diaphragm and is firmly fixed.

(Effects of the first embodiment)
According to the first embodiment described above, the following effects can be obtained.
(A) Since the FPC 12 and the diaphragm 7 are fixed by the linear fixing member 9 in the input side region X with respect to the predetermined region E where the electrode bumps 12b are disposed, the tension to the FPC 12 is mainly a fixing member. 9, it is possible to prevent the soldered portion from being peeled off in connection work, assembly work, etc. of the FPC 12.
(B) Since the FPC 12 is used as the wiring member, the ease of handling and the degree of freedom of design increase, and it is possible to efficiently and inexpensively manufacture a droplet discharge head having excellent connection reliability with respect to the piezoelectric element. it can.
(C) Since a thermosetting adhesive film is used as the fixing member 9, the FPC 12 and the diaphragm 7 can be firmly and simply joined securely and the electrode bumps 12 b of the FPC 12 Since the melting and the curing of the thermosetting adhesive film can be performed at the same time and the heating operation can be completed only once, the FPC 12 is difficult to be peeled off and the FPC 12 is excellent in connection reliability with respect to the piezoelectric element 8. The droplet discharge head 1 can be manufactured efficiently and at low cost.
(D) Since the fixing member 9 is disposed after the positioning, the positioning accuracy can be improved.
(E) Since the conductive pattern 12a having a two-layer structure is used, the wiring density can be increased.

[Second Embodiment]
FIG. 7 is a plan view of a droplet discharge head according to the second embodiment of the present invention. In the present embodiment, the fixing member 9 is disposed around the predetermined region E (the input side region X and the outer peripheral edge Y), and other configurations are the same as those in the first embodiment. is there.

  By configuring as described above, the bonding area between the FPC 12 and the diaphragm 7 can be increased, and the FPC 12 can be bonded more firmly, and the connection reliability of the FPC 12 to the piezoelectric element 8 can be further improved. .

[Third Embodiment]
FIG. 8 is a plan view of a droplet discharge head according to the third embodiment of the present invention. The present embodiment has a configuration in which the fixing member 9 is disposed in two points on the input side region X in the form of dots. Other configurations are the same as those in the first embodiment.

  By configuring as described above, the firm fixation between the FPC 12 and the diaphragm 7 can be easily realized using, for example, a positioning reference hole.

[Fourth Embodiment]
(Color printer configuration)
FIG. 9 is a configuration diagram of a color printer to which the liquid droplet ejection apparatus according to the fourth embodiment of the present invention is applied. This color printer 100 has a substantially box-shaped casing 101, and a paper feed tray 20 that accommodates paper P is placed in the lower part of the casing 101, and a recorded paper P is placed in the upper part of the casing 101. Each of the discharged paper discharge trays 21 is disposed, main conveyance paths 31a to 31e from the paper supply tray 20 via the recording position 102 to the paper discharge tray 21, and from the paper discharge tray 21 side to the recording position 102 side. A transport mechanism 30 that transports the paper P along the reverse transport path 32 is provided.

  At the recording position 102, a plurality of droplet discharge heads 1 shown in FIG. 1 are arranged in parallel to form a droplet discharge head unit. The four droplet discharge head units are respectively yellow (Y) and magenta (M). As a droplet discharge head unit 41 (41Y, 41M, 41C, 41K) that discharges ink droplets of each color of cyan, (C), and black (K), a droplet discharge head array is configured by arranging in the paper P transport direction. is doing. Details of the arrangement will be described later.

  In addition, the color printer 100 includes a charging roll 43 as an adsorbing unit that adsorbs the paper P, a platen 44 disposed to face the droplet discharge head units 41Y, 41M, 41C, and 41K via the endless belt 35. The maintenance unit 45 disposed in the vicinity of the droplet discharge head units 41Y, 41M, 41C, and 41K and each part of the color printer 100 are controlled, and the droplet discharge head units 41Y, 41M, 41C, A control unit (not shown) that records a color image on the paper P by applying a driving voltage to the piezoelectric element 8 of the droplet discharge head 1 constituting 41K, discharging ink droplets from the nozzles 2a, is provided.

  The droplet discharge head units 41 </ b> Y, 41 </ b> M, 41 </ b> C, and 41 </ b> K have an effective print area that is equal to or larger than the width of the paper P. In addition, although the piezoelectric method was used as a method for discharging droplets, there is no particular limitation, and for example, a widely used method such as a thermal method can be appropriately used.

  Ink tanks 42Y, 42M, 42C, and 42K that store inks corresponding to the droplet discharge head units 41Y, 41M, 41C, and 41K are disposed above the droplet discharge head units 41Y, 41M, 41C, and 41K. is doing. From each ink tank 42Y, 42M, 42C, 42K, it is comprised so that ink may be supplied to each droplet discharge head 1 via piping which is not shown in figure.

  The ink stored in the ink tanks 42Y, 42M, 42C, and 42K is not particularly limited, and for example, commonly used inks such as water-based, oil-based, and solvent-based inks can be appropriately used.

  The transport mechanism 30 is disposed in each part of the pick-up roll 33 that takes out the paper P one by one from the paper feed tray 20 and supplies it to the main transport path 31a, the main transport paths 31a, 31b, 31d, 31e, and the reverse transport path 32. A plurality of transport rolls 34 that transport the paper P, an endless belt 35 that is provided at the recording position 102 and transports the paper P in the direction of the paper discharge tray 21, a drive roll 36 on which the endless belt 35 is stretched, and a follower A roll 37 and a drive motor (not shown) that drives the transport roll 34 and the drive roll 36 are provided.

(Color printer operation)
Next, the operation of the color printer 100 will be described. The transport mechanism 30 drives the pickup roll 33 and the transport roll 34 under the control of the control unit, takes out the paper P from the paper feed tray 20, and transports it along the main transport paths 31a and 31b. When the paper P reaches the vicinity of the endless belt 35, electric charge is applied to the paper P by the electrostatic attraction force of the charging roll 43, and the paper P is attracted to the endless belt 35.

  The endless belt 35 is rotated by the drive of the drive roll 36, and when the paper P is conveyed to the recording position 102, a color image is recorded by the droplet discharge head units 41Y, 41M, 41C, 41K.

  The paper P on which the color image is recorded is discharged to the paper discharge tray 21 by the transport mechanism 30 via the main transport path 31d.

  When the duplex recording mode is set, the paper P once discharged to the paper discharge tray 21 returns to the main transport path 31e again, passes through the reverse transport path 32, and again passes through the main transport path 31b. Then, the color image is recorded on the surface opposite to the surface of the paper P recorded last time by the droplet discharge head units 41Y, 41M, 41C, and 41K.

(Effect of the fourth embodiment)
According to the fourth embodiment, it is possible to make the droplet discharge head units 41Y, 41M, 41C, and 41K small, low cost, and excellent in reliability.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the invention.

  The liquid droplet discharge head, the manufacturing method thereof, and the droplet discharge apparatus of the present invention are various industrial fields in which high-definition image information patterns are required to be formed by discharging droplets, such as polymer films. Ink is ejected onto the glass surface using an ink jet method to form a color filter for display, solder paste is ejected onto the substrate to form bumps for component mounting, and circuit board wiring is formed. It is effectively used in the electrical / electronic industry fields such as the medical field for producing biochips for inspecting the reaction with a sample by discharging a reaction reagent onto a glass substrate or the like.

1 is a plan view of a droplet discharge head according to a first embodiment of the present invention. It is the sectional view on the AA line of FIG. It is a disassembled perspective view of the droplet discharge head shown in FIG. It is the top view which expanded a part of flexible printed wiring board. It is sectional drawing which shows the relationship between the thickness of a fixing member, and the sum total of the height of the electrode bump before connection, and the thickness of a piezoelectric element. (A), (b) is sectional drawing which shows the manufacturing method of the droplet discharge head concerning the 1st Embodiment of this invention. It is a top view of the droplet discharge head concerning the 2nd Embodiment of the present invention. It is a top view of the droplet discharge head which concerns on the 3rd Embodiment of this invention. It is a block diagram of the head unit of the color printer to which the droplet discharge apparatus which concerns on the 4th Embodiment of this invention is applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Droplet discharge head 2 Nozzle plate 2a Nozzle 3 Laminated plate 3a Pressure generating chamber 7 Vibration plate 8 Piezoelectric element 8a Individual electrode 8b Common electrode 9 Fixing member 12 Flexible printed circuit board (FPC)
12a conductive pattern 12b electrode bump 12c cover film 12d via hole 20 paper feed tray 21 paper discharge tray 30 transport mechanism 31a to 31e main transport path 32 reverse transport path 33 pickup roll 34 transport roll 35 endless belt 36 drive roll 37 driven roll 41Y, 41M , 41C, 41K Droplet discharge head units 42Y, 42M, 42C, 42K Ink tank 43 Charging roll 44 Preten 45 Maintenance unit 50 Control unit 100 Color printer 101 Housing 102 Recording position 120 Resin substrate 121 Conductive pattern pad P Paper S Channel laminate E Predetermined area X Input side area Y Outer peripheral edge area

Claims (16)

A flow path member having a plurality of nozzles and pressure generation chambers communicated with each other by a flow path structure;
A diaphragm disposed on the opposite side of the flow path member from the nozzle;
The electrode is disposed on the diaphragm, has an electrode, is deformed when a drive signal is supplied to the electrode, changes the volume in the pressure generating chamber, and stores the liquid stored in the pressure generating chamber A plurality of piezoelectric elements ejected as droplets from a nozzle;
The drive signal is supplied to the plurality of electrodes, and the conductive pattern drawn out to the input side of the drive signal, and the electrode and the conductive pattern of the piezoelectric element are arranged in a predetermined region and electrically A liquid droplet ejection head comprising a wiring board having a plurality of electrode bumps connected to
Other than the predetermined region where the electrode bumps are arranged between the surface of the wiring board on which the electrode bumps are arranged and the surface of the diaphragm on the side where the piezoelectric elements are arranged And a fixing member for fixing the wiring board and the diaphragm is disposed at least in an area closer to the input side of the drive signal than the predetermined area. .   The fixing member is linearly disposed in a region other than the predetermined region where the electrode bumps are disposed, and at least in a region closer to the input side of the drive signal than the predetermined region. The droplet discharge head according to claim 1.   The fixing member is arranged in a plurality of dots in a region other than the predetermined region where the electrode bumps are disposed, and at least in a region closer to the input side of the drive signal than the predetermined region. The droplet discharge head according to claim 1.   The fixing member is disposed in a region other than the predetermined region where the electrode bumps are disposed, and at least in a region closer to the input side of the drive signal than the predetermined region and an outer peripheral edge of the predetermined region. The droplet discharge head according to claim 1, wherein   The droplet discharge head according to claim 1, wherein the fixing member is a thermosetting adhesive layer.   The droplet discharge head according to claim 5, wherein the thermosetting adhesive layer is a thermosetting adhesive film.   2. The droplet discharge head according to claim 1, wherein a thickness of the fixing member is equal to or less than a sum of a height of the electrode bump before connection and a thickness of the piezoelectric element. A flow path member having a plurality of nozzles and pressure generating chambers communicated with each other by a flow path structure, a vibration plate disposed on the opposite side of the flow path member from the nozzle, and disposed on the vibration plate, A plurality of electrodes that are deformed when a drive signal is supplied to the electrodes, change a volume in the pressure generation chamber, and discharge liquid stored in the pressure generation chamber as droplets from the nozzle; The piezoelectric element, the drive signal is supplied to the plurality of electrodes, the conductive pattern drawn to the input side of the drive signal, and the electrode and the conductive pattern of the piezoelectric element are arranged in a predetermined region. A method of manufacturing a droplet discharge head comprising a wiring board having a plurality of electrode bumps that are electrically connected to each other,
Positioning in a state where the surface of the wiring board on the side where the electrode bumps are disposed and the surface of the diaphragm on the side where the piezoelectric elements are disposed;
Between the surface of the positioned wiring board and the surface of the diaphragm, the region other than the predetermined region where the electrode bumps are disposed, and at least the input side of the drive signal from the predetermined region And a step of disposing a fixing member for fixing the wiring board and the vibration plate in the region.   The fixing member is linearly disposed in a region other than the predetermined region where the electrode bumps are disposed and at least in a region closer to the input side of the drive signal than the predetermined region. A method for manufacturing a droplet discharge head according to claim 8.   The fixing member is arranged in a plurality of dots in an area other than the predetermined area where the electrode bumps are arranged, and at least in an area closer to the input side of the drive signal than the predetermined area. The method of manufacturing a droplet discharge head according to claim 8.   The fixing member is disposed in a region other than the predetermined region where the electrode bumps are disposed, and at least in a region closer to the input side of the drive signal than the predetermined region and an outer peripheral edge of the predetermined region. The method of manufacturing a droplet discharge head according to claim 8.   The method for manufacturing a droplet discharge head according to claim 8, wherein a thermosetting adhesive layer is used as the fixing member.   The method for manufacturing a droplet discharge head according to claim 12, wherein a thermosetting adhesive film is used as the thermosetting adhesive layer.   The method for manufacturing a droplet discharge head according to claim 8, wherein the fixing member has a thickness equal to or less than a sum of a height of the electrode bump before connection and a thickness of the piezoelectric element.   The wiring board is heated from the surface side opposite to the side on which the electrode bumps are disposed, and the electrodes of the piezoelectric element and the conductive pattern are electrically connected by melting the electrode bumps, The method of manufacturing a droplet discharge head according to claim 8, further comprising a step of fixing the wiring substrate and the vibration plate by curing the thermosetting adhesive layer. In a droplet discharge device including a plurality of droplet discharge heads that discharge liquid as droplets from a plurality of nozzles toward a discharge target surface by driving a plurality of piezoelectric elements,
The droplet discharge head is
A laminate having a plurality of nozzles and pressure generating chambers communicated with each other by a flow path structure, and having a diaphragm disposed on the opposite side of the nozzles;
The electrode has an electrode disposed on the diaphragm, is deformed when a drive signal is supplied to the electrode, changes the volume in the pressure generating chamber through the diaphragm, and A plurality of piezoelectric elements that discharge the stored liquid as droplets from the nozzle;
The drive signal is supplied to the plurality of electrodes, and the conductive pattern drawn out to the input side of the drive signal, and the electrode and the conductive pattern of the piezoelectric element are arranged in a predetermined region and electrically A liquid droplet ejection head comprising a wiring board having a plurality of electrode bumps connected to
Other than the predetermined region where the electrode bumps are arranged between the surface of the wiring board on which the electrode bumps are arranged and the surface of the diaphragm on the side where the piezoelectric elements are arranged A droplet discharge head in which a fixing member for fixing the wiring board and the diaphragm is disposed at least in an area closer to the input side of the drive signal than the predetermined area. A droplet discharge device.

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